EMC@ : EMI, ESD and RF Component
@EMC@ : EMI, ESD and RF Nopop Component
CXDP@ : XDP Component
33
CONN@ : Connector Component
2015-09-25
REV : 1.0 (A00)
X76@ : SATA REDRIVER OPTION
MBPCB
Part Number
DAA000AD000
44
COPYRIGHT 2015
ALL RIGHT RESERVViEnD
REV: A00
PWB: 6N3K7
Description
PCB 1DK LA-C642P REV0 MB
Layout Dell logo
ABCDE
afix.com
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AN D SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT BE
TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION, NEITHER
THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY
WITHOUT DELL'S EXPRESS WRITTENCONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT BE
TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION, NEITHER
THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY
WITHOUT DELL'S EXP RESS WRITTENCONSENT.
DELL CONFIDENTIAL/PROPRIETARY
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Compal Electronics,Inc.
POWER ON/OFF
SW & LED
Blockdiagram
LA-C642P
Sheet
2
P40
P41
Rev
1.0
60Thursday, September 24, 2015
54321
RT8207M
(PU201)
SIO_SLP_S4#
+1.2V_MEM
ADAPTER
(PU401)
SIO_SLP_SUS#
RUN_ON
SIO_SLP_SUS#
ALWON
ALWON
+1.0V_PRIM
+1.0VS_VCCIO
TPS22961
(UV28)
+1.0V_PRIM_CORE
+5V_ALW
+5V_ALW2
+3.3V_RTC_LDO
+3.3V_ALW2
+1.0V_RUN_VMM
DD
SYX198D
(PU301)
TPS62134A
CHARGER
BQ24777
(PU801)
+PWR_SRC
HUB_LP_EN
TPS62134B
(PU402)
SYX198C
BATTERY
CC
(PU100)
SYX198B
(PU100)
+3.3V_ALW
ISL95857
(PU602)
AO6405
(QV1)
LDOIN
RT8207
(PU201)
+0.6V_DDR_VTT
TPS22961
(UZ20)
TPS22961
(UZ19)
TPS22961
(UZ21)
TPS22967
(UZ23)
EM5209
(UZ4)
EM5209
(UZ5)
PI5USB2544
(UI3)
SY6288
(UI1)
SY6288
(UI2)
SY8032A
(PU501)
EM5209
(UZ2)
@SIO_SLP_WLAN#
MPHYP_PWR_EN
SIO_SLP_S3#
SIO_SLP_S4#
3.3V_HDD_EN
RUN_ON
AUD_PWR_EN
USB_PWR_SHR_VBUS_EN
USB_PWR_EN1#
USB_PWR_EN2#
SIO_SLP_SUS#
SIO_SLP_LAN#
3.3V_WWAN_EN
+1.0V_MPHYGT
+1.0V_VCCSTG
+1.0V_VCCST
+5V_HDD
+5V_RUN
+5V_RUN_AUDIO
+USB_LEFT_PWR
+USB_REAR_PWR
+1.8V_PRIM
+3.3V_LAN
+3.3V_WWAN
+5V_USB_CHG_PWR
AP7175SP
(PU1500)
SIO_SLP_S4#
0.675_DDR_VTT_ON
CPU PWR
PCH PWR
GPU PWR
Peripheral Device PWR
+2.5V_MEM
(QV8)
3.3V_TS_EN
+3.3V_RUN
3.3V_CAM_EN#
+3V_TSP
+1.5V_RUN
+3.3V_CAM
+3.3V_HDD
DELL CONFIDENTIAL/PROPRIETARY
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Date:
Compal Electronics,Inc.
Powerrails
Thursday, September 24, 2015
LA-C642P
Rev
4
Sheet
1
1.0
60
of
LP2301
AP7175SP
(PU502)
LP2301A
(QZ1)
(UZ4)
AUX_EN_WOWL
@SIO_SLP_WLAN#
RUN_ON
AUD_PWR_EN
A_ON
SIO_SLP_SUS#
@PCH_ALW_ON
CV2_ON
ENVCC_PCH
+3.3V_WLAN
+3.3V_RUN
+3.3V_RUN_AUDIO
+3.3V_M
+3.3V_ALW_PCH
+3.3V_CV2
+LCDVDD
USH/B
IMVP_VR_ON
BB
IMVP_VR_ON
IMVP_VR_ON
+BL_PWR_SRC
+VCC_GT+VCC_SA
+VCC_CORE
EN_INVPWR
EM5209
(UZ3)
EM5209
(UZ5)
TPS22967
(UZ8)
EM5209
TPS22967
AA
(UZ18)
AP2821
(UV24)
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT BE
TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION, NEITHER
THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DE LL'S EXPRESS WRITTENCONSENT.
