DENSITRON DD-12832BE-1A Product Specification

OLED DISPLAY MODULE

Product Specification

CUSTOMER

PRODUCT

NUMBER

CUSTOMER

APPROVAL

Standard

DD-12832BE-1A

INTERNAL APPROVALS

Product Mgr Doc. Control Electr. Eng

Bazile

Peter

Date: 12 May 08 Date: 12 May 08 Date: 12 May 08

Anthony

Perkins

Rekha

Mani

Date

TABLE OF CONTENTS

1 MAIN FEATURES .......................................................................................................... 4

2 MECHANICAL SPECIFICATION............................................................................... 5

2.1 MECHANICAL CHARACTERISTICS .................................................................... 5

2.2 MECHANICAL DRAWING ..................................................................................... 6

3 ELECTRICAL SPECIFICATION................................................................................. 7

3.1 ABSOLUTE MAXIMUM RATINGS ....................................................................... 7

3.2 ELECTRICAL CHARACTERISTICS ...................................................................... 8

3.3 INTERFACE PIN ASSIGNMENT ............................................................................ 9

3.4 BLOCK DIAGRAM ................................................................................................ 11

3.5 TIMING CHARACTERISTICS .............................................................................. 12

4 OPTICAL SPECIFICATION....................................................................................... 16

4.1 OPTICAL CHARACTERISTICS............................................................................ 16

5 FUNCTIONAL SPECIFICATION .............................................................................. 17

5.1 COMMANDS .......................................................................................................... 17

5.2 POWER UP/DOWN SEQUENCE........................................................................... 17

5.3 RESET CIRCUIT..................................................................................................... 17

5.4 ACTUAL APPLICATION EXAMPLE ................................................................... 18

6 PACKAGING AND LABELLING SPECIFICATION.............................................. 19

7 QUALITY ASSURANCE SPECIFICATION ............................................................. 20

7.1 CONFORMITY ....................................................................................................... 20

7.2 DELIVERY ASSURANCE ..................................................................................... 20

7.3 DEALING WITH CUSTOMER COMPLAINTS .................................................... 24

8 RELIABILITY SPECIFICATION .............................................................................. 25

8.1 RELIABILITY TESTS ............................................................................................ 25

8.2 LIFE TIME............................................................................................................... 25

9 HANDLING PRECAUTIONS...................................................................................... 26

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REVISION RECORD

Rev. Date Page Chapt. Comment ECR no.

A

12 May 08

First Issue

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1 MAIN FEATURES

ITEM CONTENTS

Display Format 128 x 32 Dots

Overall Dimensions 62.00 x 24.00 x 2.00 mm

Colour Monochrome (Light Blue)

Active Area 55.02 x 13.10 mm

Viewing Area 57.02 x 15.1 mm

Display Mode Passive Matrix (2.23”)

Driving Method 1/32 duty

Driver IC SSD1305

Operating temperature -30 ~ +70

Storage temperature -40 ~ +80

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2 MECHANICAL SPECIFICATION

2.1 MECHANICAL CHARACTERISTICS

ITEM CHARACTERISTIC UNIT

Display Format 128 x 32 Dots Dots

Overall Dimensions 62.00 x 24.00 x 2.00 mm

Viewing Area 57.02 x 15.10 mm

Active Area 55.02 x 13.10 mm

Dot Size 0.41 x 0.39 mm

Dot Pitch 0.43 x 0.41 mm

Weight 5.80 g

IC Controller/Driver SSD1305

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2.2 MECHANICAL DRAWING

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3 ELECTRICAL SPECIFICATION

3.1 ABSOLUTE MAXIMUM RATINGS

Item Symbol Min Max Unit Note

Supply Voltage for logic VDD -0.3 4.0 V

Note 1, 2

Supply voltage for Display VCC 0 15 V

Operating Temperature Top -30 70 °C

Storage Temperature Tst -40 80 °C

Static Electricity Be sure that you are grounded when handling displays.

Note 1: All the above voltages are on the basis of “ VSS=0V”. Note 2: When this module is used beyond the above absolute maximum ratings, permanent

damage to the module may occur. Also for normal operations it’s desirable to use this module under the conditions according to Section 3.2 “Electrical Characteristics”. If this module is used beyond these conditions the module may malfunction and the reliability could deteriorate.

