DENSITRON DD-2864BY-4A Product Specification

OLED DISPLAY MODULE

Product Specification

CUSTOMER

PRODUCT

NUMBER

CUSTOMER

APPROVAL

Standard

DD-2864BY-4A

INTERNAL APPROVALS

Product Mgr Doc. Control Electr. Eng

Bazile

Peter

Date: 02/02/10 Date: 02/02/10 Date: 02/02/10

Bazile

Peter

Luo Luo

Date

TABLE OF CONTENTS

1 MAIN FEATURES .......................................................................................................... 4

2 MECHANICAL SPECIFICATION............................................................................... 5

2.1 MECHANICAL CHARACTERISTICS .................................................................... 5

2.2 MECHANICAL DRAWING ..................................................................................... 6

3 ELECTRICAL SPECIFICATION................................................................................. 7

3.1 ABSOLUTE MAXIMUM RATINGS ....................................................................... 7

3.2 ELECTRICAL CHARACTERISTICS ...................................................................... 8

3.3 INTERFACE PIN ASSIGNMENT ............................................................................ 9

3.4 BLOCK DIAGRAM ................................................................................................ 12

3.5 AC CHARACTERISTICS ....................................................................................... 13

4 OPTICAL SPECIFICATION....................................................................................... 18

4.1 OPTICAL CHARACTERISTICS............................................................................ 18

5 FUNCTIONAL SPECIFICATION .............................................................................. 18

5.1 COMMANDS .......................................................................................................... 18

5.2 POWER UP/DOWN SEQUENCE........................................................................... 18

5.3 RESET CIRCUIT..................................................................................................... 18

5.4 ACTUAL APPLICATION EXAMPLE ................................................................... 18

6 PACKAGING AND LABELLING SPECIFICATION.............................................. 18

6.1 LABELLING & MARKING.................................................................................... 18

7 QUALITY ASSURANCE SPECIFICATION ............................................................. 18

7.1 CONFORMITY ....................................................................................................... 18

7.2 DELIVERY ASSURANCE ..................................................................................... 18

7.3 DEALING WITH CUSTOMER COMPLAINTS .................................................... 18

8 RELIABILITY SPECIFICATION .............................................................................. 18

8.1 RELIABILITY TESTS ............................................................................................ 18

8.2 LIFE TIME............................................................................................................... 18

8.3 F

AILURE CHECK STANDARD ..................................................................................... 18

9 PRECAUTIONS............................................................................................................. 18

9.1 H

ANDLING................................................................................................................. 18

9.2 STORAGE ............................................................................................................... 18

9.3 DESIGNING ............................................................................................................ 18

9.4 DISPOSING................................................................................................................. 18

9.5 OTHER....................................................................................................................... 18

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REVISION RECORD

Rev. Date Page Chapt. Comment ECR no.

A 02 Feb 10 First Issue

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1 MAIN FEATURES

ITEM CONTENTS

Display Format 128 x 64 Dots

Overall Dimensions(W*H*T)

Active Area(W*H)

30.00×20.16× 1.80 mm

23.02 × 11.86 mm

Viewing Area(W*H) 25.02 x 13.86 mm

Display Mode Passive Matrix

Display Colour Light Blue, Yellow Colour

Driving Method 1 / 64 duty

Driver IC SSD1305

Operating temperature

Storage temperature

-30Ԩ ~ +70Ԩ

-40Ԩ ~ +85Ԩ

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2 MECHANICAL SPECIFICATION

2.1 MECHANICAL CHARACTERISTICS

ITEM CHARACTERISTIC UNIT

Display Format 128 x 64 Dots

Overall Dimensions

30.00×20.16× 1.80

mm

Viewing Area 25.02 x 13.86 mm

Active Area

Dot Size

Dot Pitch

23.02 × 11.86

0.16 × 0.16

0.18 × 0.18

mm

Weight 2.03 g

IC Controller/Driver SSD1305

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2.2 MECHANICAL DRAWING

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3 ELECTRICAL SPECIFICATION

3.1 ABSOLUTE MAXIMUM RATINGS

VSS = 0 V, Ta = 25 °C

Item Symbol Min Max Unit Note

Supply Voltage for Logic VDD -0.3 4 V Note 1, 2

Supply Voltage for Display VCC 0 11 V Note 1, 2

Operating Temperature Top -30 70 °C

Storage Temperature Tstg -40 85 °C

Life Time (120 cd/m2) 10,000 Hour Note 3

Note 1: All the above voltages are on the basis of “VSS=0V”. Note 2: When this module is used beyond above absolute maximum ratings, permanent

