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ConnectCore 6 Plus Hardware Reference Manual
2
Contents
About the ConnectCore 6 Plus
Features and functionality6
Block diagram7
Power supply architecture8
Bootstrap13
Wireless interfaces14
WLAN IEEE 802.11a/b/g/n/ac15
Modulation and data rates15
RF channels17
Receive sensitivity19
Transmit power19
Bluetooth20
MCA hardware20
Supported devices20
MCA pinout22
Shared I2C bus31
Shared SPI bus32
CryptoAuthentication device33
Module pinout34
Signal usage limitations84
Specifications for the ConnectCore 6 Plus
Electrical characteristics87
Voltage supplies87
Power consumption87
Power consumption use cases87
Global power consumption88
Mechanical specifications88
Coplanarity94
SMT pick and place94
SMT process parameter reference94
Reflow profile94
Regulatory information and certifications
United States FCC97
Labeling requirements97
Maximum power and frequency specifications (FCC)98
FCC notices99
FCC-approved antennas99
RF exposure100
Canada (ISED)100
Maximum power and frequency specifications100
Labeling requirements100
Transmitters with detachable antennas101
Europe ETSI101
Maximum power and frequency specifications (Europe ETSI)102
OEM labeling requirements104
CE labeling requirements104
Declarations of Conformity104
Approved antennas104
Bluetooth SIG-qualified hardware and firmware104
ConnectCore 6 Plus Hardware Reference Manual
4
About the ConnectCore 6 Plus
The ConnectCore 6 Plus is an ultra-compact and highly integrated system-on-module solution based
on the NXP i.MX6QP Cortex-A9 processor family.
With processor speed up to 1.0 GHz, the ConnectCore 6 Plus offers a truly future-proof platform
solution with scalable performance and pre-certified dual-band Wi-Fi (802.11a/b/g/n/ac) with
Bluetooth 4.2 dual mode connectivity.
Its innovative and scalable design maximizes integration flexibility and significantly reduces design
risk in a highly cost-effective, reliable, low-profile surface mount form factor with optimal thermal
management even in the most demanding quad-core system configurations.
Seamless Cloud Connector integration as part of the Digi Linux and Android software platform support
offers secure remote management and web services capabilities through the scalable Digi Remote
Manager.
In addition, Digi offers custom Remote Manager hardware and wireless design services as well as endto-end solutions services for cloud integration and app development.
This System-On-Module aims to be the next generation of the ConnectCore 6 Plus for i.MX6 family
modules and is pin-to-pin compatible with them.
Features and functionality6
Block diagram7
Power supply architecture8
Bootstrap13
Wireless interfaces14
MCA hardware20
CryptoAuthentication device33
Module pinout34
Signal usage limitations84
ConnectCore 6 Plus Hardware Reference Manual
5
About the ConnectCore 6 PlusFeatures and functionality
Note To serve our customers most effectively, Digi International Inc. has consolidated our cloud
services, Digi Device Cloud and Digi Remote Manager®, under the Remote Manager name. This phased
process does not affect device functionality or the functionality of the web services and other
features. However, you will find instances of both Device Cloud and Digi Remote Manager in some
documentation, firmware, and user interfaces.
Features and functionality
The ConnectCore 6 Plus module is based on the i.MX6QP processor from NXP. This processor offers a
high number of interfaces. Most of these interfaces are multiplexed and are not available
simultaneously. The module has the following features:
n i.MX6QP ARM Cortex-A9 cores operating at speed up to 1.0 GHz
l 32 Kbytes L1 Instruction cache
l 32 Kbytes L1 Data cache
l Up to 1 MB unified Instruction/Data L2 cache
l NEON MPE (Media Processing Engine) co-processor
n Graphical hardware accelerators:
l IPU (Image Processing Unit)
l VPU (Video Processing Unit)
l 3D GPU (Graphics Processing Unit) version 6
l 2D GPU (Graphics Processing Unit) version 3
l GPU (OpenVG 1.1 Graphics Processing Unit)
l Prefetch and Resolve Engine
l Prefetch and Resolve Gasket
l ASRC (Asynchronous Sample Rate Converter)
n 64-bit DDR3-1066 memory interface with a density up to 2 GBytes
n 8-bit eMMC support
n Dialog DA9063 power management IC (PMIC)
l 6x DC/DC buck converters
l 11x LDO regulators
l RTC with rechargeable coin cell battery support
l 10-bit ADC channels
l GPIO pins
n IEEE 802.11 a/b/g/n/ac WLAN interface
n Bluetooth version 4.2 dual mode
n Cortex-M0+/Cortex-M4 MCA (Microcontroller Assist) subsystem
ConnectCore 6 Plus Hardware Reference Manual
6
About the ConnectCore 6 PlusBlock diagram
n Debug interfaces:
l Standard JTAG controller IEEE 1149.1
l ETM/ETB support
n Support of i.MX6QP typical interfaces:
l 16/32-bit data/address bus
l SATA II, 3.0 Gbps (24-bit parallel bus, LVDS, HDMI, MIPI/DSI)
l Display support
o
HDMI
o
24-bit parallel bus
o
Dual LVDS
o
MIPI/DSI
l 2x camera (20-bit parallel bus, MIPI/CSI)
l MMC/SD/SDIO
l 1x USB OTG with integrated PHY
l 3x USB Host
l PCI Express Gen 2.0 lane
l 10/100/1000 M Ethernet MAC
l UART, SPI, I2C, PWM, CAN, I2S and GPIO
n Ultra-miniature SMT module (50x50mmx5mm) based on 400-LGA pads
n Security accelerators:
l ARMTrustZone
l CAAM (cryptographic acceleration and assurance module)
l SNVS (secure non-volatile storage)
l CSU (central security unit)
l A-HABv4 (advanced high-assurance boot)
Block diagram
The figure below shows the block diagram of the NXP i.MX6QP application processor.
ConnectCore 6 Plus Hardware Reference Manual
7
About the ConnectCore 6 PlusPower supply architecture
Power supply architecture
The ConnectCore 6 Plus provides a primary 5 V power supply input. This supply is the main power
domain to the on-module Dialog DA9063 power management IC (PMIC), which generates all required
supply voltages for the module components as well as the carrier board.
The module provides support for a backup battery (coin-cell or super cap) powering the real-time
clock (RTC) on the module. In addition, rechargeable backup batteries (ML414, others) are also
supported.
The PMIC generates the following power domains that are available on the module pads:
n One PMIC switching regulator:
l VGEN_3V3
ConnectCore 6 Plus Hardware Reference Manual
8
About the ConnectCore 6 PlusPower supply architecture
n Five PMIC LDO:
l VLDO2
l VLDO3_MCA
l VLDO4
l VLDO6
l VLDO8
l VDD_SD2
l VDD_WLAN_SD1
Signal
name
VGEN_
Turn
PMIC
regulator
Output
voltage
Output
accuracy
Maximum
current
Dropout
voltage
(MAX)
Turn on
time
(MAX)
off
time
(MAX)
BUCKPERI 3.3 V+/-3%1500 mA-1 µA1.2 ms-
Quiescent
current in
OFF mode
(TYP)
3V3
Note The maximum current consumption mentioned in the previous table is a combination of the
current consumed by the module (max 500mA) and by the carrier board for external use (1000mA).
