Quad channel high side driver with analog current sense
Features
Max supply voltageV
Operating voltage rangeV
Max on-state resistance (per ch.)R
Current limitation (typ)I
Off state supply currentI
1. Typical value with all loads connected.
■ General
– Inrush current active management by
power limitation
– Very low stand-by current
– 3.0 V CMOS compatible inputs
– Optimized electromagnetic emissions
– Very low electromagnetic susceptibility
– In compliance with the 2002/95/EC
european directive
– Very low current sense leakage
■ Diagnostic functions
– Proportional load current sense
– High current sense precision for wide
currents range
– Current sense disable
– Off state openload detection
– Output short to Vcc detection
– Thermal shutdown indication
– Overload and short to ground (power
limitation) indication
■ Protections
– Undervoltage shutdown
– Overvoltage clamp
– Load current limitation
– Self limiting of fast thermal transients
– Protection against loss of ground and loss
of V
CC
– Over-temperature shutdown with
autorestart (thermal shutdown)
– Reverse battery protected (see Figure 32)
CC
CC
ON
LIMH
S
4.5 to 28 V
160 mΩ
2 µA
41V
10 A
(1)
VNQ5E160AK-E
for automotive applications
PowerSSO-24
– Electrostatic discharge protection
Application
■ All types of resistive, inductive and capacitive
loads
■ Suitable as LED driver
Description
The VNQ5E160AK-E is a double channel highside driver manufactured in the ST proprietary
VIPower M0-5 technology and housed in the tiny
PowerSSO-24 package. The VNQ5E160AK-E is
designed to drive 12V automotive grounded loads
delivering protection, diagnostics and easy 3V
and 5V CMOS compatible interface with any
microcontroller.
The device integrates advanced protective
functions such as load current limitation, inrush
and overload active management by power
limitation, over-temperature shut-off with
auto-restart and over-voltage active clamp. A
dedicated analog current sense pin is associated
with every output channel in order to provide
Ehnanced diagnostic functions including fast
detection of overload and short-circuit to ground
through power limitation indication, overtemperature indication, short-circuit to Vcc
diagnosis and on & off state open load detection.
The current sensing and diagnostic feedback of
the whole device can be disabled by pulling the
CS_DIS pin high to allow sharing of the external
sense resistor with other similar devices.
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to the conditions in table below for extended
periods may affect device reliability. Refer also to the STMicroelectronics SURE Program
and other relevant quality document.
Thermal resistance junction-case (max)
(with one channel ON)
Thermal resistance junction-ambient (max)
8°C/W
See Figure 36. in the
thermal section
°C/W
8/37
Page 9
VNQ5E160AK-EElectrical specifications
2.3 Electrical characteristics
Values specified in this section are for 8V<VCC<28V, -40°C< Tj <150°C, unless otherwise
stated.
Table 5.Power section
SymbolParameterTest conditionsMin.Typ.Max.Unit
V
V
V
USDhyst
R
V
clamp
Operating supply voltage4.51328V
CC
Undervoltage shutdown3.54.5V
USD
Undervoltage shutdown
hysteresis
I
= 1A; Tj= 25°C160
OUT
On state resistance
ON
(2)
= 1A; Tj= 150°C320
OUT
I
= 1A; VCC= 5V; Tj= 25°C210
OUT
Clamp voltageIS= 20 mA414652V
Off State; V
VIN=V
I
S
I
L(off1)
Supply current
Off state output current
(2)
OUT=VSENSE=VCSD
On State; V
I
= 0A
OUT
VIN=V
= 0 V; VCC= 13 V;
OUT
Tj= 25°C
V
IN=VOUT
= 0 V; VCC= 13 V;
Tj= 125 °C
V
1. PowerMOS leakage included.
2. For each channel.
Table 6.Switching (VCC=13V; Tj= 25°C)
Output - VCC diode
F
voltage
(2)
-I
=1A; Tj=150°C0.7V
OUT
= 13 V; Tj= 25°C;
CC
= 13V; VIN= 5 V;
CC
= 0 V
0.5V
mΩI
(1)
2
(1)
5
µA
814mA
00.01 3
µA
05
SymbolParameterTest conditionsMin.Typ.Max.Unit
(dV
(dV
t
d(on)
t
d(off)
OUT
OUT
W
W
ON
OFF
Turn-on delay time RL= 13 Ω (see Figure 6.)20 µs
Turn-off delay time RL= 13 Ω (see Figure 6.)10 µs
/dt)onTurn-on voltage slope RL= 13 Ω
/dt)
Turn-off voltage slope RL= 13 Ω
off
Switching energy
losses during t
won
Switching energy
losses during t
woff
RL= 13 Ω (see Figure 6.)0.05 mJ
RL= 13 Ω (see Figure 6.)0.03 mJ
See
Figure 26.