breakage of the module may occur. Also for normal operations it’s desirable to use this module under the conditions according to Section 3.2 “Electrical Characteristics” and section 4 “optical characteristic. If this module is used beyond these conditions the malfunction of the module can occur and the reliability of the module may

deteriorate. Note 3: VCC=9V, Ta=25°C, 50% Checkerboard. End of lifetime is specified as 50% of initial brightness reached. The average

operating lifetime at room temperature is estimated by the accelerated operation at

high temperature conditions

3.2 ELECTRICAL CHARACTERISTICS

3.2.1 DC Characteristics

Characteristics Symbol Conditions Min Typ Max Unit

Supply Voltage for Logic V

Supply Voltage for Display

V

DD

CC

2.4 2.8 3.5 V

Note 4 8.0 9.0 10.0 V

Iout=100μA,3.3

High Level Input V

Low Level Input V

High Level Output V

Low Level Output V

Operating Current for VDD

Operating Current for VCC

Sleep Mode Current for VCI Sleep Mode Current for VCC

I

DD, SLEEP

I

CC, SLEEP

IH

IL

OH

OL

DD

CC

MHz

Iout=100μA,3.3

MHz

Iout=100μA,3.3

MHz

Iout=100μA,3.3

MHz

Note 5

Note 6

-

0.8xVDD - VDD

0 - 0.2xVDD

0.9xVDD - VDD

0 - 0.1xVDD

-

180 300

10.8 13.5

18.0 22.5

1 5

2 10

Note 4 Brightness (Lbr) and Supply Voltage for Display (Vcc) are subject to the change of the panel characteristics and the customer’s request. Note 5 V Note 6 V

DD= 2.8V, VCC = 9.0 V, 50% Display area turned on. DD = 2.8V, VCC = 9.0 V, 100% Display area turned on

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V

µA

mA

µA

3.3 INTERFACE PIN ASSIGNMENT

No. Symbol I/O Function

Reserved Pin (Supporting Pin)

1 N.C. (GND) -

2 VCC P

3 VCOMH O

4 IREF I

5~12 D7~D0 I/O

13 E/RD# I

14 R/W# I

15 D/C# I

Product No.

DD-2864BY-4A

The supporting pin can reduce the influence from stress on the function pins. This pin must be connected to external ground.

Power Supply for OEL Panel

This is the most positive voltage supply pin of the chip. It can be supplied externally or generated internally by using internal DC/DC voltage converter

Voltage Output High Level for COM Signal

This pin is the input pin for the voltage output high level for COM signals. A capacitor should be connected between this pin and VSS.

Current Reference for Brightness Adjustment

This pin is segment current reference pin. A resistor should be connected between this pin and VSS. Set the current at 10.0μA.

Host Data Input/output Bus

These pins are 8-bit bi-directional data bus to be connected to the microprocessor’s data bus. When serial mode is selected, D1 will be the serial data input SDIN and D0 will be the serial clock input SCLK. When I2C mode is selected, D2 & D1 should be tired together and serve as SDAout & SDAin in application and D0 is the serial clock input SCL.

Read/Write Enable or Read

This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used as the Enable (E) signal. Read/write operation is initiated when this pin is pulled high and the CS# is pulled low.

When connecting to an 80XX-microprocessor, this pin receives the Read (RD#) signal. Data read operation is initiated when this pin is pulled low and CS# is pulled low.

Read/Write Select or Write

This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used as Read/Write (R/W#) selection input. Pull this pin to “High” for read mode and pull it to “Low” for write mode.

When 80XX interface mode is selected, this pin will be the Write (WR#) input. Data write operation is initiated when this pin is pulled low and the CS# is pulled low.

Data/Command Control

This pin is Data/Command control pin. When the pin is pulled high, the input at D7~D0 is treated as display data. When the pin is pulled low, the input at D7~D0 will be transferred to the command register. For detail relationship to MCU interface signals, please refer to the Timing Characteristics Diagrams. When the pin is pulled high and serial interface mode is selected, the data at SDIN is treated as data. When it is pulled low, the data at SDIN will be transferred to the command register. In I2C mode, this pin acts as SA0 for slave address selection.

