DENSITRON DD-2832BE-2A Product Specification

OLED DISPLAY MODULE
Product Specification
CUSTOMER
PRODUCT
CUSTOMER
APPROVAL
STANDARD
DD-2832BE-2A
INTERNAL APPROVALS
Product Mgr Doc Control Electr. Eng
Bruno
Recaldini
Date: 21 Nov 06 Date: 21 Nov 06 Date: 21 Nov 06
Anthony
Perkins
Bazile Peter
Date
Appr ov al f or Spe ci f icat ion onl y
Appr ov al for Speci fi ca t i on a nd Sam pl e
DENSITRON TECHNOLOGIES plc. – PROPRIETARY DATA – ALL RIGHTS RESERVED
FORM NO: DT-029
TABLE OF CONTENTS
1 MAIN FEATURES ..........................................................................................................4
2 MECHANICAL SPECIFICATION...............................................................................5
2.1 MECHANICAL CHARACTERISTICS .................................................................... 5
2.2 MECHANICAL DRAWING ..................................................................................... 6
3 ELECTRICAL SPECIFICATION................................................................................. 7
3.1 ABSOLUTE MAXIMUM RATINGS ....................................................................... 7
3.2 ELECTRICAL CHARACTERISTICS ...................................................................... 7
3.3 INTERFACE PIN ASSIGNMENT ............................................................................ 8
3.4 BLOCK DIAGRAM .................................................................................................. 9
3.5 TIMING CHARACTERISTICS .............................................................................. 10
4 OPTICAL SPECIFICATION.......................................................................................11
4.1 OPTICAL CHARACTERISTICS............................................................................ 11
5 APPLICATION NOTES ............................................................................................... 12
5.1 COMMANDS .......................................................................................................... 12
5.2 POWER UP/DOWN SEQUENCE........................................................................... 12
5.3 RESET CIRCUIT..................................................................................................... 12
5.4 APPLICATION EXAMPLE .................................................................................... 13
5.5 DISPLAY DIRECTION SETTING ......................................................................... 14
5.6 APPLICATION CIRCUIT....................................................................................... 16
6 PACKAGING AND LABELLING SPECIFICATION..............................................17
6.1 PACKAGING .......................................................................................................... 17
6.2 LABELLING & MARKING.................................................................................... 17
7 QUALITY ASSURANCE SPECIFICATION.............................................................18
7.1 CONFORMITY ....................................................................................................... 18
7.2 DELIVERY
7.3 DEALING
ASSURANCE ..................................................................................... 18
WITH CUSTOMER COMPLAINTS .................................................... 23
8 RELIABILITY SPECIFICATION ..............................................................................24
8.1 RELIABILITY
8.2 LIFE
TIME............................................................................................................... 24
TESTS ............................................................................................ 24
9 HANDLING PRECAUTIONS......................................................................................25
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REVISION RECORD
Rev. Date Page Chapt. Comment ECR no.
A Production Release
15-16
B 23-Mar-06
17 18
C 16-May-06 10 3.5.1.1
Updated Display Direction Setting Updated Application circuit Updated Packaging and Labelling
Chapter removed, no 6800 series MPU interface provided
D 21-Nov-06 17 6 Packing details corrected
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1 MAIN FEATURES
ITEM CONTENTS
Display Format 128 x 32 Dots
Overall Dimensions(W*H*T) Glass 33.4 x 14.5 x 1.8 mm
Active Area(W*H) 27.50 x 6.06 mm
Viewing Area(W*H) 29.50 x 8.06 mm
Display Mode Passive Matrix (1.11”)
Display Colour Blue
Driving Method 1 / 32 duty
Driver IC SSD1303 (COF)
Operating temperature
Storage temperature
-20 ~ +70
-30 ~ +80
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2 MECHANICAL SPECIFICATION
2.1 MECHANICAL CHARACTERISTICS
ITEM CHARACTERISTIC UNIT
Display Format 128 x 32 Dots
Overall Dimensions Glass 33.4 x 14.5 x 1.8 mm
Viewing Area(W*H) 29.50 x 8.06 mm
Active Area(W*H) 27.50 x 6.06 mm
Dot Size 0.195 x 0.17 mm
Dot Pitch 0.215 x 0.19 mm
Weight 2.0 g
IC Controller/Driver SSD1303 ( COF )
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2.2 MECHANICAL DRAWING
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3 ELECTRICAL SPECIFICATION
3.1 ABSOLUTE MAXIMUM RATI NG S
Item Symbol Min Max Unit Note
Supply Voltage VDD -0.3 4 V
Note 1,2
Driver Supply Voltage Vcc 0 15 V
Operating Temperature Top -20 70 °C -
Storage Temperature Tst -30 80 °C -
Static Electricity Be sure that you are grounded when handling displays.
