Dell POWEREDGE R610 User Manual

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PowerEdge R610

Technical Guide

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This document is for informational purposes only. Dell reserves the right to make changes without further notice to any products herein. The content provided is as is and without express or implied warranties of any kind.

Dell, PowerEdge, and ReadyRails are trademarks of Dell, Inc. Citrix is a registered trademark and XenServer is a trademark of Citrix Systems, Inc. and/or one or more of its subsidiaries, and may be registered in the United States Patent and Trademark Office and in other countries. Intel and Xeon are registered trademarks of Intel Corporation in the U.S. and other countries. Broadcom is a registered trademark and NetXtreme is a trademark of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Matrox is a registered trademark of Matrox Electronic Systems Ltd. Microsoft and SQL Server are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. Red Hat is a registered trademark of Red Hat, Inc. in the United States and other countries. Linux is a registered trademark of Linus Torvalds. Symantec is a trademark owned by Symantec Corporation or its affiliates in the U.S. and other countries. VMware is a registered trademark and vSphere is a trademark of VMware, Inc. in the United States and/or other jurisdictions. Other trademarks and trade names may be used in this document to refer to either the entities claiming the marks and names or their products. Dell disclaims proprietary interest in the marks and names of others.

©Copyright 2011 Dell Inc. All rights reserved. Reproduction or translation of any part of this work beyond that permitted by U.S. copyright laws without the written permission of Dell Inc. is unlawful and strictly forbidden.

Revision 1 January 2011

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Table of Contents

1 Product Comparison ........................................................................................... 7

1.1 Overview .................................................................................................. 7

1.1.1 Strong IT Foundation............................................................................... 7

1.1.2 Customer-Inspired Design ......................................................................... 7

1.1.3 Enhanced Virtualization ........................................................................... 7

1.1.4 Energy Efficient .................................................................................... 7

1.1.5 Easy to Manage ..................................................................................... 8

1.1.6 Dell Services ........................................................................................ 8

1.2 Comparison ............................................................................................... 8

2 Key Technologies ............................................................................................. 11

2.1 Overview ................................................................................................ 11

2.2 Detailed Information .................................................................................. 11

3 System Overview ............................................................................................. 12

4 Mechanical .................................................................................................... 15

4.1 Chassis Description..................................................................................... 15

4.2 Dimensions and Weight ................................................................................ 15

4.3 Front Panel View and Features ...................................................................... 15

4.4 Back Panel View and Features ....................................................................... 16

4.5 Power Supply Indicators ............................................................................... 16

4.6 NIC Indicators ........................................................................................... 17

4.7 Internal Chassis Views ................................................................................. 17

4.8 Rails and Cable Management ......................................................................... 18

4.8.1 ReadyRails Sliding Rails ......................................................................... 18

4.8.2 ReadyRails Static Rails .......................................................................... 18

4.9 Fans ...................................................................................................... 18

4.10 LCD Control Panel ...................................................................................... 18

4.11 Security .................................................................................................. 19

4.11.1 Cover Latch ....................................................................................... 19

4.11.2 Bezel ............................................................................................... 19

4.11.3 Hard Drive ......................................................................................... 19

4.11.4 TPM ................................................................................................. 19

4.11.5 Power Off Security ............................................................................... 20

4.11.6 Intrusion Alert .................................................................................... 20

4.11.7 Secure Mode ...................................................................................... 20

4.12 USB Key .................................................................................................. 20

4.13 Battery ................................................................................................... 20

4.14 Field Replaceable Units (FRU)........................................................................ 20

4.15 User Accessible Jumpers, Sockets, and Connectors ............................................... 20

5 Power, Thermal, Acoustic .................................................................................. 21

5.1 Power Efficiencies ..................................................................................... 21

5.2 Main Power Supply ..................................................................................... 21

5.3 Power Supply Specifications .......................................................................... 22

5.4 Heat Dissipation ........................................................................................ 22

5.5 Environmental Specifications......................................................................... 22

5.6 Power Consumption Testing .......................................................................... 23

5.7 Energy Smart Enablement ............................................................................ 24

5.8 Energy Star Compliance ............................................................................... 24

5.9 Acoustics ................................................................................................ 24

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6 Processors ..................................................................................................... 25

6.1 Overview ................................................................................................ 25

6.2 Features ................................................................................................. 26

6.3 Supported Processors .................................................................................. 26

6.4 Processor Configurations .............................................................................. 27

6.4.1 Single Processor Configuration ................................................................. 27

6.4.2 Processor Power Voltage Regulation Modules (EVRD 11.1) ................................. 27

6.5 Processor Installation .................................................................................. 27

7 Memory ........................................................................................................ 28

7.1 Overview ................................................................................................ 28

7.2 DIMMs Supported ....................................................................................... 28

7.2.1 Memory Modes .................................................................................... 28

7.2.2 DIMM Population Rules .......................................................................... 29

7.3 Speed .................................................................................................... 29

7.4 DIMM Slots ............................................................................................... 30

7.5 Low Voltage DIMMs ..................................................................................... 30

7.6 Mirroring ................................................................................................. 30

7.7 Sparing ................................................................................................... 30

7.8 Memory Scrubbing...................................................................................... 31

7.9 Advanced ECC (Lockstep) Mode ...................................................................... 31

7.10 Optimizer (Independent Channel) Mode ............................................................ 31

7.11 Supported Configurations ............................................................................. 31

8 Chipset ........................................................................................................ 32

8.1 Intel I/O Hub (IOH) .................................................................................... 32

8.2 IOH QuickPath Interconnect (QPI) ................................................................... 32

8.3 IOH PCI Express ......................................................................................... 32

8.4 Intel I/O Controller Hub 9 (ICH9) .................................................................... 32

9 BIOS ............................................................................................................ 34

9.1 Overview ................................................................................................ 34

9.2 Supported ACPI States ................................................................................. 34

9.3 I2C (Inter-Integrated Circuit) ......................................................................... 34

10 Embedded NICs/LAN on Motherboard (LOM) ............................................................. 36

11 PCI Slots ....................................................................................................... 37

11.1 Overview ................................................................................................ 37

11.2 PCI Riser Restrictions .................................................................................. 37

11.3 Quantities and Priorities .............................................................................. 37

11.4 PCI Card Dimensions ................................................................................... 37

12 Storage ........................................................................................................ 38

12.1 Overview ................................................................................................ 38

12.2 Internal Hard Disk Drives .............................................................................. 38

12.2.1 Hard Disk Drive Carriers ......................................................................... 38

12.2.2 Empty Drive Bays ................................................................................. 39

12.2.3 Diskless Configuration Support ................................................................. 39

12.2.4 Hard Drive LED Indicators ....................................................................... 39

12.3 RAID Configurations .................................................................................... 39

12.4 Storage Controllers .................................................................................... 41

12.4.1 SAS 6/iR ........................................................................................... 41

12.4.2 PERC 6/i ........................................................................................... 42

12.4.3 PERC H200 ......................................................................................... 42

12.4.4 PERC H700 ......................................................................................... 42

12.5 Optical Drives ........................................................................................... 43

12.6 Tape Drives ............................................................................................. 43

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12.7 External Storage Support ............................................................................. 43

13 Video ........................................................................................................... 44

14 Rack Information ............................................................................................. 45

14.1 Overview ................................................................................................ 45

14.2 Rails ...................................................................................................... 45

14.3 Cable Management Arm (CMA) ....................................................................... 47

14.4 Rack View ............................................................................................... 47

15 Operating Systems ........................................................................................... 50

16 Systems Management ........................................................................................ 51

16.1 Overview ................................................................................................ 51

16.2 Server Management .................................................................................... 51

16.3 Embedded Server Management ...................................................................... 52

16.4 Dell Lifecycle Controller and Unified Server Configurator ....................................... 52

16.5 Integrated Dell Remote Access Controller .......................................................... 52

16.6 iDRAC6 Express ......................................................................................... 53

16.7 iDRAC6 Enterprise ...................................................................................... 53

16.8 iDRAC6 Enterprise with Virtual Flash (vFlash) Media ............................................. 53

17 Peripherals .................................................................................................... 56

Appendix A. Certifications ..................................................................................... 57

A.1 Regulatory Certifications ............................................................................. 57

A.2 Product Safety Certifications ......................................................................... 57

A.3 Electromagnetic Compatibility ....................................................................... 58

A.4 Ergonomics, Acoustics and Hygienics ............................................................... 59

Appendix B. Additional Information and Options ........................................................... 60

Tables

Table 1. Product Comparison to PowerEdge R510 and R710 .............................................. 8

Table 2. Product Features Summary ........................................................................ 12

Table 3. Power Supply Status ................................................................................ 16

Table 4. Power Supply Specifications ....................................................................... 22

Table 5. Environmental Specifications ...................................................................... 22

Table 6. Power Consumption Testing ....................................................................... 23

Table 7. Acoustical Performance ............................................................................ 24

Table 8. Intel Xeon 5500 and 5600 Processor Series Features ........................................... 25

Table 9. Supported Processors ............................................................................... 26

Table 10. Supported Hard Drives .............................................................................. 38

Table 11. Factory RAID Configurations ....................................................................... 39

Table 12. Storage Card Support Matrix ....................................................................... 42

Table 13. Graphics Video Modes .............................................................................. 44

Table 14. Supported Racks ..................................................................................... 46

Table 15. Rail Adjustability Ranges and Depth ............................................................. 47

Table 16. Unified Server Configurator Features and Description......................................... 52

Table 17. Features List for Base Management Functionality, iDRAC, and vFlash ...................... 54

Table 18. Product Safety Certifications ...................................................................... 57

Table 19. Electromagnetic Compatibility Certifications ................................................... 58

Table 20. Ergonomics, Acoustics and Hygienics ............................................................. 59

Table 21. Industry Standards .................................................................................. 60

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Figures

Figure 1. Chassis Dimensions ................................................................................. 15

Figure 2. Front View ........................................................................................... 16

Figure 3. Front View (With Optional Bezel) ................................................................ 16

Figure 4. Back View ............................................................................................ 16

Figure 5. Internal Chassis View .............................................................................. 17

Figure 6. Control Panel ....................................................................................... 19

Figure 7. Power Supplies ...................................................................................... 21

Figure 8. Dell 2.5‖ Hard Drive Carrier ...................................................................... 39

Figure 9. R610 Sliding Rails with Optional CMA ............................................................ 45

Figure 10. R610 Static Rails .................................................................................... 46

Figure 11. R610 Mounted in the A1 Sliding Rails ............................................................ 48

Figure 12. R610 Mounted in the B1 Sliding Rails with the CMA ........................................... 48

Figure 13. R610 Mounted in the A2 Static Rails (2-post Center Mount Configuration) ................ 49

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1 Product Comparison

1.1 Overview

The Dell™ PowerEdge™ R610 is a 2-socket 1U rack server that offers simplified management, purposeful design, and energy efficiency that can help you better manage your enterprise IT environment.

1.1.1 Strong IT Foundation

The Dell PowerEdge R610 is a key building block for today’s data center. Designed for versatility and

high performance, it provides many of the virtualization, system management, and energy-efficiency features you need now and the scalability necessary to change as your business grows. This general purpose Intel® processor-based server is ideal for corporate data centers and remote sites that require a dense, highly available single- or dual-processor server at an excellent value.

