Halogen and Antimony Free. “Green” Device (Note 3)
Pin Assignments
SET
GND
GND
CTRL
Applications
MR16 lamps
General illumination lamps
12V powered LED Lamps
24V powered LED Lamps
(Top View)
V
N/C
SW
SW
MSOP-8E
HIGH EFFICIENCY 36V 1.3A PWM DIMMABLE BUCK LED DRIVER
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl)
and <1000ppm antimony compounds.
SET 1 Set Nominal Output Current Pin. Configure the output current of the device.
GND 2, 3 GND Pins
CTRL 4
SW 5, 6 Switch Pin. Connect inductor/freewheeling diode here, minimizing track length at this pin to reduce EMI.
N/C 7 no connection
V
IN
EP EP
Pin
Number
8
NEW PRODUCT
Functional Block Diagram
Function
Dimming and On/Off Control Input.
Leave floating for normal operation.
(V
= V
CTRL
Drive to voltage below 0.4V to turn off output current
A PWM signal ( 2.5V) allows the output current to be adjusted below the level set by the resistor
connected to SET input pin.
Input Supply Pin. Must be locally decoupled to GND with > 2.2µF X7R ceramic capacitor – see
applications section for more information.
Exposed pad/TAB connects to GND and thermal mass for enhanced thermal impedance. Should not be
used as electrical ground conduction path.
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
NEW PRODUCT
Recommended Operating Conditions
Continuous VIN Pin Voltage Relative to GND
SW Voltage Relative to GND -0.3 to +40 V
CTRL Pin Input Voltage -0.3 to +6 V
DC or RMS Switch Current MSOP-8EP 1.6 A
Peak Switch Current (<10%) 2.5 A
Junction Temperature +150 °C
Lead Temperature Soldering +300 °C
Storage Temperature Range -65 to +150 °C
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices.
-0.3 to +40 V
L8807B
Symbol Parameter Min Max Unit
V
IN
V
CTRLH
V
CTRLL
f
SW
I
SW
T
J
Electrical Characteristics (V
Symbol Parameter Conditions Min Typ Max Unit
V
INSU
V
INSH
IQ
IS
VTH
V
TH-H
I
SET
R
CTRL
V
REF
R
DS(ON)
tR
tF
T
OTP
T
OTP-Hyst
I
SW_Leakage
JA
JC
Notes: 4. AL8807B does not have a low power standby mode but current consumption is reduced when output switch is inhibited: V
tested with V
5. Refer to figure 39 for the device derating curve.
6. Test condition for MSOP-8EP: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and
thermal vias to bottom layer with maximum area ground plane. For better thermal performance, larger copper pad for heat-sink is needed.
7. Dominant conduction path is via exposed pad.
Operating Input Voltage Relative to GND 6.0 36 V
Voltage High for PWM Dimming Relative to GND 2.5 5.5 V
Voltage Low for PWM Dimming Relative to GND 0 0.4 V
Maximum Switching Frequency — 1 MHz
Continuous Switch Current MSOP-8EP — 1.3 A
Junction Temperature Range -40 +125 °C
= 12V, @TA = +25°C, unless otherwise specified.)
IN
Internal Regulator Start Up Threshold
Internal Regulator Hysteresis Threshold
Quiescent Current Output not switching (Note 4) —— 350 µA
Input Supply Current CTRL pin floating f = 250kHz —1.8 5 mA
Set Current Threshold Voltage
Set Threshold Hysteresis
SET Pin Input Current
CTRL Pin Input Resistance Referred to internal reference—50 —k