DIGI ConnectCore 6 Plus User Manual

ConnectCore 6 Plus

Hardware Reference Manual

Revision history—90002278

Revision Date Description

C January 2019 Added backdrive caution.

D May 2019 Added NVCC-MIPI supply range, updated I/O supply

E October 2019 Added table listing pinout differences.

F May 2020 Added operating temperature statement.

G August 2020 Revised MCA pinout comments, added MCA functionality

Trademarks and copyright

Digi, Digi International, and the Digi logo are trademarks or registered trademarks in the United States and other countries worldwide. All other trademarks mentioned in this document are the property of their respective owners.

Disclaimers

Information in this document is subject to change without notice and does not represent a commitment on the part of Digi International. Digi provides this document “as is,” without warranty of any kind, expressed or implied, including, but not limited to, the implied warranties of fitness or merchantability for a particular purpose. Digi may make improvements and/or changes in this manual or in the product(s) and/or the program(s) described in this manual at any time.

operating range values.

note.

Warranty

To view product warranty information, go to the following website:

www.digi.com/howtobuy/terms

Customer support

Gather support information: Before contacting Digi technical support for help, gather the following

information:

Product name and model

Product serial number (s)

Firmware version

Operating system/browser (if applicable)

Logs (from time of reported issue)

Trace (if possible)

Description of issue

Steps to reproduce

ConnectCore 6 Plus Hardware Reference Manual

Contact Digi technical support: Digi offers multiple technical support plans and service packages.

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Include the document title and part number (ConnectCore 6 Plus Hardware Reference Manual, 90002278 G) in the subject line of your email.

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ConnectCore 6 Plus Hardware Reference Manual

Contents

About the ConnectCore 6 Plus

Features and functionality 7 Block diagram 8 Power supply architecture 9 Bootstrap 13 Wireless interfaces 14

WLAN IEEE 802.11a/b/g/n/ac 15 Modulation and data rates 15 RF channels 17 Receive sensitivity 19 Transmit power 19 Bluetooth 20

MCA hardware 20

Supported devices 20 MCA pinout 22 Shared I2C bus 31

Shared SPI bus 32 CryptoAuthentication device 33 Module pinout 34

Pinout differences between ConnectCore 6 and ConnectCore 6 Plus 85 Signal usage limitations 86

Specifications for the ConnectCore 6 Plus

Electrical characteristics 88

Voltage supplies 88 Power consumption 88

Power consumption use cases 88

Global power consumption 89 Mechanical specifications 89

Host PCB footprint 92 Environmental specifications 92

Linux - Android users 93

Assembly instructions

Moisture sensitivity and shelf life 95 Mounting 95 Coplanarity 95 Solder paste print 95

ConnectCore 6 Plus Hardware Reference Manual

Stencil 95 SMT pick and place 96 SMT process parameter reference 96 Reflow profile 96

Regulatory information and certifications

United States FCC 99

Labeling requirements 99

Maximum power and frequency specifications (FCC) 100

FCC notices 101

FCC-approved antennas 101

RF exposure 102 Canada (ISED) 102

Maximum power and frequency specifications 102

Labeling requirements 102

Transmitters with detachable antennas 103 Europe ETSI 103

Maximum power and frequency specifications (Europe ETSI) 104

OEM labeling requirements 106

CE labeling requirements 106

Declarations of Conformity 106

Approved antennas 106 Bluetooth SIG-qualified hardware and firmware 106

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus

The ConnectCore 6 Plus is an integrated platform solution with processor speed up to 1.2 GHz and pre-certified dual-band Wi-Fi (802.11a/b/g/n/ac) with Bluetooth 4.2 dual mode connectivity.

Cloud Connector integration, as part of the Digi Linux and Android software platform support, offers secure remote management and web services capabilities through Digi Remote Manager. Digi also offers custom Remote Manager hardware and wireless design services as well as end-to-end solutions for cloud integration and app development.

Features and functionality 7 Block diagram 8 Power supply architecture 9 Bootstrap 13 Wireless interfaces 14 MCA hardware 20 CryptoAuthentication device 33 Module pinout 34 Signal usage limitations 86

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus Features and functionality

Note To serve our customers most effectively, Digi International Inc. is consolidating its cloud

services, Digi Device Cloud and Digi Remote Manager®, under the Remote Manager name. This phased process does not affect device functionality or the functionality of the web services and other features. However, you will find instances of both Device Cloud and Digi Remote Manager in some documentation, firmware, and user interfaces.

