Page 1
Features
Type V
VNL5160N3-E
VNL5160S5-E
clamp
41 V 160 mΩ 3.5 A
R
DS(on)
I
D
VNL5160N3-E
VNL5160S5-E
OMNIFET III
fully protected low-side driver
2
3
2
1
SOT-223
SO-8
■ Drain current:3.5A
■ ESD protection
■ Overvoltage clamp
■ Thermal shutdown
■ Current and power limitation
■ Very low standby current
■ Very low electromagnetic susceptibility
■ In compliance with the 2002/95/EC European
directive
■ Open drain status output
Specially intended for R10W or 2x R5W
■
(a)
automotive signal lamps
Description
The VNL5160N3-E and VNL5160S5-E are
monolithic devices, made using
STMicroelectronics
intended for driving resistive or inductive loads
with one side connected to the battery. Built-in
thermal shutdown protects the chip from
overtemperature and short circuit. Output current
limitation protects the devices in an overload
condition. In the case of a long duration overload,
the device limits the dissipated power to a safe
level up to thermal shutdown intervention.
Thermal shutdown, with automatic restart, allows
the device to recover normal operation as soon as
a fault condition disappears. Fast
demagnetization of inductive loads is achieved at
turn-off.
®
VIPower® Tec h n o l o gy,
a. Valid for VNL5160S5-E only.
Table 1. Device summary
Order codes
Package
Tube Tape and reel
SOT-223 VNL5160N3-E VNL5160N3TR-E
SO-8 VNL5160S5-E VNL5160S5TR-E
February 2012 Doc ID 16364 Rev 2 1/26
www.st.com
1
Page 2
Contents VNL5160N3-E, VNL5160S5-E
Contents
1 Block diagrams and pins configurations . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Absolute maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5 Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.1 SOT-223 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.2 SO-8 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.2 SOT-223 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.3 SO8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.4 SOT-223 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.5 SO8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2/26 Doc ID 16364 Rev 2
Page 3
VNL5160N3-E, VNL5160S5-E List of tables
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Pin function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 4. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 5. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 6. PowerMOS section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 7. Source drain diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 8. Input section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 9. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 10. Logic input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 11. Openload detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 12. Supply section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 13. Switching characteristics (Vcc=13V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 14. Protection and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 15. Truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 16. SOT-223 thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 17. SO-8 thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 18. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Doc ID 16364 Rev 2 3/26
Page 4
List of figures VNL5160N3-E, VNL5160S5-E
List of figures
Figure 1. VNL5160N3-E block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. VNL5160S5-E block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. VNL5160N3-E current and voltage conventions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. VNL5160S5-E current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 5. Configuration diagrams (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 6. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. VNL5160N3-E application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 8. VNL5160S5-E application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 9. Maximum demagnetization energy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 10. SOT-223 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 11. SOT-223 Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . 16
Figure 12. SOT-223 thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 13. SOT-223 thermal fitting model
Figure 14. SO-8 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 15. SO-8 Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . 19
Figure 16. SO-8 thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 17. SO-8 thermal fitting mode
Figure 18. SOT-223 mechanical data & package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 19. SO8 mechanical data & package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 20. SOT-223 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 21. SO-8 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 22. SO-8 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
(1)
l. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4/26 Doc ID 16364 Rev 2
Page 5
VNL5160N3-E, VNL5160S5-E Block diagrams and pins configurations
1 Block diagrams and pins configurations
Figure 1. VNL5160N3-E block diagram
$2!).
#ONTROL$IAGNOSTIC,/')#
).054
$2)6%2
!#4)6%0/7%2,)-)4!4)/.
Figure 2. VNL5160S5-E block diagram
3500,9
6/,4!'%
3500,9
,/')#
#ONTROL$IAGNOSTIC
/&&3TATE
/PENLOAD
#URRENT
,IMITATION
/6%24%-0%2!452%
02/4%#4)/.
/6%2,/!$02/4%#4)/.
#URRENT
,IMITATION
0O WER
#LAMP
0OWER
#LAMP
'.$
("1($'5
$2!).
).054
34!453
$2)6%2
/6%24%-0%2!452%
02/4%#
/6%2,/!$02/4%#4)/.
!#4)6%0/7%2,)-)4!4)/.
4)/.
