Digi, Digi International, the Digi logo, and ConnectCore 6
registered trademarks in the United States and other countries worldwide. All
other trademarks mentioned in this document are the property of their respective
owners.
Information in this document is subject to change without notice and does not
represent a commitment on the part of Digi International. Digi provides this
document “as is,” without warranty of any kind, expressed or implied, including,
but not limited to, the implied warranties of fitness or merchantability for a
particular purpose. Digi may make improvements and/or changes in this manual
or in the product(s) and/or the program(s) described in this manual at any time.
This guide provides information about the Digi ConnectCore for i.MX6 embedded core module
family.
Conventions used in this guide
This table describes the typographic conventions used in this guide:
This conventionIs used for
italic type
monospaced type
Digi Information
Emphasis, new terms, variables, and document titles.
Filenames, pathnames, and code examples.
Document Updates
Please always check the product specific section on the Digi support website at
www.digiembedded.com/support
for the most current revision of this document.
Contact Information
For more information about your Digi products, or for customer service and technical support,
contact Digi International.
To contact Digi International byUse
Digi International
Mail
World Wide Webhttp://www.digiembedded.com/support/
Telephone (U.S.)(952) 912-3444 or (877) 912-3444
Telephone (other locations)+1 (952) 912-3444 or (877) 912-3444
1101 Bren Road East
Minnetonka, MN 55343
U.S.A.
Additional Resources
Refer to the most recent Freescale i.MX6 processor reference manual and related documentation
(available on the Freescale web site at: http://www.freescale.com/imx6) for additional
information.
The ConnectCore 6 is an ultra-compact and highly integrated system-on-module solution based
on the Freescale i.MX6 Cortex-A9 processor family.
With processor speeds up to 1.2 GHz and fully interchangeable single-/dual-/quad-core variants,
the ConnectCore 6 offers a truly future-proof platform solution with scalable performance and
pre-certified wireless 802.11a/b/g/n and Bluetooth 4.0, including Bluetooth Low Energy
connectivity.
Its innovative and scalable design maximizes integration flexibility and significantly reduces
design risk in a highly cost-effective, reliable, low-profile surface mount form factor with optimal
thermal management even in the most demanding quad-core system configurations.
Seamless Cloud Connector integration as part of the Digi Linux and Android software platform
support offers secure remote management and web services capabilities through the scalable
Device Cloud™ by Etherios™.
In addition, Digi offers complete professional Etherios custom hardware and wireless design
services as well as end-to-end solutions services for cloud integration and app development.
ConnectCore 6 Features and Functionality
The ConnectCore for i.MX6 module is based on the i.MX6 processor from Freescale. This
processor offers a high number of interfaces. Most of these interfaces are multiplexed and are
not available simultaneously. The module has the following features:
• i.MX6 single/dual/quad ARM Cortex-A9 cores operating at speeds up to 1.2GHz.
• 32Kbytes L1 Instruction cache
• 32Kbytes L1 Data cache
• Up to 1MB unified Instruction/Data L2 cache
• NEON MPE (Media Processing Engine) co-processor
• Graphical Hardware accelerators:
• IPU (Image Processing Unit)
• Optional VPU (Video Processing Unit)
• Optional 2D/3D GPU (Graphics Processing Unit)
• 64-bit DDR3-1066 memory interface with a density up to 2GBytes.
• 8-bit eMMC support up to revision 4.4/4.41
• Dialog DA9063 Power Management IC (PMIC)
• 6x DC/DC buck converters
• 11x LDO regulators
• RTC with rechargeable coin cell battery support
• 10-bit ADC channels
• GPIO pins
• Optional IEEE802.11a/b/g/n WLAN interface with spatial diversity support.
• SATA II, 3.0Gbps (24-bit parallel bus, LVDS, HDMI, MIPI/DSI)
• Cameras (20-bit parallel bus, MIPI/CSI)
• MMC/SD/SDIO
• 1x USB OTG with integrated PHY
• 3x USB Host
• 1x Host with integrated PHY
• 2x Host with integrated HS-IC USB PHY
• PCI Express Gen 2.0 lane
• Gigabit Ethernet MAC
• 10/100M Ethernet MAC
• UART, SPI, I2C, PWM, CAN, I2S and GPIO
• Ultra-miniature SMT module (50x50mmx5mm) based on 400-LGA pads
IEEE 802.11 a/b/g/n and Bluetooth Features and Functionality
The RF interface of the ConnectCore for i.MX6 is handled by a Qualcomm-Atheros module
capable of 2.4 GHz and 5 GHz connections using 802.11 a/b/g/n and Bluetooth 4.0 (Dual mode
with Blueooth Low Energy support).
The module is built with coexistence in mind and handles the BT coexistence internally. Cellular
coexistence filtering is onboard to aid in designing systems susceptible to cellular interference.
Module Variants
The ConnectCore for i.MX6 module supports population options such as network interface
(Wi-Fi), memory (flash, RAM), MCU-assist, processor (single, dual and quad-cores), and others.
The ConnectCore for i.MX6 provides a primary 5V power supply input. This supply is the main
power domain to the on-module Dialog DA9063 power management IC (PMIC), which generates
all required supply voltages for the module components as well as the carrier board.
