Datasheet XM28C010PMHR-90, XM28C010PMHR-70, XM28C010PMHR-20, XM28C010PMHR-15, XM28C010PMHR-12 Datasheet (XICOR)

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1 Megabit Puma Module

XM28C010P

High Speed 5 Volt Byte Alterable Nonvolatile Memory Array

FEATURES

• High Speed, High Density Memory Module
—150ns, 120ns, 90ns and 70ns Access Times

Available

—1 Megabit Memory in 1 square inch.

• Flexible Multiplane Architecture
—Four Separate Chip Selects
—32 Separate I/Os

• User Configurable I/Os—x8, x16, or x32

• User Configurable Page Size—64 Double­words, 128 Words, or 256 Bytes

—Concurrent Read/Write Operations

• Able to Continue Reading During a
Nonv olatile Write Cycle.

• 5 Volt Byte or Page Alterable
—No Erase Before Write

• Software Data Protection

• Early End of Write Polling

ATA Polling

—D
—Toggle Bit Polling

32K x 32 Bit

• High Reliability
—Endurance: 100,000 Cycles
—Data Retention: 100 Years

DESCRIPTION

The XM28C010P is a high speed, high density CMOS
byte alterable non volatile memory array constructed on
a co-fired ceramic substrate using Xicor’s High Speed
32K x 8 components in 32-pad leadless chip carriers.
The Substrate is a 66-pin ceramic pin grid array.

The module is configured with four separate chip
enable and write enable inputs and 32 separate I/Os.
This, along with the small footprint, provides the end
user with a large degree of flexibility in board la yout and
memory configuration. In addition, with the large num­ber of pins and the growth path being implemented, the
module will be able to grow to 16 megabits.

FUNCTIONAL DIAGRAM

OE WE1 CE1 WE2 CE2 WE3 CE3 WE4 CE4

32k x 8

A0–A15 I/O0–I/O7

32k x 8

I/O8–I/O15

32k x 8 32k x 8

I/O16–I/O23

I/O24–I/O31

6491 ILL F01

Xicor, 1995, 1996 Patents Pending

6491-1.3 8/12/97 T0/C2/D0 NS

1

Characteristics subject to change without notice

XM28C010P

PIN CONFIGURATION

1 12 23 34 45 56

PACKAGE INFORMATION

I/O8 WE2 I/O15

I/O9 CE2 I/O14

I/O10 GND I/O13

A13 I/O11 I/O12

A14 A10 OE

NC A11 NC

NC A12 WE1

NC VCC I/O7

I/O0 CE1 I/O6

I/O1 NC I/O5

I/O2 I/O3 I/O4

11 22 33 44 55 66

I/O24 VCC I/O31

I/O25 CE4 I/O30

I/O26 WE4 I/O29

A6 I/O27 I/O28

A7 A3 A0

A15 A4 A1

A8 A5 A2

A9 WE3 I/O23

I/O16 CE3 I/O22

I/O17 GND I/O21

I/O18 I/O19 I/O20

6491 ILL F02

.050 TYP

.100 TYP

PIN #1
IDENTIFIER
(NOT CHAMFERED)

.100 TYP

0.15

ALL MEASUREMENTS IN INCHES

1.09+/-.010 SQ

.600 TYP

.040

.410

.149+/-.015

.180

.320 MAX

.164

.050

.130

.018

6491 ILL F03.1

2

XM28C010P

ORDERING INFORMATION

XM28C010P X X

–

Access Time

70 = 70ns
90 = 90ns
12 = 120ns
15 = 150ns
20 = 200ns

Devices

Temperature Range

Blank = Commercial = 0°C to +70°C
I = Industrial = –40°C to +85°C
M = Military = –55°C to +125°C

MHR = Military High Rel

P = 66 Pin PUMA Module

LIMITED WARRANTY

Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty,
express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement.
Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and
prices at any time and without notice.

Xicor, Inc. assumes no responsibility f or the use of an y circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, licenses are implied.

U.S. PATENTS

Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481; 4,404,475; 4,450,402;
4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829, 482; 4,874, 967; 4,883, 976. Foreign patents and additional pat­ents pending.

LIFE RELA TED POLICY

In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detec­tion and correction, redundancy and back-up features to prev ent such an occurrence.

Xicor's products are not authorized for use in critical components in life support devices or systems

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure
to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.

2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiv eness.

3