Diodes AP2202 User Manual

Data Sheet

150mA RF ULDO REGULATOR AP2202

General Description

The AP2202 is a 150mA ULDO regulator which pro­vides very low noise, ultra low dropout voltage
(typically 165mV at 150mA), very low standby current
(1

µA maximum) and excellent power supply ripple

rejection (PSRR 75dB at 100Hz) in battery powered
applications, such as handsets and PDAs and in noise
sensitive applications, such as RF electronics.

The AP2202 also features logic compatible enable/
shutdown control inputs, a low power shutdown mode
for extended battery life, over current protection, over
temperature protection, as well as reversed-battery pro­tection.

The AP2202 has adjustable, 2.5V, 2.6V, 2.8V, 3.0V and

3.3V versions.

The AP2202 is available in space saving SOT-23-5 and
SOT-89 packages.

Features

· Up to 150mA Output Current

· Low Standby Current

· Low Dropout Voltage: V

· High Output Accuracy: ± 1%

· Good Ripple Rejection Ability: 75dB at 100Hz

OUT

=100µA

and I

· Tight Load and Line Regulation

· Low Temperature Coefficient

· Over Current Protection

· Thermal Protection

· Reverse-battery Protection

· Logic-controlled Enable

=165mV at 150mA

DROP

Applications

· Cellular Phones

· Cordless Phones

· Digital Still Cameras

· Wireless Communicators

· PDAs / Palmtops

· PC Mother Board

· Consumer Electronics

SOT-23-5

Figure 1. Package Types of AP2202

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

1

SOT-89

Data Sheet

150mA RF ULDO REGULATOR AP2202

Pin Configuration

K Package

(SOT-23-5)

V

GND

EN

1

IN

2

34

5

Figure 2. Pin Configuration of AP2202 (Top View)

V

OUT

BYP

R Package

(SOT-89)

123

V

OUT

(TAB )

GND

V

V

GND

EN

IN

1

IN

2

34

V

5

OUT

ADJ

Pin Description

Pin Number

SOT-23-5 SOT-89

13 V

Pin Name

IN

Input voltage

2 2 GND Ground (TAB for SOT-89)

3 EN Enable input: CMOS or TTL compatible input. Logic high=enable, logic

low=shutdown

4 BYP/ADJ Bypass capacitor for low noise operation/Adjust output

51 V

OUT

Regulated output voltage

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

2

Function

Data Sheet

150mA RF ULDO REGULATOR AP2202

Functional Block Diagram

V

BYP

EN

V

IN

1 (3)

IN

4

5 (1)

V

OUT

+

Bandgap

3

-

Current Limit

Thermal Shutdown

Ref.

2 (2)

A (B)
A for SOT-23-5
B for SOT-89

GND

Fixed Regulator

1

5

V

OUT

4

ADJ

EN

3

+

-

Current Limit

Thermal Shutdown

Bandgap

Ref.

2

GND

Adjustable Regulator

Figure 3. Functional Block Diagram of AP2202

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

3

Data Sheet

150mA RF ULDO REGULATOR AP2202

Ordering Information

Package

SOT-23-5

SOT-89

Circuit Type

Package

K: SOT-23-5
R: SOT-89

Temperature

Range

o

-40 to 125

-40 to 125

C

o

C

AP2202 -

E1: Lead Free
G1: Green

TR: Tape and Reel

ADJ: Adjustable Output

2.5: Fixed Output 2.5V

2.6: Fixed Output 2.6V

2.8: Fixed Output 2.8V

3.0: Fixed Output 3.0V

3.3: Fixed Output 3.3V

Part Number Marking ID

Lead Free Green Lead Free Green

AP2202K-ADJTRE1 AP2202K-ADJTRG1 E2C G2C Tape & Reel

AP2202K-2.5TRE1 AP2202K-2.5TRG1 E2D G2D Tape & Reel

AP2202K-2.6TRE1 AP2202K-2.6TRG1 E2E G2E Tape & Reel

AP2202K-2.8TRE1 AP2202K-2.8TRG1 E2G G2G Tape & Reel

AP2202K-3.0TRE1 AP2202K-3.0TRG1 E2I G2I Tape & Reel

AP2202K-3.3TRE1 AP2202K-3.3TRG1 E2L G2L Tape & Reel

AP2202R-3.3TRE1 AP2202R-3.3TRG1 E22B G22B Tape & Reel

Packing Type

BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with
"G1" suffix are available in green packages.

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

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Data Sheet

150mA RF ULDO REGULATOR AP2202

Absolute Maximum Ratings (Note 1)

Parameter Symbol Value Unit

Supply Input Voltage V

Enable Input Voltage V

Power Dissipation P

Lead Temperature (Soldering, 10sec) T

LEAD

Junction Temperature T

Storage Temperature T

IN

EN

D

STG

Internally Limited (Thermal Protection) W

J

15 V

15 V

260

150

-65 to 150

o

C

o

C

o

C

ESD (Machine Model) 200 V

Thermal Resistance (No Heatsink) θ

SOT-23-5 200

JA

SOT-89 165

o

C/W

Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated
under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods
may affect device reliability.