Note 1: All the above voltages are on the basis of “GND=0V”. Note 2: When this module is used beyond the above absolute maximum ratings, permanent
breakage of the module may occur. Also, for normal operations, it’s desirable to use this module under the conditions according to Section 3 “Electrical Characteristics”. If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate.
3.2 ELECTRICAL CHARACTERISTICS
3.2.1 DC CHARACTERISTICS
Characteristics Symbol Min Typ Max Unit
Supply Logic VDD 2.6 2.8 3.5 V
Driver Supply Voltage VCC 7.0 7.5 8.0 V
High Level Input VIH
Low Level Input VIL 0 -
High Level Output VOH
Low Level Output VOL 0 -
0.8xVDD
0.9xVDD
- V
V
DD
0.2xVDD
V
- VDD V
0.1xVDD
V
VDD Current IDD Note 1,2 300 450 µA
Note 1 3.0 4.9
VCC Current ICC
mA
Note 2 5.0 7.5
(1)
Note Note
: VDD = 2.8V, VCC = 7.5V, Frame Rate = 100Hz, Contrast Setting = 0xFF, 50% pixels ON
(2)
: VDD = 2.8V, VCC = 7.5V, Frame Rate = 100Hz, Contrast Setting = 0xFF, 100% pixels ON
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3.3 INTERFACE PIN ASSIGNMENT
No. Symbol I/O Function
Reserved Pin (Supporting Pin).
1 N.C. -
2 VCC I/O
3 VCOMH I/O
4 IREF I
5~12 D7~D0 I/O
13 E/RD# I
14 R/W# I
15 D/C# I
16 RES# I
17 CS# I
18 VDD I
19 VSS I
20 N.C. -
The supporting pin can reduce the influences from stresses on the function pins.
Power Supply for Panel.
This is the most positive voltage supply pin of the chip. It can be supplied externally or generated internally by using internal DC/DC voltage converter.
Voltage Output High Level for COM Signal.
This pin is the input pin for the voltage output high level for COM signal. A capacitor should be connected between this pin and VSS.
Current Reference for Brightness Adjustment.
This pin is segment current reference pin. A resistor should be connected between this pin and VSS. Set the current at 10uA.
Host Data Input/Output Bus. These pins are 8-bit bi-directional data bus to be connected to the microprocessor’s data bus.
Read/Write Enable or Read.
This pin receives the Read (RD#) signal. Data read operation is initiated when this pin is pulled low and CS# is pulled low.
Read/Write Select or Write.
This pin is the Write (WR#) input. Data write operation is initiated when this pin is pulled low and CS# ispulled low
Data/Command Control.
This pin is Data/Command control pin. When the pin is pulled high, the input at D7~D0 is treated as display data. When the pin is pulled low, the input at D7~D0 will be transferred to the command register. For detail relationship to MCU interface signal, please refer to the Timing Characteristics Diagrams.
Power Reset for Controller and Driver.
This pin is reset signal input. When the pin is low, initialization of the chip executed.
Chip Select.
This pin is the chip select input. The chip is enabled for MCU communication only when CS# is pulled low.
Power Supply for Logic circuit
This is a voltage supply pin It must be connected to an external source.
Ground
This is a ground pin. It also acts as a reference for the logic pins, the OLED driving voltages, and the analogue circuits. It must be connected to external ground.
Reserved Pin (Supporting Pin).
The supporting pin can reduce the influences from stresses on the function pins.
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3.4 BLOCK DIAGRAM
Active Area 1.11"
128
~
COM62
COM32
x 32 Pixels
SEG0
~~~
COM33~COM63
SEG127
SSD1303
~
VCOMH
VCC
IREF
D0
D7
R1
C3
C2
Pins connected to MCU interface: D7~D0, E/RD#, R/W#, D/C#, RES#, and CS#
C1, C3: 4.7μF C2: 10μF R1: 910kΩ, R1 = (Voltage at IREF - BGGND) / IREF
E/RD#
VDD
VSS
RES#
D/C#
R/W#
CS#
C1
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3.5 TIMING CHARACTERISTICS
3.5.1 AC CHARACTERISTICS
3.5.1.1 8080-Series MPU Parallel Interface Timing Characteristics:
Characteristics Symbol Min Max Unit
Clock Cycle Time t
300 - ns
cycle
Address Setup Time tAS 0 - ns
Address Hold Time tAH
Write Data Setup Time t
Write Data Hold Time t
Read Data Hold Time t
40
DSW
DHW
20
DHR
Output Disable Time tOH -
Access Time t
Chip Select Low Pulse Width (Read) Chip Select Low Pulse Width (Write)
Chip Select High Pulse Width (Read) Chip Select High Pulse Width (Write)
-
ACC
PW
PW
CSL
CSH
Rise Time tR -
Fall Time tF -
0 -
-
15
120
60
60 60
- ns
-
70
140
-
-
15
15
ns
ns
ns
ns
ns
ns
ns
ns
ns
* All the timing should be based on 30% and 70% of VDD-GND.
