DFI KS211, KS212 User Manual

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1

Chapter 1 Introduction

KS211/212

7” Touch Panel PC

User’s Manual

A27010427

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2

Chapter 1 Introduction

Copyright

This publication contains information that is protected by copyright. No part of it may be reproduced in any form or by any means or used to make any transformation/adaptation without the prior written permission from the copyright holders.

This publication is provided for informational purposes only. The manufacturer makes no representations or warranties with respect to the contents or use of this manual and specifically disclaims any express or implied warranties of merchantability or fitness for any particular purpose. The user will assume the entire risk of the use or the results of the use of this document. Further, the manufacturer reserves the right to revise this publication and make changes to its contents at any time, without obligation to notify any person or entity of such revisions or changes.

Trademarks

Product names or trademarks appearing in this manual are for identification purpose only and are the properties of the respective owners.

FCC and DOC Statement on Class B

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio TV technician for help.

Notice:

1. The changes or modifications not expressly approved by the party responsible for compli-

ance could void the user’s authority to operate the equipment.

2. Shielded interface cables must be used in order to comply with the emission limits.

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Chapter 1 Introduction

Table of Contents

Copyright �� 2

Trademarks �� 2

FCC and DOC Statement on Class B ��2

About this Manual ��4

Warranty ��4

Static Electricity Precautions ��4

Safety Measures ��4

About the Package ��5

Chapter 1 - Introduction ��6

Overview �� 6 Key Features ��6 Specifications �� 7 Getting the Know the KS211/212 ��9 Mechanical Dimensions �� 10

Chapter 2 - Installation �� 11

Connecting Cables to Terminal Blocks �� 11 Removing the Chassis Cover ��12

Chapter 3 - Hardware Installation �� 13

Board Layout ��13 System Memory �� 13 Jumper Settings �� 13 Top Panel I/O Port �� 16

Side Panel I/O Port �� 16 Bottom Panel I/O Ports ��17

Chapter 4 - Mounting Options �� 22

Wall Mount �� 22 Panel Mount ��23

Appendix A - BSP User Guide �� 22

Appendix B – Android BSP Known Issue ��35

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Chapter 1 Introduction

About this Manual

An electronic file of this manual is included in the CD. To view the user’s manual in the CD, insert the CD into a CD-ROM drive. The autorun screen (Main Board Utility CD) will appear. Click “User’s Manual” on the main menu.

Warranty

1. Warranty does not cover damages or failures that arised from misuse of the product, inability to use the product, unauthorized replacement or alteration of components and product specifications.

2. The warranty is void if the product has been subjected to physical abuse, improper installation, modification, accidents or unauthorized repair of the product.

3. Unless otherwise instructed in this user’s manual, the user may not, under any circumstances, attempt to perform service, adjustments or repairs on the product, whether in or out of warranty. It must be returned to the purchase point, factory or authorized service agency for all such work.

4. We will not be liable for any indirect, special, incidental or consequencial damages to the product that has been modified or altered.

Important:

Static Electricity Precautions

It is quite easy to inadvertently damage your PC, system board, components or devices even before installing them in your system unit. Static electrical discharge can damage computer components without causing any signs of physical damage. You must take extra care in handling them to ensure against electrostatic build-up.

1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are ready to install it.

2. Wear an antistatic wrist strap.

3. Do all preparation work on a static-free surface.

4. Hold the device only by its edges. Be careful not to touch any of the components, contacts

or connections.

5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or con nectors by their ends.

Safety Measures

To avoid damage to the system:

• Use the correct AC input voltage range.

To reduce the risk of electric shock:

• Unplug the power cord before removing the system chassis cover for installation or servic-

ing. After installation or servicing, cover the system chassis before plugging the power cord. Battery:

• Danger of explosion if battery incorrectly replaced.

• Replace only with the same or equivalent type recommend by the manufacturer.

• Dispose of used batteries according to local ordinance.

Electrostatic discharge (ESD) can damage your processor, disk drive and other components. Perform the upgrade instruction procedures described at an ESD workstation only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system chassis throughout any procedures requiring ESD protection.

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Chapter 1 Introduction

About the Package

The package contains the following items. If any of these items are missing or damaged, please contact your dealer or sales representative for assistance.

• 1 7” Touch Panel PC

• 3 Terminal blocks

• 1

24V power adapter

• 1 CD disk includes: Manual

• 1 Quick Installation Guide

Optional Items

• Wall Mount kit

• Panel Mount kit

• Power Cord

The board and accessories in the package may not come similar to the information listed above. This may differ in accordance to the sales region or models in which it was sold. For more information about the standard package in your region, please contact your dealer or sales representative.

Safety Precautions

• Use the correct DC input voltage range.

• Unplug the power cord before removing the system chassis cover for installation or servicing. After installation or servicing, cover the system chassis before plugging the power cord.

• Danger of explosion if battery incorrectly replaced.