The table below provides the characteristics of the optional LDO outputs:
Signal
name
PMIC
regulator
Output
voltage
VLDO2LDO20.6-
Drop output
Output
accuracy
Default
voltage
Maximum
current
voltage
(MAX)
+/-3%1.8 V200 mA150 mV
Quiescent current
in OFF mode
(TYP)
1 µA
1.86 V
VLDO3_
MCA
VLDO4LDO40.9-
LDO30.9-
3.44 V
+/-3%3.3 V200 mA150 mV1 µA
+/-3%3.3 V200 mA150 mV1 µA
3.44 V
VLDO6LDO60.9-3.6V+/-3%3.3 V200 mA150 mV1 µA
VLDO8LDO80.9-3.6V+/-3%3.3 V200 mA150 mV1 µA
VDD_
SD2
VDD_
LDO90.95 -
+/-1%3.3 V200 mA150 mV
3.6 V
LDO100.9 - 3.6V+/-3%3.3 V300 mA150 mV
WLAN_
SD1
ConnectCore 6 Plus Hardware Reference Manual
1 µA
1 µA
9
About the ConnectCore 6 PlusPower supply architecture
Signal nameTurn on time (MAX) Turn off time (MAX)
VLDO2
150 µs
1 ms
VLDO3_MCA300 µs1 ms
VLDO4300 µs1 ms
VLDO6200 µs1 ms
VLDO8300 µs1 ms
VDD_SD2200 µs1 ms
VDD_WLAN_SD1 200 µs1 ms
Note For information about using the LDO options, please contact Digi.
VLDO3 is used for supplying MCA processor on the module.
The power management IC located on the module is responsible for generating all required i.MX6QP
processor supply voltages. The following i.MX6QP supplies are available on the module pads:
n NVCC_ENET
n NVCC_EIM
n NVCC_LCD
n NVCC_CSI
n NVCC_RGMII
Some of the I/O supplies are set on the module. See the following table:
Power domainConnection
NVCC_GPIOVGEN_3V3
NVCC_JTAGVGEN_3V3
NVCC_NANDFVGEN_3V3
NVCC_SD1VDD_WLAN_SD1
NVCC_SD2VDD_SD2
NVCC_SD3VGEN_3V3
PCIE_VPH2.5V (VDDHIGH_CAP_2V5)
The remaining I/O voltages must be set externally and are left open on the ConnectCore 6 Plus
module. See the following table for operating ranges of the remaining I/O supplies.
Power domainMinMax
NVCC_ENET1.65 V 3.6 V
ConnectCore 6 Plus Hardware Reference Manual
10
About the ConnectCore 6 PlusPower supply architecture
Power domainMinMax
NVCC_EIM1.65 V 3.6 V
NVCC_LCD1.65 V 3.6 V
NVCC_CSI1.65 V 3.6 V
NVCC_RGMII in HSIC 1.2 V mode1.15 V 1.30 V
NVCC_RGMII in RGMII 1.5 V mode 1.43 V 1.58 V
NVCC_RGMII in RGMII 1.8 V mode 1.70 V 1.90 V
NVCC_RGMII in RGMII 2.5 V mode 2.25 V 2.625 V
As shown in the table above, the supplies have a wide operating range. In order to provide the most
cost-effective and flexible solution for a given use-case, the supplies listed in the table need to be
provided by the carrier board integrating the ConnectCore 6 Plus module. However, PMIC power
domains 3.3 V—and LDO2/3/4/6/8 options—are dedicated power sources for supplying i.MX6QP power
domains.
The MCU - assist specific power domain (VLDO3_MCA) available on the ConnectCore 6 Plus LGA pads is
a power supply output powering the on-module Kinetis processor.
ConnectCore 6 Plus Hardware Reference Manual
11
About the ConnectCore 6 PlusPower supply architecture
The following diagram outlines the power supply approach of the ConnectCore 6 Plus. Inputs are
marked red, blue marks are outputs.
ConnectCore 6 Plus Hardware Reference Manual
12
About the ConnectCore 6 PlusBootstrap
Bootstrap
The ConnectCore 6 Plus module can be configured to boot from different devices and interfaces
determined by the Boot ROM. The configuration of the CPU booting process is done through:
n BOOT_MODE register, which selects the boot mode of the processor
n eFUSEs and/or GPIOs, which determine the boot configuration
Four boot modes are available on the i.MX6QP processor. Selection between them is done through
BOOT_MODE[1:0] bits. The bits are externally configurable on two processor IOs, whose values are
latched during boot-up:
BOOT_MODE [1:0]Boot type
00Boot from fuses
01Serial downloader
10Internal boot (default)
11Reserved
BOOT_MODE[0] and BOOT_MODE[1] are available on dedicated pads on the module.
Note BOOT_MODE[1:0] is set internally to [10] through 10K pull-up and 10K pull-down resistors. So, by
default, the SOM is configured to Internal boot.
Boot from fuses
Boot from fuses is the recommended boot mode for production purposes. When this boot mode is
selected, you must configure several parameters in order to select and configure the system boot
device. These parameters are configured through fuses, which are burned in order to set their values.
This means that the configuration is irreversible.
BOOT_CFG1 register selects the boot device through BOOT_CFG1[7:4] bits:
BOOT_CFG1[7:4]Boot device
0000
0001Reserved
1xxxRaw NAND
0010SSD/Hard Disk (SATA)
010xSD/eSD/SDXC
0011Serial ROM (I2C/SPI)
NOR/OneNAND (EIM)
011xMMC/eMMC
ConnectCore 6 Plus Hardware Reference Manual
13
About the ConnectCore 6 PlusWireless interfaces
There are many other registers that configure the different boot devices. For a complete description
of the booting configuration, refer to the NXP i.MX6QP Applications Processor Reference Manual
(Chapter 8: System Boot).
Internal Boot
Internal boot is the recommended boot mode for development purposes. When this boot mode is
selected, the selection and configuration of the booting process is done through the same registers
used when booting from fuses. However, this time the values of some registers are overridden using
multiple GPIOs—which are latched during power-up.
The following configuration is done internally in the ConnectCore 6 Plus module in order to enable
booting from the internal eMMC memory:
Default
Bootstrap register bitCorresponding GPIO
BOOT_CFG1[4]EIM_DA410K pull-down
BOOT_CFG1[5]EIM_DA510K pull-up
BOOT_CFG1[6]EIM_DA610K pull-up
configuration
BOOT_CFG1[7]EIM_DA710K pull-down
BOOT_CFG2[3]EIM_DA1110K pull-up
BOOT_CFG2[4]EIM_DA1210K pull-up
BOOT_CFG2[5]EIM_DA1310K pull-down
BOOT_CFG2[6]EIM_DA1410K pull-up
By default, the system is configured to boot from MMC/eMMC (BOOT_CFG1[7:5] = 011). You can
externally change the configuration of these lines to select between different boot devices. To see a
detailed implementation of the boot configuration, check the ConnectCore 6 Plus carrier board
reference design.
CAUTION! Make sure that EIM_EB3 (pad AA18) is not pulled high during boot. Pulling this
signal high enables an infinite loop at start of boot ROM. This feature is exclusively used
for debugging purposes.