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4 OPTICAL SPECIFICATION
4.1 OPTICAL CHARACTERISTICS
Characteristics Symbol Condition Min Typ Max Unit
Brightness Lbr With Polarizer 35 60 - cd/m2
(X) 0.12 0.16 0.20
C.I.E.(Blue)
(Y)
Without Polarizer
-
0.22 0.26 0.30
Frame Rate 100 F/sec
Dark Room
Contrast
CR Shown as below - >1:100 - -
View Angle >160 - - degree
Note 3: Optical measurement taken at 1/32 duty, 100Hz Frame Rate, 0xFF Contrast Setting.
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5 APPLICATION NOTES
5.1 COMMANDS
Please refer to the Technical Manual for the SSD1303.
5.2 POWER UP/DOWN SEQUENCE
To protect panel and extend the panel life time, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off. It gives the panel enough time to complete the action of charge and discharge before/after the operation.
5.2.1 POWER UP SEQUENCE
V
1. Power up VDD
2. Send Display off command VCC
3. Clear Screen
4. Power up VCC
5. Delay 100ms VDD (When VDD is stable)
6. Send Display on command VSS/Ground
ON VCC ON Display On
DD
5.2.2 POWER DOWN SEQUENCE
Display off V
off VDD off
CC
1. Send Display off command
2. Power down VCC VCC
3. Delay 100ms (when V
is reach 0 and panel is
CC
completely discharges) VDD
4. Power down V
DD
VSS/Ground
5.3 RESET CIRCUIT
When RES# input is low, the chip is initialized with the following status:
1. Display is off
2. 132x64 Display Mode
3. Normal segment and display data column and row address mapping (SEG0 mapped to column address 00H and COM0 mapped to row address 00H)
4. Shift register data clear in serial interface
5. Display start line is set at display RAM address 0
6. Column address counter is set at 0
7. Normal scan direction of the COM outputs
8. Contrast control register is set at 80H
9. Internal booster is selected
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5.4 APPLICATION EXAMPLE
Command usage and explanation of an actual example
< Initialization Setting > Set Display Clock Divide Ratio / Oscillator Frequency ( 11010101 with XXXXXXXX )
Set Display Offset ( 11010011 with **XXXXXX ) * XXXXXX = 64 – Dummy Line from Common 0 Set Multiplex Ratio ( 10101000 with **XXXXXX )
Set DC/DC On/Off ( 10101101 with 1000101X ) 10001010 => 0x8A ( Off ) Set Area Colour Mode & Low Power Display Mode ( 11011000 with 00XX0X0X ) 00000101 => 0x05 ( Mono & Low Power Save Mode )
Set Display Start Line ( 01XXXXXX ) Set Segment Re-map ( 1010000X ) Set COM Output Scan Direction ( 11011010 with 000X0010 ) 00010010 => 0x12 ( Alternative Mode )
Set Contrast Control Register ( 10000001 with XXXXXXXX )
Set Entire Display On/Off ( 1010010X ) 10100100 => 0xA4 ( Normal ) Set Normal/Inverse Display ( 1010011X ) 10100110 => 0xA6 ( Normal ) Set Display On/Off ( 1010111X ) 10101111 => 0xAF ( Turns On )
< Display Boundary Setting > Set Page Address ( 1011XXXX ) 10110000 => 0xB0 Set Lower Column Address ( 0000XXXX ) Set Higher Column Address ( 0001XXXX )
If the noise is accidentally occurred at the displaying window during the operation, please reset the display in order to recover the display function.
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5.5 DISPLAY DIRECTION SETTING
5.5.1 Normal Display Mode
<Relative Instruction Setting>
Set Display Offset
0xD3 with 0x20
Set Multiplex Ratio
0xA8 with 0x1F
Set Display Start Line
0x40
Set Segment Re-map
0xA0 (Normal Mode)
Set COM Output Scan Direction
0xC8 (Remapped Mode)
Set Lower Column Address
0x00
Set Higher Column Address
0x10
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5.5.2 Inverted Display Mode
* The pattern shown in active area is the same as that in normal display mode but
setting the COM Output Scan Direction as remapped mode.
