Page 1
Data Sheet
BOOST CONTROLLER AP3039
General Description
AP3039 is a current mode high voltage low-side Nchannel MOSFET controller which is ideal for boost
regulators. It contains all the features needed to implement single ended primary topology DC/DC
converters.
The input voltage range of AP3039 is from 5V to 27V.
Its operation frequency is adjustable from 150kHz to
1MHz.
The AP3039 has UVLO (Under Voltage Lock Out)
circuit. It uses two external resistors to set the UVLO
voltage. The AP3039 also has an over output voltage
protection to limit the output voltage. The OVP voltage can be set through external resistors. If the output
voltage is higher than the OVP high threshold point, it
will disable the driver, when the output voltage drops
to the OVP low threshold point, it will enable the
driver. It also features a soft start to reduce the inrush
current when power on, the soft start time can be set
through an external capacitor.
Features
· Input Voltage Range 5V to 27V
· 0.6A Peak MOSFET Gate Driver
· 20ns Quick MOSFET Gate Driver
· Duty Cycle Limit of 90%
· Programmable UVLO
· Programmable Over Voltage Protection
· Cycle by Cycle Current Limit
· Adjustable Soft-Start
· Adjustable Operation Frequency from 150kHz to
1MHz
Applications
· LED Lighting
· Notebook
· LCD Display Modules
The AP3039 is available in QFN-3x3-16 and SOIC-14
packages.
QFN-3x3-16 SOIC-14
Figure 1. Package Types of AP3039
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
1
Page 2
Data Sheet
BOOST CONTROLLER AP3039
Pin Configuration
FN Package
(
QFN-3x3-16
Pin 1 Dot by Marking
OV
SSUVLO
)
COMP
13141516
UVLO
OV
EN
VIN
EN
VIN
NC
VCC
1
2
EP
3
49
5678
PGND
OUT
RT
CS
12
11
10
NC
FB
SHDN
AGND
Exposed PAD
M Package
(
SOIC-14
1
2
3
4
)
SS
14
COMP
13
FB
12
SHDN
11
VCC
OUT
PGND
Figure 2. Pin Configuration of AP3039 (Top View)
5
6
7
10
9
8
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
2
AGND
CS
RT
Page 3
Data Sheet
BOOST CONTROLLER AP3039
Pin Description
Pin Number
16-pin 14-pin
13 ENEnable pin
2 4 VIN Input supply pin, must be locally bypassed
Pin Name Function
3, 12 NC
45 VCC
56 OUT
6 7 PGND Power ground
7 8 RT An external resistor connected from this pin to GND to set the operating frequency
8 9 CS Sense switch current pin, which is used for current mode control and for current limit
9 10 AGND Reference ground
10 11 SHDN
11 12 FB Voltage Feedback Pin. The reference voltage is 500mV
13 13 COMP Compensation Pin. This pin is the output of the internal Error Amplifier
14 14 SS
No connection (for
6V linear regulator output pin. VCC is used to bias the gate driver for the external
MOSFET. If V
bypass switch. If V
GND (recommend to connect with AGND pin) with a ceramic capacitor
Connect this pin to the gate of external MOSFET, the gate driver has 0.6A peak current
capability
This pin can be connected to current matched chip and receives error signal used to shut
down the system
An external soft start time capacitor is connected from this pin to ground and is charged by
internal 12µA current source to control regulator soft start time
QFN-3x3-16 package only)
is less than 8.5V, the VCC is equal to VIN minus drop voltage across
IN
is less than 6V, connect VCC to VIN. This pin should be bypassed to
IN
15 1 UVLO
16 2 OV Over output voltage protection pin
EP
Two resistors connected from this pin to ground and the VIN pin respectively to set start up
and shutdown level
Exposed backside pad. Solder to the circuit board ground plane with sufficient copper
connection to ensure low thermal resistance (for
3
QFN-3x3-16 package only)
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
Page 4
Data Sheet
BOOST CONTROLLER AP3039
Functional Block Diagram
VIN
EN
UVLO
OV
SHDN
RT
2 (4)
1 (3)
15 (1)
1.25V
16 (2)
1.25V
10 (11)
7 (8)
EN
OSTD
REFERENCE
22µA
22µA
OSL
1.25V
LOGIC
CLK
BYPASS
SWITCH
REGULATOR
R
S
CLK
LEB
Q
REFERENCE
12µA
110mV
SAW
3V
DRIVER
+
EA
Σ
+
13 (13)
0.5V
11 (12)
14 (14)
9 (10)
4 (5)
5 (6)
6 (7)
8 (9)
VCC
OUT
PGND
CS
COMP
FB
SS
AGND
A (B)
A QFN-3x3-16
B SOIC-14
SAW
Figure 3. Functional Block Diagram of AP3039
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
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Page 5
Data Sheet
BOOST CONTROLLER AP3039
Ordering Information
AP3039 -
Circuit Type
Package
FN: QFN-3x3-16
G1: Green
TR: Tape and Reel
Blank: Tube
M: SOIC-14
Package Temperature Range Part Number Marking ID Packing Type
QFN-3x3-16
o
SOIC-14
BCD Semiconductor's products, as designated with "G1" suffix in the part number, are RoHS compliant and Green.