Recommended Operating Conditions

Parameter Symbol Min Max Unit

Supply Input Voltage V

Enable Input Voltage V

Operating Junction Temperature T

IN

EN

J

2.5 13.2 V

0 13.2 V

-40 125

o

C

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

5

Data Sheet

150mA RF ULDO REGULATOR AP2202

Electrical Characteristics
AP2202-ADJ Electrical Characteristics

VIN=V

(note 2), unless

Parameter Symbol Conditions Min Typ Max Unit

Output Voltage Accuracy

Output Voltage
Temperature Coefficient
(Note 3)

Line Regulation

Load Regulation
(Note 4)

Dropout Voltage (Note 5)

Standby Current

Ground Pin Current
(Note 6)

Ripple Rejection PSRR frequency=100Hz, I

Current Limit I

Output Noise

OUT

+1V, I

=100µA, CIN=1.0µF, C

OUT

otherwise specified.

∆V

OUT/VOUT

∆V

OUT

V

RLINE

V

RLOAD

V

I

I

LIMIT

DROP

STD

GND

e

no

OUT

/∆T

=2.2µF, VEN≥

Variation from specified
V

VIN=V

I

OUT

I

OUT

I

OUT

I

OUT

I

OUT

2.0V, TJ=25oC,

Bold

typeface applies over -40oC≤TJ≤

-1 1

OUT

+1V to 13.2V

OUT

-2 2

0.004 0.012

=0.1mA to 150mA 0.02 0.2

=100µA

=50mA

=100mA

=150mA

VEN≤0.4V (shutdown) 0.01 1

V

≤0.18V (shutdown) 5

EN

VEN≥2.0V, I

V

≥2.0V, I

EN

≥2.0V, I

V

EN

≥2.0V, I

V

EN

≥2.0V, I

V

EN

V

=0V 320 550 mA

OUT

I

=50mA, C

OUT

OUT

OUT

OUT

OUT

OUT

OUT

=0µA

=100µA

=50mA

=100mA

=150mA

=100µA75 dB

OUT

1300 1900

=2.2µF,

100pF from BYP to GND

120

0.05

0.5

15 50

70

110 150

230

140 250

300

165 275

350

95 130

150

98 140

160

350 600

800

600 1000

1500

2500

260

125oC

%

µV/

%/V

%

mV

µA

µA

o

C

HznV /

Enable Input Logic-Low
Vo l t a g e

V

IL

Regulator shutdown

0.4

0.18

V

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

6

Data Sheet

150mA RF ULDO REGULATOR AP2202

Electrical Characteristics (Continued)
AP2202-ADJ Electrical Characteristics

VIN=V

(note 2), unless

Parameter Symbol Conditions Min Typ Max Unit

Enable Input Logic-High
Vo l t a g e

OUT

+1V, I

=100µA, CIN=1.0µF, C

OUT

otherwise specified.

=2.2µF, VEN≥

OUT

V

IH

Regulator enabled 2.0 V

2.0V, TJ=25oC,

Bold

typeface applies over -40oC≤TJ≤

125oC

Enable Input Logic-Low
Current

Enable Input Logic-High
Current

Thermal Resistance

I

IL

I

IH

θ

JC

VIL≤0.4V 0.01 1

≤0.18V 2

V

IL

VIH≥2.0V 5 20

V

≥2.0V 25

IH

SOT-23-5 63.4

o

C/W

µA

µA

SOT-89 50

Note 2: Specifications in bold type are limited to

-40oC≤TJ≤

125oC. Limits over temperature are guaranteed by design, but not

tested in production.
Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature
range.
Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load
regulation in the load range from 0.1mA to 150mA. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.

Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (T

o

C≤TJ≤

125oC)

40

below its nominal value measured at 1V differential.

=25oC) or 2% (-

J

Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the
supply is the sum of the load current plus the ground pin current.

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

7

Data Sheet

150mA RF ULDO REGULATOR AP2202

Electrical Characteristics (Continued)
AP2202-2.5 Electrical Characteristics

VIN=3.5V, I

unless

otherwise specified.