Wireless interfaces
The ConnectCore 6 Plus system-on-module combines a wireless local area network (WLAN) and
Bluetooth dual solution to support IEEE802.11 a/b/g/n/ac WLAN standards and Bluetooth 4.2, enabling
seamless integration of WLAN/Bluetooth and Low Energy technology.
The following sections include specifications for the wireless interfaces available on the i.MX6QP
module.
ConnectCore 6 Plus Hardware Reference Manual
14
About the ConnectCore 6 PlusWireless interfaces
WLAN IEEE 802.11a/b/g/n/ac
The 2.4 GHz band on the ConnectCore 6 Plus module supports 20/40 MHz bandwidths, and the 5 GHz
band supports 20/40/80 MHz bandwidths.
The following sections specify the performance of the WLAN IEEE 802.11a/b/g/n/ac interface on the
ConnectCore 6 Plus module.
Modulation and data rates
The following tables list modulation values for ConnectCore 6 Plusmodule supports the following
WLAN standards.
Mode
802.11bDBPSK1 Mbps
802.11ga BPSK-1/26 Mbps
802.11nBPSK-1/2MCS0
Modulation & coding
DQPSK2 Mbps
CCK5.5 Mbps
CCK11 Mbps
BPSK-3/49 Mbps
QPSK-1/212 Mbps
QPSK-3/418 Mbps
16QAM-1/224 Mbps
16QAM-3/436 Mbps
64QAM-2/348 Mbps
64QAM-3/454 Mbps
QPSK-1/2MCS1
Rate
QPSK-3/4MCS2
16QAM-1/2MCS3
16QAM-3/4MCS4
64QAM-2/3MCS5
64QAM-3/4MCS6
64QAM-5/6MCS7
ConnectCore 6 Plus Hardware Reference Manual
15
About the ConnectCore 6 PlusWireless interfaces
Mode
802.11ac BPSK-1/2MCS0
Modulation & coding
QPSK-1/2MCS1
QPSK-3/4MCS2
16QAM-1/2MCS3
16QAM-3/4MCS4
64QAM-2/3MCS5
64QAM-3/4MCS6
64QAM-5/6MCS7
256QAM-3/4MCS8
256QAM-5/6MCS9
Rate
Data rate (Mbps) - Non Short Guard Interval (Non-SGI)
Data rate
(Mbps)802.11b802.11ga802.11n802.11ac
ModulationDBPSK CCKBPSK-
1/2
64QAM3/4
BPSK1/2
64QAM5/6
BPSK1/2
64QAM5/6
256QAM5/6
1
Mbps11Mbps6Mbps54Mbps
2.4
GHz
5 GHz HT206546.5656.565
HT201116546.5656.565
HT4013.513513.5135180
HT4013.513513.5135180
HT8029.3292.5390
MCS0MCS7MCS0MCS7MCS9
Data rate (Mbps) - Short Guard Interval (SGI)
Mode
ModulationDBPSK CCKBPSK-
2.4
GHz
HT201116547.272.27.272.2
HT401515015150200
802.11b802.11ga802.11n802.11ac
64QAM-
1/2
1
Mbps11Mbps6Mbps54Mbps
3/4
BPSK1/2
MCS0MCS7MCS0MCS7MCS9
64QAM5/6
BPSK1/2
64QAM5/6
256QAM5/6
ConnectCore 6 Plus Hardware Reference Manual
16
About the ConnectCore 6 PlusWireless interfaces
Mode
5 GHz HT206547.272.27.272.2
HT401515015150200
HT8032.5325433.3
802.11b802.11ga802.11n802.11ac
RF channels
The ConnectCore 6 Plus module supports the following frequency bands.
Note See Regulatory information and certifications for further details about available RF channels and
their maximum transmit power.
2.4 GHz
2.4 GHz band
channel #
12412✔✔✔
22417✔✔✔
32422✔✔✔
Center frequency
(MHz)
EUROPE
(ETSI)
NORTH AMERICA
(FCC)JAPAN
ConnectCore 6 Plus Hardware Reference Manual
17
About the ConnectCore 6 PlusWireless interfaces
2.4 GHz band
channel #
42427✔✔✔
52432✔✔✔
62437✔✔✔
72442✔✔✔
82447✔✔✔
92452✔✔✔
102457✔✔✔
112462✔✔✔
122467✔No✔
132472✔No✔
142484NoNo802.11b only
Center frequency
(MHz)
EUROPE
(ETSI)
NORTH AMERICA
(FCC)JAPAN
5 GHz
5 GHz band
channel #Center frequency (MHz) EUROPE (ETSI)NORTH AMERICA (FCC) JAPAN
365180Indoors✔✔
405200Indoors✔✔
445220Indoors✔✔
485240Indoors✔✔
525260Indoors / DFS / TPC DFSDFS / TPC
565280Indoors / DFS / TPC DFSDFS / TPC
605300Indoors / DFS / TPC DFSDFS / TPC
645320Indoors / DFS / TPC DFSDFS / TPC
1005500DFS / TPCDFSDFS / TPC
1045520DFS / TPCDFSDFS / TPC
1085540DFS / TPCDFSDFS / TPC
1125560DFS / TPCDFSDFS / TPC
1165580DFS / TPCDFSDFS / TPC
1205600DFS / TPCNo AccessDFS / TPC
1245620DFS / TPCNo AccessDFS / TPC
ConnectCore 6 Plus Hardware Reference Manual
18
About the ConnectCore 6 PlusWireless interfaces
5 GHz band
channel #Center frequency (MHz) EUROPE (ETSI)NORTH AMERICA (FCC) JAPAN
1285640DFS / TPCNo AccessDFS / TPC
1325660DFS / TPCDFSDFS / TPC
1365680DFS / TPCDFSDFS / TPC
1405700DFS / TPCDFSDFS / TPC
1495745SRD✔No Access
1535765SRD✔No Access
1575785SRD✔No Access
1615805SRD✔No Access
1655825SRD✔No Access
Note
DFS = Dynamic Frequency Selection
TPC = Transmit Power Control
SRD = Short Range Devices 25 mW max power
Receive sensitivity
The following table lists typical receive sensitivity values for the ConnectCore 6 Plus module.
Mode802.11b802.11ga802.11n802.11ac
ModulationDBPSK CCKBPSK-
1/2
1
Mbps11Mbps
2.4
GHz
5 GHz HT20---90-75-82-64-82-64-
Note Specification is subject to change.
HT20-90-88-90-75-82-64-82-64-
HT40-----79-61-79-61-54
HT40-----79-61-79-61-54
HT80-------76-58-51
6 Mbps 54 MbpsMCS0MCS7MCS0MCS7MCS9
64QAM3/4
BPSK1/2
64QAM5/6
BPSK1/2
64QAM5/6
256QAM5/6
Transmit power
The following table lists nominal transmit power values for the ConnectCore 6 Plus module.
