•Output voltage: 3.3V, 5V, 12V and adjustable output
version
• Adjustable version output vo l tag e range, 1.23V to
• 150Khz +
• Voltage mode non-synchronous PWM control
• Thermal-shutdown and current-limit protection
• ON/OFF shutdown control input
• Operating voltage can be up to 40V
• Output load current: 5A
• Low power standb y mode
• Built-in switching transistor on chip
• Lead Free packages: TO263-5L and TO220-5L(R)
• TO263-5L and TO220-5L(R): Available in “Green”
• Lead Free Finish/ RoHS Compliant (Note 1)
4%
37V+
Molding Compound (No Br, Sb)
15% fixed switching frequency
Applications
• Simple High-efficiency step-down regulator
• On-card switching regulators
• Positive to negative converter
Typical Application Circuit
(1) Fixed Type Circuit
General Description
The AP1501A series are monolithic ICs that are designed for a
step-down DC/DC converter, and possess the ability to drive a
5A load without additional transistor component. Due to reducing
the number of external component, the board space can be
saved easily. The external shutdown function can be controlled
by logic level and then come into standby mode. The internal
compensation makes feedback control have good line and load
regulation without external design. Regarding protected function,
thermal shutdown is to prevent over temperature operating from
damage, and current limit is against over current operating of the
output switch. The AP1501A series operates at a switching
frequency of 150Khz thus allowing smaller sized filter
components than what would be needed with lower frequency
switching regulators. Other features include a guaranteed
4% tolerance on output voltage under specified input voltage
+
and output load conditions, and +
The output version includes fixed 3.3V, 5V, 12V, and an
adjustable type. The packages are available in a standard 5-lead
TO263 and TO220 packages.
AP1501A-XXK5L-13 K5 TO263-5L NA NA 800/Tape & Reel -13
AP1501A-XXK5G-U K5 TO263-5L 50 -U NA NA
AP1501A-XXK5G-13 K5 TO263-5L NA NA 800/Tape & Reel -13
AP1501A-XXT5L-U T5 TO220-5L 50 -U NA NA
Lead-free
AP1501A-XXT5G-U T5 TO220-5L 50 -U NA NA
AP1501A-XXT5RL-U T5R TO220-5L(R) 50 -U NA NA
Lead-free
AP1501A-XXT5RG-U T5R TO220-5L(R) 50 -U NA NA
Notes: 1. EU Directive 2002/95/ EC (RoHS). All applicable RoHS exemptions applied. Please visit our website at
http://www.diodes.com/datasheets/ap02001.pdf.
http://www.diodes.com/products/lead_free.html
2. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
Electrical Characteristics ( All Output Voltage Versions )
Unless otherwise specified, V
Specifications with boldface type are for full operating temperature range, the other type are for T
Symbol Parameter Conditions Min Typ. Max Unit
IFB Feedback Bias Current
F
Oscillator Frequency
OSC
V
Saturation Voltage
SAT
DC
Max. Duty Cycle(ON) V
Min. Duty Cycle(OFF) V
ICL Current Limit
Output = 0V
IL
Output = -1V V
IQ Quiescent Current V
I
STBY
VIL
VIH High (regulator OFF) 2.0
Standby Quiescent
Current
ON/OFF Pin Logic Input
Threshold Voltage
= 12V for 3.3V, 5V, adjustable version and V
IN
= 1.3V
V
FB
(Adjustable version only)
I
= 5A
OUT
no outside circuit
= 0V force driver on
V
FB
= 0V force driver on 100
FB
= 12V force driver of f 0
FB
peak current
no outside circuit
V
= 0 force driver on
FB
Output
Leakage
Current
no outside circuit
V
= 12 force driver off (Note 3)
FB
= 40V 2 60 mA
IN
= 12 force driver off 5 10 mA
FB
ON/OFF pin = 5V
= 40V
V
IN
Low (regulator ON)
= 24V for the 12V version. I
IN
J
40
127 150 173
110 173
1.5
5.5 6.0
200 uA
150
= 25ºC.