<Relative Instruction Setting>
Set Display Offset
0xD3 with 0x20
Set Multiplex Ratio
0xA8 with 0x1F
Set Display Start Line
0x40
Set Segment Re-map
0xA1 (Remapped Mode)
Set COM Output Scan Direction
0xC0 (Normal Mode)
Set Lower Column Address
0x04
Set Higher Column Address
0x10
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5.6 APPLICATION CIRCUIT
5.6.1 Components List
Item Silk Name Value Remark
Driver IC SSD1303
DC/DC Converter TPS61041
Inductor L1 4.7μH 2A
Schottky Diode D1
R1 150k 1%, 1/4W
Resistor
Capacitor
FH12A-20S-0.5SH
Connector
FH19S-20S-0.5SH Bottom Contact Type (HRS)
R2 24k 1%, 1/4W R3 910k 1% C1 0.1μF 6.3V, Low ESR
C2, C5 4.7μF 6.3V, Low ESR
C3 10μF 16V, Low ESR C4 0.1μF 16V, Low ESR C6 4.7μF 16V, Low ESR
(Solomon Systech)
Step-up Type (TI)
1A, 20V
Top Contact Type (HRS)
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6 PACKAGING AND LABELLING SPECIFICATION
6.1 PACKAGING
6.1.1 Material
Item Part code
1 Module
DD-2832BE-2A 33.4*14.5*1.8
2 Tray ***** 3 Inner box ***** 4 Carton ***** 5 Inner box bag *****
Dimensions
(mm)
*** *** *** ***
Unit weight
(kg)
0.002 2880
0.010 64
0.250 4
1.100 1 *** ***
6 Total weight 7.54 Kg ± 5%
6.1.2 Specification and quantity
Modules x tray = 48 Modules per inner box = 720 Modules in outer box = 2880
Quantity
6.2 LABELLING & MARKING
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7 QUALITY ASSURANCE SPECIFICATION
7.1 CONFORMITY
The performance, function and reliability of the shipped products conform to the Product Specification.
7.2 DELIVERY ASSURANCE
7.2.1 Delivery inspection standards
IPC-AA610, class 2 electronic assemblies standard
7.2.2 Zone definition
A Viewing area
B Outside viewing area
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7.2.3 Visual inspection
Inspect under 30W fluorescent lamp leaving 50 cm between the module and the lamp
and 30 cm between the module and the eye (measuring position).
Appearance is inspected at the best contrast voltage (best contrast is adjusted
considering clearness and crosstalk on screen).
Inspect the module at 45° right and left, top and bottom.
Use the optimum viewing angle during the contrast inspection.
eye
45°45°
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7.2.4 Standard of appearance inspection
Units: mm
No Item Criteria
Round type: as per following drawing = (X+Y)/2 Acceptable quantity Size Zone A Zone B
1
2 Polarizer scratch
3 Polarizer bubble
Black spot,
white spot, dust
Line type: as per following drawing Acceptable quantity Length Width Zone A Zone B
- - W0.02 Any number L≤3.0 0.02<W≤0.03 L≤2.5 0.03<W≤0.05
- - 0.05<W As round type
Total acceptable quantity: 3
Scratch on protective film is permitted Scratch on polarizer: same as No. 1 = (X+Y)/2 Acceptable quantity Size Zone A Zone B
Total acceptable quantity: 3
X1/6 Panel Length
<0.1
0.1<∅<0.2
0.2<∅<0.25
0.25<
<0.1
0.1<<0.2
0.2<<0.25
0.25<
Any number
Any number
3 1 0
2
3 1 0
Any number
Any number
Any number
Y1
ZT
4 Panel Chipping
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Class Item Criteria
Minor Segment
deformation
Minor Panel
Chipping
1b. Pin hole on dot matrix display
Acceptable quantity
Size
a,b<0.1 Any number
2. Segments / dots with different width
3. Alignment layer defect = (a+b)/2
X 1/6 Panel length Y 1 Z T
Acceptable quantity
(a+b)/20.1 Any number
0.5<∅<1.0 Total acceptable quantity: 7
Acceptable ab a/b4/3 a<b a/b>4/3
Size
0.4
0.4<1.0
1.0<1.5
1.5<2.0
Total acceptable quantity: 7
3
Any number
5 3 2
Minor Panel
Cracking
Minor Cupper
exposed (pin or film)
Minor Film or
Trace Damage
Cracks not allowed
Not allowed if visible by eye inspection
Not allowed if affect electrical function
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Class Item Criteria
Minor Contact
Lead Twist Not allowed
Minor Contact
Lead Broken
Minor Contact
Lead Bent
Minor Colour
uniformity
Major No unmelted solder paste should be present on PCB
Critical Cold solder joints, missing solder connections, or oxidation are not allowed Minor No residue or solder balls on PCB are allowed Critical Minor Tray
PCB
particles
Not allowed
Not allowed if bent lead causes short circuit
Not allowed if bent lead extends horizontally more than 50% of its width
Level of sample for approval set as limit sample
Short circuits on components are not allowed Size Quantity
On tray
On display
<0.2 >0.25 ∅≥0.25
L = 3 1
Any number
4 2
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7.3 DEALING WITH CUSTOMER COMPLAINTS
7.3.1 Non-conforming analysis
Purchaser should supply Densitron with detailed data of non-conforming sample. After accepting it, Densitron should complete the analysis in two weeks from receiving the sample. If the analysis cannot be completed on time, Densitron must inform the purchaser.
