This publication contains information that is protected by copyright. No part of it may be reproduced in any form or by any means or used to make any transformation/adaptation without
the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no
representations or warranties with respect to the contents or use of this manual and specifically disclaims any express or implied warranties of merchantability or fitness for any particular
purpose. The user will assume the entire risk of the use or the results of the use of this document. Further, the manufacturer reserves the right to revise this publication and make changes
to its contents at any time, without obligation to notify any person or entity of such revisions
or changes.
Changes after the publication’s first release will be based on the product’s revision. The website
will always provide the most updated information.
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
COM Express Specification Reference
PICMG® COM Express ModuleTM Base Specification.
http://www.picmg.org/
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.
An electronic file of this manual is included in the CD. To view the user’s manual in the CD,
insert the CD into a CD-ROM drive. The autorun screen (Main Board Utility CD) will appear.
Click “User’s Manual” on the main menu.
Warranty
1. Warranty does not cover damages or failures that arised from misuse of the product,
inability to use the product, unauthorized replacement or alteration of components and
product specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper installation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circumstances, attempt to perform service, adjustments or repairs on the product, whether in or
out of warranty. It must be returned to the purchase point, factory or authorized service
agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequencial damages to the
product that has been modified or altered.
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in handling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are
ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, contacts
or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or connectors by their ends.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other components. Perform the upgrade instruction procedures described at an ESD workstation only. If such a station is not available, you can provide some ESD protection by
wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system
chassis throughout any procedures requiring ESD protection.
Safety Measures
To avoid damage to the system:
• Use the correct AC input voltage range.
To reduce the risk of electric shock:
• Unplug the power cord before removing the system chassis cover for installation or servicing. After installation or servicing, cover the system chassis before plugging the power
cord.
4
www.dfi .comChapter 1 Introduction
About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
• One CD9A3 board
• One DVD
• One QR (Quick Reference)
Optional Items
• COM100-B carrier board kit
• Heat sink
• Heat sink with fan
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Before Using the System Board
Before using the system board, prepare basic system components.
If you are installing the system board in a new system, you will need at least the following
internal components.
• Storage devices such as hard disk drive, CD-ROM, etc.
You will also need external system peripherals you intend to use which will normally include at
least a keyboard, a mouse and a video display monitor.
• Watchdog timeout programmable via software from 1 to 256 seconds
®
AtomTM D2550)
®
AtomTM N2800/
Chapter 1
Expansion
Interfaces
Damage Free
Intelligence
BIOS
OS Support
Temperature
Humidity
Power
PCB
• Supports 8 USB 2.0 ports
• Supports 3 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I
2
C interface
• Supports 2 serial interfaces (TX/RX)
• Supports 8-bit Digital I/O
• Monitors CPU temperature
• Monitors CPU fan speed
• Monitors Vcore/VCCRTC/DDR3 voltages
• Watchdog timer function
• 16Mbit SPI BIOS
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Operating: 0oC to 60oC
• Storage: -40
o
C to 85oC
• 10% to 90%
• 4.75~20V, 5VSB, VCC_RTC (ATX mode)
4.75~20V, VCC_RTC (AT mode)
• Dimensions
- COM Express
®
Mini
- 84mm (3.30") x 55mm (2.16")
• Compliance
- PICMG COM Express
®
R2.1, Type 10
6
www.dfi .comChapter 1 Introduction
Chapter 1
Features
• Watchdog Timer
The Watchdog Timer function allows your application to regularly “clear” the system at the set
time interval. If the system hangs or fails to function, it will reset at the set time interval so
that your system will continue to operate.
• DDR3
DDR3 delivers increased system bandwidth and improved performance. The advantages of
DDR3 are its higher bandwidth and its increase in performance at a lower power than DDR2.
• Graphics
The integrated Intel® HD graphics engine delivers an excellent blend of graphics performance
and features to meet business needs. It provides excellent video and 3D graphics with outstanding graphics responsiveness. These enhancements deliver the performance and compatibility needed for today’s and tomorrow’s business applications. Supports LVDS and DDI (HDMI,
DVI and DisplayPort) for up to 2 independent displays.
