DFI BT700 User Manual

www.dﬁ .comChapter 1 Introduction

BT700

Qseven Board User’s Manual

A31430532

www.dﬁ .comChapter 1 Introduction

This publication contains information that is protected by copyright. No part of it may be reproduced in any form or by any means or used to make any transformation/adaptation without the prior written permission from the copyright holders.

This publication is provided for informational purposes only. The manufacturer makes no representations or warranties with respect to the contents or use of this manual and specifically disclaims any express or implied warranties of merchantability or fitness for any particular purpose. The user will assume the entire risk of the use or the results of the use of this document. Further, the manufacturer reserves the right to revise this publication and make changes to its contents at any time, without obligation to notify any person or entity of such revisions or changes.

Changes after the publication’s first release will be based on the product’s revision. The website will always provide the most updated information.

Trademarks

Product names or trademarks appearing in this manual are for identification purpose only and are the properties of the respective owners.

Qseven Specification Reference

http://www.qseven-standard.org/

FCC and DOC Statement on Class B

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio TV technician for help.

Notice:

1. The changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

2. Shielded interface cables must be used in order to comply with the emission limits.

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Table of Contents

Trademarks ........................................................................................................2

FCC and DOC Statement on Class B ..................................................... 2

About this Manual ..........................................................................................4

Warranty ............................................................................................................4

Static Electricity Precautions ......................................................................4

Safety Measures ..............................................................................................4

About the Package .........................................................................................5

Chapter 1 - Introduction .............................................................................6

Specifications ................................................................................................6

Features ..........................................................................................................7

Chapter 2 - Hardware Installation ................................................ 8

Board Layout .................................................................................................8

Block Diagram ............................................................................................... 8

Mechanical Diagram ....................................................................................9

System Memory .......................................................................................... 10

Cooling Option ............................................................................................10

MXM Connector ..........................................................................................11

MXM Connector Signal Description .......................................................13

Installing BT700 onto a Carrier Board .................................................18

Chapter 3 - BIOS Setup ............................................................... 19

Overview ..................................................................................................... 19

AMI BIOS Setup Utility .............................................................................20

Main ..........................................................................................................20

Advanced ...................................................................................................20

Chipset ......................................................................................................27

Security ...................................................................................................... 32

Boot...........................................................................................................32

Save & Exit ................................................................................................33

Updating the BIOS ....................................................................................33

Notice: BIOS SPI ROM .............................................................................34

Chapter 4 - Supported Software .......................................................... 35

Appendix A - System Error Message ................................................... 50

Appendix B - Troubleshooting ................................................................51

www.dﬁ .comChapter 1 Introduction

About this Manual

An electronic file of this manual is included in the CD. To view the user’s manual in the CD, insert the CD into a CD-ROM drive. The autorun screen (Main Board Utility CD) will appear. Click “User’s Manual” on the main menu.

Warranty

1. Warranty does not cover damages or failures that arised from misuse of the product, inability to use the product, unauthorized replacement or alteration of components and product specifications.

2. The warranty is void if the product has been subjected to physical abuse, improper installation, modification, accidents or unauthorized repair of the product.

3. Unless otherwise instructed in this user’s manual, the user may not, under any circumstances, attempt to perform service, adjustments or repairs on the product, whether in or out of warranty. It must be returned to the purchase point, factory or authorized service agency for all such work.

4. We will not be liable for any indirect, special, incidental or consequencial damages to the product that has been modified or altered.

Static Electricity Precautions

It is quite easy to inadvertently damage your PC, system board, components or devices even before installing them in your system unit. Static electrical discharge can damage computer components without causing any signs of physical damage. You must take extra care in handling them to ensure against electrostatic build-up.

1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are ready to install it.

2. Wear an antistatic wrist strap.

3. Do all preparation work on a static-free surface.

4. Hold the device only by its edges. Be careful not to touch any of the components, contacts or connections.

5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or connectors by their ends.

Safety Measures

To avoid damage to the system:

• Use the correct AC input voltage range.

To reduce the risk of electric shock:

• Unplug the power cord before removing the system chassis cover for installation or servicing. After installation or servicing, cover the system chassis before plugging the power cord.

Important:

Electrostatic discharge (ESD) can damage your processor, disk drive and other components. Perform the upgrade instruction procedures described at an ESD workstation only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system chassis throughout any procedures requiring ESD protection.

www.dﬁ .comChapter 1 Introduction

About the Package

The package contains the following items. If any of these items are missing or damaged, please contact your dealer or sales representative for assistance.

• One BT700 board

• One DVD

• One QR (Quick Reference)

• One Heat sink

Optional Items

• Q7X-151 carrier board kit

• Heat spreader

• Heat spreader with heat sink

• bracket The board and accessories in the package may not come similar to the information listed

above. This may differ in accordance with the sales region or models in which it was sold. For more information about the standard package in your region, please contact your dealer or sales representative.

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Expansion Interfaces

• Supports 1 USB 3.0 port and 1 USB HSIC for 2 USB 2.0 (default); or 4 USB 2.0 ports* (BOM option)

• Supports 4 USB 2.0 ports

• Supports 3 PCIe x1 (default); or 1 PCIe x4 (PCIe port 3, by default, is shared with the onboard LAN)*

• Supports LPC interface

• Supports I

C interface

• Supports SMBus interface

• Suppotrs 1 UART interface (TX/RX/CTS/RTS)

Damage Free Intelligence

• Monitors CPU temperature

• Monitors system fan speed

• Monitors Vcore/VGFX/VSM voltages

• Watchdog timer function

BIOS

• AMI BIOS

- 64Mbit SPI BIOS

Power

• Input: VCC_RTC, 5V standby, 5V

Power Consumption

• BT700-T44-E45: 12.72W with E3845 at 1.91GHz and 4GB DDR3L memory down

OS Support

• Windows 7 Ultimate x86 & SP1 (32-bit)

• Windows 7 Ultimate x64 & SP1 (64-bit)

• Windows 8 Enterprise x86 (32-bit)

• Windows 8 Enterprise x64 (64-bit)

• Windows 8.1 Enterprise x86 (32-bit)

• Windows 8.1 Enterprise x64 (64-bit)

Temperature

• Operating : 0

C to 60oC - Atom (Fanless)

: -20

C to 70oC - Atom (Fanless with air ﬂ ow)

: -40

C to 85oC - Atom (Fanless with air ﬂ ow)

• Storage: -40

C to 85oC

Humidity

• 5% to 90%

PCB

• Dimensions

- Qseven form factor

- 70mm (2.76") x 70mm (2.76")