The module provides support for a backup battery (coin-cell or super cap) powering the realtime clock (RTC) on the module. In addition, rechargeable backup batteries (ML414, others) are
also supported.
The PMIC generates the following power domains that are available on the module pads:
• 3.3V (GEN_3V3)
Power
domain
3.3VDC/DC+/-3%1500mA-1µA1.2ms-
Regulator
type
Note: The maximum current consumption mentioned above is a combination of the current
consumed by the module and by the carrier board.
Moreover, 5x PMIC LDO outputs are also available on the module pads:
The table below provides the characteristics of the optional LDO outputs:
Turn
LDO
Output
voltage
Output
accuracy
Default
voltage
Maximum
current
Dropout voltage
(MAX)
Turn on time
(MAX)
off
time
(MAX)
VLDO3 0.9-3.44V +/-3%3.3V200mA150mV1µA300µs1ms
VLDO4 0.9-3.44V +/-3%3.3V200mA150mV1µA300µs1ms
VLDO6 0.9-3.6V +/-3%3.3V200mA150mV1µA200µs1ms
VLDO7 0.9-3.6V +/-3%1.8V200mA150mV1µA300µs1ms
VLDO8 0.9-3.6V +/-3%3.3V200mA150mV1µA300µs1ms
Quiescent
current in
OFF mode
(TYP)
Note:
• For information about using the LDOs options, please contact Digi.
• VLDO3 is used for supplying MCA processor on the module.
The power management IC located on the module is responsible for generating all required
i.MX6 processor supply voltages. The following i.MX6x supplies are available on the module
pads:
• NVCC_ENET
• NVCC_EIM
• NVCC_LCD
• NVCC_CSI
• NVCC_RGMII
Some of the I/O supplies are set on the module. See the table following table:
Power domainConnection
NVCC_GPIOGEN_3V3
NVCC_JTAGGEN_3V3
NVCC_NANDFGEN_3V3
NVCC_SD1GEN_3V3
NVCC_SD2GEN_3V3
NVCC_SD3GEN_3V3
The remaining I/O voltages must be set externally and are left open on the ConnectCore for
i.MX6 module. See the following table for operating ranges of the remaining I/O supplies.
As shown in the table above, the supplies have a wide operating range. In order to provide the
most cost-effective and flexible solution for a given use-case, the supplies listed in the table need
to be provided by the carrier board integrating the ConnectCore for i.MX6 module. However,
PMIC power domains 3.3V - and LDO3/4/6/7/8 options - are dedicated power sources for
supplying i.MX6 power domains.
The MCU - assist specific power domain (LDO3_MCA) available on the ConnectCore for i.MX6
LGA pads is a power supply output powering the on-module Kinetis processor.
The following diagram outlines the power supply approach of the ConnectCore for i.MX6. Inputs
are marked red, blue marks outputs.
The ConnectCore 6 is configured by default to boot in “Internal boot” mode. See the following
table:
BOOT_MODE [1:0]Boot type
00Boot from fuses
01Serial Downloader
10Internal Boot (default)
11Reserved
Note:
• 10K pull-up populated on BOOT_MODE1
• 10K pull-down populated on BOOT_MODE0
By default, the boot media configured on the ConnectCore for i.MX6 module is the on-module
eMMC. This is achieved by having the following resistors populated on the module:
• 10K pull-down on EIM_DA4 (BOOT_CFG1[4])
• 10K pull-up on EIM_DA5 (BOOT_CFG1[5])
• 10K pull-up on EIM_DA5 (BOOT_CFG1[6])
• 10K pull-up on EIM_DA7 (BOOT_CFG1[7]
• 10K pull-down on EIM_DA11 (BOOT_CFG2[3])
• 10K pull-up on EIM_DA12 (BOOT_CFG2[4])
When selecting “Internal Boot”, bootstrap pins shall be protected to insure a proper boot
process. “Internal Boot” has the benefit that multiple boot media can be supported. For mass
production, Digi recommends to use “Boot from fuses” for more security.
The following signals available on ConnectCore for i.MX6 pads have a limited usage:
NVCC_EIM
NVCC_EIM
• SD1_CLK (pad L21), SD1_CMD (pad J23), SD1_DAT[3:0] (pads L20, J21, J22 and N24) are
only available externally on modules which don't have Wi-Fi populated.
• SD3_DAT4/BT_UART_RXD (pad C22), SD3_DAT5/BT_UART_TXD (pad D23), SD3_CLK/
BT_UART_RTS (pad B21), SD3_CMD/BT_UART_CTS (pad E23) are only available externally on
modules which don't have Bluetooth populated.
• NANDF_CLE/BT_WAKE (pad E22) is only available externally on modules which don't have
Bluetooth populated.
• I2C2_SCL/KEY_COL3 (pad C3) and I2C2_SDA/KEY_ROW3 (pad F2) are used on the module
as I2C signals connected to the PMIC and MCA processor. Using these signals externally
should be done with caution, since it could prevent the module from working properly. It is
recommended that you use another I2C port for connecting external devices to the
ConnectCore i.MX6 module in order to avoid excessive bus load.