See
Figure 28.
9/37
V/µs
V/µs
Page 10
Electrical specificationsVNQ5E160AK-E
Table 7.Logic Inputs
SymbolParameterTest conditionsMin.Typ.Max.Unit
V
I
IL
V
I
IH
V
I(hyst)
V
ICL
V
CSDL
I
CSDL
V
CSDH
I
CSDH
V
CSD(hyst)
V
CSCL
Table 8.Protections and diagnostics
Input low level voltage0.9V
IL
Low level input currentVIN= 0.9V1µA
Input high level voltage2.1V
IH
High level input currentVIN= 2.1V10µA
Input hysteresis voltage0.25V
Input clamp voltage
CS_DIS low level voltage0.9V
Low level CS_DIS currentV
CS_DIS high level voltage2.1V
High level CS_DIS currentV
CS_DIS hysteresis voltage0.25V
CS_DIS clamp voltage
IIN= 1mA5.57
= -1mA-0.7
I
IN
= 0.9V1µA
CSD
= 2.1V10µA
CSD
I
= 1mA5.57
CSD
= -1mA-0.7
I
CSD
(1)
V
V
SymbolParameterTest conditionsMin.Typ.Max.Unit
I
limH
I
limL
T
TSD
T
T
RS
T
HYST
V
DEMAG
V
ON
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles.
DC short circuit current
Short circuit current
during thermal cycling
Shutdown temperature150175200°C
Reset temperature
R
Thermal reset of
STATUS
Thermal hysteresis
(T
Turn-off output voltage
clamp
TSD-TR
)
I
OUT
Output voltage drop
limitation
VCC= 13V
CC
<28V
5V<V
V
= 13V; TR<Tj<T
CC
= 1A; VIN= 0; L= 20mH
I
= 0.03A;
OUT
= -40°C...150°C
T
j
(see Figure 8.)
TSD
7101414A
2.5A
TRS + 1
TRS + 5
135°C
7°C
VCC-41
VCC-46VCC-52
25mV
A
°C
V
10/37
Page 11
VNQ5E160AK-EElectrical specifications
Table 9.Current sense (8V<VCC<18V)
SymbolParameterTest conditionsMin.Typ. Max. Unit
I
= 0.025 A;
OUT
dK
dK
K
K
1/K1
K
2/K2
I
0
1
2
OUT/ISENSE
I
OUT/ISENSE
(1)
Current sense ratio drift
I
OUT/ISENSE
(1)
Current sense ratio drift
V
T
I
V
T
Tj= 25°C...150°C
I
V
T
I
V
T
T
I
V
= 0.5 V; V
SENSE
= -40°C...150°C330600870
j
= 0.35A;
OUT
= 0.5 V; V
SENSE
= -40°C...150°C
j
= 0.35 A;
OUT
= 0.5 V; V
SENSE
= -40°C...150°C
j
= 0.5A;
OUT
=4V; V
SENSE
=-40°C...150°C
j
= 25°C...150°C
j
= 0.5 A;
OUT
= 4 V; V
SENSE
CSD
CSD
CSD
CSD
CSD
= 0 V;
= 0 V;
= 0 V;
= 0 V;
= 0 V;
345
475
395
475
- 1212%
375
470
415
470
- 88%
Tj= -40°C...150°C
600
555
565
525
K
dK
3/K3
I
SENSE0
I
OL
V
SENSE
I
3
OUT/ISENSE
(1)
Current sense ratio drift
Analog sense leakage
current
Openload on state
current detection
threshold
Max analog sense
output voltage
I
= 1.5 A;
OUT
V
T
T
I
V
= 4 V; V
SENSE
= -40°C...150°C
j
= 25°C...150°C
j
= 1.5 A;
OUT
= 4 V; V
SENSE
Tj= -40°C...150°C
= 0 A; V
I
OUT
V
CSD
= -40°C...150°C
T
j
I
= 0 A; V
OUT
V
CSD
= -40°C...150°C
T
j
I
= 1A; V
OUT
V
CSD
SENSE
= 5 V; VIN= 0 V;
SENSE
= 0 V; VIN= 5 V;
SENSE
= 5V; VIN= 5V;
Tj= -40°C...150°C
VIN = 5V,
I
= 5 µA
SENSE
I
= 1.5 A; V
OUT
CSD
= 0 V;
CSD
425
465
505
435
465
495
CSD
= 0 V;
- 66%
= 0 V;
01
= 0 V;
02
= 0V;
01
15mA
= 0 V 5V
µA
V
SENSEH
Analog sense output
voltage in fault
condition
(2)
VCC= 13 V; R
= 3.9 KΩ;8V
SENSE
11/37
Page 12
Electrical specificationsVNQ5E160AK-E
Table 9.Current sense (8V<VCC<18V) (continued)
SymbolParameterTest conditionsMin.Typ. Max. Unit