1.1.2 Customer-Inspired Design

Dell PowerEdge 11th generation servers are designed to meet customer needs with excellent reliability, security, and commonality to make the experience easier. We put all external ports, power supplies, LCD screens, and LED lights in the same location for a familiar experience as well as easy installation and deployment.

The PowerEdge R610 embodies the Dell PowerEdge 11th generation portfolio specifications. The R610 features robust metal hard drive carriers and organized cabling, designed to help improve component access and airflow across the server. The R610 also has either an interactive LCD screen or an LED display positioned on the front of the server for easy monitoring and troubleshooting.

1.1.3 Enhanced Virtualization

Featuring Intel® Xeon® processors, embedded hypervisors, and expanded memory footprint and I/O, the Dell PowerEdge R610 delivers exceptional overall system performance and significant virtual machine-per-server capacity. With optional factory-integrated virtualization capabilities, you get tailored solutions—built with the latest technologies from Dell and our trusted partners—which allow you to streamline deployment and simplify virtual infrastructures. Choose your hypervisor from market leaders such as VMware®, Citrix®, and Microsoft®, and enable virtualization with a few mouse clicks.

1.1.4 Energy Efficient

The PowerEdge R610 incorporates Energy Smart design using efficient power supply units, low-flow fans, and a logical component layout of the internal components which aids airflow direction, helping keep the server cool and reduce noise as much as possible. In addition, advanced thermal control helps optimize performance while minimizing system power consumption. This provides better energy efficiency with policy-driven power and thermal management and highly efficient standards-based Energy Smart components.

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Feature

R510

R610

R710

Processor

Intel® Xeon® processor 5500 and 5600 series

Form Factor

2U rack

1U rack

2U rack

Front Side Bus

Intel® QuickPath Interconnect (QPI)

6.4GT/s

Intel® QuickPath Interconnect (QPI)

6.4GT/s

Intel® QuickPath Interconnect (QPI)

6.4GT/s

# Sockets

2 2 2

# Cores

2, 4, or 6

L2/L3 Cache

4MB, 8MB, and 12BM

4MB, 8MB, and 12MB

Chipset

Intel® 5500

Intel® 5520

DIMMs

8 DDR3

12 DDR3

18 DDR3

Min/Max RAM

1GB/128GB

1GB/192GB

1GB/288GB

Drive Bays

4 x 3.5‖, or 8 x 3.5‖ or 2.5‖, or 12 x 3.5‖ or 2.5‖ + 2 x

internal 2.5‖

6 x 2.5‖

4 x 3.5" with optional flex bay,

6 x 3.5" without flex bay, or

8 x 2.5‖

Hard Drive Types

SAS, SATA, and SSD

Hot-plug SAS and SATA, nearline SAS and SSD

1.1.5 Easy to Manage

The PowerEdge R610 lets you devote more focus to running your business. The optional advanced embedded systems management engine, Lifecycle Controller, automates common management tasks, and gives you zero-media, low-touch deployment that is efficient, secure, and user-friendly. Lifecycle Controller works with the standard iDRAC Express or optional iDRAC Enterprise to help simplify administrator tasks by performing a comprehensive set of provisioning functions such as system deployment, system updates, hardware configuration, and diagnostics from a single intuitive interface called Unified Server Configurator (USC) in a pre-OS environment. This helps eliminate the need to use and maintain multiple pieces of disparate CD/DVD media. With Dell Lifecycle Controller server deployment automation, the R610 can be up and running fast.

Also part of the Dell OpenManage™ portfolio is the Dell Management Console (DMC) which is included with every Dell server and provides IT administrators with a consolidated console view of their IT infrastructure.

1.1.6 Dell Services

Dell Services can help reduce IT complexity, lower costs, and eliminate inefficiencies by making IT and business solutions work harder for you. The Dell Services team takes a holistic view of your needs and designs solutions for your environment and business objectives while leveraging proven delivery methods, local talent, and in-depth domain knowledge for the lowest total cost of ownership (TCO).

1.2 Comparison

Table 1. Product Comparison to PowerEdge R510 and R710

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Feature

R510

R610

R710

External Drive Bay(s)

Four- and eight-drive chassis: optional internal SATA slimline optical drives such as DVD-ROM or DVD+RW

Twelve-drive chassis: N/A

Optional internal SATA slimline optical drives such as DVD-ROM or DVD+RW

Optional flex bay expansion to support half-height tape backup unit

Embedded Hard Drive Controller

PERC 6/i, SAS 6/iR, PERC H200, PERC H700, PERC S100, PERC S300

PERC 6/i, SAS 6/iR, PERC H200, PERC H700

Optional Storage Controller

Non-RAID: SAS 5/E

LSI 2032 (for tape backup unit only)

6Gps SAS HBA RAID: SAS 6/iR

PERC 6/i PERC 6/E PERC H200 PERC H700 PERC H800

Software RAID: PERC S100 (4-drive

chassis only) PERC S300 (4- and 8drive chassis only)

Non-RAID: SAS 5/E

LSI 2032 (for tape backup unit only)

6Gps SAS HBA RAID: SAS 6/iR

PERC 6/i PERC 6/E PERC H200 PERC H700 PERC H800

Non-RAID: SAS 5/E

LSI 2032 (for tape backup unit only)

6Gps SAS HBA RAID: SAS 6/iR

PERC 6/i PERC 6/E PERC H200 PERC H700 PERC H800

Availability

Hot-plug hard drives, redundant power, quad-pack LED diagnostic

or LCD (with hot-plug hard drive chassis),

memory mirroring

Hot-plug hard drives, hot-plug redundant

power and cooling, ECC memory, Single Device Data

Correction (SDDC), memory demand and

patrol scrubbing, high-availability failover

cluster

Hot-plug hard drives, hot-plug redundant

power and cooling, ECC memory, Single Device Data

Correction (SDDC), memory demand and

patrol scrubbing, high-availability failover

cluster

Server Management

BMC, IPMI 2.0, Dell OpenManage™

Optional: iDRAC6 Express, iDRAC 6 Enterprise, vFlash

iDRAC6 Express, BMC, IPMI 2.0, Dell OpenManage™

Optional: iDRAC6 Enterprise, vFlash

iDRAC6 Express, BMC, IPMI 2.0, Dell OpenManage™

Optional: iDRAC6 Enterprise, vFlash

I/O Slots

3 PCIe + 1 storage slot or 1 PCIe + 1 storage slot

2 PCIe x8 G2

2 PCIe x8 + 2 PCIe x4 G2 or

1 x PCIe x16 + 2 PCIe x4 G2

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Feature

R510

R610

R710

RAID

SAS 6/iR and PERC H200: RAID 0, 1

PERC 6/i and PERC H700: RAID 0, 1, 5, 6, 10, 50, 60

PERC S100: 0, 1, 5, 10 PERC S300: 0, 1, 5, 10

SAS 6/iR and PERC H200: RAID 0, 1

PERC 6/i and PERC H700: RAID 0, 1, 5, 6, 10, 50, 60

SAS 6/iR and PERC H200: RAID 0, 1

PERC 6/i and PERC H700: RAID 0, 1, 5, 6, 10, 50, 60

NIC/LOM

Broadcom® BCM5716 2 x iSCSI TOE

Optional: various NICs available

Broadcom® BCM5709C 4 x iSCSI TOE

Optional: various NICs available

Broadcom® BCM5709C 4 x iSCSI TOE

Optional: various NICs available

USB

2 front, 2 back, 2 internal

2 front, 2 back, 1 internal

Power Supplies

Four-drive chassis: non-redundant, 480W

Eight-drive and twelvedrive chassis: hot-plug redundant 750W

Two redundant hot-plug high efficiency 502W or

two redundant hot-plug high output 717W

Two redundant hot-plug high efficiency 570W or

two redundant hot-plug high output 870W

Fans

Four-drive chassis: four non-redundant, non-hotpluggable fans

Eight-drive chassis: five non-redundant, non-hotpluggable fans

Twelve-drive chassis: five redundant, non-hotpluggable, dual-rotor fans

Six dual-rotor fans (dual processor configuration) or

five dual-rotor fans (single processor configuration)

Five hot-plug fans (default processor configuration) or

four hot-plug fans (single processor configuration)

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2 Key Technologies

2.1 Overview

Key features of the PowerEdge R610 include dual Intel® Xeon® 5500 and 5600 series quad-core and six-core processors, Intel® 5500 chipset I/O Hub (IOH) with QuickPath Architecture, DDR3 memory, DIMM thermal sensors, PCI Express Generation 2, iDRAC with integrated video controller, dual-port embedded Gigabit Ethernet controllers, Internal SD Module, iDRAC6 Express, and optional iDRAC6 Enterprise.

2.2 Detailed Information

The Intel® Xeon® processor 5500 and 5600 series is designed specifically for servers and workstation applications. The processor features quad-core and six-core processing to maximize performance and performance/watt for data center infrastructures and highly dense deployments. The processor also features the Intel Core™ micro-architecture and Intel 64 architecture for flexibility in 64-bit and 32bit applications and operating systems. See section 6 for more information.

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Feature

Technical Specification

Form Factor

1U rack

Processors

Dual-core, quad-core, or six-core Intel® Xeon® processors 5500 and 5600 series

Processor Sockets

Front Side Bus or HyperTransport

Intel® QuickPath Interconnect (QPI)

Cache

Up to 12MB

Chipset

Intel® 5520

Memory1

Up to 192GB (12 DIMM slots): 1GB/2GB/4GB/8GB/16GB DDR3 800MHz, 1066MHz, or 1333MHz

I/O Slots

Two PCIe x8 Gen2

RAID Controller

Internal Controllers:

PERC H200 (6Gb/s) PERC H700 (6Gb/s) (non-

volatile battery-backed cache: 512MB, 1GB)

SAS 6/iR PERC 6/i (battery-backed

cache: 256MB)

External Controllers: PERC H800 (6Gb/s) (non-volatile

battery-backed cache: 512MB, 1G) PERC 6/E (battery-backed cache:

256MB, 512MB) External HBAs (non-RAID): 6Gb/s SAS HBA SAS 5/E HBA LSI2032 PCIe SCSI HBA

Drive Bays

Internal hard drive bay and hot-plug backplane, up to six 2.5‖ SAS, SATA, or SSD Drives

Maximum Internal Storage

6TB (with six 1TB NL SAS drives)

Hard Drives1

2.5‖ SAS (15,000 rpm): 73GB, 146GB

2.5‖ SAS (10,000 rpm): 146GB,

300GB, 600GB

2.5‖ nearline SAS (7,200 rpm):

500GB, 1TB

2.5‖ SATA (7,200 rpm): 250GB, 500GB

2.5‖ SATA SSD: 50GB, 100GB

2.5‖ SAS SSD: 149GB

3 System Overview

For the latest information on supported features for the PowerEdge R610, visit Dell.com.

Table 2. Product Features Summary

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Feature

Technical Specification

Communications

Two dual-port embedded Broadcom® NetXtreme II™ 5709C Gigabit Ethernet NICs with failover and load balancing.