• Serial ATA
Serial ATA is a storage interface that is compliant with SATA 1.0a specification. With speed of
up to 3Gb/s (SATA 2.0), it improves hard drive performance faster than the standard parallel
ATA whose data transfer rate is 100MB/s.
• Gigabit LAN
The Intel® I210AT Gigabit LAN controller supports up to 1Gbps data transmission.
• USB
The system board supports USB 2.0 and USB 1.1 ports. USB 1.1 supports 12Mb/second bandwidth while USB 2.0 supports 480Mb/second bandwidth providing a marked improvement in
device transfer speeds between your computer and a wide range of simultaneously accessible
external Plug and Play peripherals.
7
www.dfi .comChapter 1 Introduction
Chapter 2 - Concept
COM Express Module Standards
The figure below shows the dimensions of the different types of COM Express modules.
CD9A3 Series is a COM Express Mini. The dimension is 84mm x 55mm.
Common for all Form Factors
Extended only
Basic only
Compact only
Compact and Basic only
Mini only
Chapter 2
106.00
Extended
91.00
18.00
6.00
0.00
4.00
0.00
16.50
Mini
8
74.20
80.00
91.00
BasicCompact
70.00
51.00
4.00
121.00
151.00
www.dfi .comChapter 2 Concept
Chapter 2
/
/
/
A
A
A
A
A
A
A
A
A
A
Specification Comparison Table
The table below shows the COM Express standard specifications and the corresponding specifications supported on the CD9A3 Series module.
Side View of the Module with Heat Sink and Carrier Board
0.00
63.50
11
5.80
www.d.comChapter 3 Hardware Installation
Chapter 3
System Memory
Important:
Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in
boards, and other components. Perform installation procedures at an ESD workstation
only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If
a wrist strap is unavailable, establish and maintain contact with the system chassis
throughout any procedures requiring ESD protection.
System Memory
The system board is equipped with eight DDR3 memory chips onboard.
Important:
When the Standby Power LED lit red, it indicates that there is power on the board.
Power-off the PC then unplug the power cord prior to installing any devices. Failure to
do so will cause severe damage to the board and components.
Standby
Power LED
DDR3
12
www.dfi .comChapter 3 Hardware Installation
Chapter 3
Connectors
CPU Fan Connector
Sense
Power
Ground
Connect the CPU fan’s cable connector to the CPU fan connector on the board. The cooling fan
will provide adequate airflow throughout the chassis to prevent overheating the CPU and board
components.
BIOS Setting
1
3
COM Express Connectors
The COM Express connectors are used to interface the CD9A3 COM Express board to a carrier
board. Connect the COM Express connectors (lcoated on the solder side of the board) to the
COM Express connectors on the carrier board.
Refer to the “Installing CD9A3 Series onto a Carrier Board” section for more information.
COM Express Connectors
“Module Board H/W Monitor” submenu in the Advanced menu of the BIOS will display the current speed of the cooling fan. Refer to chapter 3 of the manual for more information.
Refer to the following pages for the pin functions of these connectors.
Pin Types
I Input to the Module
O Output from the Module
I/O Bi-directional input / output signal
OD Open drain output
C97/HDA Signals Description
SignalPin#Pin TypePwr Rail /ToleranceCD9A3 SeriesCarrier BoardDescription
AC/HAD_RST#A30O CMOS3.3V Suspend/3.3VConnect to CODEC pin 11 RESET#Reset output to CODEC, active low.
AC/HDA_SYNCA29O CMOS3.3V/3.3VConnect to CODEC pin 10 SYNCSample-synchronization signal to the CODEC(s).
AC/HDA_BITCLKA32I/O CMOS3.3V/3.3VConnect to CODEC pin 6 BIT_CLKSerial data clock generated by the external CODEC(s).
AC/HDA_SDOUTA33O CMOS3.3V/3.3VConnect to CODEC pin 5 SDATA_OUTSerial TDM data output to the CODEC.