Analog sense output
I
t
(2)
SENSEH
DSENSE1H
current in fault
condition
(2)
Delay response time
from falling edge of
CS_DIS pin
VCC= 13V; V
V
I
<4V, 0.025A<Iout<1.5A
SENSE
=90% of I
SENSE
(see Figure 4)
= 5 V;9mA
SENSE
SENSEMAX
40100µs
Delay response time
t
DSENSE1L
from rising edge of
CS_DIS pin
Delay response time
t
DSENSE2H
from rising edge of
INPUT pin
Delay response time
Δt
DSENSE2H
between rising edge of
output current and rising
edge of current sense
Delay response time
t
DSENSE2L
from falling edge of
INPUT pin
1. Parameter guaranteed by design; it is not tested
2. Fault condition includes: power limitation, overtemperature and open load off state detection.
Table 10.Openload detection (8V<VCC<18V)
V
I
(see Figure 4)
V
I
(see Figure 4.)
V
I
I
I
V
I
(see Figure 4.)
<4V, 0.025A<Iout<1.5A
SENSE
=10% of I
SENSE
<4V, 0.025A<Iout<1.5A
SENSE
=90% of I
SENSE
<4V,
SENSE
= 90% of I
SENSE
= 90% of I
OUT
OUTMAX
SENSE
=1.5A (see Figure 7)
<4V, 0.025A<Iout<1.5A
SENSE
=10% of I
SENSEMAX
SENSEMAX
SENSEMAX,
OUTMAX
SENSEMAX
520µs
120300µs
110µs
80 250 µs
SymbolParameterTest conditionsMin.Typ.Max.Unit
Openload off state
V
OL
voltage detection
24V
threshold
Output short circuit to
t
DSTKON
detection delay at
V
CC
See Figure 5.1801200µs
turn off
I
L(off2)r
I
L(off2)f
Off state output current
at V
OUT
= 4V
Off state output current
at V
OUT
= 2V
= 0 V; V
V
IN
rising from 0 V to 4 V
V
OUT
= 0 V; V
V
IN
V
falling from VCC to 2V
OUT
SENSE
SENSE
= 0 V
= V
SENSEH
-1200µA
-5090µA
Delay response from
= 4 V; VIN= 0 V
td_vol
output rising edge to
SENSE
rising edge in
V
openload
V
OUT
V
SENSE
= 90% of V
SENSEH
20µs
12/37
Page 13
VNQ5E160AK-EElectrical specifications
Figure 4.Current sense delay characteristics
INPUT
CS_DIS
LOAD CURRENT
SENSE CURRENT
t
DSENSE2H
t
DSENSE1L
Figure 5.Openload off-state delay timing
OUTPUT STUCK TO V
V
IN
V
CS
Figure 6.Switching characteristics
V
OUT
t
Won
80%
t
Woff
90%
t
t
DSENSE1H
CC
V
OUT
V
DSTKON
> V
SENSEH
OL
t
DSENSE2L
dV
OUT
INPUT
/dt
(on)
t
d(on)
dV
/dt
OUT
(off)
t
r
10%
t
f
t
t
d(off)
t
13/37
Page 14
Electrical specificationsVNQ5E160AK-E
Figure 7.Delay response time between rising edge of ouput current and rising
edge of current sense (CS enabled)
V
IN
Δt
DSENSE2H
t
I
OUT
I
SENSE
90% I
OUTMAX
I
OUTMAX
I
SENSEMAX
t
90% I
Figure 8.Output voltage drop limitation
Vcc-Vout
Tj=150oC
Von
Von/Ron(T)
SENSEMAX
Tj=25
Tj=-40
t
o
C
o
C
Iout
14/37
Page 15
VNQ5E160AK-EElectrical specifications
Figure 9.I
I
/ I
out
sense
700
650
max Tj = -40 °C to 150 °C
600
550
500
450
400
350
300
250
200
0,350,580,811,041,271,5
/ I
out
max Tj = 25 °C to 150 °C
min Tj = 25 °C to 150 °C
min Tj = -40 °C to 150 °C
sense
vs. I
out
typical value
I
(A)
OUT
Figure 10. Maximum current sense ratio drift vs load current
dk/k(%)
15
10
5
0
-5
-10
-15
0,350,580,811,041,271,5
I
(A)
OUT
Note:Parameter guaranteed by design; it is not tested.
