Datasheet VNQ600 Datasheet (ST)

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Page 1

Features

Max supply voltage V

Max On-state resistance R

Current limitation (typ.) I

1. Per each channel.

LIM

VNQ600

Quad channel high side solid state relay

36V

(1)

35mΩ

25A

■ DC short circuit current: 25A

■ CMOS compatible inputs

■ Proportional load current sense.

■ Undervoltage & overvoltage shutdown

■ Overvoltage clamp

■ Thermal shutdown

■ Current limitation

■ Very low standby power dissipation

■ Protection against:

– Loss of ground & loss of V

■ Reverse battery protection

(a)

SO-28 (double island)

Description

The VNQ600 is a quad HSD formed by assembling two VND600 chips in the same SO-28 package. The VNQ600 is a monolithic device designed in| STMicroelectronics VIPower M0-3 Technology. The VNQ600 is intended for driving any type of multiple loads with one side connected to ground.

This device has four independent channels and four analog sense outputs which deliver currents proportional to the outputs currents.

Active current limitation combined with thermal shutdown and automatic restart protect the device against overload. Device automatically turns off in case of ground pin disconnection.

a. See Application schematic on page 17

Table 1. Device summary

Order codes

Package

Tube Tape and reel

SO-28 (double island) VNQ600 VNQ60013TR

November 2008 Rev 10 1/26

www.st.com

Page 2

Contents VNQ600

1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 17

3.1.1 Solution 1: a resistor in the ground line (RGND only) . . . . . . . . . . . . . . 17

3.1.2 Solution 2: a diode (D

3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.3 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.4 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . 19

) in the ground line . . . . . . . . . . . . . . . . . . . . 18

GND

4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

4.1 SO-28 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

5.2 SO-28 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

2/26

Page 3

VNQ600 List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6

Table 3. Absolute maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 4. Thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 5. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 6. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 7. Switching (V Table 8. Current sense (9V< V

Table 9. Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Table 10. V

- output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Table 11. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Table 12. Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 13. Thermal calculation according to the PCB heatsink area . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Table 14. Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Table 15. SO-28 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Table 16. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

=13V; Tj = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

< 16V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3/26

Page 4

List of figures VNQ600

List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Figure 4. I

OUT/ISENSE

Figure 5. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 7. Off state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 10. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 11. Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 12. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 13. I

vs Tcase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

LIM

Figure 14. On state resistance vs V

Figure 15. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 16. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 17. On state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 18. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 19. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Figure 20. Maximum turn-off current versus load inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 21. SO-28 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Figure 22. Rthj-amb Vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 21

Figure 23. Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 24. Thermal fitting model of a quad channel HSD in SO-28 . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Figure 25. SO-28 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 26. SO-28 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Figure 27. SO-28 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

versus I

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

OUT

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4/26

Page 5

VNQ600 Block diagram and pin description

1 Block diagram and pin description

Figure 1. Block diagram

1,2

OVERVOLTAGE

UNDERVOLTAGE

INPUT 1

INPUT 2

GND 1,2

INPUT 3

INPUT 4

GND 3,4

OVERTEMP. 1

OVERTEMP. 2

OVERTEMP. 3

OVERTEMP. 4

LOGIC

DRIVER 1

OUT1

DRIVER 2

OUT2

OVERVOLTAGE

UNDERVOLTAGE

DRIVER 3

OUT3

DRIVER 4

OUT4

DEMAG 1

LIM1

DEMAG 2

LIM2

DEMAG 3

LIM3

DEMAG 4

LIM4

OUTPUT 1

CURRENT SENSE 1

OUTPUT 2

CURRENT SENSE 2

3,4

OUTPUT 3

CURRENT SENSE 3

OUTPUT 4

CURRENT SENSE 4

5/26

Page 6

Block diagram and pin description VNQ600

Figure 2. Configuration diagram (top view)

1,2

OUTPUT 2

OUTPUT 1

OUTPUT 4

OUTPUT 3

3,4

VCC1,2

GND 1,2

INPUT2

INPUT1

CURRENT

SENSE 1

SENSE 2

1,2

3,4

GND 3,4

INPUT4

INPUT3

CURRENT SENSE 3

CURRENT SENSE 4

3,4

Table 2. Suggested connections for unused and not connected pins

Connection / pin Current sense N.C. Output Input

Floating X X X

To ground

Through 1KΩ

resistor

Through 10KΩ

resistor

6/26

Page 7

VNQ600 Electrical specifications

2 Electrical specifications

2.1 Absolute maximum ratings

Stressing the device above the rating listed in the “Absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality document.