• Compliance

- Qseven speciﬁ cation revision 2.0

Chapter 1 - Introduction

Specifications

Processor

• Intel® AtomTM processors

- E45: Intel

AtomTM E3845, Quad Core, 2M Cache, 1.91GHz, 10W

- E26: Intel

AtomTM E3826, Dual Core, 1M Cache, 1.46GHz, 7W

- E15: Intel

AtomTM E3815, Single Core, 0.5M Cache, 1.46GHz, 5W

• BGA 1170 packaging technology

• 22nm process technology

System Memory

• 2GB/4GB DDR3L memory down

• Supports DDR3L 1333MHz (-E45) Supports DDR3L 1066MHz (-E26/-E15)

• Supports single channel memory interface

Graphics

• Intel® HD Graphics

• Supports LVDS and DDI interfaces

• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to 1920x1200 @60Hz

• Digital Display Interfaces: HDMI, DVI and DP

• HDMI, DVI: resolution up to 1920x1080 @60Hz

• DP: resolution up to 2560x1600 @60Hz

• Supports hardware acceleration for DirectX 11, OCL 1.2, OGL 4.0, H.264, MPEG2, MVC, VC-1, WMV9 and VP8 (supported version dependent on OS)

Audio

• Supports High Deﬁ nition Audio interface

LAN

• Intel® I210AT/IT Gigabit Ethernet Controller

- Intel

I210IT supports wide temperature (-40oC to 85oC)

• Integrated 10/100/1000 transceiver

• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab

Serial ATA

• Supports 2 Serial ATA interfaces

• SATA 2.0 with data transfer rate up to 3Gb/s

• Integrated Advanced Host Controller Interface (AHCI) controller

eMMC* (optional)

• Supports 4GB, 8GB, 16GB and 32GB eMMC onboard

• Supports Windows 8.1 only

SD Interface

• Supports 1 SD interface

• Supports SDIO speciﬁ cation Ver. 3.0, HC Standard speciﬁ cation Ver. 3.0, physical layer speciﬁ cation Ver. 3.0, security speciﬁ cation Ver. 1.01

Trusted Platform Module - TPM* (optional)

• Provides a Trusted PC for secure transactions

• Provides software license protection, enforcement and password protection

Watchdog Timer

• Watchdog timeout programmable via software from 1 to 255 seconds

Chapter 1

Note:

*Optional and is not supported in standard model. Please contact your sales representative for more information.

www.dﬁ .comChapter 1 Introduction

Features

• DDR3L

DDR3L is a higher performance DDR3 SDRAM interface providing less voltage and higher speed successor. DDR3L supporting 1066MHz

(-E26/-E15) or 1333MHz (-E45) delivers increased

system bandwidth and improved performance to provide its higher bandwidth and its increase in performance at a lower power than DDR3 and DDR2.

• Graphics

The integrated Intel® HD graphics engine delivers an excellent blend of graphics performance and features to meet business needs. It provides excellent video and 3D graphics with outstanding graphics responsiveness. These enhancements deliver the performance and compatibility needed for today’s and tomorrow’s business applications. Supports HDMI, DVI and DP interfaces for display outputs.

• Serial ATA

Serial ATA is a storage interface that is compliant with SATA 2.0a specification. With speed of up to 3Gb/s (SATA 2.0), it improves hard drive performance faster than the standard parallel ATA whose data transfer rate is 100MB/s.

• Gigabit LAN

The Intel

I210AT/IT Gigabit Ethernet Controller supports up to 1Gbps data transmission.

• Watchdog Timer

The Watchdog Timer function allows your application to regularly “clear” the system at the set time interval. If the system hangs or fails to function, it will reset at the set time interval so that your system will continue to operate.

Chapter 1

Specification Comparison Table

The table below shows the Qseven standard specifications and the corresponding specifications supported on the BT700 module.

System I/O Interface

ARM/RISC Based Minimum Configuration

X86 Based Minimum Configuration

Maximum Configuration

DFI BT700 Configuration

PCI Express Lanes 0 1 (x1 link) 4

3+1(shared with Ethernet

)

Serial ATA channels0022

USB 2.0 ports 3 4 8

6+2(shared with 1 USB 3.0 port) - BOM option

USB 3.0

orts 0 0 2 1

LVDS channel

embedded Display Por

0 0 Dual Channel 24bits Dual Channel 24bits

Dis

play

Port, TMDS 0 0 1 1

h Definition

udio/AC'97/I2

0011

Ethernet 10/100 Mbit

/Gig

abit

0 0 1 (Gigabit Ethernet) 1

UART 0 0 1 1 Low Pin Count bus 0 0 1 1 Secure Di

ital I/O 8-bi

for SD/MMC cards

0011

stem Management0111

C Bus

1111 SPI Bus 0 0 1 1 CAN Bus 0 0 1 0 Watchdo

Trigger 1 1 1 1 Power Button 1 1 1 1 Power Good 1 1 1 1 Reset Button 1 1 1 1 LID Button 0 0 1 1 Slee

Button 0 0 1 1 Suspend To RAM (S3 mode

)

0011

Wake 0 0 1 1 Batter

low alarm 0 0 1 1 Thermal control 0 0 1 1 FAN control 0 0 1 1

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Chapter 2

Chapter 2 - Hardware Installation Board Layout

Top View

Bottom View

Block Diagram

PCIe x1

2GB/4GB DDR3L

memory down

Atom E3800

Series

AMXM Golden Finger

HDA

LPC

PCIe x1 3x

SM Bus

UART

C Bus

HDA

LPC

PCI

e x1 3x

SM Bus

UARTIC Bus

GbE

SPI Flash

64Mbit

eMMC

Switch

SATA 2.0 2x

GLAN

I210

PCIe x1 (Opt.)

USB 2.0 4x

eDP

LVDS

PTN3460

USB

HSIC

USB

HSIC

USB 3.0 1x

USB 2.0 2x

USB 2.0 2x (Opt. share with USB 3.0)

DDI

eMMC

(optional)

USB 3.0 1x

DDR3 1333MHz

Single Channel

DDR3L

DDR3L DDR3L

SPI Flash BIOS

E3800 Series

Intel Atom

NXP PTN3460

IDT P9145

DDR3L

Intel

WGI210AT

SMSC

USB4604

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Chapter 2

Mechanical Diagram

BT700 Module with thermal solution

Side View of the Module with thermal solution and Carrier Board

BT700 Module

20.00

70.00

1.20

6.00

14.00

64.90

20.00

Module PCB

Heatsink

Bottom Vie

Top View

0.00

56.50

64.90

70.00

3.95

2.99

11.52

66.05

66.99

70.00

56.50

0.00

11.53

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Chapter 2

System Memory

Important:

Cooling Option

Heat Spreader with Heat Sink

• “1” and “2“ denote the locations of the thermal pads designed to contact the corresponding components that are on BT700.

