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or in the product(s) and/or the program(s) described in this manual at any time.
This guide provides information about the Digi ConnectCore for i.MX6 embedded core module
family.
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Additional Resources
Refer to the most recent Freescale i.MX6 processor reference manual and related documentation
(available on the Freescale web site at: http://www.freescale.com/imx6) for additional
information.
The ConnectCore 6 is an ultra-compact and highly integrated system-on-module solution based
on the Freescale i.MX6 Cortex-A9 processor family.
With processor speeds up to 1.2 GHz and fully interchangeable single-/dual-/quad-core variants,
the ConnectCore 6 offers a truly future-proof platform solution with scalable performance and
pre-certified wireless 802.11a/b/g/n and Bluetooth 4.0, including Bluetooth Low Energy
connectivity.
Its innovative and scalable design maximizes integration flexibility and significantly reduces
design risk in a highly cost-effective, reliable, low-profile surface mount form factor with optimal
thermal management even in the most demanding quad-core system configurations.
Seamless Cloud Connector integration as part of the Digi Linux and Android software platform
support offers secure remote management and web services capabilities through the scalable
Device Cloud™ by Etherios™.
In addition, Digi offers complete professional Etherios custom hardware and wireless design
services as well as end-to-end solutions services for cloud integration and app development.
ConnectCore 6 Features and Functionality
The ConnectCore for i.MX6 module is based on the i.MX6 processor from Freescale. This
processor offers a high number of interfaces. Most of these interfaces are multiplexed and are
not available simultaneously. The module has the following features:
• i.MX6 single/dual/quad ARM Cortex-A9 cores operating at speeds up to 1.2GHz.
• 32Kbytes L1 Instruction cache
• 32Kbytes L1 Data cache
• Up to 1MB unified Instruction/Data L2 cache
• NEON MPE (Media Processing Engine) co-processor
• Graphical Hardware accelerators:
• IPU (Image Processing Unit)
• Optional VPU (Video Processing Unit)
• Optional 2D/3D GPU (Graphics Processing Unit)
• 64-bit DDR3-1066 memory interface with a density up to 2GBytes.
• 8-bit eMMC support up to revision 4.4/4.41
• Dialog DA9063 Power Management IC (PMIC)
• 6x DC/DC buck converters
• 11x LDO regulators
• RTC with rechargeable coin cell battery support
• 10-bit ADC channels
• GPIO pins
• Optional IEEE802.11a/b/g/n WLAN interface with spatial diversity support.
• SATA II, 3.0Gbps (24-bit parallel bus, LVDS, HDMI, MIPI/DSI)
• Cameras (20-bit parallel bus, MIPI/CSI)
• MMC/SD/SDIO
• 1x USB OTG with integrated PHY
• 3x USB Host
• 1x Host with integrated PHY
• 2x Host with integrated HS-IC USB PHY
• PCI Express Gen 2.0 lane
• Gigabit Ethernet MAC
• 10/100M Ethernet MAC
• UART, SPI, I2C, PWM, CAN, I2S and GPIO
• Ultra-miniature SMT module (50x50mmx5mm) based on 400-LGA pads
IEEE 802.11 a/b/g/n and Bluetooth Features and Functionality
The RF interface of the ConnectCore for i.MX6 is handled by a Qualcomm-Atheros module
capable of 2.4 GHz and 5 GHz connections using 802.11 a/b/g/n and Bluetooth 4.0 (Dual mode
with Blueooth Low Energy support).
The module is built with coexistence in mind and handles the BT coexistence internally. Cellular
coexistence filtering is onboard to aid in designing systems susceptible to cellular interference.
Module Variants
The ConnectCore for i.MX6 module supports population options such as network interface
(Wi-Fi), memory (flash, RAM), MCU-assist, processor (single, dual and quad-cores), and others.
The ConnectCore for i.MX6 provides a primary 5V power supply input. This supply is the main
power domain to the on-module Dialog DA9063 power management IC (PMIC), which generates
all required supply voltages for the module components as well as the carrier board.
The module provides support for a backup battery (coin-cell or super cap) powering the realtime clock (RTC) on the module. In addition, rechargeable backup batteries (ML414, others) are
also supported.