• Replace only with the same or equivalent type recommend by the manufacturer.

• Dispose of used batteries according to local ordinance.

• Keep this system away from humidity.

• Place the system on a stable surface. Dropping it or letting it fall may cause damage.

• The openings on the system are for air ventilation to protect the system from overheating. DO NOT COVER THE OPENINGS.

• Place the power cord in such a way that it will not be stepped on. Do not place anything on top of the power cord. Use a power cord that has been approved for use with the system and that it matches the voltage and current marked on the system’s electrical range label.

• If the system will not be used for a long time, disconnect it from the power source to avoid damage by transient overvoltage.

• If one of the following occurs, consult a service personnel:

- The power cord or plug is damaged.

- Liquid has penetrated the system.

- The system has been exposed to moisture.

- The system is not working properly.

- The system dropped or is damaged.

- The system has obvious signs of breakage.

• The unit uses a three-wire ground cable which is equipped with a third pin to ground the unit and prevent electric shock. Do not defeat the purpose of this pin. If your outlet does not support this kind of plug, contact your electrician to replace the outlet.

• Disconnect the system from the DC outlet before cleaning. Use a damp cloth. Do not use liquid or spray detergents for cleaning.

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Chapter 1 Introduction

Chapter 1 - Introduction

Chapter 1

Overview KS211

KS212

Top View

Bottom View

Side View

Top View

Bottom View

Side View

Key Features

• 7" WVGA Touch Screen Fanless Panel PC

• 1GB DDR3 onboard

• 4GB eMMC onboard

• 4 customizable function keys (KS211)

• 1 SD/MMC socket

• 1 HDMI, 2 USB 2.0, 1 Mini USB, 1 LAN, 1 COM, 12-bit GPIO

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Chapter 1 Introduction

EXPANSION SLOTS

• 1 Mini PCIe slot (DFI Proprietary)

- Supports half size Mini PCIe card

- Supports USB interface for 3G module

• 1 SIM card slot

POWER • 9~30Vdc (+/-10%) power input voltage FRONT PANEL

PROTECTION

• IP65 (Dust Tight; Water Proof protection)

CONSTRUCTION

• Aluminum front bezel, rugged metal housing

MOUNTING

• Wall mount (VESA 75x75)

• Panel mount (Mounting clamp)

ENVIRONMENT • Temperature

- Operating: -15oC ~ 60oC

- Storage: -30oC ~ 80oC

• Relative Humidity

- 95% RH at 60oC

DIMENSIONS • 235mm x 150mm x 40.80mm (W x H x D) WEIGHT

•

2.10 kg

OS SUPPORT• Android 2.3

• LTIB Linux 2.6.35.3

Specifications KS211

PROCESSOR • Freescale i.MX535

- ARM Cortex-A8 core

- Processor speed: up to 1GHz

SYSTEM MEMORY • DDR3 onboard

• Onboard

memory

- 1GB: standard

- 2GB: option

LCD and TOUCH SCREEN

• 7” (800x480) WVGA TFT touch screen LCD

• Supports touch screen

- TI

®

TSC2004 touch screen controller

• 400 NITS

• 4-Wire Resistive touch screen

STORAGE • 8Mbit EEPROM (option)

•

1 SD/MMC socket

• Supports 4GB (standard), 8GB and 16GB eMMC onboard

ONBOARD LAN FEATURES

• SMSC 8710 10/100 Ethernet transceiver

AUDIO • SGTL5000 2-channel audio codec

• 2 built

-in 2W speakers (left and right sides)

• 1 Line-out

GPIO

• 1 12-bit GPIO connector (6 bit in/6 bit out, with power)

I/O PORTS • Front

- 1 Power LED

- 4 function keys

• Bottom

- 1 DB-9 RS232/422/485 serial port

- 1 HDMI port

- 1 Mini USB port (device Type B)

- 2 USB 2.0/1.1 ports (Type A)

- 1 Line-out jack

- 12-bit GPIO (2 7-pole terminal blocks)

- 1 2-pin 9-30V DC-in jack

- 1 power switch

- 1 LAN port

• Side

- 2 built-in 2W speakers (left and right sides)

• Top

- 1 SD/MMC card socket

Chapter 1

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Chapter 1 Introduction

Chapter 1

Specifications KS212

EXPANSION SLOTS

• 1 Mini PCIe slot (DFI Proprietary)

- Supports half size Mini PCIe card

- Supports USB interface for 3G module

• 1 SIM card slot

POWER • 9~30Vdc (+/-10%) power input voltage CONSTRUCTION

• Aluminum front bezel, rugged metal housing

FRONT PANEL PROTECTION

• IP65 (Dust Tight; Water Proof protection)

