DFI BT9A3 User Manual

BT9A3

COM Express Mini Module

User’s Manual

A31110523

www.dﬁ .comChapter 1 Introduction

Copyright

FCC and DOC Statement on Class B

This publication contains information that is protected by copyright. No part of it may be reproduced in any form or by any means or used to make any transformation/adaptation without the prior written permission from the copyright holders.

This publication is provided for informational purposes only. The manufacturer makes no representations or warranties with respect to the contents or use of this manual and specifically disclaims any express or implied warranties of merchantability or fitness for any particular purpose. The user will assume the entire risk of the use or the results of the use of this document. Further, the manufacturer reserves the right to revise this publication and make changes to its contents at any time, without obligation to notify any person or entity of such revisions or changes.

Changes after the publication’s first release will be based on the product’s revision. The website will always provide the most updated information.

Trademarks

Product names or trademarks appearing in this manual are for identification purpose only and are the properties of the respective owners.

COM Express Specification Reference

PICMG® COM Express ModuleTM Base Specification. http://www.picmg.org/

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio TV technician for help.

Notice:

1. The changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

2. Shielded interface cables must be used in order to comply with the emission limits.

www.dﬁ .comChapter 1 Introduction

Trademarks ........................................................................................................2

FCC and DOC Statement on Class B .....................................................2

About this Manual ..........................................................................................4

Chapter 4 - BIOS Setup ............................................................... 26

Overview ..................................................................................................... 26

AMI BIOS Setup Utility .............................................................................27

Main ......................................................................................................... 27

Advanced .................................................................................................. 27

Chipset ..................................................................................................... 34

Security .................................................................................................... 38

Boot ......................................................................................................... 39

Save & Exit ...............................................................................................39

Updating the BIOS ....................................................................................40

Notice: BIOS SPI ROM .............................................................................40

Warranty ..............................................................................................................4

Static Electricity Precautions ......................................................................4

Safety Measures ..............................................................................................4

About the Package .........................................................................................5

Chapter 1 - Introduction .............................................................................6

Specifications ................................................................................................6

Features ........................................................................................................7

Chapter 2 - Concept .......................................................................8

COM Express Module Standards ..............................................................8

Specification Comparison Table ...............................................................9

Chapter 3 - Hardware Installation ...............................................10

Board Layout ...............................................................................................10

Block Diagram .............................................................................................10

Mechanical Diagram ..................................................................................11

System Memory ..........................................................................................12

Connectors ...................................................................................................13

CPU Fan Connector.................................................................................... 13

COM Express Connector .............................................................................13

COM Express Connector Signal Discription .................................................. 15

Cooling Option ............................................................................................21

Installing BT9A3 onto a Carrier Board ................................................. 21

Installing the COM Express Debug Card .............................................23

Chapter 5 - Supported Software ...........................................................41

Chapter 6 - GPIO Programming Guide...............................................52

Appendix A - Watchdog Sample Code................................................53

Appendix B - System Error Message ...................................................54

Appendix C - Troubleshooting ................................................................56

www.dﬁ .comChapter 1 Introduction

About this Manual

Static Electricity Precautions

An electronic file of this manual is included in the CD. To view the user’s manual in the CD, insert the CD into a CD-ROM drive. The autorun screen (Main Board Utility CD) will appear. Click “User’s Manual” on the main menu.

Warranty

1. Warranty does not cover damages or failures that arised from misuse of the product, inability to use the product, unauthorized replacement or alteration of components and product specifications.

2. The warranty is void if the product has been subjected to physical abuse, improper installation, modification, accidents or unauthorized repair of the product.

3. Unless otherwise instructed in this user’s manual, the user may not, under any circumstances, attempt to perform service, adjustments or repairs on the product, whether in or out of warranty. It must be returned to the purchase point, factory or authorized service agency for all such work.

4. We will not be liable for any indirect, special, incidental or consequencial damages to the product that has been modified or altered.

It is quite easy to inadvertently damage your PC, system board, components or devices even before installing them in your system unit. Static electrical discharge can damage computer components without causing any signs of physical damage. You must take extra care in handling them to ensure against electrostatic build-up.

1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are ready to install it.

2. Wear an antistatic wrist strap.

3. Do all preparation work on a static-free surface.

4. Hold the device only by its edges. Be careful not to touch any of the components, contacts or connections.

5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or connectors by their ends.

Important:

Electrostatic discharge (ESD) can damage your processor, disk drive and other components. Perform the upgrade instruction procedures described at an ESD workstation only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system chassis throughout any procedures requiring ESD protection.

Safety Measures

To avoid damage to the system:

• Use the correct AC input voltage range.

To reduce the risk of electric shock:

• Unplug the power cord before removing the system chassis cover for installation or servicing. After installation or servicing, cover the system chassis before plugging the power cord.

www.dﬁ .comChapter 1 Introduction

About the Package

The package contains the following items. If any of these items are missing or damaged, please contact your dealer or sales representative for assistance.

• One BT9A3 board

• One QR (Quick Reference)

• One DVD

• One Heat sink

Optional Items

• COM100-B carrier board kit

• Heat sink with fan

• Heat spreader The board and accessories in the package may not come similar to the information listed

above. This may differ in accordance with the sales region or models in which it was sold. For more information about the standard package in your region, please contact your dealer or sales representative.

Before Using the System Board

Before using the system board, prepare basic system components. If you are installing the system board in a new system, you will need at least the following

internal components.