• Remove the plastic covering from the thermal pads prior to mounting the heat sink onto BT700.

Top View of the Heat Sink

Bottom View of the Heat Sink

The system board is equipped with eight 2GB/4GB DDR3L onboard memory inerfaces.

• Supports DDR3L 1333MHz (-E45/-E27/-J00/-N30/-N07) Supports DDR3L 1066MHz (-E26/-E25/-E15)

• Supports single channel memory interface

DDR3L

Top View

Bottom View

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Chapter 2

MXM Connector

The MXM connector is used to interface with the carrier board. Insert BT700 to the MXM connector on the carrier board. Refer to the following pages for the pin functions of this connector.

Refer to “Installing BT700 onto a Carrier Board” section for more information.

MXM Connector

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Chapter 2

Pin Q7 R2.0 Signal BT700 Signal Pin Q7 R2.0 Signal BT700 Signal

1 GND GND 2 GND GND 3 GBE_MDI3- GBE_MDI3- 4 GBE_MDI2- GBE_MDI2- 5 GBE_MDI3+ GBE_MDI3+ 6 GBE_MDI2+ GBE_MDI2+ 7 GBE_LINK100# GBE_LINK100# 8 GBE_LINK1000# GBE_LINK1000#

9 GBE_MDI1- GBE_MDI1- 10 GBE_MDI0- GBE_MDI0- 11 GBE_MDI1+ GBE_MDI1+ 12 GBE_MDI0+ GBE_MDI0+ 13 GBE_LINK# NC 14 GBE_ACT# GBE_ACT# 15 GBE_CTREF NC 16 SUS_S5# SUS_S4# 17 WAKE# WAKE# 18 SUS_S3# SUS_S3# 19 SUS_STAT# SUS_STAT# 20 PWRBTN# PWRBTN# 21 SLP_BTN# SLP_BTN# 22 LID_BTN# LID_BTN# 23 GND GND 24 GND GND

KEY KEY KEY KEY 25 GND GND 26 PWGIN PWGIN 27 BATLOW# BATLOW# 28 RSTBTN# RSTBTN# 29 SATA0_TX+ SATA0_TX+ 30 SATA1_TX+ SATA1_TX+ 31 SATA0_TX- SATA0_TX- 32 SATA1_TX- SATA1_TX- 33 SATA_ACT# SATA_ACT# 34 GND GND 35 SATA0_RX+ SATA0_RX+ 36 SATA1_RX+ SATA1_RX+ 37 SATA0_RX- SATA0_RX- 38 SATA1_RX- SATA1_RX- 39 GND GND 40 GND GND 41 BIOS_DISABLE# / BOOT_ALT# BIOS_DISABLE# 42 SDIO_CLK# SDIO_CLK# 43 SDIO_CD# SDIO_CD# 44 SDIO_LED NC 45 SDIO_CMD SDIO_CMD 46 SDIO_WP SDIO_WP 47 SDIO_PWR# SDIO_PWR# 48 SDIO_DAT1 SDIO_DAT1 49 SDIO_DAT0 SDIO_DAT0 50 SDIO_DAT3 SDIO_DAT3 51 SDIO_DAT2 SDIO_DAT2 52 SDIO_DAT5 NC 53 SDIO_DAT4 NC 54 SDIO_DAT7 NC 55 SDIO_DAT6 NC 56 RSVD NC 57 GND GND 58 GND GND 59 HDA_SYNC / I2S_WS HDA_SYNC 60 SMB_CLK / GP1_I2C_CLK SMB_CLK 61 HDA_RST# / I2S_RST# HDA_RST# 62 SMB_DAT / GP1_I2C_DAT SMB_DAT 63 HDA_BITCLK / I2S_CLK HDA_BITCLK 64 SMB_ALERT# SMB_ALERT# 65 HDA_SDI / I2S_SDI HDA_SDI 66 GP0_I2C_CLK GP0_I2C_CLK 67 HDA_SDO / I2S_SDO HDA_SDO 68 GP0_I2C_DAT GP0_I2C_DAT 69 THRM# THRM# 70 WDTRIG# WDTRIG# 71 THRMTRIP# THRMTRIP# 72 WDOUT WDOUT 73 GND GND 74 GND GND 75 USB_P7- / USB_SSTX0- USB_SSTX0- 76 USB_P6- / USB_SSRX0- USB_SSRX0- 77 USB_P7+ / USB_SSTX0+ USB_SSTX0+ 78 USB_P6+ / USB_SSRX0+ USB_SSRX0+ 79 USB_6_7_OC# USB_6_7_OC# 80 USB_4_5_OC# USB_4_5_OC# 81 USB_P5- / USB_SSTX1-

USB_P5- 82 USB_P4- / USB_SSRX1- USB_P4-

83 USB_P5+ / USB_SSTX1+ USB_P5+ 84 USB_P4+ / USB_SSRX1+ USB_P4+ 85 USB_2_3_OC# USB_2_3_OC# 86 USB_0_1_OC# USB_0_1_OC# 87 USB_P3- USB_P3- 88 USB_P2- USB_P2- 89 USB_P3+ USB_P3+ 90 USB_P2+ USB_P2+ 91 USB_CC NC 92 USB_ID NC 93 USB_P1- USB_P1- 94 USB_P0- USB_P0- 95 USB_P1+ USB_P1+ 96 USB_P0+ USB_P0+ 97 GND GND 98 GND GND 99 eDP0_TX0+ / LVDS_A0+

LVDS_A0+ 100 eDP1_TX0+ / LVDS_B0+ LVDS_B0+

101 eDP0_TX0- / LVDS_A0- LVDS_A0- 102 eDP1_TX0- / LVDS_B0- LVDS_B0- 103 eDP0_TX1+ / LVDS_A1+ LVDS_A1+ 104 eDP1_TX1+ / LVDS_B1+ LVDS_B1+ 105 eDP0_TX1- / LVDS_A1- LVDS_A1- 106 eDP1_TX1- / LVDS_B1- LVDS_B1- 107 eDP0_TX2+ / LVDS_A2+ LVDS_A2+ 108 eDP1_TX2+ / LVDS_B2+ LVDS_B2+ 109 eDP0_TX2- / LVDS_A2- LVDS_A2- 110 eDP1_TX2- / LVDS_B2- LVDS_B2- 111 LVDS_PPEN LVDS_PPEN 112 LVDS_BLEN LVDS_BLEN 113 eDP0_TX3+ / LVDS_A3+ LVDS_A3+ 114 eDP1_TX3+ / LVDS_B3+ LVDS_B3+ 115 eDP0_TX3- / LVDS_A3- LVDS_A3- 116 eDP1_TX3- / LVDS_B3- LVDS_B3-