Optional 1GBe and 10GBe add-in NICs:

Broadcom® NetXtreme II® 57711 Dual Port Direct Attach 10Gb Ethernet PCI-Express Network Interface Card with TOE and iSCSI Offload

Intel® Gigabit ET Dual Port Server Adapter and Intel® Gigabit ET Quad Port Server Adapter

Dual Port 10GB Enhanced Intel Ethernet Server Adapter X520-DA2 (FCoE Ready for Future Enablement)

Brocade® CNA Dual-port adapter Emulex® CNA iSCSI HBA stand up adapter OCE10102-IX-D Emulex® OCE10102-IX-DCNA iSCSI HBA stand-up adapter

Optional add-in HBAs:

Brocade® 8 GB HBAs

Power Supply

One or two hot-plug high-efficiency 502W Energy Smart power supplies or

One or two hot-plug 717W high-output power supplies

Availability

DDR3 memory, ECC, hot-plug hard drives, optional hot-plug redundant power supplies, dual embedded NICs with failover and load balancing support, optional PERC6/i integrated daughtercard controller with battery-backed cache (or other controllers with battery-backed cache or non-volatile cache), hot-plug redundant cooling, toolless chassis, fibre and SAS cluster support, validated for Dell/EMC SAN

Video

Integrated Matrox® G200 (8MB shared video memory)

Remote Management

iDRAC6 Enterprise (optional)

Systems Management

Dell™ OpenManage™

Rack Support

ReadyRails™ sliding rails with optional cable management arm for 4post racks (optional adapter brackets required for threaded hole racks)

ReadyRails™ static rails for 2-post and 4-post racks

Operating Systems

Microsoft® Windows® Small Business Server 2008 Microsoft® Windows® Essential Business Server 2008 Microsoft® Windows Server® 2008 SP2, x86/x64 (x64 includes

Hyper-V™) Microsoft® Windows Server® 2008 R2, x64 (includes Hyper-V™ v2) Microsoft® Windows® HPC Server 2008 Novell® SUSE® Linux® Enterprise Server Red Hat® Enterprise Linux® Sun® Solaris™

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Feature

Technical Specification

Operating Systems

Optional Embedded Hypervisors:

Citrix® XenServer™ Microsoft® Hyper-V™ through Microsoft® Windows Server® 2008 VMware® vSphere™ 4.1 (including VMware ESX® 4.1 or VMware

ESXi™ 4.1) For more information on the specific versions and additions, visit

www.dell.com/OSsupport.

Featured Database Applications

Microsoft® SQL Server® solutions (see Dell.com/SQL) Oracle® database solutions (see Dell.com/Oracle)

GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded

material and operating environment and will be less.

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Za (With Bezel)

Za (Without Bezel)

Max Weight

482.44 mm

424.0 mm

42.6 mm

35.0 mm

21.0 mm

737.3 mm

772.0 mm

17.69 kg

4 Mechanical

4.1 Chassis Description

The PowerEdge R610 is a 1U rack-mount design that supports the following features:

 New LCD control panel, bezel, and hard-drive carriers  Toolless rack latches  Pull-out tray for customer labels  Embedded NIC 1 and iDRAC MAC addresses  Support for persistent storage:

o Internal USB and SD card slot o One external vFlash media slot (on optional iDRAC6 Enterprise card)

 Updated power supplies and removal process

4.2 Dimensions and Weight

Figure 1 details the dimensions and weight for the PowerEdge R610.

Figure 1. Chassis Dimensions

4.3 Front Panel View and Features

Figure 2 and Figure 3 show the front views of the PowerEdge R610.

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LED

Power Supply Status

AC Power is not present

AC Power is present

Fault of any kind is detected

DC Power is applied to the system

↔

Redundant power supply mismatch (when hot-plugged/swapped)

Figure 2. Front View

Figure 3. Front View (With Optional Bezel)

See the Front-Panel Features and Indicators section in the About Your System chapter of the PowerEdge R610 Hardware Owner’s Manual on Support.Dell.com for more information.

4.4 Back Panel View and Features

Figure 4 shows the back view of the PowerEdge R610.

Figure 4. Back View

See the Back-Panel Features and Indicators section in the About Your System chapter of the PowerEdge R610 Hardware Owner’s Manual on Support.Dell.com for more information.

4.5 Power Supply Indicators

The PowerEdge R610 redundant power supplies have one status bi-color LED: green for AC power present and amber for a fault as detailed in Table 3.

Table 3. Power Supply Status

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See the Power Indicator Codes section in the About Your System chapter of the PowerEdge R610 Hardware Owner’s Manual on Support.Dell.com for more information.

4.6 NIC Indicators

See the NIC Indicator Codes section in the About Your System chapter of the PowerEdge R610 Hardware Owner’s Manual on Support.Dell.com for more information.

4.7 Internal Chassis Views

Figure 5 shows the internal view of the PowerEdge R610 server.

Figure 5. Internal Chassis View

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4.8 Rails and Cable Management

4.8.1 ReadyRails Sliding Rails

ReadyRailsTM Sliding Rails for 4-post racks support the following:

 Toolless installation in 19‖ EIA-310-E compliant square or unthreaded round hole 4-post racks

including all generations of Dell racks

 Full extension of the system out of the rack to allow serviceability of key internal components  Optional cable management arm (CMA) except on racks less than 1m in depth, including Dell

4200 and 2400 racks

 Threaded 4-post racks require the ReadyRails™ static rails listed below or third-party offerings

available through Dell Software and Peripherals

4.8.2 ReadyRails Static Rails

ReadyRailsTM Static Rails for 4-post and 2-post racks support the following:

 Toolless installation in 19‖ EIA-310-E compliant square or unthreaded round hole 4-post racks

including all generations of Dell racks

 Tooled installation in 19‖ EIA-310-E compliant threaded hole 4-post and 2-post racks

See section 14 for more details.

4.9 Fans

Six dual-rotor 40 mm fans are mounted in a fan assembly that is located in the chassis between the hard drive bay and the processors. Only five fans are populated in systems with a single processor configuration. Each fan has a connector that plugs directly into the planar. The R610 fans cannot be hot-swapped. There are six fan zones in the R610, with one zone for each system fan.

The Embedded Server Management logic in the system controls and monitors the speed of the fans. A fan failure or over-temperature in the system results in a notification from iDRAC6.

The R610 Power Supply Units do not have any integrated fans; they are cooled by the system fans in front of them. The system requires a power-supply blank (metal cover) in place of the empty power supply slot. System fan speed is pulse-width modulated. Redundant cooling is supported.

To provide cooling when the system is off, both rotors in FAN_MOD1 run off Vaux power at a low speed setting when the ambient air temperature in the power supply passes a pre-defined threshold. The iDRAC controls the fan in AutoCool mode.

4.10 LCD Control Panel

The LCD control panel is located on the front of the system chassis to provide user access to buttons,

display, and I/O interfaces. See Figure 6. The control panel includes the following features:

 ACPI-compliant power button with an integrated green power LED (controlled by iDRAC6)  128x20 pixel LCD with controls:

o Two navigation buttons o Select button o System ID button

 Non-maskable Interrupt (NMI) button (recessed)  Ambient temperature sensor

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Figure 6. Control Panel

The LCD panel is a graphics display controlled by the iDRAC6. Both iDRAC6 and BIOS can send error codes and messages to the display.

The system's LCD panel provides system information and status messages to signify when the system is operating correctly or when the system needs attention.

BIOS has the ability to enter a secure mode through Setup, which locks the Power and NMI buttons. When in this mode, the power button can still be used to turn on the server even when the power button is disabled in System Setup.

For more information on the LCD panel, see the LCD Panel Features section in the About Your System chapter in the PowerEdge R610 Hardware Owner’s Manual on Support.Dell.com.

4.11 Security

For additional information regarding the following security features, see the PowerEdge R610 Hardware Owner’s Manual on Support.Dell.com.

4.11.1 Cover Latch

The PowerEdge R610 comes with a coin lock entry latch on the top cover of the unit and provides security for the entire system. The lock provides for toolless access to the chassis.

4.11.2 Bezel

A metal bezel is mounted to the chassis. A lock on the bezel is used to protect un-authorized access to system peripherals and the control panel. System status on the LCD is viewable even when the bezel is installed.

4.11.3 Hard Drive

The optional front bezel of the system contains a lock which secures the system hard drives. Some hard drives can still be unplugged from the backplane with the bezel present, but they cannot be removed from the chassis.

4.11.4 TPM

The TPM is used to generate and store keys, protect and authenticate passwords, and create and store digital certificates. The TPM can also be used to store Microsoft® BitLocker™ keys for hard drive

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encryption features in Microsoft® Windows Server® 2008. TPM is enabled through a BIOS option and uses HMAC-SHA1-160 for binding.

4.11.5 Power Off Security

The control panel is designed so the power switch cannot be accidentally activated. The lock on the bezel secures the switch behind the bezel. In addition, there is a setting in the CMOS setup that disables the power button function.

4.11.6 Intrusion Alert

A switch mounted on Riser 2 is used to detect chassis intrusion. When the cover is opened, the switch circuit closes and indicates intrusion to the iDRAC6. When enabled, the software can provide notification that the cover has been opened.

4.11.7 Secure Mode

BIOS has the ability to enter a secure boot mode through Setup. This mode includes the option to lock out the power and NMI switches on the control panel or set up a system password.

4.12 USB Key

The port on the control panel is for an optional USB key and is located inside the chassis. Some possible applications of the USB key are listed as follows:

 User custom boot and pre-boot OS for ease of deployment or diskless environments  USB license keys for software applications like eToken™ or Sentinel Hardware Keys  Storage of custom logs or scratch pads for portable user defined information (not hot-

swappable)

4.13 Battery

A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the Real-Time Clock and CMOS RAM on the ICH9 chip.

4.14 Field Replaceable Units (FRU)

The planar contains a serial EEPROM to contain FRU information including Dell part number, part revision level, and serial number. The backplane storage enclosure processor (SEP) and the power supply microcontrollers are also used to store FRU data.

4.15 User Accessible Jumpers, Sockets, and Connectors

See the Jumpers and Connectors chapter in the PowerEdge R610 Hardware Owner’s Manual on

Support.Dell.com.

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5 Power, Thermal, Acoustic

5.1 Power Efficiencies

One of the main features of the 11G family of servers is enhanced power efficiency. The R610 achieves higher power efficiency by implementing the following features:

 User-selectable power cap (subsystems throttle to maintain the specified power cap)  Improved power budgeting  Power-supply and voltage-regulator (VR) efficiency improvements  Use of switching regulators instead of linear regulators  Closed-loop thermal throttling  Increased rear venting and 3D venting  Pulse-width modulated (PWM) fans with an increased number of fan zones and configuration-

dependent fan speeds

 Use of DDR3 memory (lower voltage compared to DDR2, UDIMM)  Processor VR dynamic phase shedding  Memory VR static phase shedding  Random time interval for system start  Ability for an entire rack to power on without exceeding the available power  BIOS Power/Performance options page  Active Power Controller (BIOS-based CPU P-state manager)  Ability to power down or throttle memory  Ability to disable a processor core  Ability to turn off embedded NICs or PCIe lanes when not being used  Option to run PCIe at Gen1 speeds instead of Gen2

5.2 Main Power Supply

The base redundant R610 system consists of two hot-plug 502W Energy Smart (energy efficient) power supplies in a 1+1 configuration. A 717W high-output power supply is also available.