3.2 ELECTRICAL CHARACTERISTICS

Characteristics Symbol Conditions Min Typ Max Unit

Supply Voltage VDD 2.4 2.8 3.5 V

Supply Voltage for Display VCC Note 3 12 12.5 13.0 V

VDD

High Level Input VIH 0.8xVDD

Low Level Input VIL

High Level Output VOH 0.9 x VDD

IOUT=0.1mA,

3.3MHz

Low Level Output VOL

Note 4 -

0

Operating current for VDD IDD

Note 5 -

-

180

V

0.2 x VDD

V

VDD V

0.1 x V

DD

V

300

µA

300

Operating current for VCC ICC

I

Sleep mode current for VDD

Sleep mode current for VCC

DD

SLEEP

CC

I

SLEEP

Note 4 -

Note 5 -

-

20

28

1

25

mA

35

5 µA

Note 3 Brigthness (Lbr) and Supply Voltage for Display (VCC) are subject to the change of the panel characteristics and the customers request

Note 4 V

DD = 2.8V, VCC = 12.5V, 50% display area turned on.

Note 5 V

DD = 2.8V, VCC = 12.5V, 100% display area turned on.

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3.3 INTERFACE PIN ASSIGNMENT

No. Symbol Function

Reserved Pin (Supporting Pin)

1

2

3 VSS

4

5 VDD

6

N.C.(GND)

VLSS

The supporting pins can reduce the influences from stresses on the function pins. These pins must be connected to external ground.

Ground of Analog Circuit

This is an analog ground pin. It should be connected to VSS externally

Ground of OEL System

This is a ground pin. It also acts as a reference for the logic pins, the OEL driving voltages, and the analog circuits. It must be connected to external ground.

N.C. No Connection

Power Supply for Logic Circuit

This is a voltage supply pin. It must be connected to external source.

BS1

Communicating Protocol Select

These pins are MCU interface selection input. See the following table:

7

8

BS2

CS#

9 RES#

10

11

12

13~20

D/C#

R/W#

E/RD#

D0~D7

Chip Select

This pin is the chip select input. The chip is enabled for MCU communication only when CS# is pulled low.

Power Reset for Controller and Driver

This pin is reset signal input. When the pin is low, initialization of the chip is executed.

Data/Command Control

This pin is Data/Command control pin. When the pin is pulled high, the input at D7~D0 is treated as display data. When the pin is pulled low, the input at D7~D0 will be transferred to the command register. For detail relationship to MCU interface signals, please refer to the Timing Characteristics Diagrams. When the pin is pulled high and serial interface mode is selected, the data at SDIN is treated as data. When it is pulled low, the data at SDIN will be transferred to the command register. In I2C mode, this pin acts as SA0 for slave address selection.

Read/Write Select or Write

This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used as Read/Write (R/W#) selection input. Pull this pin to “High” for read mode and pull it “Low” for write mode. When 80XX interface mode is selected, this pin will be the Write (WR#) input. Data write operation is initiated when this pin is pulled low and the CS# is pulled low.

Read/Write Enable or Read

This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used as the Enable (E) signal. Read/write operation is initiated when this pin is pulled high and the CS# is pulled low. When connecting to an 80XX-microprocessor, this pin receives the Read (RD#) signal. Data read operation is initiated when this pin is pulled low and CS# is pulled low.

Host Data Input/Output Bus

These pins are 8-bit bi-directional data bus to be connected to the microprocessor’s data bus. When serial mode is selected, D1 will be the serial data input SDIN and D0 will be the serial clock input SCLK. When I2C mode is

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21 IREF

22 VCOMH

23 VCC

24 N.C.(GND)

selected, D2 & D1 should be tied together and serve as SDAout &SDAin in application and D0 is the serial clock input SCL.

Current Reference for Brightness Adjustment

This pin is segment current reference pin. A resistor should be connected between this pin and VSS. Set the current lower than 10uA

Voltage Output High Level for COM signal

This pin is the input pin for the voltage output high level for COM signals. A capacitor should be connected between this pin and VSS.

Power Supply for OEL Panel

This is the most positive voltage supply pin of the chip. It must be supplied externally.

Reserved Pin (Supporting Pin)

The supporting pins can reduce the influences from stresses on the function pins. These pins must be connected to external ground.

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3.4 BLOCK DIAGRAM

MCU Interface Selection: BS1 and BS2 Pins connected to MCU interface: D7~D0, E/RD#, R/W#, D/C#, RES# and CS#.