117 GND GND 118 GND GND 119 eDP0_AUX+ / LVDS_A_CLK+ LVDS_A_CLK+ 120 eDP1_AUX+ / LVDS_B_CLK+ LVDS_B_CLK+ 121 eDP0_AUX- / LVDS_A_CLK- LVDS_A_CLK- 122 eDP1_AUX- / LVDS_B_CLK- LVDS_B_CLK- 123 LVDS_BLT_CTRL /GP_PWM_OUT0 LVDS_BLT_CTRL 124 GP_1-Wire_Bus GP_1-Wire_Bus 125 GP2_I2C_DAT / LVDS_DID_DAT LVDS_DID_DAT 126 eDP0_HPD# / LVDS_BLC_DAT NC 127 GP2_I2C_CLK / LVDS_DID_CLK LVDS_DID_CLK 128 eDP1_HPD# / LVDS_BLC_CLK NC 129 CAN0_TX NC 130 CAN0_RX NC 131 DP_LANE3+ / TMDS_CLK+ DP_LANE3+ 132 RSVD (Differential Pair) NC 133 DP_LANE3- / TMDS_CLK- DP_LANE3- 134 RSVD (Differential Pair) NC 135 GND GND 136 GND GND 137 DP_LANE1+ / TMDS_LANE1+ DP_LANE1+ 138 DP_AUX+ DP_AUX+ 139 DP_LANE1- / TMDS_LANE1- DP_LANE1- 140 DP_AUX- DP_AUX- 141 GND GND 142 GND GND 143 DP_LANE2+ / TMDS_LANE0+ DP_LANE2+ 144 RSVD (Differential Pair) NC 145 DP_LANE2- / TMDS_LANE0- DP_LANE2- 146 RSVD (Differential Pair) NC 147 GND GND 148 GND GND 149 DP_LANE0+ / TMDS_LANE2+ DP_LANE0+ 150 HDMI_CTRL_DAT HDMI_CTRL_DAT 151 DP_LANE0- / TMDS_LANE2- DP_LANE0- 152 HDMI_CTRL_CLK HDMI_CTRL_CLK 153 DP_HDMI_HPD# DP_HDMI_HPD# 154 RSVD NC 155 PCIE_CLK_REF+ PCIE_CLK_REF+ 156 PCIE_WAKE# PCIE_WAKE# 157 PCIE_CLK_REF- PCIE_CLK_REF- 158 PCIE_RST# PCIE_RST# 159 GND GND 160 GND GND 161 PCIE3_TX+ NC 162 PCIE3_RX+ NC 163 PCIE3_TX- NC 164 PCIE3_RX- NC 165 GND GND 166 GND GND 167 PCIE2_TX+

PCIE2_TX+ 168 PCIE2_RX+ PCIE2_RX+

169 PCIE2_TX- PCIE2_TX- 170 PCIE2_RX- PCIE2_RX- 171 UART0_TX UART0_TX 172 UART0_RTS# UART0_RTS# 173 PCIE1_TX+ PCIE1_TX+ 174 PCIE1_RX+ PCIE1_RX+ 175 PCIE1_TX- PCIE1_TX- 176 PCIE1_RX- PCIE1_RX- 177 UART0_RX UART0_RX 178 UART0_CTS# UART0_CTS# 179 PCIE0_TX+ PCIE0_TX+ 180 PCIE0_RX+ PCIE0_RX+ 181 PCIE0_TX- PCIE0_TX- 182 PCIE0_RX-

PCIE0_RX-

183 GND GND 184 GND GND 185 LPC_AD0 / GPIO0 LPC_AD0 186 LPC_AD1 / GPIO1 LPC_AD1 187 LPC_AD2 / GPIO2 LPC_AD2 188 LPC_AD3 / GPIO3 LPC_AD3 189 LPC_CLK / GPIO4 LPC_CLK 190 LPC_FRAME# / GPIO5 LPC_FRAME# 191 SERIRQ / GPIO6 SERIRQ 192 LPC_LDRQ# / GPIO7 NC 193 VCC_RTC VCC_RTC 194 SPKR / GP_PWM_OUT2 SPKR 195 FAN_TACHOIN / GP_TIMER_IN FAN_TACHOIN 196 FAN_PWMOUT / GP_PWM_OUT1 FAN_PWMOUT 197 GND GND 198 GND GND 199 SPI_MOSI SPI_MOSI 200 SPI_CS0# SPI_CS0# 201 SPI_MISO SPI_MISO 202 SPI_CS1# NC 203 SPI_SCK SPI_SCK 204 MFG_NC4 NC 205 VCC_5V_SB VCC_5V_SB 206 VCC_5V_SB VCC_5V_SB 207 MFG_NC0 NC 208 MFG_NC2 UART1_RX 209 MFG_NC1 UART1_TX 210 MFG_NC3 NC 211 VCC VCC 212 VCC VCC 213 VCC VCC 214 VCC VCC 215 VCC VCC 216 VCC VCC 217 VCC VCC

218 VCC VCC 219 VCC VCC 220 VCC VCC 221 VCC VCC 222 VCC VCC 223 VCC VCC 224 VCC VCC 225 VCC VCC 226 VCC VCC 227 VCC VCC 228 VCC VCC 229 VCC VCC 230 VCC VCC

Pin Q7 R2.0 Signal BT700 Signal Pin Q7 R2.0 Signal BT700 Signal

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Chapter 2

MXM Connector Signal Description

Signal Pin# Pin Type Pwr Rail /Tolerance BT700 Carrier Board Description

PCIE0_RX+ 180 PCIE0_RX- 182 PCIE0_TX+

179

AC Coupling capacitor

PCIE0_TX-

181

AC Coupling capacitor PCIE1_RX+ 174 PCIE1_RX- 176 PCIE1_TX+

173

AC Coupling capacitor PCIE1_TX-

175

AC Coupling capacitor PCIE2_RX+ 168 PCIE2_RX- 170 PCIE2_TX+

167

AC Coupling capacitor PCIE2_TX-

169

AC Coupling capacitor PCIE3_RX+ 162 PCIE3_RX- 164 PCIE3_TX+

161

AC Coupling capacitor PCIE3_TX-

163

AC Coupling capacitor PCIE_CLK_REF+ 155 PCIE_CLK_REF- 157 PCIE_WAKE# 156 I CMOS 3.3V Suspend/3.3V PU 10K to 3.3V Suspend PCI Express Wake Event: Sideband wake signal asserted by components requesting wakeup. PCIE_RST# 158 O CMOS 3.3V/3.3V Reset Signal for external devices.

