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Dell™ Studio XPS™ 8000 Comprehensive Specifications
This document provides information that you may need when setting up, updating drivers for, and upgrading your computer.
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Processor
Drives and Devices External
Memory Expansion
Computer Information Power
Expansion Bus Battery
Video Physical
Audio Computer
Memory Card Reader
System
Board
Connectors
Connectors
Slots
Environment
Information in this document is subject to change without notice.
© 2009 Dell Inc. All rights reserved.
Reproduction of these materials in any manner whatsoever without the written permission of Dell Inc. is strictly forbidden.
Trademarks used in this text: Dell, the DELL logo, and Studio XPS are trademarks of Dell Inc.; Intel is a registered trademark and Core is a
trademark of Intel Corporation in the U.S. and other countries; Blu- ray Disc is a trademark of the Blu- ray Disc Association; Bluetooth is a registered
trademark owned by Bluetooth SIG, Inc. and is used by Dell under license.
Other trademarks and trade names may be used in this document to refer to either the entities claiming the marks and names or their products.
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Model: D03M series Type: D03M001 August 2009 Rev. A00
Processor
Type
L1 cache 32 KB
L2 cache 256 KB
L3 cache 8 MB
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®
Intel
Core™ i7-870
Intel Core i7-860
Intel Core i5-750
Drives and Devices
Externally accessible two 5.25-inch bays for SATA
DVD+/-RW Super Multi Drive
or Blu-ray Disc™ combo or
Blu-ray Disc RW drive
one 3.5-inch bay for a
Flexdock or a Bluetooth
module
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Wireless (optional)
Internally accessible
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WiFi/Bluetooth
technology
two 3.5-inch bays for SATA hard
drives
wireless
Memory
Connectors four internally-accessible DDR3
DIMM sockets
Capacities 1 GB, 2 GB, and 4 GB
Memory type 1066-MHz or 1333 MHz DDR3
DIMM;
non-ECC memory only
Memory configurations
possible
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4 GB, 6 GB, 8 GB, 12 GB, and 16
GB
(64-bit operating system)
Computer Information
System chipset Intel P55
Data bus width 2.5 GT/s
DRAM bus width 64 bits
Processor address
bus width
RAID support (internal
SATA drives only)
BIOS chip (NVRAM) 8 MB
Memory speed 1333 Mhz
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64 bits
RAID 0 (striping)
RAID 1 (mirroring)
Expansion Bus
PCI Express Gen2 x1 slot bi-directional
speed — 500 MB/s
Gen2 x16 slot bi-directional
speed — 16 GB/s
PCI 32-bit speed — 33 MHz
SATA 2.0 1.5 Gbps and 3.0 Gbps
USB 2.0
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high speed — 480 Mbps
full speed — 12 Mbps
low speed — 1.2 Mbps
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Video
Discrete PCI Express x16 card
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Audio
Type Integrated 7.1 channel, High
Definition Audio with S/PDIF
support
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Memory Card Reader
Cards Supported CompactFlash (CF) Card
Smart Media (SM) Card
xD-Picture (xD) Card
Memory Stick (MS) Card
Memory Stick PRO
(MSPRO)Card
Memory Stick PRO HG
(MSPRO HG)Card
SecureDigital (SD) Card
SecureDigital Card (SDHC)
2.0
MultiMedia Card (MMC)
MicroDrive (MD)
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System Board Connectors
Memory four 240-pin connectors
PCI one 124-pin connector
PCI Express x1 two 36-pin connectors
PCI Express x16 one 164-pin connector
Power (System board) one 24-pin EPS 12V connector
(ATX-compatible)
Processor fan one 4-pin connector
Chassis fan one 3-pin connector
Front USB connector five 9-pin connectors
Front audio connector one 9-pin connector for 2-channel
stereo sound and microphone
SATA four 7-pin connectors
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S/PDIF out 5-pin connector
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External Connectors
Network adapter RJ45 connector
USB two top-panel, two front panel,
and four back-panel USB 2.0compliant connectors
Audio
S/PDIF one S/PDIF (optical) connector
eSATA one back-panel connector
IEEE 1394a one back-panel 6-pin serial
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top panel - headphone and
microphone connectors
back panel - six connectors
for 7.1 support
connector
Expansion Slots
PCI
Connectors one
Connector size 124-pin connector
Connector data width
(maximum)
PCI Express x1
32 bit
Connectors two
Connector size 36-pin connector
Connector data width
(maximum)
PCI Express x16
Connectors one
Connector size 164-pin connector
Connector data width
(maximum)
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1 PCI Express lane
16 PCI Express lane
Power
DC Power Supply
Wattage 350 W
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Maximum heat
1836 BTU/hr
(813 cm/s)
dissipation
NOTE: Heat dissipation is calculated by using the power
supply wattage rating.
Input voltage 115/230 VAC
Input frequency 50/60 Hz
Rated output current 8 A/4 A
Coin-cell battery 3-V CR2032 lithium coin cell
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Battery
Coin-cell battery 3-V CR2032 lithium coin cell
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Physical
Height 407.75 mm (16.02 inches)
Width 185.81 mm (7.31 inches)
Depth 454.67 mm (17.90 inches)
Weight 10.18 kg (22.40 lb)
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Computer Environment
Temperature range:
Operating 10°C to 35°C
(50°F to 95°F)
Storage -40°C to 65°C
(-40°F to 149°F)
Relative humidity 20% to 80%
(non-condensing)
Maximum vibration (using a random-vibration
spectrum that simulates user environment):
Operating 0.25 GRMS
Storage 2.2 GRMS
Maximum shock (measured with hard drive in
head-parked position and a 2-ms half-sine pulse):
Operating Half-Sine Pulse: 40G for 2 ms with
a change in velocity of 20 in/s
(51 cm/s)
Storage Half-Sine Pulse: 50G for 26 ms with
a change in velocity of 320 in/s
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Altitude (maximum):
Operating -15.2 to 3048 m
(-50 to 10,000 ft)
Storage -15.2 to 10,668 m
(-50 to 35,000 ft)
Airborne contaminant
level
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G2 or lower as defined by ISAS71.04-1985
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