Parameter Symbol Conditions Min Typ Max Unit

Output Voltage Accuracy

Output Voltage
Temperature Coefficient
(Note 3)

=100µA, CIN=1.0µF, C

OUT

∆V

(∆V

=2.2µF, VEN≥

OUT

OUT/VOUT

/∆T

∆V

OUT

OUT/VOUT

2.0V, TJ=25oC,

Variation from specified
V

OUT

Bold

typeface applies over -40oC≤TJ≤

-1 1

-2 2

120

)/∆T 48

125oC (note 2),

%

µV/

ppm/

o

C

o

C

Line Regulation

Load Regulation
(Note 4)

Dropout Voltage (Note 5)

Standby Current

Ground Pin Current
(Note 6)

V

RLINE

V

RLOAD

V

DROP

I

I

GND

STD

VIN=3.5V to 13.2V

I

=0.1mA to 150mA 1 5

OUT

I

=100µA

OUT

=50mA

I

OUT

=100mA

I

OUT

=150mA

I

OUT

VEN≤0.4V (shutdown) 0.01 1

V

≤0.18V (shutdown) 5

EN

VEN≥2.0V, I

V

≥2.0V, I

EN

≥2.0V, I

V

EN

≥2.0V, I

V

EN

≥2.0V, I

V

EN

OUT

OUT

OUT

OUT

OUT

=0µA

=100µA

=50mA

=100mA

=150mA

Ripple Rejection PSRR frequency=100Hz, I

V

Current Limit I

Output Noise

LIMIT

e

no

=0V 320 550 mA

OUT

I

=50mA, C

OUT

OUT

100pF from BYP to GND

13

mV

13

mV

13

15 50

70

110 150

230

mV

140 250

300

165 275

350

µA

95 130

150

98 140

160

350 600

µA

800

600 1000

1500

1300 1900

2500

=100µA75 dB

OUT

=2.2µF,

260

HznV /

Enable Input Logic-Low
Vo l t a g e

V

IL

Regulator shutdown

0.4

0.18

V

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

8

Data Sheet

150mA RF ULDO REGULATOR AP2202

Electrical Characteristics (Continued)
AP2202-2.5 Electrical Characteristics

VIN=3.5V, I

unless

otherwise specified.

Parameter Symbol Conditions Min Typ Max Unit

Enable Input Logic-High
Vo l t a g e

=100µA, CIN=1.0µF, C

OUT

=2.2µF, VEN≥

OUT

V

IH

2.0V, TJ=25oC,

Bold

typeface applies over -40oC≤TJ≤

125oC (note 2),

Regulator enabled 2.0 V

Enable Input Logic-Low
Current

Enable Input Logic-High
Current

Thermal Resistance

I

IL

I

IH

θ

JC

VIL≤0.4V 0.01 1

≤0.18V 2

V

IL

VIH≥2.0V 5 20

V

≥2.0V 25

IH

SOT-23-5 63.4

o

C/W

µA

µA

SOT-89 50

Note 2: Specifications in bold type are limited to

-40oC≤TJ≤

125oC. Limits over temperature are guaranteed by design, but not

tested in production.
Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature
range.
Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load reg­ulation in the load range from 0.1mA to 150mA. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.

Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (T

o

C≤TJ≤

125oC)

40

below its nominal value measured at 1V differential.

=25oC) or 2% (-

J

Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the
supply is the sum of the load current plus the ground pin current.

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

9

Data Sheet

150mA RF ULDO REGULATOR AP2202

Electrical Characteristics (Continued)
AP2202-2.6 Electrical Characteristics

VIN=3.6V, I

unless

otherwise specified.

Parameter Symbol Conditions Min Typ Max Unit

Output Voltage Accuracy

Output Voltage
Temperature Coefficient
(Note 3)

=100µA, CIN=1.0µF, C

OUT

∆V

(∆V

=2.2µF, VEN≥

OUT

OUT/VOUT

/∆T

∆V

OUT

OUT/VOUT

2.0V, TJ=25oC,

Variation from specified
V

OUT

Bold

typeface applies over -40oC≤TJ≤

-1 1

-2 2

120

)/∆T 46

125oC (note 2),

%

µV/

ppm/

o

C

o

C

Line Regulation

Load Regulation
(Note 4)

Dropout Voltage (Note 5)

Standby Current

Ground Pin Current
(Note 6)

V

RLINE

V

RLOAD

V

DROP

I

STD

I

GND

VIN=3.6V to 13.2V

I

=0.1mA to 150mA 1 6

OUT

I

=100µA

OUT

=50mA

I

OUT

=100mA

I

OUT

=150mA

I

OUT

VEN≤0.4V (shutdown) 0.01 1

V

≤0.18V (shutdown) 5

EN

VEN≥2.0V, I

V

≥2.0V, I

EN

≥2.0V, I

V

EN

≥2.0V, I

V

EN

≥2.0V, I

V

EN

OUT

OUT

OUT

OUT

OUT

=0µA

=100µA

=50mA

=100mA

=150mA

Ripple Rejection PSRR frequency=100Hz, I

V

Current Limit I

Output Noise

LIMIT

e

no

=0V 320 550 mA

OUT

I

=50mA, C

OUT

OUT

100pF from BYP to GND

13

mV

13

mV

14

15 50

70

110 150

230

mV

140 250

300

165 275

350

µA

95 130

150

98 140

160

350 600

µA

800

600 1000

1500

1300 1900

2500

=100µA75 dB

OUT

=2.2µF,

260

HznV /

Enable Input Logic-Low
Voltage

V

IL

Regulator shutdown

0.4

0.18

V

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

10

Data Sheet

150mA RF ULDO REGULATOR AP2202

Electrical Characteristics (Continued)
AP2202-2.6 Electrical Characteristics

VIN=3.6V, I

unless

otherwise specified.

