This publication contains information that is protected by copyright. No part of it may be reproduced in any form or by any means or used to make any transformation/adaptation without
the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no
representations or warranties with respect to the contents or use of this manual and specifically disclaims any express or implied warranties of merchantability or fitness for any particular
purpose. The user will assume the entire risk of the use or the results of the use of this document. Further, the manufacturer reserves the right to revise this publication and make changes
to its contents at any time, without obligation to notify any person or entity of such revisions
or changes.
Changes after the publication’s first release will be based on the product’s revision. The website
will always provide the most updated information.
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
COM Express Specification Reference
PICMG® COM Express ModuleTM Base Specification.
http://www.picmg.org/
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.
Appendix B - Watchdog Sample Code ................................................83
Appendix C - System Error Message ...................................................84
Appendix D - Troubleshooting ................................................................85
67
3
www.dfi .comChapter 1 Introduction
About this Manual
Static Electricity Precautions
An electronic file of this manual is included in the CD. To view the user’s manual in the CD, insert the CD into a CD-ROM drive. The autorun screen (Main Board Utility CD) will appear. Click
“User’s Manual” on the main menu.
Warranty
1. Warranty does not cover damages or failures that arised from misuse of the product, inability to use the product, unauthorized replacement or alteration of components and product specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper installation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circumstances, attempt to perform service, adjustments or repairs on the product, whether in or
out of warranty. It must be returned to the purchase point, factory or authorized service
agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequencial damages to the
product that has been modified or altered.
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in handling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are
ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, contacts
or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or connectors by their ends.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other components. Perform the upgrade instruction procedures described at an ESD workstation only. If such a station is not available, you can provide some ESD protection by
wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system
chassis throughout any procedures requiring ESD protection.
Safety Measures
To avoid damage to the system:
• Use the correct AC input voltage range.
To reduce the risk of electric shock:
• Unplug the power cord before removing the system chassis cover for installation or servicing. After installation or servicing, cover the system chassis before plugging the power
cord.
4
www.dfi .comChapter 1 Introduction
About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
• One HU968 board
• One QR (Quick Reference)
• One DVD
• Heat spreader with heat sink and fan
Optional Items
• COM331-B carrier board kit
• Heat sink with fan
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Before Using the System Board
Before using the system board, prepare basic system components.
If you are installing the system board in a new system, you will need at least the following
internal components.
• Storage devices such as hard disk drive, CD-ROM, etc.
You will also need external system peripherals you intend to use which will normally include at
least a keyboard, a mouse and a video display monitor.
• Provides software license protection, enforcement and password protection
• Supports iAMT9.5
• Out-of-band system access
• Remote troubleshooting and recovery
• Hardware-based agent presence checking
• Proactive alerting
• Remote hardware and software asset tracking
®
Smart Response Technology
Expansion
Interfaces
Damage Free
Intelligence
BIOS
Power
Power
Consumption
WatchDog
• Supports 2 USB 3.0 interfaces
• Supports 8 USB 2.0 interfaces
• Supports 1 PCIe x4; or 2 PCIe x2; or 4 PCIe x1 interfaces
• Supports 1 PCIe x2; or 1 PCIe x1 interface
• Supports 1 PCIe x1 interface (PCIe Lane 6 shares with 1 SATA 3.0 port)
• Supports LPC interface
• Supports SMBus interface
• Supports I
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/1.05V/DDR voltages and failure alarm
• Watchdog timer function
• AMI BIOS
- 64Mbit SPI BIOS
2
C interface
• Input: 12V, VCC_RTC, 5VSB* (optional)
• TBD
• Software programmable from 1 to 255 seconds
Timer
OS Support
Temperature
Humidity
PCB
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
• Windows 8.1 Enterprise x86 (32-bit)
• Windows 8.1 Enterprise x64 (64-bit)
• Operating: 0oC to 60oC
• Storage: -20
o
C to 85oC
• 5% to 90%
• Dimensions
- COM Express
®
Compact
- 95mm (3.74") x 95mm (3.74")
• Compliance
- PICMG COM Express
®
R2.1, Type 6
Note:
*Optional and is not supported in standard model. Please contact your sales representative for more information.
6
www.dfi .comChapter 1 Introduction
Chapter 1
Features
• Watchdog Timer
The Watchdog Timer function allows your application to regularly “clear” the system at the set
time interval. If the system hangs or fails to function, it will reset at the set time interval so
that your system will continue to operate.
• DDR3L
DDR3L is a higher performance DDR3 SDRAM interface providing less voltage and higher
speed successor. DDR3L supporting 1600MHz
proved performance to provide its higher bandwidth and its increase in performance at a lower
power.
delivers increased system bandwidth and im-
• Graphics
The integrated Intel® HD graphics engine delivers an excellent blend of graphics performance
and features to meet business needs. It provides excellent video and 3D graphics with outstanding graphics responsiveness. These enhancements deliver the performance and compatibility needed for today’s and tomorrow’s business applications. It supports VGA, LVDS and DDI
interfaces for 3 display outputs.
• Serial ATA
Serial ATA is a storage interface that is compliant with SATA 1.0a specification. With speed of
up to 6Gb/s (SATA 3.0), it improves hard drive performance faster than the standard parallel
ATA whose data transfer rate is 100MB/s. The bandwidth of the SATA 3.0 will be limited by
carrier board design.
• Gigabit LAN
The Intel® I218LM with iAMT9.5 Gigabit LAN controller supports up to 1Gbps data transmission.
• USB
The system board supports the new USB 3.0. It is capable of running at a maximum transmission speed of up to 5 Gbit/s (625 MB/s) and is faster than USB 2.0 (480 Mbit/s, or 60 MB/s)
and USB 1.1 (12Mb/s). USB 3.0 reduces the time required for data transmission, reduces
power consumption, and is backward compatible with USB 2.0. It is a marked improvement
in device transfer speeds between your computer and a wide range of simultaneously
accessible external Plug and Play peripherals.