Signal Pin# Pin Type Pwr Rail /Tolerance BT700 Carrier Board Description

UART0_TX 171 O CMOS 3.3V/3.3V Connect to UART device Serial Data Transmitter UART0_RX 177 I CMOS 3.3V/3.3V Connect to UART device Serial Data Reciever UART0_CTS# 178 I CMOS 3.3V/3.3V Connect to UART device Handshake signal, ready to send data UART0_RTS# 172 O CMOS 3.3V/3.3V Connect to UART device Handshake signal, ready to receive data

Signal Pin# Pin Type Pwr Rail /Tolerance BT700 Carrier Board Description

GBE_MDI0+ 12 GBE_MDI0- 10 GBE_MDI1+ 11 GBE_MDI1- 9 GBE_MDI2+ 6 GBE_MDI2- 4 GBE_MDI3+ 5 GBE_MDI3- 3

GBE_CTREF 15 REF NC

Reference voltage for carrier board Ethernet channel 0 magnetics center tap. The reference voltage is determined by the requirements of the module's PHY and may be as low as 0V and as high as 3.3V. The reference voltage output should be current limited on the module. In a case in which the reference is shorted to ground, the current must be limited to 250mA

or less. GBE_LINK# 13 O CMOS 3.3V PP 3.3V/3.3V NC Ethernet controller 0 link indicator, active low. GBE_LINK100# 7 O CMOS 3.3V PP 3.3V/3.3V Ethernet controller 0 100Mbit/sec link indicator, active low. GBE_LINK1000# 8 O CMOS 3.3V PP 3.3V/3.3V Ethernet controller 0 1000Mbit/sec link indicator, active low. GBE_ACT# 14 O CMOS 3.3V PP 3.3V/3.3V Ethernet controller 0 activity indicator, active low.

Connect to PCIE device or slot

Connect to PCIE device or slot (This Port is BOM Option with On board LAN)

Device - Connect AC Coupling cap 0.1uF (This Port is BOM Option with On board LAN) Slot - Connect to PCIE Conn pin

Device - Connect AC Coupling cap 0.1uF Slot - Connect to PCIE Conn pin

Device - Connect AC Coupling cap 0.1uF Slot

- Connect to PCIE Conn pin

Connect to Magnetics Module MDI2+/-

Connect to Magnetics Module MDI3+/-

Device - Connect AC Coupling cap 0.1uF Slot - Connect to PCIE Conn pin

Connect to PCIE device, PCIe CLK Buffer or slot

PCIE

GB_LAN

I/O GB_LAN Media Dependent Interface (MDI) differential pair 2. The MDI can operate in 1000, 100, and 10Mbit/sec modes.This signal pair is used for all modes.

O PCIE PCIE PCI Express Reference Clock for Lanes 0 to 3.

UART Interface Signals

Gigabit Ethernet Signals

I/O GB_LAN Media Dependent Interface (MDI) differential pair 0. The MDI can operate in 1000, 100, and 10Mbit/sec modes.This signal pair is used for all modes.

I/O GB_LAN Media Dependent Interface (MDI) differential pair 1. The MDI can operate in 1000, 100, and 10Mbit/sec modes.This signal pair is used for all modes.

Connect to Magnetics Module MDI0+/-

Connect to Magnetics Module MDI1+/-

Pin Types I Input Pin O Output Pin I/O Bi-directional input / output Pin OD Open drain OC Open Collector PP Push Pull NC Not Connected

PCI Express Interface Signals Descriptions

I PCIE

O PCIE

PCI Express channel 0, Receive Input differential pair.

PCI Express channel 0, Transmit Output differential pair.

PCI Express channel 1, Receive Input differential pair.

PCI Express channel 1, Transmit Output differential pair.

PCI Express channel 2, Receive Input differential pair.

PCI Express channel 2, Transmit Output differential pair.

PCI Express channel 3, Receive Input differential pair.(This Port is BOM Option with On board LAN)

PCI Express channel 3, Transmit Output differential pair.(This Port is BOM Option with On board LAN)

I PCIE

O PCIE

PCIE

I/O GB_LAN Media Dependent Interface (MDI) differential pair 3. The MDI can operate in 1000, 100, and 10Mbit/sec modes.This signal pair is used for all modes.

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Signal Pin# Pin Type Pwr Rail /Tolerance BT700 Carrier Board Description

SATA0_RX+ 35 AC Coupling capacitor SATA0_RX- 37 AC Coupling capacitor SATA0_TX+ 29 AC Coupling capacitor SATA0_TX- 31 AC Coupling capacitor SATA1_RX+ 36 AC Coupling capacitor SATA1_RX- 38 AC Coupling capacitor SATA1_TX+ 30 AC Coupling capacitor SATA1_TX- 32 AC Coupling capacitor SATA_ACT# 33 O OC 3.3V 3.3V/3.3V Serial ATA Led. Open collector output pin driven during SATA command activity.

Signal Pin# Pin Type Pwr Rail /Tolerance BT700 Carrier Board Description

USB_P0+ 96 USB_P0- 94 USB_P1+ 95 USB_P1- 93 USB_P2+ 90 USB_P2- 88 USB_P3+ 89 USB_P3- 87 USB_P4+ USB_SSRX1+

USB_P4USB_SSRX1-

USB_P5+ USB_SSTX1+

USB_P5USB_SSTX1-

USB_P6+ USB_SSRX0+

USB_P6USB_SSRX0-

USB_P7+ USB_SSTX0+

77 AC Coupling capacitor

USB_P7USB_SSTX0-

75 AC Coupling capacitor

USB_0_1_OC# 86 I CMOS 3.3V Suspend/3.3V PU 10K to 3.3V Suspend Connect to Overcurrent of USB Power Switch Over current detect input 1. This pin is used to monitor the USB power over current of the USB Ports 0 and 1. USB_2_3_OC# 85 I CMOS 3.3V Suspend/3.3V PU 10K to 3.3V Suspend Connect to Overcurrent of USB Power Switch Over current detect input 2. This pin is used to monitor the USB power over current of the USB Ports 2 and 3. USB_4_5_OC# 80 I CMOS 3.3V Suspend/3.3V PU 10K to 3.3V Suspend Connect to Overcurrent of USB Power Switch Over current detect input 3. This pin is used to monitor the USB power over current of the USB Ports 4 and 5. USB_6_7_OC# 79 I CMOS 3.3V Suspend/3.3V PU 10K to 3.3V Suspend Connect to Overcurrent of USB Power Switch Over current detect input 4. This pin is used to monitor the USB power over current of the USB Ports 6 and 7.