Parameter Symbol Conditions Min Typ Max Unit

Enable Input Logic-High
Vo l t a g e

=100µA, CIN=1.0µF, C

OUT

=2.2µF, VEN≥

OUT

V

IH

2.0V, TJ=25oC,

Bold

typeface applies over -40oC≤TJ≤

125oC (note 2),

Regulator enabled 2.0 V

Enable Input Logic-Low
Current

Enable Input Logic-High
Current

Thermal Resistance

I

IL

I

IH

θ

JC

VIL≤0.4V 0.01 1

≤0.18V 2

V

IL

VIH≥2.0V 5 20

V

≥2.0V 25

IH

SOT-23-5 63.4

o

C/W

µA

µA

SOT-89 50

Note 2: Specifications in bold type are limited to

-40oC≤TJ≤

125oC. Limits over temperature are guaranteed by design, but not

tested in production.
Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature
range.
Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load
regulation in the load range from 0.1mA to 150mA. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.

Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (T

o

40

C≤TJ≤

125oC)

below its nominal value measured at 1V differential.

=25oC) or 2% (-

J

Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the
supply is the sum of the load current plus the ground pin current.

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

11

Data Sheet

150mA RF ULDO REGULATOR AP2202

Electrical Characteristics (Continued)
AP2202-2.8 Electrical Characteristics

VIN=3.8V, I

unless

otherwise specified.

Parameter Symbol Conditions Min Typ Max Unit

Output Voltage Accuracy

Output Voltage
Temperature Coefficient
(Note 3)

=100µA, CIN=1.0µF, C

OUT

∆V

(∆V

=2.2µF, VEN≥

OUT

OUT/VOUT

/∆T

∆V

OUT

OUT/VOUT

2.0V, TJ=25oC,

Variation from specified
V

OUT

Bold

typeface applies over -40oC≤TJ≤

-1 1

-2 2

120

)/∆T 42.8

125oC (note 2),

%

µV/

ppm/

o

C

o

C

Line Regulation

Load Regulation
(Note 4)

Dropout Voltage (Note 5)

Standby Current

Ground Pin Current
(Note 6)

V

RLINE

V

RLOAD

V

DROP

I

I

GND

STD

VIN=3.8V to 13.2V

I

=0.1mA to 150mA 1 6

OUT

I

=100µA

OUT

=50mA

I

OUT

=100mA

I

OUT

=150mA

I

OUT

VEN≤0.4V (shutdown) 0.01 1

V

≤0.18V (shutdown) 5

EN

VEN≥2.0V, I

V

≥2.0V, I

EN

≥2.0V, I

V

EN

≥2.0V, I

V

EN

≥2.0V, I

V

EN

OUT

OUT

OUT

OUT

OUT

=0µA

=100µA

=50mA

=100mA

=150mA

Ripple Rejection PSRR frequency=100Hz, I

V

Current Limit I

Output Noise

LIMIT

e

no

=0V 320 550 mA

OUT

I

=50mA, C

OUT

OUT

100pF from BYP to GND

14

mV

14

mV

14

15 50

70

110 150

230

mV

140 250

300

165 275

350

µA

95 130

150

98 140

160

350 600

µA

800

600 1000

1500

1300 1900

2500

=100µA75 dB

OUT

=2.2µF,

260

HznV /

Enable Input Logic-Low
Vo l t a g e

V

IL

Regulator shutdown

0.4

0.18

V

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

12

Data Sheet

150mA RF ULDO REGULATOR AP2202

Electrical Characteristics (Continued)
AP2202-2.8 Electrical Characteristics

VIN=3.8V, I

unless

otherwise specified.

Parameter Symbol Conditions Min Typ Max Unit

Enable Input Logic-High
Vo l t a g e

=100µA, CIN=1.0µF, C

OUT

=2.2µF, VEN≥

OUT

V

IH

2.0V, TJ=25oC,

Bold

typeface applies over -40oC≤TJ≤

125oC (note 2),

Regulator enabled 2.0 V

Enable Input Logic-Low
Current

Enable Input Logic-High
Current

Thermal Resistance

I

IL

I

IH

θ

JC

VIL≤0.4V 0.01 1

≤0.18V 2

V

IL

VIH≥2.0V 5 20

V

≥2.0V 25

IH

SOT-23-5 63.4

o

C/W

µA

µA

SOT-89 50

Note 2: Specifications in bold type are limited to

-40oC≤TJ≤

125oC. Limits over temperature are guaranteed by design, but not

tested in production.
Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature
range.
Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load
regulation in the load range from 0.1mA to 150mA. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.

Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (T

o

C≤TJ≤

125oC)

40

below its nominal value measured at 1V differential.