7
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Chapter 2 - Concept
COM Express Module Standards
The figure below shows the dimensions of the different types of COM Express modules.
HU968 is a COM Express Compact module. The dimension is 95mm x 95mm.
Common for all Form Factors
Extended only
Basic only
Compact only
Compact and Basic only
Mini only
Chapter 2
106.00
Extended
91.00
18.00
6.00
0.00
4.00
0.00
16.50
Mini
8
74.20
80.00
91.00
BasicCompact
70.00
51.00
4.00
121.00
151.00
www.dfi .comChapter 2 Concept
Chapter 2
/
/
/
A
)
A
A
A
)
Specification Comparison Table
The table below shows the COM Express standard specifications and the corresponding specifications supported on the HU968 module.
COM Express Module Base
ConnectorFeature
A-B
A-BPCI Express Lanes 0 - 51 / 66 (PCIE Lans 4-5 support PCIEx2 or PCIEx1 only)
A-BLVDS Channel A0 / 11
A-BLVDS Channel B0 / 11
A-BeDP on LVDS CH A pins0 / 10
A-BVGA Port0 / 10/1 (Option : DDI2 or VGA)
A-BTV-OutNANA
A-BDDI 0NANA
5
A-B
A-BCAN interface on SER10 / 10
A-BSATA / SAS Ports1 / 42/3 (Option : PCIE Lane 6 or SATA Port 2)
A-BAC’97 / HDA Digital Interface0 / 11
A-BUSB 2.0 Ports4 / 88
A-BUSB Client0 / 10
A-BUSB 3.0 PortsNANA
A-BLAN Port 01 / 11
A-BExpress Card Support1 / 22
A-BLPC Bus1 / 11
A-BSPI1 / 21
A-B
0
0
N
0/1(Option : PCIE Lane 6 or SATA Port 2
N
N
N
1/2(Option : DDI2 or VGA
2
12
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Chapter 3 - Hardware Installation
HD Audio
USB 2.0 8x
SATA 3.0
2x
USB 3.0 2x
C Bus
(Opt. share with DP to VGA)
)
LPC Bus
2nd SPI Bus
Board Layout
CPU Fan
1
Intel
I218LM
TPM (optional)
Chrontel
CH7517
DDR3L
DDR3L
SPI Flash BIOS
BGA 1168
Intel
iTE
IT8528E
Power LED
(optional)
Standby
SSD
DDR3L
DDR3L
DDR3L
DDR3L
NXP
PTN3460
Top View
Chapter 3
Block Diagram
LVDS Port
(Dual Channel)
eDP to LVDS
R.G.BDDI Port 2
DP to VGA
HD Audio
LPC Bus
Backup
EEPROM
2
I
C Bus
WDT
Embedded
Serial Port1,
PWM/TACH
A / B
4 in/4 out DIO
PCIe x1 Lane 0~3 (4 x1 or 2 x2 or 1 x4)
Controller
2 Tx/Rx
IT8528E
Sys Fan
SM Bus
SM Bus
USB 2.0 8x
SATA 3.0 2x
SSD Chip
(Optional)
SATA 3.0 1x
(Opt. share with PCIe x1 Lane 6)
LAN
Intel® GLAN
I218LM
PCIe x1 Lane 4~5 (1 x1 or 1 x2)
DIO
TPM 1.2
SLB9635
(optional)
SM Bus
SATA 3.0 1x
eDP
PCIe x1
4th Generation
®
Intel
Core™ i7/i5/i3;
®
Intel
Celeron
™
VR12.6
(Vcore)
DDI Port 2
(Opt. share with DP to VGA)
DDI Port 1
DDR3L
2GB/4GB/8GB
DDR3 1600MHz
Dual Channel
USB 3.0 2x
PCIe x1 Lane 6
C / D
DDR3L
DDR3L
D110
C110
B110
A110
COM Express connector
COM Express connector
2nd SPI Bus
Bottom View
D1
C1
B1
A1
10
www.dfi .comChapter 3 Hardware Installation
Mechanical Diagram
Chapter 3
53.00
HU968 Module with Heat Sink
95.00
20.00
55.00
95.00
Fan
Heat sink
Heatspreader
Module PCB
91.00
4.00
0.00
0.00
HU968 Module
4.00
4.00
52.63
80.00
91.00
95.00
95.00
91.00
4.00
Top View
11.00 22.00
Standoff
Side View of the Module with Heat Sink and Carrier Board
2.00
Bottom View
18.00
6.00
0.00
0.00
74.20
11
16.50
www.dfi .comChapter 3 Hardware Installation
Chapter 3
System Memory
Important:
Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in
boards, and other components. Perform installation procedures at an ESD workstation
only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If
a wrist strap is unavailable, establish and maintain contact with the system chassis
throughout any procedures requiring ESD protection.
System Memory
The system board is equipped with 2GB/4GB/8GB DDR3L system memory onboard supporting
1600MHz, dual channel memory interface.
Important:
When the Standby Power LED lit red, it indicates that there is power on the board.
Power-off the PC then unplug the power cord prior to installing any devices. Failure to
do so will cause severe damage to the board and components.
DDR3L
DDR3L
DDR3L
DDR3L
DDR3L
DDR3L
Bottom View
Top View
DDR3L
DDR3L
Standby
Power LED
12
www.dfi .comChapter 3 Hardware Installation
Chapter 3
Connectors
CPU Fan Connector
Sense
+12V
Ground
Connect the CPU fan’s cable connector to the CPU fan connector on the board. The cooling fan
will provide adequate airflow throughout the chassis to prevent overheating the CPU and board
components.
BIOS Setting
1
3
COM Express Connectors
The COM Express connectors are used to interface the HU968 COM Express board to a carrier
board. Connect the COM Express connectors (located on the solder side of the board) to the
COM Express connectors on the carrier board.
Refer to the “Installing HU968 onto a Carrier Board” section for more information.