15/37
Page 16
Electrical specificationsVNQ5E160AK-E
Table 11.Truth table
ConditionsInputOutputSense (V
Normal operation
CSD
L
H
L
H
0
Nominal
=0V)
(1)
Overtemperature
Undervoltage
Overload
Short circuit to GND
(power limitation)
Open load off state
(with external pull up)
Short circuit to V
CC
(external pull up
disconnected)
Negative output voltage
clamp
1. If the V
and external circuit.
is high, the SENSE output is at a high impedance, its potential depends on leakage currents
CAll functions of the device performed as designed after exposure to disturbance.
E
One or more functions of the device did not perform as designed after exposure to
disturbance and cannot be returned to proper operation without replacing the device.
17/37
Page 18
Electrical specificationsVNQ5E160AK-E
2.4 Waveforms
Figure 11. Normal operation
Normal operation
INPUT
Nominal loadNominal load
I
OUT
V
SENSE
V
CS_DIS
Figure 12. Overload or short to GND
Overload or Short to GND
INPUT
I
OUT
V
SENSE
V
CS_DIS
I
LimH
>
Power Limitation
I
LimL
Thermal cycling
>
18/37
Page 19
VNQ5E160AK-EElectrical specifications
Figure 13. Intermittent overload
Intermittent Overload
INPUT
Overload
I
>
LimH
I
>
LimL
I
OUT
V
>
SENSEH
V
SENSE
V
CS_DIS
Figure 14. Off-state open load with external circuitry
OFF-State Open Load
with external circuitry
Nominal load
INPUT
V
OUT
I
OUT
V
SENSE
V
CS_DIS
V
t
DSTK(on)
OL
V
SENSEH
V
> V
OUT
OL
>
19/37
Page 20
Electrical specificationsVNQ5E160AK-E
Figure 15. Short to V
V
OUT
I
OUT
V
CS_DIS
CC
Resistive
Short to V
V
OL
t
DSTK(on)
CC
Short to V
CC
Hard
Short to V
V
> V
OUT
t
DSTK(on)
CC
OL
Figure 16. TJ evolution in overload or short to GND
TJ evolution in
Overload or Short to GND
INPUT
I
OUT
T
J
Self-limitation of fast thermal transients
T
J_START
Power Limitation
I
>
LimH
T
T
TSD
R
< I
T
HYST
LimL
20/37
Page 21
VNQ5E160AK-EElectrical specifications
2.5 Electrical characteristics curves
Figure 17. Off state output currentFigure 18. High level input current
Iloff (mA)
200
Off State
150
100
50
0
-50 -250255075 100 125 150 175
Vcc=13V
Vin=Vout=0V
Tc (°C)
Iih (µA)
5
4,5
3,5
2,5
1,5
0,5
Vin= 2.1 V
4
3
2
1
0
-50 -250255075 100 125 150 175
Tc (°C)
Figure 19. Input clamp voltageFigure 20. Input low level voltage
Vicl (V)
7
6,8
6,6
6,4
6,2
5,8
5,6
5,4
5,2
lin= 1 mA
6
5
-50 -250255075 100 125 150 175
Tc (°C)
Vil (V)
2
1,8
1,6
1,4
1,2
1
0,8
0,6
0,4
0,2
0
-50 -250255075 100 125 150 175
Tc (°C)
Figure 21. Input high level voltageFigure 22. Input hysteresis voltage
Vih (V)
4
3,5
3
2,5
2
1,5
1
0,5
0
-50 -250255075 100 125 150 175
Tc (°C)
Vihyst (V)
1
0,9
0,8
0,7
0,6
0,5
0,4
0,3
0,2
0,1
0
-50 -250255075 100 125 150 175
Tc (°C)
21/37
Page 22
Electrical specificationsVNQ5E160AK-E
Figure 23. On state resistance vs. T
Ron (Ohm)
300
Iout= 1A
250
200
150
100
50
Vcc= 13V
-50 -250255075 100 125 150 175
Tc (°C)
case
Figure 24. On state resistance vs. V
Ron (Ohm)
300
250
200
150
100
05101520253035
Vcc (V)
Figure 25. Undervoltage shutdownFigure 26. Turn-on voltage slope
Vusd (V)
8
6
4
2
0
-50 -250255075100 125 150 175
Tc (°C)
(dVout/dt )On (V/ms)
1000
900
800
700
600
500
400
300
200
100
0
-50 -250255075 100 125 150 175