• Storage devices such as hard disk drive, CD-ROM, etc. You will also need external system peripherals you intend to use which will normally include at

least a keyboard, a mouse and a video display monitor.

www.dﬁ .comChapter 1 Introduction

Chapter 1 - Introduction

Specifications

Chapter 1

Processor

System Memory

Graphics

Audio LAN

Serial ATA

Expansion Interfaces

• Intel® AtomTM/Intel® Celeron® processors

- E45: Intel

- E27: Intel

- E15: Intel

- J00: Intel

- N30: Intel

AtomTM E3845, Quad Core, 2M Cache, 1.91GHz, 10W

AtomTM E3827, Dual Core, 1M Cache, 1.75GHz, 8W

AtomTM E3815, Single Core, 0.5M Cache, 1.46GHz, 5W

Celeron® J1900, Quad Core, 2M Cache, 2GHz (2.41GHz), 10W

Celeron® N2930, Quad Core, 2M Cache, 1.83GHz (2.16GHz), 7.5W

• BGA 1170 packaging technology

• 22nm process technology

• 2GB/4GB DDR3L ECC memory down

• Supports DDR3L 1333MHz (-E45/-E27/-J00/-N30) Supports DDR3L 1066MHz (-E15)

• Supports single channel memory interface

• Intel® HD Graphics

• Supports LVDS and DDI interfaces

• LVDS: NXP PTN3460, 18/24-bit, single channel, resolution up to 1366x768 @60Hz

• Digital Display Interfaces: HDMI, DVI and DP

• HDMI, DVI: resolution up to 1920x1080 @60Hz

• DP: resolution up to 2560x1600 @60Hz

• Supports hardware acceleration for DirectX 11, OCL 1.2, OGL 4.0, H.264, MPEG2, MVC, VC-1, WMV9 and VP8 (supported version dependent on OS)

• Supports High Deﬁ nition Audio interface

• Intel® I210 Gigabit Ethernet Controller

• Integrated 10/100/1000 transceiver

• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab

• Supports 2 Serial ATA interfaces

• SATA 2.0 with data transfer rate up to 3Gb/s

• Integrated Advanced Host Controller Interface (AHCI) controller

• Supports 1 USB 3.0 port

• Supports 8 USB 2.0 ports

- 4 integrated USB 2.0 ports

- 1 USB HSIC for 4 USB 2.0 ports

• Supports 3 PCIe x1 (default); or 1 PCIe x4* (BOM option)

• Supports LPC interface

• Supports I

C interface

• Supports SMBus interface

• Suppotrs 2 serial interfaces (TX/RX)

• Supports 8-bit Digital I/O

eMMC*

• Supports 4GB, 8GB, 16GB and 32GB eMMC onboard

(optional) Watchdog

• Watchdog timeout programmable via software from 1 to 255 seconds

Timer Damage Free

Intelligence

• Monitors CPU/system temperature and overheat alarm

• Monitors Vcore/Vgfx/VDDR/3V3 voltages and failure alarm

• Monitors CPU/system fan speed and failure alarm

• Watchdog timer function

BIOS

• AMI BIOS

- 64Mbit SPI BIOS

Power

• TBD

Consumption OS Support

• Windows 7 Ultimate x86 & SP1 (32-bit)

• Windows 7 Ultimate x64 & SP1 (64-bit)

• Windows 8 Enterprise x86 (32-bit)

• Windows 8 Enterprise x64 (64-bit)

• Windows 8.1 Enterprise x86 (32-bit)

• Windows 8.1 Enterprise x64 (64-bit)

• Windows 8.1 Embedded Pro x86 (32-bit)

• Windows 8.1 Embedded Pro x64 (64-bit)

Temperature

Humidity Power Input

• Operating

: 0

C to 60oC - Atom, Celeron (Fanless)

: -20

C to 70oC - Atom (Fanless with air ﬂ ow)

: -40

C to 85oC - Atom (Fanless with air ﬂ ow)

• Storage: -40

C to 85oC

• 5% to 90%

• 4.75V~20V, 5VSB, VCC_RTC (ATX mode)

• 4.75V~20V, VCC_RTC (AT mode)

PCB

• Dimensions

- COM Express

Mini

- 84mm (3.30") x 55mm (2.16")

• Compliance

- PICMG COM Express

R2.1, Type 10

Note:

*Optional and is not supported in standard model. Please contact your sales representative for more information.

www.dﬁ .comChapter 1 Introduction

Chapter 1

Features

• Watchdog Timer

The Watchdog Timer function allows your application to regularly “clear” the system at the set time interval. If the system hangs or fails to function, it will reset at the set time interval so that your system will continue to operate.

• DDR3L

DDR3L is a higher performance DDR3 SDRAM interface providing less voltage and higher speed successor. DDR3L SDRAM modules support 1066/1333MHz for DDR modules. DDR3L delivers increased system bandwidth and improved performance to provide its higher bandwidth and its increase in performance at a lower power.

• Graphics

The integrated Intel® HD graphics engine delivers an excellent blend of graphics performance and features to meet business needs. It provides excellent video and 3D graphics with outstanding graphics responsiveness. These enhancements deliver the performance and compatibility needed for today’s and tomorrow’s business applications. Supports HDMI, DVI and DP interfaces for up to 3 display outputs.

• Serial ATA

Serial ATA is a storage interface that is compliant with SATA 1.0a specification. With speed of up to 3Gb/s (SATA 2.0), it improves hard drive performance faster than the standard parallel ATA whose data transfer rate is 100MB/s.

• Gigabit LAN

The Intel® I210 Gigabit LAN controller supports up to 1Gbps data transmission.