COM Express Connectors
“Module Board H/W Monitor” submenu in the Advanced menu of the BIOS will display the current speed of the cooling fan. Refer to chapter 3 of the manual for more information
.
Refer to the following pages for the pin functions of these connectors.
Pin Types
I Input to the Module
O Output from the Module
I/O Bi-directional input / output signal
OD Open drain output
C97/HDA Signals Description
SignalPin#Module Pin Type Pwr Rail /ToleranceHU968Carrier BoardDescription
AC/HAD_RST#A30O CMOS3.3V Suspend/3.3VConnect to CODEC pin 11 RESET#Reset output to CODEC, active low.
AC/HDA_SYNCA29O CMOS3.3V/3.3VConnect to CODEC pin 10 SYNCSample-synchronization signal to the CODEC(s).
AC/HDA_BITCLKA32I/O CMOS3.3V/3.3VConnect to CODEC pin 6 BIT_CLKSerial data clock generated by the external CODEC(s).
AC/HDA_SDOUTA33O CMOS3.3V/3.3VConnect to CODEC pin 5 SDATA_OUTSerial TDM data output to the CODEC.
AC/HDA_SDIN2B28I/O CMOS3.3V Suspend/3.3VNA
AC/HDA_SDIN1B29I/O CMOS3.3V Suspend/3.3VConnect 33 ƻ in series to CODEC1 pin 8 SDATA_IN
AC/HDA_SDIN0B30I/O CMOS3.3V Suspend/3.3VConnect 33 ƻ in series to CODEC0 pin 8 SDATA_IN
Gigabit Ethernet Signals Description
SignalPin#Module Pin Type Pwr Rail /ToleranceHU968Carrier BoardDescription
GBE0_MDI0+A13I/O Analog3.3V max Suspend
GBE0_MDI0-A12I/O Analog3.3V max Suspend
GBE0_MDI1+A10I/O Analog3.3V max Suspend
GBE0_MDI1-A9I/O Analog3.3V max Suspend
GBE0_MDI2+A7I/O Analog3.3V max Suspend
GBE0_MDI2-A6I/O Analog3.3V max Suspend
GBE0_MDI3+A3I/O Analog3.3V max Suspend
GBE0_MDI3GBE0_ACT#B2OD CMOS3.3V Suspend/3.3VConnect to LED and recommend current limit resistor 150ȟ to 3.3VSBGigabit Ethernet Controller 0 activity indicator, active low.
GBE0_LINK#A8OD CMOS3.3V Suspend/3.3VNCGigabit Ethernet Controller 0 link indicator, active low.
GBE0_LINK100#A4OD CMOS3.3V Suspend/3.3VConnect to LED and recommend current limit resistor 150ȟ to 3.3VSBGigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active low.
GBE0_LINK1000#A5OD CMOS3.3V Suspend/3.3VConnect to LED and recommend current limit resistor 150ȟ to 3.3VSBGigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active low.
SATA Signals Description
SignalPin#Module Pin Type Pwr Rail /ToleranceHU968Carrier BoardDescription
SATA0_TX+A16O SATAAC coupled on ModuleAC Coupling capacitor
SATA0_TX-A17O SATAAC coupled on ModuleAC Coupling capacitor
SATA0_RX+A19I SATAAC coupled on ModuleAC Coupling capacitor
SATA0_RX-A20I SATAAC coupled on ModuleAC Coupling capacitor
SATA1_TX+B16O SATAAC coupled on ModuleAC Coupling capacitor
SATA1_TX-B17O SATAAC coupled on ModuleAC Coupling capacitor
SATA1_RX+B19I SATAAC coupled on ModuleAC Coupling capacitor
SATA1_RX-B20I SATAAC coupled on ModuleAC Coupling capacitor
SATA2_TX+A22O SATAAC coupled on ModuleAC Coupling capacitor
SATA2_TX-A23O SATAAC coupled on ModuleAC Coupling capacitor
SATA2_RX+A25I SATAAC coupled on ModuleAC Coupling capacitor
SATA2_RX-A26I SATAAC coupled on ModuleAC Coupling capacitor
SATA3_TX+B22O SATAAC coupled on ModuleNA
SATA3_TX-B23O SATAAC coupled on ModuleNA
SATA3_RX+B25I SATAAC coupled on ModuleNA
SATA3_RX-B26I SATAAC coupled on ModuleNA
ATA_ACT#A28I/O CMOS3.3V / 3.3VPU 10K to 3.3VConnect to LED and recommend current limit resistor 220ƻ to 3.3VATA (parallel and serial) or SAS activity indicator, active low.
O PCIEAC coupled on ModulePCI Express Differential Transmit Pairs 0
I PCIEAC coupled off ModulePCI Express Differential Receive Pairs 0
O PCIE
I PCIEAC coupled off Module
O PCIEAC coupled on ModulePCI Express Differential Transmit Pairs 2
I PCIEAC coupled off Module
O PCIEAC coupled on Module
I PCIEAC coupled off Module
O PCIEAC coupled on Module
I PCIEAC coupled off ModulePCI Express Differential Receive Pairs 4
AC coupled on ModulePCI Express Differential Transmit Pairs 1
Connect to Magnetics Module MDI0+/-
Connect to Magnetics Module MDI1+/-
Connect to Magnetics Module MDI2+/-
Connect to Magnetics Module MDI3+/-
Connect to SATA0 Conn TX pin
Connect to SATA0 Conn RX pinSerial ATA or SAS Channel 0 receive differential pair.
Connect to SATA1 Conn TX pin
Connect to SATA1 Conn RX pinSerial ATA or SAS Channel 1 receive differential pair.
Connect to SATA2 Conn TX pin
Connect to SATA2 Conn RX pinSerial ATA or SAS Channel 2 receive differential pair.