Vcc= 13 V
RI= 13 Ohm
Tc (°C)
CC
Tc=150°C
Tc=125°C
Tc=25°C
Tc=-40°C
Figure 27. I
Ilimh (A)
14
12
10
8
6
-50-250255075100125150
LIMH
Vcc= 13 V
vs. T
case
Tc (°C)
22/37
Figure 28. Turn-off voltage slope
(dVout/dt )Off (V/ms)
1200
1100
1000
900
800
700
600
500
-50 -250255075 100 125 150 175
Vcc= 13 V
RI= 13 Ohm
Tc (°C)
Page 23
VNQ5E160AK-EElectrical specifications
Figure 29. CS_DIS high level voltageFigure 30. CS_DIS clamp voltage
Vcsdh (V)
4
3,5
3
2,5
2
1,5
1
0,5
0
-50 -250255075 100 125 150 175
Tc (°C)
Figure 31. CS_DIS low level voltage
Vcsdl (V)
3
2,5
2
1,5
Vcsdcl(V)
10
9
Iin = 1 mA
8
7
6
5
4
3
-50 -250255075 100 125 150 175
Tc (°C)
1
0,5
0
-50 -250255075 100 125 150 175
Tc (°C)
23/37
Page 24
Application informationVNQ5E160AK-E
3 Application information
Figure 32. Application schematic
+5V
V
CC
R
prot
Μ
CU
R
prot
R
prot
R
SENSE
C
EXT
CS_DIS
INPUT
CURRENT SENSE
D
ld
OUTPUT
GND
R
GND
GND
D
GND
V
Note:Channel 2, 3, 4 have the same internal circuit as channel 1.
3.1 GND protection network against reverse battery
This section provides two solutions for implementing a ground protection network against
reverse battery.
3.1.1 Solution 1 : resistor in the ground line (R
This can be used with any type of load.
The following is an indication on how to dimension the R
1.R
2. R
where -I
maximum rating section of the device datasheet.
Power dissipation in R
Equation 1
≤ 600mV / (I
GND
≥ (−VCC) / (-I
GND
is the DC reverse ground pin current and can be found in the absolute
GND
S(on)max
GND
GND
)
)
(when VCC<0: during reverse battery situations) is:
= (-VCC)2/R
P
D
GND
GND
only)
GND
resistor.
24/37
Page 25
VNQ5E160AK-EApplication information
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where I
S(on)max
becomes the sum of the
maximum on-state currents of the different devices.
Please note that if the microprocessor ground is not shared by the device ground then the
R
will produce a shift (I
GND
S(on)max
* R
) in the input thresholds and the status output
GND
values. This shift will vary depending on how many devices are on in the case of several
high side drivers sharing the same R
GND
.
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize Section 3.1.2: Solution 2 : diode (DGND) in
the ground line.
3.1.2 Solution 2 : diode (D
A resistor (R
=1kΩ) should be inserted in parallel to D
GND
) in the ground line
GND
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network will produce a shift (≈600mV) in the input
threshold and in the status output values if the microprocessor ground is not common to the
device ground. This shift will not vary if more than one HSD shares the same diode/resistor
network.
3.2 Load dump protection
Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the
V
max DC rating. The same applies if the device is subject to transients on the VCC line
CC
that are greater than the ones shown in the ISO 7637-2: 2004(E) table.
3.3 MCU I/Os protection
If a ground protection network is used and negative transient are present on the VCC line,
the control pins will be pulled negative. ST suggests to insert a resistor (R
prevent the µC I/Os pins to latch-up.
