DENSITRON DD-12964WE-1A Product Specification

OLED DISPLAY MODULE

Product Specification

CUSTOMER

PRODUCT

NUMBER

CUSTOMER

APPROVAL

Standard

DD-12864WE-1A

INTERNAL APPROVALS

Product Mgr Doc. Control Electr. Eng

Bruno

Recaldini

Date: 27 Nov 06 Date: 27 Nov 06 Date: 27 Nov 06

Anthony

Perkins

Bazile

Peter

Date

TABLE OF CONTENTS

1 MAIN FEATURES ..........................................................................................................4

2 MECHANICAL SPECIFICATION...............................................................................5

2.1 MECHANICAL CHARACTERISTICS .................................................................... 5

2.2 MECHANICAL DRAWING ..................................................................................... 6

3 ELECTRICAL SPECIFICATION................................................................................. 7

3.1 ABSOLUTE MAXIMUM RATINGS ....................................................................... 7

3.2 ELECTRICAL CHARACTERISTICS ...................................................................... 8

3.3 INTERFACE PIN ASSIGNMENT ............................................................................ 9

3.4 BLOCK DIAGRAM ................................................................................................ 11

3.5 TIMING CHARACTERISTICS .............................................................................. 12

4 OPTICAL SPECIFICATION.......................................................................................15

4.1 OPTICAL CHARACTERISTICS............................................................................ 15

5 FUNCTIONAL SPECIFICATION..............................................................................16

5.1 COMMANDS .......................................................................................................... 16

5.2 POWER UP/DOWN SEQUENCE........................................................................... 16

5.3 RESET CIRCUIT..................................................................................................... 16

5.4 ACTUAL APPLICATION EXAMPLE ................................................................... 17

6 PACKAGING AND LABELLING SPECIFICATION..............................................18

7 QUALITY ASSURANCE SPECIFICATION.............................................................19

7.1 CONFORMITY ....................................................................................................... 19

7.2 DELIVERY ASSURANCE ..................................................................................... 19

7.3 DEALING WITH CUSTOMER COMPLAINTS .................................................... 23

8 RELIABILITY SPECIFICATION ..............................................................................24

8.1 RELIABILITY

8.2 LIFE

TIME............................................................................................................... 24

TESTS ............................................................................................ 24

9 HANDLING PRECAUTIONS......................................................................................25

Product No.

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REVISION RECORD

Rev. Date Page Chapt. Comment ECR no.

A

27 Nov 06

First Issue

Product No.

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1 MAIN FEATURES

ITEM CONTENTS

Display Format 128 x 64 Dots

Overall Dimensions Glass 26.70 x 19.26 x 2.10 mm

Colour Monochrome White

Active Area 21.74 x 10.86 mm

Viewing Area 23.74 x 12.86 mm

Display Mode Passive Matrix (0.96”)

Driving Method 1/64 duty

Driver IC SH1101A

Operating temperature -30 ~ +70

Storage temperature -40 ~ +80

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2 MECHANICAL SPECIFICATION

2.1 MECHANICAL CHARACTERISTICS

ITEM CHARACTERISTIC UNIT

Display Format 128 x 64 Dots Dots

Overall Dimensions Glass 26.70 x 19.26 x 2.10 mm

Viewing Area 23.74 x 12.86 mm

Active Area 21.74 x 10.86 mm

Dot Size 0.15 x 0.15 mm

Dot Pitch 0.17 x 0.17 mm

Weight 2 g

IC Controller/Driver SH1101A

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2.2 MECHANICAL DRAWING

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3 ELECTRICAL SPECIFICATION

3.1 ABSOLUTE MAXIMUM RATI NG S

Item Symbol Min Max Unit Note

VSS = 0 V, Ta = 25 °C

Supply Voltage V

-0.3 3.5 V

DD1

Note 1, 2

Driver Supply Voltage VPP 0 15 V

Operating Temperature Top -30 70 °C

Storage Temperature Tst -40 80 °C

Static Electricity Be sure that you are grounded when handling displays.

Note 1: All the above voltages are on the basis of “GND=0V”. Note 2: When this module is used beyond the above absolute maximum ratings, permanent

damage to the module may occur. Also for normal operations it’s desirable to use this module under the conditions according to Section 3.2 “Electrical Characteristics”. If this module is used beyond these conditions the module may malfunction and the reliability could deteriorate.