AC/HDA_SDIN2B28I/O CMOS3.3V Suspend/3.3VConnect 33 ƻ in series to CODEC2 pin 8 SDATA_IN
AC/HDA_SDIN1B29I/O CMOS3.3V Suspend/3.3VConnect 33 ƻ in series to CODEC1 pin 8 SDATA_IN
AC/HDA_SDIN0B30I/O CMOS3.3V Suspend/3.3VConnect 33 ƻ in series to CODEC0 pin 8 SDATA_IN
Gigabit Ethernet Signals Description
SignalPin#Pin TypePwr Rail /ToleranceCD9A3 SeriesCarrier BoardDescription
GBE0_MDI0+A13I/O Analog3.3V max Suspend
GBE0_MDI0-A12I/O Analog3.3V max Suspend
GBE0_MDI1+A10I/O Analog3.3V max Suspend
GBE0_MDI1-A9I/O Analog3.3V max Suspend
GBE0_MDI2+A7I/O Analog3.3V max Suspend
GBE0_MDI2-A6I/O Analog3.3V max Suspend
GBE0_MDI3+A3I/O Analog3.3V max Suspend
MDI3-
GBE0
GBE0_ACT#B2OD CMOS3.3V Suspend/3.3V
GBE0_LINK#A8OD CMOS3.3V Suspend/3.3VNCGigabit Ethernet Controller 0 link indicator, active low.
GBE0_LINK100#A4OD CMOS3.3V Suspend/3.3V
GBE0_LINK1000#A5OD CMOS3.3V Suspend/3.3V
2I
O Analog3.3V max Suspend
Connect to Magnetics Module MDI0+/-
Connect to Magnetics Module MDI1+/-
Connect to Magnetics Module MDI2+/-
Connect to Magnetics Module MDI3+/Connect to LED and recommend current limit
resistor 150ȟ to 3.3VSB
Connect to LED and recommend current limit
resistor 150ȟ to 3.3VSB
Connect to LED and recommend current limit
resistor 150ȟ to 3.3VSB
Serial TDM data inputs from up to 3 CODECs.
Gigabit Ethernet Controller 0: Media Dependent Interface Differential
Pairs 0,1,2,3. The MDI can operate in 1000, 100 and 10 Mbit / sec
modes. Some pairs are unused in some modes, per the following:
1000BASE-T 100BASE-TX 10BASE-T
MDI[0]+/- B1_DA+/- TX+/- TX+/ MDI[1]+/- B1_DB+/- RX+/- RX+/ MDI[2]+/- B1_DC+/ MDI[3]+/- B1_DD+/-
Gigabit Ethernet Controller 0 activity indicator, active low.
Gigabit Ethernet Controller 0 100 Mbit / sec link indicator, active low.
Gigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active low.
SATA Signals Description
SignalPin#Pin TypePwr Rail /ToleranceCD9A3 SeriesCarrier BoardDescription
SATA0_TX+A16O SATAAC coupled on ModuleAC Coupling capacitor
SATA0_TX-A17O SATAAC coupled on ModuleAC Coupling capacitor
SATA0_RX+A19I SATAAC coupled on ModuleAC Coupling capacitor
SATA0_RX-A20I SATAAC coupled on ModuleAC Coupling capacitor
SATA1_TX+B16O SATAAC coupled on ModuleAC Coupling capacitor
SATA1_TX-B17O SATAAC coupled on ModuleAC Coupling capacitor
SATA1_RX+B19I SATAAC coupled on ModuleAC Coupling capacitor
SATA1_RX-B20I SATAAC coupled on ModuleAC Coupling capacitor
O PCIEAC coupled on ModulePCI Express Differential Transmit Pairs 0
I PCIEAC coupled off ModulePCI Express Differential Receive Pairs 0
O PCIEAC coupled on ModulePCI Express Differential Transmit Pairs 1
I PCIEAC coupled off ModulePCI Express Differential Receive Pairs 1
O PCIEAC coupled on ModulePCI Express Differential Transmit Pairs 2
I PCIEAC coupled off ModulePCI Express Differential Receive Pairs 2
O PCIEAC coupled on ModulePCI Express Differential Transmit Pairs 3 (NA for CD9A3)
I PCIEAC coupled off ModulePCI Express Differential Receive Pairs 3 (NA for CD9A3)
O PCIEPCIEReference clock output for all PCI Express and PCI Express Graphics lanes.
