Digi, Digi International, the Digi logo, and ConnectCore 6
registered trademarks in the United States and other countries worldwide. All
other trademarks mentioned in this document are the property of their respective
owners.
Information in this document is subject to change without notice and does not
represent a commitment on the part of Digi International. Digi provides this
document “as is,” without warranty of any kind, expressed or implied, including,
but not limited to, the implied warranties of fitness or merchantability for a
particular purpose. Digi may make improvements and/or changes in this manual
or in the product(s) and/or the program(s) described in this manual at any time.
This guide provides information about the Digi ConnectCore for i.MX6 embedded core module
family.
Conventions used in this guide
This table describes the typographic conventions used in this guide:
This conventionIs used for
italic type
monospaced type
Digi Information
Emphasis, new terms, variables, and document titles.
Filenames, pathnames, and code examples.
Document Updates
Please always check the product specific section on the Digi support website at
www.digiembedded.com/support
for the most current revision of this document.
Contact Information
For more information about your Digi products, or for customer service and technical support,
contact Digi International.
To contact Digi International byUse
Digi International
Mail
World Wide Webhttp://www.digiembedded.com/support/
Telephone (U.S.)(952) 912-3444 or (877) 912-3444
Telephone (other locations)+1 (952) 912-3444 or (877) 912-3444
1101 Bren Road East
Minnetonka, MN 55343
U.S.A.
Additional Resources
Refer to the most recent Freescale i.MX6 processor reference manual and related documentation
(available on the Freescale web site at: http://www.freescale.com/imx6) for additional
information.
The ConnectCore 6 is an ultra-compact and highly integrated system-on-module solution based
on the Freescale i.MX6 Cortex-A9 processor family.
With processor speeds up to 1.2 GHz and fully interchangeable single-/dual-/quad-core variants,
the ConnectCore 6 offers a truly future-proof platform solution with scalable performance and
pre-certified wireless 802.11a/b/g/n and Bluetooth 4.0, including Bluetooth Low Energy
connectivity.
Its innovative and scalable design maximizes integration flexibility and significantly reduces
design risk in a highly cost-effective, reliable, low-profile surface mount form factor with optimal
thermal management even in the most demanding quad-core system configurations.
Seamless Cloud Connector integration as part of the Digi Linux and Android software platform
support offers secure remote management and web services capabilities through the scalable
Device Cloud™ by Etherios™.
In addition, Digi offers complete professional Etherios custom hardware and wireless design
services as well as end-to-end solutions services for cloud integration and app development.
ConnectCore 6 Features and Functionality
The ConnectCore for i.MX6 module is based on the i.MX6 processor from Freescale. This
processor offers a high number of interfaces. Most of these interfaces are multiplexed and are
not available simultaneously. The module has the following features:
• i.MX6 single/dual/quad ARM Cortex-A9 cores operating at speeds up to 1.2GHz.
• 32Kbytes L1 Instruction cache
• 32Kbytes L1 Data cache
• Up to 1MB unified Instruction/Data L2 cache
• NEON MPE (Media Processing Engine) co-processor
• Graphical Hardware accelerators:
• IPU (Image Processing Unit)
• Optional VPU (Video Processing Unit)
• Optional 2D/3D GPU (Graphics Processing Unit)
• 64-bit DDR3-1066 memory interface with a density up to 2GBytes.
• 8-bit eMMC support up to revision 4.4/4.41
• Dialog DA9063 Power Management IC (PMIC)
• 6x DC/DC buck converters
• 11x LDO regulators
• RTC with rechargeable coin cell battery support
• 10-bit ADC channels
• GPIO pins
• Optional IEEE802.11a/b/g/n WLAN interface with spatial diversity support.
• SATA II, 3.0Gbps (24-bit parallel bus, LVDS, HDMI, MIPI/DSI)
• Cameras (20-bit parallel bus, MIPI/CSI)
• MMC/SD/SDIO
• 1x USB OTG with integrated PHY
• 3x USB Host
• 1x Host with integrated PHY
• 2x Host with integrated HS-IC USB PHY
• PCI Express Gen 2.0 lane
• Gigabit Ethernet MAC
• 10/100M Ethernet MAC
• UART, SPI, I2C, PWM, CAN, I2S and GPIO
• Ultra-miniature SMT module (50x50mmx5mm) based on 400-LGA pads
IEEE 802.11 a/b/g/n and Bluetooth Features and Functionality
The RF interface of the ConnectCore for i.MX6 is handled by a Qualcomm-Atheros module
capable of 2.4 GHz and 5 GHz connections using 802.11 a/b/g/n and Bluetooth 4.0 (Dual mode
with Blueooth Low Energy support).