C1, C3: 0.1μF C2: 4.7μF C4: 10μF C5: 4.7μF/25V Tantalum Capacitor R1: 910 kΩ, R1 = (Voltage at IREF – VSS) / IREF

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3.5 TIMING CHARACTERISTICS

3.5.1 AC CHARACTERISTICS

3.5.1.1 68XX-Series MPU Parallel Interface Timing Characteristics

VDD-VSS = 2.4V to 3.5V, Ta=25oC

Symbol Description Min Max Unit

tcycle System Cycle Time 300 - ns

tAS

tAH Address Hold Time 0 - ns

tDSW Write Data Setup Time 40 - ns

tDHW Write Data Hold Time 7 - ns

tDHR Read Data Hold Time 20 - ns

tOH Output Disable Time - 70 ns

tACC Access Time - 140 ns

PWCSL

PWCSH

Address Setup Time 0

Chip Select Low Pulse Width (Read) Chip Select 120

Low Pulse width (Write) 60

Chip Select High Pulse Width (Read) Chip Select 60

High Pulse Width (Write) 60

- ns

tR Rise Time - 15 ns

tF Fall Time - 15 ns

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3.5.1.2 8080-Series MPU Parallel Interface Timing Characteristics

V

DD-VSS

Symbol Description Min Max Unit

tcycle Clock Cycle Time 300 - ns

tAS

Address Setup Time 10

tAH Address Hold Time 0 - ns

tDSW Write Data Setup Time 40 - ns

tDHW Write Data Hold Time 7 - ns

tDHR Read Data Hold Time 20 - ns

tOH Output Disable Time - 70 ns

tACC Access Time - 140 ns

tPWLR Read Low Time 120 - ns

tPWLW Write Low Time 60 - ns

tPWHR Read High Time 60 - ns

tPWHW

tCS

tCSH

tCSF

Write High Time 60 Chip Select Setup Time 0 Chip Select Hold Time to Read Signal 0

Chip Select Hold Time 20 tR Rise Time - 15 ns tF Fall Time - 15 ns

= 2.4V to 3.5V, Ta=25oC

- ns

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3.5.1.3 Serial Interface Timing Characteristics

VDD-VSS = 2.4V to 3.5V, Ta=25oC

Symbol Description Min Max Unit

tcycle Clock Cycle Time 250 - ns

tAS

tAH Address Hold Time 150 - ns

tCSS Chip Select Setup Time 120 - ns

tCSH

tDSW tDHW Write Data Hold Time 15 - ns

tCLKL Serial Clock Low Time 100 - ns

tCLKH Serial Clock High Time 100 - ns

tR Rise Time - 15 ns tF Fall Time - 15 ns

Address Setup Time 150

Chip Select Hold Time 60

Write Data Setup Time 50

- ns

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3.5.1.4 I²C Interface Timing Characteristics

V

DD-VSS

Symbol Description Min Max Unit

tcycle Clock Cycle Time 2.5 - us

tHSTART

Start Condition Hold Time 0.6

Data Hold Time (for “SDAOUT” Pin) Data

tHD

Hold Time (for “SDAIN” Pin)

tSD Data Setup Time 100 - ns

tSSTART Start Condition Setup Time

(Only relevant for a repeated Start condition)

= 2.4V to 3.5V, Ta=25oC

- us

0

- ns

300

0.6 - us

tSSTOP

Stop Condition Setup Time 0.6

tR Rise Time for Data and Clock Pin

tF Fall Time for Data and Clock Pin

tIDLE

Idle Time before a New Transmission can Start

- us

300 ns

1.3 - us

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4 OPTICAL SPECIFICATION

4.1 OPTICAL CHARACTERISTICS

Characteristics Symbol Condition Min Typ Max Unit

Brightness(White) Lbr

With Polarizer

(Note 3)

100 120 - cd/m

2

(X) 0.12 0.16 0.20

C.I.E.(Blue)

Dark Room

Contrast

(Y)

CR - >2000:1 - -

Without Polarizer

-

0.22 0.26 0.30

Viewing Angle >160 - - degree

Optical measurement taken at V

DD = 2.8V, VCC = 12.5V.

Software configuration follows Section 5.4 Initialization

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5 FUNCTIONAL SPECIFICATION

5.1 COMMANDS

Please refer to the Technical Manual for the SSD1305

5.2 POWER UP/DOWN SEQUENCE

To protect panel and extend the panel lifetime, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off. It gives the panel enough time to complete the action of charge and discharge before/after the operation.