-40 to 85
C
AP3039FNTR-G1 B2A Tape & Reel
AP3039M-G1 3039M-G1 Tube
AP3039MTR-G1 3039M-G1 Tape & Reel
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
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Page 6
Data Sheet
BOOST CONTROLLER AP3039
Absolute Maximum Ratings (Note 1)
Parameter Symbol Value Unit
Input Voltage V
VCC Pin Voltage V
OUT Pin Voltage V
Feedback Pin Voltage V
UVLO Pin Voltage V
CS Pin Voltage V
SHDN Pin Voltage V
Enable Pin Voltage V
OV Pin Voltage V
Thermal Resistance (Junction to Ambient, no Heat sink) θ
Operating Junction Temperature T
Storage Temperature Range T
Lead Temperature (Soldering, 10sec) T
IN
CC
OUT
FB
UVLO
CS
SHDN
EN
OV
JA
J
STG
LEAD
QFN-3x3-16
SOIC-14 102
30 V
10 V
10 V
7V
7V
7V
7V
V
IN
7V
60
o
C/W
150
-65 to 150
260
ESD (Machine Model) 200 V
V
o
C
o
C
o
C
ESD (Human Body Model) 2000 V
Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to
the device. These are stress ratings only, and functional operation of the device at these or any other conditions
beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability.
Recommended Operating Conditions
Parameter Symbol Min Max Unit
Input Voltage
Operating Frequency f 150 1000 kHz
Operating Temperature T
V
IN
A
527V
-40 85
o
C
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
6
Page 7
Data Sheet
BOOST CONTROLLER AP3039
Electrical Characteristics
(VIN=12V, V
EN =VIN
, TA=25oC, unless otherwise specified.)
Parameter Symbol Conditions Min Typ Max Unit
Input Voltage V
VCC=V
IN
VCC bypassed to GND
IN
56
627
through a 0.47µF capacitor
Feedback Voltage
FB Pin Bias Current I
Quiescent Current I
Shutdown Quiescent Current I
VCC Voltage
VCC Current Limit I
Drop Voltage Across Bypass Switch
Bypass Switch Turn-off Threshold
Bypass Switch Threshold Hysteresis
CC-LIM
V
IN-VCC
V
BYP-HIVIN
V
BYP-HYSVIN
V
FB
FB
Q
SHDN
V
CC
No switching 3 5 mA
VEN=0V 1 2 µA
9V≤VIN≤27V 5.566.5
6V≤V
ICC=0mA, f
6V≤V
<9V 5
IN
≤200kHz,
OSC
<8.5V
IN
increasing
decreasing
490 500 510 mV
35 100 nA
50 mA
300 mV
8.7 V
260 mV
V
V
VCC Pin UVLO Rising Threshold
VCC Pin UVLO Falling Hysteresis
Oscillator Frequency
UVLO Threshold V
V
CC-HI
V
CC-HYS
f
UVLO
UVLO Hysteresis Current Source I
Current Limit Threshold Voltage V
RT Vol tage V
Error Amplifier Transconductance G
V
EN Pin Threshold Voltage
V
V
SHDN Pin Threshold Voltage
V
OSC
HYS
CS
RT
EH
EL
IH
IL
Adjustable, RT=51kΩ
to 470kΩ
S
4.7 V
300 mV
150 1000 kHz
1.22 1.25 1.28 V
22 µA
90 110 130 mV
1.20 1.25 1.30 V
470 µA/V
2.0
V
0.5
2.0
V
0.5
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
7
Page 8
Data Sheet
BOOST CONTROLLER AP3039
Electrical Characteristics (Continued)
(VIN=12V, V
EN =VIN
, TA=25oC, unless otherwise specified.)