LOAD
1.3
= 0.5A
60
100
Khz
1.6
1.7
6.5
7.5
250
300
0.6
nA
V
%
A
uA
V
ON/OFF Pin Logic
IH
Input Current
ON/OFF Pin Input
IL
Current
θ
θ
Notes: 3. Feedback pin removed from output and connected to 0V to force the output transistor switch ON. Feedback pin removed from output
and connected to 12V for the 3.3V, 5V, and the ADJ. version, and 15V for the 12V version, to force the output transistor switch OFF.
4. Test condition: Device mounted with copper area of approximately 3in
This is the positive input supply for the IC switching regulator. A suitable
input bypass capacitor must be present at this pin to minimize voltage
transients and to supply the switching currents needed by the regulator.
Ground
Circuit ground.
Output
Internal switch. The voltage at this pin switches between (+V
and approximately – 0.5V, with a duty cycle of approximately
/ VIN. To minimize coupling to sensitive circuitry, the PC board
V
OUT
copper area connected to this pin should be kept a mini mum.
Feedback
Senses the regulated output voltage to complete the fee dback loop.
ON/OFF
Allows the switching regulator circuit to be shutdown using logic level
signals thus dropping the total input supply current to approximately
150uA. Pulling this pin below a threshold voltage of approximately
1.3V turns the regulator on, and pulling this pin above 1.3V (up to a
maximum of 40V) shuts the regulator down. If this shutdown feature is
not needed, the ON/OFF pin can be wired to the ground pin or it can be
left open, in either case the regulator will be in the ON condition.
Thermal Considerations
The AP1501A is available in two packages, a 5-pin surface mount
TO-263 and TO-220.
The TO-220 package needs a heat sink under mo st conditions. The size
of the heat sink depends on the input voltage, the output voltage, the
load current and the ambient temperature. The AP1501A junction
temperature rises above ambient temperature for a 5A load a nd different
input and output voltages. The data for these curves was taken with the
AP1501A (TO-220 package) operating as a buck switching regulator in
an ambient temperature of 25
numbers are all approximate and there are many factors that can affect
these temperatures. Higher ambient temperatures require more heat
sinking.
The TO-263 surface mount package tab is designed to be soldered to
the copper on a printed circuit board. The copper and the board are the
heat sink for this package and the other heat producing components,
such as the catch diode and inductor. The PC board copper area that
the package is soldered to should be at least 0.8 in
have 2 or more square inches of 2 oz. Additional copper area improves
the thermal characteristics, but with copper areas greater than
approximately 6 in
realized. If further thermal improvements are needed, double sided,
multilayer PC boards with large copper areas and/or airflow are
recommended.
2
, only small improvements in heat dissipation are
o
C (still air). These temperature rise
2
, and ideally should
IN
– V
SAT
)
The AP1501A (TO-263 package) junction temperature rise above
ambient temperature with a 2A load for various input and output voltages.
This data was taken with the circuit operating as a buck switching
regulator with all components mounted on a PC board to simulate the
junction temperature under actual operating conditions. This curve can
be used for a quick c heck for the a pproximate j unction temp erature for
various conditions, but be aware that there are many factors that can
affect the junction temperature. When load currents higher than 3A are
used, double sided or multilayer PC boards with large copper areas
and/or airflow might be needed, especially for high ambient te mperatures
and high output voltages.
For the best thermal performance, wide copper traces and generous
amounts of printed circuit board copper should be used in the board
layout. (Once exception to this is the output (switch) pin, w hich should not
have large areas of copper.) Large areas of copper provide the best
transfer of heat (lower thermal resistance) to the surrounding air, and
moving air lowers the thermal resistance even furthe r.
Package thermal resistance and junction temperature rise numbers are
all approximate, and there are many factors that will affect these
numbers. Some of these factors include board size, shape, thickness,
position, location, and even board temperatu re. Other factors are, trace
width, total printed circuit copper area, copper thickness, single or
double-sided, multilayer board and the amount of solder on the board.
The effectiveness of the PC board to dissipate heat al so depends on the
size, quantity and spacing of other components on the board, as well as
whether the surrounding air is still or moving.
Furthermore, some of these components such as the catch diode will
add heat to the PC board and the heat can vary as the input voltage
changes. For the inductor, depending on the physical size, type of core
material and the DC resistance, it could either act as a heat sink taking
heat away from the board, or it could add heat to the board.
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