Page 1
0.5A to 2.0A High-side Power Distribution Switches AP2822
Preliminary Datasheet
General Description
The AP2822 is an integrated high-side power switch
that consists of N-Channel MOSFET, charge pump,
over current & temperature and other related protection
circuits. The switch’s low R
to meet USB voltage drop requirements. The IC
includes soft-start to limit inrush current, over-current
protection, load short protection with fold-back, and
thermal shutdown to avoid switch failure during hot
plug-in. Under voltage lockout (UVLO) function is
used to ensure the device remain off unless there is a
valid input voltage present. A FLAG output is
available to indicate fault conditions to the local USB
controller.
The AP2822 is available in the standard package of
SOT-23-5.
, 85mΩ, is designed
DS(ON)
Applications
• USB Power Management
USB Bus/Self Powered Hubs
•
• Hot-plug Power Supplies
• Battery-charger Circuits
• Notebooks, Motherboard PCs
Features
Low MOSFET On Resistance: 85mΩ
•
• Compliant to USB Specifications
• Available 4 Versions of Continuous Load:
0.5A/1.0A/1.5A/2.0A
• Logic Level Enable Pin: Available with
Active-high or Active-low Version
• Operating Voltage Range: 2.7V to 5.5V
• Low Supply Current: 68µA (Typ.)
• Low Shutdown Current: 1.0µA (Max)
• Under-voltage Lockout
• Soft Start-up
• Over-current Protection
• Over Temperature Protection
• Load Short Protection with Fold-back
• No Reverse Current When Power Off
• Deglitched FLAG Output with Open Drain
• With Output Shutdown Pull-low Resistor
Figure 1. Package Type of AP2822
SOT-23-5
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
1
Page 2
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches AP2822
Pin Configuration
K/KA/KB/KE Package
（SOT-23-5）
K KA
FLAG
GND
VOUT 1
1
2
34
EN
KB KE
1
VOUT
5
VIN
VOUT
5
EN
GND
FLAG
1
2
3
VOUT VIN
VOUT
5
VIN
4
5
GND
VIN
2
3
Figure 2. Pin Configuration of AP2822 (Top View)
4
EN
GND
FLAG
2
4
3
EN
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
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Page 3
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches AP2822
Pin Descriptions
Pin Number Pin Name Function
1(K)
3(KA/KE)
2 GND Ground
3(K)
1(KA)
4(KB/KE)
4(K/KA)
3(KB)
5(KE)
5(K/KA)
1,5(KB)
1(KE)
FLAG
EN Chip enable control input, active low or high
VIN Supply input pin
VOUT Switch output voltage
Fault flag pin, output with open drain, need a pull-up resistor
in application, active low to indicate OCP or OTP
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
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Page 4
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches AP2822
Functional Block Diagram
VIN
EN
3(1){4}[4]
4(4){3}[5]
Clock
Band Gap
Reference
UVLO
GND
2(2){2}[2]
A(B){C}[D]
A: SOT-23-5(K Package)
B: SOT-23-5(KA Package)
C: SOT-23-5(KB Package)
D: SOT-23-5(KE Package)
Figure 3. Functional Block Diagram of AP2822
Gate Control
Over Current
Limiting
Thermal
Sense
CMP
Deglitch Logic
Current
Sense
Shutdown
Signal
FLAG
5(5){1,5}[1]
1(3)[3]
VOUT
FLAG
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
4
Page 5
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches AP2822
Ordering Information
AP2822 -
Circuit Type
Condition
A: Active High (Continuous 0.5A)
B: Active Low (Continuous 0.5A)
C: Active High (Continuous 1.0A)
D: Active Low (Continuous 1.0A)
E: Active High (Continuous 1.5A)
F: Active Low (Continuous 1.5A)
G: Active High (Continuous 2.0A)
H: Active Low (Continuous 2.0A)
Package
SOT-23-5
Temperature
Range
-40 to 85°C
