Diodes AP2101, AP2111 User Manual

T

AP2101/AP2111

2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH

Description

The AP2101 and AP2111 are integrated high-side power switches

optimized for Universal Serial Bus (USB) and other hot-swap

applications. The family of devices complies with USB 2.0 and

available with both polarities of Enable input. They offer current and

thermal limiting and short circuit protection as well as controlled rise

time, under-voltage lockout and auto-discharge functionalities. A

7ms deglitch capability on the open-drain Flag output prevents false

over-current reporting and does not require any external components.

All devices are available in SO-8 and MSOP-8EP packages.

Features

• Single USB port power switches with auto-discharge

• Short-circuit current and thermal protection

• 2.45A accurate current limiting

• Fast transient response time: 5s

• 90m

• Reverse Current Blocking

• Input voltage range: 2.7V – 5.5V

• 0.6ms typical rise time

• Very low shutdown current: 1A (max)

• Fault report (FLG) with blanking time (7ms typ)

• ESD protection: 4kV HBM, 300V MM

• Active low (AP2101) or active high (AP2111) enable

• Ambient temperature range: -35°C to 85°C

• SO-8 and MSOP-8EP (Exposed Pad): Available in “Green”

• UL Recognized, File Number E322375

• IEC60950-1 CB Scheme Certified

Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.

2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.

 on-resistance

Molding Compound (No Br, Sb)

 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

 Halogen and Antimony Free. “Green” Device (Note 3)

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

Pin Assignments

( Top View )

GND

IN

EN

GND

IN

EN

1

2

3

4

SO-8

( Top View )

1

2

3

4

MSOP-8EP

8

NC

7

OUT

6

OU

5

FLG

NC

8

7

OUT

6

OUT

5

FLG

Applications

• Consumer electronics – LCD TV & Monitor, Game Machines

• Communications – Set-Top-Box, GPS, Smartphone

• Computing – Laptop, Desktop, Servers, Printers, Docking Station,

HUB

Typical Applications Circuit

AP2111 Enable Active High

Power Supply

2.7V to 5.5V

10k

OFF

10uF

ON

0.1uF

IN

FLG

EN

GND

OUT

0.1uF 120uF

Load

AP2101/AP2111

Document number: DS32015 Rev. 3 - 2

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AP2101/AP2111

Available Options

Part Number Channel

Enable Pin

(EN)

AP2101 1 Active Low 2.45A 2.0A

AP2111 1 Active High 2.45A 2.0A

Current Limit

(Typical)

Recommended Maximum Continuous Load Current

Pin Descriptions

Name

Pin Number

SO-8 MSOP-8EP

Functions

GND 1 1 Ground

IN

2, 3 2, 3 Voltage input pin (all IN pins must be tied together externally)

EN 4 4 Enable input, active low (AP2101) or active high (AP2111)

FLG 5 5 Over-current and over-temperature fault report; open-drain flag is active low when triggered

OUT

NC

6, 7 6, 7 Voltage output pin (all OUT pins must be tied together externally)

8 8 No internal connection; recommend tie to OUT pins

Exposed pad.

Exposed tab — Exposed tab

It should be connected to GND and thermal mass for enhanced thermal impedance. It should not be used as electrical ground conduction path.

Functional Block Diagram

IN

UVLO

EN

Absolute Maximum Ratings (@T

Current

Sense

Driver

Thermal

Sense

= +25°C, unless otherwise specified.)

A

Current

Limit

Discharge

Control

Deglitch

OUT

FLG

GND

Symbol Parameter Ratings Units

ESD HBM Human Body Model ESD Protection 4 kV

ESD MM Machine Model ESD Protection 300 V

VIN

V

OUT

V

EN , VFLG

T

I

LOAD

J(MAX)

TST

Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;

Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices

Note: 4. UL Recognized Rating from -30°C to 70°C (Diodes qualified

functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time.

Input Voltage 6.5 V

Output Voltage

VIN +0.3

V

Enable Voltage 6.5 V

Maximum Continuous Load Current Internal Limited A

Maximum Junction Temperature 150 °C

Storage Temperature Range (Note 4) -65 to +150 °C

T

from -65°C to 150°C)

ST

AP2101/AP2111

Document number: DS32015 Rev. 3 - 2

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AP2101/AP2111

Recommended Operating Conditions (@T

= +25°C, unless otherwise specified.)

A

Symbol Parameter Min Max Units

V

I

OUT

T

VIL

VIH

IN

A

Input voltage 2.7 5.5 V

Output Current 0 2.0 A

Operating Ambient Temperature -35 85

°C

EN Input Logic Low Voltage 0 0.8 V

EN Input Logic High Voltage 2

VIN

V

Electrical Characteristics (@T

= +25°C, VIN = +5.0V, unless otherwise specified.)

A

Symbol Parameter Test Conditions (Note 5) Min Typ Max Unit

V

UVLO

I

SHDN

I

LEAK

I

REV

R

DS(ON)

I

LIMIT

I

TRIG

I

SHORT

T

SHORT

V

I

SINK

T

D(ON)

T

D(OFF)

R

T

BLANK

R

T

SHDN

T

JA

Notes: 5. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.