Table 3. Absolute maximum rating

Symbol Parameter Value Unit

-V

OUT

CSENSE

GND

ESD

MAX

Supply voltage (continuous) 41 V

Reverse supply voltage (continuous) -0.3 V

Output current (continuous), for each channel 15 A

Reverse output current (continuous), for each channel -15 A

Input current +/- 10 mA

Current sense maximum voltage

Ground current at T

< 25 °C (continuous) -200 mA

pins

-3

+15

Electrostatic discharge (Human Body Model: R=1.5KΩ; C=100pF)

- INPUT

- CURRENT SENSE

- OUTPUT

- V

Maximum switching energy (L=0.11mH; R

Power dissipation (per island) at T

tot

Junction operating temperature Internally limited °C

Storage temperature -55 to 150 °C

stg

=0Ω; V

=13.5V; T

bat

=150ºC; IL=40A)

jstart

=25°C 6.25 W

lead

4000 2000 5000 5000

126 mJ

V V

V V V V

7/26

Page 8

Electrical specifications VNQ600

2.2 Thermal data

Table 4. Thermal data (per island)

Symbol Parameter Value Unit

thj-lead

thj-amb

Thermal resistance junction-lead 20 °C/W

Thermal resistance junction-ambient (one chip ON)

Thermal Resistance junction-ambient (two chips ON)

1. When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35 µm thick) connected to all V

2. When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35 µm thick) connected to all V

pins. Horizontal mounting and no artificial air flow.

2.3 Electrical characteristics

Values specified in this section are for 8V<VCC<36V; -40°C< Tj <150°C, unless otherwise stated.

Figure 3. Current and voltage conventions

S3,4

CC3,4

IN1

SENSE3

SENSE1

IN2

SENSE2

IN3

SENSE3

IN4

SENSE4

IN4

STAT4

IN1

SENSE1

IN2

SENSE2

IN3

CC3,4

INPUT1

CUR. SENSE1

INPUT2

CUR. SENSE2

INPUT3

CUR. SENSE3

INPUT4

CUR. SENSE4

GND

3,4

GND3,4

CC1,2

OUTPUT1

OUTPUT2

OUTPUT3

OUTPUT4

GND

(1)

OUT1

OUT2

OUT3

OUT4

1,2

GND1,2

S1,2

OUT2

(2)

OUT1

°C/W

CC1,2

Note: V

= V

CCn

- V

during reverse battery condition.

OUTn

8/26

Page 9

VNQ600 Electrical specifications

Table 5. Power

Symbol Parameter Test conditions Min. Typ. Max. Unit

USD

clamp

L(off1)

L(off2)

L(off3)

L(off4)

Operating supply voltage 5.5 13 36 V

Undervoltage shutdown 3 4 5.5 V

Overvoltage shutdown 36 V

1,2,3,4=5A; Tj=25°C

OUT

On state resistance

1,2,3,4=5A; Tj=150°C

OUT

1,2,3,4=3A; V

OUT

=6V

Clamp voltage ICC=20mA 41 48 55 V

Off State; VCC=13V;

Supply current

Off state output current VIN=V

Off state output current VIN=0V; V

Off state output current

VIN=V

OUT

Off State; V VIN=V

OUT

=25°C

On State; V I

=0A; R

OUT

VIN=V

OUT

=125°C

VIN=V

OUT

=25°C

=0V

=13V;

=0V;

=13V; VIN=5V;

=3.9KΩ

SENSE

=0V 0 50 µA

=3.5V -75 0 µA

OUT

=0V; VCC=13V;

mΩ

120

mΩ

µA

5µA

3µA

Note: V

and VOV are correlated. Typical difference is 5V.

clamp

Table 6. Protections

Symbol Parameter Test conditions Min. Typ. Max. Unit

demag

=13V

DC Short circuit

lim

current

5.5V<VCC<36V

Thermal shutdown

TSD

temperature

Thermal reset

temperature

Thermal hysteresis 7 15 °C

hyst

Turn-off output voltage clamp

Output voltage drop

limitation

=2A; L=6mH VCC-41 VCC-48 VCC-55 V

OUT

=0.5A; Tj= -40°C...+150°C 50 mV

OUT

25 40 70

A A

150 175 200 °C

135 °C

Note: To ensure long term reliability under heavy overload or short circuit conditions, protection

and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles.