The PMIC generates the following power domains that are available on the module pads:
• 3.3V (GEN_3V3)
Power
domain
3.3VDC/DC+/-3%1500mA-1µA1.2ms-
Regulator
type
Note: The maximum current consumption mentioned above is a combination of the current
consumed by the module and by the carrier board.
Moreover, 5x PMIC LDO outputs are also available on the module pads:
The table below provides the characteristics of the optional LDO outputs:
Turn
LDO
Output
voltage
Output
accuracy
Default
voltage
Maximum
current
Dropout voltage
(MAX)
Turn on time
(MAX)
off
time
(MAX)
VLDO3 0.9-3.44V +/-3%3.3V200mA150mV1µA300µs1ms
VLDO4 0.9-3.44V +/-3%3.3V200mA150mV1µA300µs1ms
VLDO6 0.9-3.6V +/-3%3.3V200mA150mV1µA200µs1ms
VLDO7 0.9-3.6V +/-3%1.8V200mA150mV1µA300µs1ms
VLDO8 0.9-3.6V +/-3%3.3V200mA150mV1µA300µs1ms
Quiescent
current in
OFF mode
(TYP)
Note:
• For information about using the LDOs options, please contact Digi.
• VLDO3 is used for supplying MCA processor on the module.
The power management IC located on the module is responsible for generating all required
i.MX6 processor supply voltages. The following i.MX6x supplies are available on the module
pads:
• NVCC_ENET
• NVCC_EIM
• NVCC_LCD
• NVCC_CSI
• NVCC_RGMII
Some of the I/O supplies are set on the module. See the table following table:
Power domainConnection
NVCC_GPIOGEN_3V3
NVCC_JTAGGEN_3V3
NVCC_NANDFGEN_3V3
NVCC_SD1GEN_3V3
NVCC_SD2GEN_3V3
NVCC_SD3GEN_3V3
The remaining I/O voltages must be set externally and are left open on the ConnectCore for
i.MX6 module. See the following table for operating ranges of the remaining I/O supplies.
As shown in the table above, the supplies have a wide operating range. In order to provide the
most cost-effective and flexible solution for a given use-case, the supplies listed in the table need
to be provided by the carrier board integrating the ConnectCore for i.MX6 module. However,
PMIC power domains 3.3V - and LDO3/4/6/7/8 options - are dedicated power sources for
supplying i.MX6 power domains.
The MCU - assist specific power domain (LDO3_MCA) available on the ConnectCore for i.MX6
LGA pads is a power supply output powering the on-module Kinetis processor.
The following diagram outlines the power supply approach of the ConnectCore for i.MX6. Inputs
are marked red, blue marks outputs.
The ConnectCore 6 is configured by default to boot in “Internal boot” mode. See the following
table:
BOOT_MODE [1:0]Boot type
00Boot from fuses
01Serial Downloader
10Internal Boot (default)
11Reserved
Note:
• 10K pull-up populated on BOOT_MODE1
• 10K pull-down populated on BOOT_MODE0
By default, the boot media configured on the ConnectCore for i.MX6 module is the on-module
eMMC. This is achieved by having the following resistors populated on the module:
• 10K pull-down on EIM_DA4 (BOOT_CFG1[4])
• 10K pull-up on EIM_DA5 (BOOT_CFG1[5])
• 10K pull-up on EIM_DA5 (BOOT_CFG1[6])
• 10K pull-up on EIM_DA7 (BOOT_CFG1[7]
• 10K pull-down on EIM_DA11 (BOOT_CFG2[3])
• 10K pull-up on EIM_DA12 (BOOT_CFG2[4])
When selecting “Internal Boot”, bootstrap pins shall be protected to insure a proper boot
process. “Internal Boot” has the benefit that multiple boot media can be supported. For mass
production, Digi recommends to use “Boot from fuses” for more security.
The following table provides pinout information of the ConnectCore for i.MX6 module.
Additional timing and electrical information can be found in either Freescale i.MX6 processor
datasheet (www.freescale.com) or in Dialog DA9063 product datasheet (www.dialog-