Diodes AP2805 User Manual

500mA High-side Power Distribution Switch with Enable and Flag AP2805
Data Sheet
General Description
The AP2805 is an integrated high-side power switch that consists of N-Channel MOSFET, charge pump, over current & temperature and other related protection circuits. The switch’s low RDS (ON), 60m, design easily to meet USB voltage drop requirements. It includes soft-start to limit inrush current, over-current protection, load short protection with fold-back, and thermal shutdown to avoid switch failure during hot plug-in. Under voltage lockout (UVLO) function is used to ensure the device remain off unless there is a valid input voltage present. A Flag output is available to indicate fault conditions to the local USB controller.
The AP2805 is available in standard packages of SOIC-8 and MSOP-8.
SOIC-8 MSOP-8
Figure 1. Package Types of AP2805
Features
Low MOSFET on Resistance:
60m@V
Compliant to USB Specifications
Operating Voltage Range: 2.7V to 5.5V
Low Supply Current: 60µA (Typ.)
Low Shutdown Current: 1.0µA (Max)
Guarantee 0.5A Continuous Load
Current Limit: 0.7A (Min), 1.4A (Max)
Under-voltage Lockout
Logic Level Enable Pin: Available in
Active-high or Active-low Version Over-current Protection
Over Temperature Protection
Load Short Protection with Fold-back
No Reverse Current When Power Off
Deglitched Flag Output with Open Drain
With Output Shutdown Pull-low Resistor for
A/C Versions
UL Approved (File No. E339337)
Nemko CB Scheme IEC60950-1, Ref. Certif
No. NO67288
=5.0V
IN
Applications
USB Power Management
USB Bus/Self Powered Hubs
Hot-plug Power Supplies
Battery-charger Circuits
Notebooks, Motherboard PCs
Aug. 2012 Rev 1. 0 BCD Semiconductor Manufacturing Limited
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Data Sheet
500mA High-side Power Distribution Switch with Enable and Flag AP2805
Pin Configuration
M/MM Package
SOIC-8/MSOP-8
Figure 2. Pin Configuration of AP2805 (Top View)
Pin Descriptions
Pin Number Pin Name Function
1 GND Ground
2, 3 VIN Supply input pin
4
5
6, 7, 8 VOUT Switch output voltage
Chip enable control input, active low or high
Fault flag pin, output with open drain, need a pull-up resistor in application, active low to indicate OCP or OTP
Aug. 2012 Rev 1. 0 BCD Semiconductor Manufacturing Limited
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Data Sheet
500mA High-side Power Distribution Switch with Enable and Flag AP2805
Functional Block Diagram
Figure 3. Functional Block Diagram of AP2805
Aug. 2012 Rev 1. 0 BCD Semiconductor Manufacturing Limited
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Data Sheet
500mA High-side Power Distribution Switch with Enable and Flag AP2805
Ordering Information
AP2805 -
Circuit Type
Condition A: Active High with Auto Discharge B: Active High without Auto Discharge C: Active Low with Auto Discharge D: Active Low without Auto Discharge
Product Package Condition
SOIC-8
AP2805A
MSOP-8
SOIC-8
AP2805B
MSOP-8
SOIC-8
AP2805C
MSOP-8
SOIC-8
AP2805D
MSOP-8
Active High
with Auto Discharge
Active High
without Auto Discharge
Active Low
with Auto Discharge
Active Low
without Auto Discharge
Temperature
Range
-40 to 85°C
-40 to 85°C
-40 to 85°C
-40 to 85°C
BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant
and Green.
Part Number Marking ID Green Green
AP2805AM-G1 2805AM-G1 Tube
AP2805AMTR-G1 2805AM-G1 Tape & Reel
AP2805AMM-G1 2805AMM-G1 Tube
AP2805AMMTR-G1 2805AMM-G1 Tape & Reel
AP2805BM-G1 2805BM-G1 Tube
AP2805BMTR-G1 2805BM-G1 Tape & Reel
AP2805BMM-G1 2805BMM-G1 Tube
AP2805BMMTR-G1 2805BMM-G1 Tape & Reel
AP2805CM-G1 2805CM-G1 Tube
AP2805CMTR-G1 2805CM-G1 Tape & Reel
AP2805CMM-G1 2805CMM-G1 Tube
AP2805CMMTR-G1 2805CMM-G1 Tape & Reel
AP2805DM-G1 2805DM-G1 Tube
AP2805DMTR-G1 2805DM-G1 Tape & Reel
AP2805DMM-G1 2805DMM-G1 Tube
AP2805DMMTR-G1 2805DMM-G1 Tape & Reel
G1: Green
TR: Tape & Reel Blank: Tube
Package M: SOIC-8 MM: MSOP-8
Packing
Type
Aug. 2012 Rev 1. 0 BCD Semiconductor Manufacturing Limited
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Data Sheet
500mA High-side Power Distribution Switch with Enable and Flag AP2805
Absolute Maximum Ratings (Note 1)
Parameter Symbol Value Unit
Power Supply Voltage VIN 6.0 V
Operating Junction Temperature Range
Storage Temperature Range T
Lead Temperature (Soldering,10 sec) T
Thermal Resistance (Junction to Ambient)
150 ºC
T
J
-65 to 150 ºC
STG
260 ºC
LEAD
θ
JA
SOIC-8 135
MSOP-8 150
o
C/W
ESD (Machine Model)
ESD (Human Body Model) 2000 V
200 V
Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability.
Recommended Operating Conditions
Parameter Symbol Min Max Unit
Supply Voltage VIN 2.7 5.5 V
Operating Ambient Temperature Range
Aug. 2012 Rev 1. 0 BCD Semiconductor Manufacturing Limited
-40 85 °C
T
A
5
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