MOUNTING •

VESA 75x75

ENVIRONMENT • Temperature

- Operating: -15oC ~ 60oC

- Storage: -30oC ~ 80oC

• Relative Humidity

- 95% RH at 60oC

DIMENSIONS • 230.40mm x 142.32mm x 35.80mm WEIGHT

•

1.90 kg

OS SUPPORT• Android 2.3

• LTIB Linux 2.6.35.3

PROCESSOR • Freescale i.MX535

- ARM Cortex-A8 core

- Processor speed: up to 1GHz

SYSTEM MEMORY • DDR3 onboard

• Onboard

memory

- 1GB (standard)

- 2GB: option

LCD and TOUCH SCREEN

• 7” (800x480) WVGA TFT touch screen LCD

• Supports touch screen

- TI

®

TSC2004 touch screen controller

• 400 NITS

• 4-Wire Resistive touch screen

STORAGE • 8Mbit EEPROM (option)

•

1 SD/MMC socket

• Supports 4GB (standard), 8GB and 16GB eMMC onboard

ONBOARD LAN FEATURES

• SMSC 8710 10/100 Ethernet transceiver

AUDIO • SGTL5000 2-channel audio codec

• 2 built

-in 2W speakers (left and right sides)

• 1 Line-out

GPIO

• 1 12-bit GPIO connector (6 bit in/6 bit out, with power)

I/O PORTS • Bottom

- 1 DB-9 RS232/422/485 serial port

- 1 HDMI port

- 1 Mini USB port (device T

ype B)

- 2 USB 2.0/1.1 ports (Type A)

- 1 Line-out jack

- 12-bit GPIO (2 7-pole terminal blocks)

- 1 2-pin 9-30V DC-in jack

- 1 power switch

- 1 LAN port

• Side

- 2 built-in 2W speakers (left and right sides)

• Top

- 1 SD/MMC card socket

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Chapter 1 Introduction

Getting to Know the KS211/212

Chapter 1

Front View

Power LED

Indicates the power status of the system.

Function Keys (KS211)

Used to navigate through the pages.

Top View

SD/MMC

Indicates to insert and SD and MMC.

Bottom View

COM

Used to connect a serial device.

Mini USB

Used to connect a Mini USB device (only as client).

USB

Used to connect USB 2.0/1.1 devices.

LAN

Used to connect the system to a local area network.

GPIO

Supports 6-bit input and 6-bit output GPIO connector (with power).

Line-out

Used to connect to a speaker.

DC-in

Used to plug a power adapter.

Power Switch

Press to power-on or power-off the system.

HDMI

Used to connect an HDMI device.

Power LED Function Keys

SD/MMC

2W built-in speaker

Side View

Speaker

Bult-in with 2W speaker in the right and left sides.

Power Switch

Line-out

USB 9-30V DC-in

HDMI

RS232/422/485 COM

12-bit GPIO

Mini USB

LAN

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Chapter 1 Introduction

Mechanical Dimensions KS211

KS212

Chapter 1

Left View

214.60

235.00

150.00

40.80

Bottom View

Right View

Top View

Front View

125.60

35.80

90.00

20.99

4.49

133.00

142.32

11.2095.00

20.20190.00

90.00

153.00 (A,A FOR T/P)

154.40 (V,A FOR T/P)

190.00

221.00

230.40

20.20

65.85

92.04

93.40

214.60

(A,A FOR T/P)

(V,A FOR T/P)

Ø3.50

Bottom View

Right View

Top View

Front ViewLeft View

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Chapter 2 Installation

Chapter 2 - Installation

Chapter 2

Connecting Cables to Terminal Blocks

Important:

When installing the touch panel PC, make sure the power is off. Failure to turn off, may cause severe damage to the system.

1. Insert the cable end of the power adaptor to the terminal block. To firmly fix the cable into

the terminal block, use a screwdriver to clamp down the wires to the screw that is in the terminal block.

2. Plug the terminal block into the DC-in connector and then tighten the screws to secure the terminal block in place.

Terminal block

Wire

Power adapter cable

DC-in connector

Screws

White Wire

Black Wire

+ -

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Chapter 2 Installation

1. Make sure the system and all other peripheral devices connected to it has been poweredof f.

2. Disconnect all power cords and cables.

3. The 8 mounting screws on the rear side of the system are used to secure the cover to the chassis. Remove these screws and then put them in a safe place for later use.

