• Halogen and Antimony Free. “Green” Device (Note 3)
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Power Supply Input.
Connect a 0.1μF ceramic capacitor between V
device.
LED Current Setting Pin.
Connect a resistor from this pin to GND: I
May also be used to provide PWM dimming functionality.
Exposed Pad (bottom).
Used to improve thermal impedance of package.
It must be connected to GND directly underneath the package but not used as sole GND
potential terminal.
and GND as close as possible to the
CC
= 750/R
LED
SET
Absolute Maximum Ratings (@T
Symbol Parameters Ratings Unit
VCC
V
LED
V
R
RSET
I
LED
ESD HBM Human Body Model ESD Protection 1 kV
ESD CDM Charged Device Model ESD Protection 1.2 kV
TJ
TST
Note: 4.V
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when
handling and transporting these devices.
CC
AL5812
Document number: DS35616 Rev. 2 - 2
Supply Voltage Relative to GND Pin (Note 4) -0.3 to +66 V
LED Pin Voltage Relative to GND Pin (Note 4) -0.3 to +66 V
Notes: 5. Test condition for MSOP-8EP: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.
6. Test condition for U-DFN3030-6: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and
thermal vias to bottom layer with maximum area ground plane. For better thermal performance, larger copper pad for heat-sink is needed
7. Dominant conduction path via exposed pad.
Recommended Operating Conditions(@T
Symbol Parameter Min Max Unit
VCC
V
NEW PRODUCT
I
LED
LED
TA
Notes: 8. For improved accuracy LED current should be greater than 60mA.
9. Maximum LED current is also limited by ambient temperature and power dissipation such that junction temperature should be kept less than or equal
to +125°C.
Electrical Characteristics (@T
Supply Voltage Range Relative to GND Pin
LED Pin Output Voltage Range Relative to GND Pin
LED Pin Current (Notes 8 & 9)
Operating Ambient Temperature Range
= +25°C, VCC= 3.5V, V
A
θ
JA
= +25°C, TJ = +125°C
T
A
(Note 7)
= +25°C, unless otherwise specified.)
A
P
DIS
(Note 7)
3.5 60
1 60
10 150 mA
-40 +125 °C
=1V (Note 10), R
LED
= 7.5kΩ unless otherwise specified.)
SET
V
L5812
Symbol Parameter Conditions Min Typ Max Unit
V
R
RSET
I
I
REG
LED
LINE
LED
LED Current Line Regulation
Voltage
SET
Current Accuracy
V
UVLO Under Voltage Lockout
ICC
I
LEAK
T
SHDN
T
HYS
Note: 10. All voltages unless otherwise stated are measured with respect to GND pin.