• USB

The system board supports the new USB 3.0. It is capable of running at a maximum transmission speed of up to 5 Gbit/s (625 MB/s) and is faster than USB 2.0 (480 Mbit/s, or 60 MB/s) and USB 1.1 (12Mb/s). USB 3.0 reduces the time required for data transmission, reduces power consumption, and is backward compatible with USB 2.0. It is a marked improvement in device transfer speeds between your computer and a wide range of simultaneously accessible external Plug and Play peripherals.

www.dﬁ .comChapter 1 Introduction

Chapter 2 - Concept COM Express Module Standards

The figure below shows the dimensions of the different types of COM Express modules. BT9A3 is a COM Express Mini. The dimension is 84mm x 55mm.

Common for all Form Factors Extended only Basic only Compact only Compact and Basic only Mini only

Chapter 2

106.00

Extended

91.00

18.00

6.00

0.00

4.00

0.00

16.50

Mini

74.20

80.00

91.00

BasicCompact

70.00

51.00

4.00

121.00

151.00

www.dﬁ .comChapter 2 Concept

Chapter 2

Specification Comparison Table

The table below shows the COM Express standard specifications and the corresponding specifications supported on the BT9A3 module.

COM Express Module Base

Connector Feature

A-B A-B PCI Express Lanes 0 - 5 1 / 4 A-B LVDS Channel A 0 / 1 A-B LVDS Channel B NA A-B eDP on LVDS CH A pins 0 / 1 A-B VGA Port NA A-B TV-Out NA A-B DDI 0 0/1

A-B A-B CAN interface on SER1 0 / 1

A-B SATA / SAS Ports 1 / 2 A-B AC’97 / HDA Digital Interface 0 / 1 A-B USB 2.0 Ports 4 / 8 A-B USB Client 0 / 1 A-B USB 3.0 Ports 0/2 A-B LAN Port 0 1 / 1 A-B Express Card Support 0/2 A-B LPC Bus 1 / 1 A-B SPI 1 / 2 A-B

A-B A-B SMBus 1 / 1

A-B I2C 1 / 1 A-B Watchdog Timer 0 / 1 A-B Speaker Out 1 / 1 A-B External BIOS ROM Support 0 / 2 A-B Reset Functions 1 / 1

Serial Ports 1 - 2 0 / 2

SDIO (muxed on GPIO) 0 / 1 General Purpose I/O 8 / 8

Specification Type 10

(No IDE or PCI, add DDI+ USB3) Min

System Management

Note:

• 5 Indicates 12V-tolerant features on former VCC_12V signals.

• 6 Cells in the connected columns spanning rows provide a rough approximation of features sharing connector pins.

Max

System I/O

DFI BT9A3

Type 10

3 1

0 NA NA

COM Express Module Base

Connector Feature

A-B A-B Thermal Protection 0 / 1 A-B Battery Low Alarm 0 / 1 A-B Suspend/Wake Signals 0 / 3 A-B Power Button Support 1 / 1 A-B Power Good 1 / 1 A-B VCC_5V_SBY Contacts 4 / 4

A-B

A-B A-B Trusted Platform Modules 0 / 1

A-B A-B VCC_12V Contacts 12 / 12

Sleep Input 0 / 1 Lid Input 0 / 1 Fan Control Signals 0 / 2

Specification Type 6

(No IDE or PCI, add DDI+ USB3) Min

Power Management

Max

Power

DFI BT9A3

Type 10

Module Pin-out - Required and Optional Features C-D Connector. PICMG® COM Express Revision 2.1

COM Express Module Base

Connector Feature

C-D

PCI Express Lanes 16 - 31 NA

C-D

C-D C-D C-D VCC_12V Contacts NA

PCI Express Graphics (PEG) NA Muxed SDVO Channels 1 - 2 NA PCI Express Lanes 6 - 15 NA PCI Bus - 32 Bit NA PATA Port NA LAN Ports 1 - 2 NA DDIs 1 - 3 NA USB 3.0 Ports NA

Specification Type 10

(No IDE or PCI, add DDI+ USB3) Min

Max

System I/O

Power

DFI BT9A3

Type 10

N N N N N N N N N

1 1 3 1 1 4 1 1 2 0

www.dﬁ .comChapter 2 Concept

Chapter 3 - Hardware Installation

USB 2.0 4x

SATA 2.0 2x

DDI Port 0

PCIe x1 (Opt.)

HD Audio

LPC Bus

USB 3.0 1x

PCIe x1

Flash

Board Layout

Chapter 3

Block Diagram

CPU fan

DDR3L

Intel WGI210AT

DDR3L

eMMC

(optional)

Intel Atom

SPI Flash BIOS

Top View

DDR3L

E3800 Series

DDR3L

NXP PTN3460

SMSC USB4604

DDR3L

ITE IT8528

Serial Port 1, 2

8-bit DIO

A / B

USB 2.0 4x

SLP/LID

WDT

System Fan PWM/TACH

Tx/Rx

C Bus

EEPROM

TCA6408A

GLAN

SPI

Flash

DDI Port 0

PTN3460

LPC Bus

Embedded

Controller

IT8528

SM Bus

HD Audio USB 3.0 1x USB 2.0 4x

USB4604I

SATA 2.0 2x

PCIe x1 PCIe x1 PCIe x1

PCIe x1 (Opt.)