• NANDF_CS1/#MCA_INT (pad H21), CSI0_DAT11/ECSPI2_SS0 (pad A6), CSI0_DAT8/
ECSPI2_SCLK (pad D6), CSI0_DAT10/ECSPI2_MISO (pad K5) and CSI0_DAT9/ECSPI2_MOSI
(pad D5) are connected to MCA processor. #MCA_INT is a signal reserved as interrupt
between MCA processor and i.MX6 processor. The other signals are a SPI bus shared between
i.MX6 and MCA processor. The usage and availability of these signals is depending on the
firmware running in the MCA processor.
• ON/OFF (pad D18) signal is connected to PMIC and MCA.
• #POR (pad E18) is connected to PMIC and i.MX6 processor.
The ConnectCore 6 adapter board allows connecting the ConnectCore 6 module to the Jumpstart
board for the i.MX53 (JSCCWMX53), providing connections and hardware to use most of the
interfaces of the module for initial development and prototyping.
The ConnectCore 6 module is soldered on the adapter board. The adapter has two 2x90 pin
connectors for connecting the board to the JSCCWMX53.
The following picture shows the block diagram of hardware formed by the ConnectCore 6, the
adapter board and the JSCCWMX53. Dash boxes represent interfaces of the JSCCWMX53 that
are not connected to the adapter board.
Refer to the Single Board Computer (SBC) development board design information posted on the
Digi technical support website for a reference design based on a discrete implementation without
using an adapter board.
The ConnectCore 6 module has three I2C busses available on the module pinout. The default
configuration of the adapter board uses I2C2 and I2C3 busses. The following tables show the
configuration and use of these two I2C busses on the adapter board.
I2C2
This I2C bus is used internally on the ConnectCore 6 module. The bus is connected to the PMIC
and to the Kinetis MCA, and it's used to configure and monitor the PMIC.
This I2C bus is available on the module PADs, but should not be used unless absolutely
necessary. A problem on this bus can cause the module to not boot correctly.
Two 4K7 pull-up resistors to 3.3V are connected to the I2C2 lines on the ConnectCore 6 module.
The following table shows the interfaces connected to the I2C2 bus.
InterfaceSpeed (Kbps)Address
Kinetis MCA400SW configurable
PMIC400
Write: 0xB0
Read: 0xB1
Module PADs400
I2C3
The I2C bus is not used internally on the ConnectCore 6 module. Two 2K2 pull-up resistors to
3.3V are connected to the I2C3 lines on the adapter board.
The adapter board has a Gigabit PHY for the Gigabit interface. The address of the Gigabit PHY
can be configured with four configuration resistors.
The Gigabit PHY address configured by default is 0x0.
R32R24R30R31PHY Address
NOT Populated PopulatedNOT Populated Populated0x0
PopulatedNOT PopulatedNOT PopulatedPopulated0x1
NOT Populated PopulatedPopulatedNO Populated0x2
PopulatedNOT PopulatedPopulatedNOT Populated0x3
USB Host
The ConnectCore 6 module provides one USB Host port. This USB port can be connected on the
adapter board to the PCIe mini card connector and to the JSCCWMX53. Four configuration
resistors are used to select the interface where the USB Host is connected.
By default the USB Host port is connected to the JSCCWMX53.
R678R679R658R659USB host connection
NOT Populated NOT PopulatedPopulatedPopulatedTo JSCCWMX53
The Gigabit Ethernet PHY has two outputs to indicate the link and activity status of the port.
These outputs are connected to a green LED and to a yellow LED, integrated on the Ethernet
connector. The following table shows the link/activity status indicated by the two LEDs.
Yellow LED Green LEDLink/Activity Status
OFFOFFLink off
ONOFF1000 Link/ No activity
BlinkingOFF1000 Link/ activity (Rx, Tx)
OFFON100 Link/ No activity
OFFBlinking100 Link/Activity (Rx, Tx)
ONON10 Link/ No activity
BlinkingBlinking10 Link/ activity (Rx, Tx)
5V Regulator
The adapter board has several interfaces that need a regulated 5V supply. To generate this
supply one LTC3125 step-up DC/DC converter is used. This DC/DC converted can generate a
regulated 5V from a 1.8V to 5.5V input supply. The LTC3125 will maintain voltage regulation
even when the input voltage is above the desired output voltage.
The 5V regulator will be enabled by the ConnectCore 6 signal PWR_EN. On low power mode this
regulator will be disabled. The following table shows the interfaces of the adapter board where
the +5V supply is connected.
InterfaceComments
USBH1_VBUSPower supply for the USB Host controller of the i.MX6 CPU
The adapter board provides a 2-pin, 2.54mm pitch straight pin header for connecting an external
coin cell or super capacitor to power the RTC interface when the main supply is off. If higher
voltage is present on the main supply, it will be used as a power source for the RTC.
The following table shows the pinout of the coin cell connector.