Removing the Chassis Cover

Mounting Screw

4. After removing the mounting screws, lift the cover up.

5. The Mini PCIe slot and SIM card slot are readily accessible after removing the chassis cover.

Lift the Cover Upward

Mini PCIe Slot

SIM card slot

Mounting Screw

Chapter 2

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Chapter 3 Hardware Installation

Chapter 3

Chapter 3 - Hardware Installation

Board Layout

1ON23456

SW4

1

10

3

COM1 debug

port

1

109

2

Power LED

Chassis Intrusion

Freescale i.MX535

DDR3

1

Clear CMOS

(JP1)

RTC_Battery

DDR3

1

39

LVDS

2

40

1

AMP_R

VGA

1

15

2

16

Reset

Power Button

JTAG

1 2

11 12

SW28

SW29

456 1

ON

2378

456 1

ON

2378

3G LED

MIC

AMP_L

SIM

1

13 14

2

DIO

USB 6-7

3G_Modem

1

2

9

10

HDMI Chip Sil9022

Audio Chip

SGTL5000 LAN Chip SMSC 8710

Panel Power

Select

(J11)

UART 2 Chip

SP338

PMIC DA9053

COM2 RS232/422/485 HW/SW Mode Select(JP7)

112

2

12

1

+ -

MMC/SD

HDMI

Line-out

Mini USB

LAN

USB 4-5

COM2

DC-in

System Memory

DDR3

Important:

Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in boards, and other components. Perform installation procedures at an ESD workstation only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system chassis throughout any procedures requiring ESD protection.

Important:

When the Standby Power LED lit red, it indicates that there is power on the system board. Power-off the PC then unplug the power cord prior to installing any devices. Failure to do so will cause severe damage to the motherboard and components.

•DDR3onboard

•Onboardmemory

- 1GB: standard

- 2GB: optional

Power LED

Features

DDR3

eMMC

Touch Screen

5

1

Android Hot Key Connector

Top View

Bottom View

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Chapter 3 Hardware Installation

Chapter 3

Jumper Settings

Clear CMOS Data

If you encounter the following,

a) CMOSdatabecomes corrupted.

b) You forgot the supervisor or user password.

youcanreconfigurethesystemwith thedefaultvalues storedintheROM BIOS.

Toloadthedefault valuesstoredinthe ROMBIOS,please followthesteps below.

1. Power-off the system and unplug the power cord.

2. SetJP1pins2and 3toOn. Waitforafew secondsandset JP1backto itsdefaultsetting, pins1 and2On.

3. Now plug the power cord and power-on the system.

JP1

2-3On: ClearCMOS Data

1-2On:

Normal (default)

3

1

2

3

1

2

COM RS232/RS422/RS485 Select

SW4(forCOM2)isusedto configuretheCOM porttoRS232, RS422(FullDuplex) orRS485.

JP7is usedtoconfigurethe COMportset viathehardware modeorsoftwaremode.

Note:

IfyouusetheSW4to selectRS232/RS422/ RS485,makesure JP7isset viathe

“Hardware Mode”.

12

10

3

1

1-4-7-10,2-5-8-11 On:

Software Mode (default)

2-5-8-11,3-6-9-12 On:

Hardware Mode

12

10

3

1

RS232/RS422/RS485 Select: COM (SW4)

RS232

1On,2-3Off

RS422

1,2On,3Off

RS485

2On,1,3Off

SW4

JP7

COM:

RS232/422/485

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Chapter 3 Hardware Installation

Chapter 3

Panel Power Select MMC/SD Mode Select

2-3On:

+3.3V (default)

1-2On: +5V

J11 is used to select the power that supplies with the LVDS panel.

Important:

Before powering-on the system, make sure J11’s setting matches the LVDS panel’s specification. Selecting the incorrect voltage will seriously damage the LVDS panel.

J11

3

1

2

3

1

2

SW28 SW29

MMC/SD Mode SW29 SW28

Program Mode

All off 5,6On

eMMC Boot

2,3,4,7On 1On

SD Boot

2On All off

SW28and SW29areusedto settheMMC/SD Cardsocketvia theselectionsof ProgramMode,

eMMC Boot, or SD Boot.

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Chapter 3 Ports and Connectors

Ports and Connectors Top Panel I/O Port

Chapter 3

SD/MMC

The front panel I/O port consist of the following:

• 1 SD/MMC card socket

SD/MMC

card socket

This expansion port is used to insert a Secure Digital (SD) or Multimedia Card (MMC) device. Aside from storing data files, an SD card is also capable of storing powerful software applications.

Side Panel I/O Port

2W built-in speaker

The side panel I/O port consist of the following:

• 2 2W built-in speaker (right and left sides)

Built-in Speaker

1

AOUT_R+

AOUT_R-

AOUT_L+

AOUT_L-

The amplify connectors right/left which have amplifying feature are used to connect external speakers. Using the same signal cable to connect with external speaker.

