DENSITRON C0201QILK-C Product Specification

Page 1
Preliminary Product Specification
Module name: C0201QILK-C Issue date: 2008/06/24 Version: 1.5
Customer
Approved by Customer
Approved by CMEL
PD Division ENG Division QA Dept
Note:
1. The information contained herein may be change without prior notice. It is therefore advisable to contact Chi MEI ELCorp before designed your product based on this specification.
1
Page 2
Reversion History
Version Date Page Description
Ver.1.0 Ver.1.1 Ver.1.2
Ver1.3
Ver1.4 Ver1.5
2008/03/11 2008/03/12 2008/06/04
2008/06/19
2008/06/20 2008/06/24
All
Page17
Page3 Page17 Page18 Page19 Page12 Page13 Page12 Page19
Preliminary specification was first issued Modify the connector in the drawing Modify the pixel pitch size Modify the Panel drawing Add Reliability Test Add the Package drawing Modify Electro-Optical Characteristic table Modify Gamma Register Setting Modify IC Initial Register Setting Add RA condition Modify Low Temp. Operation
2
Page 3
1. Purpose:
This documentation defines general product specification for OLED module supplied by CMEL. The information described in this technical specification is tentative. Please Contact CMEL’s representative while your product is modified.
2. General Description:
Driving Mode: Active Matrix. Color Mode: Full Color (262K color) Driver IC: S6E63D6, COG Assembly Interface:
1. MPU i80-system 18-/16-/9-/8-bit bus interface
2. MPU i68-system 18-/16-/9-/8-bit bus interface
3. Serial data transfer interface
Application: Cell phone etc.. RoHS Compatible
3. Mechanical Data: No. Items Specification Unit
1 Diagonal Size 2 Resolution 3 Pixel Pitch 4 Active Area 5 Outline Area(M/F) 6 Thickness 7 Weight
2.0” Inch 176 xRGBx220
0.18×0.18
31.68×39.6
37.3×50.25
1.60 (Typ) mm
9.2 g
mm mm mm
3
Page 4
4. Absolute Maximum ratings:
(VSS=0V)
Item Symbol Unit Value Note
Power supply voltage 1 VDD3 V -0.3 ~ + 5.0
Power supply voltage 2 VCI V -0.3 ~ + 5.0
Input Voltage range Vin V -0.3 ~ VDD+0.5
Operating temperature Topr C -20 ~ + 60
Storage temperature Tstg C -40~ + 85
Notes:
(1) Absolute maximum rating is the limit value. When the IC is exposed operation environment beyond this range, the IC do not assure operations and may be damaged permanently, not be able to be recovered. (2) Absolute maximum rating is guaranteed only when our company’s package used.
4
Page 5
5. Electrical Characteristic:
5.1 DC Characteristic
5
Page 6
6
Page 7
5.2 AC Characteristic
5.2.1 CPU interface M68
7
Page 8
5.2.2 CPU interface M80
8
Page 9
Image Data format for 18bit CPU interface (262k color)
Image Data format for 16bit CPU interface (65k color)
Image Data format for 9bit CPU interface (262k color)
Image Data format for 8bit CPU interface (65K color) Case 1:
Case 2:
Image Data format for 8bit CPU interface (262K color)
9
Page 10
5.2.3 SPI
10
Page 11
(Note) RS=”0” : Index data
RS=”1” : Instruction data
11
Page 12
6. Electro-Optical Characteristic:
Items Symbol Min Typ. Max Unit Remark
Operating Luminance L 150 175 200 Cd/m
2
(1)(5)
Power Consumption Pon - 150 200 mW
30% pixels
on (1) Max. Current Icc - - 66 mA (1) Response Time Tres - - 50 us (2) CIEx (White) Wx 0.26 0.31 0.36 - (5) CIEy( White) W y 0.28 0.33 0.38 - (5) CIEx (Red) Rx 0.62 0.66 0.70 (5) CIEy( Red) Ry 0.30 0.34 0.38 (5) CIEx (Green) Gx 0.25 0.29 0.33 (5) CIEy( Green) Gy 0.61 0.65 0.69 (5) CIEx (Blue) Bx 0.11 0.15 0.19 (5) CIEy( Blue) By 0.12 0.16 0.20 (5) V iewing Angle VA 160 170 - Degree (3) Contrast CR 5000:1 10000:1 (4) Operation Lifetime LTop 20000 Hrs (1)(6)
Note:
Measuring surrounding: dark room Surrounding temperature: 25oC
IOVCC = 1.65V ~ 3.3V
1. T est condition:
a. AR_VDD= 4.6V+/- 0.03V, AR_VSS= -4.4V+/- 0.03V
b. IC Initial Register Setting: R01: 0x881C // Set scan line R02: 0x0000 R03: 0x0030 // 16bit mode R10: 0x0000 // IC stand by off R18: 0x0028 // Frame Rate=80Hz RF8: 0x000F // VGH=+5V RF9: 0x0019 // VGL=-7V R05: 0x0001 // Display On R35: 0x0000 // window display R36: 0x00DB // window display R37: 0x20CF // window display R20: 0x0020 // window display R21: 0x0000 // window display
12
Page 13
r
Gamma Register Setting: R70: 0x3480 R71: 0x3900 R72: 0x3C80 R73: 0x291F R74: 0x2119 R75: 0x3221 R76: 0x211A R77: 0x2C22 R78: 0x271D
2.response Time test condition
T
100% 90%
10%
3.Viewing angle test condition:
Viewing Angle= CR>10
Tf
Time
Vss(GND)
ψ=270°
4.Contrast
Luminance with all pixels white CR = Luminance with all pixels black
5.Optical tester: CA210
6. Brightness of 30% power consumption. Operating Life Time is defined when the luminance has decayed to less than 50% of the initial measured luminance before life test.