5.2.1 POWER UP SEQUENCE

V

1. Power up V

DD

2. Send Display off command Vcc

3. Initialization

4. Clear Screen

5.Power up VCC V

6. Delay 100ms (when VDD is stable) V

7. Send Display on command

ON VCC ON

DD

SS Ground

Display On

5.2.2 POWER DOWN SEQUENCE

Display off V

1. Send Display off command

2. Power down V

VCC

CC

3. Delay 100ms (When V completely discharges) V

4. Power down V V

reach 0 and panel is

CC

DD

SS Ground

5.3 RESET CIRCUIT

When RES# input is low, the chip is initialized with the following status:

1. Display is OFF

2. 132x64 Display mode

3. Normal segment and display data colume and row address mapping (SEG0 mapped to column address 00h and COM0 mapped to row address 00h)

4. Shift register data clear in serial interface

5. Display start line is set at display RAM address 0

6. Column address counter is set at 0

7. Normal scan direction of the COM outputs

8. Contrast control register is set at 80h

9. Normal display mode (Equivalent to A4h command)

off VDD off

CC

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5.4 ACTUAL APPLICATION EXAMPLE

Command usage and explanation of an actual example

If the noise is accidentally occurred at the displaying window during the operation, please reset the display in order to recover the display function.

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6 PACKAGING AND LABELLING SPECIFICATION

DENSITRON DD-12832BE-1A TW YY MM

54 Pieces per tray 15 trays per box ( 810 pieces ) 4 boxes per carton (3240 pieces )

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7 QUALITY ASSURANCE SPECIFICATION

7.1 CONFORMITY

The performance, function and reliability of the shipped products conform to the Product Specification.

7.2 DELIVERY ASSURANCE

7.2.1 DELIVERY INSPECTION STANDARDS

IPC-AA610, class 2 electronic assemblies standard

7.2.2 Zone definition

A Active

7.2.3 Visual inspection

Test and measurement to be conducted under following conditions

Temperature: 23±5℃

Humidity: 55±15%RH Fluorescent lamp: 30 W

Distance between the Panel & Eyes of the Inspector: ≧30cm

Distance between the Panel & the lamp: ≧50cm

B Outside Active

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7.2.4 Standard of appearance inspection

Units: mm

Class Item Criteria

Minor Outside & inside package Presence of product no., lot no., quantity

Critical

Major Dimension Product dimensions must be according to specification and drawing

Major Electrical Product electrical characteristics must be according to specification

Critical OLED

Minor Black spot,

Minor Polariser

Packing &

Label

Display

white spot,

dust

scratch

bubble

Product must not be mixed with others and quantity must not be different from that indicated on the label

Missing lines, short circuits or wrong patterns on OLED display are not allowed

Round type: as per following drawing ∅ = (X+Y)/2 Acceptable quantity Size Zone A Zone B

Line type: as per following drawing Acceptable quantity Length Width Zone A Zone B

- - W≤0.05 Any number L≤2.0 W≤0.1 3 L>2.0 0

Total acceptable quantity: 3

Scratch on protective film is permitted Minor Polariser Scratch on polariser: same as No. 1 ∅ = (X+Y)/2 Acceptable quantity Size Zone A Zone B

∅<0.1

0.1<∅<0.2

0.2<∅<0.25

0.25<∅

∅<0.5

∅>0.5

Any number

3 1 0

Any number

0

Any number

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Class Item Criteria

Minor Segment

deformation

Minor Panel

Chipping

1b. Pin hole on dot matrix display

Acceptable quantity

Size a,b<0.1 Any number (a+b)/2≤0.1 Any number

0.5<∅<1.0

3

Total acceptable quantity: 7

2. Segments / dots with different width

Acceptable a≥b a/b≤4/3 a<b a/b>4/3

3. Alignment layer defect ∅ = (a+b)/2

Acceptable quantity

Size

∅≤0.4

0.4<∅≤1.0

1.0<∅≤1.5

1.5<∅≤2.0

Total acceptable quantity: 7

Any number

5 3 2

X ≤ 1/6 Panel length Y ≤ 1 Z ≤ T

Minor Panel

Cracking

Minor Cupper

Cracks not allowed

Not allowed if visible by eye inspection exposed (pin or film)

