Digi CCIMX6P Users Guide

ConnectCore 6 Plus

Hardware Reference Manual

Revision history—900002278

Revision Date Description

A April 2018 First release

Trademarks and copyright

Digi, Digi International, and the Digi logo are trademarks or registered trademarks in the United
States and other countries worldwide. All other trademarks mentioned in this document are the
property of their respective owners.

© 2018 Digi International Inc. All rights reserved.

Disclaimers

Information in this document is subject to change without notice and does not represent a
commitment on the part of Digi International. Digi provides this document “as is,” without warranty of
any kind, expressed or implied, including, but not limited to, the implied warranties of fitness or
merchantability for a particular purpose. Digi may make improvements and/or changes in this manual
or in the product(s) and/or the program(s) described in this manual at any time.

Warranty

To view product warranty information, go to the following website:

www.digi.com/howtobuy/terms

Send comments

Documentation feedback: To provide feedback on this document, send your comments to

[e-mail].

Customer support

Digi Technical Support: Digi offers multiple technical support plans and service packages to help our

customers get the most out of their Digi product. For information on Technical Support plans and
pricing, contact us at +1 952.912.3444 or visit us at www.digi.com/support.

ConnectCore 6 Plus Hardware Reference Manual

2

Contents

About the ConnectCore 6 Plus

Features and functionality 6
Block diagram 7
Power supply architecture 8
Bootstrap 13
Wireless interfaces 14

WLAN IEEE 802.11a/b/g/n/ac 15
Modulation and data rates 15
RF channels 17
Receive sensitivity 19
Transmit power 19
Bluetooth 20

MCA hardware 20

Supported devices 20
MCA pinout 22
Shared I2C bus 31

Shared SPI bus 32
CryptoAuthentication device 33
Module pinout 34
Signal usage limitations 84

Specifications for the ConnectCore 6 Plus

Electrical characteristics 87

Voltage supplies 87
Power consumption 87

Power consumption use cases 87

Global power consumption 88
Mechanical specifications 88

Host PCB footprint 90
Environmental specifications 90

Linux - Android users 91

Assembly instructions

Moisture sensitivity and shelf life 93
Mounting 93

Solder Paste 93
Solder paste print 93
Stencil 93

ConnectCore 6 Plus Hardware Reference Manual

3

Coplanarity 94
SMT pick and place 94
SMT process parameter reference 94
Reflow profile 94

Regulatory information and certifications

United States FCC 97

Labeling requirements 97

Maximum power and frequency specifications (FCC) 98

FCC notices 99

FCC-approved antennas 99

RF exposure 100
Canada (ISED) 100

Maximum power and frequency specifications 100

Labeling requirements 100

Transmitters with detachable antennas 101
Europe ETSI 101

Maximum power and frequency specifications (Europe ETSI) 102

OEM labeling requirements 104

CE labeling requirements 104

Declarations of Conformity 104

Approved antennas 104
Bluetooth SIG-qualified hardware and firmware 104

ConnectCore 6 Plus Hardware Reference Manual

4

About the ConnectCore 6 Plus

The ConnectCore 6 Plus is an ultra-compact and highly integrated system-on-module solution based
on the NXP i.MX6QP Cortex-A9 processor family.

With processor speed up to 1.0 GHz, the ConnectCore 6 Plus offers a truly future-proof platform
solution with scalable performance and pre-certified dual-band Wi-Fi (802.11a/b/g/n/ac) with
Bluetooth 4.2 dual mode connectivity.

Its innovative and scalable design maximizes integration flexibility and significantly reduces design
risk in a highly cost-effective, reliable, low-profile surface mount form factor with optimal thermal
management even in the most demanding quad-core system configurations.

Seamless Cloud Connector integration as part of the Digi Linux and Android software platform support
offers secure remote management and web services capabilities through the scalable Digi Remote
Manager.

In addition, Digi offers custom Remote Manager hardware and wireless design services as well as end­to-end solutions services for cloud integration and app development.

This System-On-Module aims to be the next generation of the ConnectCore 6 Plus for i.MX6 family
modules and is pin-to-pin compatible with them.

Features and functionality 6
Block diagram 7
Power supply architecture 8
Bootstrap 13
Wireless interfaces 14
MCA hardware 20
CryptoAuthentication device 33
Module pinout 34
Signal usage limitations 84

ConnectCore 6 Plus Hardware Reference Manual

5

About the ConnectCore 6 Plus Features and functionality

Note To serve our customers most effectively, Digi International Inc. has consolidated our cloud

services, Digi Device Cloud and Digi Remote Manager®, under the Remote Manager name. This phased
process does not affect device functionality or the functionality of the web services and other
features. However, you will find instances of both Device Cloud and Digi Remote Manager in some
documentation, firmware, and user interfaces.