The module is built with coexistence in mind and handles the BT coexistence internally. Cellular
coexistence filtering is onboard to aid in designing systems susceptible to cellular interference.
Module Variants
The ConnectCore for i.MX6 module supports population options such as network interface
(Wi-Fi), memory (flash, RAM), MCU-assist, processor (single, dual and quad-cores), and others.
The ConnectCore for i.MX6 provides a primary 5V power supply input. This supply is the main
power domain to the on-module Dialog DA9063 power management IC (PMIC), which generates
all required supply voltages for the module components as well as the carrier board.
The module provides support for a backup battery (coin-cell or super cap) powering the realtime clock (RTC) on the module. In addition, rechargeable backup batteries (ML414, others) are
also supported.
The PMIC generates the following power domains that are available on the module pads:
• 3.3V (GEN_3V3)
Power
domain
3.3VDC/DC+/-3%1500mA-1µA1.2ms-
Regulator
type
Note: The maximum current consumption mentioned above is a combination of the current
consumed by the module and by the carrier board.
Moreover, 5x PMIC LDO outputs are also available on the module pads:
The table below provides the characteristics of the optional LDO outputs:
Turn
LDO
Output
voltage
Output
accuracy
Default
voltage
Maximum
current
Dropout voltage
(MAX)
Turn on time
(MAX)
off
time
(MAX)
VLDO3 0.9-3.44V +/-3%3.3V200mA150mV1µA300µs1ms
VLDO4 0.9-3.44V +/-3%3.3V200mA150mV1µA300µs1ms
VLDO6 0.9-3.6V +/-3%3.3V200mA150mV1µA200µs1ms
VLDO7 0.9-3.6V +/-3%1.8V200mA150mV1µA300µs1ms
VLDO8 0.9-3.6V +/-3%3.3V200mA150mV1µA300µs1ms
Quiescent
current in
OFF mode
(TYP)
Note:
• For information about using the LDOs options, please contact Digi.
• VLDO3 is used for supplying MCA processor on the module.
The power management IC located on the module is responsible for generating all required
i.MX6 processor supply voltages. The following i.MX6x supplies are available on the module
pads:
• NVCC_ENET
• NVCC_EIM
• NVCC_LCD
• NVCC_CSI
• NVCC_RGMII
Some of the I/O supplies are set on the module. See the table following table:
Power domainConnection
NVCC_GPIOGEN_3V3
NVCC_JTAGGEN_3V3
NVCC_NANDFGEN_3V3
NVCC_SD1GEN_3V3
NVCC_SD2GEN_3V3
NVCC_SD3GEN_3V3
The remaining I/O voltages must be set externally and are left open on the ConnectCore for
i.MX6 module. See the following table for operating ranges of the remaining I/O supplies.
As shown in the table above, the supplies have a wide operating range. In order to provide the
most cost-effective and flexible solution for a given use-case, the supplies listed in the table need
to be provided by the carrier board integrating the ConnectCore for i.MX6 module. However,
PMIC power domains 3.3V - and LDO3/4/6/7/8 options - are dedicated power sources for
supplying i.MX6 power domains.
The MCU - assist specific power domain (LDO3_MCA) available on the ConnectCore for i.MX6
LGA pads is a power supply output powering the on-module Kinetis processor.
The following diagram outlines the power supply approach of the ConnectCore for i.MX6. Inputs
are marked red, blue marks outputs.
The ConnectCore 6 is configured by default to boot in “Internal boot” mode. See the following
table:
BOOT_MODE [1:0]Boot type
00Boot from fuses
01Serial Downloader
10Internal Boot (default)
11Reserved
Note:
• 10K pull-up populated on BOOT_MODE1
• 10K pull-down populated on BOOT_MODE0
By default, the boot media configured on the ConnectCore for i.MX6 module is the on-module
eMMC. This is achieved by having the following resistors populated on the module:
• 10K pull-down on EIM_DA4 (BOOT_CFG1[4])
• 10K pull-up on EIM_DA5 (BOOT_CFG1[5])
• 10K pull-up on EIM_DA5 (BOOT_CFG1[6])
• 10K pull-up on EIM_DA7 (BOOT_CFG1[7]
• 10K pull-down on EIM_DA11 (BOOT_CFG2[3])
• 10K pull-up on EIM_DA12 (BOOT_CFG2[4])
When selecting “Internal Boot”, bootstrap pins shall be protected to insure a proper boot
process. “Internal Boot” has the benefit that multiple boot media can be supported. For mass
production, Digi recommends to use “Boot from fuses” for more security.