Parameter Symbol Conditions Min Typ Max Unit
OV Threshold V
OV Hysteresis Current Source I
OV-HYS
Maximum Duty Cycle D
Soft Start Current Source I
Out Pin Rise Time t
Out Pin Fall Time t
OUT Dropout Voltage (V
CC-VOUT
OUT Low Voltage Level (V
Thermal Shutdown Temperature
)V
)V
OUT
T
Thermal Shutdown Hysteresis
OV
MAX
SS
RISE
FAL L
OUT-HIOUT
OUT-LIOUT
OTSD
T
HYS
Out Pin Load =1nF 20 ns
Out Pin Load =1nF 20 ns
=50mA
=100mA
1.25 V
22 µA
90 93 %
12 µA
0.25 0.75 V
0.25 0.75 V
160
20
o
C
o
C
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
8
Page 9
Data Sheet
BOOST CONTROLLER AP3039
Typical Performance Characteristics
95
94
93
92
91
90
89
Efficiency (%)
88
87
86
85
-50 -25 0 25 50 75 100 125
VIN=12V, V
L=22
µH, C
=33V, f
OUT
=10µF, C
IN
I
OUT
I
OUT
OSC
OUT
=160mA
= 200mA
=1MHz
=10µF
Temperature (oC)
Figure 4.
Efficiency vs. Case Temperature
95
90
85
80
75
Efficiency (%)
70
65
60
20 40 60 80 100 120 140 160 180 200
VIN=12V, V
L=22
=33V, f
OUT
=10µF, C
IN
OSC
OUT
µH, C
Output Current (mA)
=1MHz, TA=25OC
=10µF
95
94
93
92
91
90
89
Efficiency (%)
88
87
86
85
6 9 12 15 18 21 24 27
I
=160mA, V
OUT
L=22
µH, C
OUT
=10µF; C
IN
f
=400kHz
OSC
f
= 1MHz
OSC
=33V, TA=25OC
=10µF
OUT
Input Voltage (V)
Figure 5. Efficiency vs. Input Voltage
92.0
91.5
91.0
90.5
Efficiency (%)
90.0
89.5
89.0
16 18 20 22 24 26 28 30 32 34
VIN=12V, V
L=22
µH, C
=33V, f
OUT
=10µF, C
IN
=1MHz, TA=25OC
OSC
=10µF
OUT
Output Voltage (V)
Figure 6. Efficiency vs. Output Current
Figure 7. Efficiency vs. Output Voltage
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
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Page 10
Data Sheet
BOOST CONTROLLER AP3039
Typical Performance Characteristics (Continued)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
Quiescent Current (mA)
0.4
0.2
0.0
5 1015202530
Input Voltage (V)
-50OC
25OC
85OC
125OC
Figure 8. Quiescent Current vs. Input Voltage
1.20
1.15
1.10
1.05
1.00
Frequency (MHz)
0.95
0.90
-50 -25 0 25 50 75 100 125
Case Temperature (OC)
RT=51kΩ
6.5
6.4
6.3
6.2
6.1
6.0
5.9
VCC Voltage (V)
5.8
5.7
5.6
5.5
6 9 12 15 18 21 24 27
-50OC
25OC
85OC
125OC
Input Voltage (V)
Figure 9. VCC Voltage vs. Input Voltage
1200
1100
1000
900
800
700
600
500
Frequency (kHz)
400
300
200
100
40 80 120 160 200 240 280 320 360 400 440 480
RT (kΩ)
Figure 10. Switching Frequency vs. Case Temperature
10
Figure
11. Switching Frequency vs. RT Val ue
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
Page 11
Data Sheet
BOOST CONTROLLER AP3039
Typical Performance Characteristics (Continued)
1.30
1.29
1.28
1.27
1.26
1.25
1.24
RT Voltage (V)
1.23
1.22
1.21
1.20
5 1015202530
Input Voltage (V)
Figure 12.