=25oC) or 2% (-

J

Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the
supply is the sum of the load current plus the ground pin current.

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

13

Data Sheet

150mA RF ULDO REGULATOR AP2202

Electrical Characteristics (Continued)
AP2202-3.0 Electrical Characteristics

VIN=4V, I

unless

Parameter Symbol Conditions Min Typ Max Unit

Output Voltage Accuracy

Output Voltage
Temperature Coefficient
(Note 3)

=100µA, CIN=1.0µF, C

OUT

otherwise specified.

∆V

(∆V

=2.2µF, VEN≥

OUT

OUT/VOUT

/∆T

∆V

OUT

OUT/VOUT

2.0V, TJ=25oC,

Variation from specified
V

OUT

Bold

typeface applies over -40oC≤TJ≤

-1 1

-2 2

120

)/∆T 40

125oC (note 2),

%

µV/

ppm/

o

C

o

C

Line Regulation

Load Regulation
(Note 4)

Dropout Voltage (Note 5)

Standby Current

Ground Pin Current
(Note 6)

V

RLINE

V

RLOAD

V

DROP

I

I

GND

STD

VIN=4V to 13.2V

I

=0.1mA to 150mA 1 7

OUT

I

=100µA

OUT

=50mA

I

OUT

=100mA

I

OUT

=150mA

I

OUT

VEN≤0.4V (shutdown) 0.01 1

V

≤0.18V (shutdown) 5

EN

VEN≥2.0V, I

V

≥2.0V, I

EN

≥2.0V, I

V

EN

≥2.0V, I

V

EN

≥2.0V, I

V

EN

OUT

OUT

OUT

OUT

OUT

=0µA

=100µA

=50mA

=100mA

=150mA

Ripple Rejection PSRR frequency=100Hz, I

V

Current Limit I

Output Noise

LIMIT

e

no

=0V 320 550 mA

OUT

I

=50mA, C

OUT

OUT

100pF from BYP to GND

14

mV

14

mV

15

15 50

70

110 150

230

mV

140 250

300

165 275

350

µA

95 130

150

98 140

160

350 600

µA

800

600 1000

1500

1300 1900

2500

=100µA75 dB

OUT

=2.2µF,

260

HznV /

Enable Input Logic-Low
Vo l t a g e

V

IL

Regulator shutdown

0.4

0.18

V

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

14

Data Sheet

150mA RF ULDO REGULATOR AP2202

Electrical Characteristics (Continued)
AP2202-3.0 Electrical Characteristics

VIN=4V, I

unless

Parameter Symbol Conditions Min Typ Max Unit

Enable Input Logic-High
Vo l t a g e

=100µA, CIN=1.0µF, C

OUT

otherwise specified.

=2.2µF, VEN≥

OUT

V

IH

2.0V, TJ=25oC,

Bold

typeface applies over -40oC≤TJ≤

125oC (note 2),

Regulator enabled 2.0 V

Enable Input Logic-Low
Current

Enable Input Logic-High
Current

Thermal Resistance

I

IL

I

IH

θ

JC

VIL≤0.4V 0.01 1

≤0.18V 2

V

IL

VIH≥2.0V 5 20

V

≥2.0V 25

IH

SOT-23-5 63.4

o

C/W

µA

µA

SOT-89 50

Note 2: Specifications in bold type are limited to

-40oC≤TJ≤

125oC. Limits over temperature are guaranteed by design, but not

tested in production.
Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature
range.
Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load
regulation in the load range from 0.1mA to 150mA. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.

Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (T

o

C≤TJ≤

125oC)

40

below its nominal value measured at 1V differential.

=25oC) or 2% (-

J

Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the
supply is the sum of the load current plus the ground pin current.

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

15

Data Sheet

150mA RF ULDO REGULATOR AP2202

Electrical Characteristics (Continued)
AP2202-3.3 Electrical Characteristics

VIN=4.3V, I

unless

otherwise specified.

Parameter Symbol Conditions Min Typ Max Unit

Output Voltage Accuracy

Output Voltage
Temperature Coefficient
(Note 3)

=100µA, CIN=1.0µF, C

OUT

∆V

(∆V

=2.2µF, VEN≥

OUT

OUT/VOUT

/∆T

∆V

OUT

OUT/VOUT

2.0V, TJ=25oC,

Variation from specified
V

OUT

Bold

typeface applies over -40oC≤TJ≤

-1 1

-2 2

120

)/∆T 36.3

125oC (note 2),

%

µV/

ppm/

o

C

o

C

Line Regulation

Load Regulation
(Note 4)

Dropout Voltage (Note 5)

Standby Current

Ground Pin Current
(Note 6)

