The VNS3NV04DP-E device is made up of two
monolithic chips (OMNIFET II) housed in a
standard SO-8 package. The OMNIFET II is
designed using STMicroelectronics™ VIPower™
M0-3 technology and is intended for replacement
of standard Power MOSFETs in up to 50 kHz DC
applications.
Built-in thermal shutdown, linear current limitation
and overvoltage clamp protect the chip in harsh
environments.
Fault feedback can be detected by monitoring
voltage at the input pin
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to Absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
program and other relevant quality document.
Table 2.Absolute maximum ratings
DRAIN 1
DRAIN 2
SOURCE 2
I
D1
I
D2
V
DS1
V
DS1
SymbolParameterValueUnit
V
V
I
R
IN MINn
I
I
V
ESD1
V
ESD2
P
T
DSn
INn
INn
Dn
Rn
tot
T
j
T
c
stg
Drain-Source Voltage (V
= 0 V)Internally clampedV
INn
Input voltageInternally clampedV
Input current +/- 20mA
Minimum input series impedance220Ω
Drain current Internally limitedA
Reverse DC output current -5.5A
Electrostatic discharge (R = 1.5 KΩ, C = 100 pF)4000V
Electrostatic discharge on output pins only (R = 330 Ω,
C=150pF)
Figure 11.Derating curveFigure 12. Static drain-source on
Figure 10. Static drain-source on
resistance
Rds(on) (mohms)
1000
900
800
700
600
500
400
300
200
100
0
0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55
Tj=-40ºC
Vin=2.5V
Tj=25ºC
Tj=150ºC
Id(A)
resistance vs input voltage
(part 1)
Rds(on) (mohms)
300
275
250
Tj=150ºC
225
200
175
150
Tj=25ºC
125
100
Tj=-40ºC
75
50
25
0
33.544.555.566.5
Vin(V)
Id=3.5A
Id=1A
Id=3.5A
Id=1A
Id=3.5A
Id=1A
Figure 13. Static drain-source on
Figure 14. Transconductance
resistance vs input voltage
(part 2)
Rds(on) (mohms)
250
225
200
175
150
125
100
75
50
25
0
33.544.555.566.5
Vin(V)
Id=1.5A
Tj=150ºC
Tj=25ºC
Tj=-40ºC
12/21Doc ID 018529 Rev 1
Gfs (S)
11
10
Vds=13V
9
8
7
6
5
4
3
2
1
0
0 0.5 1 1 .5 2 2.5 3 3.5 4 4.5 5 5.5
Id (A)
Tj=-40ºC
Tj=25ºC
Tj=150ºC
Page 13
VNS3NV04DP-EElectrical specifications
Figure 15. Static drain-source on
Figure 16. Transfer characteristics
resistance vs Id
Rds(on) (mohms)
250
225
200
175
150
125
100
75
50
25
0
Vin=5V
Tj=150ºC
Tj=25ºC
Tj= - 40ºC
00.511.522.533.54
Id (A)
Idon (A)
6
5.5
4.5
3.5
2.5
1.5
0.5
Vds=13.5V
5
4
3
2
1
0
Tj=150ºC
Tj=-40ºC
Tj=25ºC
1.522.533.544.555.56
Vin (V)
Figure 17. Turn-on current slope (part 1) Figure 18. Turn-on current slope (part 2)
di/dt(A/us)
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
0
250
500
750
1000
1250
Rg(ohm)
1500
Vdd=15V
1750
Vin=5V
Id=1.5A
2000
2250
2500
di/dt(A/usec)
1.75
1.5
1.25
1
0.75
0.5
0.25
0
0
Vin=3.5V
Vdd=15V
Id=1.5A
250
750
1250
1750
500
1000
1500
Rg(ohm)
2000
2250
2500
Figure 19. Input voltage vs input charge Figure 20.Turn-off drain source voltage
slope (part 1)
Vin (V)
9
8
Vds=1V
Id=1.5A
7
6
5
4
3
2
1
0
012345 67891011
Qg (nC)
Doc ID 018529 Rev 113/21
dv/dt(V/usec)
300
275
250
225
200
175
150
125
100
75
50
25
0
0
250
500
750
1000
1250
Rg(ohm)
1500
Vdd=15V
1750
Vin=5V
Id=1.5A
2000
2250
2500
Page 14
Electrical specificationsVNS3NV04DP-E
Figure 21. Turn-off drain-source voltage
slope (part 2)
dv/dt(V/usec)
300
275
250
225
200
175
150
125
100
75
50
25
0
0
500
750
1000
1250
250
1500
Vin=3.5V
Vdd=15V
1750
Id=1.5A
2000
2250
2500
Rg(ohm)
Figure 23. Switching time resistive load
(part 1)
t(usec)
4
3.5
Vdd=15V
3
Id=1.5A
2.5
1.5
0.5
Vin=5V
2
1
0
0
500
750
1000
1250
250
Rg(ohm)
1500
1750
td(off)
2000
tr
tf
td(on)
2250
2500
Figure 22. Capacitance variations
C(pF)
350
300
250
200
150
100
50
05101520253035
Vds(V)
f=1MHz
Vin=0V
Figure 24. Switching time resistive load
(part 1)
t(nsec)
900
800
700
600
500
400
300
200
100
0
3.25 3.5 3.7544.25 4.5 4.7555.25
td(off)
tf
td(on)
tr
Vin(V)
Vdd=15V
Id=1.5A
Rg=220ohm
Figure 25. Output characteristicsFigure 26. Normalized on resistance vs
Id (A)
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
012345678910
Vds (V)
14/21Doc ID 018529 Rev 1
Vin=5V
Vin=4V
Vin=3V
temperature
Rds(on) (mOhm)
4
3.5
3
2.5
2
1.5
0.5
Vin=5V
Id=1.5A
1
-50 -250255075 100 125 150 175
Tc )ºC)
Page 15
VNS3NV04DP-EElectrical specifications
Figure 27. Normalized input threshold
voltage vs temperature
Figure 28. Normalized current limit vs
junction temperature