RT Voltage vs. Input Voltage
-50OC
25OC
85OC
125OC
1.280
1.275
1.270
1.265
1.260
1.255
1.250
OV Voltage (V)
1.245
1.240
1.235
1.230
5 1015202530
-40OC
25OC
85OC
125OC
Input Voltage (V)
1.260
1.255
1.250
1.245
UVLO Voltage (V)
1.240
1.235
1.230
5 1015202530
-50OC
25OC
85OC
125OC
Input Voltage (V)
Figure 13. UVLO Voltage vs. Input Voltage
25.0
24.5
24.0
23.5
23.0
22.5
22.0
UVLO Current(µA)
21.5
21.0
20.5
20.0
5 1015202530
-40OC
25OC
85OC
125OC
Input Voltage (V)
Figure 14. OV Voltage vs. Input Voltage
Figure 15. UVLO Current vs. Input Voltage
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
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Page 12
Data Sheet
BOOST CONTROLLER AP3039
Typical Performance Characteristics (Continued)
25.0
24.5
24.0
23.5
23.0
22.5
22.0
OV Current (µA)
21.5
21.0
20.5
20.0
5 1015202530
-50OC
25OC
85OC
125OC
Input Voltage (V)
Figure
16. OV Current vs. Input Voltage
450
425
400
375
350
325
300
275
250
OUT Low Voltage (mV)
225
200
175
150
-50 -25 0 25 50 75 100 12 5
Temperature (OC)
0.510
0.508
0.506
0.504
0.502
0.500
0.498
FB Voltage (V)
0.496
0.494
0.492
0.490
-50 -25 0 25 50 75 100 125
Case Temperature (OC)
Figure 17. Feedback Voltage vs. Case Temperature
400
375
350
325
300
275
250
225
OUT Dropout Voltage (mV)
200
175
150
-50 -25 0 25 50 75 100 125
Case Temperature (oC)
Figure 18. OUT Low Voltage vs. Case Temperature
Figure 19. OUT Dropout Voltage vs. Case Temperature
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
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Page 13
Data Sheet
BOOST CONTROLLER AP3039
Application Information
Operation
AP3039 is a boost DC-DC controller with adjustable
operation frequency. Current mode control scheme
provides excellent line and load regulation. Operation
can be best understood by referring to Figure 3.
At the start of each oscillator cycle, the SR latch is set
and external power switch Q1 (see Figure 20) turns on
and the switch current will increase linearly. The
voltage on external sense resistor R
connected from CS pin to GND, is proportional to the
switch current. This voltage is added to a stabilizing
ramp and the result is fed into the non-inversion input
of the PWM comparator. When this non-inversion
input voltage exceeds inversion input voltage of PWM
comparator which is the output voltage of the error
amplifier EA, the SR latch is reset and the external
power switch turns off. The voltage level at inversion
input of PWM comparator sets the peak current level to
keep the output voltage in regulation. This voltage
level is the amplified signal of the voltage difference
between feedback voltage and reference voltage of
0.5V. So, a constant output current can be provided by
this operation mode.