3.2 ELECTRICAL CHARACTERISTICS

Characteristics Symbol Conditions Min Typ Max Unit

Supply Voltage V

2.6 2.8 3.5 V

DD1

DC/DC Supply Voltage VDD2 2.6 - 3.5 V

Driver Supply Voltage VPP 8 9 10 V

V

High Level Input V

Low Level Input V

High Level Output V

Low Level Output V

Operating current for VDD1

IHC

ILC

OHC

OLC

IDD1

Operating current for VPP IPP

Sleep mode current for VDD1 Sleep mode current for VCC

IDD1

SLEEP

ICC SLEEP

0.8xV

IOUT=0.5mA,

0.8 x VDD1

3.3MHz

Note 4 -

Note 5 -

Note 4 -

Note 5 -

-

DD1

0

-

180

5.6

8

<1

DD1

0.2 x

VDD1

V

VDD1 V

0.2 x

VDD1

V

320

µA

320

8

mA

11

1 µA

Note 4 VDD1 = 2.8V, VPP = 9V, Frame rate = 150Hz, Contrast setting = 0x64, 50% display area turned on.

Note 5 VDD1 = 2.8V, VPP = 9V, Frame rate = 150Hz, Contrast setting = 0x64, 100% display area turned on.

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3.3 INTERFACE PIN ASSIGNMENT

No. Symbol Function

1

N.C. No Connection

Ground

2

GND

This is the ground pin. It also acts as a reference for the logic pins, the OLED driving voltages and the analogue circuits. It must be connected to external ground

Output for connected external NMOS

3

SW

This output pin drives the gate of the external NMOS of the booster circuit.

Power supply for DC/DC converter circuit

4

VDD2

This is the power supply pin for the internal buffer of the DC/DC voltage converter. It must be connected to VDD when the converter is used. It must be floated when the converter is not used

Feedback Input for DC/DC converter circuit

5

FB

This pin is the feedback resistor input of the booster circuit. It is used to adjust the booster output voltage level (VCC)

Input for connected External NMOS

6

SENSE

This pin connects to the source current pin of the external NMOS of the booster circuit.

Voltage reference for DC/DC converter circuit

7

8

9 C86

10

VBREF

VDD1

PS

This pin is the internal voltage reference of booster circuit. A Stabilization capacitor typ 1µF should be connected to VSS.

Power supply for logic circuit

This is a voltage supply pin. It must be connected to external source.

Communicating protocol select

These pins are MCU interface selection input. See the following table:

C86 0 1 0

PS 1 1 0

Chip select

11

CS

This pin is the chip select input. The chip is enabled for MCU communication only when CS# is pulled low.

Power reset for controller and driver

12

RES

This pin is reset signal input. When the pin is low initialization of the chip is executed.

Data/Command Control

This pin is data/command control pin. When the pin is pulled high, the input

13

A0

D7~D0 is treated as display data. When the pin is pulled low, the input at D7~D0 will be transferred to the command register. For detail relationship to MCU interface signals please refer to the Timing Characteristics Diagrams

Read/Write select or write

This pin is MCU interface input. When interfacing to a 6800-series microprocessor this pin will be used as Read/Write (R/W#) selection

14 WR

input. Pull this pin to “High” for Read mode and pull it to “Low” for Write mode. When 8080 interface mode is selcted this pin will be the Write (WR#) input. Data write operation is initiated when this pin is pulled low and the CS# is pulled low.

6800-parallel 8080-parallel Serial

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15 RD

16 VCOMH

17 VPP 18

19 20 21

D0~D7

22 23

Read/Write enable or Read

This pin is MCU interface input. When interfacing to a 6800-series microprocessor this pin will be used as the Enable (E) signal. Read/Write operation is initiated when this pin is pulled high and the CS# is pulled low. When connecting to a 8080-series microprocessor this pin receives the Read (RD#) signal. Data read operation is initiated when this pin is pulled low and CS# is pulled low

Voltage output high level for COM signal

This pin is the input pin for the voltage output high level for COM signals. A capacitor should be connected between this pin and VSS.

Power Supply for OLED Panel

This is the most positive voltage supply pin of the chip. It can be supplied externally or generated internally by using internal DC/DC voltage converter

Host data Input/Output bus

These pins are 8-bit bi-directional data bus to be connected to the microprocessors data bus. When serial mode is selected D1 will be the serial data input SDIN and D0 will be the serial clock input SCLK.