Connect to SATA0 Conn TX pin
Connect to SATA0 Conn RX pin
Connect to SATA1 Conn TX pin
Connect to SATA1 Conn RX pin
Connect to LED and recommend current limit
resistor 220ƻ to 3.3V
Connect to PCIE device or slot
Device - Connect AC Coupling cap 0.1uF
Slot - Connect to PCIE Conn pin
Connect to PCIE device or slot
Device - Connect AC Coupling cap 0.1uF
Slot - Connect to PCIE Conn pin
Connect to PCIE device or slot
Device - Connect AC Coupling cap 0.1uF
Slot - Connect to PCIE Conn pin
Connect to PCIE device, PCIe CLK Buffer or slot
Serial ATA or SAS Channel 0 transmit differential pair.
Serial ATA or SAS Channel 0 receive differential pair.
Serial ATA or SAS Channel 1 transmit differential pair.
Serial ATA or SAS Channel 1 receive differential pair.
ATA (parallel and serial) or SAS activity indicator, active low.
16
www.dfi .comChapter 3 Hardware Installation
Chapter 3
s
s
ExpressCard Signals Description
SignalPin#Pin TypePwr Rail /ToleranceCD9A3 SeriesCarrier BoardDescription
EXCD0_CPPE#A49PU 10k to 3.3V
EXCD1_CPPE#B48PU 10k to 3.3V
EXCD0_PERST#A48
EXCD1_PERST#B47
DDI Signals Descriptions
SignalPin#Pin TypePwr Rail /ToleranceCD9A3 SeriesCarrier BoardDescription
DDI1_PAIR0+/DP0_LANE0+B71Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR0-/DP0_LANE0-B72Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR1+/DP0_LANE1+B73Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR1-/DP0_LANE1-B74Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR2+/DP0_LANE2+B75Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR2-/DP0_LANE2-B76Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR3+/DP0_LANE3+B81Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR3-/DP0_LANE3-B82Connect AC Coupling Capacitors 0.1uF to Device
DDI1_CTRLCLK_AUX-/DP0_AUX-B99
DDI1_HPD/DP0_HPDB89I CMOS3.3V / 3.3VPD 1M to GNDPD 1M and Connect to device Hot Plug Detect DDI Hot-Plug Detect
DDI1_DDC_AUX_SELB95I CMOS3.3V / 3.3VPD 1M to GNDPU 100K to 3.3V for DDC(HDMI/DVI)
I CMOS3.3V /3.3VPCI ExpressCard: PCI Express capable card request, active low, one per card
O CMOS3.3V /3.3VPCI ExpressCard: reset, active low, one per card
O PCIEAC coupled off ModuleDDI 1 Pair 0 differential pairs/Serial Digital Video B red output differential pair
O PCIEAC coupled off Module
O PCIEAC coupled off ModuleDDI 1 Pair 2 differential pairs/Serial Digital Video B blue output differential pair
O PCIEAC coupled off ModuleDDI 1 Pair 3 differential pairs/Serial Digital Video B clock output differential pair.
I/O PCIEAC coupled on Module
I/O OD CMOS 3.3V / 3.3V
I/O PCIEAC coupled on ModulePU 100K to 3.3VConnect to DP AUX-DP AUX- function if DDI1_DDC_AUX_SEL is no connect
I/O OD CMOS 3.3V / 3.3VPU 2.2K to 3.3V/PU 100K to 3.3V Connect to HDMI/DVI I2C CTRLDATAHDMI/DVI I2C CTRLDATA if DDI1_DDC_AUX_SEL is pulled high
PD 49.9K to GND
(S/W IC between Rpu/PCH)
PU 2.2K to 3.3V, PD 49.9K to
GND
Connect to DP AUX+DP AUX+ function if DDI1_DDC_AUX_SEL is no connect
Connect to HDMI/DVI I2C CTRLCLKHDMI/DVI I2C CTRLCLK if DDI1_DDC_AUX_SEL is pulled high
DDI 1 Pair 1 differential pairs/Serial Digital Video B green output differential pair
NA for CD9A3
NA for CD9A3
NA for CD9A3
Selects the function of DDI1_CTRLCLK_AUX+ and DDI1_CTRLDATA_AUX-.