Condition Part Number Marking ID
Active High
(Continuous 0.5A)
Active Low
(Continuous 0.5A)
Active High
(Continuous 1.0A)
Active Low
(Continuous 1.0A)
Active High
(Continuous 1.5A)
Active Low
(Continuous 1.5A)
Active High
(Continuous 2.0A)
Active Low
(Continuous 2.0A)
AP2822AKTR-G1 GCQ Tape & Reel
AP2822BKTR-G1 GCR Tape & Reel
AP2822CKTR-G1 GCS Tape & Reel
AP2822DKTR-G1 GCT Tape & Reel
AP2822EKTR-G1 GCU Tape & Reel
AP2822FKTR-G1 GCV Tape & Reel
AP2822GKTR-G1 GCW Tape & Reel
AP2822HKTR-G1 GCZ Tape & Reel
G1: Green
TR: Tape & Reel
Package
K/KA/KB/KE: SOT-23-5
Packing
Type
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
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Page 6
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches AP2822
Ordering Information (Continued)
Package
SOT-23-5
SOT-23-5
Temperature
Range
-40 to 85°C
-40 to 85°C
Condition Part Number Marking ID
Active High
(Continuous 0.5A)
Active Low
(Continuous 0.5A)
Active High
(Continuous 1.0A)
Active Low
(Continuous 1.0A)
Active High
(Continuous 1.5A)
Active Low
(Continuous 1.5A)
Active High
(Continuous 2.0A)
Active Low
(Continuous 2.0A)
Active High
(Continuous 0.5A)
Active Low
(Continuous 0.5A)
Active High
(Continuous 1.0A)
Active Low
(Continuous 1.0A)
Active High
(Continuous 1.5A)
Active Low
(Continuous 1.5A)
Active High
(Continuous 2.0A)
Active Low
(Continuous 2.0A)
AP2822AKATR-G1 GDQ Tape & Reel
AP2822BKATR-G1 GDR Tape & Reel
AP2822CKATR-G1 GDS Tape & Reel
AP2822DKATR-G1 GDT Tape & Reel
AP2822EKATR-G1 GDU Tape & Reel
AP2822FKATR-G1 GDV Tape & Reel
AP2822GKATR-G1 GDW Tape & Reel
AP2822HKATR-G1 GDZ Tape & Reel
AP2822AKBTR-G1 GLA Tape & Reel
AP2822BKBTR-G1 GLB Tape & Reel
AP2822CKBTR-G1 GLC Tape & Reel
AP2822DKBTR-G1 GLD Tape & Reel
AP2822EKBTR-G1 GLE Tape & Reel
AP2822FKBTR-G1 GLF Tape & Reel
AP2822GKBTR-G1 GLG Tape & Reel
AP2822HKBTR-G1 GLH Tape & Reel
Packing
Type
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
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Page 7
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches AP2822
Ordering Information (Continued)
Package
SOT-23-5
BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant
and green.
Temperature
Range
-40 to 85°C
Condition Part Number Marking ID
Active High
(Continuous 0.5A)
Active Low
(Continuous 0.5A)
Active High
(Continuous 1.0A)
Active Low
(Continuous 1.0A)
Active High
(Continuous 1.5A)
Active Low
(Continuous 1.5A)
Active High
(Continuous 2.0A)
Active Low
(Continuous 2.0A)
AP2822AKETR-G1 GLI Tape & Reel
AP2822BKETR-G1 GLJ Tape & Reel
AP2822CKETR-G1 GLK Tape & Reel
AP2822DKETR-G1 GLL Tape & Reel
AP2822EKETR-G1 GLM Tape & Reel
AP2822FKETR-G1 GLN Tape & Reel
AP2822GKETR-G1 GLO Tape & Reel
AP2822HKETR-G1 GLP Tape & Reel
Packing
Type
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
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Page 8
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches AP2822
Absolute Maximum Ratings (Note 1)
Parameter Symbol Value Unit
Power Supply Voltage VIN 6.0 V
Operating Junction Temperature
Range
Storage Temperature Range T
150 ºC
T
J
-65 to 150 ºC
STG
Lead Temperature (Soldering, 10sec) T
Thermal Resistance
(Junction to Ambient)
ESD (Machine Model)
ESD (Human Body Model) 2000 V
260 ºC
LEAD
θ
JA
TBD
200 V
o
C/W
Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only, and functional operation of the device at these or any other conditions
beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute
Maximum Ratings” for extended periods may affect device reliability.