PinSignalComments
1VCC_LICELLPower supply for RTC
2GNDGround
There are three types of components that can be connected to this connector: Lithium coin cells
(Primary cell: non-rechargeable), Lithium coin cells (Secondary cell: rechargeable), and
Supercaps. When a Primary Lithium coin cell is connected, the PMIC backup battery charger
must be turned off and this pin is used strictly as an input. It is hazardous to attempt to charge
Primary Lithium cells as they may vent or explode. Secondary Lithium coin cells are only made
available directly to manufacturers of equipment that could use them, in that case they are
normally required to design their product to prevent the user gaining access to this part since
there is a danger to the user if by replacing it, they fit a primary type (the only sort that they are
likely to be able to source) into the charging circuit. When a Secondary Lithium coin cell is used,
both the charging current and the termination voltage are programmable. When a Supercap is
used, both the charge current and termination voltage should be set to the maximum values.
The advantage of using a Primary Lithium coin cell is that the energy density usually allows years
of service since the self discharge rate is low. The advantage of using a Secondary Lithium coin
cell is that the self discharge rate is usually sufficient to allow a few months of support for the
RTC before it will need recharging. The advantage of the Supercap is that it is intrinsically safe
and can out-last the Primary Lithium coin cell option, however the self discharge rate is high
meaning that a 1F capacitor at 25° C is likely to support the RTC for approximately 5 to 10 days.
A programmable constant charge current charger with a programmable top-off charging voltage
is provided for charging of Secondary Lithium-Manganese coin cell batteries and super
capacitors. Charging current is programmable from 100uA to 6mA. Termination voltage is
programmable from +1.1 to +3.1V.
The minimum voltage of the coin cell supply is +2V. The maximum voltage of the coin cell supply
is +3.6V.
The adapter board has a triple-speed (10Base-T/100Base-Tx/1000Base-T) Ethernet PHY
connected to the RGMII interface of the ConnectCore 6 module. Two GPIO signals of the i.MX6
CPU are used to reset the Ethernet PHY (GPIO1_25) and as interrupt input from the PHY
(GPIO1_28).
Gigabit Connector, J3
The adapter board provides a Gigabit RJ-45 connector with integrated 1:1 transformer and link/
activity LEDs. The functionality of the two LEDs is detailed on chapter Gigabit Ethernet LEDs.
The following table shows the pinout of the Gigabit connector.
The ConnectCore 6 module provides an HDMI 1.4a compatible interface. The interface includes
the HDMI controller and PHY. Video resolutions up to 1080p@120Hz HDTV are supported. All
audio formats as specified by the HDMI Specification 1.4a are supported. Hot plug/unplug
detection is also supported.
The adapter board provides an HDMI port protection device with all ESD, overcurrent output
protection and backdrive protection for an HDMI port.
HDMI Connector, J22
The adapter board provides an HDMI connector, J22. The table below shows the pinout of the
HDMI connector.
The table below shows the pinout of the LVDS1 connector, P7:
PinSignalComments
1+3.3VGenerated on PMIC buckperi
2+3.3VGenerated on PMIC buckperi
3GND
4LVDS1_TX0_NTransmission pair 0 data -
5LVDS1_TX0_PTransmission pair 0 data +
6GND
7LVDS1_TX1_NTransmission pair 1 data-
8LVDS1_TX1_PTransmission pair 1 data +
9GND
10LVDS1_TX2_NTransmission pair 2 data-
11LVDS1_TX2_PTransmission pair 2 data+
12GND
13LVDS1_CLK_NTransmission pair clock-
14LVDS1_CLK_PTransmission pair clock+
15GND
16LVDS1_TX3_NTransmission pair 3 data-
17LVDS1_TX3_PTransmission pair 3 data+
18GND
19nc
20nc
21nc
22nc
23LVDS1_PENIRQ#Connected to i.MX6 GPIO_16 pad
24ECSPI2_MOSI
25ECSPI2_MISO
26ECSPI2_CLK
27ECSPI2_SS1Connected to i.MX6 EIM_LBA pad
28PWM1Shared with MIPI display
29+5VGenerated on adapter board
30+5VGenerated on adapter board
MIPI Camera and MIPI Display
The ConnectCore 6 board provides a MIPI camera serial interface (MIPI_CSI) compliant with the
MIPI CSI-2 specification. A MIPI D-PHY is also included on the module, allowing direct
connections between the module and a MIPI CSI-2 compliant camera sensor. This interface
supports up to 4 differential data pairs.
The ConnectCore for iMX6 board provides a MIPI display serial interface (MIPI_DSI) compliant
with the MIPI DSI specification. A MIPI D-PHY is also included on the module, allowing direct
connections between the module and a MIPI DSI compliant display. This interface supports up to
2 differential data pairs.
MIPI Connector
The adapter board provides a 2x15 pin, 0.5mm pitch connector (Molex 54167-0308) for the MIPI
interfaces. The following table shows the pinout of the MIPI connector.
PinSignalComments
1+5VSupply for camera and display
2CSI_D0_NMIPI Camera pair 0 data-
3+5VSupply for camera and display
4CSI_D0_PMIPI Camera pair 0 data+
5MIPI_I2C_SDAI2C2 bus
6GND
7MIPI_I2C_SCLI2C2 bus
8CSI_D1_NMIPI Camera pair 1 data-
9PWM1Shared with LVDS1 interface
10CSI_D1_PMIPI Camera pair 1 data+
11MIPI_BACKLGT_ONMIPI Display Backlight control
12GND
13MIPI_GPIO
14CSI_D2_NMIPI Camera pair 2 data-
15DSI_D0_PMIPI Display pair 0 data+
16CSI_D2_PMIPI Camera pair 2 data+
17DSI_D0_NMIPI Display pair 0 data-
Can be used to reset or disable a MIPI Camera or
display
The ConnectCore 6 module provides a PCI express controller and a PCI express PHY. The
adapter board has a half size mini PCIe card connector (J6) to support this interface.
