DFI CR902-B User Manual

CR902-B/BL Series

COM Express Basic Module

User’s Manual

A25220442

www.dﬁ .comChapter 1 Introduction

Copyright

FCC and DOC Statement on Class B

This publication contains information that is protected by copyright. No part of it may be reproduced in any form or by any means or used to make any transformation/adaptation without the prior written permission from the copyright holders.

This publication is provided for informational purposes only. The manufacturer makes no representations or warranties with respect to the contents or use of this manual and specifically disclaims any express or implied warranties of merchantability or fitness for any particular purpose. The user will assume the entire risk of the use or the results of the use of this document. Further, the manufacturer reserves the right to revise this publication and make changes to its contents at any time, without obligation to notify any person or entity of such revisions or changes.

Changes after the publication’s first release will be based on the product’s revision. The website will always provide the most updated information.

Trademarks

Product names or trademarks appearing in this manual are for identification purpose only and are the properties of the respective owners.

COM Express Specification Reference

PICMG® COM Express ModuleTM Base Specification. http://www.picmg.org/

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio TV technician for help.

Notice:

1. The changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

2. Shielded interface cables must be used in order to comply with the emission limits.

www.dﬁ .comChapter 1 Introduction

Trademarks ........................................................................................................2

FCC and DOC Statement on Class B .....................................................2

About this Manual ..........................................................................................4

Chapter 4 - BIOS Setup ............................................................... 31

Overview ..................................................................................................... 31

AMI BIOS Setup Utility .............................................................................32

Main ..........................................................................................................32

Advanced ...................................................................................................32

Chipset ......................................................................................................39

Boot...........................................................................................................45

Security ...................................................................................................... 46

Save & Exit ................................................................................................ 46

Updating the BIOS ....................................................................................47

Notice: BIOS SPI ROM .............................................................................47

Warranty ............................................................................................................4

Static Electricity Precautions ......................................................................4

Safety Measures ..............................................................................................4

About the Package .........................................................................................5

Chapter 1 - Introduction .............................................................................6

Specifications ................................................................................................6

Features ........................................................................................................7

Chapter 2 - Concept .......................................................................8

COM Express Module Standards ..............................................................8

Specification Comparison Table ...............................................................9

Chapter 3 - Hardware Installation .............................................. 10

Board Layout ...............................................................................................10

Block Diagram .............................................................................................10

Mechanical Diagram ..................................................................................11

System Memory ..........................................................................................12

Installing the DIMM Module ........................................................................13

Connectors ...................................................................................................14

CPU Fan Connector .....................................................................................14

COM Express Connectors ............................................................................15

COM Express connector Signal Discription .................................................... 17

Standby Power LED ................................................................................... 27

Cooling Option ............................................................................................27

Installing CR902-B/BL Series onto a Carrier Board .........................28

Chapter 5 - Supported Software .......................................................... 48

Appendix A - nLite and AHCI Installation Guide ...........................62

nLite ...............................................................................................................62

AHCI ..............................................................................................................66

Appendix B - Watchdog Sample Code ................................................68

Appendix C - System Error Message ...................................................69

Appendix D - Troubleshooting ................................................................70

www.dﬁ .comChapter 1 Introduction

About this Manual

Static Electricity Precautions

An electronic file of this manual is included in the CD. To view the user’s manual in the CD, insert the CD into a CD-ROM drive. The autorun screen (Main Board Utility CD) will appear. Click “User’s Manual” on the main menu.

Warranty

1. Warranty does not cover damages or failures that arised from misuse of the product, inability to use the product, unauthorized replacement or alteration of components and product specifications.

2. The warranty is void if the product has been subjected to physical abuse, improper installation, modification, accidents or unauthorized repair of the product.

3. Unless otherwise instructed in this user’s manual, the user may not, under any circumstances, attempt to perform service, adjustments or repairs on the product, whether in or out of warranty. It must be returned to the purchase point, factory or authorized service agency for all such work.

4. We will not be liable for any indirect, special, incidental or consequencial damages to the product that has been modified or altered.

It is quite easy to inadvertently damage your PC, system board, components or devices even before installing them in your system unit. Static electrical discharge can damage computer components without causing any signs of physical damage. You must take extra care in handling them to ensure against electrostatic build-up.

1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are ready to install it.

2. Wear an antistatic wrist strap.

3. Do all preparation work on a static-free surface.

4. Hold the device only by its edges. Be careful not to touch any of the components, contacts or connections.

5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or connectors by their ends.

Important:

Electrostatic discharge (ESD) can damage your processor, disk drive and other components. Perform the upgrade instruction procedures described at an ESD workstation only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system chassis throughout any procedures requiring ESD protection.

Safety Measures

To avoid damage to the system:

• Use the correct AC input voltage range.

To reduce the risk of electric shock:

• Unplug the power cord before removing the system chassis cover for installation or servicing. After installation or servicing, cover the system chassis before plugging the power cord.

www.dﬁ .comChapter 1 Introduction

About the Package

The package contains the following items. If any of these items are missing or damaged, please contact your dealer or sales representative for assistance.

• One CR902 board

• One

• One QR (Quick Reference)

DVD

Optional Items

• COM330-B carrier board kit

• Heat spreader with heat sink and fan The board and accessories in the package may not come similar to the information listed

above. This may differ in accordance with the sales region or models in which it was sold. For more information about the standard package in your region, please contact your dealer or sales representative.

Before Using the System Board

Before using the system board, prepare basic system components. If you are installing the system board in a new system, you will need at least the following

internal components.