Features and functionality

The ConnectCore 6 Plus module is based on the i.MX6QP processor from NXP. This processor offers a
high number of interfaces. Most of these interfaces are multiplexed and are not available
simultaneously. The module has the following features:

n i.MX6QP ARM Cortex-A9 cores operating at speed up to 1.0 GHz

l 32 Kbytes L1 Instruction cache

l 32 Kbytes L1 Data cache

l Up to 1 MB unified Instruction/Data L2 cache

l NEON MPE (Media Processing Engine) co-processor

n Graphical hardware accelerators:

l IPU (Image Processing Unit)

l VPU (Video Processing Unit)

l 3D GPU (Graphics Processing Unit) version 6

l 2D GPU (Graphics Processing Unit) version 3

l GPU (OpenVG 1.1 Graphics Processing Unit)

l Prefetch and Resolve Engine

l Prefetch and Resolve Gasket

l ASRC (Asynchronous Sample Rate Converter)

n 64-bit DDR3-1066 memory interface with a density up to 2 GBytes

n 8-bit eMMC support

n Dialog DA9063 power management IC (PMIC)

l 6x DC/DC buck converters

l 11x LDO regulators

l RTC with rechargeable coin cell battery support

l 10-bit ADC channels

l GPIO pins

n IEEE 802.11 a/b/g/n/ac WLAN interface

n Bluetooth version 4.2 dual mode

n Cortex-M0+/Cortex-M4 MCA (Microcontroller Assist) subsystem

ConnectCore 6 Plus Hardware Reference Manual

6

About the ConnectCore 6 Plus Block diagram

n Debug interfaces:

l Standard JTAG controller IEEE 1149.1

l ETM/ETB support

n Support of i.MX6QP typical interfaces:

l 16/32-bit data/address bus

l SATA II, 3.0 Gbps (24-bit parallel bus, LVDS, HDMI, MIPI/DSI)

l Display support

o

HDMI

o

24-bit parallel bus

o

Dual LVDS

o

MIPI/DSI

l 2x camera (20-bit parallel bus, MIPI/CSI)

l MMC/SD/SDIO

l 1x USB OTG with integrated PHY

l 3x USB Host

l PCI Express Gen 2.0 lane

l 10/100/1000 M Ethernet MAC

l UART, SPI, I2C, PWM, CAN, I2S and GPIO

n Ultra-miniature SMT module (50x50mmx5mm) based on 400-LGA pads

n Security accelerators:

l ARMTrustZone

l CAAM (cryptographic acceleration and assurance module)

l SNVS (secure non-volatile storage)

l CSU (central security unit)

l A-HABv4 (advanced high-assurance boot)

Block diagram

The figure below shows the block diagram of the NXP i.MX6QP application processor.

ConnectCore 6 Plus Hardware Reference Manual

7

About the ConnectCore 6 Plus Power supply architecture

Power supply architecture

The ConnectCore 6 Plus provides a primary 5 V power supply input. This supply is the main power
domain to the on-module Dialog DA9063 power management IC (PMIC), which generates all required
supply voltages for the module components as well as the carrier board.

The module provides support for a backup battery (coin-cell or super cap) powering the real-time
clock (RTC) on the module. In addition, rechargeable backup batteries (ML414, others) are also
supported.

The PMIC generates the following power domains that are available on the module pads:

n One PMIC switching regulator:

l VGEN_3V3

ConnectCore 6 Plus Hardware Reference Manual

8

About the ConnectCore 6 Plus Power supply architecture

n Five PMIC LDO:

l VLDO2

l VLDO3_MCA

l VLDO4

l VLDO6

l VLDO8

l VDD_SD2

l VDD_WLAN_SD1

Signal
name

VGEN_

Turn

PMIC
regulator

Output
voltage

Output
accuracy

Maximum
current

Dropout
voltage
(MAX)

Turn on
time
(MAX)

off
time
(MAX)

BUCKPERI 3.3 V +/-3% 1500 mA - 1 µA 1.2 ms -

Quiescent
current in
OFF mode
(TYP)

3V3

Note The maximum current consumption mentioned in the previous table is a combination of the

current consumed by the module (max 500mA) and by the carrier board for external use (1000mA).

The table below provides the characteristics of the optional LDO outputs:

Signal
name

PMIC
regulator

Output
voltage

VLDO2 LDO2 0.6-

Drop output
Output
accuracy

Default
voltage

Maximum
current

voltage

(MAX)

+/-3% 1.8 V 200 mA 150 mV

Quiescent current
in OFF mode
(TYP)

1 µA

1.86 V

VLDO3_
MCA

VLDO4 LDO4 0.9-

LDO3 0.9-

3.44 V

+/-3% 3.3 V 200 mA 150 mV 1 µA

+/-3% 3.3 V 200 mA 150 mV 1 µA

3.44 V

VLDO6 LDO6 0.9-3.6V+/-3% 3.3 V 200 mA 150 mV 1 µA

VLDO8 LDO8 0.9-3.6V+/-3% 3.3 V 200 mA 150 mV 1 µA

VDD_
SD2

VDD_

LDO9 0.95 -

+/-1% 3.3 V 200 mA 150 mV

3.6 V

LDO10 0.9 - 3.6V+/-3% 3.3 V 300 mA 150 mV
WLAN_
SD1

ConnectCore 6 Plus Hardware Reference Manual

1 µA

1 µA

9

About the ConnectCore 6 Plus Power supply architecture

Signal name Turn on time (MAX) Turn off time (MAX)

VLDO2

150 µs

1 ms

VLDO3_MCA 300 µs 1 ms

VLDO4 300 µs 1 ms

VLDO6 200 µs 1 ms

VLDO8 300 µs 1 ms

VDD_SD2 200 µs 1 ms

VDD_WLAN_SD1 200 µs 1 ms

Note For information about using the LDO options, please contact Digi.