5432
54321
1K
+3.3V_ALW_PCH
2.2K
2.2K
+3.3V_ALW_PCH
+3.3V_ALW
2N7002
2N7002
127
129
28
31
LOM
Dock
R7
R8
MEM_SMBCLK
MEM_SMBDATA
499
1K
DD
SKL-U
R9
W2
SML0_SMBCLK
499
SML0_SMBDATA
V3W3
B4
A3
B5
A4
1K
1K
DOCK_SMB_CLK
DOCK_SMB_DAT
+3.3V_ALW_PCH
SML1_SMBDATA
SML1_SMBCLK
B6A5
3A
3A
1A
1A
CC
1B
1B
2.2K
2.2K
+3.3V_RUN
202
200
202
200
DIMMA
DIMMB
53
51
XDP
2.2K
KBC
A56
1C1CB59
PBAT_SMBCLK
PBAT_SMBDAT
2.2K
@2.2K
A50
B53
USH_SMBCLK
USH_SMBDAT
BB
MEC 5085
1E
1E
@2.2K
+3.3V_ALW
100 ohm
100 ohm
+3.3V_ALW
7
6
BATTERY
CONN
2.2K
2.2K
+3.3V_CV2
M9
L9
USH
USH/B
A49
2B
B52
2B
B50
A47
B7
A7
B48
B49
CHARGER_SMBCLK
CHARGER_SMBDAT
GPU_SMBDAT
GPU_SMBCLK
1G
1G
AA
2D
2D
2A
2A
5432
10K
10K
2.2K
2.2K
+3.3V_ALW
+3.3V_RUN
9
8
Charger
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT BE
TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION, NEITHER
THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DE LL'S EXPRESS WRITTENCONSENT.
PROPRI ETARY NOTE: THIS SHE ET OF ENGI NEERING DR AWING AND SPECIFICAT IONS CONTA INS
CONFID ENTIAL TRA DE SECRET AND OTHER PROPRIETA RY INFORMA TION OF DE LL INC. (" DELL") THI S
DOCUME NT MAY NOT BE TRANS FERRED OR COPIED WIT HOUT THE E XPRESS WRI TTEN AUTHO RIZATION O F
DELL. IN ADDITION , NEITHE R THIS SHE ET NOR THE INFORMATI ON IT CONT AINS WAY B E USED BY OR
DISCLO SED TO ANY THIRD PA RTY WITHOU T DELL'S E XPRESS WRI TTEN CONSEN T.
PROPR IETARY NOT E: THIS SHE ET OF ENG INEERING DRAW ING AND SPECI FICATIONS CO NTAINS CO NFIDENTIAL
TRADE SECRET AND OTH ER PROPR IETARY I NFORM ATION OF DE LL INC. (" DELL") THIS DOCUMEN T MAY NOT B E
TRANSFE RRED OR COP IED WITHOU T THE EX PRESS WRITTEN A UTHOR IZATION OF DELL. I N ADDI TION, NEITHER
THIS SHE ET NOR THE INF ORMATI ON IT CONTAI NS WAY BE U SED BY OR DISCLOSED TO A NY THI RD PA RTY
WITHOUT DELL'S E XPRE SS WRITTEN CONS ENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT BE
TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION, NEITHER
THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY
WITHOUT DELL'S EXP RESS WRITTENCONSENT.
CAD N ote:
Trace width=12~15 mil, S pacing =20 mils
Max trac e leng th= 500 mil
RC5
RC6
RC7
12
12
12
121_0402_1%
80.6_0402_1%
100_0402_1%
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT BE
TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. INADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DE LL'S EXPRESS WRITTENCONSENT.
9/5 M OW
Option 1: Implemen t a 1 kO hm pull- down resistor on the signal an d de-populate the
requir ed 1 kOh m pull-up resistor . In this case, customers must en sure that the SPI
flash dev ice on the platform has HOLD functi onality disabl ed bydefa ult.