• A CPU

• Memory module

• Storage devices such as hard disk drive, CD-ROM, etc. You will also need external system peripherals you intend to use which will normally include at

least a keyboard, a mouse and a video display monitor.

www.dﬁ .comChapter 1 Introduction

Chapter 1 - Introduction

Specifications

Chapter 1

Processor

Chipset

System Memory

Graphics

Audio

• BGA 1023 packaging technology

- 3rd generation Intel : Intel : Intel : Intel : Intel : Intel : Intel : Intel : Intel : Intel : Intel

- 2nd generation Intel : Intel : Intel : Intel : Intel : Intel : Intel : Intel : Intel : Intel : Intel

• Intel® QM77 Express Chipset (-B)

• Intel

• Two 204-pin DDR3/DDR3L SODIMM sockets

• 3rd generation processors

• 2nd generation processors

• Supports dual channel memory interface

• Supports up to 16GB system memory

• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM technologies

• Intel® HD Graphics 4000 (3rd generation processors)

• Intel

• Supports LVDS, VGA and DDI interfaces

• VGA: resolution up to 2048x1536 @ 75Hz

• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit, resolution up to

• Digital Display Interfaces: HDMI, DVI, DP or SDVO

• HDMI, DVI, DP, SDVO: resolution up to 1920x1200 @ 60Hz

• Intel

• DirectX Video Acceleration (DXVA) for accelerating video processing

- Full AVC/VC1/MPEG2 HW Decode

• Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors)

• Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors)

CoreTM i7-3615QE, (6M Cache, up to 3.30 GHz); 45W

CoreTM i7-3612QE, (6M Cache, up to 3.10 GHz); 35W

CoreTM i7-3555LE, (4M Cache, up to 3.20 GHz); 25W

CoreTM i7-3517UE, (4M Cache, up to 2.80 GHz); 17W

CoreTM i5-3610ME, (3M Cache, up to 3.30 GHz); 35W

CoreTM i3-3120ME, (3M Cache, 2.40 GHz); 35W

CoreTM i3-3217UE, (3M Cache, 1.60 GHz); 17W

CeleronTM 1020E, (2M Cache, 2.20 GHz); 35W

CeleronTM 1047UE, (2M Cache, 1.40 GHz); 17W

CeleronTM 927UE, (1M Cache, 1.50 GHz); 17W

CoreTM i7-2715QE, (6M Cache, up to 3.00 GHz); 45W

CoreTM i7-2655LE, (4M Cache, up to 2.90 GHz); 25W

CoreTM i7-2610UE, (4M Cache, up to 2.40 GHz); 17W

CoreTM i5-2515E, (3M Cache, up to 3.10 GHz); 35W

CoreTM i3-2310E, (3M Cache, 2.10 GHz); 35W

CoreTM i3-2340UE, (3M Cache, 1.30 GHz); 17W

CeleronTM B810E (2M Cache, 1.6GHz); 35W

CeleronTM 847E (2M Cache, 1.1GHz); 17W

CeleronTM 827E (1.5M Cache, 1.4GHz); 17W

CeleronTM 807UE, (1M Cache, 1.00 GHz); 10W

HM76 Express Chipset (-BL)

- Supports DDR3/DDR3L 1333/1600 MHz (i7/i5/i3)

- Supports DDR3/DDR3L 1067/1333/1600 MHz (i7 Quad Core)

- Supports DDR3 1066/1333 MHz (i7/i5/i3/Celeron)

- Supports DDR3 1066/1333/1600 MHz (i7 Quad Core)

are supported for x8 and x16 devices, unbuffered, non-ECC

HD Graphics 3000 (2nd generation processors)

HD Graphics (Intel® CeleronTM processors)

1920x1200 @ 60Hz

Clear Video Technology

CoreTM processors (22nm process technology)

CoreTM processors (32nm process technology)

• Supports High Deﬁ nition Audio interface

LAN

Serial ATA

Expansion Interfaces

IDE Inerface

Damage Free Intelligence

BIOS OS Support

Temperature Humidity Power PCB

Certiﬁ cation

• Intel® 82579LM Gigabit Ethernet PHY

• Integrated 10/100/1000 transceiver

• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab

• Supports 4 Serial ATA interfaces

• 2 SATA 3.0 with data transfer rate up to 6Gb/s 2 SATA 2.0 with data transfer rate up to 3Gb/s

• Integrated Advanced Host Controller Interface (AHCI) controller

• Supports RAID 0/1/5/10 (CR902-B Series only)

• Supports 8 USB 2.0 ports

• Supports 1 PCIe x16 interface (multiplex digital display inerface)

• Supports 2 DDI (multiplex with PCIe x16)

- Port B for SDVO / HDMI / DVI

- Port C for HDMI/DVI/DisplayPort

• Supports 1 PCIe x4 and 1 PCIe x1 (default); or 5 PCIe x1 interfaces

• Supports 4 PCI interfaces (PCI 2.3 interface)

• Supports LPC interface

• Supports SMBus interface

• Supports IDE interface

• Supports 8-bit Digital I/O

• Supports up to two IDE devices

• DMA mode: Ultra ATA up to 100MB/s

• PIO mode: up to 16MB/s

• Monitors CPU temperature and overheat alarm

• Monitors CPU fan speed and failure alarm

• Monitors Vcore/VCCRTC/DDR/+1.05V/VCCSA voltages and failure alarm

• Watchdog timer function

• 64Mbit SPI BIOS

• Windows XP Professional x86 & SP3 (32-bit)

• Windows XP Professional x64 & SP2 (64-bit)

• Windows 7 Ultimate x86 & SP1 (32-bit)

• Windows 7 Ultimate x64 & SP1 (64-bit)

• Windows 8 Enterprise x86 (32-bit)

• Windows 8 Enterprise x64 (64-bit)

• 0oC to 60oC

• 10% to 90%

• Input: 5VSB (option), 12V, VCC_RTC

• Dimensions: 95mm (3.74") x 125mm (4.9")

• Compliance: PICMG COM Express

• CE

• FCC Class B

• RoHS

R2.1 basic form factor, Type 2

www.dﬁ .comChapter 1 Introduction

Chapter 1

Features

• Watchdog Timer

The Watchdog Timer function allows your application to regularly “clear” the system at the set time interval. If the system hangs or fails to function, it will reset at the set time interval so that your system will continue to operate.

