Dell™ Studio XPS™ 8100:
Comprehensive Specifications
This document provides information that you may need when setting up,
updating drivers for, and upgrading your computer.
NOTE: Offerings may vary by region. For more information regarding the configuration
of your computer, click Start → Help and Support and select the option to view
information about your computer.
Processor
®
Ty p e I n t e l
L1 cache 32 KB
L2 cache 256 KB/core
Core™ i7-870
Intel Core i7-860
Intel Core i7-750
Intel Core i5-670
Intel Core i5-661
Intel Core i5-660
Intel Core i5-650
Intel Core i3-540
Intel Core i3-530
Processor
L3 cache
Memory
Connectors four internally-accessible DDR3 DIMM
Capacities 1 GB, 2 GB, and 4 GB
Memory type 1066-MHz or 1333-MHz DDR3 DIMM;
Memory configurations possible 4 GB, 6 GB, 8 GB, 12 GB, and 16 GB
(continued)
Intel Core i5-670
Intel Core i5-661
Intel Core i5-660
Intel Core i5-650
Intel Core i3-540
Intel Core i3-530
Intel Core i7-750
Intel Core i7-870
Intel Core i7-860
upto 4 MB
upto 6 MB
upto 8 MB
sockets
non-ECC memory only
(64-bit operating system)
Computer Information
System chipset Intel H57
Data bus width 2.5 GT/s
DRAM bus width 64 bits
Processor address bus width 64 bits
RAID support (internal SATA drives
only)
BIOS chip (NVRAM) 8 MB
Memory speed 1333 Mhz
RAID 0 (striping)
RAID 1 (mirroring)
Drives and Devices
Externally accessible
• two 5.25-inch bays for SATA
DVD+/-RW Super Multi Drive or
Blu-ray Disc™ combo or Blu-ray
Disc RW drive
Internally accessible two 3.5-inch bays for SATA hard drives
Wireless (optional) WiFi/Bluetooth
®
wireless technology
Expansion Bus
PCI Express
• Gen2 x1 slot bi-directional speed —
500 MB/s
• Gen2 x16 slot bi-directional speed —
16 GB/s
PCI 32-bit speed — 33 MHz
SATA 2.0 1.5 Gbps and 3.0 Gbps
USB 2.0
• high speed — 480 Mbps
• full speed — 12 Mbps
• low speed — 1.2 Mbps
Memory Card Reader
Cards supported
Video
Integrated Intel® Graphics Media Accelerator HD
Discrete PCI Express x16 card
Audio
Type Integrated 7.1 channel, High Definition
• CompactFlash (CF) card
• Smart Media (SM) card
•xD-Picture (xD) card
• Memory Stick (MS) card
• Memory Stick Duo card
• Memory Stick PRO Duo card
• Memory Stick PRO (MSPRO) card
•Memory Stick PRO HG
(MSPRO HG) card
• SecureDigital (SD) card
• SecureDigital Card (SDHC) 2.0
• MultiMedia Card (MMC)
•MicroDrive (MD)
audio with S/PDIF support
System Board Connectors
Memory four 240-pin connectors
PCI one 124-pin connector
PCI Express x1 two 36-pin connectors
PCI Express x16 one 164-pin connector
Power (system board) one 24-pin EPS 12V connector
(ATX-compatible)
Processor fan one 4-pin connector
System Board Connectors
Chassis fan one 3-pin connector
Front USB connector five 9-pin connectors
Front audio connector one 9-pin connector for 2-channel stereo
SATA four 7-pin connectors
S/PDIF out one 5-pin connector
External Connectors
Network adapter RJ45 connector
USB two top-panel, two front-panel, and four
Audio top panel — one headphone and one
S/PDIF one S/PDIF (optical) connector
eSATA one back-panel connector
IEEE 1394a one back-panel 6-pin serial connector
HDMI 19-pin connector
DVI 24-pin connector
(continued)
sound and microphone
back-panel USB 2.0-compliant
connectors
microphone connector
back panel — six connectors for 7.1
support
Expansion Slots
PCI
Connectors
Connector size
Connector data width (maximum)
PCI Express x1
Connectors
Connector size
one
124-pin connector
32 bit
two
36-pin connector
Expansion Slots
Connector data width (maximum)
PCI Express x16
Connectors
Connector size
Connector data width (maximum)
Power
DC Power Supply
Wattage 350 W
Maximum heat dissipation 1836 BTU/hr
(continued)
1 PCI Express lane
one
164-pin connector
16 PCI Express lane
NOTE: Heat dissipation is calculated by using the power supply wattage rating.
Input voltage 115/230 VAC
Input frequency 50/60 Hz
Rated output current 8 A/4 A
Battery
Coin-cell battery 3-V CR2032 lithium coin cell
Physical
Height 407.75 mm (16.02 inches)
Width 185.81 mm (7.31 inches)
Depth 454.67 mm (17.90 inches)
Weight 10.18 kg (22.40 lb)
Computer Environment
Temperature range:
Operating
Storage
Relative humidity 20% to 80% (non-condensing)
10°C to 35°C (50°F to 95°F)
-40°C to 65°C (-40°F to 149°F)
Computer Environment
(continued)
Maximum vibration (using a random-vibration spectrum that simulates user
environment):
Operating
Storage
0.25 GRMS
2.2 GRMS
Maximum shock (measured with hard drive in head-parked position and a 2-ms
half-sine pulse):
Operating
Half-Sine Pulse: 40G for 2 ms with a
change in velocity of 20 in/s (51 cm/s)
Storage
Half-Sine Pulse: 50G for 26 ms with a
change in velocity of 320 in/s (813 cm/s)
Altitude (maximum):
Operating
Storage
-15.2 to 3048 m (-50 to 10,000 ft)
-15.2 to 10,668 m (-50 to 35,000 ft)
Airborne contaminant level G2 or lower as defined by ISA-S71.04-
1985
____________________
Information in this document is subject to change without notice.
© 2009 Dell Inc. All rights reserved.
Reproduction of these materials in any manner whatsoever without the written permission of Dell Inc. is
strictly forbidden.
Trademarks used in this text: Dell, the DELL logo, Studio XPS are trademarks of Dell Inc.; Intel is a
registered trademark and Core is a trademark of Intel Corporation in the U.S. and other countries; Microsoft,
Windows, and Windows start button logo are either trademarks or registered trademarks of Microsoft
Corporation in the United States and/or other countries.
Other trademarks and trade names may be used in this document to refer to either the entities claiming the
marks and names or their products. Dell Inc. disclaims any proprietary interest in trademarks and trade
names other than its own.
Model: D03M series Type: D03M001 October 2009 Rev. A00
Loading...