The following table provides pinout information of the ConnectCore for i.MX6 module.
Additional timing and electrical information can be found in either Freescale i.MX6 processor
datasheet (www.freescale.com) or in Dialog DA9063 product datasheet (www.dialog-
The following signals available on ConnectCore for i.MX6 pads have a limited usage:
NVCC_EIM
NVCC_EIM
• SD1_CLK (pad L21), SD1_CMD (pad J23), SD1_DAT[3:0] (pads L20, J21, J22 and N24) are
only available externally on modules which don't have Wi-Fi populated.
• SD3_DAT4/BT_UART_RXD (pad C22), SD3_DAT5/BT_UART_TXD (pad D23), SD3_CLK/
BT_UART_RTS (pad B21), SD3_CMD/BT_UART_CTS (pad E23) are only available externally on
modules which don't have Bluetooth populated.
• NANDF_CLE/BT_WAKE (pad E22) is only available externally on modules which don't have
Bluetooth populated.
• I2C2_SCL/KEY_COL3 (pad C3) and I2C2_SDA/KEY_ROW3 (pad F2) are used on the module
as I2C signals connected to the PMIC and MCA processor. Using these signals externally
should be done with caution, since it could prevent the module from working properly. It is
recommended that you use another I2C port for connecting external devices to the
ConnectCore i.MX6 module in order to avoid excessive bus load.
• NANDF_CS1/#MCA_INT (pad H21), CSI0_DAT11/ECSPI2_SS0 (pad A6), CSI0_DAT8/
ECSPI2_SCLK (pad D6), CSI0_DAT10/ECSPI2_MISO (pad K5) and CSI0_DAT9/ECSPI2_MOSI
(pad D5) are connected to MCA processor. #MCA_INT is a signal reserved as interrupt
between MCA processor and i.MX6 processor. The other signals are a SPI bus shared between
i.MX6 and MCA processor. The usage and availability of these signals is depending on the
firmware running in the MCA processor.
• ON/OFF (pad D18) signal is connected to PMIC and MCA.
• #POR (pad E18) is connected to PMIC and i.MX6 processor.
The Freescale i.MX6 thermal specification is based on maximum junction temperature (Tj) of the
specific application processor variant used. In order to support thermal management assistance
through software, the Freescale i.MX6 processor has a built-in junction temperature sensor/
monitor.
The table below outlines the three temperature related operational threshold modes with
severity related recovery actions as defined in software.
ModeTemperature (Tj)Recovery Action
Critical
Hot
Active
Linux - Android Users
> Max Tj - 5
> Max Tj - 15
< Max Tj - 25
o
C
o
C
o
C
• Automatic system reboot to protect
i.MX6 from damage
• i.MX6 core and GPU frequencies are
reduced
• Additional actions may be initiated
depending on actual system
implementation
• Limitations applied in Hot mode are
removed again
At any time, the processor junction temperature can be measured by entering the following shell
command:
cat /sys/class/thermal/thermal_zone0/temp
Note: Depending on the operating system, the junction temperature is displayed in milli °C
or °C.
The ConnectCore 6 multichip module was designed to provide customers with unique options to
simplify and support the implementation of thermal management approaches in their designs, as
needed:
• The ConnectCore 6 offers a fully shielded design (including internal thermal compounds) with
optimized heat transfer and heat spreading for specific internal components (processor and
PMIC). It is ideally suited for more efficient heat dissipation by providing a single, uniform
surface for thermal management via enclosures, heat sinks or other means.
• The surface mount design of the ConnectCore 6 allows for additional dissipation of heat
through the carrier board it is mounted on.
Evaluation of the ConnectCore 6 thermal performance has successfully demonstrated that the
ambient operating temperatures specified can be support by the module. However, actual
ambient operating temperature performance may vary and is highly dependent on the specific
use-case, such as, enclosure design, system design, i.MX6 processor variant, GPU/VPU activity,
on-module peripherals used.Your specific system design and application may require additional
thermal management such as passive (heatsink/-spreader) or active (airflow) cooling at elevated
temperatures.
ConnectCore 6 Variant
Industrial
Commercial
1
Please note that ambient operating temperature ratings are highly dependent on the specific use-case, e.g. enclosure design, system design, i.MX6 processor variant, GPU/VPU activity, peripherals used. Your specific system design and application may require additional thermal management such as passive (heatsink/-spreader) or active (airflow) cooling.