• DDR3

DDR3 delivers increased system bandwidth and improved performance. The advantages of DDR3 are its higher bandwidth and its increase in performance at a lower power than DDR2.

• Graphics

The integrated Intel® HD graphics engine delivers an excellent blend of graphics performance and features to meet business needs. It provides excellent video and 3D graphics with outstanding graphics responsiveness. These enhancements deliver the performance and compatibility needed for today’s and tomorrow’s business applications. Supports LVDS, VGA and DDI display outputs.

• Serial ATA

Serial ATA is a storage interface that is compliant with SATA 1.0a specification. With speed of up to 3Gb/s (SATA 2.0) and 6Gb/s (SATA 3.0), it improves hard drive performance faster than the standard parallel ATA whose data transfer rate is 100MB/s. The bandwidth of the SATA 3.0 will be limited by carrier board design.

• Gigabit LAN

The Intel 82579LM Gigabit LAN controller supports up to 1Gbps data transmission.

www.dﬁ .comChapter 1 Introduction

Chapter 2 - Concept COM Express Module Standards

The figure below shows the dimensions of the different types of COM Express modules. CR902-B/BL series is a COM Express Basic module. The dimension is 95mm x 125mm.

Common for all Form Factors Extended only Basic only Compact only Compact and Basic only Mini only

Chapter 2

106.00

Extended

91.00

18.00

6.00

0.00

4.00

0.00

16.50

Mini

74.20

80.00

91.00

BasicCompact

70.00

51.00

4.00

121.00

151.00

www.dﬁ .comChapter 2 Concept

Chapter 2

ANA

A-BV

ANA

(

)

ANA

Specification Comparison Table

The table below shows the COM Express standard specifications and the corresponding specifications supported on the CR902-B/BL series module.

COM Express Module Base Specification Type 2

Connector Feature

DFI CR902-B/BL Series

Type 2

(IDE + PCI) Min

-B

System I/O

-B PCI Express Lanes 0 - 5 1 / 6 5

-B LVDS Channel

0 / 1 1

-B LVDS Channel B 0 / 1 1

-B eDP on LVDS CH A pins N GA Port 0 / 1 1

-B TV-Out N

-B DDI 0 N

-B

Serial Ports 1 - 2 NA NA

-B CAN interface on SER1 N

-B SATA / SAS Ports 1 / 4 4

A-B AC’97 / HDA Digital Interface 0 / 1 1

-B USB 2.0 Ports 4 / 8 8

-B USB Client 0 / 1 0

-B USB 3.0 Ports N

-B LAN Port 0 1 / 1 1

-B Express Card Support 1 / 2 2

-B LPC Bus 1 / 1 1

-B SPI 1 / 2 1

A-B

-B

SDIO

muxed on GPIO

General Purpose I/O 8 / 8 8

System Management

-B SMBus 1 / 1 1

-B I2C 1 / 1 1

-B Watchdog Timer 0 / 1 1

-B Speaker Out 1 / 1 1

-B External BIOS ROM Support 0 / 2 1

-B Reset Functions 1 / 1 1

• 5 Indicates 12V-tolerant features on former VCC_12V signals.

• 6 Cells in the connected columns spanning rows provide a rough approximation of features sharing connector pins.

Type 2 (IDE + PCI)

Connector Feature

A-B A-B Thermal Protection 0 / 1 A-B Battery Low Alarm 0 / 1 A-B Suspend/Wake Signals 0 / 3 A-B Power Button Support 1 / 1 A-B Power Good 1 / 1 A-B VCC_5V_SBY Contacts 4 / 4

A-B

A-B A-B Trusted Platform Modules NA A-B A-B VCC_12V Contacts 12 / 12

Sleep Input NA Lid Input NA Fan Control Signals NA

Min / Max

Power Management

Power

DFI CR902-B/BL Series

e 2

1 1 2 1 1 4 N N N N

Module Pin-out - Required and Optional Features C-D Connector. PICMG® COM.0Revision 2.1

Type 2 (IDE + PCI)

Connector Feature

C-D

C-D C-D C-D VCC_12V Contacts 12 / 12

PCI Express Lanes 16 - 31 0 / 16 PCI Express Graphics (PEG) 0 / 1 Muxed SDVO Channels 1 - 2 0 / 2 PCI Express Lanes 6 - 15 NA PCI Bus - 32 Bit 1 / 1 PATA Port 1 / 1 LAN Ports 1 - 2 NA NA DDIs 1 - 3 NA USB 3.0 Ports NA

Min / Max

System I/O

Power

DFI CR902-B/BL Series

e 2

0 1 1 N 1 1

N N

www.dﬁ .comChapter 2 Concept

Chapter 3 - Hardware Installation

MHz

HD Audio

LPC Bus

USB 2.0 8x

SATA 2.0 2x, SATA 3.0 2x

LVDS (Dual Channel)

CRT

PCIe x1

LAN

Port

SM Bus

ae6

2nd SPI

Bus

HDMI

/DVI

/DP

/ C

/DVI

/DP

spla

)