Recommended Operating Conditions
Parameter Symbol Min Max Unit
Supply Voltage VIN 2.7 5.5 V
Operating Ambient Temperature
Range
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
-40 85 °C
T
A
8
Page 9
t
f
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches AP2822
Electrical Characteristics
(VIN=5.0V, CIN=2.2µF, C
Parameter Symbol Condition Min Typ Max Unit
=1.0µF, Typical TA=25°C, unless otherwise specified)
OUT
Supply Voltage VIN
Switch On Resistance R
Current Limit I
Supply Current I
Fold-back Short Current I
Shutdown Supply Current I
Enable High Input Threshold V
Enable Low Input Threshold V
DS(ON)
LIMIT
SUPPLY
SHORT
SHUTDOWN
ENH
ENL
VIN=5.0V, I
AP2822A/B(0.5A) , V
AP2822C/D(1.0A), V
AP2822E/F(1.5A), V
AP2822G/H(2.0A), V
=2.0A 85 110 mΩ
OUT
=4.0V 0.7 1.0 1.4
OUT
=4.0V 1.1 1.5 2.1
OUT
=4.0V 1.65 2.2 2.8
OUT
=4.0V 2.2 2.7 3.2
OUT
VIN=5.0V, No Load 68 95 µA
AP2822 A/B/C/D, V
AP2822 E/F/G/H, V
=0V
OUT
=0V 1.1
OUT
Chip Disable, Shutdown Mode 0.1 1.0 µA
1.6 5.5 V
0 1.0 V
2.7 5.5 V
A
0.7
A
Enable Pin Input Current IEN Force 0V to 5.0V at EN Pin -1.0 1.0 µA
Under Voltage Lockou
Threshold Voltage
Under Voltage Hysteresis V
V
VIN Increasing from 0V 2.2 2.5 3.0 V
UVLO
0.2 V
UVLOHY
Reverse Current I
Output Pull Low Resistance
after Shutdown
R
Output Turn-on Time tON
FLAG Pin Delay Time t
FLAG Pin Low Voltage V
FLAG Pin Leakage Current I
Thermal Shutdown
Temperature
Thermal Shutdown Hysteresis T
Chip Disable, V
REVERSE
DISCHARGE
LEAKAGE
T
100 200 Ω
DFLG
I
FLG
FLAG Disable, Force 5.0V 1.0 µA
OTSD
HYOTSD
OUT>VIN
From Enable Active to 90% o
Output
From Over Current Fault Condition
to Flag Active
=5.0mA 35 70 mV
SINK
0.1 1.0 µA
500 µs
5 10 15 ms
150
30
o
C
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
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Page 10
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches AP2822
Typical Performance Characteristics
100
90
80
70
60
50
40
30
Supply Current (μA)
20
10
0
-40.0 -20.0 0.0 20.0 40.0 60.0 80.0
Ambient Temperature (
O
C)
VIN=5V
Enable Active
No Load
Figure 4. Supply Current vs. Ambient Temperature Figure 5. Supply Current vs. Supply Voltage
200
180
160
140
120
(mΩ)
100
DS(ON)
80
R
60
40
20
0
-40-20 0 20406080
VIN=5.0V
VIN=3.3V
Ambient Temperature (OC)
I
=1.0A
OUT
Figure 6. R
vs. Ambient Temperature Figure 7. R
DS(ON)
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
10
100
90
80
70
60
50
40
30
Supply Current (μA)
20
10
0
-10
1.01.52.02.53.03.54.04.55.05.5
180
170
160
150
140
130
120
(mΩ)
110
100
DS(ON)
90
R
80
70
60
50
40
30
3.0 3.5 4.0 4.5 5.0 5.5
Supply Voltage (V)
Supply Voltage (V)
DS(ON)
TA=-40OC
TA=25OC
TA=85OC
TA=-40OC
TA=25OC
TA=85OC
vs. Supply Voltage
Enable Active
I
=1.0A
OUT
Page 11
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches AP2822
Typical Performance Characteristics (Continued)
1.4
1.2
1.0
For AP2822A/B
1.4
1.2
1.0
For AP2822A/B
0.8
0.6
Current Limit (A)
0.4
0.2
0.0
3.0 3.5 4.0 4.5 5.0 5.5
TA= -40OC
TA= 25OC
TA= 85OC
Supply Voltage (V)
0.8
0.6
Current Limit (A)
0.4
0.2
0.0
-40-200 20406080
Ambient Temperature (OC)
VIN=5.0V
VIN=3.3V
Figure 8. Current Limit vs. Supply Voltage Figure 9. Current Limit vs. Ambient Temperature
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
Current Limit (A)
1.2
1.1
1.0
3.0 3.5 4.0 4.5 5.0 5.5
Supply Voltage (V)
For AP2822C/D
TA=-40oC
TA=250C
TA=850C
2.0
1.9
1.8
1.7
1.6
1.5
Current Limit (A)
1.4
1.3
1.2
-40-200 20406080
Ambient Temperature (OC)
For AP2822C/D
VIN=5.0V
VIN=3.3V
Figure 10. Current Limit vs. Supply Voltage Figure 11. Current Limit vs. Ambient Temperature
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
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Page 12
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches AP2822
Typical Performance Characteristics (Continued)
3.0
2.8
2.6
2.4
2.2
2.0
1.8
Current Limit (A)
1.6
1.4
1.2
3.0 3.5 4.0 4.5 5.0 5.5