USB_ID 92 I CMOS 3.3V Suspend/3.3V NC

USB ID pin.Configures the mode of the USB Port 1. If the signal is detected as being 'high active' the BIOS will automatically configure USB Port 1 as USB Client and

enable USB Client support. This signal should be driven as OC signal by external circuitry.

USB_CC 91 I CMOS 3.3V Suspend/3.3V NC

USB Client Connect pin.If USB Port 1 is configured for client mode then an externally connected USB host should set this signal to high-active in order to properly make

the connection with the module's internal USB client controller.

If the external USB host is disconnected, this signal should be set to low-active in order to inform the USB client controller that the external host has been

disconnected.

A level shifter/protection circuitry should be implemented on the carrier board for this signal.

Signal Pin# Pin Type Pwr Rail /Tolerance BT700 Carrier Board Description

SDIO_CD# 43 I/O CMOS 3.3V/3.3V Connect to SD Card SDIO Card Detect. This signal indicates when a SDIO/MMC card is present. SDIO_CLK 42 O CMOS 3.3V/3.3V Connect to SD Card SDIO Clock. With each cycle of this signal a one-bit transfer on the command and each data line occurs. This signal has maximum frequency of 48 MHz.

SDIO_CMD 45 I/O OD/PP CMOS 3.3V/3.3V Connect to SD Card

SDIO Command/Response. This signal is used for card initialization and for command transfers. During initialization mode this signal is open drain. During command

transfer this signal is in push-pull mode. SDIO_LED 44 O CMOS 3.3V/3.3V NC SDIO LED. Used to drive an external LED to indicate when transfers occur on the bus. SDIO_WP 46 I/O CMOS 3.3V/3.3V Connect to SD Card SDIO Write Protect. This signal denotes the state of the write-protect tab on SD cards. SDIO_PWR# 47 O CMOS 3.3V/3.3V SDIO Power Enable. This signal is used to enable the power being supplied to a SD/MMC card device. SDIO_DAT0-7 48-55 I/O PP CMOS 3.3V/3.3V SDIO_DAT4-7 NC Connect to SD Card SDIO Data lines. These signals operate in push-pull mode

Signal Pin# Pin Type Pwr Rail /Tolerance BT700 Carrier Board Description

HDA_RST# I2S_RST#

61 O CMOS 3.3V/3.3V Connect to CODEC

HD Audio/AC'97 Codec Reset.

Multiplexed with I2S Codec Reset. HDA_SYNC I2S_WS

59 O CMOS 3.3V/3.3V Connect to CODEC

Serial Bus Synchronization.

Multiplexed with I2S Word Select from Codec. HDA_BCLK I2S_CLK

63 O CMOS 3.3V/3.3V Connect to CODEC

HD Audio/AC'97 24 MHz Serial Bit Clock from Codec.

Multiplexed with I2S Serial Data Clock from Codec. HDA_SDO I2S_SDO

67 O CMOS 3.3V/3.3V Connect to CODEC

HD Audio/AC'97 Serial Data Output to Codec.

Multiplexed with I2S Serial Data Output from Codec. HDA_SDIN I2S_SDI

65 I CMOS 3.3V/3.3V Connect to CODEC

HD Audio/AC'97 Serial Data input to Codec.

Multiplexed with I2S Serial Data Input from Codec.

Connect 90 ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB connector Connect 90 ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB connector

USB

USB Interface Signals

Universal Serial Bus Port 0 differential pair.I/O USB

Universal Serial Bus Port 2 differential pair.

Serial ATA Interface Signals

I SATA

O SATA

I SATA

SATA

Connect to SATA0 Conn TX pin

Universal Serial Bus Port 5 differential pair.

Multiplexed with transmit signal differential pairs for the Superspeed USB data path.

Universal Serial Bus Port 6 differential pair.

Multiplexed with receive signal differential pairs for the Superspeed USB data path.

USB

O SATA

Serial ATA channel 0, Receive Input differential pair.

Serial ATA channel 1, Receive Input differential pair.

Serial ATA channel 0, Transmit Output differential pair.

Serial ATA channel 1, Transmit Output differential pair.

Connect to SATA0 Conn RX pin

Connect to SATA1 Conn TX pin

Connect to SATA1 Conn RX pin

Connect 90 ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB connector Connect 90 ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB connector

Connect 90 ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB connector

Connect Common Choke in series and ESD suppressors to GND to USB connector(This Port is BOM Option with USB_P6 / USB_P7)

Universal Serial Bus Port 3 differential pair.

Universal Serial Bus Port 7 differential pair.

Multiplexed with transmit signal differential pairs for the Superspeed USB data path.

I/O USB

I/O USB I USB

SDIO Interface Signals

High Definition Audio Signals/AC'97

I/O USB O USB

I/O USB I USB

I/O USB O USB

Universal Serial Bus Port 1 differential pair.This port may be optionally used as USB client port.

Universal Serial Bus Port 4 differential pair.

Multiplexed with receive signal differential pairs for the Superspeed USB data path.

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Signal Pin# Pin Type Pwr Rail /Tolerance BT700 Carrier Board Description

LVDS_PPEN 111 O CMOS 3.3V/3.3V

Connect to enable control of LVDS panel power circuit

Controls panel power enable. LVDS_BLEN 112 O CMOS 3.3V/3.3V

Connect to enable control of LVDS panel backlight power circuit.

Controls panel Backlight enable. LVDS_BLT_CTRL/GP_PWM_OUT0 123 O CMOS 3.3V/3.3V

Connect to brightness control of LVDS panel backlight power circuit.

Primary functionality is to control the panel backlight brightness via pulse width modulation (PWM).