ConnectCore 6 Plus Hardware Reference Manual
19
About the ConnectCore 6 PlusMCA hardware
RF Band Channel BW Standard Output Power (dBm)
2.4 GHz20 MHz802.11b18 (1Mbps) - 18 (11Mbps)
20 MHz802.11g18 (6Mbps) - 16 (54Mbps)
20 MHz802.11n18 (MCS0) - 15 (MCS7)
40 MHz802.11n17 (MCS0) - 15 (MCS7)
40 MHz802.11ac17 (MCS0) - 13 (MCS9)
5 GHz20 MHz802.11a13 (6Mbps) - 11 (54Mbps)
20 MHz802.11n13 (MCS0) - 10 (MCS7)
40 MHz802.11n12 (MCS0) - 9 (MCS7)
40 MHz802.11ac12 (MCS0) - 5 (MCS9)
80 MHz802.11ac11 (MCS0) - 4 (MCS9)
Note See Regulatory information and certifications for further details about available RF channels and
their maximum transmit power.
Note Due to manufacturing tolerance these nominal output powers may be reduced up to 3 dB.
Bluetooth
The ConnectCore 6 Plus module supports both Bluetooth and Bluetooth Low Energy protocols:
n Bluetooth 4.2; backwards compatible with Bluetooth 1.X, 2.X + Enhanced Data Rate, Bluetooth
3.X, Bluetooth 4.0 and Bluetooth 4.1 Bluetooth class 1 and class 2 power-level transmissions
n Integrated WLAN-Bluetooth coexistence
Note See Bluetooth SIG-qualified hardware and firmware for more information.
MCA hardware
Supported devices
The ConnectCore 6 Plus module is designed to support a Kinetis processor in a QFN48 package. See
below for a list of compatible Kinetis processors that can be used in this package size:
n MKL14Z32VFT4
n MKL14Z64VFT4
n MKL15Z128VFT4
n MKL15Z32VFT4
n MKL15Z64VFT4
n MKL24Z32VFT4
ConnectCore 6 Plus Hardware Reference Manual
20
About the ConnectCore 6 PlusMCA hardware
n MKL24Z64VFT4
n MKL25Z128VFT4
n MKL25Z32VFT4
n MKL25Z64VFT4
n MKL26Z128VFT4
n MKL26Z64VFT4
n MKL26Z32VFT4
n K10P48M50SF0
n K20P48M50SF0
By default, NXP MKL14Z32VFT4 is populated on the module variants supporting the MCA unit.
ConnectCore 6 Plus Hardware Reference Manual
21
About the ConnectCore 6 PlusMCA hardware
MCA pinout
The table below contains the pinouts for the MCA unit on ConnectCore 6 Plus module. The pinout
information assumes the use of NXP MKL14Z32VFT4 microcontroller. Using a different Kinetis
microcontroller may change the functions available on the MCA pins.
MCAConnectCore 6 Plus
PinNrSignal
name
1VDD-LDO3_MCAMCA power supply
2VSS-GNDMCA ground
3ADC0_SE1
PTE16
SPI0_PCS0
UART2_TX
TPM_
CLKIN0
-
-
-
4ADC0_SE5a
PTE17
SPI0_SCK
UART2_RX
TPM_
CLKIN1
LPTMR0_
ALT3
-
Pad
NrSignal nameUsage on module
1x 100nF + 1x1µF capacitors connected to GND are
placed close to this pin on ConnectCore 6 Plus SOM.
N20MCA_IO/USB0_PNot used on module.
For KL24, KL25 and K20 processors, this pin is USB0_
DP.
MCA_IO/USB0_P (N20) and MCA_IO/USB0_N (P20)
have been routed as differential pair for supporting
USB functionality on KL24, KL25 and K20 processors.
P20MCA_IO/USB0_NNot used on module.
For KL24, KL25 and K20 processors, this pin is USB0_
DN.
MCA_IO/USB0_P (N20) and MCA_IO/USB0_N (P20)
have been routed as differential pair for supporting
USB functionality on KL24, KL25 and K20 processors.
5ADC0_SE2
PTE18
SPI0_MOSI
I2C0_SDA
SPI0_MISO
-
-
ConnectCore 6 Plus Hardware Reference Manual
Y22MCA_IO27Not used on module.
For KL24 and K20 processors, this pin is VOUT33.
ConnectCore 6 Plus SOM has a 0R resistor foreseen on
this pin for connecting this signal to LDO3_MCA. By
default, the resistor is not populated and MCA_IO27 is
available on module pad.
22
About the ConnectCore 6 PlusMCA hardware
MCAConnectCore 6 Plus
PinNrSignal
name
6ADC0_SE6a
PTE19
SPI0_MISO
I2C0_SCL
SPI0_MOSI
-
-
7ADC0_SE0
PTE20
TPM1_CH0
UART0_TX
-
-
-
8ADC0_SE4a
PTE21
TPM1_CH1
UART0_RX
-
-
-
Pad
NrSignal nameUsage on module
P21MCA_IO14Not used on module.
T23MCA_IO0Not used on module.
P23MCA_IO1Not used on module.
9VDDA-LDO3_MCAMCA power supply
A 100 nF capacitor connected to GND is placed close to
this pin on ConnectCore 6 Plus SOM.
10VREFHAC10 MCA_VREFHNot used on module.
A 100 nF capacitor connected to GND is placed close to
this pin on ConnectCore 6 Plus SOM.
11VREFL-GNDMCA ground
12VSSA-GNDMCA ground
13CMP0_
IN5/ADC0_
SE4b
PTE29
TPM0_CH2
TPM_
CLKIN0
-
-
-
Y23MCA_IO23Not used on module.
ConnectCore 6 Plus Hardware Reference Manual
23
About the ConnectCore 6 PlusMCA hardware
MCAConnectCore 6 Plus
PinNrSignal
name
14ADC0_
SE23/CMP0_
IN4
PTE30
TPM0_CH3
TPM_
CLKIN1
-
-
-
15-
PTE24
TPM0_CH0
I2C0_SCL
-
-
16-
PTE25
TPM0_CH1
I2C0_SDA
-
-
Pad
NrSignal nameUsage on module
--This MCA pin is connected to the gate of an N-channel
MOSFET. A 10K pull-down resistor is connected to GND
on this signal too. The drain of the MOSFET is
connected to ConnectCore 6 Plus signal ON/OFF (pad
D18). The source of the MOSFET is connected to GND.
This signal is reserved on the module and allows MCA
to control ON/OFF signal over software.
-KINETIS_32KThis MCA pin is connected to 32K output of the PMIC.
It’s the clock input of the MCA processor.
AC21 MCA_IO28Not used on module.
For K10 and K20 processors, this pin is VBAT.
ConnectCore 6 Plus SOM has a 0R resistor foreseen on
this pin for connecting this signal to LDO3_MCA. By
default, the resistor is not populated and MCA_IO28 is
available on module pad.
1x 100 nF + 1x1 µF capacitors connected to GND are
placed close to this pin on ConnectCore 6 Plus SOM.
17-
18-
L23MCA_SWD_CLKNot used on module.
PTA0
TPM0_CH5
-
-
SWD_CLK
AA22 MCA_IO25Not used on module.
PTA1
UART0_RX
TPM2_CH0
-
-
-
-
ConnectCore 6 Plus Hardware Reference Manual
24
About the ConnectCore 6 PlusMCA hardware
MCAConnectCore 6 Plus
PinNrSignal
name
19-
PTA2
UART0_TX
TPM2_CH1
-
-
-
-
20-
PTA3
I2C1_SCL
TPM0_CH0
-
-
SWD_DIO
21-
PTA4
I2C1_SDA
TPM0_CH1
-
-
NMI_b
Pad
NrSignal nameUsage on module
AA23 MCA_
IO6/PMIC_GP_
FB2
M23MCA_SWD_DIONot used on module.