9/26

Page 10

Electrical specifications VNQ600

Table 7. Switching (VCC=13V; Tj=25°C)

Symbol Parameter Test conditions Min. Typ. Max. Unit

RL=2.6Ω channels 1,2,3,4 (see Figure 5)

40 µs

See

Figure 10

See

Figure 12

d(on)

d(off)

(dV

/dt)onTurn-on voltage slope

OUT

/dt)

(dV

OUT

Turn-on delay time

Turn-off delay time

Turn-off voltage slope

off

Table 8. Current sense (9V< VCC< 16V)

Symbol Parameter Test conditions Min. Typ. Max. Unit

1/K1

dK2/K

3/K3

SENSE1,2

SENSEH

OUT/ISENSE

Current sense ratio drift

OUT/ISENSE

Current sense ratio

drift

OUT/ISENSE

Current sense ratio drift

Max analog sense output voltage

Analog sense output voltage in overtemperature condition

or I

OUT1

SENSE

open; Tj= -40°C...150°C

or I

OUT1

SENSE

open; Tj= -40°C...150°C

or I

OUT1

other channels open;

=-40°C

=25°C...150°C

or I

OUT1

SENSE

open;

=-40°C...150°C

or I

OUT1

other channels open;

=-40°C

=25°C...150°C

or I

OUT1

other channels open;

=-40°C...150°C

=5.5V; I

SENSE

VCC>8V, I R

SENSE

= 13V; R

=0.5A;

OUT2

=0.5V; other channels

=0.35A;

OUT2

=0.5V; other channels

OUT2

=5A; V

=2A;

SENSE

=4V;

=2.5V; other channels

OUT2

=15A; V

OUT1,2

=2.5A;

SENSE

=4V;

=10kΩ

=5A;

OUT1,2

=10kΩ

= 3.9kΩ 5.5 V

SENSE

3300 4400 6000

-10 +10 %

4200 4400

4900 4900

6000 5750

-6 +6 %

4200 4400

4900 4900

5500 5250

-6 +6 %

V/ µs

10/26

Page 11

VNQ600 Electrical specifications

Table 8. Current sense (9V< VCC< 16V) (continued)

Symbol Parameter Test conditions Min. Typ. Max. Unit

Analog sense output

VSENSEH

Impedance in overtemperature condition

=13V; Tj>T

All channels open

TSD

;

400 Ω

DSENSE

1. Current sense signal delay after positive input slope.

Table 9. Logic inputs

Current sense delay response

To 9 0% I

SENSE

(1)

500 µs

Symbol Parameter Test conditions Min. Typ. Max. Unit

I(hyst)

Table 10. VCC - output diode

Low level input voltage 1.25 V

High level input voltage 3.25 V

Input hysteresis voltage 0.5 V

Input current VIN=1.5V 1 µA

Input current VIN=3.5V 10 µA

Input clamp voltage

ICL

IIN=1mA

= -1mA

66.8

-0.7

Symbol Parameter Test conditions Min. Typ. Max. Unit

Forward on voltage -I

=2.30A; Tj=150°C 0.6 V

OUT

Figure 4. I

OUT/ISENSE

6500

6000

5500

5000

4500

4000

3500

3000

OUT/ISENSE

versus I

OUT

max.Tj=-40°C

max.Tj=25...150°C

min.Tj=25...150°C

typical value

min.Tj=-40°C

0246810121416

(A)

OUT

11/26

Page 12

Electrical specifications VNQ600

Figure 5. Switching characteristics

OUT

/dt

OUT

(on)

SENSE

INPUT

Table 11. Truth table

d(on)

80%

90%

DSENSE

90%

/dt

OUT

(off)

10%

d(off)