Note t hat the pull down r esistor on SP I0_IO3 is only ne eded for SK L U/Y platfor ms
with E S and SKL S /H platform s with pre-ES1 /ES1samp les.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DE LL'S EXPRESS WRITTENCONSENT.
9/24: Reserve f or embed ded loc ation ,refer Intel PDG 0.9
ISH_I2C2_SDA <29>
ISH_I2C2_SCL <29>
ISH_UART0_RXD <29>
ISH_UART0_TXD <29>
ISH_UART0_RTS# <29>
ISH_UART0_CTS# <29>
LCD_CBL_DET# <26>
@
T121
PAD~D
VMM3320_LPM_DIS <24>
KB_DET# <39>
AUD_PWR_EN <30>
IR_CAM_DET# <26>
WWAN
WLAN
NO R EBOOT STRA P
HIG H
LOW(DEFAULT)
Wea kIPD
BB
+3.3V_ALW_PCH
12
@ RC184
8.2K_0402_5%
HDD_EN
No R EBOOT
REBO OTENA BLE
+5V_ALW
LPSS_UART2_TXD
LPSS_UART2_RXD
JUART1
1
1
2
2
3
3
4
4
5
6
GND
GND
ACES_50207-00471-P01
8/21
KB_DET#
LCD_CBL_DET#
IR_CAM_DET#
+3.3V_ALW_PCH
RC287100K_0402_5%
RC346100K_0402_5%
NON_DOCK
112
@
RC341
10K_0402_5%
DIMM_TYPE
RC342
10K_0402_5%
2
12
RC28810K_0402_5%
12
12
12
100_0402_1%@RH359
DIMM_TYPE
HIGH
DDR3L
LOWDDR4
+3.3V_RUN
BOOT BIOS Dest ination(Bit 10)
HIG H
LOW(DEFAULT)
LPC
SPI
AA
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT BE
TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION, NEITHER
THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY
WITHOUT DELL'S EXP RESS WRITTENCONSENT.
113_0402_1%8/19 for layout routingchange
0_0402_5%
1K_0402_5%
USB_OC0#
USB_OC3#36
USB_OC1#27
USB_OC2#18
HDD_FALL_INT
IFDET_SATA#_PCIE
PCH_SATA_LED#
HDD_DET#
SATAGP11
RPC3
45
10K_8P4R_5%
RPC4
45
3
6
7
2
18
10K_8P4R_5%
RC24610K_0402_5%
CKLT0.9
2
+3.3V_ALW_PCH
+3.3V_RUN
+3.3V_ALW_PCH
AA
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT BE
TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION, NEITHER
THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY
WITHOUT DELL'S EXP RESS WRITTENCONSENT.
For Sk ylake p op RC5 2a nd dep op RC32 4
For C annonl ake depop R C52 and po p RC32 4
5467 65_5467 65_2014W W48_Skyl ake_MO W_Rev_1 _0
PCH_RTCX1
@
RC324
CMOS1 must take care sh ort & touch risk on layou tplace ment
@RC344
SIO_SLP_LAN#
8/21 can change to 10K for merge to RP
GPP_B12/SLP_S0#
GPD4/SLP_S3#SIO_SLP_S3# <17,32,48>
GPD5/SLP_S4#
GPD10/SLP_S5#
SLP_SUS#
SLP_LAN#
GPD9/SLP_WLAN#
GPD6/SLP_A#
GPD3/PWRBTN#
GPD1/ACPRESENT
GPD0/BATLOW#
GPP_A11/PME#
INTRUDER#
GPP_B2/VRALERT#
11OF 20
+3.3V_RUN
12
@ RC291
10K_0402_5%
SYS_RESET#
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DE LL'S EXPRESS WRITTENCONSENT.
Servic e Mode Switc h:
Add a switch to M E_FWP signal to un lock the ME region and
allow the entire region of the SPI flash to be updated usin gFPT.
+3.3V_ALW_PCH
12
ME_F WP PCH has internal 20KPD.