24 25

Current reference for brightness adjustment

26 IREF

This pin is segment current reference pin. A resistor should be connected between this pin and VSS. Set the current at 10µA

27 N.C. No Connection

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3.4 BLOCK DIAGRAM

MCU Interface Selection: PS and C86 Pins connected to MCU interface: D7~D0, RD, WR, A0, RES and CS. *VBREF, SENSE, FB, VDD2 and SW should be left float when using external DC/DC converter.

C1, C2, C3: 4.7μF R1: 910 kΩ, R1 = (Voltage at IREF – GND) / IREF

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3.5 TIMING CHARACTERISTICS

3.5.1 AC CHARACTERISTICS

3.5.1.1 6800-Series MPU Parallel Interface Timing Characteristics

VDD = 2.8V, Ta = 25˚C

Characteristics Symbol Min Max Unit

System cycle time tCYC6 300 Address setup timing tAS6 0 Address hold time tAH6 0 Write Data Setup time tDS6 40 Write Data Hold time tDH6 15 Output Disable time tOH6 10 70 Access time tACC6 - 140 Enable H pulse width (Write) tEWHW 100 Enable H pulse width (Read) tEWHR 120 Enable L pulse width (Write) tEWLW 100 -

Enable L pulse width (Read) tEWLR 100 Rise time tR - 15 Fall time tF - 15

All the timing should be based on 30% and 70% of V

DD1 -

VSS

-

--

nS

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3.5.1.2 8080-Series MPU Parallel Interface Timing Characteristics

Characteristics Symbol Min Max Unit

System cycle time tCYC8 300 Address setup timing tAS8 0 Address hold time tAH8 0 Write Data Setup time tDS8 40 Write Data Hold time tDH8 15 Output Disable time tCH8 10 70 /RD Access time tACC8 - 140 Control L pulse width (WR) tCCLW 100 Control L pulse width (RD) tCCLR 120 Control H pulse width (WR) tCCHW 100 Control H pulse width (RD) tCCHR 100 -

Rise time tR - 15 Fall time tF - 15

All the timing should be based on 30% and 70% of V

DD1 -

VSS

-

nS

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3.5.1.3 Serial Interface Timing Characteristics

VDD = 2.8V , Ta = 25˚C

Characteristics Symbol Min Max Unit

Serial Clock Cycle Time TSCYC 250 Address Setup Time TSAS 150 Address Hold Time TSAH 150 Data Setup Time TSDS 100 Data Hold Time TSDH 100 /CS Setup Time TCSS 120 /CS Hold Time TCSH 60 Serial clock H pulse width TSHW 100 Serial clock L pulse width TSLW 100 Rise Time tR - 15 Fall Time tF - 15

* All the timing should be based on 30% and 70% of V

DD -

VSS

-

nS

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4 OPTICAL SPECIFICATION

4.1 OPTICAL CHARACTERISTICS

Characteristics Symbol Condition Min Typ Max Unit

Brightness(White) Lbr 40 60 - cd/m2

(X) 0.28 0.32 0.36

C.I.E.(White)

(Y)

-

0.29 0.33 0.37

Dark Room

Contrast

CR - >100:1 - -

Viewing Angle >160 - - degree

Optical measurement with polarizer is taken at 1/64 duty, 150Hz Frame Rate, 0x64 Contrast setting.

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5 FUNCTIONAL SPECIFICATION

5.1 COMMANDS

Please refer to the Technical Manual for the SH1101A

5.2 POWER UP/DOWN SEQUENCE

To protect panel and extend the panel lifetime, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off. It gives the panel enough time to complete the action of charge and discharge before/after the operation.

5.2.1 POWER UP SEQUENCE

V

1. Power up V

DD1

2. Delay 100ms at least VPP (when reset is finished)

3. Send Display off command

4. Clear Screen

5.Power up VPP V

6. Delay 100ms (when VDD1 is stable) VSS Ground

7. Send Display on command

ON VPP ON

DD1

Display On

5.2.2 POWER DOWN SEQUENCE

Display off V

1. Send Display off command

2. Power down VPP VPP

3. Delay 100ms (When VPP reach 0 and panel is completely discharges) V

4. Power down V V

DD1

SS Ground

DD1

5.3 RESET CIRCUIT

When RES# input is low, the chip is initialized with the following status:

1. Display is OFF

2. 132x64 Display mode

3. Normal segment and display data colume and row address mapping (SEG0 mapped to column address ooH and COM0 mapped to row address 00H)