Connect to PCIE device or slot
Device - Connect AC Coupling cap 0.1uF
Slot - Connect to PCIE Conn pin
Connect to PCIE device or slot
Device - Connect AC Coupling cap 0.1uF
Slot - Connect to PCIE Conn pin
Connect to PCIE device or slot
Device - Connect AC Coupling cap 0.1uF
Slot - Connect to PCIE Conn pin
Connect to PCIE device or slot
Device - Connect AC Coupling cap 0.1uF
Slot - Connect to PCIE Conn pin
Connect to PCIE device or slot
Device - Connect AC Coupling cap 0.1uF
Slot - Connect to PCIE Conn pin
Serial TDM data inputs from up to 2 CODECs.
Gigabit Ethernet Controller 0: Media Dependent Interface Differential
Pairs 0,1,2,3. The MDI can operate in 1000, 100 and 10 Mbit / sec
modes. Some pairs are unused in some modes, per the following:
1000BASE-T 100BASE-TX 10BASE-T
MDI[0]+/- B1_DA+/- TX+/- TX+/ MDI[1]+/- B1_DB+/- RX+/- RX+/ MDI[2]+/- B1_DC+/ MDI[3]+/- B1_DD+/-
Serial ATA or SAS Channel 0 transmit differential pair.
Serial ATA or SAS Channel 1 transmit differential pair.
Serial ATA or SAS Channel 2 transmit differential pair.
Serial ATA or SAS Channel 3 transmit differential pair.
Serial ATA or SAS Channel 3 receive differential pair.
(Optional with on board LAN, Default setting as NC)
PCI Express Differential Receive Pairs 7
(Optional with on board LAN, Default setting as NC)
Reference clock output for all PCI Express and PCI Express Graphics
lanes.
SignalPin#Module Pin Type Pwr Rail /ToleranceHU968Carrier BoardDescription
EXCD0_CPPE#A49PU 10k to 3.3V
EXCD1_CPPE#B48PU 10k to 3.3V
EXCD0_PERST#A48
EXCD1_PERST#B47
DDI Signals Description
SignalPin#Module Pin Type Pwr Rail /ToleranceHU968Carrier BoardDescription
DDI1_PAIR0+/SDVO1_RED+D26Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR0-
SDVO1_RED-D27Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR1+/SDVO1_GRN+D29Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR1-/SDVO1_GRN-D30Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR2+/SDVO1_BLU+D32Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR2-/SDVO1_BLU-D33Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR3+/SDVO1_CK+D36Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR3-/SDVO1_CK-D37Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR4+
DDI1_PAIR4-/SDVO1_INT-C26NA
DDI1_PAIR5+/SDVO1_TVCLKIN+C29NA
DDI1_PAIR5-/SDVO1_TVCLKIN-C30NA
DDI1_PAIR6+/SDVO1_FLDSTALL+C15NA
DDI1_PAIR6-/SDVO1_FLDSTALL-C16NA
DDI1_CTRLCLK_AUX+/SDVO1_CTRLCLK D15
DDI1_CTRLCLK_AUX-/SDVO1_CTRLDATA D16
DDI1_HPDC24I CMOS3.3V / 3.3VPD 1M and Connect to device Hot Plug DetectDDI Hot-Plug Detect
DDI1_DDC_AUX_SELD34I CMOS3.3V / 3.3VPD 1M to GNDPU 100K to 3.3V for DDC(HDMI/DVI)
DDI2_PAIR0+D39Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR0-D40Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR1+D42Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR1-D43Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR2+D46Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR2-D47Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR3+D49Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR3-D50Connect AC Coupling Capacitors 0.1uF to Device
DDI2_CTRLCLK_AUX+C32
DDI2_CTRLCLK_AUX-C33
DDI2_HPDD44I CMOS3.3V / 3.3VPD 1M and Connect to device Hot Plug DetectDDI Hot-Plug Detect
DDI2_DDC_AUX_SELC34I CMOS3.3V / 3.3VPD 1M to GNDPU 100K to 3.3V for DDC(HDMI/DVI)
SDVO1_INT+C25N
O PCIEAC coupled on ModulePCI Express Graphics transmit differential pairs 14
I PCIEAC coupled off Module
O PCIEAC coupled on ModulePCI Express Graphics transmit differential pairs 15
I PCIEAC coupled off ModulePCI Express Graphics receive differential pairs 15
I CMOS3.3V /3.3V
O CMOS3.3V /3.3VPCI ExpressCard: reset, active low, one per card
O PCIEAC coupled off ModuleDDI 1 Pair 0 differential pairs/Serial Digital Video B red output differential pair
O PCIEAC coupled off ModuleDDI 1 Pair 1 differential pairs/Serial Digital Video B green output differential pair
O PCIE
O PCIEAC coupled off ModuleDDI 1 Pair 3 differential pairs/Serial Digital Video B clock output differential pair.
I PCIE
I PCIEAC coupled off ModuleSerial Digital Video TVOUT synchronization clock input differential pair.
I PCIE
I/O PCIEAC coupled on Module
I/O OD CMOS 3.3V / 3.3V
I/O PCIEAC coupled on Module
I/O OD CMOS 3.3V / 3.3V
O PCIEAC coupled off Module
O PCIEAC coupled off ModuleDDI 2 Pair 1 differential pairs
O PCIEAC coupled off ModuleDDI 2 Pair 2 differential pairs
O PCIEAC coupled off ModuleDDI 2 Pair 3 differential pairs
I/O PCIEAC coupled on Module
I/O OD CMOS 3.3V / 3.3V
I/O PCIEAC coupled on Module
I/O OD CMOS 3.3V / 3.3V
AC coupled off ModuleDDI 1 Pair 2 differential pairs/Serial Digital Video B blue output differential pair
AC coupled off Module
AC coupled off ModuleSerial Digital Video Field Stall input differential pair.