Conditions Input Output Sense

Normal operation

Overtemperature

Undervoltage

Overvoltage

Short circuit to GND

Short circuit to V

Negative output voltage clamp

L H H

L H

LL0

L H

L L

L L L

H H

(Tj>T

Nominal

SENSEH

0 0

j<TTSD

) V

TSD

< Nominal

) 0

SENSEH

12/26

Page 13

VNQ600 Electrical specifications

Table 12. Electrical transient requirements

ISO T/R

7637/1

Test levelsITest levelsIITest levels

Tes t pul se

1 -25V -50V -75V -100V 2ms, 10Ω

2 +25V +50V +75V +100V 0.2ms, 10Ω

3a -25V -50V -100V -150V 0.1µs, 50Ω

3b +25V +50V +75V +100V 0.1µs, 50Ω

4 -4V -5V -6V -7V 100ms, 0.01Ω

5 +26.5V +46.5V +66.5V +86.5V 400ms, 2Ω

ISO T/R

7637/1

Test levels resultITest levels resultIITest levels result

Tes t pul se

1C C C C

2C C C C

3a C C C C

3b C C C C

4C C C C

5C E E E

Class Contents

All functions of the device are performed as designed after exposure to disturbance. One or more functions of the device is not performed as designed after exposure and cannot be returned to proper operation without replacing the device.

Test levels

III

Test levels

delays and impedance

Test levels result

III

13/26

Page 14

Electrical specifications VNQ600

Figure 6. Waveforms

NORMAL OPERATION

INPUT

LOAD CURRENT

SENSE

INPUT

LOAD CURRENT

SENSE

INPUT

LOAD CURRENT SENSE

UNDERVOLTAGE

USDhyst

USD

OVERVOLTAGE

VCC < V

VCC > V

INPUT

LOAD CURRENT LOAD VOLTAGE SENSE

INPUT

LOAD VOLTAGE LOAD CURRENT

SENSE

INPUT

LOAD CURRENT

SENSE

SHORT TO GROUND

SHORT TO V

<Nominal

TSD

OVERTEMPERATURE

<Nominal

SENSE

SENSEH

SENSE

14/26

Page 15

VNQ600 Electrical specifications

2.4 Electrical characteristics curves

Figure 7. Off state output current Figure 8. High level input current

IL(o ff1) (u A)

4.5

3.5

2.5

1.5

0.5

Off state Vcc=36V

Vin=Vout=0V

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

Iih (uA )

4.5

Vi n=3. 25V

3.5

2.5

1.5

0.5

-50 -25 0 25 50 75 100 125 150 175

Tc (°C )

Figure 9. Input clamp voltage Figure 10. Turn-on voltage slope

Vicl (V)

7.8

7.6

7.4

7.2

6.8

6.6

6.4

6.2

Ii n =1m A

-50 -25 0 25 50 75 100 125 150 175

Tc (°C )

Figure 11. Overvoltage shutdown Figure 12. Turn-off voltage slope

Vov (V)

-50 -25 0 25 50 75 100 125 150 175

Tc (°C )

15/26

Page 16

Electrical specifications VNQ600

Figure 13. I

vs T

LIM

case

Ilim (A)

Vcc=13V

-50 -25 0 25 50 75 100 125 150 175

Tc (°C )

Figure 14. On state resistance vs V

Ron (mOhm)

5 10152025303540

Io u t =5 A

Tc = 150°C

Tc = 25°C

Tc= - 40°C

Vcc (V)

Figure 15. Input high level Figure 16. Input hysteresis voltage

Vih (V)

3.6

3.4

3.2

2.8

2.6

2.4

2.2

-50 -25 0 25 50 75 100 12 5 150 175

Tc (°C)

Vhyst (V)

1.5

1.4

1.3

1.2

1.1

0.9

0.8

0.7

0.6

0.5

-50 -25 0 25 50 75 100 12 5 150 175

Tc (°C)

Figure 17. On state resistance vs Tcase Figure 18. Input low level

Ron (mOhm)

100

Io u t=5 A

Vc c=8V & 36V

-75 -50 -25 0 25 50 75 100 125 150 175

Tc (°C)

16/26

Vil (V)

2.6

2.4

2.2

1.8

1.6

1.4

1.2

-50 -25 0 25 50 75 100 125 150 175

Tc (°C )

Page 17

VNQ600 Application information

3 Application information

Figure 19. Application schematic

+5V

prot

INPUT1

C. SENSE 1

INPUT2

C. SENSE 2

INPUT3

C. SEN SE 3

INPUT4

C. SENSE 4

GND1,2

CC1,2

OUTPUT1

OUTPUT2

OUTPUT3

OUTPUT4

GND3,4

CC3,4

SENSE1,2,3,4

GND

Note: Channels 3 & 4 have the same internal circuit as channel 1 & 2.

3.1 GND protection network against reverse battery

This section provides two solutions for implementing a ground protection network against reverse battery.

3.1.1 Solution 1: a resistor in the ground line (R

This can be used with any type of load.