Minor Film or

Not allowed if affect electrical function Trace Damage

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Class Item Criteria

Minor Contact

Lead Twist Not allowed

Minor Contact

Lead

Not allowed Broken

Minor Contact

Lead Bent

Not allowed if

bent lead causes

short circuit

Not allowed if bent lead

extends horizontally

more than 50%

of its width

Minor Colour

Level of sample for approval set as limit sample uniformity

Major No unmelted solder paste should be present on PCB

PCB

Critical Cold solder joints, missing solder connections, or oxidation are not allowed Minor No residue or solder balls on PCB are allowed Critical Minor Tray

particles

Short circuits on components are not allowed

Size Quantity

On tray

On display

∅<0.2 ∅>0.25 ∅≥0.25

L = 3 1

Any number

4 2

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7.3 DEALING WITH CUSTOMER COMPLAINTS

7.3.1 Non-conforming analysis

Purchaser should supply Densitron with detailed data of non-conforming sample. After accepting it, Densitron should complete the analysis in two weeks from receiving the sample. If the analysis cannot be completed on time, Densitron must inform the purchaser.

7.3.2 Handling of non-conforming displays

If any non-conforming displays are found during customer acceptance inspection which Densitron is clearly responsible for, return them to Densitron. Both Densitron and customer should analyse the reason and discuss the handling of nonconforming displays when the reason is not clear. Equally, both sides should discuss and come to agreement for issues pertaining to modification of Densitron quality assurance standard.

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8 RELIABILITY SPECIFICATION

8.1 RELIABILITY TESTS

Test Item Test Condition Evaluation and assessment

High Temperature Operation 85°C, 500 hours

Low Temperature Operation -30°C, 500 hours

High Temperature Storage 90°C, 500 hours

Low Temperature Storage -40°C, 500 hours

High Temperature & High Humidity Storage

Thermal Shock

60°C, 90%RH, 500 hours

100 cycle of

-40°C ↔85°C 30 Mins dwell

No abnormalities in function and appearance No abnormalities in function and appearance No abnormalities in function and appearance No abnormalities in function and appearance No abnormalities in function and appearance No abnormalities in function and appearance

• The samples used for above tests do not include polarizer.

• No moisture condensation is observed during tests.

8.1.1 FAILURE CHECK STANDARD

After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure teat at 23±5 °C; 55±15% RH

8.2 LIFE TIME

Item Description

Function, performance, appearance, etc. shall be free from remarkable deterioration

1

more than 10,000 hours under 120 cd/m² brightness and 50% Checkerboard, humidity (50% RH), and in area not exposed to direct sunlight.

2 End of lifetime is specified as 50% of initial brightness.

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9 HANDLING PRECAUTIONS

Safety

If the panel breaks, be careful not to get the organic substance in your mouth or in your eyes. If the organic substance touches your skin or clothes, wash it off immediately using soap and plenty of water.

Mounting and Design

Place a transparent plate (e.g. acrylic, polycarbonate or glass) on the display surface to protect the display from external pressure. Leave a small gap between the transparent plate and the display surface. Design the system so that no input signal is given unless the power supply voltage is applied.

Caution during OLED cleaning

Lightly wipe the display surface with a soft cloth soaked with Isopropyl alcohol, Ethyl alcohol or Trichlorotriflorothane. Do not wipe the display surface with dry or hard materials that will damage the polariser surface. Do not use aromatic solvents (toluene and xylene), or ketonic solvents (ketone and acetone).

Caution against static charge

As the display uses C-MOS LSI drivers, connect any unused input terminal to V input any signals before power is turned on. Also, ground your body, work/assembly table and assembly equipment to protect against static electricity.

Packaging

Displays use OLED elements, and must be treated as such. Avoid strong shock and drop from a height. To prevent displays from degradation, do not operate or store them exposed directly to sunshine or high temperature/humidity.

Caution during operation

It is indispensable to drive the display within the specified voltage limit since excessive voltage shortens its life.

Other Precautions

When a display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module.

Storage

Store the display in a dark place where the temperature is 25°C ± 10°C and the humidity below 50%RH. Store the display in a clean environment, free from dust, organic solvents and corrosive gases. Do not crash, shake or jolt the display (including accessories).

or VSS. Do not

DD

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DENSITRON DD-12832BE-1A Product Specification

Specifications and Main Features

Frequently Asked Questions

User Manual