Ambient Operating
Temperature
-40 to 85
0 to 70
o
o
C -40 to 125oC
1
C -40 to 125oC
Please contact Digi if you need information and/or guidance related to thermal management in
your specific application.
Moisture Sensitivity and Shelf Life
1 The ConnectCore for i.MX6 module is classified as a Level 3 Moisture Sensitive Device in
accordance with IPC/JEDEC J-STD-020.
2 Calculated shelf life in sealed packaging: 12 months at <40°C and <90% relative humidity
(RH).
3 Environmental condition during production: 30°C /60% RH according to IPC/JEDEC J-STD -
033A, paragraph 5.
4 Maximum time between opening of the sealed packaging and reflow process must not exceed
168 hours, based on condition b), IPC/JEDEC J-STD -033A, paragraph 5.2.
5 Baking is required, if conditions b) or c) do not apply. See above.
6 Baking is required, if the packaging humidity indicator indicates 10% RH or higher.
7 If baking is required, bake modules in trays 4-6 hours at 125°C; maximum stacking height is
10 trays.
Storage Temperature
Mounting
The ConnectCore 6 module has been designed with easy integration into existing SMT processes
in mind. Guidance for mounting the module on your carrier board is given in this section of the
document.
The ConnectCore 6 modules are not sealed and therefore they should not be subjected to a wash
cycle or similar treatment where condensation could occur. Contact Digi International for
additional guidance to discuss conformal coating approaches and options, if needed.
Solder Paste
The following solder paste type has been approved for mounting the module on a carrier board:
• SAC305 (Lead-free: Alpha OM-340 Type 4 or equivalent)
The following solder paste printing parameters are recommended:
• Stencil Thickness: 0.15 mm/5 mil
• Stencil Diameter: One to one of Pad diameter (to +20% of pad)
• Paste alignment: 20% off the pad max (offset <20% pad diameter)
Stencil
The recommendation is to use a laser cut and/or electro-formed stencil for placing the
ConnectCore 6 module. Based on the actual coplanarity characteristics of your carrier board,
adjustments may be required to determine the optimal solder paste volume.
It is also recommended to perform an X-ray analysis of the initial production run of your
assembly with the ConnectCore 6. Please contact Digi for additional support.
Coplanarity
The coplanarity measured on the ConnectCore for 6 is <0.003" bow and twist (98% confidence
interval). It is important that the carrier board is also coplanar. If the carrier board is thinner
than the ConnectCore 6 it is recommended that the assembly be supported during the reflow
process, i.e. reflow fixture should be used to minimize the potential bow of the carrier card.
Bow and twist measurements have been done with SmartScope Flash 500 equipment which has
a Z accuracy up to (2.0 + 8L/1000) µm.
SMT Pick and Place
• Placement Nozzle: Large is available on the machine
• Nozzle Pick Surface: Center of Shield on i.MX6 SOM
• Placement Speed: Slowest speed for the machine
• Placement alignment: 10% of pad diameter (compensating for module weight and supporting
alignment). The module should be placed last as part of the assembly/mounting process to
Paster alignment25% off the pad (offset <0.25* diameter
ConnectCore for i.MX6 Hardware Reference Manual
Placement nozzle0>15mm vacuum
Nozzle Pick SurfacePnP cap center
PnP
Reflow
SpeedSlowest speed for the machine
Placement SequencePlace the SoM last
Placement Alignment50% off the pad (offset <.5* diameter)
Belt speed0.6-1.1 m/sec
Refer to SMT profile recommendation in the next page
Reflow Profile Using Seven Zone Oven, SAC 305Lead-Free
Solder Paste (Alpha OM-340)
Time Above Liquidous (TAL) is recommended to be between 56 to 63 seconds. Use of 40AWG
K-type thermal couple and M.O.L.E or equivalent thermal profiler is recommended. The first
recommended thermal probe location is on the outer row of pads, to be on the out most row of
pins preferably a ground pad. The second thermal probe location is on the inner row of pads
preferably a signal pad.
The following image shows the reflow profile based on a seven zone convection oven.
The reflow profile shown above is valid for the combination solder paste/reflow machine and Digi
reference carrier board. Optimization of a reflow profile will depend on the selected solder paste/
reflow machine (reflow or vapor phase) and carrier board design.