Board Layout

Chapter 3

Block Diagram

CPU fan

Intel 82579LM

JMB368

Standby Power LED

Intel

BGA 1023 i3/i5/i7

Intel

CR902-B:QM77 CR902-BL:HM76

SPI Flash BIOS

Top View

iTE

IT8518E

DDR3_1 SODIMM

DDR3_2 SODIMM

A / B

Channel A

1066/1333/1600

DDR3

SODIMM

Channel B

DDR3

SODIMM

1066/1333/1600

CMOS

Backup EEPROM

SM Bus

HD Audio

LPC Bus

USB 2.0 8x

SATA 2.0 2x, SATA 3.0 2x

LVDS (Dual Channel)

CRT

PCIe x1 5x

2nd SPI Bus

LAN Ports

PCIe x1, Lane 8

MHz

Processor

CORE

CORE CORE CORE

3rd/2nd Generation

Core™ i7/i5/i3

Intel

Graphics

CORE

(Direct Media

Interface)

Memory

Controller

DMI x4

Mobile Intel® QM77

(CR902-B)

Mobile Intel

(CR902-BL)

Intel® FDI

(Flexible Display

Interface)

HM76

PEG 16x LANES DI e

Multiplexer

Switch

DVI

B: SDVO

HDMI/DVI

Port B: SDVO/

Port C: HDMI/DVI/DP

PCIe x1

Lane 7

PCIe to

PCI

PCIe x1

Lane 6

PCIe to

PATA

IMVP7

(Vcore,Vgfx)

PEG/SDVO/

HDMI/DP Mux

PCI Bus

IDE Bus

C / D

iTE

IT8892

D110

C110 B110

A110

COM Express connector

Bottom View

Intel® GLAN

PHY 82579LM

C1 B1

www.dﬁ .comChapter 3 Hardware Installation

Mechanical Diagram

Chapter 3

53.00

CR902-B/BL Series Module with Heat Sink

20.0022.0011.00

54.60

Heat sink with fan

Heat spreader

Module PCB

4.00

0.00

87.00

91.00

0.00

2.00

12.00

4.00

0.00

12.50

CR902-B/BL Series Module

87.00

76.00

125.00

70.20

117.00

121.00

117.00

Ø2.70(*7 pcs)

4.00

0.00

87.00

91.00

95.00

Top View

Standoff

Side View of the Module with Heat Sink and Carrier Board

Bottom View

www.dﬁ .comChapter 3 Hardware Installation

Important:

Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in boards, and other components. Perform installation procedures at an ESD workstation only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system chassis throughout any procedures requiring ESD protection.

System Memory

The system board is equipped with two 204-pin SODIMM sockets that support DDR3(1.5V)/ DDR3L(1.35V) memory modules; depends on CPU supported. However, DDR3L memory module can run at 1.5V.

Important:

When the Standby Power LED lit red, it indicates that there is power on the board. Power-off the PC then unplug the power cord prior to installing any devices. Failure to do so will cause severe damage to the board and components.

Chapter 3

Standby

Power LED

DDR3_2

DDR3_1

www.dﬁ .comChapter 3 Hardware Installation

Chapter 3

Installing the DIMM Module

Note:

The system board used in the following illustrations may not resemble the actual one. These illustrations are for reference only.

1. Make sure the PC and all other peripheral devices connected to it has been powered down.

2. Disconnect all power cords and cables.

3. Locate the SODIMM socket on the system board.

4. Note the key on the socket. The key ensures the module can be plugged into the socket in only one direction.

5. Grasping the module by its edges, align the module into the socket at an approximately 30 degrees angle. Apply firm even pressure to each end of the module until it slips down into the socket. The contact fingers on the edge of the module will almost completely disappear inside the socket.

6. Push down the module until the clips at each end of the socket lock into position. You will

hear a distinctive “click”, indicating the module is correctly locked into position.

Clip

www.dﬁ .comChapter 3 Hardware Installation

Chapter 3

Connectors

CPU Fan Connector

Sense Power

Ground

Connect the CPU fan’s cable connector to the CPU fan connector on the board. The cooling fan will provide adequate airflow throughout the chassis to prevent overheating the CPU and board components.

BIOS Setting

“Module Board H/W Monitor” submenu in the Advanced menu of the BIOS will display the current speed of the cooling fan. Refer to chapter 3 of the manual for more information

1 3

COM Express Connectors

The COM Express connectors are used to interface the CR902-B/BL Series COM Express board to a carrier board. Connect the COM Express connectors (lcoated on the solder side of the board) to the COM Express connectors on the carrier board.

Refer to the “Installing CR902-B/BL Series onto a Carrier Board” section for more information.

COM Express Connectors

Refer to the following pages for the pin functions of these connectors.

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COM Express Connectors

Chapter 3

Note:

16 RSVD pins are reserved for future use and should be no connect. Do not tie the RSVD pins together.

www.dﬁ .comChapter 3 Hardware Installation

Chapter 3

Note:

16 RSVD pins are reserved for future use and should be no connect. Do not tie the RSVD pins together.

www.dﬁ .comChapter 3 Hardware Installation

Chapter 3

COM Express Connectors Signal Description

Pin Types I Input to the Module O Output from the Module I/O Bi-directional input / output signal OD Open drain output

C97/HDA Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance PU/PD Description AC/HAD_RST# A30 O CMOS 3.3V Suspend/3.3V Reset output to CODEC, active low.

