• Halogen and Antimony Free. “Green” Device (Note 3)
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen and Antimony free, "Green" and Lead-Free.
3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl)
and <1000ppm antimony compounds.
Supply Input.
Connect a 0.1μF ceramic capacitor between V
LED Current Setting Pin.
Connect a resistor from this pin to GND:
I
May also be used to provide PWM dimming functionality
Exposed Pad (bottom).
Used to improve thermal impedance of package.
It must be connected to GND directly underneath the package.
LED
= 750/R
SET
and GND as close as possible to the device.
CC
L5811
Absolute Maximum Ratings (@T
Symbol Parameters Ratings Unit
VCC
V
LED
V
R
RSET
I
LED
ESD HBM Human Body Model ESD Protection 1 kV
ESD CDM Charged Device Model ESD protection 1.2 kV
TJ
TST
Notes: 4. VCC pin can be greater or smaller than V
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when
handling and transporting these devices
AL5811
Document number: DS35255 Rev. 1 - 2
Supply Voltage Relative to GND Pin (Note 4) -0.3 to +66 V
LED Voltage Relative to GND Pin (Note 4) -0.3 to +66 V
Notes: 5. Dominant conduction path via exposed pad.
6. Test condition for MSOP-8EP: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.
7. Test condition for U-DFN3030-6: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and
thermal vias to bottom layer with maximum area ground plane. For better thermal performance, larger copper pad for heat-sink is needed
Recommended Operating Conditions(@T
= +25°C, unless otherwise specified.)
A
NEW PRODUCT
Symbol Parameter Min Max Unit
VCC
V
LED
I
LED
TA
Note: 8. Maximum LED current is also limited by ambient temperature and power dissipation such that junction temperature should
be kept less than or equal 125°C.
Supply Voltage Range Relative to GND Pin 3.5 60
OUT Voltage Range Relative to GND Pin 1.0 60
V
LED Pin Current (Note 8) 10 75 mA
Operating Ambient Temperature Range -40 +125 °C
Electrical Characteristics (@T
= +25°C, VCC = 3.5V, V
A
= 1.0 (Note 9), R
LED
= 15kΩ, unless otherwise specified.)
SET
Symbol Parameter Conditions Min Typ Max Unit
V
R
RSET
I
I
LED
REG
LINE
ICC
I
LEAK
T
SHDN
T
HYS
Note: 9. All voltages unless otherwise stated are measured with respect to GND pin.
LED current dimming can be achieved by driving the R
(Figure 5). The R
pin current is then effectively switched on and off causing the LED current to turn on and off.
SET
NEW PRODUCT
pin via the current setting resistor (R
SET
80
70
60
50
40
30
LED CURRENT (mA)
20
L5811
) and series MOSFET switch to ground
SET
10
Figure 5. PWM Dimming
0
0 102030405060708090100
DUTY CYCLE (%)
LED Current vs. Duty Cycle
Frequency = 100Hz; Duty Cycle = 0.1 % to 100%;
Figure 6. PWM Dimming Linearity
R = 10K; 2LEDs in Series
SET
Thermal Considerations
When designing linear LED drivers careful consideration must be given to:
1. the power dissipation within the LED driver
and
2. PCB layout/heat sinking.
A Linear LED driver has to be able to handle the large potential input voltage variations due to the supply voltage tolerance and also the variation in
LED forward voltage due to binning and temperature.
This can result in a large potential difference across the LED driver resulting in a larger than anticipated power dissipation.
For example in n 12V powered system with a 5% output voltage tolerance; the input voltage could typically vary from 12.6V down to 11.4V driving
3 LEDs with a voltage varying from 3V to 3.5V at 75mA. This means that the LED driver has to cope with a voltage drop across varying from
approximately 3.6V to 0.9V. This means that the power dissipation of the AL5811 could be as much as 270mW.
Figure 7 below shows how the AL5811’s power dissipation capability varies with package; these values will vary with PCB size and area of metal
associated with the ground plane used for heat sinking. By increasing the area on the top layer the thermal impedance of both packages could be
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NEW PRODUCT
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