Features and functionality

The ConnectCore 6 Plus module is based on the i.MX6QP processor from NXP. This processor offers a high number of interfaces. Most of these interfaces are multiplexed and are not available simultaneously. The module has the following features:

n i.MX6QP ARM Cortex-A9 cores operating at speed up to 1.0 GHz

l 32 Kbytes L1 instruction cache

l 32 Kbytes L1 data cache

l Up to 1 MB unified instruction/data L2 cache

l NEON MPE (Media Processing Engine) co-processor

n Graphical hardware accelerators:

l IPU (Image Processing Unit)

l VPU (Video Processing Unit)

l 3D GPU (Graphics Processing Unit) version 6

l 2D GPU (Graphics Processing Unit) version 3

l GPU (OpenVG 1.1 Graphics Processing Unit)

l Prefetch and resolve engine

l Prefetch and resolve gasket

l ASRC (Asynchronous Sample Rate Converter)

n 64-bit DDR3-1066 memory interface with a density up to 2 GBytes

n 8-bit eMMC support

n Dialog DA9063 power management IC (PMIC)

l 6x DC/DC buck converters

l 11x LDO regulators

l RTC with rechargeable coin cell battery support

l 10-bit ADC channels

l GPIO pins

n IEEE 802.11 a/b/g/n/ac WLAN interface

n Bluetooth version 4.2 dual mode

n Cortex-M0+/Cortex-M4 MCA (Microcontroller Assist) subsystem

n Debug interfaces:

l Standard JTAG controller IEEE 1149.1

l ETM/ETB support

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus Block diagram

n Support of i.MX6QP typical interfaces:

l 16/32-bit data/address bus

l SATA II, 3.0 Gbps (24-bit parallel bus, LVDS, HDMI, MIPI/DSI)

l Display support

HDMI

24-bit parallel bus

Dual LVDS

MIPI/DSI

l 2x camera (20-bit parallel bus, MIPI/CSI)

l MMC/SD/SDIO

l 1x USB OTG with integrated PHY

l 3x USB Host

l PCI Express Gen 2.0 lane

l 10/100/1000 M Ethernet MAC

l UART, SPI, I2C, PWM, CAN, I2S and GPIO

n Ultra-miniature SMT module (50x50mmx5mm) based on 400-LGA pads

n Security accelerators:

l ARMTrustZone

l CAAM (Cryptographic Acceleration and Assurance Module)

l SNVS (Secure Non-volatile Storage)

l CSU (Central Security Unit)

l A-HABv4 (Advanced High-assurance Boot)

Block diagram

The figure below shows the block diagram of the NXP i.MX6QP application processor.

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus Power supply architecture

Power supply architecture

The ConnectCore 6 Plus provides a primary 5 V power supply input. This supply is the main power domain to the on-module Dialog DA9063 power management IC (PMIC), which generates all required supply voltages for the module components as well as the carrier board.

The module provides support for a backup battery (coin-cell or super cap) powering the real-time clock (RTC) on the module. In addition, rechargeable backup batteries (ML414, others) are also supported.

The PMIC generates the following power domains that are available on the module pads:

n One PMIC switching regulator:

l VGEN_3V3

n Five PMIC LDO:

l VLDO2

l VLDO3_MCA

l VLDO4

l VLDO6

l VLDO8

l VDD_SD2

l VDD_WLAN_SD1

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus Power supply architecture

Turn

Dropout

Signal name

VGEN_ 3V3

Note The maximum current consumption mentioned in the previous table is a combination of the

current consumed by the module (max 500 mA) and by the carrier board for external use (1000 mA).

The table below provides the characteristics of the optional LDO outputs:

Signal name

VLDO2 LDO2 0.6-

VLDO3_ MCA

VLDO4 LDO4 0.9-

PMIC regulator

BUCKPERI 3.3 V +/-3% 1500 mA - 1 µA 1.2 ms -

PMIC regulator

LDO3 0.9-

Output voltage

1.86 V

3.44 V

Output accuracy

+/-3% 1.8 V 200 mA 150 mV

+/-3% 3.3 V 200 mA 150 mV 1 µA

Maximum current

Default voltage

voltage (MAX)

Maximum current

Turn on time (MAX)

Drop output voltage (MAX)

off time (MAX)

Quiescent current in OFF mode (TYP)

1 µA

Quiescent current in OFF mode (TYP)

VLDO6 LDO6 0.9-3.6V+/-3% 3.3 V 200 mA 150 mV 1 µA

VLDO8 LDO8 0.9-3.6V+/-3% 3.3 V 200 mA 150 mV 1 µA

VDD_ SD2

VDD_ WLAN_ SD1

Signal name Turn on time (MAX) Turn off time (MAX)

VLDO2

VLDO3_MCA 300 µs 1 ms

VLDO4 300 µs 1 ms

VLDO6 200 µs 1 ms

VLDO8 300 µs 1 ms

VDD_SD2 200 µs 1 ms

VDD_WLAN_SD1 200 µs 1 ms

LDO9 0.95 -

3.6 V

LDO10 0.9 - 3.6V+/-3% 3.3 V 300 mA 150 mV

150 µs

+/-1% 3.3 V 200 mA 150 mV

1 ms

1 µA

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus Power supply architecture

Note For information about using the LDO options, please contact Digi. VLDO3 is used for supplying

MCA processor on the module.