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No. Symbol I/O Function

Power Reset for Controller and Driver

16 RES# I

17 CS# I

18 N.C. -

19 BS2

I

20 BS1

This pin is reset signal input. When the pin is low, initialization of the chip is executed.

Chip Select

This pin is the chip select input. The chip is enabled for MCU communication only when CS# is pulled low.

Reserved Pin

The N.C. pin between function pins is reserved for compatible and flexible design.

Communicating Protocol Select

These pins are MCU interface selection input. See the following table:

BS1 BS2 I2C 1 0 4-wire SPI 0 0 68XX-parallel 0 1 80XX-parallel 1 1

Power Supply for Logic Circuit

21 VDD P

22~24 N.C. -

25 VBREF P

26 N.C. -

27 FB I

28 VDDB P

29 GDR O

30 VSS P

This is a voltage supply pin. It must be connected to external source

Reserved Pin

The N.C. pins between function pins are reserved for compatible and flexible design.

Voltage Reference for DC/DC Converter Circuit

This is the internal voltage reference of booster circuit. A stabilization capacitor, typ. 1μF, should be connected to VSS.

Reserved Pin

The N.C. pin between function pins is reserved for compatible and flexible design.

Feedback Input for DC/DC Converter Circuit

This is the feedback resistor input of the booster circuit. It is used to adjust the booster output voltage level (VCC).

Power Supply for DC/DC Converter Circuit

This is the power supply pin for the internal buffer of the DC/DC voltage converter. It must be connected to VDD when the converter is used. It could be floated when the converter is not used.

Output for Connected External NMOS

This output pin drives the gate of the external NMOS of the booster circuit.

Ground of OEL System

This is a ground pin. It also acts as a reference for the logic pins, the OEL driving voltages, and the analogue circuits. It must be connected to external ground.

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31 N.C. (GND) -

Reserved Pin (Supporting Pin)

The supporting pin can reduce the influence from stress on the function pins. This pin must be connected to external ground.

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3.4 BLOCK DIAGRAM

MCU Interface Selection: BS1 and BS2 Pins connected to MCU interface: D7~D0, E/RD#, R/W#, D/C#, RES#, and CS# *VBREF, FB, and GDR should be left float.

C1, C3: 0.1 μF C2: 4.7 μF C4: 10 μF C5: 4.7 μF / 25V Tantalum Capacitor

R1: 910kΩ, R1 = (Voltage at IREF – VSS) / IREF

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3.5 AC CHARACTERISTICS

3.5.1 68XX-Series MPU Parallel Interface Timing Characteristics

Characteristics Symbol Min Max Unit

Clock Cycle Time t

300 - ns

cycle

Address Setup Time tAS 0 - ns

Address Hold Time tAH 0 - ns

Write Data Setup Time t

Write Data Hold Time t

Read Data Hold Time t

40 - ns

DSW

7 - ns

DHW

20 - ns

DHR

Output Disable Time tOH - 70 ns

Access Time t

Chip Select Low Pulse Width (Read) Chip Select Low Pulse Width (Write)

Chip Select High Pulse Width (Read) Chip Select High Pulse Width (Write)

- 140 ns

ACC

PW

CSL

CSH

120

60

60 60

- ns

Rise Time tR - 15 ns

Fall Time tF - 15 ns

(VDD ~ VSS = 2.4 to 3.5 V, Ta = 25°C)

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3.5.2 8080-Series MPU Parallel Interface Timing Characteristics

Characteristics Symbol Min Max Unit

Clock Cycle Time t

300 - ns

cycle

Address Setup Time tAS 10 - ns

Address Hold Time tAH

Write Data Setup Time t

Write Data Hold Time t

Read Data Hold Time t

DSW

DHW

DHR

40

20

0 -

-

7

- ns

-

ns

Output Disable Time tOH - 70 ns

Access Time t

Read Low Time t

Write Low Time t

Read High Time t

Write High Time t

Chip Select Setup Time t

Chip Select Hold Time to Read Signal t

- 140 ns

ACC

PWLR

PWLW

PWHR

PWHW

CS

CSH

120 - ns

60

0

20

-

ns

Rise Time tR -

Fall Time tF -

15

(VDD ~ VSS = 2.4 to 3.5 V, Ta = 25°C)

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ns

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3.5.3 Serial Interface Timing Characteristics