The value of these resistors is a compromise between the leakage current of µC and the
current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC
I/Os:
if the device drives an
GND
prot
) in line to
Equation 2
-V
Calculation example:
For V
5kΩ ≤ R
= - 100V and I
CCpeak
≤ 180kΩ
prot
Recommended values: R
CCpeak/Ilatchup
≥ 20mA; V
latchup
=10kΩ, C
prot
≤ R
EXT
25/37
≤ (V
prot
OHµC
=10nF.
OHμC-VIH-VGND
≥ 4.5V
) / I
IHmax
Page 26
Application informationVNQ5E160AK-E
3.4 Current sense and diagnostic
The current sense pin performs a double function (see Figure 33: Current sense and
diagnostic):
●Current mirror of the load current in normal operation, delivering a current
proportional to the load one according to a know ratio K
The current I
external resistor R
minimum (see parameter V
can be easily converted to a voltage V
SENSE
. Linearity between I
SENSE
SENSE
in Table 9: Current sense (8V<VCC<18V)). The
OUT
and V
current sense accuracy depends on the output current (refer to current sense electrical
characteristics Table 9: Current sense (8V<V
●Diagnostic flag in fault conditions, delivering a fixed voltage V
maximum current I
SENSEH
in case of the following fault conditions (refer to Tr u t h ta bl e ):
<18V)).
CC
–Power limitation activation
–Over-temperature
–Short to V
in off state
CC
–Open load in off state with additional external components.
A logic level high on CS_DIS pin sets at the same time all the current sense pins of the
device in a high impedance state, thus disabling the current monitoring and diagnostic
detection. This feature allows multiplexing of the microcontroller analog inputs by sharing of
sense resistance and ADC line among different devices.
.
X
SENSE
by means of an
SENSE
is ensured up to 5V
SENSEH
up to a
Figure 33. Current sense and diagnostic
41V
Overtemperature
Pwr_Lim
SENSEH
CS_DIS
To uC ADC
I
OUT/KX
R
PROT
R
SENSE
I
SENSEH
CURRENT
SENSEn
V
SENSE
V
OL OFF
INPUTn
Main MOSn
+
-
GND
V
PU_CMD
R
I
Loff2r
I
Loff2f
R
PU
PU
Load
PD
V
BAT
V
CC
V
OL
OUTn
26/37
Page 27
VNQ5E160AK-EApplication information
⋅⋅−
⋅
3.4.1 Short to VCC and off state open load detection
Short to V
A short circuit between V
V
SENSEH
during the on state depending on the nature of the short circuit.
Off state open load with external circuitry
CC
and output is indicated by the relevant current sense pin set to
CC
during the device off state. Small or no current is delivered by the current sense
Detection of an open load in off mode requires an external pull-up resistor R
the output to a positive supply voltage V
It is preferable V
to be switched off during the module stand-by mode in order to avoid the
PU
PU
.
connecting
PU
overall stand-by current consumption to increase in normal conditions, i.e. when load is
connected.
An external pull down resistor R
connected between output and GND is mandatory to
PD
avoid misdetection in case of floating outputs in off state (see Figure 33: Current sense and
diagnostic).
R
must be selected in order to ensure V
PD
OUT < VOLmin
unless pulled up by the external
circuitry:
Equation 3
OLfoffLPD
min)2(
R
≤ 22 KΩ is recommended.
PD
OUT
−
OFFupPull
_
VVIRV
2
=<⋅=
For proper open load detection in off state, the external pull-up resistor must be selected
according to the following formula:
Equation 4
V
OUT
For the values of V
(8V<V
CC
<18V).
=
ONupPull
_
−
OLmin ,VOLmax, IL(off2)r
IRRVR
roffLPDPUPUPD
)2(
RR
+
PDPU
and I
27/37
see Table 10: Openload detection
L(off2)f
OL
max
VV
4
=>
Page 28
Application informationVNQ5E160AK-E
3.5 Maximum demagnetization energy (VCC=13.5V)
Figure 34. Maximum turn-off current versus inductance (for each channel)
100
10
A
B
C
1
I (A)
0,1
0,1110100L (mH)
A:
T
= 150°C single pulse
jstart
B: T
C:
VIN, I
= 100°C repetitive pulse
jstart
T
= 125°C repetitive pulse
jstart
L
DemagnetizationDemagnetizationDemagnetization
Note:Values are generated with R
In case of repetitive pulses, T
must not exceed the temperature specified above for curves A and B.
=0 Ω.