The power management IC located on the module is responsible for generating all required i.MX6QP processor supply voltages. The following i.MX6QP supplies are available on the module pads:

n NVCC_ENET

n NVCC_EIM

n NVCC_LCD

n NVCC_CSI

n NVCC_RGMII

Some of the I/O supplies are set on the module. See the following table:

Power domain Connection

NVCC_GPIO VGEN_3V3

NVCC_JTAG VGEN_3V3

NVCC_NANDF VGEN_3V3

NVCC_SD1 VDD_WLAN_SD1

NVCC_SD2 VDD_SD2

NVCC_SD3 VGEN_3V3

PCIE_VPH 2.5V (VDDHIGH_CAP_2V5)

The remaining I/O voltages must be set externally and are left open on the ConnectCore 6 Plus module. See the following table for operating ranges of the remaining I/O supplies.

Power domain Min Typical Max

NVCC_ENET 1.8 V

NVCC_EIM

NVCC_LCD

NVCC_CSI

1.8 V 2.5 V 3.3 V

2.5 V 3.3 V

NVCC_MIPI 2.25 V 2.5 V 3.3 V

NVCC_RGMII in HSIC 1.2 V mode 1.15 V - 1.30 V

NVCC_RGMII in RGMII 1.5 V mode 1.43 V - 1.58 V

NVCC_RGMII in RGMII 1.8 V mode 1.70 V - 1.90 V

NVCC_RGMII in RGMII 2.5 V mode 2.25 V - 2.625 V

As shown in the table above, the supplies have a wide operating range. To provide the most costeffective and flexible solution for a given use case, the carrier board integrating the ConnectCore 6

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus Power supply architecture

Plus module must provide the supplies listed in the table. But note that PMIC power domains 3.3 V— and LDO2/3/4/6/8 options—are dedicated power sources for supplying i.MX6QP power domains.

The MCU-assist-specific power domain (VLDO3_MCA) available on the ConnectCore 6 Plus LGA pads is a power supply output that powers the on-module Kinetis processor.

The following diagram outlines the ConnectCore 6 Plus power supply. Inputs are marked red; blue marks are outputs.

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus Bootstrap

Bootstrap

The ConnectCore 6 Plus module can be configured to boot from different devices and interfaces determined by the boot ROM. The configuration of the CPU booting process is done through:

n BOOT_MODE register, which selects the boot mode of the processor

n eFUSEs and/or GPIOs, which determine the boot configuration

Four boot modes are available on the i.MX6QP processor. Selection between them is done through BOOT_MODE[1:0] bits. The bits are externally configurable on two processor IOs, whose values are latched during boot-up:

BOOT_MODE [1:0] Boot type

00 Boot from fuses

01 Serial downloader

10 Internal boot (default)

11 Reserved

BOOT_MODE[0] and BOOT_MODE[1] are available on dedicated pads on the module.

Note BOOT_MODE[1:0] is set internally to [10] through 10K pull-up and 10K pull-down resistors. So, by

default, the SOM is configured to internal boot.

Boot from fuses

Boot from fuses is the recommended boot mode for production purposes. When this boot mode is selected, you must configure several parameters in order to select and configure the system boot device. These parameters are configured through fuses, which are burned in order to set their values.

CAUTION! A boot-from-fuses configuration is irreversible.

BOOT_CFG1 register selects the boot device through BOOT_CFG1[7:4] bits:

BOOT_CFG1[7:4] Boot device

0000

0001 Reserved

1xxx Raw NAND

0010 SSD/Hard Disk (SATA)

NOR/OneNAND (EIM)

010x SD/eSD/SDXC

0011 Serial ROM (I2C/SPI)

011x MMC/eMMC

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus Wireless interfaces

There are many other registers that configure the different boot devices. For a complete description of the booting configuration, refer to the NXP i.MX6QP Applications Processor Reference Manual (Chapter 8: System Boot).

Internal Boot

Internal boot is the recommended boot mode for development purposes. When this boot mode is selected, the selection and configuration of the booting process is done through the same registers used when booting from fuses. However, this time the values of some registers are overridden using multiple GPIOs—which are latched during power-up.