PD 100K to GND
(S/W IC between Rpu/PCH)
PU 4.7K to 3.3V, PD 100K to GND
(S/W IC between Rpu/Rpd
resistor)
PU 100K to 3.3V
(S/W IC between Rpu/PCH)
PU 4.7K to 3.3V/PU 100K to 3.3V
(S/W IC between 4.7K/100K
resistor)
PD 100K to GND
(S/W IC between Rpu/PCH)
PU 4.7K to 3.3V, PD 100K to GND
(S/W IC between Rpu/Rpd
resistor)
PU 100K to 3.3V
(S/W IC between Rpu/PCH)
PU 4.7K to 3.3V/PU 100K to 3.3V
(S/W IC between 4.7K/100K
resistor)
Connect to DP AUX+DP AUX+ function if DDI1_DDC_AUX_SEL is no connect
Connect to HDMI/DVI I2C CTRLCLKHDMI/DVI I2C CTRLCLK if DDI1_DDC_AUX_SEL is pulled high
Connect to DP AUX-DP AUX- function if DDI1_DDC_AUX_SEL is no connect
Connect to HDMI/DVI I2C CTRLDATAHDMI/DVI I2C CTRLDATA if DDI1_DDC_AUX_SEL is pulled high
Connect to DP AUX+DP AUX+ function if DDI2_DDC_AUX_SEL is no connect
Connect to HDMI/DVI I2C CTRLCLKHDMI/DVI I2C CTRLCLK if DDI2_DDC_AUX_SEL is pulled high
Connect to DP AUX-DP AUX- function if DDI2_DDC_AUX_SEL is no connect
Connect to HDMI/DVI I2C CTRLDATAHDMI/DVI I2C CTRLDATA if DDI2_DDC_AUX_SEL is pulled high
ress Graphics lane reversal input strap. Pull low on the Carrier
board to reverse lane order.
PCI ExpressCard: PCI Express capable card request, active low, one per
card
Serial Digital Video B interrupt input differential pair.
Selects the function of DDI1_CTRLCLK_AUX+ and DDI1_CTRLDATA_AUX-.
DDI[n]_DDC_AUX_SEL shall be pulled to 3.3V on the Carrier with a 100K Ohm
resistor to configure the DDI[n]_AUX pair as the DDC channel.
Carrier DDI
_DDC_AUX_SEL should be connected to pin 13 of the DisplayPort
DDI 2 Pair 0 differential pairs
Selects the function of DDI2_CTRLCLK_AUX+ and DDI2_CTRLDATA_AUX-.
DDI[n]_DDC_AUX_SEL shall be pulled to 3.3V on the Carrier with a 100K Ohm
resistor to configure the DDI[n]_AUX pair as the DDC channel.
Carrier DDI[n]_DDC_AUX_SEL should be connected to pin 13 of the DisplayPort
O PCIEAC coupled off ModuleDDI 3 Pair 3 differential pairs
I/O PCIEAC coupled on ModuleNADP AUX+ function if DDI3_DDC_AUX_SEL is no connect
I/O OD CMOS 3.3V / 3.3VNAHDMI/DVI I2C CTRLCLK if DDI3_DDC_AUX_SEL is pulled high
I/O PCIEAC coupled on ModuleNADP AUX- function if DDI3_DDC_AUX_SEL is no connect
I/O OD CMOS 3.3V / 3.3VNAHDMI/DVI I2C CTRLDATA if DDI3_DDC_AUX_SEL is pulled high
I/O USB3.3V Suspend/3.3V
I/O USB3.3V Suspend/3.3V
I/O USB3.3V Suspend/3.3V
I/O USB3.3V Suspend/3.3V
I/O USB
I/O USB3.3V Suspend/3.3V
I/O USB3.3V Suspend/3.3V
I/O USB3.3V Suspend/3.3V
O PCIEAC coupled on Module
I PCIEAC coupled off Modul
O PCIEAC coupled on Module
I PCIEAC coupled off Modul
O PCIEAC coupled on ModuleAdditional transmit signal differential pairs for the SuperSpeed USB data path.
I PCIEAC coupled off Modul
O PCIEAC coupled on ModuleAdditional transmit signal differential pairs for the SuperSpeed USB data path.
I PCIEAC coupled off ModulAdditional receive signal differential pairs for the SuperSpeed USB data path.
AC coupled off Module
3.3V Suspend/3.3V
Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB
connector
Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB
connector
Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB
connector
Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB
connector
Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB
connector
Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB
connector
Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB
connector
Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB
connector
Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB
connector
Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB
connector
Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB
connector
Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB
connector
DDI 3 Pair 0 differential pairs
DDI 3 Pair 2 differential pairs
Selects the function of DDI3_CTRLCLK_AUX+ and DDI3_CTRLDATA_AUX-.
DDI[n]_DDC_AUX_SEL shall be pulled to 3.3V on the Carrier with a 100K Ohm
resistor to configure the DDI[n]_AUX pair as the DDC channel.
Carrier DDI
_DDC_AUX_SEL should be connected to pin 13 of the DisplayPort
USB differential pairs 0
USB differential pairs 1
USB differential pairs 2
USB differential pairs 3
USB differential pairs 4
USB differential pairs 5
USB differential pairs 6
USB differential pairs 7, USB7 may be configured as a USB client or as a host, or both, at the
Module designer's discretion.(CR901-B default set as a host)
USB over-current sense, USB channels 0 and 1. A pull-up for this line
shall be present on the Module. An open drain driver from a USB
current monitor on the Carrier Board may drive this line low. Do not
pull this line high on the Carrier Board.
USB over-current sense, USB channels 2 and 3. A pull-up for this line
shall be present on the Module. An open drain driver from a USB
current monitor on the Carrier Board may drive this line low. Do not
ull this line high on the Carrier Board.
USB over-current sense, USB channels 4 and 5. A pull-up for this line
shall be present on the Module. An open drain driver from a USB
current monitor on the Carrier Board may drive this line low. Do not
pull this line high on the Carrier Board.
USB over-current sense, USB channels 6 and 7. A pull-up for this line
shall be present on the Module. An open drain driver from a USB
current monitor on the Carrier Board may drive this line low. Do not
pull this line high on the Carrier Board.
Additional transmit signal differential pairs for the SuperSpeed USB data path.
Additional receive signal differential pairs for the SuperSpeed USB data path.