Intel® GLAN

I210

Switch

DDI Port 1LVDS

USB HSIC

PCIe x1

Atom E3800 Series

/Celeron

DDR3

1333MHz

Single Channel

MMC Bus

DDR3L 1GB ECC 8x memory down

eMMC

(Optional)

B110 B1

COM Express connector

A110

Bottom View

www.dﬁ .comChapter 3 Hardware Installation

Mechanical Diagram

Chapter 3

20.00

16.50

BT9A3 Module with Heat Sink

85.00

60.00

Heatsink

Module PCB

55.00

51.00

4.00

84.00

80.00

BT9A3 Module

4.00

51.00

Top View

4.00

0.00

4.00

2.00

Standoff

Side View of the Module with Heat Sink and Carrier Board

Bottom View

6.00

0.00

9.80

www.dﬁ .comChapter 3 Hardware Installation

Chapter 3

System Memory

Important:

Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in boards, and other components. Perform installation procedures at an ESD workstation only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system chassis throughout any procedures requiring ESD protection.

System Memory

The system board is equipped with nine DDR3L memory chips onboard.

• 2GB/4GB DDR3L ECC memory down

• Supports DDR3L 1333MHz (-E45/-E27/-J00/-N30/-N07) Supports DDR3L 1066MHz (-E26/-E25/-E15)

• Supports single channel memory interface

DDR3L

Bottom View

DDR3L

Top View

DDR3L

www.dﬁ .comChapter 3 Hardware Installation

Chapter 3

Connectors

CPU Fan Connector

Sense

+12V

Ground

Connect the CPU fan’s cable connector to the CPU fan connector on the board. The cooling fan will provide adequate airflow throughout the chassis to prevent overheating the CPU and board components.

1 3

COM Express Connector

The COM Express connector is used to interface the BT9A3 COM Express board to a carrier board. Connect the COM Express connector (located on the solder side of the board) to the COM Express connector on the carrier board.

Refer to the “Installing BT9A3 onto a Carrier Board” section for more information.

COM Express Connector

BIOS Setting

“Module Board H/W Monitor” submenu in the Advanced menu of the BIOS will display the current speed of the cooling fan. Refer to chapter 3 of the manual for more information

Refer to the following pages for the pin functions of the connector.

www.dﬁ .comChapter 3 Hardware Installation

COM Express Connector

Chapter 3

Row A Row B

A1 GND (FIXED) B1 GND (FIXED) A2 GBE0_MDI3- B2 GBE0_ACT# A3 GBE0_MDI3+ B3 LPC_FRAME# A4 GBE0_LINK100# B4 LPC_AD0 A5 GBE0_LINK1000# B5 LPC_AD1 A6 GBE0_MDI2- B6 LPC_AD2 A7 GBE0_MDI2+ B7 LPC_AD3 A8 GBE0_LINK# B8 LPC_DRQ0# A9 GBE0_MDI1- B9 LPC_DRQ1# A10 GBE0_MDI1+ B10 LPC_CLK A11 GND (FIXED) B11 GND (FIXED) A12 GBE0_MDI0- B12 PWRBTN# A13 GBE0_MDI0+ B13 SMB_CK A14 GBE0_CTREF B14 SMB_DAT A15 SUS_S3# B15 SMB_ALERT# A16 SATA0_TX+ B16 SATA1_TX+ A17 SATA0_TX- B17 SATA1_TXA18 SUS_S4# B18 SUS_STAT# A19 SATA0_RX+ B19 SATA1_RX+ A20 SATA0_RX- B20 SATA1_RXA21 GND (FIXED) B21 GND (FIXED) A22 USB_SSRX0- B22 USB_SSTX0A23 USB_SSRX0+ B23 USB_SSTX0+ A24 SUS_S5# B24 PWR_OK A25 USB_SSRX1- B25 USB-SSTX1A26 USB_SSRX1+ B26 USB-SSTX1+ A27 BATLOW# B27 WDT A28 (S)ATA_ACT# B28 AC/HDA _SDIN2 A29 AC/HDA_SYNC B29 AC/HDA _SDIN1 A30 AC/HDA _RST# B30 AC/HDA _SDIN0

Row A Row B

A31 GND (FIXED) B31 GND (FIXED) A32 AC/HDA _BITCLK B32 SPKR A33 AC/HDA _SDOUT B33 I2C_CK A34 BIOS_DIS0# B34 I2C_DAT A35 THRMTRIP# B35 THRM# A36 USB6- B36 USB7A37 USB6+ B37 USB7+ A38 USB_6_7_OC# B38 USB_4_5_OC# A39 USB4- B39 USB5A40 USB4+ B40 USB5+ A41 GND (FIXED) B41 GND (FIXED) A42 USB2- B42 USB3A43 USB2+ B43 USB3+ A44 USB_2_3_OC# B44 USB_0_1_OC# A45 USB0- B45 USB1A46 USB0+ B46 USB1+ A47 VCC_RTC B47 EXCD1_PERST# A48 EXCD0_PERST# B48 EXCD1_CPPE# A49 EXCD0_CPPE# B49 SYS_RESET# A50 LPC_SERIRQ B50 CB_RESET# A51 GND (FIXED) B51 GND (FIXED) A52 RSVD B52 RSVD A53 RSVD B53 RSVD A54 GPI0 B54 GPO1 A55 RSVD B55 RSVD