(suspe nd power rail)
FLASH DE SCRIPTOR SECURITY OVERRIDE
LOW = ENABLE (DEF AULT)-->P in1 & Pin3 short
HIGH = DISABLE (ME can update ) -->Pin2 & Pin3 short
CONTACTLESS_DET# <33>
2
200_0402_1%
2
51_0402_5%
2
100_0402_1%
2
51_0402_5%
ME_FWP_EC
@
RC2210_0402_5%
PT,ST pop RC222 and SW 1; MP pop RC221
@
RC222
1K_0402_5%
<31> ME_FWP_EC
1
RC81
1
RC82
1
RC130
21
ME_FWP
+1.0V_VCCSTG
ME_FWP
@
SW1
1
A
2
B
3
4 C
5 G1
G2
SS3-CMFTQR9_3P
+3.3V_ALW_PCH+3.3V_ALW_PCH
1
2
@RC183
TOP SW AP STRAP
AA
HIG H
LOW(DEFAULT)
8.2K_0402_5%
ENABLE
DISABLE
SPKR
@RC187
Flash Des criptor Securi ty override
HIG H
LOW(DEFAULT)
HDA_SDOUT
1
2
4.7K_0402_5%
DISABLE
ENABLE
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT BE
TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION, NEITHER
THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY
WITHOUT DELL'S EXP RESS WRITTENCONSENT.
5432
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Date:of
Compal Electronics,Inc.
CPU (7/14)
Thursday, September 24, 2015
LA-C642P
1
Sheet
1260
Rev
1.0
54321
DD
CFG[2][ 5][6][7] for SKYLAK E-H CPU C FG stra ppin
For S kylak e RC1 20 depo p
For C annon lake RC1 20po p
5467 65_5467 65_2014W W48_Skyl ake_MO W_Rev_1 _0
@
T12
PAD~D
@
T13
PAD~D
@
T14
PAD~D
@
T15
PAD~D
@
T128
PAD~D
@
T129
PAD~D
@
T130
PAD~D
@
T126
PAD~D
@
T127
PAD~D
@
PAD~D
@
PAD~D
12
RC120100K_0402_5%
Cannonlake-U PCH compatibility
close UC1.U11/U12 and<400mil
+1.8V_PRIM+VCC_1P8
12
@RC3130_0402_5%
ZV M# for SKYLA KE-U 2+3e
T113
T114
MSM # for SKYLAK E-U 2+3e
+1.0V_VCCST
SPARE
SKL-U
RSVD_F6
RSVD_E3
RSVD_C11
RSVD_B11
RSVD_A11
RSVD_D12
RSVD_C12
RSVD_F52
20OF 20
F6
E3
C11
B11
A11
D12
C12
F52
UC1T
AW69
RSVD_AW69
AW68
RSVD_AW68
AU56
RSVD_AU56
AW48
RSVD_AW48
C7
RSVD_C7
U12
RSVD_U12
U11
RSVD_U11
H11
1
2
RSVD_H11
SKL-U_BGA1356
CC222
@
1U_0402_6.3V6K
AA
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT BE
TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION, NEITHER
THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY
WITHOUT DELL'S EXP RESS WRITTENCONSENT.
5432
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Compal Electronics,Inc.
CPU (8/14)
Thursday, September 24, 2015
LA-C642P
1
Sheet
1360
Rev
1.0
+1.0V_PRIM
12
+1.0V_PRIM_XDP
0.1U_0201_10V6
K
0.1U_0201_10V6
K
@
1
1
CC28
2
2
DD
Place near
JXDP1
<11,32> VCCST_PWRGD
<11,39> PCH_RSMRST#_Q
54321
+1.0V_PRIM_XDP
0_0603_1%@RC216
@
CC29
<12> XDP_OBS0_R
<12> XDP_OBS1_R
<8> PCH_SPI_DO_XDP
<11,32> RESET_OUT#
RC5 need to close toJCPU1
12
@RC123
1
RC124
CXDP@1K_0402_5%
FIVR_EN
CFG0@RC126
CXDP@ RC128
<8,20,21,42> DDR_XDP_WAN_SMBDAT
<8,20,21,42> DDR_XDP_WAN_SMBCLK
<10> CPU_XDP_PREQ#
<10> CPU_XDP_PRDY#
CXDP@ RC239
CXDP@ RC240
1K_0402_5%
2
1