1

AMP_R

AMP_L

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Chapter 3 Ports and Connectors

Chapter 3

Bottom Panel I/O Ports

The bottom panel I/O ports consist of the following:

• 1 12-bit GPIO (6-bit in/6-bit out)

• 1 HDMI port (Type B)

• 1 Mini USB port

• 1 Line-out jack

• 1 RS232/422/485 COM port

• 1 LAN port

• 2 USB 2.0/1.1 ports (Type A)

• 1 DC-in

GPIO

17

8 14

Power Switch

Line-out

USB 9-30V DC-in

HDMI

RS232/422/485 COM

12-bit GPIO

Mini USB

LAN

8

The 12-bit Digital I/O (6-bit input and 6-bit output) connector provides powering-on function to external devices that are connected to these connectors. The pin functions of the digital I/O connector are listed below:

GPIO Connector

Pins Function Pins Function

1

DIO_OUT-1

8

DIO_IN-4

2

DIO_IN-1

9

DIO_OUT-5

3

DIO_OUT-2

10

DIO_IN-5

4

DIO_IN-2

11

DIO_OUT-6

5

DIO_OUT-3

12

DIO_IN-6

6

DIO_IN-3

13 DC_5V_BB

7

DIO_OUT-4 14 GND

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Chapter 3 Ports and Connectors

HDMI

The HDMI interface which carries both digital audio and video signals is used to connect a LCD monitor or digital TV that has the HDMI port.

HDMI

Note:

The graphics features are controlled by CPU. When HDMI and LVDS displays simultaneously, the system board transmits video signals from HDMI port only. The LVDS works on the system board will make the screen dark.

Mini USB

The Mini USB is a device that can act as client role. It indicates the concept of one-to-one connection between two devices which are connected directly in order to transfer data bilaterally.

Chapter 3

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Chapter 3 Ports and Connectors

Chapter 3

Line-out

The line-out jack is used to connect a headphone or external speakers.

Line-out

COM (Serial) Port

COM:

RS232/422/485

The pin function of COM port will vary according to JP7/SW4’s settings. Refer to “COM RS232/ RS422/RS485 Select” in this chapter for more information.

The serial COM port is an asynchronous communication port with 16C550A-compatible UARTs that can be used with modems, serial printers, remote display terminals, and other serial devices.

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Chapter 3 Ports and Connectors

Chapter 3

USB 2.0/1.1 Ports

USB allows data exchange between your computer and a wide range of simultaneously accessible external Plug and Play peripherals.

The system board is equipped with two onboard USB 2.0/1.1 ports (USB 4-5). The 10-pin connector allow you to connect two additional USB 2.0/1.1 ports (USB 6-7). The additional USB ports may be mounted on a card-edge bracket. Install the card-edge bracket to an available slot at the rear of the system chassis and then insert the USB port cables to a connector.

LAN Port

The LAN port allows the system board to connect to a local area network by means of a network hub.

Features

• SMSC 8710 10/100M Ethernet transceiver

LAN

10

VCC

-Data

+Data

GND

Key

VCC

-Data

+Data

GND

N.C.

9

1

2

USB 2.0

USB 6-7

USB 2.0

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Chapter 3 Ports and Connectors

This DC-in terminal block provides a maximum of 60W power and is considered a low power solution. Connect a DC power cord to this jack. Use a power adapter with 9~30V DC output voltage. Using a voltage higher than the recommended one may fail to boot the system or cause damage to the system board.

9~30V DC-in

DC-in

Chapter 3

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Chapter 4 Mounting Options

Chapter 4 - Mounting Options

Chapter 4

Wall Mount

The wall mount kit includes the following:

• 2 Wall mount brackets

• Bracket screws

Wall mount bracket 1 Wall mount bracket 2

1. Select a place on the wall where you will mount the Panel PC.

2. Use the provided mounting screws to attach “wall mount bracket 1” to the wall.

Wall mount bracket 1

Mounting screw

4. Using the hooks on “bracket 2”, slide the Panel PC to “bracket 1”.

Wall mount bracket 1

Wall mount bracket 2

3. Attach the other bracket (wall mount bracket 2) to the rear of the Panel PC.

Wall mount bracket 2

Mounting screw

Hooks

5. Tighten the screw to hold the assembly in place.

Mounting screw

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Chapter 4 Mounting Options

Panel Mount

The panel mounting kit includes the following:

• 6 mounting clamps

1. Select a place on the panel where you will mount the Panel PC.

2. Cut out a shape on the panel that corresponds to the Panel PC’s rear dimensions (217.6mm x 128.6mm).

128.60

217.60

3. Stick the poron foam on the rear panel.

Poron foam

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Chapter 4 Mounting Options

Chapter 4

4. Slide the Panel PC through the hole until it is properly ﬁ tted against the panel.

5. Position the mounting clamps along the rear edges of the Panel PC, ﬁ tting them into the slits

that are around the Panel PC.

Slit for mounting the clamp

Mounting clamp

White plastic cap

6. The ﬁ rst and second clamps must be positioned and secured diagonally prior to mounting the

rest of the clamps. Tighten the clamp’s screw using an electric screwdriver until the white plastic cap touches the panel. Do not over tighten the screws to prevent damaging the Panel PC. The illustration below shows all clamps properly mounted.