Row A Row B

A56 RSVD B56 RSVD A57 GND B57 GPO2 A58 PCIE_TX3+ B58 PCIE_RX3+ A59 PCIE_TX3- B59 PCIE_RX3 A60 GND (FIXED) B60 GND (FIXED) A61 PCIE_TX2+ B61 PCIE_RX2+ A62 PCIE_TX2- B62 PCIE_RX2- A63 GPI1 B63 GPO3 A64 PCIE_TX1+ B64 PCIE_RX1+ A65 PCIE_TX1- B65 PCIE_RX1 A66 GND B66 WAKE0# A67 GPI2 B67 WAKE1# A68 PCIE_TX0+ B68 PCIE_RX0+ A69 PCIE_TX0- B69 PCIE_RX0- A70 GND(FIXED) B70 GND (FIXED) A71 LVDS_A0+ B71 DDI0_PAIR0+ A72 LVDS_A0- B72 DDI0_PAIR0 A73 LVDS_A1+ B73 DDI0_PAIR1+ A74 LVDS_A1- B74 DDI0_PAIR1 A75 LVDS_A2+ B75 DDI0_PAIR2+ A76 LVDS_A2- B76 DDI0_PAIR2 A77 LVDS_VDD_EN B77 DDI0_PAIR4+ A78 LVDS_A3+ B78 DDI0_PAIR4 A79 LVDS_A3- B79 LVDS_BKLT_EN A80 GND (FIXED) B80 GND (FIXED) A81 LVDS_A_CK+ B81 DDI0_PAIR3+ A82 LVDS_A_CK- B82 DDI0_PAIR3 A83 LVDS_I2C_CK B83 LVDS_BKLT_CTRL A84 LVDS_I2C_DAT B84 VCC_5V_SBY A85 GPI3 B85 VCC_5V_SBY

Row A Row B

A86 RSVD B86 VCC_5V_SBY A87 eDP_HPD B87 VCC_5V_SBY A88 PCIE_CLK_REF+ B88 BIOS_DIS1# A89 PCIE0_CK_REF- B89 DD0_HPD A90 GND (FIXED) B90 GND (FIXED) A91 SPI_POWER B91 DDI0_PAIR5+ A92 SPI_MISO B92 DDI0_PAIR5 A93 GPO0 B93 DDI0_PAIR6+ A94 SPI_CLK B94 DDI0_PAIR6 A95 SPI_MOSI B95 DDI0_DDC_AUX_SEL A96 TPM_PP B96 USB_HOST_PRSNT A97 TYPE10# B97 SPI_CS# A98 SER0_TX B98 DDI0_CTRLCLK_AUX+ A99 SER0_RX B99 DDI0_CTRLCLK_AUX A100 GND (FIXED) B100 GND (FIXED) A101 SER1_TX B101 FAN_PWMOUT A102 SER1_RX B102 FAN_TACHIN A103 LID# B103 SLEEP# A104 VCC_12V B104 VCC_12V A105 VCC_12V B105 VCC_12V A106 VCC_12V B106 VCC_12V A107 VCC_12V B107 VCC_12V A108 VCC_12V B108 VCC_12V A109 VCC_12V B109 VCC_12V A110 GND (FIXED) B110 GND (FIXED)

www.dﬁ .comChapter 3 Hardware Installation

Chapter 3

COM Express Connector Signal Description

Pin Types I Input to the Module O Output from the Module I/O Bi-directional input / output signal OD Open drain output

C97/HDA Signals Description

Signal Pin# Pin Type Pwr Rail /Tolerance BT9A3 Carrier Board Description AC/HAD_RST# A30 O CMOS 3.3V Suspend/3.3V Connect to CODEC pin 11 RESET# Reset output to CODEC, active low. AC/HDA_SYNC A29 O CMOS 3.3V/3.3V Connect to CODEC pin 10 SYNC Sample-synchronization signal to the CODEC(s). AC/HDA_BITCLK A32 I/O CMOS 3.3V/3.3V Connect to CODEC pin 6 BIT_CLK Serial data clock generated by the external CODEC(s). AC/HDA_SDOUT A33 O CMOS 3.3V/3.3V Connect to CODEC pin 5 SDATA_OUT Serial TDM data output to the CODEC. AC/HDA_SDIN2 B28 I/O CMOS 3.3V Suspend/3.3V Connect 33 ƻ in series to CODEC2 pin 8 SDATA_IN AC/HDA_SDIN1 B29 I/O CMOS 3.3V Suspend/3.3V Connect 33 ƻ in series to CODEC1 pin 8 SDATA_IN AC/HDA_SDIN0 B30 I/O CMOS 3.3V Suspend/3.3V Connect 33 ƻ in series to CODEC0 pin 8 SDATA_IN

Gigabit Ethernet Signals Description

Signal Pin# Pin Type Pwr Rail /Tolerance BT9A3 Carrier Board Description GBE0_MDI0+ A13 I/O Analog 3.3V max Suspend GBE0_MDI0- A12 I/O Analog 3.3V max Suspend GBE0_MDI1+ A10 I/O Analog 3.3V max Suspend GBE0_MDI1- A9 I/O Analog 3.3V max Suspend GBE0_MDI2+ A7 I/O Analog 3.3V max Suspend GBE0_MDI2- A6 I/O Analog 3.3V max Suspend GBE0_MDI3+ A3 I/O Analog 3.3V max Suspend

MDI3-

GBE0 GBE0_ACT# B2 OD CMOS 3.3V Suspend/3.3V GBE0_LINK# A8 OD CMOS 3.3V Suspend/3.3V NC Gigabit Ethernet Controller 0 link indicator, active low.

GBE0_LINK100# A4 OD CMOS 3.3V Suspend/3.3V

GBE0_LINK1000# A5 OD CMOS 3.3V Suspend/3.3V

O Analog3.3V max Suspend

Connect to Magnetics Module MDI0+/-

Connect to Magnetics Module MDI1+/-

Connect to Magnetics Module MDI2+/-

Connect to Magnetics Module MDI3+/Connect to LED and recommend current limit

resistor 150ȟ to 3.3VSB

Connect to LED and recommend current limit resistor 150ȟ to 3.3VSB

Serial TDM data inputs from up to 3 CODECs.