When not in use for this primary purpose it can be used as General Purpose PWM Output. LVDS_A0+ eDP0_TX0+

LVDS_A0eDP0_TX0-

101

LVDS_A1+ eDP0_TX1+

103

LVDS_A1eDP0_TX1-

105

LVDS_A2+ eDP0_TX2+

107

LVDS_A2eDP0_TX2-

109

LVDS_A3+ eDP0_TX3+

113

LVDS_A3eDP0_TX3-

115

LVDS_A_CLK+ eDP0_AUX+

119

LVDS_A_CLKeDP0_AUX-

121

LVDS_B0+ eDP1_TX0+

100

LVDS_B0eDP1_TX0-

102

LVDS_B1+ eDP1_TX1+

104

LVDS_B1eDP1_TX1-

106

LVDS_B2+ eDP1_TX2+

108

LVDS_B2eDP1_TX2-

110

LVDS_B3+ eDP1_TX3+

114

LVDS_B3eDP1_TX3-

112

LVDS_B_CLK+ eDP1_AUX+

120

LVDS_B_CLKeDP1_AUX-

122

LVDS_DID_CLK/GP_I2C_CLK 127 I/O OD CMOS 3.3V/3.3V PU 2.2K to 3.3V

Connect to DDC clock of LVDS panel

Primary functionality is DisplayID DDC clock line used for LVDS flat panel detection. If primary functionality is not used it can be as General Purpose I²C bus clock line. LVDS_DID_DAT/GP_I2C_DAT 125 I/O OD CMOS 3.3V/3.3V PU 2.2K to 3.3V

Connect to DDC clock of LVDS panel

Primary functionality DisplayID DDC data line used for LVDS flat panel detection. If primary functionality is not used it can be as General Purpose I²C bus data line. LVDS_BLC_CLK/eDP1_HPD# 128 I/O OD CMOS 3.3V/3.3V NC Control clock signal for external SSC clock chip. If the primary functionality is not used, it can be used as an embedded DisplayPort secondary Hotplug detection. LVDS_BLC_DAT/eDP0_HPD# 126 I/O OD CMOS 3.3V/3.3V NC Control data signal for external SSC clock chip. If the primary functionality is not used, it can be used as an embedded DisplayPort primary Hotplug detection.

Signal Pin# Pin Type Pwr Rail /Tolerance BT700 Carrier Board Description

DP_LANE3- 133 Connect AC Coupling Capacitors 0.1uF to Device DP_LANE3+ 131 Connect AC Coupling Capacitors 0.1uF to Device DP_LANE2- 145 Connect AC Coupling Capacitors 0.1uF to Device DP_LANE2+ 143 Connect AC Coupling Capacitors 0.1uF to Device DP_LANE1- 139 Connect AC Coupling Capacitors 0.1uF to Device DP_LANE1+ 137 Connect AC Coupling Capacitors 0.1uF to Device DP_LANE0- 151 Connect AC Coupling Capacitors 0.1uF to Device DP_LANE0+ 149

Connect AC Coupling Capacitors 0.1uF to Device DP_AUX- 140 Connect AC Coupling Capacitors 0.1uF to Device, PU 100K to 3.3V DP_AUX+ 138 Connect AC Coupling Capacitors 0.1uF to Device, PD 100K to GND DP_HDMI_HPD# 153 I CMOS 3.3V/3.3V PU 10K to 3.3V Hot plug detection signal that serves as an interrupt request.

Signal Pin# Pin Type Pwr Rail /Tolerance BT700 Carrier Board Description

TMDS_CLK- 133 Connect AC Coupling Capacitors 0.1uF to Device TMDS_CLK+ 131 Connect AC Coupling Capacitors 0.1uF to Device TMDS_LANE0- 145 Connect AC Coupling Capacitors 0.1uF to Device TMDS_LANE0+ 143 Connect AC Coupling Capacitors 0.1uF to Device TMDS_LANE1- 139 Connect AC Coupling Capacitors 0.1uF to Device TMDS_LANE1+ 137 Connect AC Coupling Capacitors 0.1uF to Device TMDS_LANE2- 151 Connect AC Coupling Capacitors 0.1uF to Device TMDS_LANE2+ 149 Connect AC Coupling Capacitors 0.1uF to Device

HDMI_CTRL_CLK 152 I/O OD CMOS 3.3V/3.3V PU 2.2K to 3.3V

DDC based control signal (clock) for HDMI device. Note: Level shifters must be implemented on the carrier board for this signal in order to be compliant with the HDMI Specification.

HDMI_CTRL_DAT 150 I/O OD CMOS 3.3V/3.3V PU 2.2K to 3.3V

DDC based control signal (data) for HDMI device. Note: Level shifters must be implemented on the carrier board for this signal in order to be compliant with the HDMI Specification

DP_HDMI_HPD# 153 I CMOS 3.3V/3.3V PU 10K to 3.3V Hot plug detection signal that serves as an interrupt request.

AC coupled off Module

Connect to LVDS connector

AC coupled off Module

HDMI Interface Signals

O TMDS

TMDS differential pair clock lines.

TMDS differential pair lines lane 0.

TMDS differential pair lines lane 1.

LVDS secondary channel differential pair 3. Display Port secondary channel differential pair 3.

O LVDS

LVDS secondary channel differential pair clock lines. Display Port secondary auxiliary channel.

LVDS primary channel differential pair 3. Display Port primary channel differential pair 3.

O LVDS

LVDS primary channel differential pair clock lines. Display Port primary auxiliary channel.

O LVDS

LVDS secondary channel differential pair 0. Display Port secondary channel differential pair 0.

O LVDS

LVDS secondary channel differential pair 1. Display Port secondary channel differential pair 1.

O LVDS

LVDS secondary channel differential pair 2. Display Port secondary channel differential pair 2.

O LVDS

LVDS

O PCIE DisplayPort differential pair lines lane 1.

O PCIE DisplayPort differential pair lines lane 0.

O PCIE DisplayPort differential pair lines lane 3.

O PCIE DisplayPort differential pair lines lane 2.

DisplayPort Interface Signals

O LVDS

LVDS Flat Panel Signals

LVDS primary channel differential pair 0. Display Port primary channel differential pair 0.

O LVDS

TMDS differential pair lines lane 2.

TMDS

I/O PCIE Auxiliary channel used for link management and device control. Differential pair lines.

O LVDS

LVDS primary channel differential pair 1. Display Port primary channel differential pair 1.

LVDS primary channel differential pair 2. Display Port primary channel differential pair 2.

LVDS

Connect to LVDS connector

LVDS

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Signal Pin# Pin Type Pwr Rail /Tolerance BT700 Carrier Board Description

LPC_AD[0..3] GPIO[0..3]

185-188 I/O CMOS 3.3V/3.3V Connect to LPC device

Multiplexed Command, Address and Data.

General purpose input/output [0..3] LPC_FRAME# GPIO5

190 I/O CMOS 3.3V/3.3V Connect to LPC device

LPC frame indicates the start of a new cycle or the termination of a broken cycle.

General purpose input/output 5. LPC_LDRQ# GPIO7

192 I/O CMOS 3.3V/3.3V NC

LPC DMA request.