Panel wall

128.60

217.60

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Appendix A

Appendix A - BSP User Guide Build Android for FS200-M53

Get Android Source Code (Android/Kernel/uboot)

Please get an Android BSP from DFI for implementing your android system, which contains the bootloader (uboot), kernel code, and android system, as well as tool chain, on the FS200 board. You can find out a compressed file named ‘Android_2_3_7_sources_v115_3G.tar.gz’.

Supposed that you works in the linux system. Please use linux commands to extract this compressed file.

#tar –zxvf Android_2_3_7_sources_v115_3G.tar.gz After extracting this compressed file, you can find out the specified folder, Android_2_3_7_

sources_v115_3G, containing several sub-folders that include uboot , kernel, android system and tool chain folders, respectively.

Find folders

Please enter the ‘Android_2_3_7_sources_v115_3G’ folder to find out the following sub-folders.

• Bootable – represents the uboot folder

• Kernel_imx – represents the kernel system

• Prebuilt/linux-x86/toolchain – this folder contains all relevant tool compilers to build up

several systems.

• Others – represents all files used for android system

Build Uboot Images

Before building up uboot images, please set up the working environments described in the following table on the right.

Assumed that your root folder is Android_2_3_7_sources_v115_3G.

$cd Android_2_3_7_sources_v115_3G/bootable/bootloader/uboot-imx $export ARCH=arm $export CROSS_COMPILE=~/android_fs200/Android_2_3_7_sources_v115_3G/prebuilt/linux-x86/toolchain/arm-eabi-4.3.1/bin/arm-eabi$make distclean $make mx53_smd_android_config $make

After finishing ‘make’ command, it will generate the uboot image located in the ~/Android_2_3_7_sources_v115_3G/bootable/bootloader/uboot-imx folder.

"u-boot.bin" is generated if you have built it up successfully. The u-boot.bin has 1024 Bytes padding at the head of file, for example, first executable

instruction is at the offset 1KB. If you want to generate a no-padding image, you have to do dd command in host listed below.

$ sudo dd if=./u-boot.bin of=./u-boot-no-padding.bin bs=1024 skip=1; sync This no-padding uboot image is usually used in the SD card, for example, programming this

no-padding uboot image into 1KB offset of SD card so that we do not overwrite the MBR (including partition table) within first 512B on the SD card.

Please use the u-boot.bin image to program on the eMMC flash by using the ‘mfgtool’ tool.

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Build Kernel Image

Kernel image will be established by using the following commands and working environments.

Set the working path to your specified folder. Please take care of the setting of tool chain version in the path.

export PATH=~/Android_2_3_7_sources_v115_3G/bootable/bootloader/uboot-imx/ tools:$PATH cd Android_2_3_7_sources_v115_3G/kernel_imx export ARCH=arm export CROSS_COMPILE=~/Android_2_3_7_sources_v115_3G//prebuilt/linux-x86/toolchain/armeabi-4.4.3/bin/arm-eabimake distclean make imx5_fs200_android_v106_defconfig

Generate the kernel image

make uImage -j4 make M=drivers/usb/class

With a successful establishment in the above case, the generated kernel image is ~/Android_2_3_7_sources_v115_3G/kernel_imx/arch/arm/boot/uImage.

Please use the generated image to program kernel to emmc via Mfgtool and read the Mfgtool section for more details of programming.

Build Android Image

The environment for the development of android system should contain the following folders respectively. The functions of these folders are explained below.

root/ : root file system (including init, init.rc, etc). Mounted at / system/: Android system binary/libraries. Mounted at /system data/: Android data area. Mounted at /data recovery/: root file system when booting in the "recovery" mode. Not directly used. ramdisk.img: Ramdisk image is generated from "root/". Not directly used. android_system.img: UBI raw image is generated from "system/." It contains system, data

and cache UBI volumes with UBIFS format. android_recovery.img: UBI raw image is generated from "recovery/." It contains recovery UBI volumes with UBIFS format.

Please use the following steps to build up the Android image:

After processing the above procedures, it will generate five images listed below in the ~/Android_2_3_7_sources_v115_3G/out/target/product/imx53_smd folder.

1. ramdisk.img

2. recovery.img

3. system.img

4. userdata.img

5. uImage.img

export PATH=~/Android_2_3_7_sources_v115_3G/prebuilt/linux-x86/toolchain/arm-eabi-4.4.3/ bin:$PATH export LOCAL_PATH=~/Android_2_3_7_sources_v115_3G/:$PATH cd Android_2_3_7_sources_v115_3G export ARCH=arm

The version of cross_compile is ‘arm-eabi-4.4.3’. Please don’t change the version for building kernel. export CROSS_COMPILE=~/Android_2_3_7_sources_v115_3G/prebuilt/linux-x86/toolchain/armeabi-4.4.3/bin/arm-eabiexport TOPDIR=~/Android_2_3_7_sources_v115_3G/ make distclean source ./build/envsetup.sh lunch imx53_smd-user #lunch make -j4

Lunch is a distributed process launcher for GNU/Linux. The Lunch master launches lunch-slave processes through an encrypted SSH session if on a remote host. Those slave processes can in turn launch the desired commands on-demand.