The following interfaces are connected to the PCIe card connector:
• PCIe: Three differential pairs for transmit data, receive data and clock
• I2C3
• USB Host 2.0. This interface is shared with the USB connected to the JSCCWMX53. Please
refer to chapter Configuration Resistors to connect this interface for the PCIe connector
• PCIE_WAKE_N: output, open drain, low level signal to wake up the module
• PCIE_RESET_N: low level signal to reset the mini PCIe card.
The ConnectCore 6 module has a Kinetic microcontroller for wake up, power management
control, and analogue and digital GPIO expander.
The MCA can be programmed through the Serial Wire Debug (SWD) interface. These signals are
available on the module pinout and are connected on the adapter board to the MCA connector.
All the MCA signals that are not used internally on the ConnectCore 6 module are connected to
the module pinout. These signals can be used as GPIO, low leakage wake up sources, PWM
outputs, etc. On the adapter these signals are connected to the MCA connector.
Kinetis MCA Connector, P1
The adapter provides a 2x25 pin, 1.27mm pitch, pin header (SAMTEC TFM-125-32-L-D-A) for the
Kinetis MCA signals. Four of these signals are connected to the ConnectCore 6 module and also
to the touch screen inputs of the JSCCWMX53. The following table shows the pinout of this
connector.
The adapter board has two 2x90 pin connectors, J1 and J2, for connecting the board to the
Jumpstart Kit for CCW-i.MX53 board.
Most of the interfaces of the ConnectCore 6 are directly connected to the JSCCWMX53. Please
refer to chapter Block Diagram to see the interfaces that are directly connected between the
ConnectCore 6 and the JSCCWMX53 board.
The following paragraphs detail the connections between the ConnectCore 6 module and the
JSCCWMX53. For a detailed description of the JSCCWMX53 board please refer to the Hardware
Reference Manual of the JSCCWMX53.
Parallel Camera 0, CSI0
The following table shows the signals mapping between the parallel camera 0 of the adapter
board and the parallel camera 0 of the JSCCWMX53.
The ConnectCore 6 module provides an external interface module (EIM) to connect memory
mapped devices. This module is highly configurable to different modes, data length, address
length, etc. Most of the pins of the EIM are multiplexed with other functionalities. The following
table shows the signal mapping of the EIM signals between the JSCCWMX53 and the adapter
board module.
The JSCCWMX53 has four analog signals for a resistive touch screen connection. These four
analog inputs are connected to four analog input of the ConnectCore 6 module. These signals
are also connected to the Kinetis MCA connector on the adapter board.
The following table shows the signals mapping between the touch interface of the adapter board
and the touch interface of the JSCCWMX53.
Signal namePinSignal namePin
TOUCH_X1J2-39MCA_IO0T23
TOUCH_X2J2-41MCA_IO2R23
TOUCH_Y1J2-43MCA_IO4U24
TOUCH_Y2J2-45MCA_IO9R22
Keypad
The following table shows the signals mapping between the keypad interface of the adapter
board and the keypad interface of the JSCCWMX53.
The following table shows the signals mapping between the audio interface of the adapter board
and the audio interface of the JSCCWMX53.
JSCCWMX53Adapter board
Signal namePinSignal namePin
AUD5_TXDJ2-137CSI0_DAT5C7
AUD5_RXDJ2-139CSI0_DAT7M5
AUD5_TXCJ2-141CSI0_DAT4B7
AUD5_TXFSJ2-144CSI0_DAT6C5
AUD_HP_DETJ2-79NANDF_D0J24
PWM
The ConnectCore 6 module has three PWM signals generated by the PMIC. Two of these PWM
signals are connected to the PWM signals of the JSCCWMX53. The other PWM signal is
connected to the LVDS1 connector and to the MIPI connector of the adapter board, to control
the intensity of these displays.
The following table shows the connection between the PWM signals of the adapter board and the
PWM signals of the JSCCWMX53.
JSCCWMX53Adapter board
Signal namePinSignal namePin
PMIC_GPIO14/PWM1J2-27PMIC_GPIO14/PWM2Y10
PMIC_GPIO15/PWM2J2-32PMIC_GPIO15/PWM3V13
The following table shows the connection between the PWM signal of the adapter board and the
LVDS1 connector of the adapter board.
JSCCWMX53Adapter board
Signal namePinSignal namePin
PMIC_GPIO11/PWM1P4-28PMIC_GPIO11/PWM1V11
The following table shows the connection between the PWM of the adapter board and the MIPI
connector of the adapter board.
The JSCCWMX53 has a USB Hub connected to the USB Host interface. The following table shows
the signals mapping between the USB Host interface of the adapter board and the USB Host
interface of the JSCCWMX53.