VLDO3 is used for supplying MCA processor on the module.

The power management IC located on the module is responsible for generating all required i.MX6QP
processor supply voltages. The following i.MX6QP supplies are available on the module pads:

n NVCC_ENET

n NVCC_EIM

n NVCC_LCD

n NVCC_CSI

n NVCC_RGMII

Some of the I/O supplies are set on the module. See the following table:

Power domain Connection

NVCC_GPIO VGEN_3V3

NVCC_JTAG VGEN_3V3

NVCC_NANDF VGEN_3V3

NVCC_SD1 VDD_WLAN_SD1

NVCC_SD2 VDD_SD2

NVCC_SD3 VGEN_3V3

PCIE_VPH 2.5V (VDDHIGH_CAP_2V5)

The remaining I/O voltages must be set externally and are left open on the ConnectCore 6 Plus
module. See the following table for operating ranges of the remaining I/O supplies.

Power domain Min Max

NVCC_ENET 1.65 V 3.6 V

ConnectCore 6 Plus Hardware Reference Manual

10

About the ConnectCore 6 Plus Power supply architecture

Power domain Min Max

NVCC_EIM 1.65 V 3.6 V

NVCC_LCD 1.65 V 3.6 V

NVCC_CSI 1.65 V 3.6 V

NVCC_RGMII in HSIC 1.2 V mode 1.15 V 1.30 V

NVCC_RGMII in RGMII 1.5 V mode 1.43 V 1.58 V

NVCC_RGMII in RGMII 1.8 V mode 1.70 V 1.90 V

NVCC_RGMII in RGMII 2.5 V mode 2.25 V 2.625 V

As shown in the table above, the supplies have a wide operating range. In order to provide the most
cost-effective and flexible solution for a given use-case, the supplies listed in the table need to be
provided by the carrier board integrating the ConnectCore 6 Plus module. However, PMIC power
domains 3.3 V—and LDO2/3/4/6/8 options—are dedicated power sources for supplying i.MX6QP power
domains.

The MCU - assist specific power domain (VLDO3_MCA) available on the ConnectCore 6 Plus LGA pads is
a power supply output powering the on-module Kinetis processor.

ConnectCore 6 Plus Hardware Reference Manual

11

About the ConnectCore 6 Plus Power supply architecture

The following diagram outlines the power supply approach of the ConnectCore 6 Plus. Inputs are
marked red, blue marks are outputs.

ConnectCore 6 Plus Hardware Reference Manual

12

About the ConnectCore 6 Plus Bootstrap

Bootstrap

The ConnectCore 6 Plus module can be configured to boot from different devices and interfaces
determined by the Boot ROM. The configuration of the CPU booting process is done through:

n BOOT_MODE register, which selects the boot mode of the processor

n eFUSEs and/or GPIOs, which determine the boot configuration

Four boot modes are available on the i.MX6QP processor. Selection between them is done through
BOOT_MODE[1:0] bits. The bits are externally configurable on two processor IOs, whose values are
latched during boot-up:

BOOT_MODE [1:0] Boot type

00 Boot from fuses

01 Serial downloader

10 Internal boot (default)

11 Reserved

BOOT_MODE[0] and BOOT_MODE[1] are available on dedicated pads on the module.

Note BOOT_MODE[1:0] is set internally to [10] through 10K pull-up and 10K pull-down resistors. So, by

default, the SOM is configured to Internal boot.

Boot from fuses

Boot from fuses is the recommended boot mode for production purposes. When this boot mode is
selected, you must configure several parameters in order to select and configure the system boot
device. These parameters are configured through fuses, which are burned in order to set their values.
This means that the configuration is irreversible.

BOOT_CFG1 register selects the boot device through BOOT_CFG1[7:4] bits:

BOOT_CFG1[7:4] Boot device

0000

0001 Reserved

1xxx Raw NAND

0010 SSD/Hard Disk (SATA)

010x SD/eSD/SDXC

0011 Serial ROM (I2C/SPI)

NOR/OneNAND (EIM)

011x MMC/eMMC

ConnectCore 6 Plus Hardware Reference Manual

13

About the ConnectCore 6 Plus Wireless interfaces

There are many other registers that configure the different boot devices. For a complete description
of the booting configuration, refer to the NXP i.MX6QP Applications Processor Reference Manual
(Chapter 8: System Boot).

Internal Boot

Internal boot is the recommended boot mode for development purposes. When this boot mode is
selected, the selection and configuration of the booting process is done through the same registers
used when booting from fuses. However, this time the values of some registers are overridden using
multiple GPIOs—which are latched during power-up.