Additional transmit signal differential pairs for the SuperSpeed USB data path.
Additional receive signal differential pairs for the SuperSpeed USB data path.
Additional receive signal differential pairs for the SuperSpeed USB data path.
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LVDS Signals Description
SignalPin#Module Pin Type Pwr Rail /ToleranceHU968Carrier BoardDescription
LVDS_A0+A71
LVDS_A0-A72
LVDS_A1+A73
LVDS_A1-A74
LVDS_A2+A75
LVDS_A2-A76
LVDS_A3+A78
LVDS_A3-A79
LVDS_A_CK+A81
LVDS_A_CK-A82
LVDS_B0+B71
LVDS_B0-B72
LVDS_B1+B73
LVDS_B1-B74
LVDS_B2+B75
LVDS_B2-B76
LVDS_B3+B77
LVDS_B3-B78
LVDS_B_CK+B81
LVDS_B_CK-B82
LVDS_VDD_ENA77O CMOS3.3V / 3.3VConnect to enable control of LVDS panel power circuitLVDS panel power enable
LVDS_BKLT_ENB79O CMOS3.3V / 3.3VConnect to enable control of LVDS panel backlight power circuit.LVDS panel backlight enable
LVDS_BKLT_CTRLB83O CMOS3.3V / 3.3VConnect to brightness control of LVDS panel backlight power circuit.LVDS panel backlight brightness control
LVDS_I2C_CKA83I/O OD CMOS 3.3V / 3.3VPU 4.7K to 3.3VConnect to DDC clock of LVDS panelI2C clock output for LVDS display use
LVDS_I2C_DATA84I/O OD CMOS 3.3V / 3.3VPU 4.7K to 3.3VConnect to DDC data of LVDS panelI2C data line for LVDS display use
LPC Signals Description
SignalPin#Module Pin Type Pwr Rail /ToleranceHU968Carrier BoardDescription
LPC_AD0B4
LPC_AD1B5
LPC_AD2B6
LPC_AD3B7
LPC_FRAME#B3O CMOS3.3V / 3.3VLPC frame indicates the start of an LPC cycle
LPC_DRQ0#B8PU 10K to 3.3VNC
LPC_DRQ1#B9PU 10K to 3.3VNC
LPC_SERIRQA50I/O CMOS3.3V / 3.3VPU 10K to 3.3VLPC serial interrupt
LPC_CLKB10O CMOS3.3V / 3.3VLPC clock output - 24MHz nominal
SPI Signals Description
SignalPin#Module Pin Type Pwr Rail /ToleranceHU968Carrier BoardDescription
SPI_CS#B97O CMO
SPI_MISOA92I CMOS3.3V Suspend/3.3VConnect a series resistor 33
SPI_MOSIA95O CMOS3.3V Suspend/3.3VConnect a series resistor 33
SPI_CLKA94O CMOS3.3V Suspend/3.3VConnect a series resistor 33
SPI_POWERA91O3.3V Suspend/3.3V
BIOS_DIS0#A34
BIOS_DIS1#B88
O LVDSLVDS
O LVDS
O LVDSLVDS
O LVDSLVDS
O LVDSLVDS
O LVDSLVDS
O LVDSLVDS
O LVDSLVDS
O LVDSLVDS
I/O CMOS3.3V / 3.3V
I CMOS
I CMOS
LVDS
3.3V / 3.3VLPC serial DMA request
3.3V Suspend/3.3V
NA
Connect to LVDS connectorLVDS Channel A differential pairs
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LPC device
Connect to LPC device
Connect to Carrier Board SPI Device CS#
to Carrier Board SPI Device SO pinData in to Module from Carrier SPI
to Carrier Board SPI Device SI pinData out from Module to Carrier SPI
to Carrier Board SPI Device SCK pinClock from Module to Carrier SPI
in
Ther LVDS flat panel differential pairs (LVDS_A[0:3]+/-, LVDS_B[0:3]+/-. LVDS_A_CK+/-,
LVDS_B_CK+/-) shall have 100ƻ terminations across the pairs at the destination. These
terminations may be on the Carrier Board if the Carrier Board implements a LVDS deserializer
on-board
LVDS Channel A differential clockO LVDSLVDS
LVDS Channel B differential pairs
Ther LVDS flat panel differential pairs (LVDS_A[0:3]+/-, LVDS_B[0:3]+/-. LVDS_A_CK+/-,
LVDS_B_CK+/-) shall have 100ƻ terminations across the pairs at the destination. These
terminations may be on the Carrier Board if the Carrier Board implements a LVDS deserializer
on-board
LVDS Channel B differential clock
LPC multiplexed address, command and data bus
Chi
select for Carrier Board SPI - may be sourced from chipset SPI0 or SPI1
Power supply for Carrier Board SPI – sourced from Module – nominally
3.3V. The Module shall provide a minimum of 100mA on SPI_POWER.
Carriers shall use less than 100mA of SPI_POWER. SPI_POWER
shall only be used to power SPI devices on the Carrier
Selection straps to determine the BIOS boot device.
The Carrier should only float these or pull them low, please refer to
COM Express Module Base Specification Revision 2.1 for strapping options of BIOS disable signals.