13
Page 14
7. System Diagram:
HOST S6E63D6
SPI
interface
CSB SDIN RW_WRB(SCL)
14
Page 15
8. Pin Assignment: PIN Symbol I/O Description Remarks
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
AR_VDD
AR_VSS
VCI
VCI1
GND
C12M
C12P
C11M
C11P
VLOUT1
C31P
C31M
C32P
C32M
VLOUT3
VLOUT2
Positive voltage for OLED
I
Nagative voltage for OLED
I
Power supply for analog circuit(2.5v~3.3v)
I
A reference voltage for 1st booster r(connect a 1u/10v capacitance to
O
gnd) Ground
I I
External capacitance connect pin between C12M and C12P (1u/10V)
I I
External capacitance connect pin between C11M and C11P (1u/10V)
I
1st booster output pin. (1u/10V)
O
I
External capacitance connect pin between C31M and C31P (1u/10V)
I I
External capacitance connect pin between C32M and C32P (1u/10V)
I
3rd booster output pin. (1u/16V)
O
2nd booster output pin. (1u/16V)
O
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
C21P
C21M
FLM
IOVCC
SPB
ID_MIB
DB17
DB16
DB15
DB14
DB13
DB12
DB11
DB10
DB9
I
External capacitance connect pin between C21M and C21P. (1u/10V)
I
Tearing effect output signal.
O
In normal operation, leave this pad open. I/O power supply
I
Select the CPU interface mode.
I
(0=parallel interface 1=serial interface) Select the CPU type
I
(0=intel 80x-system 1=motorola 68x-system) BI-directional data bus.
I/O
When CPU I/F, 18-bit interface : DB 17-0
I/O
16-bit interface : DB 17-10 , DB 8-1 9-bit interface : DB 8-0
I/O
8-bit interface : DB 8-1
I/O
When RGB I/F
I/O
18-bit interface : DB 17-0 18-bit interface : DB 17-0
I/O
16-bit interface : DB 17-10, DB 8-1
I/O
6-bit interface : DB 8-3
I/O
Fix unused pin to the VSS level
I/O
32
33
DB8
DB7
I/O I/O
15
Page 16
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
RW_WRB
49
50
51
52
53
E_RDB
RESETB
MVDD
VREG1OUT
54
55
56
57
DB6
DB5
DB4
DB3
DB2
DB1
DB0
NC
NC
NC
NC
SDI
SDO
CSB
RS
VCI
VGH
VGL
GND
I/O I/O I/O I/O I/O I/O I/O
For a serial peripheral interface(SPI), input data is fetched at the rising edge of the SCL signal, Fix SDI pin at VSS level if the pin
I
is not used. For a serial peripheral interface (SPI), serves as the serial data
olutput pin(SDO), Successive bits are output at the falling edge
I
of the SCL signal. Chip select signal input pin.
0= driver IC is selected and can be accessed.
I
1= driver IC is not selected and cannot be accessed.
Pin function CPU type Pin description
Read/Write operation
RW 68-system
I
WRB 80_system SCL SPI The synchronous clock signal
Register select pin. 0=Index/status, 1=instruction parameter, GRAM data
I
Must be fixed at VDD3 level when not used.
Pin Function CPU type Pin description
E 68-system
I
RDB 80_system When SPI mode is selected , fix this pin at VDD3 levle
Reset pin initializes the IC when low. Should be reset after
I
power-on.
Internal power for RAM. Connect a capacitance to gnd. Connect a
O
capacitance(1u/10v) to gnd. A reference level for the grayscale voltage. Connect a
O
capacitance(1u/10v) to gnd. Power supply for analog circuit(2.5v~3.3v)
I
The positive voltage used in the gate driver. Connect a
O
capacitance(1u/10v) to gnd. The negative voltage used in the gate driver. Connect a
O
capacitance(1u/10v) to gnd. Ground
selection pin 0=write 1=read Write strobe signal.(Input pin) Data is fetched at the rising edge.
Read/Writeoperation enable pin Read strobe signal. Read out data at the low level
58
X-
For touch screen
16
Page 17
59
60
61
Y- X+ Y+
For touch screen For touch screen For touch screen
17
Page 18
9. External Dimension:
18
Page 19
10. Reliability Test:
No. Items Specification
1 High Temp. Storage 85°C, 240hrs 2 Low Temp. Storage -40°C, 240hrs 3 High Temp. Operation 70°C, 240hrs 4 Low Temp. Operation -40°C, 240hrs 5 High Temp / Humidity Storage 85°C, 85%RH, 240hrs 6 High Temp / Humidity Operation 60°C, 90%RH, 240hrs
-40°C ~85°C (-40°C /30min; transit/3min;
7 Thermal shock
85°C /30min; transit /3min) 1cycle: 66min, 100 cycles Frequency: 5~50HZ, 0.5G Scan rate: 1 oct/min
8 Vibration
Time: 2 hrs/axis Test axis: X, Y, Z Height: Follow ISTA spec.
9 Drop
Sequence : 1 angle3 edges and 6 faces Cycles: 1
10 ESD Air discharge model, ±8kV, 10 times
Test and measurement conditions
All measurements shall not be started until the specimens attain to temperature stability.
The degradation of Polarizer is ignored for item 1, 5 & 6.
The test pattern at operating condition is 30%P.C. alternating pictures.
Evaluation Criteria
No damage to glass or encapsulation
No drastic change to display
Defects / Mura follow product specification
Luminance: Within +/-50% of initial value
Current consumption: within +/-50% of initial value
19
Page 20
11. Package:
20
Loading...