The following configuration is done internally in the ConnectCore 6 Plus module in order to enable
booting from the internal eMMC memory:

Default

Bootstrap register bit Corresponding GPIO

BOOT_CFG1[4] EIM_DA4 10K pull-down

BOOT_CFG1[5] EIM_DA5 10K pull-up

BOOT_CFG1[6] EIM_DA6 10K pull-up

configuration

BOOT_CFG1[7] EIM_DA7 10K pull-down

BOOT_CFG2[3] EIM_DA11 10K pull-up

BOOT_CFG2[4] EIM_DA12 10K pull-up

BOOT_CFG2[5] EIM_DA13 10K pull-down

BOOT_CFG2[6] EIM_DA14 10K pull-up

By default, the system is configured to boot from MMC/eMMC (BOOT_CFG1[7:5] = 011). You can
externally change the configuration of these lines to select between different boot devices. To see a
detailed implementation of the boot configuration, check the ConnectCore 6 Plus carrier board
reference design.

CAUTION! Make sure that EIM_EB3 (pad AA18) is not pulled high during boot. Pulling this
signal high enables an infinite loop at start of boot ROM. This feature is exclusively used
for debugging purposes.

Wireless interfaces

The ConnectCore 6 Plus system-on-module combines a wireless local area network (WLAN) and
Bluetooth dual solution to support IEEE802.11 a/b/g/n/ac WLAN standards and Bluetooth 4.2, enabling
seamless integration of WLAN/Bluetooth and Low Energy technology.

The following sections include specifications for the wireless interfaces available on the i.MX6QP
module.

ConnectCore 6 Plus Hardware Reference Manual

14

About the ConnectCore 6 Plus Wireless interfaces

WLAN IEEE 802.11a/b/g/n/ac

The 2.4 GHz band on the ConnectCore 6 Plus module supports 20/40 MHz bandwidths, and the 5 GHz
band supports 20/40/80 MHz bandwidths.

The following sections specify the performance of the WLAN IEEE 802.11a/b/g/n/ac interface on the
ConnectCore 6 Plus module.

Modulation and data rates

The following tables list modulation values for ConnectCore 6 Plusmodule supports the following
WLAN standards.

Mode

802.11b DBPSK 1 Mbps

802.11ga BPSK-1/2 6 Mbps

802.11n BPSK-1/2 MCS0

Modulation & coding

DQPSK 2 Mbps

CCK 5.5 Mbps

CCK 11 Mbps

BPSK-3/4 9 Mbps

QPSK-1/2 12 Mbps

QPSK-3/4 18 Mbps

16QAM-1/2 24 Mbps

16QAM-3/4 36 Mbps

64QAM-2/3 48 Mbps

64QAM-3/4 54 Mbps

QPSK-1/2 MCS1

Rate

QPSK-3/4 MCS2

16QAM-1/2 MCS3

16QAM-3/4 MCS4

64QAM-2/3 MCS5

64QAM-3/4 MCS6

64QAM-5/6 MCS7

ConnectCore 6 Plus Hardware Reference Manual

15

About the ConnectCore 6 Plus Wireless interfaces

Mode

802.11ac BPSK-1/2 MCS0

Modulation & coding

QPSK-1/2 MCS1

QPSK-3/4 MCS2

16QAM-1/2 MCS3

16QAM-3/4 MCS4

64QAM-2/3 MCS5

64QAM-3/4 MCS6

64QAM-5/6 MCS7

256QAM-3/4 MCS8

256QAM-5/6 MCS9

Rate

Data rate (Mbps) - Non Short Guard Interval (Non-SGI)

Data rate
(Mbps) 802.11b 802.11ga 802.11n 802.11ac

Modulation DBPSK CCK BPSK-

1/2

64QAM­3/4

BPSK­1/2

64QAM­5/6

BPSK­1/2

64QAM­5/6

256QAM­5/6

1
Mbps11Mbps6Mbps54Mbps

2.4
GHz

5 GHz HT20 6 54 6.5 65 6.5 65

HT20 1 11 6 54 6.5 65 6.5 65

HT40 13.5 135 13.5 135 180

HT40 13.5 135 13.5 135 180

HT80 29.3 292.5 390

MCS0 MCS7 MCS0 MCS7 MCS9

Data rate (Mbps) - Short Guard Interval (SGI)

Mode

Modulation DBPSK CCK BPSK-

2.4
GHz

HT20 1 11 6 54 7.2 72.2 7.2 72.2

HT40 15 150 15 150 200

802.11b 802.11ga 802.11n 802.11ac

64QAM-

1/2

1
Mbps11Mbps6Mbps54Mbps

3/4

BPSK­1/2

MCS0 MCS7 MCS0 MCS7 MCS9

64QAM­5/6

BPSK­1/2

64QAM­5/6

256QAM­5/6

ConnectCore 6 Plus Hardware Reference Manual

16

About the ConnectCore 6 Plus Wireless interfaces

Mode

5 GHz HT20 6 54 7.2 72.2 7.2 72.2

HT40 15 150 15 150 200

HT80 32.5 325 433.3

802.11b 802.11ga 802.11n 802.11ac

RF channels

The ConnectCore 6 Plus module supports the following frequency bands.

Ch.