4. Shift register data clear in serial interface

5. Display start line is set at display RAM address 0

6. Column address counter is set at 0

7. Normal scan direction of the COM outputs

8. Contrast control register is set at 80H

9. Internal booster is selected

off V

PP

DD1

off

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5.4 ACTUAL APPLICATION EXAMPLE

Command usage and explanation of an actual example

<Initialisation Setting> Set Display Clock Divide Ratio / Oscillator Frequency (11010101 with XXXXXXXX)

Set Display Offset (11010011 with **XXXXXX) Set Multiplex Ratio (10101000 with **XXXXXX)

Set DC/DC On/Off (10101101 with 1000101X) 10001010=>0x8A (Off)

Set Display Start Line (01XXXXXX) Set Segment Re-map (1010000X) Set COM Output Scan Direction (1100X***) Set COM Pins Hardware Configuration (11011010 with 000X0010) 00010010=>0x12 (Alternative Mode)

Set Contrast Control Register (10000001 with XXXXXXXX)

Set Entire Display On/Off (1010010X) 10100100=>0xA4 (Normal) Set Normal/Inverse Display (1010011X) 10100110=>0xA6 (Normal) Set Display On/Off (1010111X) 10101111=> 0xAF (Turns On)

<Display Boundary Settings> Set Page Address (1011XXXX) 10110000=>0xB0 Set Lower Column Address (0000XXXX) Set Higher Column Address (0001XXXX)

If the noise is accidentally occurred at the displaying window during the operation, please reset the display in order to recover the display function.

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6 PACKAGING AND LABELLING SPECIFICATION

DENSITRON DD-12864WE-1A TW YY MM

54 Pieces per tray 15 trays per box ( 810 pieces ) 4 boxes per carton (3240 pieces )

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7 QUALITY ASSURANCE SPECIFICATION

7.1 CONFORMITY

The performance, function and reliability of the shipped products conform to the Product Specification.

7.2 DELIVERY ASSURANCE

7.2.1 DELIVERY INSPECTION STANDARDS

IPC-AA610, class 2 electronic assemblies standard

7.2.2 Zone definition

A Active

7.2.3 Visual inspection

Test and measurement to be conducted under following conditions

Temperature: 23±5℃

Humidity: 55±15%RH Fluorescent lamp: 30 W

Distance between the Panel & Eyes of the Inspector: ≧30cm

Distance between the Panel & the lamp: ≧50cm

B Outside Active

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7.2.4 Standard of appearance inspection

Units: mm

Class Item Criteria

Minor Outside & inside package Presence of product no., lot no., quantity

Critical

Major Dimension Product dimensions must be according to specification and drawing

Major Electrical Product electrical characteristics must be according to specification

Critical OLED

Minor Black spot,

Minor Polariser

Packing &

Label

Display

white spot,

dust

scratch

bubble

Product must not be mixed with others and quantity must not be different from that indicated on the label

Missing lines, short circuits or wrong patterns on OLED display are not allowed

Round type: as per following drawing ∅ = (X+Y)/2 Acceptable quantity Size Zone A Zone B

Line type: as per following drawing Acceptable quantity Length Width Zone A Zone B

- - W≤0.05 Any number L≤2.0 W≤0.1 3 L>2.0 0

Total acceptable quantity: 3

Scratch on protective film is permitted Minor Polariser Scratch on polariser: same as No. 1 ∅ = (X+Y)/2 Acceptable quantity Size Zone A Zone B

∅<0.1

0.1<∅<0.2

0.2<∅<0.25

0.25<∅

∅<0.5

∅>0.5

Any number

3 1 0

Any number

0

Any number

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Class Item Criteria

Minor Segment

deformation

Minor Panel

Chipping

1b. Pin hole on dot matrix display

Acceptable quantity

Size a,b<0.1 Any number (a+b)/2≤0.1 Any number

0.5<∅<1.0

3

Total acceptable quantity: 7

2. Segments / dots with different width

Acceptable

a≥b a/b≤4/3

a<b a/b>4/3

3. Alignment layer defect ∅ = (a+b)/2

Acceptable quantity

Size ∅≤0.4

0.4<∅≤1.0

1.0<∅≤1.5

1.5<∅≤2.0

Total acceptable quantity: 7

Any number

5 3 2

X ≤ 1/6 Panel length Y ≤ 1 Z ≤ T

Minor Panel

Cracking

Minor Cupper

Cracks not allowed

Not allowed if visible by eye inspection exposed (pin or film)