The power supplies connect directly to the planar. There is a power cable to connect between the planar and the backplane. The R610 power supplies do not have embedded cooling fans; they are cooled only by the system cooling fans.

Field replaceable unit (FRU) data is stored in the memory of the power supply microcontroller. Additionally, the power supply firmware can be updated by the iDRAC over the PMBus.

In a single power supply configuration, the power supply is installed in PS1 location and a power supply blank (metal cover) is installed in PS2 location for proper system cooling.

Figure 7. Power Supplies

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Feature

Specification

Wattage 717 Watt (high output)

502 Watt (Energy Smart)

Voltage

90-264 VAC, autoranging, 47-63 Hz

Maximum inrush current

Under typical line conditions and over the entire system ambient operating range, the inrush current may reach 55A per power supply for 10ms or less.

Temperature

Operating

10° to 35°C (50° to 95°F) with a maximum temperature gradation of 10°C per hour

Note: For altitudes above 2950 feet, the maximum operating temperature is de-rated 1°F/550 ft.

Storage

-40° to 65°C (-40° to 149°F) with a maximum temperature gradation of 20°C per hour

Relative Humidity

Operating

20% to 80% (non-condensing) with a maximum humidity gradation of 10% per hour

Storage

5% to 95% (non-condensing) with a maximum humidity gradation of 10% per hour

Maximum Vibration

Operating

0.26 Grms at 5–350Hz for 5 minutes in operational orientations

Storage

1.54 Grms at 10–250Hz for 10 minutes in all orientations

Maximum Shock

Operating

Half sine shock in all operational orientations of 31 G 5% with a pulse duration of 2.6ms 10%

5.3 Power Supply Specifications

Table 4. Power Supply Specifications

5.4 Heat Dissipation

High output (717W) power supply: 2446.5 BTU/hr maximum

Energy Smart (502W) power supply: 1712.9 BTU/hr maximum

5.5 Environmental Specifications

Table 5. Environmental Specifications

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Maximum Shock

Storage

Half sine shock on all six sides of 71G 5% with a pulse duration of 2ms 10% Square wave shock on all six sides of 27G with velocity change @ 235 in/sec or greater

Altitude

Operating

-16 to 3048m (-50 to 10,000ft) Note: For altitudes above 2950 feet, the maximum operating temperature is de-rated 1°F/550ft

Storage

-16 to 10,600m (-50 to 35,000ft)

Feature

Energy Smart Power Supply

High Output Power Supply

Dimensions

L-249 mm1 x W-65.5 mm x H-38.2 mm

Status Indicators

1 x bi-color Light Emitting Diode

Integrated Fans

None

Fixed Input Plug

IEC-C14

AC Cord Rating

15 Amps @ 120 VAC, 10 Amps @ 240 VAC

Input Voltage

90–264 VAC

Auto-ranging

Yes

Line Frequency

47–63 Hertz

Maximum Inrush Current

55 Amps per supply for 10 ms or less

Hot-Swap Capability

Yes

Output Power

502 Watts

717 Watts

Maximum Heat Dissipation

1712.9 BTU per hour

2446.5 BTU per hour

Efficiency (20% – 100% Load)

86.5–90% @ 115 VAC 88–92% @ 230 VAC

85–88.5% @ 115 VAC

86.5–90.5% @ 230 VAC

5.6 Power Consumption Testing

Table 6. Power Consumption Testing

Does not include the power supply handle or ejection tab

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Typical Configuration @ 23 ± 2 °C

Operating Mode

LWA-UL (Bels)

(dBA)

Prominent Tones

CPUs

HDDs

Power Supplies

Optical Drive

2 4 2

1 Idle

5.3

None

Stressed

5.3

None

5.7 Energy Smart Enablement

The 11G family of PowerEdge servers implements aspects of Dell’s Energy Smart strategy. This strategy offers the following:

 Energy Smart components on a portfolio level, such as high-capacity and Energy Smart power

supplies

 Systems with either a lowest power footprint configuration or a best performance per watt

configuration

 Energy Smart components (such as DIMMs or hard drives) selected without cherry picking or

screening individual manufacturer’s components based on energy consumption

5.8 Energy Star Compliance

ENERGY STAR® qualified configurations can be accessed from the ENERGY STAR Compliance results landing page on Dell.com.

5.9 Acoustics

The acoustical design of the PowerEdge R610 reflects adherence to Dell’s high sound quality standards. Sound quality is different from sound power level and sound pressure level in that it describes how humans respond to annoyances in sound, like whistles, hums, etc. One of the sound quality metrics in the Dell specification is prominence ratio of a tone as shown in Table 7.

Table 7. Acoustical Performance

The acoustical specification for the R610 is Category II-D.

Definitions

Idle: Reference ISO7779 (1999) definition 3.1.7; system is running in its OS but no other specific activity.

Stressed Processor: An operating mode per ISO7779 (1999) definition 3.1.6. The software SPECPower_ssj2008 is utilized to stress the processors. SPECPower is set to 50% loading.

LwA – UL: The upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296 (1988) and measured in accordance to ISO 7779 (1999).

LpA: Average bystander A-Weighted sound pressure level. The system is placed in a rack with its bottom at 25 cm from the floor. The acoustic transducers are at the four bystander positions, ref ISO7779 (1999) Section 8.6.2.

Prominent tone: Criteria of D.5 and D.8 of ECMA-74 9th ed. (2005) are followed to determine if discrete tones are prominent. The system is placed in a rack with its bottom at 75 cm from the floor. The acoustic transducer is at front bystander position, ref ISO7779 (1999) Section 8.6.2.

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Feature

5500 Series

5600 Series

# Cores

4 6 Last Level Cache

8MB shared

12MB shared

Multi-processor support

1–2 Processors

1-2 Processors

Front Side Bus (FSB) (MHz)/ Link Frequency (GT/s)

Up to 6.4 GT/s

Max Thermal Design Power (TDP)

130W (workstation) 95W (server)

Max Frequency

>3GHz

Memory Controller

Integrated 3-channel DDR3

Process Technology

45nm

32nm

Intel® Trusted Execution Technology

Yes

Intel® Advanced Encryption Security- New Instructions

Yes Intel® Virtualization

Technology

Yes

Yes Intel® 64

Yes

6 Processors

6.1 Overview

The Intel® Xeon® processor 5500 and 5600 series 2S is the microprocessor designed specifically for servers and workstation applications. The Intel Xeon processor 5500 series features quad-core processing to maximize performance and performance/watt for datacenter infrastructures and highly dense deployments. The Intel 5600 series features six-core processing, offering enhanced systemlevel performance, virtualization, and energy efficiency. The Intel Xeon processor 5500 and 5600 series also feature Intel’s Core™ micro-architecture and Intel 64 architecture for flexibility in 64-bit and 32-bit applications and operating systems.

The Intel Xeon processor 5500 and 5600 series uses a 1366-contact Flip-Chip Land Grid Array (FCLGA) package that plugs into a surface mount socket. The PowerEdge R610 provides support for up to two processors.

Table 8. Intel Xeon 5500 and 5600 Processor Series Features

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Feature

5500 Series

5600 Series

Intel® Hyper-Threading Technology

Yes

Yes Socket

LGA1366

Model

Speed

Power

Cache

Cores

QPI Speed

X5680

3.33GHz

130W

12M

6.4GT/s

X5670

2.93GHz

95W

12M

6.4GT/s

X5660

2.80GHz

95W

12M

6.4GT/s

X5650

2.66GHz

95W

12M

6.4GT/s

L5640

2.26GHz

60W

12M

5.86GT/s

6.2 Features

Key features of the Intel Xeon processor 5500 and 5600 series include:

 Two, four, or six cores per processor  Two point-to-point QuickPath Interconnect links at 6.4 GT/s  1366-pin FC-LGA package  32 nm and 45 nm process technology  No termination required for non-populated processors (must populate CPU socket 1 first)  Integrated QuickPath DDR3 memory controller 64-byte cache line size RISC/CISC hybrid

architecture

 Compatible with existing x86 code base  MMX™ support—Execute Disable Bit Intel Wide Dynamic Execution  Ability to executes up to four instructions per clock cycle  Simultaneous Multi-Threading (SMT) capability  Support for CPU Turbo Mode (on certain processors)—increases processor frequency if

operating below thermal, power, and current limits for streaming SIMD (Single Instruction, Multiple Data) Extensions 2, 3, and 4

 Intel 64 Technology Intel VT-x and VT-d Technology for virtualization support Enhanced Intel

SpeedStep® Technology

 Demand-based switching for active processor power management as well as support for ACPI

P-States, C-States and T-States

 Support for DDR3L, 1.35v DIMMs for even lower system power (5600 series)  Support for memory sparing (5600 series)  AES-NI (hardware encryption assist) for more efficient encryption for uses such as online

transactions SSL (5600 series)

 Intel TXT (Trusted Execution Technology) provides hardware assisted protection against

emerging software attacks (5600 series)

6.3 Supported Processors

For the latest information on supported processors for the PowerEdge R610, visit Dell.com.

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Model

Speed

Power

Cache

Cores

QPI Speed

X5677

3.46GHz

130W

12M

6.4GT/s

X5667

3.06GHz

95W

12M

6.4GT/s

E5640

2.66GHz

80W

12M

5.86GT/s

E5630

2.53GHz

80W

12M

5.86GT/s

L5630

2.13GHz

40W

12M

5.86GT/s

E5620

2.40GHz

80W

12M

5.86GT/s

L5609

1.86GHz

40W

12M

4.8GT/s

X5560

2.80GHz

95W

8M 4 6.4GT/s

E5530

2.40GHz

80W

8M 4 5.86GT/s

L5520

2.26GHz

60W

8M 4 5.86GT/s

E5507

2.26GHz

80W

4M 4 4.8GT/s

E5506

2.13GHz

80W

4M 4 4.8GT/s

E5503

2.00GHz

80W

4M 2 4.8GT/s

6.4 Processor Configurations

6.4.1 Single Processor Configuration

The PowerEdge R610 is designed so that a single processor placed in the CPU1 socket functions normally. The system will halt during power-on self-test (POST) if a single processor is placed in the CPU2 socket. If using a single processor, the R610 requires a heatsink blank in the CPU2 socket for thermal reasons.

6.4.2 Processor Power Voltage Regulation Modules (EVRD 11.1)

Voltage regulation to the Intel Xeon processor 5500 and 5600 series 2S is provided by EVRD (Enterprise Voltage Regulator-Down). EVRDs are embedded on the planar. Processor core voltage is not shared between processors. EVRDs support static phase shedding and power management via the PMBus.

6.5 Processor Installation

Refer to the Processors section in the Installing System Components chapter of the Dell PowerEdge R610 Systems Hardware Owner’s Manual on Support.dell.com for processor installation and removal

instructions.

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7 Memory

7.1 Overview

The PowerEdge R610 uses DDR3 memory, providing a high-performance, high-speed memory interface capable of low latency response and high throughput. The R610 supports Registered ECC DDR3 DIMMs (RDIMM) or Unbuffered ECC DDR3 DIMMs (UDIMM).