RF band Ch. BW

2.4 GHz 20 MHz 5 MHz 1(2412), 2(2417), 3(2422), 4(2427), 5

40 MHz 5 MHz 3(2422), 11(2462)

5 GHz 20 MHz 20 MHz 36(5180), 40(5200), 44(5220), 48

spacing Channel number (Center freq. MHz)

(2432), 6(2437), 7(2442), 8(2447), 9
(2452), 10(2457), 11(2462), 12(2467),
13(2472), 14(2484)

(5240), 52(5260), 56(5280), 60(5300),
64(5320), 100(5500), 104(5520), 108
(5540), 112(5560), 116(5580), 120
(5600), 124(5620), 128(5640), 132
(5660), 136(5680), 140(5700), 144
(5720), 149(5745), 153(5765), 157
(5785), 161(5805), 165(5825)

40 MHz 40 MHz 38(5190), 46(5230), 54(5270), 62

(5310), 102(5510), 110(5550), 118
(5590), 126(5630), 134(5670), 142
(5710), 151(5755), 159(5795)

80 MHz 80 MHz 42(5210), 58(5290), 106(5530), 122

(5610), 138(5690), 155(5775)

Note See Regulatory information and certifications for further details about available RF channels and

their maximum transmit power.

2.4 GHz

2.4 GHz band
channel #

1 2412 ✔ ✔ ✔

2 2417 ✔ ✔ ✔

3 2422 ✔ ✔ ✔

Center frequency
(MHz)

EUROPE
(ETSI)

NORTH AMERICA
(FCC) JAPAN

ConnectCore 6 Plus Hardware Reference Manual

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About the ConnectCore 6 Plus Wireless interfaces

2.4 GHz band
channel #

4 2427 ✔ ✔ ✔

5 2432 ✔ ✔ ✔

6 2437 ✔ ✔ ✔

7 2442 ✔ ✔ ✔

8 2447 ✔ ✔ ✔

9 2452 ✔ ✔ ✔

10 2457 ✔ ✔ ✔

11 2462 ✔ ✔ ✔

12 2467 ✔ No ✔

13 2472 ✔ No ✔

14 2484 No No 802.11b only

Center frequency
(MHz)

EUROPE
(ETSI)

NORTH AMERICA
(FCC) JAPAN

5 GHz

5 GHz band
channel # Center frequency (MHz) EUROPE (ETSI) NORTH AMERICA (FCC) JAPAN

36 5180 Indoors ✔ ✔

40 5200 Indoors ✔ ✔

44 5220 Indoors ✔ ✔

48 5240 Indoors ✔ ✔

52 5260 Indoors / DFS / TPC DFS DFS / TPC

56 5280 Indoors / DFS / TPC DFS DFS / TPC

60 5300 Indoors / DFS / TPC DFS DFS / TPC

64 5320 Indoors / DFS / TPC DFS DFS / TPC

100 5500 DFS / TPC DFS DFS / TPC

104 5520 DFS / TPC DFS DFS / TPC

108 5540 DFS / TPC DFS DFS / TPC

112 5560 DFS / TPC DFS DFS / TPC

116 5580 DFS / TPC DFS DFS / TPC

120 5600 DFS / TPC No Access DFS / TPC

124 5620 DFS / TPC No Access DFS / TPC

ConnectCore 6 Plus Hardware Reference Manual

18

About the ConnectCore 6 Plus Wireless interfaces

5 GHz band
channel # Center frequency (MHz) EUROPE (ETSI) NORTH AMERICA (FCC) JAPAN

128 5640 DFS / TPC No Access DFS / TPC

132 5660 DFS / TPC DFS DFS / TPC

136 5680 DFS / TPC DFS DFS / TPC

140 5700 DFS / TPC DFS DFS / TPC

149 5745 SRD ✔ No Access

153 5765 SRD ✔ No Access

157 5785 SRD ✔ No Access

161 5805 SRD ✔ No Access

165 5825 SRD ✔ No Access

Note

DFS = Dynamic Frequency Selection
TPC = Transmit Power Control
SRD = Short Range Devices 25 mW max power

Receive sensitivity

The following table lists typical receive sensitivity values for the ConnectCore 6 Plus module.

Mode 802.11b 802.11ga 802.11n 802.11ac

Modulation DBPSK CCK BPSK-

1/2

1

Mbps11Mbps

2.4
GHz

5 GHz HT20 - - -90 -75 -82 -64 -82 -64 -

Note Specification is subject to change.

HT20 -90 -88 -90 -75 -82 -64 -82 -64 -

HT40 - - - - -79 -61 -79 -61 -54

HT40 - - - - -79 -61 -79 -61 -54

HT80 - - - - - - -76 -58 -51

6 Mbps 54 Mbps MCS0 MCS7 MCS0 MCS7 MCS9

64QAM­3/4

BPSK­1/2

64QAM­5/6

BPSK­1/2

64QAM­5/6

256QAM­5/6

Transmit power

The following table lists nominal transmit power values for the ConnectCore 6 Plus module.