The following configuration is done internally in the ConnectCore 6 Plus module to enable booting from the internal eMMC memory:

Default

Bootstrap register bit Corresponding GPIO

BOOT_CFG1[4] EIM_DA4 10K pull-down

BOOT_CFG1[5] EIM_DA5 10K pull-up

BOOT_CFG1[6] EIM_DA6 10K pull-up

configuration

BOOT_CFG1[7] EIM_DA7 10K pull-down

BOOT_CFG2[3] EIM_DA11 10K pull-up

BOOT_CFG2[4] EIM_DA12 10K pull-up

BOOT_CFG2[5] EIM_DA13 10K pull-down

BOOT_CFG2[6] EIM_DA14 10K pull-up

By default, the system is configured to boot from MMC/eMMC (BOOT_CFG1[7:5] = 011). You can externally change the configuration of these lines to select between different boot devices. To see a detailed implementation of the boot configuration, check the ConnectCore 6 Plus carrier board reference design.

Make sure that the following signals are not pulled high during boot:

n EIM_EB3 (pad AA18)

n EIM_A18 (pad AB15)

n EIM_A20 (pad AB16)

n EIM_A21 (pad AC16)

Pulling these lines up during booting will prevent the system from booting.

Wireless interfaces

The ConnectCore 6 Plus system-on-module combines a wireless local area network (WLAN) and Bluetooth dual solution to support IEEE802.11 a/b/g/n/ac WLAN standards and Bluetooth 4.2, enabling integration of WLAN/Bluetooth and Low Energy technology.

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus Wireless interfaces

The following sections include specifications for the wireless interfaces available on the i.MX6QP module.

WLAN IEEE 802.11a/b/g/n/ac

The 2.4 GHz band on the ConnectCore 6 Plus module supports 20/40 MHz bandwidths, and the 5 GHz band supports 20/40/80 MHz bandwidths.

The following sections specify the performance of the WLAN IEEE 802.11a/b/g/n/ac interface on the ConnectCore 6 Plus module.

Modulation and data rates

The following tables list modulation values for ConnectCore 6 Plus module supports the following WLAN standards.

Mode

802.11b DBPSK 1 Mbps

802.11ga BPSK-1/2 6 Mbps

802.11n BPSK-1/2 MCS0

Modulation & coding

DQPSK 2 Mbps

CCK 5.5 Mbps

CCK 11 Mbps

BPSK-3/4 9 Mbps

QPSK-1/2 12 Mbps

QPSK-3/4 18 Mbps

16QAM-1/2 24 Mbps

16QAM-3/4 36 Mbps

64QAM-2/3 48 Mbps

64QAM-3/4 54 Mbps

QPSK-1/2 MCS1

Rate

QPSK-3/4 MCS2

16QAM-1/2 MCS3

16QAM-3/4 MCS4

64QAM-2/3 MCS5

64QAM-3/4 MCS6

64QAM-5/6 MCS7

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus Wireless interfaces

Mode

802.11ac BPSK-1/2 MCS0

Modulation & coding

QPSK-1/2 MCS1

QPSK-3/4 MCS2

16QAM-1/2 MCS3

16QAM-3/4 MCS4

64QAM-2/3 MCS5

64QAM-3/4 MCS6

64QAM-5/6 MCS7

256QAM-3/4 MCS8

256QAM-5/6 MCS9

Rate

Data rate (Mbps) - Non Short Guard Interval (Non-SGI)

Data rate (Mbps) 802.11b 802.11ga 802.11n 802.11ac

Modulation DBPSK CCK BPSK-

1/2

64QAM3/4

BPSK1/2

64QAM5/6

BPSK1/2

64QAM5/6

256QAM5/6

1 Mbps11Mbps6Mbps54Mbps

2.4 GHz

5 GHz HT20 6 54 6.5 65 6.5 65

HT20 1 11 6 54 6.5 65 6.5 65

HT40 13.5 135 13.5 135 180

HT80 29.3 292.5 390

MCS0 MCS7 MCS0 MCS7 MCS9

Data rate (Mbps) - Short Guard Interval (SGI)

Mode

Modulation DBPSK CCK BPSK-

2.4 GHz

HT20 1 11 6 54 7.2 72.2 7.2 72.2

HT40 15 150 15 150 200

802.11b 802.11ga 802.11n 802.11ac

64QAM-

1/2

1 Mbps11Mbps6Mbps54Mbps

3/4

BPSK1/2

MCS0 MCS7 MCS0 MCS7 MCS9

64QAM5/6

BPSK1/2

64QAM5/6

256QAM5/6

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus Wireless interfaces

Mode

5 GHz HT20 6 54 7.2 72.2 7.2 72.2

HT40 15 150 15 150 200

HT80 32.5 325 433.3

802.11b 802.11ga 802.11n 802.11ac

RF channels

The ConnectCore 6 Plus module supports the following frequency bands.

Ch.

RF band Ch. BW

2.4 GHz 20 MHz 5 MHz 1(2412), 2(2417), 3(2422), 4(2427), 5

40 MHz 5 MHz 3(2422), 11(2462)

5 GHz 20 MHz 20 MHz 36(5180), 40(5200), 44(5220), 48

spacing Channel number (Center freq. MHz)

(2432), 6(2437), 7(2442), 8(2447), 9 (2452), 10(2457), 11(2462), 12(2467), 13(2472), 14(2484)

(5240), 52(5260), 56(5280), 60(5300), 64(5320), 100(5500), 104(5520), 108 (5540), 112(5560), 116(5580), 120 (5600), 124(5620), 128(5640), 132 (5660), 136(5680), 140(5700), 144 (5720), 149(5745), 153(5765), 157 (5785), 161(5805), 165(5825)

40 MHz 40 MHz 38(5190), 46(5230), 54(5270), 62

(5310), 102(5510), 110(5550), 118 (5590), 126(5630), 134(5670), 142 (5710), 151(5755), 159(5795)

80 MHz 80 MHz 42(5210), 58(5290), 106(5530), 122

(5610), 138(5690), 155(5775)

Note See Regulatory information and certifications for further details about available RF channels and

their maximum transmit power.

2.4 GHz

2.4 GHz band channel # Center frequency (MHz) Europe (ETSI) North America (FCC) Japan

1 2412 ✔ ✔ ✔

2 2417 ✔ ✔ ✔

3 2422 ✔ ✔ ✔

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus Wireless interfaces

2.4 GHz band channel # Center frequency (MHz) Europe (ETSI) North America (FCC) Japan

4 2427 ✔ ✔ ✔

5 2432 ✔ ✔ ✔

6 2437 ✔ ✔ ✔

7 2442 ✔ ✔ ✔

8 2447 ✔ ✔ ✔

9 2452 ✔ ✔ ✔

10 2457 ✔ ✔ ✔

11 2462 ✔ ✔ ✔

12 2467 ✔ No ✔

13 2472 ✔ No ✔

14 2484 No No 802.11b only

5 GHz

5 GHz band channel # Center frequency (MHz) EUROPE (ETSI) NORTH AMERICA (FCC) JAPAN

36 5180 Indoors ✔ ✔

40 5200 Indoors ✔ ✔

44 5220 Indoors ✔ ✔

48 5240 Indoors ✔ ✔

52 5260 Indoors / DFS / TPC DFS DFS / TPC

56 5280 Indoors / DFS / TPC DFS DFS / TPC

60 5300 Indoors / DFS / TPC DFS DFS / TPC

64 5320 Indoors / DFS / TPC DFS DFS / TPC

100 5500 DFS / TPC DFS DFS / TPC

104 5520 DFS / TPC DFS DFS / TPC

108 5540 DFS / TPC DFS DFS / TPC

112 5560 DFS / TPC DFS DFS / TPC

116 5580 DFS / TPC DFS DFS / TPC

120 5600 DFS / TPC No access DFS / TPC

124 5620 DFS / TPC No access DFS / TPC

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus Wireless interfaces

5 GHz band channel # Center frequency (MHz) EUROPE (ETSI) NORTH AMERICA (FCC) JAPAN

128 5640 DFS / TPC No access DFS / TPC

132 5660 DFS / TPC DFS DFS / TPC

136 5680 DFS / TPC DFS DFS / TPC

140 5700 DFS / TPC DFS DFS / TPC

149 5745 SRD ✔ No access

153 5765 SRD ✔ No access

157 5785 SRD ✔ No access

161 5805 SRD ✔ No access

165 5825 SRD ✔ No access

Note

DFS = Dynamic Frequency Selection TPC = Transmit Power Control SRD = Short Range Devices 25 mW max power

Receive sensitivity

The following table lists typical receive sensitivity values for the ConnectCore 6 Plus module.

Mode 802.11b 802.11ga 802.11n 802.11ac

Modulation DBPSK CCK BPSK-

1/2

Mbps11Mbps

2.4 GHz

5 GHz HT20 - - -90 -75 -82 -64 -82 -64 -

Note Specification is subject to change.

HT20 -90 -88 -90 -75 -82 -64 -82 -64 -

HT40 - - - - -79 -61 -79 -61 -54

HT80 - - - - - - -76 -58 -51

6 Mbps 54 Mbps MCS0 MCS7 MCS0 MCS7 MCS9

64QAM3/4

BPSK1/2

64QAM5/6

BPSK1/2

64QAM5/6

256QAM5/6

Transmit power

The following table lists nominal transmit power values for the ConnectCore 6 Plus module.

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus MCA hardware

RF Band Channel BW Standard Output power (dBm)

2.4 GHz 20 MHz 802.11b 18 (1 Mbps) - 18 (11 Mbps)

20 MHz 802.11g 18 (6 Mbps) - 16 (54 Mbps)

20 MHz 802.11n 18 (MCS0) - 15 (MCS7)

40 MHz 802.11n 17 (MCS0) - 15 (MCS7)

40 MHz 802.11ac 17 (MCS0) - 13 (MCS9)

5 GHz 20 MHz 802.11a 13 (6 Mbps) - 11 (54 Mbps)

20 MHz 802.11n 13 (MCS0) - 10 (MCS7)

40 MHz 802.11n 12 (MCS0) - 9 (MCS7)

40 MHz 802.11ac 12 (MCS0) - 5 (MCS9)

80 MHz 802.11ac 11 (MCS0) - 4 (MCS9)

Note See Regulatory information and certifications for further details about available RF channels and

their maximum transmit power.

Note Due to manufacturing tolerance, these nominal output powers may be reduced up to 3 dB.

Bluetooth

The ConnectCore 6 Plus module supports both Bluetooth and Bluetooth Low Energy protocols:

n Bluetooth 4.2; backwards compatible with Bluetooth 1.X, 2.X + Enhanced Data Rate, Bluetooth

3.X, Bluetooth 4.0 and Bluetooth 4.1 Bluetooth class 1 and class 2 power-level transmissions

n Integrated WLAN-Bluetooth coexistence

Note See Bluetooth SIG-qualified hardware and firmware for more information.

MCA hardware

Note Digi provides hardware connectivity between the on-module MCA and the main processor.

Additional software developmentis required to implement MCAfunctionality on the ConnectCore 6 and ConnectCore 6 Plus.

Supported devices

The ConnectCore 6 Plus module is designed to support a Kinetis processor in a QFN48 package. See below for a list of compatible Kinetis processors that can be used in this package size:

n MKL14Z32VFT4

n MKL14Z64VFT4

n MKL15Z128VFT4

n MKL15Z32VFT4

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus MCA hardware

n MKL15Z64VFT4

n MKL24Z32VFT4

n MKL24Z64VFT4

n MKL25Z128VFT4

n MKL25Z32VFT4

n MKL25Z64VFT4

n MKL26Z128VFT4

n MKL26Z64VFT4

n MKL26Z32VFT4

n K10P48M50SF0

n K20P48M50SF0

By default, NXP MKL14Z32VFT4 is populated on the module variants supporting the MCA unit.

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus MCA hardware

MCA pinout

The table below contains the pinouts for the MCA unit on the ConnectCore 6 Plus module.

Note The pinout information assumes you are using the NXP MKL14Z32VFT4 microcontroller. Using a

different Kinetis microcontroller may change the functions available on the MCA pins.

MCA ConnectCore 6 Plus

PinNrSignal

name

1 VDD - LDO3_MCA MCA power supply

2 VSS - GND MCA ground

3 ADC0_SE1

PTE16 SPI0_PCS0 UART2_TX TPM_ CLKIN0

4 ADC0_SE5a

PTE17 SPI0_SCK UART2_RX TPM_ CLKIN1

LPTMR0_ ALT3

Pad Nr Signal name Usage on module

1x 100 nF + 1x1 µF capacitors connected to GND are placed close to this pin on the ConnectCore 6 Plus SOM.

N20 MCA_IO/USB0_PFor KL24, KL25 and K20 processors, this pin is USB0_

DP. MCA_IO/USB0_P (N20) and MCA_IO/USB0_N (P20) have been routed as a differential pair for supporting USB functionality on KL24, KL25 and K20 processors.

P20 MCA_IO/USB0_NFor KL24, KL25 and K20 processors, this pin is USB0_

DN. MCA_IO/USB0_P (N20) and MCA_IO/USB0_N (P20) have been routed as a differential pair for supporting USB functionality on KL24, KL25 and K20 processors.

5 ADC0_SE2

PTE18 SPI0_MOSI

I2C0_SDA SPI0_MISO

ConnectCore 6 Plus Hardware Reference Manual

Y22 MCA_IO27 For KL24 and K20 processors, this pin is VOUT33. The

ConnectCore 6 Plus SOM has a 0R resistor on this pin for connecting this signal to LDO3_MCA. By default, the resistor is not populated and MCA_IO27 is available on the module pad.