C/HDA_SYN AC/HDA_BITCLK A32 I/O CMOS 3.3V/3.3V Serial data clock generated by the external CODEC(s). AC/HDA_SDOUT A33 O CMOS 3.3V/3.3V Serial TDM data output to the CODEC. AC/HDA_SDIN2 B28 I/O CMOS 3.3V Suspend/3.3V AC/HDA_SDIN1 B29 I/O CMOS 3.3V Suspend/3.3V AC/HDA_SDIN0 B30 I/O CMOS 3.3V Suspend/3.3V

Gigabit Ethernet Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance PU/PD Description GBE0_MDI0+ A13 I/O Analog 3.3V max Suspend GBE0_MDI0- A12 I/O Analog 3.3V max Suspend GBE0_MDI1+ A10 I/O Analog 3.3V max Suspend GBE0_MDI1- A9 I/O Analog 3.3V max Suspend GBE0_MDI2+ A7 I/O Analog 3.3V max Suspend GBE0_MDI2- A6 I/O Analog 3.3V max Suspend

MDI3+

GBE0 GBE0_MDI3- A2 I/O Analog 3.3V max Suspend GBE0_ACT# B2 OD CMOS 3.3V Suspend/3.3V Gigabit Ethernet Controller 0 activity indicator, active low.

GBE0_LINK# A8 OD CMOS 3.3V Suspend/3.3V Gigabit Ethernet Controller 0 link indicator, active low. GBE0_LINK100# A4 OD CMOS 3.3V Suspend/3.3V Gigabit Ethernet Controller 0 100 Mbit / sec link indicator, active low.

LINK1000#A5 OD CMOS 3.3V Suspend/3.3

GBE0

GBE0_CTREF A14 REF GND min 3.3V max N.C.

29 O CMOS 3.3V/3.3

O Analog3.3V max Suspend

PD 1M: Sample-synchronization signal to the CODEC(s).

Serial TDM data inputs from up to 3 CODECs.

Gigabit Ethernet Controller 0: Media Dependent Interface Differential Pairs 0,1,2,3. The MDI can operate in 1000, 100 and 10 Mbit / sec modes. Some pairs are unused in some modes, per the following: 1000BASE-T 100BASE-TX 10BASE-T MDI[0]+/- B1_DA+/- TX+/- TX+/ MDI[1]+/- B1_DB+/- RX+/- RX+/ MDI[2]+/- B1_DC+/ MDI[3]+/- B1_DD+/-

Gigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active low. Reference voltage for Carrier Board Ethernet channel 0 magnetics center

tap. The reference voltage is determined by the requirements of the Module PHY and may be as low as 0V and as high as 3.3V. The reference voltage output shall be current limited on the Module. In the case in which the reference

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IDE Signals Descriptions

nal Pin# Pin Type Pwr Rail /Tolerance PU/P

Si IDE_D0 D7 IDE_D1 C10 IDE_D2 C8 IDE_D3 C4 IDE_D4 D6 IDE_D5 D2 IDE_D6 C3 IDE_D7 C2 PD 10 IDE_D8 C6 IDE_D9 C7 IDE_D10 D3 IDE_D11 D4 IDE_D12 D5 IDE_D13 C9 IDE_D14 C12 IDE_D15 C5 IDE_A0 D13 IDE_A1 D14 IDE_A2 D15 IDE_IOW# D9 O CMOS 3.3V / 3.3V IDE_IOR# C14 O CMOS 3.3V / 3.3V IDE_RE IDE_ACK# D10 O CMOS 3.3V / 3.3V IDE_CS1# D16 O CMOS 3.3V / 3.3V IDE_CS3# D17 O CMOS 3.3V / 3.3V IDE_IORDY C13 I CMOS 3.3V / 5 IDE_RESET# D18 O CMOS 3.3V / 3.3V IDE_IR

IDE_CBLID# D77 I CMOS 3.3V / 5V

D8 I CMOS 3.3V / 5

D12 I CMOS 3.3V / 5

I/O CMOS 3.3V / 5V Bidirectional data to / from IDE device.

O CMOS 3.3V / 3.3V Address lines to IDE device.

PD 5.6K: to GND IDE Device DMA Request. It is asserted by the IDE device to request a data transfer.

PU 4.7K: to 3.3V IDE device I/O ready input. Pulled low by the IDE device to extend the cycle. PD 10K: to GND Interrupt request from IDE device.

: to GND

Chapter 3

Description

O write line to IDE device. Data latched on trailing(rising) edge.

I I

O read line to IDE device.

IDE Device DMA Acknowled IDE Device Chi IDE Device Chi

Reset out

Input from off-Module hardware indicating the type of IDE cable being used. High indicates a 40-pin cable used for legacy IDE modes. Low indicates that an 80-pin cable with interleaved grounds is used. Such a cable is required for Ultra-DMA 66, 100 and 133 modes.

Select for 1F0h to 1FFh range. Select for 3F0h to 3FFh range.

ut to IDE device, active low.

SATA Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance PU/PD Description SATA0_TX+ A16 O SATA AC coupled on Module

SATA0_TX- A17 O SATA AC coupled on Module SATA0_RX+ A19 I SATA AC coupled on Module SATA0_RX- A20 I SATA AC coupled on Module SATA1_TX+ B16 O SATA AC coupled on Module SATA1_TX- B17 O SATA AC coupled on Module SATA1_RX+ B19 I SATA AC coupled on Module SATA1_RX- B20 I SATA AC coupled on Module SATA2_TX+ A22 O SATA AC coupled on Module SATA2_TX- A23 O SATA AC coupled on Module SATA2_RX+ A25 I SATA AC coupled on Module SATA2_RX- A26 I SATA AC coupled on Module SATA3_TX+ B22 O SATA AC coupled on Module SATA3_TX- B23 O SATA AC coupled on Module SATA3_RX+ B25 I SATA AC coupled on Module SATA3_RX- B26 I SATA AC coupled on Module ATA_ACT# A28 I/O CMOS 3.3V / 3.3V PU 10K: to 3.3V ATA (parallel and serial) or SAS activity indicator, active low.