General purpose input/output 7. LPC_CLK GPIO4

189 I/O CMOS 3.3V/3.3V Connect to LPC device

LPC clock.

General purpose input/output 4. SERIRQ GPIO6

191 I/O CMOS 3.3V/3.3V Connect to LPC device

Serialized Interrupt.

General purpose input/output 6.

Signal Pin# Pin Type Pwr Rail /Tolerance BT700 Carrier Board Description

SPI_MOSI 199 O CMOS 3.3V/3.3V Connect a series resistor to Carrier Board SPI Device SI pin Master serial output/Slave serial input signal. SPI serial output data from Qseven module to the SPI device. SPI_MISO 201 I CMOS 3.3V/3.3V Connect a series resistor to Carrier Board SPI Device SO pin Master serial input/Slave serial output signal. SPI serial input data from the SPI device to Qseven module. SPI_SCK 203 O CMOS 3.3V/3.3V Connect a series resistor to Carrier Board SPI Device SCK pin SPI clock output. SPI_CS0# 200 O CMOS 3.3V/3.3V Connect a series resistor to Carrier Board SPI Device CS# pin SPI chip select 0 output. SPI_CS1# 202 O CMOS 3.3V/3.3V NC SPI Chip Select 1 signal is used as the second chip select when two devices are used. Do not use when only one SPI device is used.

Signal Pin# Pin Type Pwr Rail /Tolerance BT700 Carrier Board Description

CAN0_TX 129 O CMOS 3.3V/3.3V NC

CAN (Controller Area Network) TX output for CAN Bus channel 0.

In order to connect a CAN controller device to the Qseven module's CAN bus it is necessary to add transceiver hardware to the carrier board. CAN0_RX 130 I CMOS 3.3V/3.3V NC

RX input for CAN Bus channel 0. In order to connect a CAN controller device to the Qseven module's CAN bus it is necessary to add transceiver hardware to the carrier

board.

Signal Pin# Pin Type Pwr Rail /Tolerance BT700 Carrier Board Description

PWGIN 26 I CMOS 5V/5V PU 10K to 5V High active input for the Qseven® module indicates that all power rails located on the carrier board are ready for use. PWRBTN# 20 I CMOS 3.3V Standby PU 10K to 3.3V Suspend Power Button: Low active power button input. This signal is triggered on the falling edge.

Signal Pin# Pin Type Pwr Rail /Tolerance BT700 Carrier Board Description

RSTBTN# 28 I CMOS 3.3V/3.3V PU 10K to 3.3V Reset button input. This input may be driven active low by an external circuitry to reset the Qseven module. BATLOW# 27 I CMOS 3.3V Suspend/3.3V PU 10K to 3.3V Suspend

Battery low input. This signal may be driven active low by external circuitry to signal that the system battery is low or may be used to signal some other external

battery management event. WAKE# 17 I CMOS 3.3V Suspend/3.3V PU 10K to 3.3V Suspend External system wake event. This may be driven active low by external circuitry to signal an external wake-up event. SUS_STAT# 19 O CMOS 3.3V Suspend/3.3V PU 10K to 3.3V Suspend Suspend Status: indicates that the system will be entering a low power state soon.

SUS_S3# 18 O CMOS 3.3V Suspend/3.3V

S3 State: This signal shuts off power to all runtime system components that are not maintained during S3 (Suspend to Ram), S4 or S5 states.

The signal SUS_S3# is necessary in order to support the optional S3 cold power state. SUS_S5# 16 O CMOS 3.3V Suspend/3.3V S5 State: This signal indicates S4 or S5 (Soft Off) state.

SLP_BTN# 21 I CMOS 3.3V Suspend/3.3V PU 10K to 3.3V Suspend

Sleep button. Low active signal used by the ACPI operating system to transition the system into sleep state or to wake it up again. This signal is triggered on falling

edge.

LID_BTN# 22 I CMOS 3.3V Suspend/3.3V PU 10K to 3.3V Suspend

LID button. Low active signal used by the ACPI operating system to detect a LID switch and to bring system into sleep state or to wake it up again.

Open/Close state may be software configurable.

Signal Pin# Pin Type Pwr Rail /Tolerance BT700 Carrier Board Description

WDTRIG# 70 I CMOS 3.3V/3.3V PU 10K to 3.3V Watchdog trigger signal. This signal restarts the watchdog timer of the Qseven module on the falling edge of a low active pulse. WDOUT 72 O CMOS 3.3V/3.3V PU 10K to 3.3V Watchdog event indicator. High active output used for signaling a missing watchdog trigger. Will be deasserted by software, system reset or a system power down. GP0_I2C_CLK 66 I/O OD CMOS 3.3V/3.3V PU 2.2K to 3.3V General Purpose I²C bus #0 clock line. GP0_I2C_DAT 68 I/O OD CMOS 3.3V/3.3V PU 2.2K to 3.3V General Purpose I²C bus #0 data line. SMB_CLK GP1_I2C_CLK

60 I/O OD CMOS 3.3V Suspend/3.3V PU 2.2K to 3.3V Suspend

Clock line of System Management Bus.

Multiplexed with General Purpose I²C bus #1 clock line. SMB_DAT GP1_I2C_DAT

62 I/O OD CMOS 3.3V Suspend/3.3V PU 2.2K to 3.3V Suspend

Data line of System Management Bus.

Multiplexed with General Purpose I²C bus #1 data line. SMB_ALERT# 64 I/O OD CMOS 3.3V Suspend/3.3V PU 10K to 3.3V Suspend System Management Bus Alert input. This signal may be driven low by SMB devices to signal an event on the SM Bus.

SPKR/GP_PWM_OUT2 194 O CMOS 3.3V/3.3V

Primary functionality is output for audio enunciator, the“speaker” in PC AT systems. When not in use for this primary purpose it can be used as General Purpose PWM

Output.

BIOS_DISABLE#/BOOT_ALT# 41 I CMOS 3.3V/3.3V PU 10K to 3.3V

Module BIOS disable input signal. Pull low to disable module's on-board BIOS.

Allows off-module BIOS implementations. This signal can also be used to disable standard boot firmware flash device and enable an alternative boot firmware source, for

example a boot loader. RSVD 56,154,132,134,144,146 NC NC Do not connect GP_1-Wire_Bus 124 I/O CMOS 3.3V/3.3V General Purpose 1-Wire bus interface. Can be used for consumer electronics control bus (CEC) of HDMI

Power Management Signals

Miscellaneous Signals

LPC Interface Signals

SPI Interface Signals

CAN Bus Interface Signals

Power Control Signals

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DFI BT700 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual