Page 1
Features
• Fast Switching Speed
• Small Surface Mount Package
• For General Purpose Switching Applications
• Lead Free/RoHS Compliant (Note 1)
• "Green" Device (Notes 2 and 3)
SOT323
Top View
BAW56W
DUAL SURFACE MOUNT SWITCHING DIODE
Mechanical Data
• Case: SOT323
• Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating) Solderable per MIL-STD-202, Method 208
• Polarity: See Diagram
• Weight: 0.006 grams (approximate)
Top View
Internal Schematic
Ordering Information (Notes 3 & 4)
Part Number Qualification Case Packaging
BAW56W-7-F Commercial SOT323 3000/Tape & Reel
BAW56WQ-7-F Automotive SOT323 3000/Tape & Reel
Notes: 1. No purposefully added lead.
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.
3. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017
Code S T U V W X Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
KJC
YM
BAW56W
Document number: DS30064 Rev. 12 - 2
KJC = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: Y = 2011)
M = Month (ex: 9 = September)
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© Diodes Incorporated
Page 2
)
θ
(BR)
P, P
O
R
P
T
O
T
T
O
US F
O
RWARD C
URR
T
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Non-Repetitive Peak Reverse Voltage
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 5)
Average Rectified Output Current (Note 5)
Non-Repetitive Peak Forward Surge Current @ t = 1.0μs
(Note 5) @ t = 1.0s
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 5)
Thermal Resistance Junction to Ambient Air (Note 5)
Operating and Storage Temperature Range
V
T
V
RM
V
RRM
V
RWM
V
R(RMS
I
FM
I
O
I
FSM
P
R
, T
J
R
D
JA
STG
BAW56W
100 V
75 V
53 V
300 mA
150 mA
2.0
1.0
A
200 mW
625
-65 to +150
°C/W
°C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Max Unit Test Condition
Reverse Breakdown Voltage (Note 6)
Forward Voltage
Reverse Current (Note 6)
Total Capacitance
Reverse Recovery Time
Notes: 5. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
V
R
V
⎯
F
I
⎯
R
C
⎯
T
t
⎯
rr
75
⎯
0.715
0.855
1.0
1.25
2.5
50
30
25
2.0 pF
4.0 ns
V
IR = 2.5μA
I
I
V
I
I
V
μA
V
μA
μA
V
nA
V
VR = 0, f = 1.0MHz
I
I
F
F
F
F
F
rr
250
Note 5
1
(A)
EN
200
N (mW)
I
150
A
0.1
= 1.0mA
= 10mA
= 50mA
= 150mA
= 75V
R
= 75V, TJ = 150°C
R
= 25V, TJ = 150°C
R
= 20V
R
= IR = 10mA,
= 0.1 x IR, RL = 100Ω
DISSI
100
WE
D
50
0
0
40 80
T , AMBIENT TEMPERATURE ( C)
A
120 160
Fig. 1 Power Derating Curve, T o ta l Package
200
°
0.01
ANE
AN
F
I, INS
0.001
01.51.00.5
V , INSTANTANEOUS FORWARD VOL TAGE (V)
F
Fig. 2 Typical Forward C haracte r is ti cs, Per Ele m ent
BAW56W
Document number: DS30064 Rev. 12 - 2
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November 2011
© Diodes Incorporated
Page 3
TANT
O
U
R
R
CUR
RENT
C, TOT
C
PACIT
C
F
R
R
REC
OVER
Y T
)
BAW56W
10,000
(nA)
1,000
SE
100
EVE
S
10
ANE
1
R
I, INS
0.1
0
Fig. 3 Typical Reverse Characteristics, Per Element
2.5
2.0
20 40 60 80 100
V , INSTANTANEOUS REVERSE VOLT AGE (V)
R
2.0
1.8
)
1.6
E (p
1.4
AN
1.2
1.0
A
0.8
AL
0.6
T
0.4
0.2
0.0
0
Fig. 4 Total Capacitance vs. Reverse Voltage, Per Element
10
V , DC REVERSE VOLTAGE (V)
R
20 4030
f = 1.0MHz
IME (nS
1.5
1.0
SE
EVE
0.5
,
rr
t
0
046
Fig. 5 Reverse Recovery Time vs. Forward Current,
210
I , FORWARD CURRENT (mA)
F
Per Elem ent
8
Package Outline Dimensions
BAW56W
Document number: DS30064 Rev. 12 - 2
K
J
A
SOT323
Dim Min Max Typ
C
B
A 0.25 0.40 0.30
B 1.15 1.35 1.30
C 2.00 2.20 2.10
D - - 0.65
G
H
G 1.20 1.40 1.30
H 1.80 2.20 2.15
J 0.0 0.10 0.05
M
K 0.90 1.00 1.00
L 0.25 0.40 0.30
M 0.10 0.18 0.11
D
L
0° 8° -
α
All Dimensions in mm
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November 2011
© Diodes Incorporated
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BAW56W
Suggested Pad Layout
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
Y
Z
X
E
C
IMPORTANT NOTICE
LIFE SUPPORT
Dimensions Value (in mm)
Z 2.8
X 0.7
Y 0.9
C 1.9
E 1.0
BAW56W
Document number: DS30064 Rev. 12 - 2
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November 2011
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