Serial ATA or SAS Channel 0 transmit differential pair.

Serial ATA or SAS Channel 0 receive differential pair.

Serial ATA or SAS Channel 1 transmit differential pair.

Serial ATA or SAS Channel 1 receive differential pair.

Serial ATA or SAS Channel 2 transmit differential pair.

Serial ATA or SAS Channel 2 receive differential pair.

Serial ATA or SAS Channel 3 transmit differential pair.

Serial ATA or SAS Channel 3 receive differential pair.

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Chapter 3

PCI Express Lanes Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance PU/PD Description PCIE_TX0+ A68 PCIE_TX0- A69 PCIE_RX0+ B68 PCIE_RX0- B69 PCIE_TX1+ A64 PCIE_TX1- A65 PCIE_RX1+ B64 PCIE_RX1- B65 PCIE_TX2+ A61 PCIE_TX2- A62 PCIE_RX2+ B61 PCIE_RX2- B62 PCIE_TX3+ A58 PCIE_TX3- A59 PCIE_RX3+ B58 PCIE_RX3- B59 PCIE_TX4+ A55 PCIE_TX4- A56 PCIE_RX4+ B55 PCIE_RX4- B56 PCIE_TX5+ A52 PCIE_TX5- A53 PCIE_RX5+ B52 PCIE_RX5- B53 PCIE0_CK_REF+ A88

PCIE0_CK_REF- A89

O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 0

I PCIE AC coupled off Module PCI Express Differential Receive Pairs 0

O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 1

I PCIE AC coupled off Module PCI Express Differential Receive Pairs 1

O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 2

I PCIE AC coupled off Module PCI Express Differential Receive Pairs 2

O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 3

I PCIE AC coupled off Module PCI Express Differential Receive Pairs 3

O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 4

I PCIE AC coupled off Module PCI Express Differential Receive Pairs 4

O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 5

I PCIE AC coupled off Module PCI Express Differential Receive Pairs 5

O PCIE PCIE Reference clock output for all PCI Express and PCI Express Graphics lanes.

PEG Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance PU/PD Description PEG_TX0+ D52 PEG_TX0- D53 PEG_RX0+ C52 PEG_RX0- C53 PEG_TX1+ D55 PEG_TX1- D56 PEG_RX1+ C55 PEG_RX1- C56 PEG_TX2+ D58 PEG_TX2- D59 PEG_RX2+ C58 PEG_RX2- C59 PEG_TX3+ D61 PEG_TX3- D62 PEG_RX3+ C61 PEG_RX3- C62 PEG_TX4+ D65 PEG_TX4- D66 PEG_RX4+ C65 PEG_RX4- C66 PEG_TX5+ D68 PEG_TX5- D69 PEG_RX5+ C68 PEG_RX5- C69

O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 0

I PCIE AC coupled off Module PCI Express Graphics receive differential pairs 0

O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 1

I PCIE AC coupled off Module PCI Express Graphics receive differential pairs 1

O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 2

I PCIE AC coupled off Module PCI Express Graphics receive differential pairs 2

O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 3

I PCIE AC coupled off Module PCI Express Graphics receive differential pairs 3

O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 4

I PCIE AC coupled off Module PCI Express Graphics receive differential pairs 4

O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 5

I PCIE AC coupled off Module PCI Express Graphics receive differential pairs 5

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Chapter 3

PEG Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance PU/PD Description PEG_TX6+ D71 PEG_TX6- D72 PEG_RX6+ C71 PEG_RX6- C72 PEG_TX7+ D74 PEG_TX7- D75 PEG_RX7+ C74 PEG_RX7- C75 PEG_TX8+ D78 PEG_TX8- D79 PEG_RX8+ C78 PEG_RX8- C79 PEG_TX9+ D81 PEG_TX9- D82 PEG_RX9+ C81 PEG_RX9- C82 PEG_TX10+ D85 PEG_TX10- D86 PEG_RX10+ C85 PEG_RX10- C86 PEG_TX11+ D88 PEG_TX11- D89 PEG_RX11+ C88 PEG_RX11- C89 PEG_TX12+ D91 PEG_TX12- D92 PEG_RX12+ C91 PEG_RX12- C92 PEG_TX13+ D94 PEG_TX13- D95 PEG_RX13+ C94 PEG_RX13- C95 PEG_TX14+ D98 PEG_TX14- D99 PEG_RX14+ C98 PEG

RX14- C99

PEG

TX15+ D101 PEG_TX15- D102 PEG_RX15+ C101 PEG_RX15- C102

PEG_LANE_RV# D54 I CMOS 3.3V / 3.3V

PEG_ENABLE# D97 I CMOS 3.3V /3.3V PU 10K: to 3.3V

O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 6

I PCIE AC coupled off Module PCI Express Graphics receive differential pairs 6

O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 7

I PCIE AC coupled off Module PCI Express Graphics receive differential pairs 7

O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 8

I PCIE AC coupled off Module PCI Express Graphics receive differential pairs 8

O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 9

I PCIE AC coupled off Module PCI Express Graphics receive differential pairs 9

O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 10

I PCIE AC coupled off Module PCI Express Graphics receive differential pairs 10

O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 11

I PCIE AC coupled off Module PCI Express Graphics receive differential pairs 11

O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 12

I PCIE AC coupled off Module PCI Express Graphics receive differential pairs 12

O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 13

I PCIE AC coupled off Module PCI Express Graphics receive differential pairs 13

O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 14

I PCIE AC coupled off Module PCI Express Graphics receive differential pairs 14 O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 15 I PCIE AC coupled off Module PCI Express Graphics receive differential pairs 15

PCI Express Graphics lane reversal input strap. Pull low on the Carrier board to reverse lane order.

