The VNS3NV04D-E is a device formed by two
monolithic OMNIFET II chips housed in a
standard SO-8 package. The OMNIFET II are
designed in STMicroelectronics VIPower M0-3
Technology: they are intended for replacement of
standard Power MOSFETs from DC up to 50KHz
applications. Built in thermal shutdown, linear
current limitation and overvoltage clamp protects
the chip in harsh environments.
Fault feedback can be detected by monitoring the
voltage at the input pin.
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to Absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
program and other relevant quality document.
Table 2.Absolute maximum ratings
DRAIN 1
DRAIN 2
SOURCE 2
I
D1
I
D2
V
DS1
V
DS1
SymbolParameterValueUnit
V
V
I
R
IN MINn
I
I
V
ESD1
V
ESD2
P
T
Drain-Source Voltage (V
DSn
Input voltageInternally clampedV
INn
Input current +/-20mA
INn
=0V)Internally clampedV
INn
Minimum input series impedance220Ω
Drain current Internally limitedA
Dn
Reverse DC output current -5.5A
Rn
Electrostatic discharge (R=1.5KΩ, C=100pF)4000V
Electrostatic discharge on output pins only (R=330Ω,
C=150pF)
Figure 11. Derating curveFigure 12. Static Drain-Source On
resistance vs. Input voltage
Rds (on) (mohms)
300
275
250
Tj=150ºC
225
200
175
150
Tj=25ºC
125
100
Tj=-40ºC
75
50
25
0
33.544.555.566.5
Id=3.5A
Id=1A
Id =3.5A
Id =1A
Id=3.5A
Id=1A
Vin(V)
Figure 13. Static Drain-Source On
Figure 14. Transconductance
resistance Vs. Input voltage
Rds (on) (mohms)
250
225
200
175
150
125
100
75
50
25
0
33.544.555.566.5
Vin(V)
Id =1.5 A
Tj=150ºC
Tj=25ºC
Tj=-40ºC
12/21
Gfs (S)
11
10
Vds=13V
9
8
7
6
5
4
3
2
1
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4 .5 5 5.5
Id ( A )
Tj=-40ºC
Tj=25ºC
Tj=150ºC
Page 13
VNS3NV04D-EElectrical specifications
Figure 15. Static Drain-Source On
Figure 16. Transfer characteristics
resistance Vs. Id
R ds (on) (mo hms)
250
225
200
175
150
125
100
75
50
25
0
Vin=5V
Tj=150ºC
Tj=25ºC
Tj= - 40ºC
00.511.522 .533.54
Id (A )
Ido n (A )
6
5.5
Vds=13 .5V
5
4.5
4
3.5
3
2.5
2
1.5
0.5
0
Tj=150ºC
Tj=-40ºC
Tj=25ºC
1
1.522.533.544.555.56
Vin (V)
Figure 17. Turn On current slopeFigure 18. Turn On current slope
di/dt(A/us)
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
0
Vin=5V
Vdd=15V
Id =1.5A
500
1000
1500
2000
250
750
1250
1750
2250
2500
Rg(ohm)
di/dt(A/usec)
1.75
1.5
1.25
1
0.75
0.5
0.25
0
0
Vin=3. 5V
Vdd=15V
Id =1. 5A
250
750
1250
500
1000
Rg(ohm)
1500
1750
2000
2250
2500
Figure 19. Input voltage Vs. Input
charge
Vin (V)
9
8
Vds=1V
Id =1. 5A
7
6
5
4
3
2
1
0
012345 67891011
Qg (nC)
Figure 20. Turn off Drain source voltage
slope
dv/dt(V/usec)
300
275
250
225
200
175
150
125
100
75
50
25
0
0
500
750
1000
1250
250
Rg(ohm)
13/21
1500
Vdd=15V
1750
Vin=5V
Id =1.5A
2000
2250
2500
Page 14
Electrical specificationsVNS3NV04D-E
Figure 21. Turn off Drain-Source voltage
Figure 22. Capacitance variations
slope
dv/dt(V/usec)
300
275
250
225
200
175
150
125
100
75
50
25
0
0
250
500
750
1000
1250
Rg(ohm)
1500
1750
Vin=3.5V
Vdd=15V
Id =1.5A
2000
2250
2500
C(pF)
350
300
250
200
150
100
50
05101520253035
Vds(V)
f=1MHz
Vin=0V
Figure 23. Switching time resistive load Figure 24. Switching time resistive load
t(us ec )
4
3.5
3
2.5
2
1.5
1
0.5
0
Vdd=15V
Id =1.5A
Vin=5V
td(off)
tr
tf
td(on)
0
500
1000
1500
250
750
1250
1750
2000
2250
2500
Rg(ohm)
t(ns ec)
900
800
700
600
500
400
300
200
100
0
3.25 3.5 3.7544.25 4.5 4.7555.25
td(off)
tf
td(on )
tr
Vdd=15V
Id =1.5A
Rg=220oh m
Vin(V)
Figure 25. Output characteristicsFigure 26. Normalized On resistance Vs.