(see Figure 20),
CS
Input Under-Voltage Detector
AP3039 contains an Under Voltage Lock Out (UVLO)
circuit. Two resistors R1 and R2 are connected from
UVLO pin to ground and VIN pin respectively (see
Figure 20). The resistor divider must be designed such
that the voltage on the UVLO pin is higher than 1.25V
when VIN is in the desired operating range. If the
voltage on the pin is below under voltage threshold, all
functions of AP3039 are disabled, but the system will
remain in a low power standby state. UVLO hysteresis
is accomplished through an internal 22µA current
source which switched on or off 22µA current into the
impedance of the set-point divider. When the UVLO
threshold is exceeded, the current source is activated to
instantly raise the voltage on the UVLO pin. When the
UVLO pin voltage falls below the threshold the current
source is turned off, causing the voltage on the UVLO
pin to fall. The formula for UVLO can be expresses as
blow:
For Input Threshold Voltage
V
IN_THRESHOLD
=1.25V*(R1+R2)/R2
For Input Hysteresis Voltage
V
IN-HYSTERESIS
=22µA*R1
Over Voltage Protection
AP3039 has an over voltage protection (OVP) circuit.
The OV Pin is connected to the center tap of R3 and R4
resistor voltage-divider from the high voltage output to
GND (see Figure 20). When the loop is open or the
output voltage becomes excessive in any case, result
the voltage on OV pin exceeds 1.25V, all functions of
AP3039 will be disabled, and the output voltage will
fall. OVP hysteresis is accomplished with an internal
22µA current source and the operation mode is the
same as UVLO. The formula for OVP can be expresses
as blow:
For OVP Voltage
V
=1.25V*(R3+R4)/R4
OVP
For OVP Hysteresis Voltage
V
OVP-HYSTERESIS
=22µA*R3
Frequency Selection
An external resistor R
, connected from RT pin to
T
GND, is used to set the operating frequency (see Figure
20). Operation frequency range is from 150kHz to
1MHz (see Table 1). High frequency operation
optimizes the regulator for the smallest component
size, while low frequency operation can reduce the
switch losses.
Table 1. Frequency Selection
Resistance of RT (kΩ)
470 150
390 200
147 400
95 600
68 800
51 1000
Operating Frequency
(kHz)
13
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
Page 14
Data Sheet
BOOST CONTROLLER AP3039
Application Information (Continued)
Soft Start
AP3039 has a soft start circuit to limit the inrush
current during startup. The time of soft start is
controlled by an internal 12µA current source and an
external soft start capacitor C
to GND (see Figure 20). The effective C
connected from SS pin
SS
voltage for
SS
Soft Start is from 0 to 2.3V, the time of Soft Start is:
t
= CSS*2.3V/12µA
SS
Typical Application
V
: 6V to 27V
IN
C
R1
R2
OFF ON
IN
VIN
UVLO
VCC
C
V
EN
VCC Pin Application Description
The AP3039 includes an internal low dropout linear
regulator with the output pin VCC. This pin is used to
power internal PWM controller, control logic and
MOSFET driver. On the condition that V
regulator generates a 6V supply. If 6V≤V
is equal to VIN minus drop voltage across bypass
V
CC
switch. When V
is less than 6V, connect VCC to
IN
≥8.5V, the
IN
≤8.5V, the
IN
VIN.
V
OUT
C
OUT
OUT
CS
L
Q1
R
D1
R3
R5
CS
R4
GND
OV
FB
SHDN
OFF ON
R6
RT
R
T
C
SS
R
C
C
C
SS
COMP
U1 AP3039
Figure 20. Application Circuit 1 of AP3039 (Note 2)
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
14
Page 15
Data Sheet
BOOST CONTROLLER AP3039
Typical Application (Continued)
VIN:6V to 27V
R1
R2
C
IN
C
V
OFF ON
UVLO
VCC
EN
VIN
L
OUT
CS
OV
D1
Q1
R
CS
R3
1W or 3W LED
R4
C
OUT
RT
R
T
SS
C
SS
SHDN
ON OFF
FB
COMP
R
C
C
C
GND
U1 AP3039
R5
Figure 21. Application Circuit 2 of AP3039 (Driving Single 1W or 3W LED Lighting, Note 3)
VIN:6V to 27V
L
D1
C
R1
IN
VIN
OUT
Q1
R3
UVLO
C
VCC
R2
V
OFF ON
EN
CS
OV
R
CS
R4
RT
R
T
SS
C
SS
SHDN
ON OFF
FB
COMP
R
C
C
C
GND
U
1 AP3039
Figure 22. Application Circuit 3 of AP3039 (Backlight Driver, Note 4)
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
15
C
OUT
R5
Page 16
Data Sheet
BOOST CONTROLLER AP3039
Typical Application (Continued)
Note 2: The output voltage is decided by R5, R6 and the internal 0.5V reference. The output voltage accuracy is
determined by the accuracy of R5 and R6, for which the precise resistors are preferred.