@ RC217
1
@RC129
<12> CPU_XDP_TCLK
CPU XDP
1
2
1
2
<121,32>SIO_PWRBTN#
0_0402_5%
2
1K_0402_5%
1
2
0_0402_5%
12
0_0402_5%
<12> PCH_JTAG_TCK
CPU_XDP_PREQ#
0_0402_5%
0_0402_5%
H_VCCST_PWRGD_XDP
CPU_XDP_PRDY#
CFG0
CFG1
CFG2
CFG3
XDP_OBS0
XDP_OBS1
CFG4
CFG5
CFG6
CFG7
FIVR_EN_R
RESET_OUT#_R
CPU_XDP_TCLK
+1.0V_PRIM_XDP
XDP_PRSNT_PIN1
CXDP@
12 CFG3
1K_0402_5%
RC121
1
2
JXDP1
12
GND0GND1
3
OBSFN_A0OBSFN_C0
5
OBSFN_A1OBSFN_C1
7
GND2GND3
9
OBSDATA_A0OBSDATA_C0
11
OBSDATA_A1OBSDATA_C1
13
GND4GND5
15
OBSDATA_A2OBSDATA_C2
17
OBSDATA_A3OBSDATA_C3
19
GND6GND7
21
OBSFN_B0OBSFN_D0
23
OBSFN_B1OBSFN_D1
25
GND8GND9
27
OBSDATA_B0OBSDATA_D0
29
OBSDATA_B1OBSDATA_D1
31
GND10GND11
33
OBSDATA_B2OBSDATA_D2
35
OBSDATA_B3OBSDATA_D3
37
GND12GND13
39
PWRGOOD/HOOK0ITPCLK/HOOK4
41
HOOK1
43
VCC_OBS_AB
45
HOOK2
47
HOOK3
49
GND14
5152
SDATD0
53
SCLTRST#
55
TCK1TDI
57
TCK0TMS
59
GND16GND17
SAMTE_BSH-030-01-L-D-A CONN@
0_0402_5%@RC122
ITPCLK#/HOOK5
VCC_OBS_CD
RESET#/HOOK6
DBR#/HOOK7
GND15
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
54
56
58
60
+1.0V_PRIM_XDP
46
48
50
CFG17
CFG16
CFG8
CFG9
CFG10
CFG11
CFG19
CFG18
CFG12
CFG13
CFG14
CFG15
ITP_PMODE
XDP_DBRESET#
TDO_XDP
TRST#_XDP
TDI_XDP
XDP_TMS
<13> CFG[0..19]
CLK_ITPXDP_P_R <11>
CLK_ITPXDP_N_R <11>
ITP_PMODE <13>
XDP_DBRESET# <11>
PCH_SPI_DO2_XDP <8>
<31,32> RUNPWROK
CC30
1 2
0.1U_0201_10V6K
+3.3V_RUN
TDO_XDP
TDI_XDP
XDP_TMS
TRST#_XDP
UC8
14
VCC
2
1A
1
1OE
5
2A
4
2OE
9
3A
10
3OE
12
4A
13
4OE
74CBTLV3126BQ_DHVQFN14_2P5X3
GND
GNDPAD
3
1B
6
2B
8
3B
11
4B
7
15
CPU_XDP_TDO <12>
CPU_XDP_TDI <12>
CPU_XDP_TMS <12>
CPU_XDP_TRST# <12>
+1.0VS_VCCIO
CC
+1.0V_PRIM_XDP
BB
+1.0V_VCCST
+3.3V_RUN
RC137
@ RC138
RC132
12
12
12
1
1
FIVR_EN_R
150_0402_5%
FIVR_EN
150_0402_5%@RC218
FIVR_EN
10K_0402_5%@RC219
2
1K_0402_5%
2
51_0402_5%
XDP_DBRESET#
CPU_XDP_PREQ#
CKLT0.9
+3.3V_ALW_PCH
0.1U_0402_25V6
@ CC33
Place near JXDP1.47
12
1.5K_0402_5%
CXDP@RC133
PCH_SPI_DO_XDP
RESET_OUT#_R
21
9/1 f ollow S PI PWR rail
Place near JXDP1.48
XDP_DBRESET#
+3.3V_ALW_DSW
0.1U_0402_25V6
CXDP@
CC32
21
SIO_PWRBTN#
Place near JXDP1.41
12
21
EDS0.7
1.5K_0402_5%
@
RC241
0.1U_0402_25V6
@
CC269
CPU_XDP_TMS
CPU_XDP_TDI
CPU_XDP_TDO
CPU_XDP_TRST#
CPU_XDP_TCLK
XDP_TMS
@
TDI_XDP
@
TDO_XDP
@
51_0402_5%
51_0402_5%
100_0402_1%
51_0402_5%
51_0402_5%
12
RC228
1
RC229
1
RC230
2
2
2
2
2
0_0402_5%
2
0_0402_5%
2
0_0402_5%
1 RC131
1
RC134
1
RC135
1
RC136 CXDP@
1
RC139
PCH_JTAG_TDI <12>
+1.0V_VCCSTG
PCH_JTAG_TMS <12>
PCH_JTAG_TDO <12>
AA
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT BE
TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION, NEITHER
THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY
WITHOUT DELL'S EXP RESS WRITTENCONSENT.