Strap to enable PCI Express x16 external graphics interface. Pull low to enable the x16 PEG interface.

ExpressCard Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance PU/PD Description EXCD0_CPPE# A49 EXCD1_CPPE# B48 EXCD0_PERST# A48 EXCD1_PERST# B47

I CMOS 3.3V /3.3V PU 10K: to 3.3V PCI ExpressCard: PCI Express capable card request, active low, one per card

O CMOS 3.3V /3.3V PCI ExpressCard: reset, active low, one per card

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Chapter 3

PCI Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance PU/PD Description PCI_AD0 C24 PCI_AD1 D22 PCI_AD2 C25 PCI_AD3 D23 PCI_AD4 C26 PCI_AD5 D24 PCI_AD6 C27 PCI_AD7 D25 PCI_AD8 C28 PCI_AD9 D27 PCI_AD10 C29 PCI_AD11 D28 PCI_AD12 C30 PCI_AD13 D29 PCI_AD14 C32 PCI_AD15 D30 PCI_AD16 D37 PCI_AD17 C39 PCI_AD18 D38 PCI_AD19 C40 PCI_AD20 D39 PCI_AD21 C42 PCI_AD22 D40 PCI_AD23 C43 PCI_AD24 D42 PCI_AD25 C45 PCI_AD26 D43 PCI_AD27 C46 PCI_AD28 D44 PCI_AD29 C47 PCI_AD30 D45 PCI_AD31 C48 PCI_C/BE0# D26 PCI_C/BE1# C33 PCI_C/BE2# C38 PCI_C/BE3# C44 PCI_DEVSEL# C36 I/O CMOS 3.3V / 5V PU 8.2K: PCI_FRAME# D36 I/O CMOS 3.3V / 5V PU 8.2K: to 3.3V PCI bus Frame control line, active low. PCI_IRDY# C37 I/O CMOS 3.3V / 5V PU 8.2K: to 3.3V PCI bus Initiator Ready control line, active low. PCI_TRDY# D35 I/O CMOS 3.3V / 5V PU 8.2K: to 3.3V PCI bus Target Ready control line, active low. PCI_STOP# D34 I/O CMOS 3.3V / 5V PU 8.2K: to 3.3V PCI bus STOP control line, active low, driven by cycle initiator. PCI_PAR D32 I/O CMOS 3.3V / 5V PCI bus parity PCI_PERR# C34 I/O CMOS 3.3V / 5V PU 8.2K: to 3.3V Parity Error: An external PCI device drives PERR# when it receives data that has a parity error. PCI_REQ0# C22 PU 8.2K: to 3.3V PCI_REQ1# C19 PU 8.2K: to 3.3V PCI_REQ2# C17 PU 8.2K: to 3.3V PCI_REQ3# D20 PU 8.2K: to 3.3V PCI_GNT0# C20 PCI_GNT1# C18 PCI_GNT2# C16 PCI_GNT3# D19

I/O CMOS 3.3V / 5V PCI bus multiplexed address and data lines

I/O CMOS 3.3V / 5V PCI bus byte enable lines, active low

to 3.3V PCI bus Device Select, active low.

I CMOS 3.3V / 5V PCI bus master request input lines, active low.

O CMOS 3.3V / 5V PCI bus master grant output lines, active low.

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Chapter 3

PCI Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance PU/PD Description

PCI_RESET# C23 O CMOS 3.3V Suspend/ 5V PCI Reset output, active low. PCI_LOCK# C35 I/O CMOS 3.3V / 5V PCI_SERR# D33 I/O OD CMOS 3.3V / 5V PCI_PME# C15 I CMOS 3.3V Sus PCI_CLKRUN# D48 I/O CMOS 3.3V / 5V PCI_IRQA# C49 PCI_IRQB# C50 PCI_IRQC# D46 PCI_IR

D# D47 PU 8.2K: to 3.3V

PCI_CLK D50 O CMOS 3.3V / 3.3V PCI 33MHz clock output.

PCI_M66EN D49 I CMOS 3.3V / 5V

I CMOS 3.3V / 5V PCI interrupt request lines.

end/ 5

USB Signals Description

Signal Pin# Pin Type Pwr Rail /Tolerance PU/PD Description USB0+ A46 USB0- A45 USB1+ B46 USB1- B45 USB2+ A43 USB2- A42 USB3+ B43 USB3- B42 USB4+ A40 USB4- A39 USB5+ B40 USB5- B39 USB6+ A37 USB6- A36 USB7+ B37

USB7- B36

USB_0_1_OC# B44 I CMOS 3.3V Suspend/3.3V

USB_2_3_OC# A44 I CMOS 3.3V Suspend/3.3V

USB_4_5_OC# B38 I CMOS 3.3V Suspend/3.3V

USB_6_7_OC# A38 I CMOS 3.3V Suspend/3.3V

I/O USB 3.3V Suspend/3.3V USB differential pairs 0

I/O USB 3.3V Suspend/3.3V USB differential pairs 1

I/O USB 3.3V Suspend/3.3V USB differential pairs 2

I/O USB 3.3V Suspend/3.3V USB differential pairs 3 I/O USB 3.3V Suspend/3.3V USB differential pairs 4 I/O USB 3.3V Suspend/3.3V USB differential pairs 5

I/O USB 3.3V Suspend/3.3V USB differential pairs 6

I/O USB 3.3V Suspend/3.3V

PU 8.2K: to 3.3V PU 8.2K: to 3.3V PU 10K: to 3.3V Suspend PU 8.2K:

to 3.3V PU 8.2K: to 3.3V PU 8.2K: to 3.3V PU 8.2K: to 3.3V

N.C. and chip PD 10K: to GND

PU 10K: to 3.3V Suspend

PCI Lock control line, active low. System Error: SERR# may be pulsed active by any PCI device that detects a system error condition. PCI Power Mana Bidirectional pin used to support PCI clock run protocol for mobile systems.