The system contains 12 memory sockets split into two sets of six sockets, one set per each processor. Each six-socket set is organized into three channels of two memory sockets per channel.

Key features of the PowerEdge R610 memory system include:

 Registered (RDIMM) and Unbuffered (UDIMM) ECC DDR3 technology  Support for up to 192 GB of RDIMM memory (twelve 16 GB RDIMMs)  Support for up to 24 GB of UDIMM memory (twelve 2 GB UDIMMs)  64 data and eight ECC bits per channel  Support for 1066/1333 MHz single- and dual- rank DIMMs  Support for 1066 MHz quad-rank DIMMs  Support for 1.35V low voltage (LV) DIMMs with 5600 series processors  Support for single DIMM configuration (DIMM in socket A1 only)  Support for ODT (On Die Termination) clock gating (CKE) to conserve power when DIMMs are

not accessed (DIMMs enter a low power self-refresh mode)

 I2C access to SPD EEPROM for access to RDIMM thermal sensors  Single Bit Error Correction  SDDC (Single Device Data Correction, x4 or x8 devices)  Support for Closed Loop  Thermal Management on RDIMMs and UDIMMs  Multi Bit Error Detection Support for Memory Optimized Mode  Support for Advanced ECC mode  Support for Memory Mirroring  Support for Memory Sparing with 5600 series processors

7.2 DIMMs Supported

The DDR3 memory interface consists of three channels with up to two RDIMMs or UDIMMs per channel for single or dual rank and up to two RDIMMs per channel for quad rank. The interface uses 2 GB, 4 GB, 8 GB, or 16 GB RDIMMs. Also supported are 1 GB or 2 GB UDIMMs.

7.2.1 Memory Modes

The memory mode is dependent on how the memory is populated in the system, according to the following configurations:

 Three channels per processor populated identically  Dual-processor configuration with the memory configurations for each processor being

identical

o Typically, the system will be set to run in Memory Optimized (Independent Channel)

mode in this configuration.

o This mode offers the most DIMM population flexibility and system memory capacity,

but offers the least number of RAS (reliability, availability, service) features.

o Memory modules are installed in numeric order for the sockets beginning with A1 or

B1.

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 The first two channels per processor populated identically with the third channel unused

o Typically, two channels operate in Advanced ECC (Lockstep) mode with each other by

having the cache line split across both channels.

o This mode provides improved RAS features (SDDC support for x8-based memory). o For memory mirroring, two channels operate as mirrors of each other (writes go to

both channels and reads alternate between the two channels).

o For Memory Mirroring or Advanced ECC Mode, the three sockets farthest from the

processor are unused and memory modules are installed beginning with socket A2 or B2, proceeding in the following order: A2, A3, A5, and A6.

 One channel per processor populated

o This is a simple Memory Optimized mode. o Mirroring is not supported.

7.2.2 DIMM Population Rules

The following DIMM population rules apply:

 If DIMMs of different speeds are mixed, all channels will operate at the fastest common

frequency. RDIMMs and UDIMMs cannot be mixed.

 If memory mirroring is enabled, identical DIMMs must be installed in the same slots across

both channels.

 The third channel of each processor is unavailable for memory mirroring.  The R610 supports up to 12 DIMMs. DIMMs must be installed in each channel starting with the

DIMM slot farthest from the processor. Population order is identified by the silkscreen designator and the System Information Label (SIL) located on the chassis cover.

 DIMM slot population for each memory mode is listed as follows:

o Memory Optimized: [1, 2, 3], [4, 5, 6] o Advanced ECC or Mirrored: [2, 3], [5, 6] o Quad Rank or UDIMM: [1, 2, 3], [4, 5, 6]

7.3 Speed

The memory frequency is determined by a variety of inputs:

 Speed of the DIMMs  Speed supported by the processor  Configuration of the DIMMs

The memory speed of each channel depends on the memory configuration:

 For single- or dual-rank memory modules:

o One memory module per channel supports up to 1333 MHz o Two memory modules per channel supports up to 1066 MHz

 For quad-rank memory modules:

o One memory module per channel supports up to 1066 Mhz o Two memory modules per channel are limited to 800 MHz, regardless of memory

module speed

If memory modules with different speeds are installed, they will operate at the speed of the slowest installed memory module(s).

For quad-rank DIMMs mixed with single- or dual-rank DIMMs, the quad-rank DIMM must be installed in the slot with the white ejection tabs (the first DIMM slot in each channel). There is no requirement for the order of single- and dual-rank DIMMs.

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7.4 DIMM Slots

The PowerEdge R610 has 12 DIMM slots for memory. It does not have any riser cards for DIMM population.

The first DIMM slot in each channel is color-coded with white ejection tabs for ease of installation. The DIMM sockets are placed 450 mils (11.43 mm) apart, center-to-center to provide enough space for sufficient airflow to cool stacked DIMMs.

7.5 Low Voltage DIMMs

With the introduction of the Intel® Xeon® processor 5600 series, low voltage (LV) DIMMs have been added for selected memory configurations for the PowerEdge R610. Only this processor series supports operating DIMMs at the lower voltage (1.35V, also referred to as DDR3L). The Intel Xeon 5500 processor series does not support low voltage operation. However, due to the backwardscompatible nature of low voltage DIMMs, they can be operated at 1.5V. Therefore, DDR3L DIMMs can be used in systems with either processor series, and the platform will automatically choose the appropriate operating voltage based on the processor populated. DDR3L DIMMs will be qualified and available for use with Intel Xeon 5500 processor series mid-year 2011. Contact your Dell Sales Representive or visit Dell.com for more information.

LV DIMMs operate at 1.35V, creating power savings vs. standard memory which operates at 1.5V. In order to achieve power savings, all DIMMs in the system must be of the LV type. If the system detects a mixture of standard and LV DIMMs, the BIOS will operate all memory at 1.5V. When operating at the lower voltage, additional frequency and population restrictions can take effect. For example, 3 DIMMs per channel operation is not supported at low voltage.

The DDR3L standard is completely backwards-compatible at standard voltage. DDR3L DIMMs can operate at 1.5V without any limitations beyond standard voltage DDR3 DIMMs. As part of the addition of LV DIMMs, the platform has certain default behaviors. Whenever possible, if there is no performance degradation, the platform will default to 1.35V operation when using DDR3L DIMMs. In certain cases, where a configuration is populated that cannot support 1.35V or a performance degradation would result, the platform defaults to 1.5V operation. There are also options to override default voltage within allowed limits.

7.6 Mirroring

The R610 system supports memory mirroring if identical memory modules are installed in the two channels closest to the processor (memory not installed in the farthest channel). Mirroring must be enabled in the System Setup program. In a mirrored configuration, the total available system memory is one-half of the total installed physical memory.

7.7 Sparing

Systems with the Intel Xeon processor 5600 series support memory sparing. Sparing requires identical memory installed in all three channels. One of the three channels is considered the Spare Channel, and two-thirds of the total installed memory is usable and is the amount reported during POST and in BIOS setup.

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7.8 Memory Scrubbing

The R610 memory interface supports memory demand and patrol scrubbing, single-bit correction and multi-bit error detection. Correction of a x4 or x8 device failure is also possible with SDDC in the Advanced ECC mode. Additionally, correction of a x4 device failure is possible in the Memory Optimized mode.

7.9 Advanced ECC (Lockstep) Mode

In this configuration, the two channels closest to the processor are combined to form one 128-bit channel. This mode supports Single Device Data Correction (SDDC) for both x4- and x8-based memory modules. Memory modules must be identical in size, speed and technology in corresponding slots.

7.10 Optimizer (Independent Channel) Mode

In Optimizer (Independent Channel) mode, all three channels are populated with identical memory modules. This mode permits a larger total memory capacity but does not support SDDC with x8-based memory modules.

A minimal single-channel configuration of 1 GB memory modules per processor is also supported in this mode.

7.11 Supported Configurations

See the System Memory section in the Installing System Components chapter in the Dell PowerEdge R610 Systems Hardware Owner's Manual on Support.dell.com.

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8 Chipset

The PowerEdge R610 planar incorporates the Intel® Xeon® 5500 processor series chipset for I/O and processor interfacing. This chipset is designed to support the Intel Xeon 5500 and 5600 processor series family, QuickPath Interconnect, DDR3 memory technology, and PCI Express Generation 2. The chipset consists of the Intel 5500 chipset I/O Hub (IOH) and ICH9.

8.1 Intel I/O Hub (IOH)

The planar uses the Intel 5500 chipset IOH to provide a link between the Intel Xeon processor series 5500 and 5600 processor(s) and the I/O components. The main components of the IOH consist of two full-width QuickPath Interconnect links (one to each processor), 24 lanes of PCI Express Gen2, a x4 Direct Media Interface (DMI), and an integrated IOxAPIC.

8.2 IOH QuickPath Interconnect (QPI)

The QuickPath Architecture consists of serial point-to-point interconnects for the processors and the IOH. The R610 has a total of three QuickPath Interconnect (QPI) links—one link connecting the processors, and multiple links connecting both processors with the IOH. Each link consists of 20 lanes (full-width) in each direction with a link speed of 6.4 GT/s. An additional lane is reserved for a forwarded clock. Data is sent over the QPI links as packets.

The QuickPath Architecture implemented in the IOH and processors features four layers:

 Physical layer—This layer consists of the actual connection between components. It supports

Polarity Inversion and Lane Reversal for optimizing component placement and routing.

 Link layer—This layer is responsible for flow control and the reliable transmission of data.  Routing layer—This layer is responsible for the routing of QPI data packets.  Protocol layer—This layer is responsible for high-level protocol communications, including the

implementation of a MESIF (Modify, Exclusive, Shared, Invalid, Forward) cache coherence protocol.

8.3 IOH PCI Express

PCI Express is a serial point-to-point interconnect for I/O devices. PCIe Generation 2 doubles the signaling bit rate of Generation 1 from 2.5 Gb/s to 5 Gb/s. Each of the PCIe Gen2 ports are backwards-compatible with Gen1 transfer rates.

The IOH has 24 PCI Express lanes. The lanes are partitioned as two x2 PCI Express Gen2 ports and eight x4 PCI Express Gen2 ports. The x2 ports can be combined as a x4 link; however, this x4 link cannot be combined with any of the other x4 ports. Two neighboring x4 ports can be combined as a x8 link, and both resulting x8 links can combine to form a x16 link.