The ConnectCore i.MX6 is approved to withstand a maximum of six reflow cycles. Two reflow
cycles are required for manufacturing the ConnectCore i.MX6 SOM. Digi strongly recommends to
solder the ConnectCore i.MX6 module during the last reflow cycles of the carrier board
manufacturing process.
ConnectCore for i.MX6 module variants supporting both Bluetooth and WLAN are populated with
one single antenna port covering both 2.4 and 5GHz frequencies.
Module variants supporting only WLAN provide additionally antenna diversity feature. Two
antenna ports supporting the same transmit and receive signals are populated on the product.
The software running on the ConnectCore SOM switches from one antenna port to the other
depending on the RSSI (Receive Signal Strength Indication) of the received beacon, which
guarantees that the antenna with the best signal is always used and thus improve the quality
and reliability of the wireless link. The interval between comparisons of RSSI values on the two
antennas is by default 10 seconds, but can be configured in software. Furthermore, when the
RSSI measured is too low, the software will automatically switch to the other antenna regardless
of the 10 second interval. Hence, antenna diversity is an option and it is absolutely safe to mount
only one antenna in the system, connected for instance to the primary antenna port.
The listed capabilities are dependent on software platform in use. Refer to the corresponding
software platform documentation for additional information.
Please contact Digi if your end product requires a Wi-Fi Alliance Logo and/or Cisco CCX
certification.
Frequency Bands
US, Canada
• 2.412 to 2.462 GHz; 11 channels
• 5.180 to 5.320 GHz; 8 channels
• 5.500 to 5.700 GHz, 8 channels (excludes 5.600 to 5.650 GHz)
• 5.745 to 5.825 GHz; 5 channels
Europe
• 2.412 to 2.472 GHz; 13 channels
• 5.180 to 5.320 GHz; 8 channels
• 5.500 to 5.700 GHz, 8 channels (excludes 5.600 to 5.640 GHz)
Note: No specific ESD protection components have been implemented on the ConnectCore
for i.MX6 module. ESD protection level on the module’s I/Os is the same as what is specified
in the freescale datasheet. Any required ESD protection must be implemented on the carrier
board.
Power Consumption
The following image displays the current consumption of the ConnectCore for i.MX6 module
when booting respectively through U-Boot, Linux kernel and Android user space.
Power consumption of the ConnectCore 6
On this graph, we see current peaks above 1.5A. For additional margin, the recommendation is
to design a power supply solution for ConnectCore 6 SOM which is able to source up to 2A.
The ConnectCore™ for i.MX6 Module complies with Part 15 of the FCC rules and regulations.
Compliance with the labeling requirements, FCC notices and antenna usage guidelines is
required. To fulfill FCC Certification, the OEM must comply with the following regulations:
• The system integrator must ensure that the text on top side of the module is placed on the
outside of the final product.
• ConnectCore™ for i.MX6 Module may only be used with antennas approved [refer to the
antenna tables in this section].
WARNING: The Original Equipment Manufacturer (OEM) must ensure that FCC
labeling requirements are met. This includes a clearly visible label on the outside of the
final product enclosure that displays the contents shown in the figure below. Required
FCC Label for OEM products containing the ConnectCore™ for i.MX6 Module.
For WiFi/Bluetooth variant:
For WiFi only variant:
FCC Notices
Contains FCC ID: MCQ-CCIMX6B
This device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept ant interference received, including interference that
may cause undesired operation.
Contains FCC ID: MCQ-CCIMX6
This device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept ant interference received, including interference that
may cause undesired operation.
IMPORTANT: The ConnectCore™ for i.MX6 module has been certified by the FCC for use with
other products without any further certification (as per FCC section 2.1091). Modifications not
expressly approved by Digi could void the user's authority to operate the equipment.
IMPORTANT: OEMs must test final product to comply with unintentional radiators (FCC section
15.107 & 15.109) before declaring compliance of their final product to Part 15 of the FCC Rules.
IMPORTANT: The ConnectCore™ for i.MX6 module has been certified for remote and base radio
applications. If the module will be used for portable applications, the device must undergo SAR
testing. This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates
uses and can radiate radio frequency energy, and if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning
the equipment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures: Re-orient or relocate the receiving antenna, Increase the
separation between the equipment and receiver, Connect equipment and receiver to outlets on
different circuits, or Consult the dealer or an experienced radio/TV technician for help.
FCC-Approved Antennas
The ConnectCore™ for i.MX6 can be installed utilizing antennas and cables constructed with nonstandard connectors (RPSMA, RPTNC, and so on).