Module input signal indicates whether an off-Module PCI device is capable of 66MHz operation. Pulled to GND by Carrier Board device or by Slot Card if the devices are NOT capable of 66 MHz operation. If the Module is not capable of supporting 66 MHz PCI operation, this input may be a no-connect on the Module. If the Module is capable of supporting 66 MHz PCI operation, and if this input is held low by the Carrier Board, the Module PCI interface shall operate at 33 MHz.

USB differential pairs 7, USB7 may be configured as a USB client or as a host, or both, at the Module designer's discretion.(CR902-B/BL default set as a host)

USB over-current sense, USB channels 0 and 1. A pull-up for this line shall be present on the Module. An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not pull this line high on the Carrier Board. USB over-current sense, USB channels 2 and 3. A pull-up for this line shall be present on the Module. An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not pull this line high on the Carrier Board. USB over-current sense, USB channels 4 and 5. A pull-up for this line shall be present on the Module. An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not

ull this line high on the Carrier Board. USB over-current sense, USB channels 6 and 7. A pull-up for this line shall be present on the Module. An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not

ull this line high on the Carrier Board.

ement Event: PCI peripherals drive PME# to wake system from low-power states S1–S5.

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_DRQ

LVDS Si

Signal Pin# Pin Type Pwr Rail /Tolerance PU/PD Description LVDS_A0+ A71 LVDS_A0- A72 LVDS_A1+ A73 LVDS_A1- A74 LVDS_A2+ A75 LVDS_A2- A76 LVDS_A3+ A78 LVDS_A3- A79 LVDS_A_CK+ A81 LVDS_A_CK- A82 LVDS_B0+ B71 LVDS_B0- B72 LVDS_B1+ B73 LVDS_B1- B74 LVDS_B2+ B75 LVDS_B2- B76 LVDS_B3+ B77 LVDS_B3- B78 LVDS_B_CK+ B81 LVDS_B_CK- B82

LVDS_VDD_EN A77 O CMOS 3.3V / 3.3V PD 100K: to GND LVDS panel power enable LVDS_BKLT_EN B79 O CMOS 3.3V / 3.3V PD 100K: to GND LVDS panel backlight enable LVDS_BKLT_CTRL B83 O CMOS 3.3V / 3.3V PD 100K: to GND LVDS panel backlight brightness control LVDS_I2C_CK A83 I/O OD CMOS 3.3V / 3.3V PU 2.2K: to 3.3V I2C clock output for LVDS display use LVDS_I2C_DAT A84 I/O OD CMOS 3.3V / 3.3V PU 2.2K: to 3.3V I2C data line for LVDS display use

nals Descriptions

O LVDS LVDS

O LVDS LVDS LVDS Channel B differential clock

LVDS Channel A differential pairs

LVDS Channel A differential clock

LVDS Channel B differential pairs

LPC Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance PU/PD Description LPC_AD0 B4 LPC

AD1 B5 LPC_AD2 B6 LPC_AD3 B7 LPC_FRAME# B3 O CMOS 3.3V / 3.3V LPC frame indicates the start of an LPC cycle LPC

0# B8 1# B9

LPC LPC_SERIRQ A50 I/O CMOS 3.3V / 3.3V PU 10K: LPC_CLK B10 O CMOS 3.3V / 3.3V LPC clock output - 33MHz nominal

I/O CMOS 3.3V / 3.3V LPC multiplexed address, command and data bus

I CMOS 3.3V / 3.3V LPC serial DMA request

to 3.3V LPC serial interrupt

SPI Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance PU/PD Description SPI_CS# B97 O CMOS 3.3V Suspend/3.3V Chip select for Carrier Board SPI - may be sourced from chipset SPI0 or SPI1 SPI_MISO A92 I CMOS 3.3V Suspend/3.3V Data in to Module from Carrier SPI SPI_MOSI A95 O CMOS 3.3V Suspend/3.3V Data out from Module to Carrier SPI SPI_CLK A94 O CMOS 3.3V Suspend/3.3V Clock from Module to Carrier SPI

SPI_POWER A91 O 3.3V Suspend/3.3V

BIOS_DIS0# A34 BIOS_DIS1# B88

I CMOS NA

Power supply for Carrier Board SPI – sourced from Module – nominally

3.3V. The Module shall provide a minimum of 100mA on SPI_POWER. Carriers shall use less than 100mA of SPI_POWER. SPI_POWER shall only be used to power SPI devices on the Carrier

Selection straps to determine the BIOS boot device. The Carrier should only float these or pull them low, please refer to COM Express Module Base Specification Revision 2.1 for strapping options of BIOS disable signals.

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+ 52 hidden pages

DFI CR902-B User Manual

Copyright

FCC and DOC Statement on Class B

Trademarks

Table of Contents

About this Manual

Static Electricity Precautions

Warranty

Safety Measures

About the Package

Chapter 1 - Introduction

Specifications

Features

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Specification Comparison Table

Chapter 3 - Hardware Installation

Board Layout

Block Diagram

Mechanical Diagram

System Memory

Connectors

COM Express Connectors Signal Description