JSCCWMX53Adapter board
Signal namePinSignal namePin
USB_H1_DNJ2-131USB_H1_DNC16
USB_H1_DPJ2-129USB_H1_DPD16
USB_HUB_RESET_NJ1-4EIM_DA10V21
USB OTG
The JSCCWMX53 has a USB OTG interface with a reduced number of signals. The over current
(USB_OTG_OC) and power enable (USB_OTG_PWR) signals are not used.
The following table shows the signals used in the JSCCWMX53 for the USB OTG interface and the
mapping of these signals on the module.
SD2
JSCCWMX53Adapter board
Signal namePinSignal namePin
USB_OTG_DNJ2-73USB_OTG_DNG16
USB_OTG_DPJ2-71USB_OTG_DPG17
USB_OTG_IDJ2-70GPIO_1K3
USB_OTG_VBUSJ2-72USB_OTG_VBUSG14
The following table shows the signal mapping between the SD2 interface of the adapter board
and the SD3 interface of the JSCCWMX53.
JSCCWMX53Adapter board
Signal namePinSignal namePin
SD3_CLKJ2-170SD2_CLKK22
SD3_CMDJ2-169SD2_CMDM20
SD3_DATA0J2-153SD2_DATA0P24
SD3_DATA1J2-156SD2_DATA1K21
SD3_DATA2J2-155SD2_DATA2R24
SD3_DATA3J2-158SD2_DATA3K23
Note: The microSD interface on the JSCCWMX53 does not have card detect and write
The ECSPI2 interface of the ConnectCore 6 module is connected on the adapter board to the
LVDS1 connector and to the JSCCWMX53 connector. This interface is also connected on the
module to the Kinetis MCA controller. Two chip select signals are used to control all these
connections.
The following table shows the signal mapping between the ECSPI2 interface of the adapter
board and the ECSPI1 interface of the JSCCWMX53.
JSCCWMX53Adapter board
Signal namePinSignal namePin
ECSPI1_MOSIJ2-111CSI0_DAT9D5
ECSPI1_MISOJ2-113CSI0_DAT10K5
ECSPI1_MCLKJ2-115CSI0_DAT8D6
ECSPI1_SS0J2-112EIM_LBA (ECSPI2_SS1)U21
ECSPI1_SS1J2-114CSI0_DAT11(ECSPI2_SS0)A6
The following table shows the signal mapping between the ECSPI2 interface of the adapter
board and the LVDS1 connector.
I2C3
LVDS1 on Adapter Adapter board
Signal namePinSignal namePin
ECSPI1_MOSIP7-24CSI0_DAT9D20
ECSPI1_MISOP7-25CSI0_DAT10K20
ECSPI1_MCLKP7-26CSI0_DAT8D19
ECSPI1_SS0P7-27EIM_LBA (ECSPI2_SS1)U4
The following table shows the signal connections between the ECSPI2 chip select signals and the
different interfaces. These signals are shared between more than one interface. Only one of the
shared interfaces can be used at the same time.
Signal
CSI0_DAT11(ECSPI2_SS0)Kinetis MCASPI Connector
EIM_LBA (ECSPI2_SS1)-LVDS1LVDS0
Adapter
board
AdapterJSCCWMX53
The following table shows the signal mapping between the I2C3 interface of the adapter board
and the I2C3 interface of the JSCCWMX53.
Operating temperatures stated below are Tj (i.MX6 junction temperatures) and are depending on
the actual processor population on the ConnectCore 6 module.
Industrial Variant: -40° C to +105° C
Extended Commercial Variant: -20° C to +105° C
Commercial Variant: 0° C to +95° C
The customer design must assure that the specified i.MX6 junction temperatures are not
exceeded during operation.
Storage temperature: -40°C to +85°C
Moisture Sensitivity and Shelf Life
a The ConnectCore for i.MX6 module is classified as a Level 3 Moisture Sensitive Device in
accordance with IPC/JEDEC J-STD-020.
b Calculated shelf life in sealed packaging: 12 months at <40°C and <90% relative humidity
(RH).
c Environmental condition during production: 30°C /60% RH according to IPC/JEDEC J-STD -
033A, paragraph 5.
d Maximum time between opening of the sealed packaging and reflow process must not exceed
168 hours, based on condition b), IPC/JEDEC J-STD -033A, paragraph 5.2.
e Baking is required, if conditions b) or c) do not apply. See above.
fBaking is required, if the packaging humidity indicator indicates 10% RH or higher.
g If baking is required, bake modules in trays 4-6 hours at 125°C; maximum stacking height is
10 trays.
Mounting
The ConnectCore 6 module has been designed with easy integration into existing SMT processes
in mind. Guidance for mounting the module on your carrier board is given in this section of the
document.