Characteristics Symbol Min Max Unit

Clock Cycle Time t

250 - ns

cycle

Address Setup Time tAS 150 - ns

Address Hold Time tAH 150

Chip Select Setup Time t

Chip Select Hold Time t

Write Data Setup Time t

Write Data Hold Time t

Clock Low Time t

Clock High Time t

120

CSS

60 - ns

CSH

50

DSW

15

DHW

100

CLKL

100

CLKH

Rise Time tR -

Fall Time tF -

-

15

ns

(VDD ~ VSS = 2.4 to 3.5 V, Ta = 25°C)

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3.5.4 I2C Timing Characteristics

Characteristics Symbol Min Max Unit

Clock Cycle Time t

Start Condition Hold Time tHSTART 0.6

2.5 - us

cycle

-

Data Hold Time (for “SDAOUT” Pin) 0

tHD

Data Hold Time (for “SDAIN” Pin)

300

Data Setup Time tSD 100

- us

-

Start Condition Setup Time (Only relevant for a repeated Start

SSTART 0.6

t

-

condition)

Stop Condition Setup Time tSSTOP 0.6

Rise Time for Data and Clock Pin tR -

Fall Time for Data and Clock Pin tF -

Idle Time before a New Transmission can Start

tIDLE 1.3

-

300

(VDD ~ VSS = 2.4 to 3.5 V, Ta = 25°C)

us

ns

us

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4 OPTICAL SPECIFICATION

4.1 OPTICAL CHARACTERISTICS

Characteristics Symbol Condition Min Typ Max Unit

Brightness Lbr Note 4 100 120 -

C.I.E.(Blue)

C.I.E.(Yellow)

Dark Room

Contrast

(X)

C.I.E. 1931

(Y) (X)

C.I.E. 1931

(Y)

CR - >2000:1 -

0.12

0.22

0.44

0.46

0.16

0.26

0.48

0.50

Viewing Angle >160 - -

Note 4: Optical measurement taken at VDD =2.8V, VCC =9V.

0.20

0.30

0.52

0.54

2

cd/m

degree

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5 FUNCTIONAL SPECIFICATION

5.1 COMMANDS

Please refer to the Technical Manual for the SSD1305

5.2 POWER UP/DOWN SEQUENCE

To protect panel and extend the panel lifetime, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off. It gives the panel enough time to complete the action of charge and discharge before/after the operation.

5.2.1 POWER UP SEQUENCE

V

1. Power up VDD

2. Send Display off command VCC

3. Initialization

4. Clear Screen

5. Power up VCC

6. Delay 100ms V (When V

is stable)

CC

DD

7. Send Display on command VSS/Ground

ON VCC ON Display On

DD

5.2.2 POWER DOWN SEQUENCE

Display off V

1. Send Display off command

2. Power down VCC VCC

3. Delay 100ms (When VCC is reach 0 and panel is completely discharges) V

DD

4. Power down VDD V

/Ground

SS

off VDD off

CC

5.3 RESET CIRCUIT

When RES# input is low, the chip is initialized with the following status:

1. Display is OFF

2. 132×64 Display Mode

3. Normal segment and display data column and row address mapping (SEG0 mapped to column address 00h and COM0 mapped to row address 00h)

4. Shift register data clear in serial interface

5. Display start line is set at display RAM address 0

6. Column address counter is set at 0

7. Normal scan direction of the COM outputs

8. Contrast control register is set at 80h

9. Normal display mode (Equivalent to A4h command)

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5.4 ACTUAL APPLICATION EXAMPLE

Command usage and explanation of an actual example

If the noise is accidentally occurred at the displaying window during the operation, please reset the display in order to recover the display function.

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6 PACKAGING AND LABELLING SPECIFICATION

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6.1 LABELLING & MARKING

DENSITRON DD-2864BY-4A TW YY MM

7 QUALITY ASSURANCE SPECIFICATION

7.1 CONFORMITY

The performance, function and reliability of the shipped products conform to the Product Specification.