Minor Film or

Not allowed if affect electrical function Trace Damage

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Class Item Criteria

Minor Contact

Lead Twist Not allowed

Minor Contact

Lead

Not allowed Broken

Minor Contact

Lead Bent

Not allowed if

bent lead causes

short circuit

Not allowed if bent lead

extends horizontally

more than 50%

of its width

Minor Colour

Level of sample for approval set as limit sample uniformity

Major No unmelted solder paste should be present on PCB

PCB

Critical Cold solder joints, missing solder connections, or oxidation are not allowed Minor No residue or solder balls on PCB are allowed Critical Minor Tray

particles

Short circuits on components are not allowed

Size Quantity

On tray

On display

∅<0.2 ∅>0.25 ∅≥0.25

L = 3 1

Any number

4 2

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7.3 DEALING WITH CUSTOMER COMPLAINTS

7.3.1 Non-conforming analysis

Purchaser should supply Densitron with detailed data of non-conforming sample. After accepting it, Densitron should complete the analysis in two weeks from receiving the sample. If the analysis cannot be completed on time, Densitron must inform the purchaser.

7.3.2 Handling of non-conforming displays

If any non-conforming displays are found during customer acceptance inspection which Densitron is clearly responsible for, return them to Densitron. Both Densitron and customer should analyse the reason and discuss the handling of nonconforming displays when the reason is not clear. Equally, both sides should discuss and come to agreement for issues pertaining to modification of Densitron quality assurance standard.

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8 RELIABILITY SPECIFICATION

8.1 RELIABILITY TESTS

Test Item Test Condition Evaluation and assessment

High Temperature Operation 70°C±2, 120 hours

Low Temperature Operation -30°C±2, 120 hours

High Temperature Storage 80°C±2, 120 hours

Low Temperature Storage -40°C±2, 120 hours

High Temperature & High Humidity Storage(Operation)

60°C±2, 90%RH, 120 hours

24 cycle of

Thermal Shock

-40°C 1 Hour, 85°C 1 Hour. 60 Mins dwell

No abnormalities in function and appearance No abnormalities in function and appearance No abnormalities in function and appearance No abnormalities in function and appearance No abnormalities in function and appearance

No abnormalities in function and appearance

• The brightness should be greater than 50% of the initial brightness.

• The samples used for above tests do not include polarizer.

• No moisture condensation is observed during tests.

8.1.1 FAILURE CHECK STANDARD

After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure teat at 23±5 °C; 55±15% RH

8.2 LIFE TIME

Item Description

Function, performance, appearance, etc. shall be free from remarkable deterioration more than 10,000 hours under 70 cd/m² brightness and storage conditions of room

1

temperature (25±10 °C), normal humidity (45±20% RH), and in area not exposed to direct sunlight.

2 End of lifetime is specified as 50% of initial brightness.

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9 HANDLING PRECAUTIONS

Safety

If the panel breaks, be careful not to get the organic substance in your mouth or in your eyes. If the organic substance touches your skin or clothes, wash it off immediately using soap and plenty of water.

Mounting and Design

Place a transparent plate (e.g. acrylic, polycarbonate or glass) on the display surface to protect the display from external pressure. Leave a small gap between the transparent plate and the display surface. Design the system so that no input signal is given unless the power supply voltage is applied.

Caution during OLED cleaning

Lightly wipe the display surface with a soft cloth soaked with Isopropyl alcohol, Ethyl alcohol or Trichlorotriflorothane. Do not wipe the display surface with dry or hard materials that will damage the polariser surface. Do not use aromatic solvents (toluene and xylene), or ketonic solvents (ketone and acetone).

Caution against static charge

As the display uses C-MOS LSI drivers, connect any unused input terminal to V input any signals before power is turned on. Also, ground your body, work/assembly table and assembly equipment to protect against static electricity.

Packaging

Displays use OLED elements, and must be treated as such. Avoid strong shock and drop from a height. To prevent displays from degradation, do not operate or store them exposed directly to sunshine or high temperature/humidity.

Caution during operation

It is indispensable to drive the display within the specified voltage limit since excessive voltage shortens its life.

Other Precautions

When a display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module.

Storage

Store the display in a dark place where the temperature is 25°C ± 10°C and the humidity below 50%RH. Store the display in a clean environment, free from dust, organic solvents and corrosive gases. Do not crash, shake or jolt the display (including accessories).

or VSS. Do not

DD

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DENSITRON DD-12964WE-1A Product Specification

Specifications and Main Features

Frequently Asked Questions

User Manual