About the ConnectCore 6 Plus MCA hardware

MCA ConnectCore 6 Plus

PinNrSignal

name

6 ADC0_SE6a

PTE19 SPI0_MISO

I2C0_SCL SPI0_MOSI

7 ADC0_SE0

PTE20

TPM1_CH0 UART0_TX

8 ADC0_SE4a

PTE21

TPM1_CH1 UART0_RX

Pad Nr Signal name Usage on module

P21 MCA_IO14

T23 MCA_IO0

P23 MCA_IO1

9 VDDA - LDO3_MCA MCA power supply.

A 100 nF capacitor connected to GND is placed close to this pin on theConnectCore 6 Plus SOM.

10 VREFH AC10 MCA_VREFH A 100 nF capacitor connected to GND is placed close to

this pin on theConnectCore 6 Plus SOM.

11 VREFL - GND MCA ground

12 VSSA - GND MCA ground

13 CMP0_

IN5/ADC0_ SE4b PTE29

TPM0_CH2 TPM_ CLKIN0

Y23 MCA_IO23

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus MCA hardware

MCA ConnectCore 6 Plus

PinNrSignal

name

14 ADC0_

SE23/CMP0_ IN4 PTE30

TPM0_CH3 TPM_ CLKIN1

15 -

PTE24

TPM0_CH0

I2C0_SCL

16 -

PTE25

TPM0_CH1

I2C0_SDA

Pad Nr Signal name Usage on module

- - This MCA pin is connected to the gate of an N-channel MOSFET. A 10 K pull-down resistor is connected to GND on this signal too. The drain of the MOSFET is connected to theConnectCore 6 Plus signal ON/OFF (pad D18). The source of the MOSFET is connected to GND. This signal is reserved on the module and allows MCA to control ON/OFF signal over software.

- KINETIS_32K This MCA pin is connected to 32K output of the PMIC, which is the clock input of the MCA processor.

AC21 MCA_IO28 For K10 and K20 processors, this pin is VBAT.

TheConnectCore 6 Plus SOM has a 0R resistor on this pin for connecting this signal to LDO3_MCA. By default, the resistor is not populated and MCA_IO28 is available on module pad. 1x 100 nF + 1x1 µF capacitors connected to GND are placed close to this pin on ConnectCore 6 Plus SOM.

17 -

18 -

L23 MCA_SWD_CLK

PTA0

TPM0_CH5

SWD_CLK

AA22 MCA_IO25 PTA1 UART0_RX TPM2_CH0

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus MCA hardware

MCA ConnectCore 6 Plus

PinNrSignal

name

19 -

PTA2 UART0_TX TPM2_CH1

20 -

PTA3 I2C1_SCL TPM0_CH0

SWD_DIO

21 -

PTA4 I2C1_SDA TPM0_CH1

NMI_b

Pad

Nr Signal name Usage on module

AA23 MCA_

IO6/PMIC_GP_ FB2

M23 MCA_SWD_DIO

AA21 MCA_IO26

Connected on ConnectCore 6 Plus SOM to PMIC signal GP_FB2.

22 VDD - LDO3_MCA MCA power supply

1x 100 nF + 1x1 µF capacitors connected to GND are placed close to this pin on ConnectCore 6 Plus SOM.

23 VSS - GND MCA ground

24 EXTAL0

PTA18

UART1_RX TPM_ CLKIN0

- PMIC_STBY_ REQ

Connected on ConnectCore 6 Plus SOM to i.MX6QP processor signal PMIC_STBY_REQ (ball F11) and PMIC signal SYS_EN/GPIO8 (ball B9).

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus MCA hardware

MCA ConnectCore 6 Plus

PinNrSignal

name

25 XTAL0

PTA19

UART1_TX TPM_ CLKIN1

LPTMR0_ ALT1

26 RESET_b

PTA20

27 ADC0_SE8

PTB0/LLWU_ P5 I2C0_SCL TPM1_CH0

Pad Nr Signal name Usage on module

T20 MCA_IO24

N23 #MCA_RESET

R23 MCA_IO2

28 ADC0_SE9

PTB1 I2C0_SDA TPM1_CH1

29 ADC0_SE12

PTB2 I2C0_SCL TPM2_CH0

30 ADC0_SE13

PTB3 I2C0_SDA TPM2_CH1

H21 NANDF_

CS1/#MCA_INT

- INTERNAL_ I2C_SCL

- INTERNAL_ I2C_SDA

Connected to i.MX6QP processor signal NANDF_CS1 (ball C16).

Connected directly to PMIC I2C_SCL signal and to i.MX6QP processor I2C2_SCL/KEY_COL3 signal (ball U5) over N-channel MOSFET.