7.2 DELIVERY ASSURANCE

7.2.1 DELIVERY INSPECTION STANDARDS

IPC-AA610, class 2 electronic assembly’s standard

7.2.2 Zone definition

7.2.3 Visual inspection

Test and measurement to be conducted under following conditions

Temperature: 23±5 Humidity: 55±15%RH Fluorescent lamp: 30 W Distance between the Panel & Eyes of the Inspector: 30cm Distance between the Panel & the lamp: 50cm

A Active

B Outside Active

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7.2.4 Standard of appearance inspection

Units: mm

Class Item Criteria

Minor Outside & inside package Presence of product no., lot no., quantity

Critical

Major Dimension Product dimensions must be according to specification and drawing

Major Electrical Product electrical characteristics must be according to specification

Critical OLED

Minor Black spot,

Minor Polariser

Packing &

Label

Display

white spot,

dust

scratch

bubble

Product must not be mixed with others and quantity must not be different from that indicated on the label

Missing lines, short circuits or wrong patterns on OLED display are not allowed

Round type: as per following drawing  = (X+Y)/2 Acceptable quantity Size Zone A Zone B

Line type: as per following drawing Acceptable quantity Length Width Zone A Zone B

- - W≤0.05 Any number L≤2.0 W≤0.1 3 L>2.0 0

Total acceptable quantity: 3

Scratch on protective film is permitted Minor Polariser Scratch on polariser: same as No. 1  = (X+Y)/2 Acceptable quantity Size Zone A Zone B

<0.1

0.1<<0.2

0.2<<0.25

0.25<

<0.5

>0.5

Any number

3 1 0

Any number

0

Any number

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Class Item Criteria

Minor Segment

deformation

Minor Panel

Chipping

1b. Pin hole on dot matrix display

Acceptable quantity

Size

a,b<0.1 Any number

2. Segments / dots with different width

3. Alignment layer defect  = (a+b)/2

X ≤ 1/6 Panel length Y ≤ 1 Z ≤ T

Acceptable quantity

(a+b)/2≤0.1 Any number

0.5<<1.0 Total acceptable quantity: 7

Acceptable a≥b a/b≤4/3 a<b a/b>4/3

Size

≤0.4

0.4<≤1.0

1.0<≤1.5

1.5<≤2.0

Total acceptable quantity: 7

3

Any number

5 3 2

Minor Panel

Cracking

Minor Cupper

exposed (pin or film)

Minor Film or

Trace Damage

Product No.

Cracks not allowed

Not allowed if visible by eye inspection

Not allowed if affect electrical function

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Class Item Criteria

Minor Contact

Lead Twist Not allowed

Minor Contact

Lead Broken

Minor Contact

Lead Bent

Minor Colour

uniformity

Major No unmelted solder paste should be present on PCB

Critical Cold solder joints, missing solder connections, or oxidation are not allowed Minor No residue or solder balls on PCB are allowed Critical Minor Tray

PCB

particles

Not allowed

Not allowed if bent lead causes short circuit

Not allowed if bent lead extends horizontally more than 50% of its width

Level of sample for approval set as limit sample

Short circuits on components are not allowed Size Quantity

On tray

On display

<0.2 >0.25 0.25

L = 3 1

Any number

4 2

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7.3 DEALING WITH CUSTOMER COMPLAINTS

7.3.1 Non-conforming analysis

Purchaser should supply Densitron with detailed data of non-conforming sample. After accepting it, Densitron should complete the analysis in two weeks from receiving the sample. If the analysis cannot be completed on time, Densitron must inform the purchaser.

7.3.2 Handling of non-conforming displays

If any non-conforming displays are found during customer acceptance inspection which Densitron is clearly responsible for, return them to Densitron. Both Densitron and customer should analyse the reason and discuss the handling of nonconforming displays when the reason is not clear. Equally, both sides should discuss and come to agreement for issues pertaining to modification of Densitron quality assurance standard.

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8 RELIABILITY SPECIFICATION

8.1 RELIABILITY TESTS

Test Item Test Condition Evaluation and assessment

High Temperature Operation 70°C, 240 hours

Low Temperature Operation -30°C, 240 hours

High Temperature Storage 80°C, 240 hours

Low Temperature Storage -40°C2, 240 hours

High Temperature & High Humidity Storage(Operation)

Thermal Shock

 No moisture condensation is observed during tests.  The samples used for the above tests do not include polarizer

60°C2, 90%RH, 120 hours

-40°C to 85°C, 24 cycles 1 Hour

The brightness should be greater than 50% of the initial brightness.

The operational functions work

8.1.1 FAILURE CHECK STANDARD

After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure teat at 23±5 °C;55±15% RH

8.2 LIFE TIME

Item Description

Function, performance, appearance, etc. shall be free from remarkable deterioration more than 10,000 hours under ordinary operating conditions of room temperature

1

(25±10 °C), normal humidity (50% RH), and in area not exposed to direct sunlight. Storage Life time is 20,000 hr under room temperature (25±10 °C), normal humidity (50% RH)

2 End of lifetime is specified as 50% of initial brightness.

8.3 Failure Check Standard

After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH.