OUT
0.5V
=
()
R6R5*
R6
+
V
Note 3: In this application, the LED current is controlled by the feedback resistor R5. LEDs current accuracy is
determined by regulator
‘s feedback threshold accuracy and is independent of the LEDs‘ forward voltage variation.
So the precise resistors are the better choices. The resistance of R5 is in inverse proportion to the LED current
since the feedback reference is fixed at 0.5V. The relation of R5 and the LED current can be expressed as below:
0.5V
R5=
I
LED
Note 4: The summation of LED current is determined by R5 and internal 0.5V reference same as the illustration in
Figure 22.
More detailed application information please refer to application note.
16
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
Page 17
Data Sheet
BOOST CONTROLLER AP3039
Mechanical Dimensions
QFN-3x3-16
.
2
0
9
0
1
.
3
)
4
1
1
.
0
(
0
2
1
.
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(
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)
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8
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0
8
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0
0
5
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7
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t
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)
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x
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.
1
d
e
d
a
P
6
0
.
0
(
0
0
7
8
f
e
R
Unit: mm(inch)
)
0
0
3
.
0
0
5
.
0
0
7
.
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)
2
1
0
.
0
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0
0
.
0
(
0
0
0
.
0
(
0
0
0
.
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
17
Page 18
Data Sheet
BOOST CONTROLLER AP3039
Mechanical Dimensions (Continued)
0.700(0.028)
7
°
0.330(0.013)
0.510(0.020)
1.000(0.039)
SOIC-14
0.280(0.011)
A
7
°
8.550(0.337)
8.750(0.344)
0.100(0.004)
0.250(0.010)
1.270(0.050)
)
9
6
0
.
0
(
0
5
7
.
1.350(0.053)
1
)
)
8
4
2
4
2
2
.
.
0
0
(
(
0
0
0
0
8
2
.
.
5
6
0.480(0.019)×45°
°
8
3.800(0.150)
4.000(0.157)
5
0
2
0
.
0
0
(
0
2
0
.
R0.200(0.008)
R0.200(0.008)
1
°
5
°
(
0
0
.
0
.
0
8
Unit: mm(inch)
×45°
°
8
°
.
5
9
A
20:1
1
0
)
)
N
I
M
°
8
°
0
°
8
)
)
7
0
0
1
0
0
.
.
0
0
(
(
0
0
9
5
1
2
.
.
0
0
)
1
5
0
.
0
(
0
0
3
.
1
2.000(0.079)
φ
Depth 0.060(0.002)
0.100(0.004)
Note: Eject hole, oriented hole and mold mark is optional.
18
0.500(0.020)
0.600(0.024)
BCD Semiconductor Manufacturing LimitedJun. 2010 Rev. 1. 6
0
)
0
1
0
.
0
(
0
5
2
.
Page 19
BCD Semiconductor Manufacturing Limited
IMPORTANT NOTICE
IMPORTANT NOTICE
BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-
BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-
cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any
cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any
particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use
particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use
of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or
of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or
other rights nor the rights of others.
other rights nor the rights of others.
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BCD Semiconductor Manufacturing Limited
BCD Semiconductor Manufactur ing Limited
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China
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BCD Semiconductor Manufacturing Limited
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.
- IC Design Group
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Advanced Analog Circuits (Shanghai) Corporation
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Taiwan Office
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BCD Semiconductor Corp.
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