The following show how to dimension the R

1. R

2. R

where -I

≤ 600mV / 2(I

GND

≥ (−VCC) / (-I

GND

is the DC reverse ground pin current and can be found in the absolute

GND

S(on)max

GND

)

maximum rating section of the device datasheet.

Power dissipation in R

= (-VCC)2/R

GND

(when VCC<0 during reverse battery situations) is:

GND

resistor:

GND

only)

17/26

Page 18

Application information VNQ600

This resistor can be shared amongst several different HSDs. Please note that the value of this resistor should be calculated with formula (1) where I

S(on)max

becomes the sum of the

maximum on-state currents of the different devices.

Please note that, if the microprocessor ground is not shared by the device ground, then the R

will produce a shift (I

GND

S(on)max

* R

) in the input thresholds and the status output

GND

values. This shift will vary depending on how many devices are ON in the case of several high side drivers sharing the same R

GND

If the calculated power dissipation requires the use of a large resistor, or several devices have to share the same resistor, then ST suggests using solution 2 below.

3.1.2 Solution 2: a diode (D

) in the ground line

GND

A resistor (RGND=1kΩ) should be inserted in parallel to DGND if the device will be driving an inductive load. This small signal diode can be safely shared amongst several different HSD. Also in this case, the presence of the ground network will produce a shift (j600mV) in the input threshold and the status output values if the microprocessor ground is not common with the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network. Series resistor in INPUT and STATUS lines are also required to prevent that, during battery voltage transient, the current exceeds the Absolute Maximum Rating. Safest configuration for unused INPUT and STATUS pin is to leave them unconnected.

3.2 Load dump protection

Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the V

maximum DC rating. The same applies if the device is subject to transients on the VCC

line that are greater than those shown in the ISO T/R 7637/1 table.

3.3 MCU I/O protection

If a ground protection network is used and negative transients are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (R prevent the µC I/O pins from latching up.

) in line to

prot

The value of these resistors is a compromise between the leakage current of µC and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC I/Os:

-V

CCpeak/Ilatchup

≤ R

prot

≤ (V

OHµC-VIH-VGND

Example

For the following conditions:

latchup

5kΩ ≤ R

Recommended values are:

18/26

CCpeak

OHµC

=10kΩ

prot

= - 100V

≥ 20mA

≥ 4.5V

≤ 65kΩ.

prot

) / I

IHmax

Page 19

VNQ600 Application information

3.4 Maximum demagnetization energy (VCC = 13.5V)

Figure 20. Maximum turn-off current versus load inductance

LMAX (A)

100

0.001 0.01 0.1 1 10 100 L(mH)

A = Single Pulse at T

Jstart

B= Repetitive pulse at T

C= Repetitive Pulse at T

VIN, I

Demagnetization

Note: Values are generated with R

In case of repetitive pulses, T must not exceed the temperature specified above for curves B and C.

=150ºC

=100ºC

Jstart

=125ºC

Jstart

Demagnetization

=0Ω.

(at beginning of each demagnetization) of every pulse

jstart

Demagnetization

19/26

Page 20

Package and PCB thermal data VNQ600

4 Package and PCB thermal data

4.1 SO-28 thermal data

Figure 21. SO-28 PC board

Note: Layout condition of R

thickness=2mm, Cu thickness=35µm, Copper areas: 0.5 cm

Table 13. Thermal calculation according to the PCB heatsink area

Chip 1 Chip 2 T

ON OFF R

OFF ON R

ON ON

= Thermal resistance Junction to Ambient with one chip ON

thA

= Thermal resistance Junction to Ambient with both chips ON and P

thB

= Mutual thermal resistance

thC

R T

(R P

amb

thA

thC

thB

dchip2

and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB

thA

x P

x (P

x P

+ T

dchip1

dchip2

dchip1

amb

jchip1

+ T

+ P

) + R

amb

dchip2

thC

) +

thC

thA

thB

amb

(R P

dchip1

thA

x P

x (P

x P

+ T

dchip1

dchip2

dchip1

dchip2

amb

, 3 cm2, 6 cm2).

jchip2

+ T

amb

+ T

amb

+ P

dchip2

) + R

thC

) +

dchip1=Pdchip2

dchip1≠Pdchip2

Note

20/26

Page 21

VNQ600 Package and PCB thermal data

Figure 22. R

_am b

RTH

(°C /W)