AA21 MCA_IO26Not used on module.
Connected on ConnectCore 6 Plus SOM to PMIC signal
GP_FB2.
22VDD-LDO3_MCAMCA power supply
1x 100 nF + 1x1 µF capacitors connected to GND are
placed close to this pin on ConnectCore 6 Plus SOM.
23VSS-GNDMCA ground
24EXTAL0
PTA18
UART1_RX
TPM_
CLKIN0
-
-
-
-PMIC_STBY_
REQ
Connected on ConnectCore 6 Plus SOM to i.MX6QP
processor signal PMIC_STBY_REQ (ball F11) and PMIC
signal SYS_EN/GPIO8 (ball B9).
ConnectCore 6 Plus Hardware Reference Manual
25
About the ConnectCore 6 PlusMCA hardware
MCAConnectCore 6 Plus
PinNrSignal
name
25XTAL0
PTA19
UART1_TX
TPM_
CLKIN1
LPTMR0_
ALT1
-
26RESET_b
PTA20
27ADC0_SE8
PTB0/LLWU_
P5
I2C0_SCL
TPM1_CH0
-
-
-
-
Pad
NrSignal nameUsage on module
T20MCA_IO24Not used on module.
N23#MCA_RESETNot used on module.
R23MCA_IO2Not used on module.
28ADC0_SE9
PTB1
I2C0_SDA
TPM1_CH1
-
-
-
-
29ADC0_SE12
PTB2
I2C0_SCL
TPM2_CH0
-
-
-
-
30ADC0_SE13
PTB3
I2C0_SDA
TPM2_CH1
-
-
-
-
H21NANDF_
CS1/#MCA_INT
-INTERNAL_
I2C_SCL
-INTERNAL_
I2C_SDA
Connected to i.MX6QP processor signal NANDF_CS1
(ball C16).
Connected directly to PMIC I2C_SCL signal and to
i.MX6QP processor I2C2_SCL/KEY_COL3 signal (ball
U5) over N-channel MOSFET.
Connected directly to PMIC I2C_SDA signal and to
i.MX6QP processor I2C2_SDA/KEY_ROW3 signal (ball
T7) over N-channel MOSFET.
ConnectCore 6 Plus Hardware Reference Manual
26
About the ConnectCore 6 PlusMCA hardware
MCAConnectCore 6 Plus
PinNrSignal
name
31-
PTB16
SPI1_MOSI
UART0_RX
TPM_
CLKIN0
SPI1_MISO
-
-
32-
PTB17
SPI1_MISO
UART0_TX
TPM_
CLKIN1
SPI1_MOSI
-
-
33ADC0_SE14
PTC0
EXTRG_IN
CMP0_OUT
-
-
Pad
NrSignal nameUsage on module
N22MCA_IO7Not used on module.
P22MCA_IO8Not used on module.
U24MCA_IO4Not used on module.
34ADC0_SE15
PTC1/LLWU_
P6/RTC_
CLKIN
I2C1_SCL
TPM0_CH0
-
-
-
35ADC0_SE11
PTC2
I2C1_SDA
TPM0_CH1
-
-
-
-KINETIS_32KThis MCA pin is connected to 32K output of the PMIC.
For KL14, KL15, KL24 and KL25 this pin can be
configured as RTC_CLKIN signal.
R22MCA_IO9Not used on module.
ConnectCore 6 Plus Hardware Reference Manual
27
About the ConnectCore 6 PlusMCA hardware
MCAConnectCore 6 Plus
PinNrSignal
name
36-
PTC3/LLWU_
P7
UART1_RX
TPM0_CH2
CLKOUT
-
-
37-
PTC4/LLWU_
P8
SPI0_PCS0
UART1_TX
TPM0_CH3
-
-
-
38-
PTC5/LLWU_
P9
SPI0_SCK
LPTMR0_
ALT2
-
CMP0_OUT
-
Pad
NrSignal nameUsage on module
T22MCA_IO10Not used on module.
U22MCA_IO11Not used on module.
M21MCA_IO12Not used on module.
39CMP0_IN0
PTC6/LLWU_
P10
SPI0_MOSI
EXTRG_IN
SPI0_MISO
-
-
40CMP0_IN1
PTC7
SPI0_MISO
-
SPI0_MOSI
-
-
N21MCA_IO13Not used on module.
R20MCA_IO19Not used on module.
ConnectCore 6 Plus Hardware Reference Manual
28
About the ConnectCore 6 PlusMCA hardware
MCAConnectCore 6 Plus
PinNrSignal
name
41-
PTD0
SPI0_PCS0
TPM0_CH0
-
-
-
42ADC0_SE5b
PTD1
SPI0_SCK
TPM0_CH1
-
-
-
43-
PTD2
SPI0_MOSI
UART2_RX
TPM0_CH2
SPI0_MISO
-
-
Pad
NrSignal nameUsage on module
A6CSI0_
DAT11/ECSPI2_
SS0
D6CSI0_
DAT8/ECSPI2_
SCLK
K5CSI0_
DAT10/ECSPI2_
MISO
Connected to i.MX6QP processor signal CSI0_DAT11
(ball M3) and to LGA pad A6.
This pin can be configured as a SPI chip select shared
between MCA and i.MX6QP processor.
Connected to i.MX6QP processor signal CSI0_DAT8
(ball N6) and to LGA pad D6.
This pin can be configured as a SPI clock shared
between MCA and i.MX6QP processor.
Connected to i.MX6QP processor signal CSI0_DAT10
(ball M1) and to LGA pad K5.
This pin can be configured as a SPI MISO shared
between MCA and i.MX6QP processor.
44-
45-
PTD3
SPI0_MISO
UART2_TX
TPM0_CH3
SPI0_MOSI
-
-
PTD4/LLWU_
P14
SPI1_PCS0
UART2_RX
TPM0_CH4
-
-
-
D5CSI0_
DAT9/ECSPI2_
MOSI
R21MCA_IO16Not used on module.
Connected to i.MX6QP processor signal CSI0_DAT9
(ball N5) and to LGA pad D5.
This pin can be configured as a SPI MOSI shared
between MCA and i.MX6QP processor.
ConnectCore 6 Plus Hardware Reference Manual
29
About the ConnectCore 6 PlusMCA hardware
MCAConnectCore 6 Plus
PinNrSignal
name
46ADC0_SE6b
PTD5
SPI1_SCK
UART2_TX
TPM0_CH5
-
-
-
47ADC0_SE7b
PTD6/LLWU_
P15
SPI1_MOSI
UART0_RX
SPI1_MISO
-
-
48-
PTD7
SPI1_MISO
UART0_TX
SPI1_MOSI
-
-
Pad
NrSignal nameUsage on module
T21MCA_IO22Not used on module.
T24MCA_IO3Not used on module.
AA20 MCA_IO21Not used on module.
The i.MX6QP pads listed above are connected to ConnectCore 6 Plus pads. If the MCA microcontroller
firmware doesn’t use these signals, they are available on the carrier board and can be used in any of
the alternative functions listed above.