Gigabit Ethernet Controller 0: Media Dependent Interface Differential Pairs 0,1,2,3. The MDI can operate in 1000, 100 and 10 Mbit / sec modes. Some pairs are unused in some modes, per the following: 1000BASE-T 100BASE-TX 10BASE-T MDI[0]+/- B1_DA+/- TX+/- TX+/ MDI[1]+/- B1_DB+/- RX+/- RX+/ MDI[2]+/- B1_DC+/ MDI[3]+/- B1_DD+/-

Gigabit Ethernet Controller 0 activity indicator, active low.

Gigabit Ethernet Controller 0 100 Mbit / sec link indicator, active low.

Gigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active low.

SATA Signals Description

Signal Pin# Pin Type Pwr Rail /Tolerance BT9A3 Carrier Board Description SATA0_TX+ A16 O SATA AC coupled on Module AC Coupling capacitor SATA0_TX- A17 O SATA AC coupled on Module AC Coupling capacitor SATA0_RX+ A19 I SATA AC coupled on Module AC Coupling capacitor SATA0_RX- A20 I SATA AC coupled on Module AC Coupling capacitor SATA1_TX+ B16 O SATA AC coupled on Module AC Coupling capacitor SATA1_TX- B17 O SATA AC coupled on Module AC Coupling capacitor SATA1_RX+ B19 I SATA AC coupled on Module AC Coupling capacitor SATA1_RX- B20 I SATA AC coupled on Module AC Coupling capacitor

ATA_ACT# A28 I/O CMOS 3.3V / 3.3V PU 10K to 3.3V

Connect to SATA0 Conn TX pin

Connect to SATA0 Conn RX pin

Connect to SATA1 Conn TX pin

Connect to SATA1 Conn RX pin Connect to LED and recommend current limit

resistor 220ƻ to 3.3V

Serial ATA or SAS Channel 0 transmit differential pair.

Serial ATA or SAS Channel 0 receive differential pair.

Serial ATA or SAS Channel 1 transmit differential pair.

Serial ATA or SAS Channel 1 receive differential pair.

ATA (parallel and serial) or SAS activity indicator, active low.

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PCI Express Lanes Signals Description

Signal Pin# Pin Type Pwr Rail /Tolerance BT9A3 Carrier Board Description PCIE_TX0+ A68 AC Coupling capacitor PCIE_TX0- A69 AC Coupling capacitor PCIE_RX0+ B68 PCIE_RX0- B69 PCIE_TX1+ A64 AC Coupling capacitor PCIE_TX1- A65 AC Coupling capacitor PCIE_RX1+ B64 PCIE_RX1- B65 PCIE_TX2+ A61 AC Coupling capacitor PCIE_TX2- A62 AC Coupling capacitor PCIE_RX2+ B61 PCIE_RX2- B62 PCIE_TX3+ A58 NA NA PCIE_TX3- A59 NA NA PCIE_RX3+ B58 NA NA PCIE_RX3- B59 NA NA PCIE0_CK_REF+ A88 PCIE0_CK_REF- A89

ExpressCard Signals Description

Signal Pin# Pin Type Pwr Rail /Tolerance BT9A3 Carrier Board Description EXCD0_CPPE# A49 PU 10k to 3.3V EXCD1_CPPE# B48 PU 10k to 3.3V EXCD0_PERST# A48 EXCD1_PERST# B47

DDI Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance BT9A3 Carrier Board Description DDI1_PAIR0+/DP0_LANE0+ B71 Connect AC Coupling Capacitors 0.1uF to Device DDI1_PAIR0-/DP0_LANE0- B72 Connect AC Coupling Capacitors 0.1uF to Device DDI1_PAIR1+/DP0_LANE1+ B73 Connect AC Coupling Capacitors 0.1uF to Device DDI1_PAIR1-/DP0_LANE1- B74 Connect AC Coupling Capacitors 0.1uF to Device DDI1_PAIR2+/DP0_LANE2+ B75 Connect AC Coupling Capacitors 0.1uF to Device DDI1_PAIR2-/DP0_LANE2- B76 Connect AC Coupling Capacitors 0.1uF to Device DDI1_PAIR3+/DP0_LANE3+ B81 Connect AC Coupling Capacitors 0.1uF to Device DDI1_PAIR3-/DP0_LANE3- B82 Connect AC Coupling Capacitors 0.1uF to Device

DDI1_PAIR4+ B77 NA NA DDI1_PAIR4- B78 NA NA

DDI1_PAIR5+ B91 NA NA DDI1_PAIR5- B92 NA NA DDI1_PAIR6+ B93 NA NA DDI1_PAIR6- B94 NA NA

DDI1_CTRLCLK_AUX+/DP0_AUX+ B98

DDI1_CTRLCLK_AUX-/DP0_AUXDDI1_HPD/DP0_HPD B89 I CMOS 3.3V / 3.3V PD 1M to GND PD 1M and Connect to device Hot Plug Detect DDI Hot-Plug Detect

DDI1_DDC_AUX_SEL B95 I CMOS 3.3V / 3.3V PD 1M to GND PU 100K to 3.3V for DDC(HDMI/DVI)

B99

O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 0

I PCIE AC coupled off Module PCI Express Differential Receive Pairs 0

O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 1

I PCIE AC coupled off Module PCI Express Differential Receive Pairs 1

O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 2

I PCIE AC coupled off Module PCI Express Differential Receive Pairs 2

O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 3 (NA for BT9A3)

I PCIE AC coupled off Module PCI Express Differential Receive Pairs 3 (NA for BT9A3)

O PCIE PCIE Reference clock output for all PCI Express and PCI Express Graphics lanes.