012345 67

Vs PCB copper area in open box free air condition

thj-amb

PCB Cu heatsink area (cm^2)/is land

Figure 23. Thermal impedance junction ambient single pulse

Zth(°C /W)

100

0.1

0.01

0.0001 0.001 0.01 0.1 1 10 100 1000

time(s )

0,5 c m ^2/is land

3 cm ^2/is land

6 cm ^2/is land

One channel ON

Two channels ON on same chip

21/26

Page 22

Package and PCB thermal data VNQ600

Equation 1: pulse calculation formula

where

THδ

δ tpT⁄=

δ Z

THtp

1 δ–()+⋅=

Figure 24. Thermal fitting model of a quad channel HSD in SO-28

Tj_1

Pd1

Tj_2

Pd2

Tj_3

Pd3

Tj_4

Pd4

C13 C14

R13

C15 C16

R15

R14

R16

C3 C4

R3R1 R6R5R2

R17

R9R7

R18

C10

C5 C6C2

C11 C12

R10

R12R11

Table 14. Thermal parameters

Area/island (cm2)0.56

R1=R7=R13=R15 (°C/W) 0.05

R2=R8=R14=R16 (°C/W) 0.3

R3=R9 (°C/W) 3.4

R4=R10 (°C/W) 11

R5=R11 (°C/W) 15

R6=R12 (°C/W) 30 13

C1=C7=C13=C15 (W.s/°C) 0.001

C2=C8=C14=C16 (W.s/°C) 5.00E-03

C3=C9 (W.s/°C) 1.00E-02

C4=C10 (W.s/°C) 0.2

C5=C11 (W.s/°C) 1.5

C6=C12 (W.s/°C) 5 8

R17=R18 (°C/W) 150

T_amb

22/26

Page 23

VNQ600 Package and packing information

5 Package and packing information

5.1 ECOPACK® packages

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second-level interconnect. The category of Second-Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 25. SO-28 package dimensions

Table 15. SO-28 mechanical data

Symbol

Min. Typ. Max.

A 2.65

a1 0.10 0.30

b 0.35 0.49

b1 0.23 0.32

C0.50

c1 45° (typ.)

D 17.7 18.1

E 10.00 10.65

e1.27

e3 16.51

F 7.40 7.60

L 0.40 1.27

S 8° (max.)

Millimeters

23/26

Page 24

Package and packing information VNQ600

5.2 SO-28 packing information

Figure 26. SO-28 tube shipment (no suffix)

Base Q.ty 28 Bulk Q.ty 700 Tube length (± 0.5) 532 A 3.5

Figure 27. SO-28 tape and reel shipment (suffix “TR”)

B 13.8 C (± 0.1) 0.6

All dimensions are in mm.

Reel dimensions

Tape dimensions

According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986

Tape width W 16 Tape Hole Spacing P0 (± 0.1) 4 Component Spacing P 12 Hole Diameter D (± 0.1/-0) 1.5 Hole Diameter D1 (min) 1.5 Hole Position F (± 0.05) 7.5 Compartment Depth K (max) 6.5 Hole Spacing P1 (± 0.1) 2

All dimensions are in mm.

Top

cover

tape

End

500mm min

Base Q.ty 1000 Bulk Q.ty 1000 A (max) 330 B (min) 1.5 C (± 0.2) 13 F 20.2 G (+ 2 / -0) 16.4 N (min) 60 T (max) 22.4

Empty components pockets saled with cover tape.

User direction of feed

Start

No componentsNo components Components

500mm min

24/26

Page 25

VNQ600 Revision history

6 Revision history

Table 16. Document revision history

Date Revision Changes

Nov-2004 1 Initial release.

02-Jul-2004 2 Added Table 16: Document revision history.

22-Jul-2004 3 Updated disclaimer.

14-Aug-2004 4 Updated Figure 3: Current and voltage conventions.

04-Apr-2005 5 Added Figure 2.: Configuration diagram (top view).

17-Apr-2005 6

29-May-2006 7 Updated Table 14: Thermal parameters: added 6 cm

19-Nov-2006 8 Updated Ta ble 10 : V

18-Jul-2007 9 Updated Table 6: Protections: added note.

11-Nov-2008 10 Document converted to corporate template.

Added Table 2: Suggested connections for unused and not

connected pins.

Cu condition.

- output diode.

25/26

Page 26

VNQ600

Please Read Carefully:

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