The ConnectCore 6 module is specified for one (1) soldering cycle only. Modules are also not
sealed and therefore they should not be subjected to a wash cycle or similar treatment where
condensation could occur. Contact Digi International for additional guidance to discuss conformal
coating approaches and options, if needed.Solder Paste
The following solder paste type has been approved for mounting the module on a carrier board:
• SAC305 (Lead-free: Alpha OM-340 Type 4 or equivalent)
The following solder paste printing parameters are recommended:
• Stencil Thickness: 0.15 mm/5 mil
• Stencil Diameter: One to one of Pad diameter (to +20% of pad)
• Paste alignment: 20% off the pad max (offset <20% pad diameter)
Stencil
The recommendation is to use a laser cut and/or electro-formed stencil for placing the
ConnectCore 6 module. Based on the actual coplanarity characteristics of your carrier board,
adjustments may be required to determine the optimal solder paste volume.
It is also recommended to perform an X-ray analysis of the initial production run of your
assembly with the ConnectCore 6. Please contact Digi for additional support.
Coplanarity
The coplanarity measured on the ConnectCore for 6 is <0.001" bow and twist (98% confidence
interval). It is important that the carrier board is also coplanar. If the carrier board is thinner
than the ConnectCore 6 it is recommended that the assembly be supported during the reflow
process, i.e. reflow fixture should be used to minimize the potential bow of the carrier card.
SMT Pick and Place
• Placement Nozzle: Large is available on the machine
• Nozzle Pick Surface: Center of Shield on i.MX6 SOM
• Placement Speed: Slowest speed for the machine
• Placement alignment: 10% of pad diameter (compensating for module weight and supporting
alignment). The module should be placed last as part of the assembly/mounting process to
eliminate unexpected shifting.
Paster alignment25% off the pad (offset <0.25* diameter
ConnectCore for i.MX6 Hardware Reference Manual
Placement nozzle0>15mm vacuum
Nozzle Pick SurfacePnP cap center
PnP
Reflow
SpeedSlowest speed for the machine
Placement SequencePlace the SoM last
Placement Alignment50% off the pad (offset <.5* diameter)
Belt speed0.6-1.1 m/sec
Refer to SMT profile recommendation in the next page
Reflow Profile Using Seven Zone Oven, SAC 305Lead-Free
Solder Paste (Alpha OM-340)
Time Above Liquidous (TAL) is recommended to be between 56 to 63 seconds. Use of 40AWG
K-type thermal couple and M.O.L.E or equivalent thermal profiler is recommended. The first
recommended thermal probe location is on the outer row of pads, to be on the out most row of
pins preferably a ground pad. The second thermal probe location is on the inner row of pads
preferably a signal pad.
The following image shows the reflow profile based on a seven zone convection oven.
The reflow profile shown above is valid for the combination solder paste/reflow machine and Digi
reference carrier board. Optimization of a reflow profile will depend on the selected solder paste/
reflow machine (reflow or vapor phase) and carrier board design.
The listed capabilities are dependent on software platform in use. Refer to the corresponding
software platform documentation for additional information.
• Class 1.5 Bluetooth with integrated TX/RX switch
Electrical Characteristics
Voltage supplies
ParameterMinTypMaxUnit
5V supply4.255.5V
VCC_LICELL2.03.0TBDV
LDO3_MCA1.713.33.6V
Note: No specific ESD protection components have been implemented on the ConnectCore
for i.MX6 module. ESD protection level on the module’s I/Os is the same as what is specified
in the freescale datasheet. Any required ESD protection must be implemented on the carrier
board.
The following image displays the current consumption of the ConnectCore for i.MX6 module
when booting respectively through U-Boot, Linux kernel and Android user space.
The ConnectCore™ for i.MX6 Module complies with Part 15 of the FCC rules and regulations.
Compliance with the labeling requirements, FCC notices and antenna usage guidelines is
required. To fulfill FCC Certification, the OEM must comply with the following regulations:
• The system integrator must ensure that the text on top side of the module is placed on the
outside of the final product.
• ConnectCore™ for i.MX6 Module may only be used with antennas approved [refer to the
antenna tables in this section].
WARNING: The Original Equipment Manufacturer (OEM) must ensure that FCC
labeling requirements are met. This includes a clearly visible label on the outside of the
final product enclosure that displays the contents shown in the figure below. Required
FCC Label for OEM products containing the ConnectCore™ for i.MX6 Module.
For WiFi/Bluetooth variant:
For WiFi only variant:
FCC Notices
Contains FCC ID: MCQ-CCIMX6B
This device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept ant interference received, including interference that
may cause undesired operation.
Contains FCC ID: MCQ-CCIMX6
This device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept ant interference received, including interference that
may cause undesired operation.
IMPORTANT: The ConnectCore™ for i.MX6 module has been certified by the FCC for use with
other products without any further certification (as per FCC section 2.1091). Modifications not
expressly approved by Digi could void the user's authority to operate the equipment.
IMPORTANT: OEMs must test final product to comply with unintentional radiators (FCC section
15.107 & 15.109) before declaring compliance of their final product to Part 15 of the FCC Rules.
IMPORTANT: The ConnectCore™ for i.MX6 module has been certified for remote and base radio
applications. If the module will be used for portable applications, the device must undergo SAR
testing. This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates
uses and can radiate radio frequency energy, and if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning
the equipment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures: Re-orient or relocate the receiving antenna, Increase the
separation between the equipment and receiver, Connect equipment and receiver to outlets on
different circuits, or Consult the dealer or an experienced radio/TV technician for help.