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Generate uRamdisk to be loaded by uboot

The following steps generate a RAMDISK image recognized by uboot:

Assumed that you had already built up the uboot. The mkimage was generated under ~/Android_2_3_7_sources_v115_3G/bootable/bootloader/uboot-imx/tools/

$ cd ~/Android_2_3_7_sources_v115_3G/out/target/product/imx53_smd $ ~/Android_2_3_7_sources_v115_3G/bootable/bootloader/uboot-imx/tools/mkimage

-A arm -O linux -T ramdisk -C none -a 0x70308000 -n "Android Root Filesystem"

-d ./ramdisk.img ./uramdisk.img

Please use the mfgtool to program these images to the corresponding partitions in the android system.

System on MMC/SD and eMMC

Android system supports running on the MMC/SD card, or the onboard eMMC device. Currently, it supports eMMC device for booting on the FS200 board.

We need images listed below to create an android system on MMC/SD or eMMC device:

•u-boot image:u-boot.bin

•kernelimage:uImage

•ramdiskimage: uramdisk.img

•Androidsystemrootimage:system.img

•Recoveryroot image:recovery.img

You can get all the images from the release package, or build up by yourself as the section 1 described.

If you want to boot it from the SD card, please change the init.rc in the uramdisk.img and modify all the ‘mmcblk0px’ to ‘mmcblk1px’, as we take the eMMC block device as mmcblk0, but the external SD slot as mmcblk1.

The following table describes how to modify the ‘mmcblk0px’ to ‘mmcblk1px’ for booting the SD card.

Note:

FS200 takes eMMC as the default storage for android system, so the default images in the release package only support android boot from the onboard eMMC device.

# dd if=uramdisk.img of=ramdisk.img.gz skip=64 bs=1 # gunzip ramdisk.img.gz # mkdir ramdisk; cd ramdisk # cpio -i < ../ramdisk.img # vim init.rc (modify the init.rc, change the mmcblk0 to mmcblk1) # find . | cpio --create --format=’newc’ | gzip > ../ramdisk.img # mkimage -A arm -O linux -T ramdisk -C none -a 0x70308000 -n “Android Root Filesystem” -d ./ramdisk.img ./uramdisk.img

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Storage Partitions

The layout of the MMC/SD card or eMMC for Android system is showed below.

• [Partition type/index] is defined in the MBR.

• [Name] is only meaningful in android, you can ignore it when creating these partitions.

• [Start Offset] shows where partition is started, unit in MBytes.

The SYSTEM partition is used to put the established android system image. The DATA is used to put application’s unpacked codes/data, the database of system configurations, etc. In the normal boot mode, the root file system is mounted from uRamdisk. In the recovery mode, the root file system is mounted from the REOVERY partition.

Partition

Type/Index

Name Start Offset Size File System Content

N/A BOOT 0 10MB N/A

bootloader/kernel/ uramdisk images

Primary 1 MEDIA 10MB

User Defined

VFAT. Mount as/ sdcards

Media file storage

Primary 2 SYSTEM follow MEDIA ≥ 200MB

EXT4. Mount as/ system (with read only)

Android system bin/ libs (system.img)

Logic 5 (Extended 3)

DATA follow SYSTEM > 200MB

EXT4. Mount as/ data

Android data (e.g. installed app)

Logic 6 (Extended 3)

CACHE follow DATA > 10MB

EXT4. Mount as/ cache

Android cache

Primary 4 RECOVERY follow CACHE > 20MB

EXT4. Mount as/ in recovery mode

Root file system for recovery mode (recovery.img)

To create these partitions, you can simply use the MFG tool described in the next section, or use the fdisk utility on Linux PC.

After creating the partition by fdisk, please format each file system via the following commands:

# mkfs.vfat /dev/sdx1 # mkfs.ext4 /dev/sdx2 -O ^extent -L system # mkfs.ext4 /dev/sdx4 -O ^extent -L recovery # mkfs.ext4 /dev/sdx5 -O ^extent -L data # mkfs.ext4 /dev/sdx6 -O ^extent -L cache

Note:

/dev/sdxN, the x is the disk index from ‘a’ to ‘z’, that may be different from each Linux PC.

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MFG Tool Guide

The features, including windows style GUI, multiple devices support, explicit status monitoring, versatile functionalities and highly flexible architecture, make it a best choice to meet your critical timing, cost and customization requirements.

Please follow the steps to program android system images.

Step 1

Unzip the tool package to your local directory, say: D:\mfgtools-rel\, and enter it, you will find out an .exe file named MfgTool.exe. Without any installation steps, you can run it directly. So, just run it. You should be able to see the user interface below.

Step 2

The user interface appears to have nothing to do since there is nothing is selected, so let’s configure something necessary.