TA=-40OC
TA=25OC
TA=85OC
Supply Voltage (V)
For AP2822E/F
3.0
2.8
2.6
2.4
2.2
2.0
1.8
Current Limit (A)
1.6
1.4
1.2
-40-200 20406080
Ambient Temperature (OC)
For AP2822E/F
VIN=5.0V
VIN=3.3V
Figure 12. Current Limit vs. Supply Voltage Figure 13. Current Limit vs. Ambient Temperature
3.6
3.4
3.2
3.0
2.8
2.6
2.4
2.2
Current Limit (A)
2.0
1.8
1.6
3.0 3.5 4.0 4.5 5.0 5.5
Supply Voltage (V)
For AP2822G/H
TA=-40oC
TA=25oC
TA=85oC
3.6
3.4
3.2
3.0
2.8
2.6
2.4
2.2
Current Limit (A)
2.0
1.8
1.6
-40-20 0 20406080
VIN=5.0V
VIN=3.3V
Ambient Temperature (OC)
For AP2822G/H
Figure 14. Current Limit vs. Supply Voltage Figure 15. Current Limit vs. Ambient Temperature
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
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Page 13
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches AP2822
Typical Performance Characteristics (Continued)
2.70
2.65
2.60
2.55
2.50
2.45
2.40
2.35
2.30
2.25
2.20
Under Voltage Lockout Threshold Voltage (V)
-40.0 -20.0 0.0 20.0 40.0 60.0 80.0
VIN Rising
VIN Falling
Ambient Temperature (OC)
Enable Active
15
14
13
12
11
10
9
8
7
6
Flag Delay Time during Over Current (ms)
5
-40.0 -20.0 0.0 20.0 40.0 60.0 80.0
Ambient Temperature (OC)
VIN=5V
Enable Active
Figure 16. UVLO Voltage vs. Ambient Temperature Figure 17. Flag Delay Time during Over Current
vs. Ambient Temperature
14
12
TA=25OC
=5V
V
IN
Enable Active
10
8
6
Flag Delay Time during Over Current (ms)
3.0 3 .5 4.0 4.5 5.0 5.5
Supply Voltage (V)
1.30
1.28
1.26
1.24
1.22
1.20
1.18
1.16
1.14
1.12
1.10
1.08
1.06
Output Short to GND Current (A)
1.04
1.02
1.00
3.0 3.5 4.0 4.5 5.0
Supply Voltage (V)
VIN=5V
Enable Active
For AP2822 E/F/G/H
Figure 18. Flag Delay Time during Over Current Figure 19. Output Short to GND Current
vs. Supply Voltage vs. Supply Voltage
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
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Page 14
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches AP2822
Typical Performance Characteristics (Continued)
1.5
1.4
VIN=5V
Enable Active
1.3
1.2
1.1
Output Short to GND Current (A)
1.0
-40.0 -20.0 0. 0 20.0 40.0 60.0 80.0
Ambient Temperature (
For AP2822 E/F/G/H
O
C)
Figure 20. Output Short to GND Current Figure 21. Enable Threshold Voltage
vs. Ambient Temperature vs. Ambient Temperature
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
Enable Threshold Voltage (V)
0.8
0.7
3.0 3.5 4.0 4.5 5.0 5.5
V
ENH
V
ENL
Supply Voltage (V)
TA=25OC
Figure 22. Enable Threshold Voltage Figure 23. Output Turn On and Rise Time
vs. Supply Voltage (CIN=1.0μF, C
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
14
5V/div
I
20mA/div
1V/div
1.6
1.5
1.4
1.3
1.2
1.1
Enable Threshold Voltage (V)
1.0
-40.0 -20.0 0.0 20.0 40.0 60.0 80.0
V
EN
INRUSH
V
OUT
V
ENH
V
ENL
Ambient Temperature (OC)
Time 500μs/div
=1.0μF, No Load)
OUT
VIN=5V
Page 15
v
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches AP2822
Typical Performance Characteristics (Continued)
VEN
5V/div
I
INRUSH
1A/div
V
OUT
1V/div
Figure 24. Output Turn
Time 500μs/div
(CIN=1.0μF, C
On and Rise Time
=1.0μF, RL=3.3Ω) (CIN=1.0μF, C
OUT
V
5V/div
I
INRUSH
1A/div
V
OUT
1V/div
EN
Time 500μs/div
Figure 25. Output Turn On and Rise Time
=100μF, No Load)
OUT
5V/div
1V/div
VEN
C
=470μF
C
=100μF
OUT
C
=22μF
OUT
V
OUT
C
=1μF
OUT
OUT
C
Time 5ms/div
OUT
=220μF
Figure 26. Output Turn Off and Fall Time Figure 27. Output Turn Off and Fall Time
(V
=5V, CIN=1.0μF, No Load) (VIN=5V, CIN=1.0μF, C
IN
V
5V/di
V
OUT
1V/div
I
OUT
1A/div
EN
Time 500μs/div
=470μF, R
OUT
=3.3Ω)
L
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
15
Page 16
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches AP2822
Typical Performance Characteristics (Continued)
5V/div
1A/div
1V/div
VEN
I
OUT
V
OUT
Time 20ms/div
Figure 28. Output Short to GND Current
(VIN=5V, C
=1.0μF)
IN
V
FLAG
1V/div
I
OUT
