Diodes AP1662 User Manual

Data Sheet
HIGH PERFORMANCE POWER FACTOR CORRECTOR AP1662
General Description
The AP1662 is an active power factor control IC which is designed mainly for use as a pre-converter in electronic ballast, AC-DC adapter and off-line SMPS applications. . The IC includes an internal start-up timer for stand-alone applications, a one-quadrant multiplier to realize near unity power factor and a zero current detector to ensure DCM boundary conduction operation.
The totem pole output stage is capable of driving power MOSFET with 600mA source current and 800mA sink current.
Designed with advanced BiCMOS process, the AP1662 features low start-up current, low operation current and low power dissipation. The AP1662 also has rich protection features including over-voltage protection, input under-voltage lockout with hysteresis and multiplier output clamp to limit maximum peak current.
The AP1662 meets IEC61000-3-2 standard even at one-quadrant load and THD lower than 10% at high-end line voltage and full load.
The IC is available in SOIC-8 and DIP-8 packages.
Features
Comply with IEC61000-3-2 Standard
Proprietary Design for Minimum THD
• Zero Current Detection Control for DCM Boundary Conduction Mode
• Adjustable Output Voltage with Precise Over-voltage Protection
Low Start-up Current with 40µA Typical Value
• Low Quiescent Current with 2.5mA Typical Va lu e
• 1% Precision Internal Reference Voltage @ T
=25°C
J
• Internal Start-up Timer
• Disable Function for Reduced Current Consumption
• Totem Pole Output with 600mA Source and 800mA Sink Current Capability
Under-voltage Lockout with 2.5V Hysteresis
Applications
Electronic Ballast
• AC-DC Adapter
• Off-line SMPS
Single Stage PFC LED Driver
SOIC-8 DIP-8
Figure 1. Package Types of AP1662
Jul. 2012 Rev. 1. 3 BCD Semiconductor Manufacturing Limited
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Data Sheet
HIGH PERFORMANCE POWER FACTOR CORRECTOR AP1662
Pin Configuration
M Package
SOIC-8
INV VCC
1
8
COMP GD
2
7
MULT GND
3
6
CS ZCD
4
5
P Package
DIP-8
INV VCC
1
8
COMP GD
2
7
MULT GND
3
6
CS ZCD
4
5
Figure 2. Pin Configuration of AP1662 (Top View)
Jul. 2012 Rev. 1. 3 BCD Semiconductor Manufacturing Limited
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Data Sheet
HIGH PERFORMANCE POWER FACTOR CORRECTOR AP1662
Pin Description
Pin Number Pin Name Function
1 INV Inverting input of the error amplifier
2 COMP Output of the error amplifier
3 MULT Input of the multiplier
4 CS Input of the current control loop comparator
5 ZCD
6 GND
7 GD Gate driver output
Zero current detection input. If it is connected to GND, the device is disabled Ground. Current return for gate driver and control circuits of the IC
8 VCC Supply voltage of gate driver and control circuits of the IC
Functional Block Diagram
Figure 3. Functional Block Diagram of AP1662
Jul. 2012 Rev. 1. 3 BCD Semiconductor Manufacturing Limited
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Data Sheet
HIGH PERFORMANCE POWER FACTOR CORRECTOR AP1662
Ordering Information
AP1662 -
Circuit Type E1: Lead Free
Package
SOIC-8
G1: Green
Package Blank: Tube M: SOIC-8
P: DIP-8
Temperature
Range
-40 to 105°C
TR: Tape & Reel
Part Number Marking ID
Lead Free Green Lead Free Green
AP1662M-E1 AP1662M-G1 1662M-E1 1662M-G1 Tube
AP1662MTR-E1 AP1662MTR-G1 1662M-E1 1662M-G1 Tape & Reel
Packing
Type
DIP-8
-40 to 105°C
AP1662P-E1 AP1662P-G1 AP1662P-E1 AP1662P-G1 Tube
BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with “G1” suffix are available in green packages.
Jul. 2012 Rev. 1. 3 BCD Semiconductor Manufacturing Limited
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Data Sheet
HIGH PERFORMANCE POWER FACTOR CORRECTOR AP1662
Absolute Maximum Ratings (Note 1)
Parameter Symbol Value Unit
Power Supply Voltage VCC Self-limited V
Operating Supply Current ICC 30 mA
Input/Output of Error Amplifier, Input of Multiplier
Current Sense Input VCS -0.3 to 7 V
V
INV
V
, V
MULT
COMP
,
-0.3 to 7 V
Zero Current Detector Input I
Power Dissipation and Thermal characteristics @ T
=50°C
A
Thermal Resistance (Junction to Ambient)
P
R
ZCD
TOT
θJA
mA
Sink 10
DIP-8 1
W
SOIC-8 0.65
DIP-8 100
ºC/W
SOIC-8 150
Operating Junction Temperature TJ -40 to 150 ºC
Source -50
Storage Temperature Range T
Lead Temperature (Soldering, 10 Seconds)
ESD (Human Body Model) V
ESD (Machine Model) V
-65 to 150 ºC
STG
260 ºC
T
LEAD
ESD(HBM)
ESD(MM)
3000 V
200 V
Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability.
Jul. 2012 Rev. 1. 3 BCD Semiconductor Manufacturing Limited
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Data Sheet
HIGH PERFORMANCE POWER FACTOR CORRECTOR AP1662
Electrical Characteristics
V
=12V, TJ =-25°C to 125°C, CO=1nF, unless otherwise specified.
CC
Parameter Symbol Test Conditions Min Typ Max Unit Under Voltage Lockout Section
Turn-on Threshold V
Turn-off Threshold V
Hysteresis V
VCC Rising 11 12 13 V
CC-ON
VCC Falling 8.7 9.5 10.3 V
CC-OFF
2.2 2.5 2.8 V
CC-HYS
VCC Operating Range VCC After turn-on 10.3 22 V
Zener Voltage V
ICC=20mA 22 24 V
Z
Total Supply Current Section
Start-up Current I
START-UP
Operating Supply Current ICC
Quiescent Current IQ After turn on 2.5 3.75 mA
Quiescent Current IQ
VCC=11V before turn-on 40 70
Frequency=70kHz 3.5 5
In OVP condition
=2.7V
V
INV
150mV, VCC>V
V
ZCD
V
150mV, VCC<V
ZCD
CC-OFF
CC-OFF
1.4 2.2
2.2 mA
20 50 90
µA
mA
µA
Error Amplifier Section
=25ºC 2.465 2.5 2.535
T
Voltage Feedback Input Threshold
V
INV
J
10.3V<VCC<20V 2.44 2.56
V
Line Regulation VCC=10.3V to 20V 2 5 mV
Input Bias Current I
V
INV
=0 to 3V -0.1 -1
INV
µA
Voltage Gain GV Open Loop 60 80 dB
Gain Bandwidth GB 1 MHz
Output Voltage
Output Current
Upper Clamp Voltage Lower Clamp Voltage Source Current
Sink Current I
V
V
I
COMP-H
COMP-L
COMP-H
COMP-L
I
SOURCE
I
SINK
V
COMP
V
COMP
=0.5mA 5.15 5.55 5.85
V
=0.5mA 2.1 2.25 2.4
=4V, V
=2.4V -2 -4 -8
INV
mA
=4V, V
=2.6V 2.5 4.5
INV
Jul. 2012 Rev. 1. 3 BCD Semiconductor Manufacturing Limited
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