This pin shall have a 1M pull-down to
logic ground on the Module. If this input is floating the AUX pair is
used for the DP AUX+/- signals. If pulled-high the AUX pair
contains the CRTLCLK and CTRLDATA signals
************************************************************
DDI[n]_DDC_AUX_SEL shall be pulled to 3.3V on the Carrier with a 100K Ohm
resistor to configure the DDI[n]_AUX pair as the DDC channel.
Carrier DDI[n]_DDC_AUX_SEL should be connected to pin 13 of the DisplayPort
LVDS_BKLT_CTRLB83O CMOS3.3V / 3.3VPD 100K to GND
LVDS_I2C_CKA83I/O OD CMOS 3.3V / 3.3VPU 2.2K to 3.3VConnect to DDC clock of LVDS panelI2C clock output for LVDS display use
LVDS_I2C_DATA84I/O OD CMOS 3.3V / 3.3VPU 2.2K to 3.3VConnect to DDC data of LVDS panelI2C data line for LVDS display use
LPC Signals Description
SignalPin#Pin TypePwr Rail /ToleranceCD9A3 SeriesCarrier BoardDescription
LPC_AD0B4
LPC_AD1B5
LPC_AD2B6
LPC_AD3B7
LPC_FRAME#B3O CMOS3.3V / 3.3VLPC frame indicates the start of an LPC cycle
LPC_DRQ0#B8
LPC_DRQ1#B9
LPC_SERIRQA50I/O CMOS3.3V / 3.3VPU 10K to 3.3VLPC serial interrupt
LPC_CLKB10O CMOS3.3V / 3.3VLPC clock output - 33MHz nominal
O PCIEAC coupled on ModuleAdditional transmit signal differential pairs for the SuperSpeed USB data path.(NA for CD9A3)
I PCIEAC coupled off ModulAdditional receive signal differential pairs for the SuperSpeed USB data path.(NA for CD9A3)
O PCIEAC coupled on ModuleAdditional transmit signal differential pairs for the SuperSpeed USB data path.(NA for CD9A3)
I PCIEAC coupled off ModulAdditional receive signal differential pairs for the SuperSpeed USB data path.(NA for CD9A3)
O LVDSLVDS
O LVDSLVDS
O LVDSLVDS
O LVDSLVDS
I/O CMOS3.3V / 3.3V
I CMOS
3.3V / 3.3VLPC serial DMA request
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to enable control of LVDS panel power
circuit
Connect to enable control of LVDS panel backlight
power circuit.
Connect to brightness control of LVDS panel
backlight power circuit.
Connect to LPC device
USB over-current sense, USB channels 0 and 1. A pull-up for this line
shall be present on the Module. An open drain driver from a USB
current monitor on the Carrier Board may drive this line low. Do not
pull this line high on the Carrier Board.
USB over-current sense, USB channels 2 and 3. A pull-up for this line
shall be present on the Module. An open drain driver from a USB
current monitor on the Carrier Board may drive this line low. Do not
pull this line high on the Carrier Board.
USB over-current sense, USB channels 4 and 5. A pull-up for this line
shall be present on the Module. An open drain driver from a USB
current monitor on the Carrier Board may drive this line low. Do not
pull this line high on the Carrier Board.
USB over-current sense, USB channels 6 and 7. A pull-up for this line
shall be present on the Module. An open drain driver from a USB
current monitor on the Carrier Board may drive this line low. Do not
pull this line high on the Carrier Board.
Module USB client may detect the presence of a USB host. A high value(NA for CD9A3)
indicates that a host is present.
LVDS Channel A differential pairs
LVDS Channel A differential clockO LVDSLVDS
LVDS panel power enable
LVDS panel backlight enable
LVDS panel backlight brightness control
LPC multiplexed address, command and data bus
18
www.dfi .comChapter 3 Hardware Installation
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