8.4 Intel I/O Controller Hub 9 (ICH9)

ICH9 is a highly integrated I/O controller, supporting the following functions:

 Six x1 PCI Express Gen1 ports, with the capability of combining ports 1-4 as a x4 link (R610

uses the x4 link for storage, the other two x1 lanes go unused)

 PCI Bus 32-bit Interface Rev 2.3 running at 33 MHz  Up to six Serial ATA (SATA) ports with transfer rates up to 300 MB/s (R610 supports one SATA

port for an optional internal optical drive)

 Six UHCI and two EHCI (high-speed 2.0) USB host controllers, with up to 12 USB ports  Four external USB ports and one internal USB port

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 Power management interface (ACPI 3.0b compliant)  Platform Environmental Control Interface (PECI)  I/O interrupt controller  SMBus 2.0 controller  Low Pin Count (LPC) interface to Super I/O, Trusted Platform Module (TPM), and SPI-VU  Serial Peripheral Interface (SPI) support for up to two devices (R610 BIOS is connected to the

ICH9 using SPI)

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9 BIOS

9.1 Overview

The R610 BIOS is based on the Dell BIOS core and supports the following features:

 Intel  Simultaneous Multi-Threading (SMT) support  Processor Turbo Mode support  PCI 2.3 compliant  Plug and Play 1.0a compliant  MP (Multiprocessor) 1.4 compliant  Ability to boot from hard drive, optical drive, iSCSI drive, USB key, and SD card  ACPI support  Direct Media Interface (DMI) support  PXE and WOL support for on-board NICs  Memory mirroring support  SETUP access through <F2> key at end of POST  USB 2.0 (USB boot code is 1.1 compliant)  F1/F2 error logging in CMOS  Virtual KVM, CD, and floppy support  UEFI 2.1 support  Power management support, including DBS, Power Inventory, and multiple power profiles  Intel TXT (5600 series)  Intel AESNI (5600 series)

Xeon® 5500 and 5600 processor series 2S support

The R610 BIOS does not support the following:

 BIOS language localization  BIOS recovery after bad flash (can be recovered from iDRAC6 Express)

9.2 Supported ACPI States

The Advanced Configuration and Power Interface is a standard interface for enabling the operating system to direct configuration and power management.

The Intel Xeon processor 5500 and 5600 series supports the following C-States: C0, C1, C1E, C3, and C6. The R610 supports all of the available C-States.

9.3 I

I2C is a simple bi-directional two-wire bus for efficient inter-integrated circuit control. All I2C-bus compatible devices incorporate an on-chip interface which allows them to communicate directly with each other via the I2C bus. This design concept solves the many interfacing problems encountered when designing digital control circuits. These I2C devices perform communication functions between intelligent control devices (e.g., microcontrollers), general-purpose circuits (e.g., LCD drivers, remote I/O ports, memories) and application-oriented circuits.

C (Inter-Integrated Circuit)

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The PowerEdge R610 BIOS accesses the I2C through the ICH9 (Intel I/O Controller Hub 9). There are two multiplexers (MUX) on the ICH9 I2C bus.

 One MUX (U_ICH_SPD) controls the DIMM SPDs through four split segments  The other MUX (U_ICH_MAIN) controls the clock buffers, TOE, and USB Hub through four split

segments.

BIOS controls both the MUXes through the two select lines using GPIO pins.

The clock chip, USB hub, and the front panel EEPROM device addresses are located on the IOH I2C bus.

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10 Embedded NICs/LAN on Motherboard (LOM)

The PowerEdge R610 has embedded Gigabit Ethernet Controllers with TCP Offload Engine (TOE) support. Two embedded Broadcom® 5709C dual-port LAN controllers are on the R610 planar as independent Gigabit Ethernet interface devices. The following information details the features of the LAN devices:

 x4 PCI Express Gen2 capable interface (controller operated at Gen1 speed)  Integrated MAC and PHY 3072x18 Byte context memory  64 KB receive buffer  TOE (TCP Offload Engine)  iSCSI controller (enabled through an optional hardware key)  RDMA controller (RNIC) (enabled post-RTS through an optional hardware key)  NC-SI (Network Controller-Sideband Interface) connection for manageability  Wake-On-LAN (WOL)  PXE 2.0 remote boot  iSCSI boot  IPv4 and IPv6 support  Bare metal deployment support

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11 PCI Slots

11.1 Overview

The R610 has two PCI Express risers. The two PCIe risers provide two PCI Express expansion slots, which are detailed as follows:

 Two x8 PCIe Gen2 slots connected to the IOH  One x4 PCIe Gen1 slot for dedicated for the integrated storage controller card on the Riser 1

connected to the ICH9

 Support for full-height, half-length (6.6‖ max length) PCIe cards

To ensure proper cooling, only one of the two expansion cards can have a power consumption of greater than 15W (up to 25W maximum), not including the integrated storage controller.

The system does not support hot-plug or hot-removal of PCI Express cards.

For more information on installing expansion cards and expansion-card priority, see the Expansion Cards and Expansion-Card Risers section in the Installing System Components chapter of the Dell PowerEdge R610 Systems Hardware Owner’s Manual on Support.dell.com.

11.2 PCI Riser Restrictions

The following PCI riser restrictions apply for the R610:

 The riser connectors on the planar do not support plugging in a standard PCI Express card.  Two R610 risers must be installed or the system will not power up.

11.3 Quantities and Priorities

Refer to the Expansion Cards and Expansion-Card Risers section in the Installing System Components chapter of the Dell PowerEdge R610 Systems Hardware Owner’s Manual on Support.dell.com.

11.4 PCI Card Dimensions

For information about PCIe slots and card dimensions, see the Expansion Cards and Expansion-Card Risers section in the Installing System Components chapter in the Dell PowerEdge R610 Systems Hardware Owner’s Manual on Support.Dell.com.

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Form Factor

Capacity

Speed

Type

2.5‖

80GB, 160GB, 250GB, 500GB

7.2K

SATA

2.5‖

500GB, 1TB

7.2K

NL SAS

2.5‖

146GB, 300GB, 600GB

10K

SAS

2.5‖

73GB, 146GB

15K

SAS

2.5‖

50GB, 100GB

N/A

SATA SSD

2.5‖

149GB

N/A

SAS SSD

12 Storage

12.1 Overview

The PowerEdge R610 has a single six-drive backplane that supports 2.5‖ drives. There are six hot- swap capable Serial Attached SCSI (SAS) or Serial ATA (SATA) slots with two LED indicators per slot, two Mini-SAS cable connectors for connecting the backplane to the integrated storage controller, and a 14-pin power connector. Mixing SAS and SATA drives is supported.

12.2 Internal Hard Disk Drives

The R610 system supports up to six 2.5‖ hard disk drives. See Table 10 for information on supported hard drives. For the most up-to-date information on supported hard drives, visit Dell.com.

Table 10. Supported Hard Drives

The following additional guidelines apply for hard-drive configurations:

 Hard drives require the 2.5‖ hard-drive carrier  Up to six SAS or up to six SATA drives are supported  For SAS and SATA mixing:

o Two SAS and up to four SATA drives are allowed o Two SAS hard drives must be installed in slots 0 and 1

 Limited SAS and SSD mixing is supported  SSDs require the PERC 6/i or PERC H700 integrated storage controller card and cannot be

mixed with any other type of hard drive

12.2.1 Hard Disk Drive Carriers

Hard drives must use the Dell 2.5‖ drive carrier. See Figure 8.

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Non-Mixed Drives All SATA, all SAS, or all SSD

All 2.5” Drives

Config Type

Configs

Description

Min HDD

Max HDD

No HDD

NZC

No controller/No hard drive

SAS or SATA—No

RAID

MSS

Integrated SAS/SATA (SAS 6/iR,

PERC H200), No RAID

Figure 8. Dell 2.5” Hard Drive Carrier

12.2.2 Empty Drive Bays

For the slots that are not occupied by drives, a carrier blank is provided to maintain proper cooling, maintain a uniform appearance to the unit, and provide EMI shielding.

12.2.3 Diskless Configuration Support

The system supports diskless configuration with no storage controller (SAS 6/iR, PERC 6i, PERC H200, or PERC H700) installed in the system. A 2.5‖ hard drive backplane is still installed in this configuration.

12.2.4 Hard Drive LED Indicators

Each disk drive carrier has two LED indicators visible from the front of the system. One is a green LED for disk activity and the other is a bicolor (green/amber) LED for status information. The activity LED is driven by the disk drive during normal operation. The bicolor LED is controlled by the storage enclosure processor (SEP) device on the backplane. Both LEDs are used to indicate certain conditions under direction of a storage controller.

For more information, see the Hard-Drive Indicator Patterns section in the About Your System chapter in the Dell PowerEdge R610 Systems Hardware Owner’s Manual on Support.Dell.com.

12.3 RAID Configurations

See Table 11 for information on factory RAID configurations. For information on additional configurations, visit Dell.com.

Table 11. Factory RAID Configurations

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Non-Mixed Drives All SATA, all SAS, or all SSD

All 2.5” Drives

Config Type

Configs

Description

Min HDD

Max HDD

SAS or SATA— RAID

MSSR0

Integrated SAS/SATA RAID 0 (SAS 6/iR, PERC 6/i, PERC H200, PERC H700)

MSSR1

Integrated SAS/SATA RAID 1 (SAS 6/iR, PERC 6/i, PERC H200, PERC H700)

2 4

MSSR5

Integrated SAS/SATA RAID 5 (PERC 6/i, PERC H700)

MSSR10

Integrated SAS/SATA RAID 10 (PERC 6/i, PERC H700)

MSSR0/R0

Integrated SAS/SATA RAID 0/RAID 0 (SAS 6/iR, PERC 6/i, PERC H200, PERC H700)

1 + 1

MSSR1/R1

Integrated SAS/SATA RAID 1/RAID 1 (SAS 6/iR, PERC 6/i, PERC H200, PERC H700)

2 + 2

2 + 2 8

MSSR1/R5

Integrated SAS/SATA RAID 1/RAID 5 (PERC 6/i, PERC H700)

2 + 3

2 + 4

MSSR1/R10

Integrated SAS/SATA RAID 1/RAID 10 (PERC 6/i, PERC H700)

2 + 4

MSSR6

Integrated SAS/SATA RAID 6 (PERC 6/i, H700)

SAS or SATA SSDs— RAID

MSSR1

Integrated SSD RAID 1 (PERC 6/i, PERC H200, H700) (SAS SSD with PERC H200, PERC H700 only)

2 17

MSSR5

Integrated SSD RAID 5 (PERC 6/i, PERC H700) (SAS SSD with PERC H700 only)

MSSR10

Integrated SSD RAID 10 (PERC 6/i, PERC H200, PERC H700) (SAS SSD with PERC H200, PERC H700 only)

SATA SSD—No RAID

MSS

Integrated SATA SSD, No RAID (PERC H200)

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Mixed SATA + SAS Min 2xSAS + 1xSATA Max 2xSAS + 4xSATA All 2.5” Drives

Config Type

Configs

Description

Min HDD

Max HDD

SAS + SATA—No RAID

MSS-X

Integrated SAS/SATA (SAS 6/iR), No

RAID

SAS + SATA— RAID

MSSR0/R0-X

Integrated SAS/SATA RAID 0/RAID 0 (SAS 6/iR, PERC 6/i, PERC H200, PERC H700)

2 + 1

2 + 4

MSSR1/R1-X

Integrated SAS/SATA RAID 1/RAID 1 (SAS 6/iR, PERC 6/i, PERC H200, PERC H700)

2 + 2

MSSR1/R5-X

Integrated SAS/SATA RAID 1/RAID 5

(PERC 6/i, PERC H700)

2 + 3

2 + 4

MSSR1/R10-X

Integrated SAS/SATA RAID 1/RAID

10 (PERC 6/i, PERC H700)

2 + 4

Mixed SATA SSD + SAS Min 2xSATA SSD + 2xSAS

Max 2xSATA SSD + 4xSAS

All 2.5” Drives

Config Type

Configs

Description

Min HDD

Max HDD

SATA SSD + SAS— RAID

MSSR1/R1-X

Integrated SSD/SAS RAID 1/RAID 1 (PERC 6/i, PERC H700) (SAS SSD with PERC H700 only)

2 + 2

MSSR1/R5-X

Integrated SSD/SAS RAID 1/RAID 5 (PERC 6/i, PERC H700) (SAS SSD with PERC H700 only)

2 + 3

2 + 4

MSSR1/R10-X

Integrated SSD/SAS RAID 1/RAID 10 (PERC 6/i, PERC H700) (SAS SSD with PERC H700 only)

2 + 4

12.4 Storage Controllers

12.4.1 SAS 6/iR

The R610 internal SAS 6/iR HBA is an expansion card that plugs into a dedicated PCI Express x8 slot (four lanes wired). It incorporates two four-channel SAS IOCs for connection to SAS or SATA hard disk drives. It is designed in a form factor that allows the same card to be used in the PowerEdge R610 and PowerEdge T610.