ConnectCore 6 Plus Hardware Reference Manual

19

About the ConnectCore 6 Plus MCA hardware

RF Band Channel BW Standard Output Power (dBm)

2.4 GHz 20 MHz 802.11b 18 (1Mbps) - 18 (11Mbps)

20 MHz 802.11g 18 (6Mbps) - 16 (54Mbps)

20 MHz 802.11n 18 (MCS0) - 15 (MCS7)

40 MHz 802.11n 17 (MCS0) - 15 (MCS7)

40 MHz 802.11ac 17 (MCS0) - 13 (MCS9)

5 GHz 20 MHz 802.11a 13 (6Mbps) - 11 (54Mbps)

20 MHz 802.11n 13 (MCS0) - 10 (MCS7)

40 MHz 802.11n 12 (MCS0) - 9 (MCS7)

40 MHz 802.11ac 12 (MCS0) - 5 (MCS9)

80 MHz 802.11ac 11 (MCS0) - 4 (MCS9)

Note See Regulatory information and certifications for further details about available RF channels and

their maximum transmit power.

Note Due to manufacturing tolerance these nominal output powers may be reduced up to 3 dB.

Bluetooth

The ConnectCore 6 Plus module supports both Bluetooth and Bluetooth Low Energy protocols:

n Bluetooth 4.2; backwards compatible with Bluetooth 1.X, 2.X + Enhanced Data Rate, Bluetooth

3.X, Bluetooth 4.0 and Bluetooth 4.1 Bluetooth class 1 and class 2 power-level transmissions

n Integrated WLAN-Bluetooth coexistence

Note See Bluetooth SIG-qualified hardware and firmware for more information.

MCA hardware

Supported devices

The ConnectCore 6 Plus module is designed to support a Kinetis processor in a QFN48 package. See
below for a list of compatible Kinetis processors that can be used in this package size:

n MKL14Z32VFT4

n MKL14Z64VFT4

n MKL15Z128VFT4

n MKL15Z32VFT4

n MKL15Z64VFT4

n MKL24Z32VFT4

ConnectCore 6 Plus Hardware Reference Manual

20

About the ConnectCore 6 Plus MCA hardware

n MKL24Z64VFT4

n MKL25Z128VFT4

n MKL25Z32VFT4

n MKL25Z64VFT4

n MKL26Z128VFT4

n MKL26Z64VFT4

n MKL26Z32VFT4

n K10P48M50SF0

n K20P48M50SF0

By default, NXP MKL14Z32VFT4 is populated on the module variants supporting the MCA unit.

ConnectCore 6 Plus Hardware Reference Manual

21

About the ConnectCore 6 Plus MCA hardware

MCA pinout

The table below contains the pinouts for the MCA unit on ConnectCore 6 Plus module. The pinout
information assumes the use of NXP MKL14Z32VFT4 microcontroller. Using a different Kinetis
microcontroller may change the functions available on the MCA pins.

MCA ConnectCore 6 Plus

PinNrSignal

name

1 VDD - LDO3_MCA MCA power supply

2 VSS - GND MCA ground

3 ADC0_SE1

PTE16
SPI0_PCS0
UART2_TX
TPM_
CLKIN0

-

-

-

4 ADC0_SE5a

PTE17
SPI0_SCK
UART2_RX
TPM_
CLKIN1

­LPTMR0_
ALT3

-

Pad
Nr Signal name Usage on module

1x 100nF + 1x1µF capacitors connected to GND are
placed close to this pin on ConnectCore 6 Plus SOM.

N20 MCA_IO/USB0_PNot used on module.

For KL24, KL25 and K20 processors, this pin is USB0_
DP.
MCA_IO/USB0_P (N20) and MCA_IO/USB0_N (P20)
have been routed as differential pair for supporting
USB functionality on KL24, KL25 and K20 processors.

P20 MCA_IO/USB0_NNot used on module.

For KL24, KL25 and K20 processors, this pin is USB0_
DN.
MCA_IO/USB0_P (N20) and MCA_IO/USB0_N (P20)
have been routed as differential pair for supporting
USB functionality on KL24, KL25 and K20 processors.

5 ADC0_SE2

PTE18
SPI0_MOSI

­I2C0_SDA
SPI0_MISO

-

-

ConnectCore 6 Plus Hardware Reference Manual

Y22 MCA_IO27 Not used on module.

For KL24 and K20 processors, this pin is VOUT33.
ConnectCore 6 Plus SOM has a 0R resistor foreseen on
this pin for connecting this signal to LDO3_MCA. By
default, the resistor is not populated and MCA_IO27 is
available on module pad.

22

About the ConnectCore 6 Plus MCA hardware

MCA ConnectCore 6 Plus

PinNrSignal

name

6 ADC0_SE6a

PTE19
SPI0_MISO

­I2C0_SCL
SPI0_MOSI

-

-

7 ADC0_SE0

PTE20

­TPM1_CH0
UART0_TX

-

-

-

8 ADC0_SE4a

PTE21

­TPM1_CH1
UART0_RX

-

-

-

Pad
Nr Signal name Usage on module

P21 MCA_IO14 Not used on module.

T23 MCA_IO0 Not used on module.

P23 MCA_IO1 Not used on module.