V

RLINE

V

RLOAD

V

DROP

I

I

GND

STD

VIN=4.3V to 13.2V

I

=0.1mA to 150mA 1 8

OUT

I

=100µA

OUT

=50mA

I

OUT

=100mA

I

OUT

=150mA

I

OUT

VEN≤0.4V (shutdown) 0.01 1

V

≤0.18V (shutdown) 5

EN

VEN≥2.0V, I

V

≥2.0V, I

EN

≥2.0V, I

V

EN

≥2.0V, I

V

EN

≥2.0V, I

V

EN

OUT

OUT

OUT

OUT

OUT

=0µA

=100µA

=50mA

=100mA

=150mA

Ripple Rejection PSRR frequency=100Hz, I

V

Current Limit I

Output Noise

LIMIT

e

no

=0V 320 550 mA

OUT

I

=50mA, C

OUT

OUT

100pF from BYP to GND

15

mV

15

mV

17

15 50

70

110 150

230

mV

140 250

300

165 275

350

µA

95 130

150

98 140

160

350 600

µA

800

600 1000

1500

1300 1900

2500

=100µA75 dB

OUT

=2.2µF,

260

HznV /

Enable Input Logic-Low
Vo l t a g e

V

IL

Regulator shutdown

0.4

0.18

V

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

16

Data Sheet

150mA RF ULDO REGULATOR AP2202

Electrical Characteristics (Continued)
AP2202-3.3 Electrical Characteristics

VIN=4.3V, I

unless

otherwise specified.

Parameter Symbol Conditions Min Typ Max Unit

Enable Input Logic-High
Vo l t a g e

=100µA, CIN=1.0µF, C

OUT

=2.2µF, VEN≥

OUT

V

IH

2.0V, TJ=25oC,

Bold

typeface applies over -40oC≤TJ≤

125oC (note 2),

Regulator enabled 2.0 V

Enable Input Logic-Low
Current

Enable Input Logic-High
Current

Thermal Resistance

I

IL

I

IH

θ

JC

VIL≤0.4V 0.01 1

≤0.18V 2

V

IL

VIH≥2.0V 5 20

V

≥2.0V 25

IH

SOT-23-5 63.4

o

C/W

µA

µA

SOT-89 50

Note 2: Specifications in bold type are limited to

-40oC≤TJ≤

125oC. Limits over temperature are guaranteed by design, but not

tested in production.
Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature
range.
Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load
regulation in the load range from 0.1mA to 150mA. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.

Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 1% (T

o

C≤TJ≤

125oC)

40

below its nominal value measured at 1V differential.

=25oC) or 2% (-

J

Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the
supply is the sum of the load current plus the ground pin current.

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

17

Data Sheet

150mA RF ULDO REGULATOR AP2202

Typical Performance Characteristics

2.900

2.875

2.850

2.825

2.800

2.775

Output Voltage (V)

2.750

2.725

2.700

-60 -40 -20 0 20 40 60 80 100 120 140

AP2202-2.8
VIN=3.8V, I

CIN=1.0µF, C

OUT

=10mA

=2.2µF

OUT

Junction Temperature (oC)

Figure 4. Output Voltage vs. Junction Temperature

6

5

4

3

2

1

0

-1

Ground Pin Current (mA)

-2

-3

-4
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150

TA=25oC

C

=1.0µF, C

IN

Output Current (mA)

OUT

=2.2µF

350

I

=50mA

300

250

200

150

Dropout Voltage (mV)

100

50

0

-60 -40 -20 0 20 40 60 80 100 120 140

OUT

I

=100mA

OUT

I

=150mA

OUT

CIN=1.0µF, C

OUT

=2.2µF

Junction Temperature (oC)

Figure 5. Dropout Voltage vs. Junction Temperature

5000

AP2202-2.8

I

4000

3000

2000

1000

0

Ground Pin Current (µA)

-1000

-2000

-60 -40 -20 0 20 40 60 80 100 120 140

=50mA

OUT

I

=100mA

OUT

I

=150mA

OUT

VIN=3.8V,VEN=2.0V

CIN=1.0µF, C

OUT

=2.2µF

Junction Temperature (

o

C)

Figure 6. Ground Pin Current vs. Output Current

Figure 7. Ground Pin Current vs. Junction Temperature

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

18

Data Sheet

150mA RF ULDO REGULATOR AP2202

Typical Performance Characteristics (Continued)

20

AP2202-2.8

18

16

14

12

10

8

Enable Current (µA)

6

4

2

0

-60 -40 -20 0 20 40 60 80 100 120 140

VEN=1.8V

VEN=2.0V

VEN=3.0V

VEN=4.0V

VIN=3.8V, CIN=1.0µF

C

=2.2µF, I

OUT

OUT

=100µA

Junction Temperature (oC)

Figure 8. Enable Current vs. Junction Temperature

200

I

=10mA

OUT

150

=1.0µF, C

C

IN

Noise Measurement Filter: DIN Noise

OUT

=2.2µF

2.0

1.9

1.8

1.7

1.6

1.5

1.4

1.3

1.2

1.1

Enable Voltage (V)

1.0

0.9

0.8

0.7

0.6

-60 -40 -20 0 20 40 60 80 100 120 140

AP2202-2.8

VEN=on

VEN=off

CIN=1.0µF,C

VIN=3.8V,I

OUT

OUT

=5mA

=2.2µF

Junction Temperature (oC)