6. The discharge function is active when the device is disabled (when enable is de-asserted). The discharge function offers a resistive discharge path for the external storage capacitor. This is suitable only to discharge filter capacitors for limited time and cannot dissipate steady state currents greater than 8mA.

7. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.

8. Test condition for MSOP-8EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane.

Input UVLO

Input Shutdown Current

Input Quiescent Current

I

Q

R

= 1k

LOAD

Disabled, I

Enabled, I

OUT

= 0

Input Leakage Current Disabled, OUT grounded 1 µA

Reverse Leakage Current

Switch On-Resistance

Over-Load Current Limit

Current Limiting Trigger Threshold

Short-Circuit Current Limit

Short-Circuit Response Time

EN Input Logic Low Voltage

IL

EN Input Logic High Voltage

IH

EN Input leakage

Output Turn-On Delay Time

Output Turn-On Rise Time

TR

Output Turn-Off Delay Time

Output Turn-Off Fall Time

TF

FLG Output FET On-Resistance

FLG

FLG Blanking Time

Discharge Resistance (Note 6)

DIS

Thermal Shutdown Threshold

Thermal Shutdown Hysteresis 25

HYS

Thermal Resistance Junction-toAmbient

Disabled, V

= 5V, I

V

IN

OUT

= 0V, V

= 1.5A

OUT

= 5V, I

T

A

at VIN

REV

= +25°C

MSOP8-EP 90 115

SO-8 95 115

-40°C  TA  +85°C

= 25°C

T

VIN = 3.3V, I

V

= 5V, V

IN

= 1.5A

OUT

= 4.5V, CL=120µF

OUT

A

-40°C  T

 +85°C

A

Output Current Slew rate (<100A/s) , CL = 100µF

Enabled into short circuit, CL = 100µF

V

= 0V to I

OUT

V

= 2.7V to 5.5V

IN

V

= 2.7V to 5.5V

IN

V

= 5V

EN

CL = 1µF, R

I

=10mA, CL=100µF

FLG

C

= 10µF, CL = 100µF

IN

VIN = 5V, disabled, I

Enabled, R

LOAD

OUT

= 1k

= I

(short applied to output)

LIMIT

= 10

= 1mA

OUT

SO-8 (Note 7) 110

MSOP-8EP (Note 8) 60

1.6 1.9 2.5 V

0.5 1 µA

45 70 µA

0.05 µA

140

m

115 140

170

2.1 2.45 2.8 A

2.5 A

5 µs

0.8 V

2 V

1 µA

50 µs

0.6 1.5 ms

4 µs

0.03 0.1 ms

20 40 

4 7 15 ms

290 

140

°C

°C/W

AP2101/AP2111

Document number: DS32015 Rev. 3 - 2

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Typical Performance Characteristics

AP2101/AP2111

Ven 5V/div

Vout 2V/div

V

EN

V

OUT

50%

T

D(ON)

T

10%

50%

T

R

90%

D(OFF)

90%

10%

T

F

V

EN

50%

T

D(ON)

V

OUT

10%

50%

T

R

90%

D(OFF)

90%

10%

T

F

Figure 1. Voltage Waveforms: AP2101 (left), AP2111 (right)

All Enable Plots are for AP2111 Active High

Turn-On Delay and Rise Time

CL = 1µF

TA = +25°C

RL = 5

Ven 5V/div

Vout 2V/div

Turn-Off Delay and Fall Time

CL = 1µF

TA = 25°C

RL = 5

400µs/div

Ven 5V/div

Vout 2V/div

Turn-On Delay and Rise Time

400µs/div

CL = 100µF

TA = +25°C

RL = 5

Ven 5V/div

Vout 2V/div

Turn-Off Delay and Fall Time

CL = 100µF

TA = +25°C

RL = 5

400µs/div

AP2101/AP2111

Document number: DS32015 Rev. 3 - 2

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Typical Performance Characteristics (cont.)

Short Circuit Current,

Device Enabled Into Short

AP2101/AP2111

Inrush Current

Ven 5V/div

Iout 500mA/div

Vflag 5V/div

Iout 1A/div

V

IN

TA = +25°C

CL = 100µF

500us/div

0.6 Ω Load Connected to Enabled Device

V

IN

TA = +25°C

CL = 100µF

= 5V

Ven 5V/div

CL=100µF

Iout 500mA/div

CL=220µF

CL=470µF

1ms/div

Short Circuit with Blanking Time and Recovery

Vout 5V/div

Vflag 5V/div

Iout 2A/div

V

= 5V

IN

= +25°C

T

A

R

= 2.5

L

V

= 5V

IN

TA = +25°C

CL = 100µF

Power On

Vflag 5V/div

Iout 1A/div

Vin 5V/div

Vout 5V/div

AP2101/AP2111

Document number: DS32015 Rev. 3 - 2

2ms/div

50ms/div

Power Off

TA = +25°C

CL = 100µF

RL = 2.5

1ms/div

TA = +25°C

CL = 100µF

RL = 2.5

Vflag 5V/div

Iout 1A/div

Vin 5V/div

Vout 5V/div

10ms/div

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