Id ( A )
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
012345678910
Vds (V)
14/21
Vin=5V
Vin=4V
Vin=3V
temperature
Rds(on) (mOhm)
4
3.5
3
2.5
2
1.5
0.5
Vin=5V
Id =1.5A
1
-50 -2502550 75 100 125 150 175
Tc )ºC )
Page 15
VNS3NV04D-EElectrical specifications
Figure 27. Normalized Input threshold
voltage Vs. temperature
Figure 28. Normalized current limit Vs.
junction temperature
Vinth (V)
2
1.8
1.6
1.4
1.2
0.8
0.6
0.4
0.2
0
Vds=Vin
Id =1mA
1
-50 -25025 5075 100 125 150 175
Tc (ºC )
Figure 29. Step response current limit
Tdlim(usec)
13
12.5
12
11.5
11
10.5
10
9.5
9
8.5
8
7.5
5 7.5 10 12.5 15 17.5 20 22.5 25 27.5 30 32.5
Vdd(V)
Vin=5V
Rg=220oh m
Ili m (A )
10
9
8
7
6
5
4
3
2
1
0
Vin=5V
Vds=13V
-50 -250255075 100 125 150 175
Tc ( ºC )
15/21
Page 16
Protection featuresVNS3NV04D-E
3 Protection features
During normal operation, the INPUT pin is electrically connected to the gate of the internal
power MOSFET through a low impedance path.
The device then behaves like a standard power MOSFET and can be used as a switch from
DC up to 50KHz. The only difference from the user’s standpoint is that a small DC current
I
(typ. 100µA) flows into the INPUT pin in order to supply the internal circuitry.
ISS
The device integrates:
3.1 Overvoltage clamp protection
Internally set at 45V, along with the rugged avalanche characteristics of the Power MOSFET
stage give this device unrivalled ruggedness and energy handling capability. This feature is
mainly important when driving inductive loads.
3.2 Linear current limiter circuit
Limits the drain current ID to I
is active, the device operates in the linear region, so power dissipation may exceed the
capability of the heatsink. Both case and junction temperatures increase, and if this phase
lasts long enough, junction temperature may reach the overtemperature threshold T
whatever the INPUT pin voltages. When the current limiter
lim
3.3 Overtemperature and short circuit protection
These are based on sensing the chip temperature and are not dependent on the input
voltage. The location of the sensing element on the chip in the power stage area ensures
fast, accurate detection of the junction temperature. Overtemperature cutout occurs in the
range 150 to 190 °C, a typical value being 170 °C. The device is automatically restarted
when the chip temperature falls of about 15°C below shut-down temperature.
3.4 Status feedback
In the case of an overtemperature fault condition (Tj > T
diagnostic current I
a low impedance source, this current may be used in order to warn the control circuit of a
device shutdown. If the drive impedance is high enough so that the INPUT pin driver is not
able to supply the current I
device operation: no requirement is put on the current capability of the INPUT pin
driver except to be able to supply the normal operation drive current I
Additional features of this device are ESD protection according to the Human Body model
and the ability to be driven from a TTL Logic circuit.
through the INPUT pin in order to indicate fault condition. If driven from
gf
, the INPUT pin will fall to 0V. This will not however affect the
gf
), the device tries to sink a
jsh
ISS
jsh.
.
16/21
Page 17
VNS3NV04D-EPackage and packing information
4 Package and packing information
4.1 ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second-level interconnect. The category of
Second-Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
17/21
Page 18
Package and packing informationVNS3NV04D-E
4.2 SO-8 Package mechanical data
Figure 30. SO-8 package mechanical data & package outline
DIM.
A1.7500.0689
A10.1000.250 0.00390.0098
A21.2500.0492
b0.2800.480 0.01100.0189
c0.1700.230 0.00670.0091
(1)
D
E5.800 6.000 6.200 0.2283 0.2362 0.2441
(2)
E1
e1.2700.0500
h0.2500.500 0.00980.0197
L0.4001.270 0.01570.0500
L11.0400.0409
k0˚8˚0˚8˚
ccc0.1000.0039
Notes: 1. Dimensions D does not include mold flash,
protrusions or gate burrs.
Mold flash, po trusions or gate burrs shall not
exceed 0.15m m in total (bo th side).
2. Dimension “E1” does not include interlead flash
or protrusions. Interlead flash or protrusions shall
not exceed 0.25 mm per side.
mminch
MIN. TYP. MAX. MIN. TYP. MAX.
4.800 4.900 5.000 0.1890 0.1929 0.1969
3.800 3.900 4.000 0.1496 0.1535 0.1575
OUTLINE AND
MECHANICAL DATA
SO-8
18/21
0016023 D
Page 19
VNS3NV04D-EPackage and packing information
4.3 SO-8 Packing information
Figure 31. SO-8 tube shipment (no suffix)
B
C
Base Q.ty100
Bulk Q.ty2000
Tube length (± 0.5)532
A
A3.2
B6
C (± 0.1)0.6
All dimensions are in mm.
Figure 32. SO-8 tape and reel shipment (suffix “TR”)
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Base Q.ty2500
Bulk Q.ty2500
A (max)330
B (min)1.5
C (± 0.2)13
F20.2
G (+ 2 / -0)12.4
N (min)60
T (max)18.4
All dimensions are in mm.
Start
Top
cover
tape
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
No componentsNo componentsComponents
500mm min
19/21
Page 20
Revision historyVNS3NV04D-E
5 Revision history
Table 10.Document revision history
DateRevisionChanges
28-Oct-20051Initial release.
02-Jul-20072
Document reformatted and converted into new ST template.
Tab l e 4: O ff - I
unit corrected
DSS
20/21
Page 21
VNS3NV04D-E
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