9 VDDA - LDO3_MCA MCA power supply

A 100 nF capacitor connected to GND is placed close to
this pin on ConnectCore 6 Plus SOM.

10 VREFH AC10 MCA_VREFH Not used on module.

A 100 nF capacitor connected to GND is placed close to
this pin on ConnectCore 6 Plus SOM.

11 VREFL - GND MCA ground

12 VSSA - GND MCA ground

13 CMP0_

IN5/ADC0_
SE4b
PTE29

­TPM0_CH2
TPM_
CLKIN0

-

-

-

Y23 MCA_IO23 Not used on module.

ConnectCore 6 Plus Hardware Reference Manual

23

About the ConnectCore 6 Plus MCA hardware

MCA ConnectCore 6 Plus

PinNrSignal

name

14 ADC0_

SE23/CMP0_
IN4
PTE30

­TPM0_CH3
TPM_
CLKIN1

-

-

-

15 -

PTE24

­TPM0_CH0

­I2C0_SCL

-

-

16 -

PTE25

­TPM0_CH1

­I2C0_SDA

-

-

Pad
Nr Signal name Usage on module

- - This MCA pin is connected to the gate of an N-channel
MOSFET. A 10K pull-down resistor is connected to GND
on this signal too. The drain of the MOSFET is
connected to ConnectCore 6 Plus signal ON/OFF (pad
D18). The source of the MOSFET is connected to GND.
This signal is reserved on the module and allows MCA
to control ON/OFF signal over software.

- KINETIS_32K This MCA pin is connected to 32K output of the PMIC.
It’s the clock input of the MCA processor.

AC21 MCA_IO28 Not used on module.

For K10 and K20 processors, this pin is VBAT.
ConnectCore 6 Plus SOM has a 0R resistor foreseen on
this pin for connecting this signal to LDO3_MCA. By
default, the resistor is not populated and MCA_IO28 is
available on module pad.
1x 100 nF + 1x1 µF capacitors connected to GND are
placed close to this pin on ConnectCore 6 Plus SOM.

17 -

18 -

L23 MCA_SWD_CLK Not used on module.

PTA0

­TPM0_CH5

-

-

­SWD_CLK

AA22 MCA_IO25 Not used on module.
PTA1
UART0_RX
TPM2_CH0

-

-

-

-

ConnectCore 6 Plus Hardware Reference Manual

24

About the ConnectCore 6 Plus MCA hardware

MCA ConnectCore 6 Plus

PinNrSignal

name

19 -

PTA2
UART0_TX
TPM2_CH1

-

-

-

-

20 -

PTA3
I2C1_SCL
TPM0_CH0

-

-

­SWD_DIO

21 -

PTA4
I2C1_SDA
TPM0_CH1

-

-

­NMI_b

Pad

Nr Signal name Usage on module

AA23 MCA_

IO6/PMIC_GP_
FB2

M23 MCA_SWD_DIO Not used on module.

AA21 MCA_IO26 Not used on module.

Connected on ConnectCore 6 Plus SOM to PMIC signal
GP_FB2.

22 VDD - LDO3_MCA MCA power supply

1x 100 nF + 1x1 µF capacitors connected to GND are
placed close to this pin on ConnectCore 6 Plus SOM.

23 VSS - GND MCA ground

24 EXTAL0

PTA18

­UART1_RX
TPM_
CLKIN0

-

-

-

- PMIC_STBY_
REQ

Connected on ConnectCore 6 Plus SOM to i.MX6QP
processor signal PMIC_STBY_REQ (ball F11) and PMIC
signal SYS_EN/GPIO8 (ball B9).

ConnectCore 6 Plus Hardware Reference Manual

25

About the ConnectCore 6 Plus MCA hardware

MCA ConnectCore 6 Plus

PinNrSignal

name

25 XTAL0

PTA19

­UART1_TX
TPM_
CLKIN1

­LPTMR0_
ALT1

-

26 RESET_b

PTA20

27 ADC0_SE8

PTB0/LLWU_
P5
I2C0_SCL
TPM1_CH0

-

-

-

-

Pad
Nr Signal name Usage on module

T20 MCA_IO24 Not used on module.

N23 #MCA_RESET Not used on module.

R23 MCA_IO2 Not used on module.

28 ADC0_SE9

PTB1
I2C0_SDA
TPM1_CH1

-

-

-

-

29 ADC0_SE12

PTB2
I2C0_SCL
TPM2_CH0

-

-

-

-

30 ADC0_SE13

PTB3
I2C0_SDA
TPM2_CH1

-

-

-

-

H21 NANDF_

CS1/#MCA_INT

- INTERNAL_
I2C_SCL

- INTERNAL_
I2C_SDA

Connected to i.MX6QP processor signal NANDF_CS1
(ball C16).

Connected directly to PMIC I2C_SCL signal and to
i.MX6QP processor I2C2_SCL/KEY_COL3 signal (ball
U5) over N-channel MOSFET.

Connected directly to PMIC I2C_SDA signal and to
i.MX6QP processor I2C2_SDA/KEY_ROW3 signal (ball
T7) over N-channel MOSFET.