Connected directly to PMIC I2C_SDA signal and to i.MX6QP processor I2C2_SDA/KEY_ROW3 signal (ball T7) over N-channel MOSFET.

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus MCA hardware

MCA ConnectCore 6 Plus

PinNrSignal

name

31 -

PTB16 SPI1_MOSI UART0_RX TPM_ CLKIN0 SPI1_MISO

32 -

PTB17 SPI1_MISO UART0_TX TPM_ CLKIN1 SPI1_MOSI

33 ADC0_SE14

PTC0

EXTRG_IN

CMP0_OUT

Pad Nr Signal name Usage on module

N22 MCA_IO7

P22 MCA_IO8

U24 MCA_IO4

34 ADC0_SE15

PTC1/LLWU_ P6/RTC_ CLKIN I2C1_SCL

TPM0_CH0

35 ADC0_SE11

PTC2 I2C1_SDA

TPM0_CH1

- KINETIS_32K This MCA pin is connected to 32K output of the PMIC.

For KL14, KL15, KL24 and KL25 this pin can be configured as RTC_CLKIN signal.

R22 MCA_IO9

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus MCA hardware

MCA ConnectCore 6 Plus

PinNrSignal

name

36 -

PTC3/LLWU_ P7

UART1_RX TPM0_CH2 CLKOUT

37 -

PTC4/LLWU_ P8 SPI0_PCS0 UART1_TX TPM0_CH3

38 -

PTC5/LLWU_ P9 SPI0_SCK LPTMR0_ ALT2

CMP0_OUT

Pad Nr Signal name Usage on module

T22 MCA_IO10

U22 MCA_IO11

M21 MCA_IO12

39 CMP0_IN0

PTC6/LLWU_ P10 SPI0_MOSI EXTRG_IN

SPI0_MISO

40 CMP0_IN1

PTC7 SPI0_MISO

SPI0_MOSI

N21 MCA_IO13

R20 MCA_IO19

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus MCA hardware

MCA ConnectCore 6 Plus

PinNrSignal

name

41 -

PTD0 SPI0_PCS0

TPM0_CH0

42 ADC0_SE5b

PTD1 SPI0_SCK

TPM0_CH1

43 -

PTD2 SPI0_MOSI UART2_RX TPM0_CH2 SPI0_MISO

Pad Nr Signal name Usage on module

A6 CSI0_

DAT11/ECSPI2_ SS0

D6 CSI0_

DAT8/ECSPI2_ SCLK

K5 CSI0_

DAT10/ECSPI2_ MISO

Connected to i.MX6QP processor signal CSI0_DAT11 (ball M3) and to LGA pad A6. This pin can be configured as a SPI chip select shared between MCA and i.MX6QP processor.

Connected to i.MX6QP processor signal CSI0_DAT8 (ball N6) and to LGA pad D6. This pin can be configured as a SPI clock shared between MCA and i.MX6QP processor.

Connected to i.MX6QP processor signal CSI0_DAT10 (ball M1) and to LGA pad K5. This pin can be configured as a SPI MISO shared between MCA and i.MX6QP processor.

44 -

45 -

PTD3 SPI0_MISO UART2_TX TPM0_CH3 SPI0_MOSI

PTD4/LLWU_ P14 SPI1_PCS0 UART2_RX TPM0_CH4

D5 CSI0_

DAT9/ECSPI2_ MOSI

R21 MCA_IO16

Connected to i.MX6QP processor signal CSI0_DAT9 (ball N5) and to LGA pad D5. This pin can be configured as a SPI MOSI shared between MCA and i.MX6QP processor.

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus MCA hardware

MCA ConnectCore 6 Plus

PinNrSignal

name

46 ADC0_SE6b

PTD5 SPI1_SCK UART2_TX TPM0_CH5

47 ADC0_SE7b

PTD6/LLWU_ P15 SPI1_MOSI UART0_RX

SPI1_MISO

48 -

PTD7 SPI1_MISO UART0_TX

SPI1_MOSI

Pad Nr Signal name Usage on module

T21 MCA_IO22

T24 MCA_IO3

AA20 MCA_IO21

The i.MX6QP pads listed above are connected to ConnectCore 6 Plus pads. If the MCA microcontroller firmware doesn’t use these signals, they are available on the carrier board and can be used in any of the alternative functions listed above.

ConnectCore 6 Plus Hardware Reference Manual

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DIGI ConnectCore 6 Plus User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

About the ConnectCore 6 Plus

Features and functionality

Block diagram

Power supply architecture

Bootstrap

Wireless interfaces

WLAN IEEE 802.11a/b/g/n/ac

Modulation and data rates

RF channels

Receive sensitivity

Transmit power

Bluetooth

MCA hardware

Supported devices

MCA pinout