Chipset
BIOS
BIOS
DIS1#
1
1
0
DIS0#
0
SPI CS1#
Destination
1
1
00
Module
Carrier
(Default)
Chipset
SPI_CS#
SPI CS0#
Destination
ModuleModuleSPI0/SPI1
High
High
ModuleModule
SPI0
SPI1
Module
(Default)
(Default)
Descriptor
Module
Module
CarrierCarrier
Module
(Default)
Entry
Carrier FWH
SPI0/SPI1
SPI0/SPI1
(Default)
Bios
SPI
Carrier
Ref
Line
0
1
2
3
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GA Signals Description
SignalPin#Module Pin Type Pwr Rail /ToleranceHU968Carrier BoardDescription
VGA_REDB89O AnalogAnalogPD 150 to GNDPD 150R,connect to VGA connector with EMI filter & ESD protect component. Red for monitor. Analog output
VGA_GRNB91O AnalogAnalogPD 150 to GNDPD 150R,connect to VGA connector with EMI filter & ESD protect component. Green for monitor. Analog output
VGA_BLUB92O AnalogAnalogPD 150 to GNDPD 150R,connect to VGA connector with EMI filter & ESD protect component. Blue for monitor. Analog output
VGA_HSYNCB93O CMOS3.3V / 3.3VConnect to VGA connector with a3.3V Buffer IC to isolate PCH & Display Device Horizontal sync output to VGA monitor
VGA_VSYNCB94O CMOS3.3V / 3.3VConnect to VGA connector with a 33V Buffer IC to isolate PCH & Display Device Vertical sync output to VGA monitor
VGA_I2C_CKB95I/O OD CMOS 3.3V / 3.3VPU 2.2K to 3.3VConnect to VGA connector with a 3.3V to 5V Level shift circuit.DDC clock line (I2C port dedicated to identify VGA monitor capabilities)
VGA_I2C_DATB96I/O OD CMOS 3.3V / 3.3VPU 2.2K to 3.3VConnect to VGA connector with a 3.3V to 5V Level shift circuit.DDC data line.
Serial Interface Signals Description
SignalPin#Module Pin Type Pwr Rail /ToleranceHU968Carrier BoardDescription
SER0_TXA98O CMOS3.3V/5VPD 4.7K to GND
SER0_RXA99I CMOS3.3V/5VPU 47K to 3.3V
SER1_TXA101O CMOS3.3V/5VPD 4.7K to GND
SER1_RXA102I CMOS3.3V/5VPU 47K to 3.3V
Miscellaneous Signal Description
SignalPin#Module Pin Type Pwr Rail /ToleranceHU968Carrier BoardDescription
I2C_CKB33I/O OD CMOS 3.3V Suspend/3.3VPU 2.2K to 3V3_DU_ECGeneral purpose I2C port clock output
I2C_DATB34I/O OD CMOS 3.3V Suspend/3.3VPU 2.2K to 3V3_DU_ECGeneral purpose I2C port data I/O line
SPKRB32O CMOS3.3V / 3.3V
WDTB27O CMOS3.3V / 3.3VOutput indicating that a watchdog time-out event has occurred.
FAN_PWNOUTB101O OD CMOS3.3V / 3.3V
FAN_TACHINB102I OD CMOS3.3V / 3.3VPU 10K to 3V3
TPM_PPA96I CMOS3.3V / 3.3V
Power and System Management Signals Description
SignalPin#Module Pin Type Pwr Rail /ToleranceHU968Carrier BoardDescription
PWRBTN#B12I CMOS3.3V Suspend/3.3VPU 10K to 3V3_DU_ECPU 4.7K to 3V3_SB
SYS_RESET#B49I CMOS3.3V Suspend/3.3VPU 10K to 3V3_DUNC PU 4.7K to 3V3_SB
CB_RESET#B50O CMOS3.3V Suspend/3.3VPD 100K to GND
PWR_OKB24I CMOS3.3V / 3.3VPU 10K to 3V3
SUS_STAT#B18O CMOS3.3V Suspend/3.3VIndicates imminent suspend operation; used to notify LPC devices.
SUS_S3#A15O CMOS3.3V Suspend/3.3VPD 100K to GND
SUS_S4#A18O CMOS3.3V Suspend/3.3VPD 100K to GNDIndicates system is in Suspend to Disk state. Active low output.
SUS_S5#A24O CMOS3.3V Suspend/3.3VPD 100K to GNDIndicates system is in Soft Off state.
WAKE0#B66I CMOS3.3V Suspend/3.3VPU 10K to 3V3_DUPCI Express wake up signal.
WAKE1#B67I CMOS3.3V Suspend/3.3VNA
BATLOW#A27I CMOS3.3V Suspend/ 3.3VPU 10K to 3V3_DU
LID#A103I OD CMOS3.3V Suspend/12VPU 10K to 3V3_DU_EC
SLEEP#B103I OD CMOS3.3V Suspend/12VPU 10K to 3V3_DU
General purpose serial port 0 transmitter
Recommend add Protecting Logic Level Signals on Pins Reclaimed from VCC_12V
General purpose serial port 0 receiver
Recommend add Protecting Logic Level Signals on Pins Reclaimed from VCC_12V
General purpose serial port 1 transmitter
Recommend add Protecting Logic Level Signals on Pins Reclaimed from VCC_12V
General purpose serial port 1 receiver
Recommend add Protecting Logic Level Signals on Pins Reclaimed from VCC_12V
Output for audio enunciator - the "speaker" in PC-AT systems.
This port provides the PC beep signal and is mostly intended for
debugging purposes.
Fan s
eed control. Uses the Pulse Width Modulation (PWM) technique to control the fan's RPM.
Recommend add Protecting Logic Level Signals on Pins Reclaimed from VCC_12V
Fan tachometer input for a fan with a two pulse output.
(Recommend add Protecting Logic Level Signals on Pins Reclaimed from VCC_12V)
Trusted Platform Module (TPM) Physical Presence pin. Active high.
TPM chip has an internal pull down. This signal is used to indicate
Physical Presence to the TPM.
A falling edge creates a power button event. Power button events can
be used to bring a system out of S5 soft off and other suspend states,
as well as powering the system down.
Reset button input. Active low request for Module to reset and reboot.
May be falling edge sensitive. For situations when SYS_RESET# is
not able to reestablish control of the system, PWR_OK or a power
cycle may be used.
Reset output from Module to Carrier Board. Active low. Issued by
Module chipset and may result from a low SYS_RESET# input, a low
PWR_OK input, a VCC_12V power input that falls below the minimum
specification, a watchdog timeout, or may be initiated by the Module
software.
Power OK from main power supply. A high value indicates that the
power is good. This signal can be used to hold off Module startup to
allow Carrier based FPGAs or other configurable devices time to be
programmed.