L
(at beginning of each demagnetization) of every pulse
jstart
t
28/37
Page 29
VNQ5E160AK-EPackage and PC board thermal data
4 Package and PC board thermal data
4.1 PowerSSO-24 thermal data
Figure 35. PowerSSO-24 PC board
Note:Layout condition of R
area= 77 mm x 86 mm, PCB thickness=1.6 mm, Cu thickness=70 mm (front and back side),
Copper areas: from minimum pad lay-out to 8 cm
Figure 36.
RTHj_amb(°C/W)
R
thj-amb
60
55
50
45
40
35
and Zth measurements (PCB: Double layer, Thermal Vias, FR4
th
2
).
vs. PCB copper area in open box free air condition (one channel ON)
30
0246810
PCB Cu heatsink area (cm^2)
29/37
Page 30
Package and PC board thermal dataVNQ5E160AK-E
Figure 37. PowerSSO-24 thermal impedance junction ambient single pulse (one
channel ON)
ZTH (°C/W)
1000
100
10
1
0.1
0.00010.0010.010.11101001000
Time (s)
Figure 38. Thermal fitting model of a double channel hsd in PowerSSO-24
Footprint
(a)
2 cm
8 cm
2
2
30/37
Page 31
VNQ5E160AK-EPackage and PC board thermal data
Equation 5: pulse calculation formula:
Z
THδ
where δ = tP/T
Table 15.Thermal parameters
Area/island (cm2)Footprint28
R1 = R7 = R9 = R11 (°C/W)1.2
R2 = R8 = R10 = R12 (°C/W)6
R3 (°C/W)6
R4 (°C/W)7.7
R5 (°C/W)998
R6 (°C/W)281710
C1 = C7 = C9 = C11 (W.s/°C)0.0008
C2 = C8 = C10 = C12 (W.s/°C)0.0016
C3 (W.s/°C)0.025
RTHδ Z
THtp
1 δ–()+⋅=
C4 (W.s/°C)0.75
C5 (W.s/°C)149
C6 (W.s/°C)2.2517
a. The fitting model is a semplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
31/37
Page 32
Package and packing informationVNQ5E160AK-E
5 Package and packing information
5.1 ECOPACK
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com
ECOPACK® is an ST trademark.
®
5.2 PowerSSO-24 mechanical data
Figure 39. PowerSSO-24 package dimensions
.
32/37
Page 33
VNQ5E160AK-EPackage and packing information
Table 16.PowerSSO-24 mechanical data
Symbol
Min.Typ.Max.
A2.45
A22.152.35
a100.1
b0.330.51
c0.230.32
(3)
D
(3)
E
10.1010.50
7.407.60
e0.8
e38.8
F2.3
G0.1
H10.110.5
(1) (2)
Millimeters
h0.4
k0°8°
L0.61
O1.2
Q0.8
S2.9
T3.65
U1.0
N10°
X4.14.7
Y6.57.1
1. No intrusion allowed inwards the leads.
2. Flash or bleeds on exposed die pad shall not exceed 0.5 mm per side
3. “D and E” do not include mold flash or protusions.
Mold flash or protusions shall not exceed 0.15 mm per side
33/37
Page 34
Package and packing informationVNQ5E160AK-E
5.3 Packing information
Figure 40. PowerSSO-24 tube shipment (no suffix)
Base q.ty49
Bulk q.ty1225
C
B
A
Figure 41. PowerSSO-24 tape and reel shipment (suffix “TR”)
Tube length (± 0.5)532
A3.5
B13.8
C (± 0.1)0.6
All dimensions are in mm.
Reel dimensions
Base q.ty1000
Bulk q.ty1000
A (max)330
B (min)1.5
C (± 0.2)13
F20.2
G (+ 2 / -0)24.4
N (min)100
T (max)30.4
Tape dimensions
According to Electronic Industries Association
(EIA) standard 481 rev. A, Feb 1986
Updated Table 10: Openload detection (8V<V
– added I
Added Figure 9.: Iout/ Isense vs. Iout.
Added Figure 10.: Maximum current sense ratio drift vs load current
Added Section 2.4: Waveforms.
Added Section 2.5: Electrical characteristics curves.
Updated Chapter 3: Application information:
– added Section 3.4: Current sense and diagnostic
Added Chapter 4: Package and PC board thermal data:
Updated Table 16: PowerSSO-24 mechanical data
36/37
Page 37
VNQ5E160AK-E
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