7.3.2 Handling of non-conforming displays
If any non-conforming displays are found during customer acceptance inspection which Densitron is clearly responsible for, return them to Densitron. Both Densitron and customer should analyse the reason and discuss the handling of non­conforming displays when the reason is not clear. Equally, both sides should discuss and come to agreement for issues pertaining to modification of Densitron quality assurance standard.
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8 RELIABILITY SPECIFICATION
8.1 RELIABILITY TESTS
Test Item Test Condition Evaluation and assessment
High Temperature Operation 70°C±2, 240 hours
Low Temperature Operation -20°C±2, 240 hours
High Temperature Storage 80°C±2, 240 hours
Low Temperature Storage -30°C±2, 240 hours
High Temperature & High Humidity Storage(Operation)
60°C±2, 90%RH, 240 hours
No abnormalities in function and appearance No abnormalities in function and appearance No abnormalities in function and appearance No abnormalities in function and appearance No abnormalities in function and appearance
10 cycle of
Thermal Shock
-30°C 30 min R.T. 5 min,
No abnormalities in function and appearance
80°C 30 min
The brightness should be greater than 50% of the initial brightness.
The samples used for above tests do not include polarizer.
No moisture condensation is observed during tests.
8.1.1 FAILURE CHECK STANDARD
After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure teat at 23±5 °C55±15% RH
8.2 LIFE TIME
Item Description
Function, performance, appearance, etc. shall be free from remarkable deterioration within 15,000 hours under ordinary operating and storage conditions of room
1
temperature (25±10 °C), normal humidity (45±20% RH), and in area not exposed to direct sunlight.
2 End of lifetime is specified as 50% of initial brightness.
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9 HANDLING PRECAUTIONS
Safety
If the panel breaks, be careful not to get the organic substance in your mouth or in your eyes. If the organic substance touches your skin or clothes, wash it off immediately using soap and plenty of water.
Mounting and Design
Place a transparent plate (e.g. acrylic, polycarbonate or glass) on the display surface to protect the display from external pressure. Leave a small gap between the transparent plate and the display surface. Design the system so that no input signal is given unless the power supply voltage is applied.
Caution during OLED cleaning
Lightly wipe the display surface with a soft cloth soaked with Isopropyl alcohol, Ethyl alcohol or Trichlorotriflorothane. Do not wipe the display surface with dry or hard materials that will damage the polariser surface. Do not use aromatic solvents (toluene and xylene), or ketonic solvents (ketone and acetone).
Caution against static charge
As the display uses C-MOS LSI drivers, connect any unused input terminal to V input any signals before power is turned on. Also, ground your body, work/assembly table and assembly equipment to protect against static electricity.
Packaging
Displays use OLED elements, and must be treated as such. Avoid strong shock and drop from a height. To prevent displays from degradation, do not operate or store them exposed directly to sunshine or high temperature/humidity.
Caution during operation
It is indispensable to drive the display within the specified voltage limit since excessive voltage shortens its life.
Other Precautions
When a display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module.
Storage
Store the display in a dark place where the temperature is 25°C ± 10°C and the humidity below 50%RH. Store the display in a clean environment, free from dust, organic solvents and corrosive gases. Do not crash, shake or jolt the display (including accessories).
or VSS. Do not
DD
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DENSITRON TECHNOLOGIES plc. – PROPRIETARY DATA – ALL RIGHTS RESERVED
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