The AP1662 is an active power factor control IC
which is designed mainly for use as a pre-converter
in electronic ballast, AC-DC adapter and off-line
SMPS applications.
.
The IC includes an internal start-up timer for
stand-alone applications, a one-quadrant multiplier to
realize near unity power factor and a zero current
detector to ensure DCM boundary conduction
operation.
The totem pole output stage is capable of driving
power MOSFET with 600mA source current and
800mA sink current.
Designed with advanced BiCMOS process, the
AP1662 features low start-up current, low operation
current and low power dissipation. The AP1662 also
has rich protection features including over-voltage
protection, input under-voltage lockout with
hysteresis and multiplier output clamp to limit
maximum peak current.
The AP1662 meets IEC61000-3-2 standard even at
one-quadrant load and THD lower than 10% at
high-end line voltage and full load.
The IC is available in SOIC-8 and DIP-8 packages.
Features
Comply with IEC61000-3-2 Standard
•
• Proprietary Design for Minimum THD
• Zero Current Detection Control for DCM
Boundary Conduction Mode
• Adjustable Output Voltage with Precise
Over-voltage Protection
• Low Start-up Current with 40µA Typical Value
• Low Quiescent Current with 2.5mA Typical
Va lu e
• 1% Precision Internal Reference Voltage @
T
=25°C
J
• Internal Start-up Timer
• Disable Function for Reduced Current
Consumption
• Totem Pole Output with 600mA Source and
800mA Sink Current Capability
BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant.
Products with “G1” suffix are available in green packages.
Input/Output of Error Amplifier,
Input of Multiplier
Current Sense Input VCS -0.3 to 7 V
V
INV
V
, V
MULT
COMP
,
-0.3 to 7 V
Zero Current Detector Input I
Power Dissipation and Thermal
characteristics @ T
=50°C
A
Thermal Resistance
(Junction to Ambient)
P
R
ZCD
TOT
θJA
mA
Sink 10
DIP-8 1
W
SOIC-8 0.65
DIP-8 100
ºC/W
SOIC-8 150
Operating Junction Temperature TJ -40 to 150 ºC
Source -50
Storage Temperature Range T
Lead Temperature (Soldering, 10
Seconds)
ESD (Human Body Model) V
ESD (Machine Model) V
-65 to 150 ºC
STG
260 ºC
T
LEAD
ESD(HBM)
ESD(MM)
3000 V
200 V
Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only, and functional operation of the device at these or any other conditions
beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute
Maximum Ratings” for extended periods may affect device reliability.