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Product

Usage

PowerEdge R610 Support

Slot

PCI Con

PCI Bracket

IO Con

RAID

Battery Backup

PERC SAS/ SATA

PERC 6/i Integrated (PERC H700)

Internal Backplane Storage RAID (HDD, SDD)

Yes—Max 1

Storage slot

X4 int

0, 1, 5, 6, 10, 50, 60

Yes

PERC 6/E Adapter (PERC H800)

External SAS/SATA Storage

Yes—Max 1 PERC 6/E:

(MD1000 and MD1120)

PERC H800: (MD1200 and MD1220)

PCIe slot

Yes

X4 ext

0, 1, 5, 6, 10, 50, 60

Yes

PERC 5/E Adapter

Legacy External storage

Yes—Max 1 (MD1000)

PCIe slot

Yes

X4 ext

0, 1, 5, 10, 50

Yes

SAS HBA SAS/ SATA

SAS 6/iR Integrated (PERC H200)

Internal Backplane Storage (No tape or SSD support)

Yes—Max 1

Storage slot

X4 int

0, 1

SAS 5/E Adapter (SAS 6G HBA)

External SAS (DAS, tape)

Yes —Max 1

PCIe slot

Yes

X4 ext

None

12.4.2 PERC 6/i

If you want an internal RAID solution, select the PERC 6/i or PERC H700. The PERC 6/i uses the LSI 1078 ROC (RAID on Chip) processor with a PCI Express host interface and DDR2 memory. A battery is also available for backup.

12.4.3 PERC H200

The H200 SAS HBA is an expansion card that plugs into the dedicated internal SAS slot on Riser1. It incorporates two four-channel 6 Gb/s SAS IOCs for connection to SAS hard disk drives. It is designed in a form factor that allows the same card to be used in other 11G 2U rack-form factor platforms.

12.4.4 PERC H700

If you want an internal RAID solution, select the PERC H700 or PERC 6/i. The PERC H700 card has its own processor with a PCI Express Gen2 host interface and DDR2 memory and installs into the dedicated internal SAS slot on Riser1. A battery is also available for backup. It supports the internal 6 Gb/s backplane interface for internal storage options (SAS, SATA, or SSD HDD). The PowerEdge R610 supports both 256MB and 512MB cache options on the internal H700.

Table 12. Storage Card Support Matrix

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Product

Usage

PowerEdge R610 Support

Slot

PCI Con

PCI Bracket

IO Con

RAID

Battery Backup

ICH9

On planar via chipset

Internal slimline SATA Optical (no HDD)

Yes—1 port for Optical

N/A

1x int

N/A

LSI 2032 SCSI

LSI 2032 Adapter

External SCSI Tape/ Legacy External storage

Yes—Max 2 (No

internal tape backup support)

PCIe slot

Yes

1x int

1x ext

N/A

12.5 Optical Drives

Optical drives are optional in all PowerEdge R610 systems and connect to the planar through the SATA interface. The following internal slimline drives are available on the PowerEdge R610:

 DVD-ROM  DVD+RW

If an optical drive is not ordered with the system, a blank is installed in its place.

12.6 Tape Drives

External tape drives and tape libraries are supported. For more information on supported tape drives and tape libraries, see http://www.dell.com/storage.

12.7 External Storage Support

External storage devices are supported. For more information, see http://www.dell.com/storage.

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Resolution

Refresh Rate (Hz)

Color Depth

(bit)

640 x 480

60, 72, 75, 85

8, 16, 32

800 x 600

56, 60, 72, 75, 85

8, 16, 32

1024 x 768

60, 72, 75, 85

8, 16, 32

1152 x 864

8, 16, 32

1280 x 1024

60, 75, 85

8, 16

1280 x 1024

13 Video

The PowerEdge R610 Integrated Dell Remote Access Controller 6 (iDRAC6) incorporates an integrated video subsystem, connected to the 32-bit PCI interface of the ICH9. This logic is based on the Matrox® G200. The device only supports 2D graphics. The video device outputs are multiplexed between the front and rear video ports. If a monitor is connected to the front video connector, it will take precedence over the rear connection, thereby removing the display from the rear connection. The integrated video core shares its video memory with the iDRAC6’s 128 MB DDR2 application space memory. This memory is also used for the KVM buffer. The resolutions supported are listed in Table 13.

Table 13. Graphics Video Modes

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14 Rack Information

14.1 Overview

The ReadyRails™ sliding and static rail systems for the R610 provide toolless support for racks with square or unthreaded round mounting holes including all generations of Dell racks. The static rails also offer tooled mounting support for 4-post threaded and 2-post (Telco) racks for added versatility. The optional cable management arm (CMA) can be mounted on either the left or right side of the sliding rails without the use of tools for fast and easy deployment.

The R610 is not compatible with any other Dell rails including previous generation rails, but it does use the same static rails as the R710.

The CMA is not supported on racks that are less than 1 m in depth, including Dell’s 4200 and 2400 racks.

14.2 Rails

The rail offerings for the R610 consist of two types: sliding and static.

The sliding rails allow the system to be fully extended out of the rack for service and are available with or without the optional cable management arm (CMA).

Figure 9. R610 Sliding Rails with Optional CMA

The static rails support a wider variety of racks than the sliding rails but do not support serviceability in the rack and are thus not compatible with the CMA.

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Product

Rail ID

Mounting Interface

Rail Type Rack Types Supported

4-Post

2-Post

Square

Round

Thread

Flush

Center

R610 A1

ReadyRails™

Sliding

√

X X X

ReadyRails™/Generic

Static

√ √ √ √ √

Figure 10. R610 Static Rails

One key factor in selecting the proper rails is identifying the type of rack in which they will be installed. Both the sliding rails and the static rails support toolless mounting in 19‖-wide, EIA-310-E

compliant square hole and unthreaded round hole racks via the ReadyRails™ mounting interface, but

only the static rails, as the more generic or universal solution, support mounting in threaded hole and 2-post (Telco) racks.

Table 14. Supported Racks

Screws are not included in the static rail kit because the threaded racks are offered with a variety of thread designations. Users must provide their own screws when mounting the static rails in threaded or 2-post racks.

Other key factors governing proper rail selection include the spacing between the front and rear mounting flanges of the rack, the type and location of any equipment mounted in the back of the rack such as power distribution units (PDUs), and the overall depth of the rack. See Table 15.

Due to their reduced complexity and lack of need for CMA support, the static rails offer a greater adjustability range and an overall smaller footprint than the sliding rails.

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Product

Rail ID

Mounting Interface

Rail Type

Rail Adjustability Range (mm)

Rail Depth (mm)

Square

Round

Threaded

Without CMA

With CMA

Min

Max

Min

Max

Min

Max

R610

ReadyRails™

Sliding

692

756

678

749 — —

768

887

ReadyRails™/ Generic

Static

588

828

574

821

592

846

608

—

Table 15. Rail Adjustability Ranges and Depth

The adjustment range of the rails is a function of the type of rack in which they are being mounted. The min-max values listed above represent the allowable distance between the front and rear mounting flanges in the rack. Rail depth represents the minimum depth of the rail as measured from the rack front mounting flanges when the rail rear bracket is positioned all the way forward.

14.3 Cable Management Arm (CMA)

The optional cable management arm (CMA) for the R610 organizes and secures the cords and cables exiting the back of the server and unfolds to allow the server to extend out of the rack without having to detach the cables. Some key features of the R610 CMA include:

 Large U-shaped baskets support dense cable loads.  An open vent pattern allows for optimal airflow.  The CMA mounting is fully-reversible (can be mounted on either side) with no conversion

required.

 Hook-and-loop straps are used rather than plastic tie wraps to eliminate the risk of cable

damage during cycling.

 A low-profile fixed tray is provided to both support and retain the CMA in its fully closed

position.

 The CMA and the tray mount without the use of tools using simple and intuitive snap-in

designs.

14.4 Rack View

The R610 sliding rails are a drop-in design, meaning that the system is installed vertically into the rails by inserting the shoulder nuts on the sides of the system into the J-slots in the inner rail members with the rails in the fully extended position. See Figure 11.

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Figure 11. R610 Mounted in the A1 Sliding Rails

The CMA can be mounted to either side of the rails without the use of tools or the need for conversion, but it is recommended that it be mounted on the side opposite the power supplies to allow easier access to the power supplies for service or replacement. See Figure 12.

Figure 12. R610 Mounted in the B1 Sliding Rails with the CMA

The R610 static rails essentially behave like a fixed shelf. The system is installed by first resting the back of the system on the inner ledges of the rail front brackets, then pushing the system forward while ensuring that the shoulder nuts on the sides of the system are properly engaged in the horizontal slots on the rails. See Figure 13.

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Figure 13. R610 Mounted in the A2 Static Rails (2-post Center Mount Configuration)

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15 Operating Systems

For detailed information, see the following:

 Operating System Support Matrix for Dell PowerEdge Systems on www.Dell.com  Dell PowerEdge R610 Systems Getting Started With Your System guide on Support.Dell.com

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16 Systems Management

16.1 Overview

Dell delivers open, comprehensive, and integrated solutions that help you reduce the complexity of managing disparate IT assets. Combining Dell PowerEdge Servers with a wide selection of Dell developed systems management solutions gives you choice and flexibility, so you can simplify and save in IT environments of any size. To help you meet your server management demands, Dell offers Dell OpenManage™ systems management solutions for:

 Deployment of one or many servers from a single console  Monitoring of server and storage health and maintenance  Update of system, operating system, and application software

Dell offers IT management solutions for organizations of all sizes—priced and sized appropriately and supported comprehensively.

16.2 Server Management

A Dell Systems Management and Documentation DVD and a Dell Management Console DVD are included with the product. ISO images are also available. A brief description of available content:

 Dell Systems Build and Update Utility (SBUU): Dell Systems Build and Update Utility assists in

OS install and pre-OS hardware configuration and updates.

 Server Update Utility (SUU): This DVD has an inventory tool for managing updates to

firmware, BIOS, and drivers for either Linux® or Microsoft® Windows® varieties.

 OpenManage Server Administrator (OMSA): The OpenManage Server Administrator tool

provides a comprehensive, one-to-one (one console to one server) systems management solution, designed for system administrators to manage systems locally and remotely over a network. OMSA allows system administrators to focus on managing their entire network.