Vinth (V)
2
1.8
1.6
1.4
1.2
0.8
0.6
0.4
0.2
Vds=Vin
Id=1mA
1
0
-50 -250255075 100 125 150 175
Tc (ºC)
Figure 29. Step response current limit
Tdlim(usec)
13
12.5
12
11.5
11
10.5
10
9.5
9
8.5
8
7.5
5 7.5 10 12.5 15 17.5 20 22.5 25 27.5 30 32.5
Vdd(V)
Vin=5V
Rg=220ohm
Ilim (A)
10
9
8
7
6
5
4
3
2
1
0
Vin=5V
Vds=13V
-50 -250255075 100 125 150 1 75
Tc ( ºC )
Doc ID 018529 Rev 115/21
Page 16
Protection featuresVNS3NV04DP-E
3 Protection features
During normal operation, the INPUT pin is electrically connected to the gate of the internal
power MOSFET through a low impedance path.
The device then behaves like a standard power MOSFET and can be used as a switch from
DC up to 50 KHz. The only difference from the user’s standpoint is that a small DC current
I
(typ. 100 µA) flows into the INPUT pin in order to supply the internal circuitry.
ISS
The following sections describe the device features.
3.1 Overvoltage clamp protection
Internally set at 45 V, along with the rugged avalanche characteristics of the Power
MOSFET stage give this device unrivalled ruggedness and energy handling capability. This
feature is mainly important when driving inductive loads.
3.2 Linear current limiter circuit
Limits the drain current ID to I
is active, the device operates in the linear region, so power dissipation may exceed the
capability of the heatsink. Both case and junction temperatures increase, and if this phase
lasts long enough, junction temperature may reach the overtemperature threshold T
whatever the INPUT pin voltages. When the current limiter
lim
3.3 Overtemperature and short circuit protection
These are based on sensing the chip temperature and are not dependent on the input
voltage. The location of the sensing element on the chip in the power stage area ensures
fast, accurate detection of the junction temperature. Overtemperature cutout occurs in the
range 150 to 190 °C, a typical value being 170 °C. The device is automatically restarted
when the chip temperature falls of about 15 °C below shutdown temperature.
3.4 Status feedback
In the case of an overtemperature fault condition (Tj > T
diagnostic current I
a low impedance source, this current may be used in order to warn the control circuit of a
device shutdown. If the drive impedance is high enough so that the INPUT pin driver is not
able to supply the current I
operation: no requirement is put on the current capability of the INPUT pin driver except to
be able to supply the normal operation drive current I
Additional features of this device are ESD protection according to the Human Body model
and the ability to be driven from a TTL Logic circuit.
through the INPUT pin in order to indicate fault condition. If driven from
gf
, the INPUT pin falls to 0 V. This however not affects the device
gf
), the device tries to sink a
jsh
.
ISS
jsh.
16/21Doc ID 018529 Rev 1
Page 17
VNS3NV04DP-EPackage and packing information
4 Package and packing information
4.1 ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
4.2 SO-8 mechanical data
Table 10.SO-8 mechanical data
Dim.
Min. Typ. Max.
A 1.75
A1 0.10 0.25
A2 1.25
b 0.28 0.48
c 0.17 0.23
(1)
D
E 5.80 6.00 6.20
(2)
E1
e 1.27
h 0.25 0.50
4.80 4.90 5.00
3.80 3.90 4.00
mm
L 0.40 1.27
L1 1.04
k 0°8°
ccc 0.10
1. Dimension “D” does not include mold Flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15 mm in total (both side).
2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not
exceed 0.25 mm per side.
Doc ID 018529 Rev 117/21
Page 18
Package and packing informationVNS3NV04DP-E
Figure 30. SO-8 package dimension
0016023 D
18/21Doc ID 018529 Rev 1
Page 19
VNS3NV04DP-EPackage and packing information
4.3 SO-8 packing information
Figure 31. SO-8 tube shipment (no suffix)
B
C
A
Figure 32. Tape and reel shipment (suffix “TR”)
Base Q.ty100
Bulk Q.ty2000
Tube length (± 0.5)532
A3.2
B6
C (± 0.1)0.6
All dimensions are in mm.
REEL DIMENSIONS
Base Q.ty2500
Bulk Q.ty2500
A (max)330
B (min)1.5
C (± 0.2)13
F20.2
G (+ 2 / -0)12.4
N (min)60
T (max)18.4
All dimensions are in mm.
TAPE DIMENSIONS
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(EIA) Standard 481 rev. A, Feb. 1986
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