5432
Tiiitllle
SiiizeDocumentNumber
Date:of
Compal Electronics,Inc.
CPU (9/14)
Thursday, September 24, 2015
LA-C642P
1
Sheet
1460
Rev
1.0
54321
+VCC_CORE:0.3~1.35V
DD
@
T122
PAD~D
@
T123
PAD~D
CC
VCCOPC ,VCCOPC_1P 8,VCCEOPIO for SKYL AKE-U 2+ 3e
(w / on p ackag ecache )
PSC(P rimary si de cap) : Place as cl ose to the pa ckage a s poss ible
BSC (Backs ide cap) : Place o n sec ondary sid e, unde rneath the pack age
Com ponent p lacem ent order :
Pac kage edge > 0402 caps > 0805 ca ps > Bu lk caps > Power s ource
ESD Request
+VCC_CORE+1.2V_MEM
+1.0V_PRIM+VCC_CORE
+1.0V_PRIM+3.3V_RUN
+1.0V_PRIM+1.2V_MEM
+VCC_CORE+3.3V_RUN
1 2
@EMC@ CC282 22U_0603_6.3V6M
1 2
@EMC@ CC283 22U_0603_6.3V6M
1 2
@EMC@ CC284 22U_0603_6.3V6M
1 2
@EMC@ CC285 22U_0603_6.3V6M
1 2
@EMC@ CC286 22U_0603_6.3V6M
1 2
@EMC@ CC287 22U_0603_6.3V6M
BB
8/21 CRB1.0 , DG0.9
SVID ALERT
<49> VIDALERT_N
SVID DATA
AA
<49> VIDSOUT
5432
+1.0V_VCCST
12
+1.0V_VCCST
12
56_0402_1%
RC152
100_0402_1%
RC157
CAD No te: Place the PU resistors close to CPU
RC204 close to C PU 300 - 1500mils
H_CPU_SVIDALRT#
12
RC153220_0402_5%
CAD No te: Place the PU resistors close toCPU
RC208cl ose to CP U 300 - 1500mils
VIDSOUT
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT BE
TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION, NEITHER
THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY
WITHOUT DELL'S EXP RESS WRITTENCONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT BE
TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION, NEITHER
THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY
WITHOUT DELL'S EXP RESS WRITTENCONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT BE
TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION, NEITHER
THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY
WITHOUT DELL'S EXP RESS WRITTENCONSENT.
TC7SH08FU_SSOP5~D
+1.0V_VCCSTG source
+1.0V_PRIM
12
1U_0402_6.3V6K
+5V_ALW
+3.3V_ALW
5
1
B
4
O
2
A
G P
UC13
3
12
@RC320
0_0402_5%
UZ19
1
VIN1
2
VIN2
7
VINthermal
3
VBIAS
ONGND
TPS22961DNYR_WSON8
4.4 mohm/6 A
TR=12.5 us@Vin=1.05V
+1.0V_VCCST+1.0V_VCCSTG
12
VOUT
6
54
12
PJP32
PAD-OPEN1x1m
+1.0V_VCCSTG_C
@RC238
@
CZ82
0_0603_5%
pop option withUZ19
1 2
0.1U_0201_10V6K
DELL CONFIDENTIAL/PROPRIETARY
Tiiitllle
Siiize
Date:of
Compal Electronics,Inc.
Document Number
Thursday, September 24, 2015
CPU (12/14)
LA-C642P
1
Sheet
1760
Rev
1.0
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