1A/div
V
OUT
1V/div
Time 5ms/ di v
Figure 29. FLAG Response during Over Current
V
FLAG
1V/div
I
OUT
1A/div
V
OUT
1V/div
Figure 30. FLAG Response during
Over Temperature (T
Time 5ms/div
=125 ºC)
A
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
16
Page 17
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches AP2822
Typical Application
R
10kΩ
VIN=5V
C
IN
(Note2)
2.2µF
Enable
4(4){3}[5]
3(1){4}[4]
VIN
EN
AP2822
GND
2(2){2}[2]
FLAG
VOUT
1(3)[3]
5(5){1,5}[1]
USB Controller
C
OUT
1µF
V
BUS
D+
D-
GND
A(B){C}[D]
A: SOT-23-5(K Package)
B: SOT-23-5(KA Package)
C: SOT-23-5(KB Package)
D: SOT-23-5(KE Package)
Note 2: 2.2µF input capacitor is enough in most application cases.
If the VOUT is short to ground frequently during usage, large size input capacitor is necessary, recommend
22µF.
Figure 31. Typical Application of AP2822
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
17
Page 18
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches AP2822
Mechanical Dimensions
SOT-23-5 Unit: mm(inch)
2.820(0.111)
3.020(0.119)
0.100(0.004)
0.200(0.008)
0.950(0.037)
0.200(0.008)
0
0
(
0
.
0
0
7
.
R
0.300(0.012)
0.400(0.016)
Y
T
P
1.800(0.071)
2.000(0.079)
0
.
0
0
(
0
0
0
0
0
5
(
1
.
0
.
3
.
1
3
0
.
0
(
0
0
9
0
5
.
0
(
0
)
1
5
0
)
8
2
E
F
0°
8°
0
0
.
)
0
0
.
)
6
0
)
Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited
18
Page 19
BCD Semiconductor Manufacturing Limited
IMPORTANT NOTICE
IMPORTANT NOTICE
BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-
BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-
cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any
cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any
particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use
particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use
of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or
of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or
other rights nor the rights of others.
other rights nor the rights of others.
http://www.bcdsemi.com
MAIN SITE
MAIN SITE
- Headquarters
BCD Semiconductor Manufacturing Limited
BCD Semiconductor Manufactur ing Limited
- Wafer Fab
No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China
Shanghai SIM-BCD Semiconductor Manufacturing Limited
Tel: +86-21-24162266, Fax: +86-21-24162277
800, Yi Shan Road, Shanghai 200233, China
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008
REGIONAL SALES OFFICE
Shenzhen Office
REGIONAL SALES OFFICE
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office
Shenzhen Office
Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen,
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office
China
Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office
Tel: +86-755-8826 7951
Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China
Fax: +86-755-8826 7865
Tel: +86-755-8826 7951
Fax: +86-755-8826 7865
- Wafer Fab
BCD Semiconductor Manufacturing Limited
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.
- IC Design Group
800 Yi Shan Road, Shanghai 200233, China
Advanced Analog Circuits (Shanghai) Corporation
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008
8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China
Tel: +86-21-6495 9539, Fax: +86-21-6485 9673
Taiwan Office
BCD Semiconductor (Taiwan) Company Limited
Taiwan Office
4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,
BCD Semiconductor (Taiwan) Company Limited
Tai wan
4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,
Tel: +886-2-2656 2808
Taiwan
Fax: +886-2-2656 2806
Tel: +886-2-2656 2808
Fax: +886-2-2656 2806
USA Office
BCD Semiconductor Corp.
USA Office
30920 Huntwood Ave. Hayward,
BCD Semiconductor Corporation
CA 94544, USA
30920 Huntwood Ave. Hayward,
Tel : +1-510-324-2988
CA 94544, U.S.A
Fax: +1-510-324-2788
Tel : +1-510-324-2988
Fax: +1-510-324-2788
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