ConnectCore 6 Plus Hardware Reference Manual
30
About the ConnectCore 6 PlusMCA hardware
Shared I2C bus
The screenshot below shows how the I2C bus (I2C2) is used on ConnectCore 6 Plus module. The bus is
shared between i.MX6QP processor and the PMIC, the MCA, and the cryptochip. The usage of Nchannel MOSFET ensures the bus is fully isolated and allows the i.MX6QP processor to be shut off
while MCA and PMIC are powered.
ConnectCore 6 Plus Hardware Reference Manual
31
About the ConnectCore 6 PlusMCA hardware
Shared SPI bus
In addition to an I2C interface, i.MX6QP shares an SPI bus with the MCA microcontroller. The table
below shows this connection:
SPI functioni.MX6QP padMCA I/O
SPI Chip Select CSI0_DAT11 (ConnectCore 6 Plus LGA pad
About the ConnectCore 6 PlusCryptoAuthentication device
CryptoAuthentication device
The ConnectCore 6 Plus includes an Atmel CryptoAuthentication Device. This is a highly secure
cryptographic co-processor with secure hardware-based key storage. It includes the following
features:
n Performs high-speed public key (PKI) algorithms (ECDSA and ECDH).
n NIST standard P256 elliptic curve support.
n SHA-256 hash algorithm with HMAC option.
n 256-bit key length.
n Storage for up to 16 keys.
n Two high-endurance monotonic counters.
n Guaranteed unique 72-bit serial number.
n Internal High-quality FIPS Random Number Generator (RNG).
n 10 Kb EEPROM memory.
See the software documentation for information about supported cryptoauthentication features.
ConnectCore 6 Plus Hardware Reference Manual
33
About the ConnectCore 6 PlusModule pinout
Module pinout
The module has a LGA pad structure based on 400 pads. See the following diagram for the general
layout, which shows the top view of the module pinouts.
The following table provides the pinout of the ConnectCore 6 Plus module.
Additional timing and electrical information can be found in either NXP i.MX6QP processor datasheet
(www.nxp.com) or in Dialog DA9063 product datasheet (www.dialog-semiconductor.com).
module.
For K10 and K20
processors, this
pin is VBAT.
ConnectCore 6
Plus SOM has an
0R resistor
foreseen on this
pin for connecting
this signal to
LDO3_MCA. By
default, the
resistor is not
populated and
MCA_IO28 is
available on
module pad.
1x 100nF + 1x1µF
capacitors
connected to GND
are placed close to
this pin on
ConnectCore 6
Plus SOM.
Note Electrical and timing characteristics of the processor (i.MX6QuadPlus), PMIC (DA9063), and MCA
(MKL14Z32VFT4) can be found in the corresponding datasheets, which are publicly available from the
manufacturer.
Signal usage limitations
The following signals available on ConnectCore 6 Plus pads have a limited usage:
NVCC_EIM
NVCC_EIM
n SD1_CLK (pad L21), SD1_CMD (pad J23), SD1_DAT[3:0] (pads L20, J21, J22 and N24) are used
internally by the wireless, so they can't be used externally.
n SD3_DAT4/BT_UART_RXD (pad C22), SD3_DAT5/BT_UART_TXD (pad D23), SD3_CLK/BT_UART_
RTS (B21), SD3_CMD/BT_UART_CTS (pad E23) are used internally by the Bluetooth, so they
can't be used externally.
n I2C2_SCL/KEY_COL3 (pad C3) and I2C2_SDA/KEY_ROW3 (pad F2) re used internally in the
module for interconnecting the CPU with the PMIC, the MCA, and the cryptochip. Using these
signals externally should be done with caution, since it could prevent the module from working
properly. It is recommended that you use another I2C port for connecting external devices to
the ConnectCore 6 Plus i.MX6QP module in order to avoid excessive bus load.
n NANDF_CS1/#MCA_INT (pad H21), CSI0_DAT11/ECSPI2_SS0 (pad A6), CSI0_DAT8/ECSPI2_
SCLK (pad D6), CSI0_DAT10/ECSPI2_MISO (pad K5) and CSI0_DAT9/ECSPI2_MOSI (pad D5) are
connected to MCA processor. #MCA_INT is a signal reserved as interrupt between MCA
processor and i.MX6QP processor. The other signals are a SPI bus shared between i.MX6QP
and MCA processor. The usage and availability of these signals is depending on the firmware
running in the MCA processor.
ConnectCore 6 Plus Hardware Reference Manual
84
About the ConnectCore 6 PlusSignal usage limitations
n ON/OFF (pad D18) signal is connected to PMIC and MCA.
n #POR (pad E18) is connected to PMIC and i.MX6QP processor.
ConnectCore 6 Plus Hardware Reference Manual
85
Specifications for the ConnectCore 6 Plus
Electrical characteristics87
Power consumption87
Mechanical specifications88
Environmental specifications90
ConnectCore 6 Plus Hardware Reference Manual
86
Specifications for the ConnectCore 6 PlusElectrical characteristics
Electrical characteristics
Voltage supplies
ParameterMin Typ Max Unit
5 V supply4.255.5V
VCC_LICELL 2.03.0TBD V
LDO3_MCA1.71 3.33.6V
Note No specific ESD protection components have been implemented on the ConnectCore 6 Plus
module. ESD protection level on the module’s I/Os is the same as what is specified in the NXP
datasheet. Any required ESD protection must be implemented on the carrier board.
Power consumption
This section contains data on the power consumption of the ConnectCore 6 and ConnectCore 6 Plus
system-on-module. The power is measured at the input of the SOM, i.e. VSYS input power rail. The
power architecture of the SOM requires some of the PMIC regulators to be externally powered. These
regulators are powered directly from some of the outputs of the PMIC itself (which are fed from VSYS).
No external circuitry is powered from any of the output power rails of the SOM, so that the power
measured at VSYS corresponds to the consumption of the SOM alone.
Note These power consumption numbers should be considered guidelines only, never as fixed or
absolute values. Actual values will depend entirely upon individual setup and system application.
Power consumption use cases
This sections describes the use cases that were used to measure power consumption of the
ConnectCore 6 and ConnectCore 6 Plus system-on-module.
n Suspend System in suspend-to-RAM mode
n Power-off System in power-off with RTC enabled. RTC is running in the PMIC
n IDLE System up and running. Ethernet and wireless disabled
n Decoding video System up and running with the following configuration:
l Ethernet and wireless disabled
l HDMI display connected to the system
l CPU decoding 1080p video
n CPU stress System up and running with the following configuration:
l Ethernet and wireless disabled
l Hanoi application running
ConnectCore 6 Plus Hardware Reference Manual
87
Specifications for the ConnectCore 6 PlusMechanical specifications
Global power consumption
The following table list the global power consumption of the ConnectCore 6 and ConnectCore 6 Plus
system-on-module when the system is under the use cases described above:
Digi Embedded Yocto 2.4
Power consumption (mA@5V)
Use caseConnectCore 6 ConnectCore 6 Plus
Suspend144151
Power-off4.85.9
IDLE380460
Decoding video 577.94610.6 (+150.6)
CPU stress12101090 (+630)
Digi Embedded Yocto 2.2
Power consumption (mA@5V)
Use caseConnectCore 6 ConnectCore 6 Plus
Suspend146150
Power-off4.86.2
IDLE380450
Decoding video 582623 (+162)
CPU stress12601120 (+659)
Mechanical specifications
Note that all dimensions are in millimeters.