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9 PRECAUTIONS

9.1 Handling

Safety

If the panel breaks, be careful not to get the organic substance in your mouth or in your eyes. If the organic substance touches your skin or clothes, wash it off immediately using soap and plenty of water.

Mounting and Design

Place a transparent plate (e.g. acrylic, polycarbonate or glass) on the display surface to protect the display from external pressure. Leave a small gap between the transparent plate and the display surface. Design the system so that no input signal is given unless the power supply voltage is applied.

Caution during OLED cleaning

Lightly wipe the display surface with a soft cloth soaked with Isopropyl alcohol, Ethyl alcohol or Trichlorotriflorothane. Do not wipe the display surface with dry or hard materials that will damage the polariser surface. Do not use aromatic solvents (toluene and xylene), or ketonic solvents (ketone and acetone).

Caution against static charge

As the display uses C-MOS LSI drivers, connect any unused input terminal to V input any signals before power is turned on. Also, ground your body, work/assembly table and assembly equipment to protect against static electricity.

Packaging

Displays use OLED elements, and must be treated as such. Avoid strong shock and drop from a height. To prevent displays from degradation, do not operate or store them exposed directly to sunshine or high temperature/humidity.

Caution during operation

It is indispensable to drive the display within the specified voltage limit since excessive voltage shortens its life.

Other Precautions

When a display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module.

Storage

Store the display in a dark place where the temperature is 25°C ± 10°C and the humidity below 50%RH. Store the display in a clean environment, free from dust, organic solvents and corrosive gases. Do not crash, shake or jolt the display (including accessories).

or VSS. Do not

DD

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9.2 STORAGE

When storing OEL display modules, put them in static electricity preventive bags avoiding exposure to direct sun light nor to lights of fluorescent lamps, etc. and, also, avoiding high temperature and high humidity environments or low temperature (less than 0°C) environments. (We recommend you to store these modules in the packaged state when they were shipped from Factory.) At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur with them.

If electric current is applied when water drops are adhering to the surface of the OEL display module, when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful about the above.

9.3 DESIGNING

The absolute maximum ratings are the ratings which cannot be exceeded for OEL display module, and if these values are exceeded, panel damage may be happen.

To prevent occurrence of malfunctioning by noise: pay attention to satisfy the VIL and VIH specifications and, at the same time, to make the signal line cable as short as possible.

We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit (VCI). (Recommend value: 0.5A)

Pay sufficient attention to avoid occurrence of mutual noise interference with the neighbouring devices.

As for EMI, take necessary measures on the equipment side basically.

When fastening the OEL display module, fasten the external plastic housingsection.

If power supply to the OEL display module is forcibly shut down by such errors as taking out the main battery while the OEL display panel is in operation, we cannot guarantee the quality of this OEL display module.

The electric potential to be connected to the rear face of the IC chip should be as follows: SSD1351 * Connection (contact) to any other potential than the above may lead to rupture of the IC.

9.4 Disposing

Request the qualified companies to handle industrial wastes when disposing of the OEL display modules. Or, when burning them, be sure to observe the environmental and hygienic laws and regulations.

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9.5 Other

When an OEL display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module.

To protect OEL display modules from performance drops by static electricity rapture, etc., do not touch the following sections whenever possible while handling the OEL display modules. * Pins and electrodes * Pattern layouts such as the COF

With this OEL display module, the OEL driver is being exposed. Generally speaking, semiconductor elements change their characteristics when light is radiated according to the principle of the solar battery. Consequently, if this OEL driver is exposed to light, malfunctioning may occur. * Design the product and installation method so that the OEL driver may be shielded from light in actual usage. * Design the product and installation method so that the OEL driver may be shielded from light during the inspection processes.

Although this OEL display module stores the operation state data by the commands and the indication data, when excessive external noise, etc. enters into the module, the internal status may be changed. It therefore is necessary to take appropriate measures to suppress noise generation or to protect from influences of noise on the system design.

We recommend you to construct its software to make periodical refreshment of the operation statuses (re-setting of the commands and re-transference of the display data) to cope with catastrophic noise.

Product No.

DD-2864BY-4A

REV. A

Page 30 / 30

DENSITRON DD-2864BY-4A Product Specification

Specifications and Main Features

Frequently Asked Questions

User Manual