The modules are FCC approved for fixed base station and mobile applications for the channels
indicated in the tables below. If the antenna is mounted at least 20cm (8 in.) from nearby
persons, the application is considered a mobile application. Antennas not listed in the table must
be tested to comply with FCC Section 15.203 (Unique Antenna Connectors) and Section 15.247
(Emissions).
The antennas in the tables below have been approved for use with this module. Digi does not
carry all of these antenna variants. Contact Digi Sales for available antennas.
Antennas Approved for Use with the ConnectCore™ for i.MX6 Wi-Fi Modules
Omni- directional antennas
Part numberType (description)Peak Gain 2.4 GHzPeak Gain 5 GHz
WARNING: To satisfy FCC RF exposure requirements for mobile transmitting devices,
a separation distance of 20 cm or more should be maintained between the antenna of
this device and persons during device operation. To ensure compliance, operations at
closer than this distance are not recommended. The antenna used for this transmitter
must not be co-located in conjunction with any other antenna or transmitter. The
preceding statement must be included as a CAUTION statement in OEM product
manuals in order to alert users of FCC RF Exposure compliance.
Europe (ETSI)
The ConnectCore™ for i.MX6 Module has been certified for use in several European countries.
For a complete list, refer to www.digi.com
If the ConnectCore™ for i.MX6 module is incorporated into a product, the manufacturer must
ensure compliance of the final product to the European harmonized EMC and low-voltage/safety
standards. A Declaration of Conformity must be issued for each of these standards and kept on
file as described in Annex II of the R&TTE Directive.
.
Furthermore, the manufacturer must maintain a copy of the ConnectCore™ for i.MX6 Hardware
Reference manual documentation and ensure the final product does not exceed the specified
power ratings, antenna specifications, and/or installation requirements as specified in the user
manual. If any of these specifications are exceeded in the final product, a submission must be
made to a notified body for compliance testing to all required standards.
OEM Labeling Requirements
The CE marking must be affixed to a visible location on the OEM product.
CE Labeling Requirements
The CE mark shall consist of the initials CE taking the following form:
• If the CE marking is reduced or enlarged, the proportions given in the above graduated
drawing must be respected.
• The CE marking must have a height of at least 5mm except where this is not possible on
account of the nature of the apparatus.
• The CE marking must be affixed visibly, legibly, and indelibly.
Digi has issued Declarations of Conformity for the ConnectCore™ for i.MX6 module concerning
emissions, EMC and safety. Files can be obtained by contacting Digi Support.
Note: Digi does not list the entire set of standards that must be met for each country. Digi
customers assume full responsibility for learning and meeting the required guidelines for each
country in their distribution market.
Approved Antennas
The same antennas have been approved for Europe as stated in the FCC table for use with the
ConnectCore™ for i.MX6 module.
Canada (IC)
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject
to the following two conditions: (1) this device may not cause interference, and (2) this device
must accept any interference, including interference that may cause undesired operation of the
device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne
doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Labeling Requirements
Labeling requirements for Industry Canada are similar to those of the FCC. A clearly visible label
on the outside of the final product enclosure must display the following text:
For WiFi/Bluetooth variant:
Contains Model for ConnectCore i.MX6 WiFi/Bluetooth radio, IC: 1846ACCIMX6B
For WiFi only variant:
Contains Model ConnectCore for i.MX6 Radio, IC: 1846A-CCIMX6
The integrator is responsible for its product to comply with IC ICES-003 & FCC Part 15, Sub. B Unintentional Radiators. ICES-003 is the same as FCC Part 15 Sub. B and Industry Canada
accepts FCC test report or CISPR 22 test report for compliance with ICES-003.
Transmitters with Detachable Antennas
This radio transmitter (IC: 1846A-CCIMX6 / IC: 1846A-CCIMX6B) has been approved by Industry
Canada to operate with the antenna types listed in the table above with the maximum
permissible gain and required antenna impedance for each antenna type indicated. Antenna
types not included in this list, having a gain greater than the maximum gain indicated for that
type, are strictly prohibited for use with this device.
Le présent émetteur radio (IC: 1846A-CCIMX6 / IC: 1846A-CCIMX6B) a été approuvé par
Industrie Canada pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un
gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types
d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont
strictement interdits pour l'exploitation de l'émetteur.
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of
a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To
reduce potential radio interference to other users, the antenna type and its gain should be so
chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary
for successful communication.
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut
fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour
l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique
à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la
puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à
l'établissement d'une communication satisfaisante.