 Management Console: Dell IT Assistant (ITA) is also included, as well as tools to allow access

to our remote management products. These tools are Remote Access Service for iDRAC and the Baseboard Management Controller (BMC) Utility.

 Active Directory Snap-in Utility: The Active Directory Snap-in Utility provides an extension

snap-in to the Microsoft Active Directory. This allows you to manage Dell specific Active Directory objects. The Dell-specific schema class definitions and their installation are also included on the DVD.

 Dell Systems Service Diagnostics Tools: Dell Systems Service and Diagnostics tools deliver the

latest Dell optimized drivers, utilities, and operating system-based diagnostics that you can use to update your system.

 eDocs: The section includes PDF files for PowerEdge systems, storage peripherals, and

OpenManage software.

 Dell Management Console (DMC): The Dell Management Console is a systems management

console that enables systems administrators to discover and inventory devices on your network. It provides functions such as health and performance monitoring of networked devices, and patch management capabilities for Dell systems. DMC differs from the IT Assistant management console (described above) in that with DMC, value-add plug-ins that enable advanced functionality can be purchased and added to the base DMC product.

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Feature

Description

Faster O/S Installation

Drivers and the installation utility are embedded on system, so no need to scour Dell.com

Faster System Updates

Integration with Dell support automatically directed to latest versions of the Unified Server Configurator, iDRAC, RAID, BIOS, NIC, and Power Supply

Update Rollback

Ability to recover to previous ―known good state‖ for all updatable components

More Comprehensive Diagnostics

Diagnostic utilities are embedded on system

Simplified Hardware Configuration

Detects RAID controller and allows user to configure virtual disk and choose virtual disk as boot device, eliminating the need to launch a separate utility. Also provides configuration for iDRAC, BIOS, and NIC/LOM.

16.3 Embedded Server Management

The PowerEdge R610 implements circuitry for the next generation of Embedded Server Management. It is Intelligent Platform Management Interface (IPMI) v2.0 compliant. The iDRAC (Integrated Dell Remote Access Controller) is responsible for acting as an interface between the host system and its management software and the periphery devices.

iDRAC6 provides features for managing the server remotely or in data center lights-out environments.

Advanced iDRAC features require the installation of the optional iDRAC6 Enterprise card.

16.4 Dell Lifecycle Controller and Unified Server Configurator

Embedded management is comprised of interdependent pieces:

 Dell Lifecycle Controller  Unified Server Configurator  iDRAC6

Dell Lifecycle Controller powers the embedded management features. It is integrated and tamperproof storage for system-management tools and enablement utilities (firmware, drivers, etc.). Lifecycle Controller enables pre-OS server deployment, OS installation, platform updates, platform configuration, and diagnostics capabilities.

Dell Unified Server Configurator (USC) is a graphical user interface (GUI) that aids in local server provisioning in a pre-OS environment. To access the Unified Server Configurator, press the <F10> key

within 10 seconds of the Dell logo’s appearance during the system boot process. Current functionality

enabled by the Unified Server Configurator includes those shown in Table 16.

Table 16. Unified Server Configurator Features and Description

16.5 Integrated Dell Remote Access Controller

The integrated Dell Remote Access Controller (iDRAC6) provides IT Administrators comprehensive yet straightforward management of remote servers, by delivering ―as if you are there‖ presence and control. iDRAC6 helps users to save time and money by eliminating travel to the remote server(s), whether that server is located in a different room, a different building, a different city, or in a

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different country. iDRAC6 is a purchasable option and is available as three offerings: iDRAC6 Express, iDRAC6 Enterprise, and Virtual Flash (vFlash) media:

 iDRAC6 Express is most appropriate for SMB customers with limited remote management

needs.

 iDRAC6 Enterprise is appropriate for large data center customers with distributed servers.  iDRAC6 with vFlash Media is provided for large enterprise customers with requirements for

system management automation.

16.6 iDRAC6 Express

The iDRAC6 Express is standard on the PowerEdge R610. In addition to providing a Lifecycle Controller, the iDRAC6 Express offers the following key features:

 Graphical web interface  Standard-based interfaces  Server Sensor monitoring and fault alerting  Secure operation of remote access functions including authentication, authorization, and

encryption

 Power control and management with the ability to limit server power consumption and

remotely control server power states

 Advanced troubleshooting capabilities

For more information on iDRAC6 Express features see Table 17.

16.7 iDRAC6 Enterprise

The optional iDRAC6 Enterprise card provides access to advanced iDRAC6 features. The iDRAC6 Enterprise connects directly to the R610 planar and is mounted parallel to the planar with stand-offs.

Key features for the iDRAC6 Enterprise include:

 Scripting capability with Dell’s racadm command line  Remote video, keyboard, and mouse control with Virtual Console  Remote media access with Virtual Media  Dedicated network interface

16.8 iDRAC6 Enterprise with Virtual Flash (vFlash) Media

The iDRAC6 Enterprise can be upgraded by adding the vFlash Media card. This is an 8GB Dell branded SD card that enables a persistent 256 MB virtual flash partition. The vFlash Media delivers the following key features:

 Support for 8GB SD storage media  Can be used as a repository for a pre-OS image, eliminating the need to maintain a network

infrastructure for OS deployment

 Can also be used for permanent diagnostics image for use after system failures, or permanent

failsafe image for periodic configuration changes

A more detailed feature list for iDRAC6 Express, iDRAC6 Enterprise, and vFlash Media is shown in Table 17.

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Feature

Base

Management

Functionality

iDRAC6

Express

iDRAC6

Enterprise

vFlash

Media

Interface and Standards Support

IPMI 2.0



Web-based GUI



SNMP



WSMAN



SMASH-CLP



Racadm commandline



Conductivity

Shared/Failover Network Modes



IPv4



VLAN Tagging



IPv6



Dynamic DNS



Dedicated NIC



Security and Authentication

Role-based Authority



Local Users



Active Directory



SSL Encryption



Remote Management and Remediation

Remote Firmware Update



Server power control



Serial-over-LAN (with proxy)



Serial-over-LAN (no proxy)



Power capping



Last crash screen capture



Boot capture



Table 17. Features List for Base Management Functionality, iDRAC, and vFlash

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Feature

Base

Management

Functionality

iDRAC6

Express

iDRAC6

Enterprise

vFlash

Media

Serial-over-LAN



Virtual media



Virtual console



Virtual console sharing



Virtual flash



Monitoring

Sensor Monitoring and Alerting



Real-time Power Monitoring



Real-time Power Graphing



Historical Power Counters



Logging Features

System Event Log



RAC Log



Trace Log



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17 Peripherals

The R610 supports the following USB devices:

 DVD (bootable; requires two USB ports)  USB key (bootable)  Keyboard (only one USB keyboard is supported)  Mouse (only one USB mouse is supported)

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Country/Region

Authority or Mark

Argentina

IRAM

Belarus

BELLIS

Canada

SCC

China

CNCA or CCC

Croatia

KONCAR

European Union

Germany

TUV

IECEE

IECEE CB

Israel

SII

Kazakhstan

OTAN – CKT

Kenya

KEBS

Kuwait

KUCAS

Mexico

NYCE or NOM

Moldova

INSM

Nigeria

SONCAP

Norway

NEMKO

Russia

GOST

Saudi Arabia

KSA ICCP

South Africa

NRCS

Taiwan

BSMI

Ukraine

UKRTEST or

UKRSERTCOMPUTER

United States

NRTL

Uzbekistan

STZ

Appendix A. Certifications

A.1 Regulatory Certifications

Regulatory compliance certificates can be located at the following sites:

 http://ausreactorprd01/reactor/xCertSearch.asp

 http://www.dell.com/content/topics/global.aspx/about_dell/values/regulatory_compliance

/dec_conform?c=us&l=en&s=corp

A.2 Product Safety Certifications

The product has been certified and bears the Mark, as applicable, of the Product Safety authorities as indicated in Table 18.

Table 18. Product Safety Certifications

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Country/Region

Authority or Mark

Class

Australia/New Zealand

ACMA or C-Tick

Class A

Belarus

BELLIS

Class A

Bosnia & Herzegovina,

Montenegro, Serbia

KVALITET

Class A

Canada

ICES

Class A

China

CNCA or CCC

Class A

Croatia

KONCAR

Class A

European Union

Class A

Israel

SII

Class A

Japan

VCCI

Class A

Kazakhstan

OTAN – CKT

Class A

Moldova

INSM

Class A

Norway

NEMKO

Class A

Russia

GOST

Class A

South Africa

SABS

Class A

South Korea

KCC

Class A

Taiwan

BSMI

Class A

Ukraine

UKRTEST or UKRSERTCOMPUTER

Class A

United States

FCC

Class A

Uzbekistan

STZ

Class A

Vietnam

ICT

Class A

A.3 Electromagnetic Compatibility

The product has been certified and bears the Mark, as applicable, of the EMC authorities as indicated in Table 19.

Table 19. Electromagnetic Compatibility Certifications

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Country/Region

Authority or Mark

Belarus

BELLIS

Germany

Russia

GOST

A.4 Ergonomics, Acoustics and Hygienics

The product has been certified and bears the Mark, as applicable, of the Ergonomics, Acoustics and Hygienics authorities as indicated in Table 20.

Table 20. Ergonomics, Acoustics and Hygienics

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Standard

URL for Information and Specifications

ACPI

Advance Configuration and Power Interface Specification, v2.0c

http://www.acpi.info/

Energy Star EPA Version 1.0 of the

Computer Server specification

http://www.energystar.gov/index.cfm?c=archives.enterprise _servers

Ethernet

IEEE 802.3-2005

http://standards.ieee.org/getieee802/802.3.html

IPMI

Intelligent Platform Management Interface, v2.0

http://www.intel.com/design/servers/ipmi/

DDR3 Memory

DDR3 SDRAM Specification, Rev. 3A

http://www.jedec.org/download/search/JESD79-3A.pdf

LPC

Low Pin Count Interface Specification, Rev. 1.1

http://developer.AMD.com/design/chipsets/industry/lpc.ht m

PCI Express

PCI Express Base Specification Rev. 2.0

http://www.pcisig.com/specifications/pciexpress/

PMBus

Power System Management Protocol Specification, v1.1

http://pmbus.info/specs.html

SAS

Serial Attached SCSI, v1.1

http://www.t10.org/cgi-bin/ac.pl?t=f&f=sas1r10.pdf

SATA

Serial ATA Rev. 2.6; SATA II, Extensions to SATA

1.0a, Rev. 1.2

http://sata-io.org/

SMBIOS

System Management BIOS Reference Specification, v2.6

http://www.dmtf.org/standards/smbios/

TPM

Trusted Platform Module Specification, v1.2

http://www.trustedcomputinggroup.org/resources/tpm_mai n_specification

Appendix B. Additional Information and Options

The PowerEdge R610 system conforms to the industry standards detailed in Table 21.

Table 21. Industry Standards

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Standard

URL for Information and Specifications

UEFI

Unified Extensible Firmware Interface Specification, v2.1

http://www.uefi.org/specs/

USB

Universal Serial Bus Specification, Rev. 2.0

http://www.usb.org/developers/docs/

Windows Logo Windows Logo Program System and Device Requirements, v3.10

http://www.microsoft.com/whdc/winlogo/hwrequirements. mspx

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