Figure 9. Enable Voltage vs. Junction Temperature

10

1

AP2202-2.8

=1.0µF, C

C

IN

V

=4.5V, I

IN

OUT

OUT

=2.2µF, C

=10mA

BYP

=100pF

V/ Hz

µ

100

0.1

Noise (µVrms)

0.01

50

0

10 100 1000 10000

Bypass Capacitor (pF)

Figure 10. Noise vs. Bypass Capacitor

Output Noise ( )

0.001
10 100 1k 10k 100k 1M 10M

Frequency (Hz)

Figure 11. Output Noise

vs. Frequency

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

19

Data Sheet

150mA RF ULDO REGULATOR AP2202

Typical Performance Characteristics (Continued)

150

100

50

(mA)

OUT

I

0

50

(mV)

0

OUT

∆V

-50

-100
0 1020304050 60708090100

Time (µs)

AP2202-2.8

Figure 12. Load Transient

(Conditions: VIN=3.8V, C

I

=5mA to 50mA, CIN=1.0

OUT

4

2

0

(V)

EN

V

3

2

1

0

(V)

OUT

V

-1

-2
0 100 200 300 400 500 600 700 800 900 1000

Time (µs)

=100pF, VEN=2V,

BYP

µF,

C

OUT

AP2202-2.8

=2.2µF)

5.8

4.8

3.8

(v)

IN

V

2.8

20

0

(mV)

-20

OUT

-40

∆V

-60
0 20 40 60 80 100 120 140 160 180 200

Time (µs)

AP2202-2.8

Figure 13. Line Transient

(Conditions: V

100

90

80

70

60

50

PSRR (dB)

40

30

20

10

0

10 100 1k 10k 100k 1M

=3.8V to 4.8V, VEN=2V, I

IN

C

BYP

=100pF, C

Frequency (Hz)

OUT

AP2202-2.8
VIN=3.8V, V

I

OUT

=10µF)

=10mA, C

RIPPLE

OUT

OUT

=1V

PP

=2.2µF

=100µA

Figure 14. VEN(on) vs. V

OUT

(Conditions: VEN=0V to 2V, VIN=3.8V, I

C

=open,

CIN=1.0

µF,

BYP

C

OUT

OUT

=30mA,

=2.2µF)

Figure 15. PSRR vs. Frequency

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

20

Data Sheet

150mA RF ULDO REGULATOR AP2202

Typical Performance Characteristics (Continued)

0.8

0.7

0.6

0.5

0.4

0.3

Power Dissipation (W)

0.2

0.1

0.0
25 50 75 100 125 150

SOT-23-5 Package
No Heatsink

Ambient Temperature (oC)

Figure 16. Power Dissipation vs. Ambient Temperature

100

Figure 17. Power Dissipation vs. Ambient Temperature

0.8

0.7

0.6

0.5

0.4

0.3

Power Dissipation (W)

0.2

0.1

0.0
25 50 75 100 125 150

SOT-89 Package
No Heatsink

Ambient Temperature (oC)

100

C

=1.0µF

10

1

ESR (Ω)

0.1

0.01
0 25 50 75 100 125 150

Stable Area

Output Current (mA)

OUT

No Bypass Capacitor

Figure 18. ESR vs. Output Current

10

1

ESR (Ω)

0.1

0.01

0 25 50 75 100 125 150

Stable Area

Output Current (mA)

Figure 19. ESR vs. Output Current

C

=2.2µF

OUT

No Bypass Capacitor

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

21

Data Sheet

150mA RF ULDO REGULATOR AP2202

Typical Performance Characteristics (Continued)

100

C

=4.7µF

10

OUT

No Bypass Capacitor

1

ESR (Ω)

0.1

0.01
0 25 50 75 100 125 150

Stable Area

Output Current (mA)

Figure 20. ESR vs. Output Current

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

22

Data Sheet

150mA RF ULDO REGULATOR AP2202

Typical Application

V

IN

V

IN

C

1.0 µ F

C

IN

IN

VIN=3.8V

AP2202-2.8

V

IN

EN

GND

AP2202-ADJ

V

IN

V

OUT

BYP

C

100pF

V

OUT

ADJEN GND

C

BYP

optional

BYP

=2.8V

V

OUT

C

OUT

2.2µF1.0µF

R1

R2

V

=1.25* (1+R2/R1)

OUT

V

OUT

C

2.2 µ F

OUT

V

OUT

Figure 21. Typical Application of AP2202 (Note 7)

Note 7: Dropout voltage is 165mV when TA=25oC. In order to obtain a normal output voltage, V

+0.165V is the minimum

OUT

input voltage which will result a low PSRR, imposing a bad influence on system. Therefore, the recommended input voltage

+0.5V to 13.2V. For AP2202-2.8 version, its input voltage can be set from 3.3V(V

is V

OUT

Adj version, any value from V

voltage. For example, if 3.0V output voltage is required, R1 and R2 can be set to 10kΩ and 14kΩ respectively. For Adj ver-

+0.5V to 13.2V is available. R1 and R2 must be correctly selected when setting the output

OUT

+0.5V) to 13.2V. For that of

OUT

sion, we recommend 2.3V as minimum output voltage.