FCC-Approved Antennas
The ConnectCore™ for i.MX6 can be installed utilizing antennas and cables constructed with nonstandard connectors (RPSMA, RPTNC, and so on).
The modules are FCC approved for fixed base station and mobile applications for the channels
indicated in the tables below. If the antenna is mounted at least 20cm (8 in.) from nearby
persons, the application is considered a mobile application. Antennas not listed in the table must
be tested to comply with FCC Section 15.203 (Unique Antenna Connectors) and Section 15.247
(Emissions).
The antennas in the tables below have been approved for use with this module. Digi does not
carry all of these antenna variants. Contact Digi Sales for available antennas.
Antennas Approved for Use with the ConnectCore™ for i.MX6 Wi-Fi Modules
Omni- directional antennas
Part numberType (description)Peak Gain 2.4 GHzPeak Gain 5 GHz
Note: If using the RF module in a portable application (for example - if the module is used
in a hand-held device and the antenna is less than 20cm from the human body when the
device is in operation): The integrator is responsible for passing additional SAR (Specific
Absorption Rate) testing based on FCC rules 2.1091 and FCC Guidelines for Human Exposure
to Radio Frequency Electromagnetic Fields, OET Bulletin and Supplement C. The testing
results will be submitted to the FCC for approval prior to selling the integrated unit. The
required SAR testing measures emissions from the module and how they affect the person.
WARNING: To satisfy FCC RF exposure requirements for mobile transmitting devices,
a separation distance of 20 cm or more should be maintained between the antenna of
this device and persons during device operation. To ensure compliance, operations at
closer than this distance are not recommended. The antenna used for this transmitter
must not be co-located in conjunction with any other antenna or transmitter. The
preceding statement must be included as a CAUTION statement in OEM product
manuals in order to alert users of FCC RF Exposure compliance.
Europe (ETSI)
The ConnectCore™ for i.MX6 Module has been certified for use in several European countries.
For a complete list, refer to www.digi.com
If the ConnectCore™ for i.MX6 module is incorporated into a product, the manufacturer must
ensure compliance of the final product to the European harmonized EMC and low-voltage/safety
standards. A Declaration of Conformity must be issued for each of these standards and kept on
file as described in Annex II of the R&TTE Directive.
.
Furthermore, the manufacturer must maintain a copy of the ConnectCore™ for i.MX6 Hardware
Reference manual documentation and ensure the final product does not exceed the specified
power ratings, antenna specifications, and/or installation requirements as specified in the user
manual. If any of these specifications are exceeded in the final product, a submission must be
made to a notified body for compliance testing to all required standards.
OEM Labeling Requirements
The CE marking must be affixed to a visible location on the OEM product.
CE Labeling Requirements
The CE mark shall consist of the initials CE taking the following form:
• If the CE marking is reduced or enlarged, the proportions given in the above graduated
drawing must be respected.
• The CE marking must have a height of at least 5mm except where this is not possible on
account of the nature of the apparatus.
• The CE marking must be affixed visibly, legibly, and indelibly.
Digi has issued Declarations of Conformity for the ConnectCore™ for i.MX6 module concerning
emissions, EMC and safety. Files can be obtained by contacting Digi Support.
Note: Digi does not list the entire set of standards that must be met for each country. Digi
customers assume full responsibility for learning and meeting the required guidelines for each
country in their distribution market.
Approved Antennas
The same antennas have been approved for Europe as stated in the FCC table for use with the
ConnectCore™ for i.MX6 module.
Canada (IC)
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject
to the following two conditions: (1) this device may not cause interference, and (2) this device
must accept any interference, including interference that may cause undesired operation of the
device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne
doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Labeling Requirements
Labeling requirements for Industry Canada are similar to those of the FCC. A clearly visible label
on the outside of the final product enclosure must display the following text:
For WiFi/Bluetooth variant:
Contains Model ConnectCoreTM for i.MX6 Radio, IC: 1846A-CCIMX6B
For WiFi only variant:
Contains Model ConnectCoreTM for i.MX6 Radio, IC: 1846A-CCIMX6
The integrator is responsible for its product to comply with IC ICES-003 & FCC Part 15, Sub. B Unintentional Radiators. ICES-003 is the same as FCC Part 15 Sub. B and Industry Canada
accepts FCC test report or CISPR 22 test report for compliance with ICES-003.
Transmitters with Detachable Antennas
This radio transmitter (IC: 1846A-CCIMX6 / IC: 1846A-CCIMX6B) has been approved by Industry
Canada to operate with the antenna types listed in the table above with the maximum
permissible gain and required antenna impedance for each antenna type indicated. Antenna
types not included in this list, having a gain greater than the maximum gain indicated for that
type, are strictly prohibited for use with this device.
Le présent émetteur radio (IC: 1846A-CCIMX6 / IC: 1846A-CCIMX6B) a été approuvé par
Industrie Canada pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un
gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types
d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont
strictement interdits pour l'exploitation de l'émetteur.
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of
a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To
reduce potential radio interference to other users, the antenna type and its gain should be so
chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary
for successful communication.
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut
fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour
l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique
à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la
puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à
l'établissement d'une communication satisfaisante.