I CMOS 3.3V /3.3V PCI ExpressCard: PCI Express capable card request, active low, one per card

O CMOS 3.3V /3.3V PCI ExpressCard: reset, active low, one per card

O PCIE AC coupled off Module DDI 1 Pair 0 differential pairs/Serial Digital Video B red output differential pair

O PCIE AC coupled off Module

O PCIE AC coupled off Module DDI 1 Pair 2 differential pairs/Serial Digital Video B blue output differential pair

O PCIE AC coupled off Module DDI 1 Pair 3 differential pairs/Serial Digital Video B clock output differential pair.

I/O PCIE AC coupled on Module

I/O OD CMOS 3.3V / 3.3V I/O PCIE AC coupled on Module PU 100K to 3.3V Connect to DP AUX- DP AUX- function if DDI1_DDC_AUX_SEL is no connect

I/O OD CMOS 3.3V / 3.3V PU 2.2K to 3.3V/PU 100K to 3.3V Connect to HDMI/DVI I2C CTRLDATA HDMI/DVI I2C CTRLDATA if DDI1_DDC_AUX_SEL is pulled high

PD 49.9K to GND

(S/W IC between Rpu/PCH)

PU 2.2K to 3.3V, PD 49.9K to GND

Connect to PCIE device or slot

Device - Connect AC Coupling cap 0.1uF Slot - Connect to PCIE Conn pin

Connect to PCIE device or slot

Device - Connect AC Coupling cap 0.1uF Slot - Connect to PCIE Conn pin

Connect to PCIE device or slot

Device - Connect AC Coupling cap 0.1uF Slot - Connect to PCIE Conn pin

Connect to PCIE device, PCIe CLK Buffer or slot

DDI 1 Pair 1 differential pairs/Serial Digital Video B green output differential pair

NA for BT9A3

Connect to DP AUX+ DP AUX+ function if DDI1_DDC_AUX_SEL is no connect

Connect to HDMI/DVI I2C CTRLCLK HDMI/DVI I2C CTRLCLK if DDI1_DDC_AUX_SEL is pulled high

Selects the function of DDI1_CTRLCLK_AUX+ and DDI1_CTRLDATA_AUX-. This pin shall have a 1M pull-down to logic ground on the Module. If this input is floating the AUX pair is used for the DP AUX+/- signals. If pulled-high the AUX pair contains the CRTLCLK and CTRLDATA signals ************************************************************ DDI[n]_DDC_AUX_SEL shall be pulled to 3.3V on the Carrier with a 100K Ohm resistor to configure the DDI[n]_AUX pair as the DDC channel. Carrier DDI[n]_DDC_AUX_SEL should be connected to pin 13 of the DisplayPort

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USB Signals Description

Signal Pin# Pin Type Pwr Rail /Tolerance BT9A3 Carrier Board Description USB0+ A46

USB0- A45 USB1+ B46 USB1- B45 USB2+ A43 USB2- A42 USB3+ B43 USB3- B42 USB4+ A40 USB4- A39 USB5+ B40 USB5- B39 USB6+ A37 USB6- A36 USB7+ B37 USB7- B36

USB_0_1_OC# B44 I CMOS 3.3V Suspend/3.3V PU 10k to 3.3A Connect to Overcurrent of USB Power Switch

USB_2_3_OC# A44 I CMOS 3.3V Suspend/3.3V PU 10k to 3.3A Connect to Overcurrent of USB Power Switch

USB_4_5_OC# B38 I CMOS 3.3V Suspend/3.3V PU 10k to 3.3A Connect to Overcurrent of USB Power Switch

USB_6_7_OC# A38 I CMOS 3.3V Suspend/3.3V PU 10k to 3.3A Connect to Overcurrent of USB Power Switch

USB_SSTX0+ D4 NA NA USB_SSTX0- D3 NA NA USB_SSRX0+ C4 NA NA USB_SSRX0- C3 NA NA USB_SSTX1+ D7 NA NA USB_SSTX1- D6 NA NA USB_SSRX1+ C7 NA NA USB_SSRX1- C6 NA NA

USB_HOST_PRSNT B96 I CMOS 3.3V Suspend/3.3V NA NA

I/O USB 3.3V Suspend/3.3V USB differential pairs 0

I/O USB 3.3V Suspend/3.3V USB differential pairs 1

I/O USB 3.3V Suspend/3.3V USB differential pairs 2

I/O USB 3.3V Suspend/3.3V

I/O USB 3.3V Suspend/3.3V USB differential pairs 4

I/O USB 3.3V Suspend/3.3V

I/O USB 3.3V Suspend/3.3V USB differential pairs 6

I/O USB 3.3V Suspend/3.3V USB differential pairs 7

O PCIE AC coupled on Module Additional transmit signal differential pairs for the SuperSpeed USB data path.(NA for BT9A3)

I PCIE AC coupled off Modul Additional receive signal differential pairs for the SuperSpeed USB data path.(NA for BT9A3)

O PCIE AC coupled on Module Additional transmit signal differential pairs for the SuperSpeed USB data path.(NA for BT9A3)

I PCIE

AC coupled off Modul Additional receive signal differential pairs for the SuperSpeed USB data path.(NA for BT9A3)

Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB connector

USB differential pairs 3

USB differential pairs 5

USB over-current sense, USB channels 0 and 1. A pull-up for this line shall be present on the Module. An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not pull this line high on the Carrier Board.