ConnectCore 6 Plus Hardware Reference Manual
88
Specifications for the ConnectCore 6 PlusMechanical specifications
ConnectCore 6 Plus module weight is 27 grams.
There must be a recess in the host PCB to accommodate the components on the bottom side of the
SOM.
All dimensions are in millimeters.
For additional information, see Digi Application Note #31-31-14-x on the Digi technical support
website.
ConnectCore 6 Plus Hardware Reference Manual
89
Specifications for the ConnectCore 6 PlusEnvironmental specifications
Host PCB footprint
Note Minimum thickness of the host board shall be 2 mm.
Environmental specifications
The i.MX6QP thermal specification is based on maximum junction temperature (Tj) of the specific
application processor variant used. In order to support thermal management assistance through
software, the i.MX6QP processor has a built-in junction temperature sensor/monitor.
The table below outlines the three temperature-related operational threshold modes with severity
related recovery actions as defined in software.
ModeTemperature (Tj) Recovery action
Critical> Max Tj - 5oCAutomatic system reboot to protect i.MX6QP from damage
Hot> Max Tj - 15oCi.MX6QP core and GPU frequencies are reduced
Additional actions may be initiated depending on actual system
implementation
Active< Max Tj - 25oCLimitations applied in Hot mode are removed again
ConnectCore 6 Plus Hardware Reference Manual
90
Specifications for the ConnectCore 6 PlusEnvironmental specifications
Linux - Android users
At any time, the processor junction temperature can be measured by entering the following shell
command:
cat /sys/class/thermal/thermal_zone0/temp
Note Depending on the operating system, the junction temperature is displayed in milli °C or °C.
The ConnectCore 6 Plus multichip module was designed to provide customers with unique options to
simplify and support the implementation of thermal management approaches in their designs, as
needed:
n The ConnectCore 6 Plus offers a fully shielded design (including internal thermal compounds)
with optimized heat transfer and heat spreading for specific internal components (processor
and PMIC). It is ideally suited for more efficient heat dissipation by providing a single, uniform
surface for thermal management via enclosures, heat sinks or other means.
n The surface mount design of the ConnectCore 6 Plus allows for additional dissipation of heat
through the carrier board it is mounted on.
Evaluation of the ConnectCore 6 Plus thermal performance has successfully demonstrated
that the ambient operating temperatures specified can be support by the module. However,
actual ambient operating temperature performance may vary and is highly dependent on the
specific use-case, such as, enclosure design, system design, i.MX6QP processor variant,
GPU/VPU activity, on-module peripherals used. Your specific system design and application
may require additional thermal management such as passive (heatsink/-spreader) or active
(airflow) cooling at elevated temperatures.
Ambient operating
ConnectCore 6 Plus variant
temperatureStorage temperature
Industrial-40 to 85oC-40 to 125oC
Commercial0 to 70oC-40 to 125oC
Please note that ambient operating temperature ratings are highly dependent on the specific usecase, e.g. enclosure design, system design, i.MX6QP processor variant, GPU/VPU activity,
peripherals used. Your specific system design and application may require additional thermal
management such as passive (heatsink/-spreader) or active (airflow) cooling.
Running over 70° C ambient typically requires the implementation of thermal management
strategies.
Contact Digi if you need information and/or guidance related to thermal management in your specific
application.
ConnectCore 6 Plus Hardware Reference Manual
91
Assembly instructionsEnvironmental specifications
Assembly instructions
Moisture sensitivity and shelf life93
Mounting93
Solder paste print93
Stencil93
Coplanarity94
SMT pick and place94
SMT process parameter reference94
Reflow profile94
ConnectCore 6 Plus Hardware Reference Manual
92
Assembly instructionsMoisture sensitivity and shelf life
Moisture sensitivity and shelf life
The ConnectCore 6 Plus module is classified as a Level 3 Moisture Sensitive Device in accordance with
IPC/JEDEC J-STD-020.
1. Calculated shelf life in sealed packaging: 12 months at <40° C and <90% relative humidity (RH).
2. Environmental condition during production: 30° C /60% RH according to IPC/JEDEC J-STD -
033A, paragraph 5.
3. Maximum time between opening of the sealed packaging and reflow process must not exceed
168 hours, based on condition b), IPC/JEDEC J-STD -033A, paragraph 5.2.
4. Baking is required, if conditions 3) or 4) do not apply.
5. Baking is required, if the packaging humidity indicator indicates 10% RH or higher.
6. If baking is required, bake modules in trays 4-6 hours at 125° C; maximum stacking height is 10
trays.
Mounting
The ConnectCore 6 Plus module has been designed with easy integration into existing SMT processes
in mind. Guidance for mounting the module on your carrier board is given in this section of the
document.
The ConnectCore 6 Plus module is specified for one (1) soldering cycle only. Modules are also not
sealed and therefore they should not be subjected to a wash cycle or similar treatment where
condensation could occur. Contact Digi International for additional guidance to discuss conformal
coating approaches and options, if needed.
Solder Paste
The following solder paste type has been approved for mounting the module on a carrier board:
n SAC305 (Lead-free: Alpha OM-340 Type 4 or equivalent)
Solder paste print
The following solder paste printing parameters are recommended:
n Stencil Thickness: 0.15 mm/5 mil
n Stencil Diameter: One to one of Pad diameter (to +20% of pad)
n Paste alignment: 20% off the pad max (offset <20% pad diameter)
Stencil
The recommendation is to use a laser cut and/or electro-formed stencil for placing the ConnectCore 6
Plus module. Based on the actual coplanarity characteristics of your carrier board, adjustments may
be required to determine the optimal solder paste volume.
It is also recommended to perform an X-ray analysis of the initial production run of your assembly with
the ConnectCore 6 Plus. Please contact Digi for additional support.
ConnectCore 6 Plus Hardware Reference Manual
93
Assembly instructionsCoplanarity
Coplanarity
The coplanarity measured on the ConnectCore 6 Plus is <0.003" bow and twist (98% confidence
interval). It is important that the carrier board is also coplanar. If the carrier board is thinner than the
ConnectCore 6 Plus it is recommended that the assembly be supported during the reflow process, i.e.
reflow fixture should be used to minimize the potential bow of the carrier card.
Bow and twist measurements have been done with SmartScope Flash 500 equipment which has a Z
accuracy up to (2.0 + 8L/1000) µm.
SMT pick and place
n Placement Nozzle: Large is available on the machine
n Nozzle Pick Surface: Center of Shield on i.MX6QP SOM
n Placement Speed: Slowest speed for the machine
n Placement alignment: 10% of pad diameter (compensating for module weight and supporting
alignment). The module should be placed last as part of the assembly/mounting process to
Paster alignment25% off the pad (offset <0.25* diameter
PnPPlacement nozzle0>15 mm vacuum
Nozzle Pick SurfacePnP cap center
SpeedSlowest speed for the machine
Placement SequencePlace the SoM last
Placement Alignment50% off the pad (offset <.5* diameter)
ReflowBelt speed0.6-1.1 m/sec
Refer to SMT profile recommendation in the next page
Reflow profile
Time Above Liquidous (TAL) is recommended to be between 56 to 63 seconds. Use of 40AWG K-type
thermal couple and M.O.L.E or equivalent thermal profiler is recommended. The first recommended
thermal probe location is on the outer row of pads, to be on the out most row of pins preferably a
ground pad. The second thermal probe location is on the inner row of pads preferably a signal pad.