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

23

Data Sheet

150mA RF ULDO REGULATOR AP2202

Application Information

Input Capacitor

A 1

µF minimum capacitor is recommended to be

placed between V

and GND.

IN

Output Capacitor

It is required to prevent oscillation. 1.0
is recommended when C

mum is recommended when C

is unused. 2.2µF mini-

BYP

BYP

µF minimum

is 100pF. The out-

put capacitor may be increased to improve transient
response.

Noise Bypass Capacitor

Bypass capacitor is connected to the internal voltage
reference. A 100pF capacitor connected from BYP to
GND make this reference quiet, resulting in a
significant reduction in output noise, but the ESR
stable area will be narrowed.

The start-up speed of the AP2202 is inversely
proportional to the value of reference bypass
capacitor. In some cases, if output noise is not a
major concern and rapid turn-on is necessary, omit
C

and leave BYP open.

BYP

Power Dissipation

Thermal shutdown may take place if exceeding the
maximum power dissipation in application. Under all
possible operating conditions, the junction tempera­ture must be within the range specified under abso­lute maximum ratings to avoid thermal shutdown.

To determine if the power dissipated in the regulator
reaches the maximum power dissipation (see figure
16,17), using:
T

= PD*θJA + T

J

PD=(VIN-V

Where: T

ings for the junction temperature; V

A

)*I

OUT

J≤TJ(max)

OUT+VIN*IGND

, T

is absolute maximum rat-

J(max)

IN*IGND

can be

ignored due to its small value.

T

is 150

J(max)

age and 165

o

C, θ

JA

o

C/W for SOT-89 package, no heatsink is

is 200

o

C/W for SOT-23-5 pack-

required since the package alone will dissipate
enough heat to satisfy these requirements unless the
calculated value for power dissipation exceeds the
limit.

Example: For 2.8V version packaged in SOT-23-5,

I

=150mA, TA=50oC, V

OUT

o

(150

C-50oC)/(0.15A*200oC/W)+2.8V=6.133V

IN(Max)

is:

Therefore, for good performance, please make sure
that input voltage is less than 6.133V without heat-

sink when T

=50oC.

A

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

24

Data Sheet

150mA RF ULDO REGULATOR AP2202

Mechanical Dimensions

SOT-23-5 Unit: mm(inch)

2.820(0.111)

3.020(0.119)

)

)

4

2

2

1

0

0

.

.

0

)

)

9

)

)

4

6

0

1

1

1

.

.

0

0

(

(

0

0

5

5

6

9

.

.

2

2

7

5

6

0

0

.

.

0

0

(

(

0

0

0

0

5

7

.

.

1

1

0.200(0.008)

0

(

(

0

0

0

0

6

3

.

.

0

0

0.100(0.004)

0.200(0.008)

0.950(0.037)

P

Y

T

)
7
5
0

.

X

0

A

(
0

M

5
4

.
1

1.800(0.071)

2.000(0.079)

0.300(0.012)

0.400(0.016)

0

0

0

0

0

9

.

.

1

0

0

3

0

0

7

.

0

R

0

(

0

0

0

.

0

(

0

5

1

.

5

3

0

(

0

.

)

1

5

0

.

0

(

)

8

2

0

.

0

(

F

E

0°

8°

)

0

0

0

.

)

6

0

0

.

)

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

25

Data Sheet

150mA RF ULDO REGULATOR AP2202

Mechanical Dimensions (Continued)

SOT-89 Unit: mm(inch)

4.400(0.173)

1.550(0.061)REF

4.600(0.181)

1.030(0.041)REF

45

1.400(0.055)

1.600(0.063)

3.950(0.156)

4.250(0.167)

0.900(0.035)

1.100(0.043)

R0.150(0.006)

0.320(0.013)

0.520(0.020)

3.000(0.118)
TYP

2.300(0.091)

2.600(0.102)

0.320(0.013)

0.520(0.020)

0.480(0.019)

3

2.210(0.087)REF

10

3

1.500(0.059)

1.800(0.071)

2.060(0.081)REF

10

0.350(0.014)

0.450(0.018)

0.320(0.013)REF

1.620(0.064)REF

Jul. 2011 Rev. 2. 2 BCD Semiconductor Manufacturing Limited

26

BCD Semiconductor Manufacturing Limited

IMPORTANT NOTICE

IMPORTANT NOTICE

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-

cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any

cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any

particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use

particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use

of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or

of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or

other rights nor the rights of others.

other rights nor the rights of others.

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BCD Semiconductor Manufactur ing Limited

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