Indicates system is in Suspend to RAM state. Active low output. An
inverted copy of SUS_S3# on the Carrier Board may be used to
enable the non-standby power on a typical ATX supply.
General purpose wake up signal. May be used to implement wake-up
on PS2 keyboard or mouse activity.
Indicates that external battery is low.
This port provides a battery-low signal to the Module for orderly
transitioning to power saving or power cut-off ACPI modes.
LID switch. Low active signal used by the ACPI operating system for a LID switch.
Recommend add Protecting Logic Level Signals on Pins Reclaimed from VCC_12V
Sleep button. Low active signal used by the ACPI operating system to bring the
system to sleep state or to wake it up again.
(Recommend add Protecting Logic Level Signals on Pins Reclaimed from VCC_12V)
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Power and System Management Signals Description
SignalPin#Module Pin Type Pwr Rail /ToleranceHU968Carrier BoardDescription
THRM#B35I CMOS3.3V / 3.3VPU 10K to 3.3VInput from off-Module temp sensor indicating an over-temp situation.
THRMTRIP#A35O CMOS3.3V / 3.3VPU 10K to 3.3VActive low output indicating that the CPU has entered thermal shutdown.
SMB_CKB13I/O OD CMOS 3.3V Suspend/3.3VPU 2.2K to 3V3_DU_ECSystem Management Bus bidirectional clock line.
SMB_DATB14I/O OD CMOS 3.3V Suspend/3.3VPU 2.2K to 3V3_DU_ECSystem Management Bus bidirectional data line.
SMB_ALERT#B15I CMOS3.3V Suspend/3.3V
GPIO Signals Description
SignalPin#Module Pin Type Pwr Rail /ToleranceHU968Carrier BoardDescription
GPO0A93
GPO1B54
GPO2B57
GPO3B63
GPI0A54PU 100K to 3.3V
GPI1A63PU 100K to 3.3V
GPI2A67PU 100K to 3.3V
GPI3A85PU 100K to 3.3V
Power and GND Signal Description
SignalPin#Module Pin Type Pwr Rail /ToleranceHU968Carrier BoardDescription
PowerPrimary power input: +12V nominal. All available VCC_12V pins on the connector(s) shall be used.
Power
3.3V / 3.3V
System Management Bus Alert – active low input can be used to
generate an SMI# (System Management Interrupt) or to wake the system.
General purpose output pins.
Upon a hardware reset, these outputs should be low.
General purpose input pins.
Pulled high internally on the Module.
Standby power input: +5.0V nominal. If VCC5_SBY is used, all
available VCC_5V_SBY pins on the connector(s) shall be used. Only
used for standby and suspend functions. May be left unconnected if
these functions are not used in the system design.
Ground - DC power and signal and AC signal return path.
All available GND connector pins shall be used and tied to Carrier
Board GND plane.
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Standby Power LED
This LED will light when the system is in the standby mode.
Standby
Power LED
Cooling Option
Heat Sink with Cooling Fan
Note:
The system board used in the following illustrations may not resemble the actual
board. These illustrations are for reference only.
Top View of the Heat Sink
1
• “1” denotes the location of the thermal pad designed to contact the corresponding
components that are on HU968.
Important:
Remove the plastic covering from the thermal pads prior to mounting the heat sink
onto HU968.
22
Bottom View of the Heat Sink
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Chapter 3
Installing HU968 onto a Carrier Board
Important:
The carrier board (COM331-B) used in this section is for reference purpose only and
may not resemble your carrier board. These illustrations are mainly to guide you on
how to install HU968 onto the carrier board of your choice.
• To download COM331-B datasheet and manual
1. Now install the module and heatsink assembly onto the carrier board. The photo below
shows the locations of the mounting holes on carrier board.
2. Insert the provided mounting screws into the mounting holes - from the bottom through
the top of the carrier board.
Mounting hole
3. While supporting the mounting screw at the bottom, from the top side of the board, fasten
a bolt into the screw.
Bolts
4. The photo below shows the solder side of the board with the screws already fixed in place.
Mounting screw
Mounting screws
5. The photo below shows the component side of the board with the bolts already fixed in
place.
Bolts
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6. Grasping HU968 by its edges, position it on top of the carrier board with its mounting
holes aligned with the bolts on the carrier board. This will also align the COM Express
connectors of the two boards to each other.
COM Express connectors
on HU968
COM Express connectors
on the carrier board
7. Press HU968 down firmly until it is completely seated on the COM Express connectors of
the carrier board.
HU968
COM Express connectors
on the carrier board
Pressing points
BIOS ROM socket
Note:
The above illustration shows the pressing points of the module onto the carrier board.
e careful when pressing the module, it may damage the socket.
B
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8. Verify that the module is firmly seated onto the COM Express connectors of the carrier
board.
HU968
The module is completely
seated on the carrier board
Carrier board
HU968
9. Use the provided mounting screws to secure HU968 with heat sink to the carrier board
and then connect the cooling fan’s cable to the fan connector on HU968. The photo below
shows the locations of the long mounting screws.
Long screws
10. And then connect the cooling fan’s cable to the fan connector on HU968.
Fan connector
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Installing the COM Express Debug Card
Note:
The system board used in the following illustrations may not resemble the actual
board. These illustrations are for reference only.
1. COMe-LINK1 is the COM Express debug card designed for COM Express Compact modules
to debug and display signals and codes of COM Express modules.
COMe-LINK1
COMe-DEBUG Connector
COM Express
Connectors
Top view
2. Connect the COMe-DEBUG card to COMe-LINK1 via a cable.
COMe-DEBUG
Code Review
Control
COM Express
Type Display
COM Express
Power Display
Cable
COMe-DEBUGCOMe-LINK1
80 Port Display
LPC
COMe-LINK1/2
Connector
COM Express
Signal Display
Power/Reset/
Sleep/LID control
Bottom view
COM Express
Connectors
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