The following image shows the reflow profile based on a ten-zone oven, with SAC 305 Lead-Free
Solder Paste (Alpha OM-340).
ConnectCore 6 Plus Hardware Reference Manual
94
Assembly instructionsReflow profile
The reflow profile shown above is valid for the combination solder paste/reflow machine and Digi
reference carrier board. Optimization of a reflow profile will depend on the selected solder
paste/reflow machine (reflow or vapor phase) and carrier board design.
The ConnectCore 6 Plus i.MX6QP is approved to withstand a total of four reflow cycles. Two reflow
cycles are required for manufacturing the ConnectCore 6 Plus i.MX6QP SOM. Two (2) reflow cycles are
remaining for mounting the module on the carrier board. Digi strongly recommends to solder the
ConnectCore 6 Plus i.MX6QP module during the last reflow cycles of the carrier board manufacturing
process.
ConnectCore 6 Plus Hardware Reference Manual
95
Regulatory information and certifications
United States FCC97
Canada (ISED)100
Europe ETSI101
Bluetooth SIG-qualified hardware and firmware104
ConnectCore 6 Plus Hardware Reference Manual
96
Regulatory information and certificationsUnited States FCC
United States FCC
The ConnectCore 6 Plus module complies with Part 15 of the FCC rules and regulations. Compliance
with the labeling requirements, FCC notices and antenna usage guidelines is required. To fulfill FCC
Certification, the OEM must comply with the following regulations:
The system integrator must ensure that the text on top side of the module is placed on the outside of
the final product.
ConnectCore 6 Plus module may only be used with antennas approved [refer to the antenna tables in
this section].
Labeling requirements
WARNING! The Original Equipment Manufacturer (OEM) must ensure that FCC labeling
requirements are met. This includes a clearly visible label on the outside of the final
product enclosure that displays the contents shown below. Required FCC Label for OEM
products containing the ConnectCore 6 Plus module.
Contains FCC ID: MCQ-CCIMX6P
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
ConnectCore 6 Plus Hardware Reference Manual
97
ConnectCore 6 Plus Hardware Reference Manual98
Regulatory information and certificationsUnited States FCC
Regulatory information and certificationsUnited States FCC
FCC notices
IMPORTANT: The ConnectCore 6 Plus module has been certified by the FCC for use with other
products without any further certification (as per FCC section 2.1091). Modifications not expressly
approved by Digi could void the user's authority to operate the equipment.
IMPORTANT: OEMs must test final product to comply with unintentional radiators (FCC section 15.107
& 15.109) before declaring compliance of their final product to Part 15 of the FCC Rules.
IMPORTANT: The ConnectCore 6 Plus module has been certified for remote and base radio
applications. If the module will be used for portable applications, the device must undergo SAR testing.
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates uses and can
radiate radio frequency energy, and if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the following
measures: Re-orient or relocate the receiving antenna, Increase the separation between the
equipment and receiver, Connect equipment and receiver to outlets on different circuits, or Consult
the dealer or an experienced radio/TV technician for help.
FCC-approved antennas
The ConnectCore 6 Plus can be installed utilizing antennas and cables constructed with non-standard
connectors (RPSMA, RPTNC, and so on).
The modules are FCC approved for fixed base station and mobile applications for the channels
indicated in the tables below. If the antenna is mounted at least 20 cm (8 in) from nearby persons, the
application is considered a mobile application. Antennas not listed in the table must be tested to
comply with FCC Section 15.203 (Unique Antenna Connectors) and Section 15.247 (Emissions).
A concrete antenna, detailed in the table below, has been used to certify the ConnectCore 6 Plus
wireless module. This antenna can be replaced by others, however further certification testing is
required. The number of tests to be carried out can be decreased by using an antenna of the same
type, i.e. dualband omnidirectional dipole, showing lower peak gain. In such case, only a spot check
may be required by the certification laboratories to keep current certifications valid according to FCC
regulations. If replacing by an antenna with higher gain, e.g. >2.5 dBi at 2.4 GHz band, complete
radiated tests according to FCC regulations are required by the certification laboratories.
Antenna used to certify the ConnectCore 6 Plus wireless module
Peak
Part numberType (description)
Linx Technologies Inc
ANT-DB1-RAF-RPS
Dual band 2.4 GHz and 5 GHz omnidirectional
dipole, articulated, with RPSMA connector
Peak Gain
2.4 GHz
2.5 dBi4.6 dBi
Gain 5
GHz
Note If using the RF module in a portable application (for example - if the module is used in a hand-
held device and the antenna is less than 20 cm (8 in) from the human body when the device is in
ConnectCore 6 Plus Hardware Reference Manual
99
Regulatory information and certificationsCanada (ISED)
operation): The integrator is responsible for passing additional SAR (Specific Absorption Rate) testing
based on FCC rules 2.1091 and FCC Guidelines for Human Exposure to Radio Frequency
Electromagnetic Fields, OET Bulletin and Supplement C. The testing results will be submitted to the
FCC for approval prior to selling the integrated unit. The required SAR testing measures emissions
from the module and how they affect the person.
RF exposure
CAUTION! To satisfy FCC RF exposure requirements for mobile transmitting devices, a
separation distance of 20 cm (8 in) or more should be maintained between the antenna
of this device and persons during device operation. To ensure compliance, operations at
closer than this distance are not recommended. The antenna used for this transmitter
must not be co-located in conjunction with any other antenna or transmitter. The
preceding statement must be included as a CAUTION statement in OEM product
manuals in order to alert users of FCC RF Exposure compliance.
Canada (ISED)
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to
the following two conditions: (1) this device may not cause interference, and (2) this device must
accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts
de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas
produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique
subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Digi International Inc. has not approved any changes or modifications to this device by the user. Any
changes or modifications could void the user’s authority to operate the equipment.
Digi International Inc. n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle
qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de
l’appareil par l’utilisateur.
Maximum power and frequency specifications
Note See the table in United States FCCsection, as the same channel plan and maximum transmit
powers apply.
CAUTION! Due to the elimination of interference to the Terminal Doppler Weather Radar
(TDWR), the operation of this device in the frequency range 5.60 – 5.65 GHz is restricted
in Canada.
Labeling requirements
Labeling requirements for Industry Canada are similar to those of the FCC. A clearly visible label on the
outside of the final product enclosure must display the following text:
Contains IC: 1846A-CCIMX6P
L’équipement hôte doit être correctement étiqueté pour identifier les modules dans l’équipement. L'étiquette
de certification du module doit être clairement visible en tout temps lorsqu'il est installé dans l'hôte,
l’équipement hôte doit être étiqueté pour afficher l'IC du module, précédé des mots "Contient le module
émetteur", ou le mot "Contient", ou un libellé similaire exprimant la même signification, comme suit:
Contient IC: 1846A-CCIMX6P
ConnectCore 6 Plus Hardware Reference Manual
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