Click Profile drop menu and you will find out many platforms. Choose the right one based on your platform.

Step 3

Now you need to connect your board to one USB port on your PC. Please make sure that you have set the board to the bootstrap mode before powering on the board.

If your device is the device listed below, then you will find that a device with the HID mode appears on your PC when you connect your board to one USB port and power on it. Please jump to Step 4.

i.MX23/28/50

If your device is the device listed below, then you have to install driver for it:

i.MX25/35/51/53

A popup window as shown below will appear when you connect your board to one USB port and power on it.

Choose the “Install from a list or specific location” option and click the “Next” button.

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Input your driver location:

YourDiskVolume:\mfgtools-rel\Drivers\iMX_BulkIO_Driver and click “Next.”

Click the “Finish” button to finish the driver installation.

Step 4

Click the “Scan” button on the main dialog to auto scan the devices connected to your PC.

The other way is to click the “Options” menu at upper-right corner, and further click configuration item. Then, a popup window as shown below will appear. Click the “USB Ports” tab and you can view all the USB ports. Choose the one which your device is connected and click the “OK” button to close the window.

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Step 5

Now you can find that the tool is ready to do a demo work. Click the “Start” button. If you have a terminal tool to monitor the debug serial port on your board, it is suggested to open it. You can get more information from it.

Step 6

The process is ongoing.

You can find some information from the terminal.

It turns to green if all works are done. Click the “Stop” buton to finish the demo process of the tool.

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How to do your own work

If you are an operator in the factory, then all the knowledge you need is enough till now. But, if you are a developer, you will probably have a couple of questions such as how to burn my own image and default files, how to choose the dedicated storage device, etc.

The answer lies in a script: ucl.xml.

Manufacturing tool allows one to use the script to configure his/her own task list. Let’s have an overview of it. Open the file as shown below:

YourDiskVolume:\mfgtools-rel\Profiles\MX53 Linux Update\OS Firmware\ucl.xml

You can find that the script consists of one CFG section and a number of LIST sections. Never change the CFG section which is used to guide some platform specific configurations to the tool.

How to choose the dedicated storage device

You can see each LIST section which actually indicates one storage media type. Then how to choose the one you need?

There are two ways to do this:

Method 1: Open the file as shown below: YourDiskVolume:\mfgtools-rel\Profiles\ MX53 Linux Update\player.ini

You will find the sentences as listed below: [OS Firmware] UCL_INSTALL_SECTION=NAND

The value “NAND” is one of the names in these LIST sections. Change it to your own choice.

Method 2: You can also change the setting through the tool’s GUI. Click the “Options” menu at upperright corner, and then further click the configuration item. A popup window as the following picture on the right will appear.

Left-click the Options item on the blue column, and then a popup window as shown below will appear.

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Choose your own setting and click “OK” to close the window. It’s done.

Then go back to the main menu after configurating and press the ‘Start’ icon to program the specified images.

Boot from MMC/SD and eMMC

Before booting from the SD or eMMC device, please configure the jumper switch (SW28 and SW29) to provide functions.

Booting from eMMC setting:

Booting from MMC/SD:

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When a MMC/SD or eMMC device is ready for Android system boot, you can power on the board to setup the u-boot environment for loading the kernel/ramdisk from the device by pressing any key to enter.

On the u-boot shell:

U-Boot > setenv ethaddr 00:04:9f:00:ea:d3 [setup the MAC address] U-Boot > setenv fec_addr 00:04:9f:00:ea:d3 [setup the MAC address] U-Boot > setenv loadaddr <kernel load addr> [0x90800000 for i.MX51, 0x70800000 for i.MX50/3] U-Boot > setenv rd_loadaddr <ramdisk load addr> [0x90D00000 for i.MX51, 0x70D00000 for i.MX50/3] U-Boot > setenv bootcmd 'run bootcmd_eMMC; bootm ${loadaddr} ${rd_loadaddr}' U-Boot > setenv bootcmd_eMMC 'mmc read 1 ${loadaddr} 0x800 0x2000; mmc read 1 ${rd_loadaddr} 0x3000 0x300;' [load kernel and ramdisk from MMC/SD or eMMC] [About the SD boot, please use the "mmc read 0" replace the "mmc read 1"] U-Boot > setenv bootargs <SD/MMC bootargs> [For different platforms, please refer to below table] U-Boot > saveenv [Save the environments]

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Appendix B

Appendix B – Android BSP Known Issue

1. The video playing cannot support the clone display with Android 2.3, provided by Freescale.

The video playing is only available on the HDMI output and the KS211/212 LCD panel is blank.

2. The static IP is not supported by Android 2.3, provided by Freescale.

3. The USB device icon of the Android 2.3 toolbar cannot work properly after the connection is

removed from the host PC.

4. The signal noise might happen on the LCD panel while the screen backlight flashes quickly.

5. In the airplane mode, the concurrent BSP is not available.