USB over-current sense, USB channels 2 and 3. A pull-up for this line shall be present on the Module. An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not pull this line high on the Carrier Board.

USB over-current sense, USB channels 4 and 5. A pull-up for this line shall be present on the Module. An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not pull this line high on the Carrier Board.

USB over-current sense, USB channels 6 and 7. A pull-up for this line shall be present on the Module. An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not pull this line high on the Carrier Board.

Module USB client may detect the presence of a USB host. A high value(NA for BT9A3) indicates that a host is present.

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LVDS Signals Description

Signal Pin# Pin Type Pwr Rail /Tolerance BT9A3 Carrier Board Description LVDS_A0+ A71 LVDS_A0- A72 LVDS_A1+ A73 LVDS_A1- A74 LVDS_A2+ A75 LVDS_A2- A76 LVDS_A3+ A78 LVDS_A3- A79 LVDS_A_CK+ A81 LVDS_A_CK- A82

LVDS_VDD_EN A77 O CMOS 3.3V / 3.3V

LVDS_BKLT_EN B79 O CMOS 3.3V / 3.3V

LVDS_BKLT_CTRL B83 O CMOS 3.3V / 3.3V LVDS_I2C_CK A83 I/O OD CMOS 3.3V / 3.3V PU 2.2K to 3.3V Connect to DDC clock of LVDS panel I2C clock output for LVDS display use

LVDS_I2C_DAT A84 I/O OD CMOS 3.3V / 3.3V PU 2.2K to 3.3V Connect to DDC data of LVDS panel I2C data line for LVDS display use

LPC Signals Description

Signal Pin# Pin Type Pwr Rail /Tolerance BT9A3 Carrier Board Description LPC_AD0 B4 LPC_AD1 B5 LPC_AD2 B6 LPC_AD3 B7 LPC_FRAME# B3 O CMOS 3.3V / 3.3V LPC frame indicates the start of an LPC cycle LPC_DRQ0# B8 LPC_DRQ1# B9 LPC_SERIRQ A50 I/O CMOS 3.3V / 3.3V PU 8.2K to 3.3V LPC serial interrupt LPC_CLK B10 O CMOS 3.3V / 3.3V LPC clock output - 33MHz nominal

SPI Signals Description

Signal Pin# Pin Type Pwr Rail /Tolerance BT9A3 Carrier Board Description SPI_CS# B97 O CMOS 3.3V Suspend/3.3V

SPI_MISO A92 I CMOS 3.3V Suspend/3.3V

SPI_MOSI A95 O CMOS 3.3V Suspend/3.3V

SPI_CLK A94 O CMOS 3.3V Suspend/3.3V

SPI_POWER A91 O 3.3V Suspend/3.3V

BIOS

DIS0#

BIOS_DIS1# B88

Serial Interface Signals Description

Signal Pin# Pin Type Pwr Rail /Tolerance BT9A3 Carrier Board Description SER0_TX A98 O CMOS

SER0_RX A99 I CMOS

SER1_TX A101 O CMOS

SER1_RX A102 I CMOS

O LVDS LVDS

I/O CMOS 3.3V / 3.3V

I CMOS

3.3V / 3.3V LPC serial DMA request

5V / 12V(design 3.3v~5V tolerant) 5V / 12V(design 3.3v~5 tolerant 5V / 12V(design 3.3v~5V tolerant) 5V / 12V(design 3.3v~5V tolerant)

PU 47K to 3.3V General purpose serial port 0 receiver

PU 47K to 3.3V General purpose serial port 1 receiver

Connect to LVDS connector

Connect to enable control of LVDS panel power circuit Connect to enable control of LVDS panel backlight power circuit. Connect to brightness control of LVDS panel backlight power circuit.

Connect to LPC device

Connect a series resistor 33 Board SPI Device CS# pin Connect a series resistor 33 Board SPI Device SO pin Connect a series resistor 33 Board SPI Device SI pin Connect a series resistor 33 Board SPI Device SCK pin

to Carrier

PD 4.7K General purpose serial port 0 transmitter

PD 4.7K General purpose serial port 1 transmitter

LVDS Channel A differential pairs

LVDS Channel A differential clockO LVDS LVDS

LVDS panel power enable

LVDS panel backlight enable

LVDS panel backlight brightness control

LPC multiplexed address, command and data bus

Chip select for Carrier Board SPI - may be sourced from chipset SPI0 or SPI1

Data in to Module from Carrier SPI

Data out from Module to Carrier SPI

Clock from Module to Carrier SPI Power supply for Carrier Board SPI – sourced from Module – nominally

3.3V. The Module shall provide a minimum of 100mA on SPI_POWER. Carriers shall use less than 100mA of SPI_POWER. SPI_POWER shall only be used to power SPI devices on the Carrier Selection straps to determine the BIOS boot device. The Carrier should only float these or pull them low, please refer to COM Express Module Base Specification Revision 2.1 for strapping options of BIOS disable signals.

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+ 39 hidden pages

DFI BT9A3 User Manual

Copyright

FCC and DOC Statement on Class B

Trademarks

Table of Contents

About this Manual

Static Electricity Precautions

Warranty

Safety Measures

About the Package

Before Using the System Board

Chapter 1 - Introduction

Specifications

Features

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Specification Comparison Table

Chapter 3 - Hardware Installation

Board Layout

Block Diagram

Mechanical Diagram

System Memory

Connectors

COM Express Connector

COM Express Connector Signal Description