ConnectCore 6 Plus Hardware Reference Manual

26

About the ConnectCore 6 Plus MCA hardware

MCA ConnectCore 6 Plus

PinNrSignal

name

31 -

PTB16
SPI1_MOSI
UART0_RX
TPM_
CLKIN0
SPI1_MISO

-

-

32 -

PTB17
SPI1_MISO
UART0_TX
TPM_
CLKIN1
SPI1_MOSI

-

-

33 ADC0_SE14

PTC0

­EXTRG_IN

­CMP0_OUT

-

-

Pad
Nr Signal name Usage on module

N22 MCA_IO7 Not used on module.

P22 MCA_IO8 Not used on module.

U24 MCA_IO4 Not used on module.

34 ADC0_SE15

PTC1/LLWU_
P6/RTC_
CLKIN
I2C1_SCL

­TPM0_CH0

-

-

-

35 ADC0_SE11

PTC2
I2C1_SDA

­TPM0_CH1

-

-

-

- KINETIS_32K This MCA pin is connected to 32K output of the PMIC.

For KL14, KL15, KL24 and KL25 this pin can be
configured as RTC_CLKIN signal.

R22 MCA_IO9 Not used on module.

ConnectCore 6 Plus Hardware Reference Manual

27

About the ConnectCore 6 Plus MCA hardware

MCA ConnectCore 6 Plus

PinNrSignal

name

36 -

PTC3/LLWU_
P7

­UART1_RX
TPM0_CH2
CLKOUT

-

-

37 -

PTC4/LLWU_
P8
SPI0_PCS0
UART1_TX
TPM0_CH3

-

-

-

38 -

PTC5/LLWU_
P9
SPI0_SCK
LPTMR0_
ALT2

-

­CMP0_OUT

-

Pad
Nr Signal name Usage on module

T22 MCA_IO10 Not used on module.

U22 MCA_IO11 Not used on module.

M21 MCA_IO12 Not used on module.

39 CMP0_IN0

PTC6/LLWU_
P10
SPI0_MOSI
EXTRG_IN

­SPI0_MISO

-

-

40 CMP0_IN1

PTC7
SPI0_MISO

-

­SPI0_MOSI

-

-

N21 MCA_IO13 Not used on module.

R20 MCA_IO19 Not used on module.

ConnectCore 6 Plus Hardware Reference Manual

28

About the ConnectCore 6 Plus MCA hardware

MCA ConnectCore 6 Plus

PinNrSignal

name

41 -

PTD0
SPI0_PCS0

­TPM0_CH0

-

-

-

42 ADC0_SE5b

PTD1
SPI0_SCK

­TPM0_CH1

-

-

-

43 -

PTD2
SPI0_MOSI
UART2_RX
TPM0_CH2
SPI0_MISO

-

-

Pad
Nr Signal name Usage on module

A6 CSI0_

DAT11/ECSPI2_
SS0

D6 CSI0_

DAT8/ECSPI2_
SCLK

K5 CSI0_

DAT10/ECSPI2_
MISO

Connected to i.MX6QP processor signal CSI0_DAT11
(ball M3) and to LGA pad A6.
This pin can be configured as a SPI chip select shared
between MCA and i.MX6QP processor.

Connected to i.MX6QP processor signal CSI0_DAT8
(ball N6) and to LGA pad D6.
This pin can be configured as a SPI clock shared
between MCA and i.MX6QP processor.

Connected to i.MX6QP processor signal CSI0_DAT10
(ball M1) and to LGA pad K5.
This pin can be configured as a SPI MISO shared
between MCA and i.MX6QP processor.

44 -

45 -

PTD3
SPI0_MISO
UART2_TX
TPM0_CH3
SPI0_MOSI

-

-

PTD4/LLWU_
P14
SPI1_PCS0
UART2_RX
TPM0_CH4

-

-

-

D5 CSI0_

DAT9/ECSPI2_
MOSI

R21 MCA_IO16 Not used on module.

Connected to i.MX6QP processor signal CSI0_DAT9
(ball N5) and to LGA pad D5.
This pin can be configured as a SPI MOSI shared
between MCA and i.MX6QP processor.

ConnectCore 6 Plus Hardware Reference Manual

29

About the ConnectCore 6 Plus MCA hardware

MCA ConnectCore 6 Plus

PinNrSignal

name

46 ADC0_SE6b

PTD5
SPI1_SCK
UART2_TX
TPM0_CH5

-

-

-

47 ADC0_SE7b

PTD6/LLWU_
P15
SPI1_MOSI
UART0_RX

­SPI1_MISO

-

-

48 -

PTD7
SPI1_MISO
UART0_TX

­SPI1_MOSI

-

-

Pad
Nr Signal name Usage on module

T21 MCA_IO22 Not used on module.

T24 MCA_IO3 Not used on module.

AA20 MCA_IO21 Not used on module.

The i.MX6QP pads listed above are connected to ConnectCore 6 Plus pads. If the MCA microcontroller
firmware doesn’t use these signals, they are available on the carrier board and can be used in any of
the alternative functions listed above.

ConnectCore 6 Plus Hardware Reference Manual

30