'.$
("1($'5
Doc ID 16364 Rev 2 5/26
Page 6
Block diagrams and pins configurations VNL5160N3-E, VNL5160S5-E
Table 2. Pin function
Name Function
INPUT
Voltage controlled input pin with hysteresis, CMOS compatible. Controls output
switch state
(1)
DRAIN PowerMOS drain
SOURCE PowerMOS source and ground reference for the control section
SUPPLY
VOLTAGE
STATUS Open drain digital diagnostic pin
1. Internally connected to V
2. Valid for VNL5160S5-E only.
Supply voltage connected to the signal part (5V)
(2)
in the VNL5160N3-E.
supply
Figure 3. VNL5160N3-E current and voltage conventions
I
D
DRAIN
I
IN
INPUT
SOURCE
V
DS
V
IN
Figure 4. VNL5160S5-E current and voltage conventions
I
IN
I
STAT
V
IN
V
STAT
V
SUPPLY
INPUT
STATUS
I
S
SUPPLY
VOLTAGE
DRAIN
SOURCE
I
D
V
DS
6/26 Doc ID 16364 Rev 2
Page 7
VNL5160N3-E, VNL5160S5-E Block diagrams and pins configurations
Figure 5. Configuration diagrams (top view)
SOT-223
Table 3. Suggested connections for unused and not connected pins
SO-8
Connection/pin Status N.C. Input
Floating X X X
To ground Not allowed X Through 10kΩ resistor
Doc ID 16364 Rev 2 7/26
Page 8
Absolute maximum rating VNL5160N3-E, VNL5160S5-E
2 Absolute maximum rating
Stressing the device above the rating listed in Tabl e 4 may cause permanent damage to the
device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the Operating sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability. Refer also to the STMicroelectronics SURE Program and other relevant
quality document
2.1 Absolute maximum ratings
Table 4. Absolute maximum ratings
Val ue Un it
Symbol Parameter
SOT-223 SO-8
V
- I
I
STAT
V
ESD1
V
ESD2
T
E
Drain-source voltage (VIN=0V) Internally clamped V
DS
DC drain current Internally limited A
I
D
Reverse DC drain current -4 A
D
DC supply current - -1 to 10 mA
I
S
DC input current -1 to 10 mA
I
IN
DC status current - -1 to 10 mA
Electrostatic discharge (R=1.5kΩ; C=100pF)
–INPUT
–STATUS
– SUPPLY
– DRAIN
Electrostatic discharge on output pin only
(R=330Ω, C=150pF)
T
Junction operating temperature -40 to 150 °C
j
Storage temperature -55 to 150 °C
stg
4000
4000
4000
5000
2000 V
Single pulse avalanche energy
L=8.5mH, T
as
V
=13.5V, I
batt
= 150 °C, RL=0Ω,
j
out=IlimL
37 mJ
V
8/26 Doc ID 16364 Rev 2
Page 9
VNL5160N3-E, VNL5160S5-E Absolute maximum rating
2.2 Thermal data
Table 5. Thermal data
Maximum value
Symbol Parameter
SOT-223 SO-8
R
thj-amb
1. When mounted on a standard single-sided FR4 board with 0.5cm2 of Cu (at least 35 µm thick) connected
to all DRAIN pins
Thermal resistance junction-ambient 146.8
(1)
103.1 °C/W
Unit
Doc ID 16364 Rev 2 9/26
Page 10
Electrical characteristics VNL5160N3-E, VNL5160S5-E
3 Electrical characteristics
Values specified in this section are for VIN=V
= 4.5 V to 5.5 V, -40 °C < Tj<150°C,
supply
unless otherwise stated.
Table 6. PowerMOS section
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
supply
R
V
CLAMP
V
CLTH
I
DSS
Table 7. Source drain diode
Operating supply
voltage
On-state resistance
ON
Drain-source clamp
voltage
Drain-source clamp
threshold voltage
Off-state output current
VIN=V
supply
=5V
ID = 1 A; Tj = 25 °C
= 1 A; Tj = 150 °C
I
D
= 0 V; ID = 1 A 41 46 52 V
V
IN
= 0 V; ID = 2 mA 36 V
V
IN
V
IN
V
IN
= 0 V; V
= 0 V; V
= 13 V; Tj = 25 °C
DS
= 13 V; Tj = 125 °C00
DS
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
Forward on voltage ID = 1 A; V
SD
= 0 V 0.8 V
IN
3.555.5V
160 170
320mΩmΩ
3
5
µA
Table 8. Input section
(1)
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
V
V
1. Valid for VNL5160N3-E option (input & supply pins connected together).
Supply current from
ISS
input pin
Input clamp voltage
ICL
Input threshold
INTH
voltage
On-state V
V
= 0 V
DS
I
= 1 mA
S
= -1 mA
I
S
= VIN; ID = 1 mA 1 3.5 V
V
DS
IN
= V
supply
= 5 V;
30 110 µA
5.5
-0.7
7V
V
10/26 Doc ID 16364 Rev 2
Page 11
VNL5160N3-E, VNL5160S5-E Electrical characteristics
Table 9. Status pin
(1)
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
STAT
I
LSTAT
C
STAT
V
STCL
1. Valid for VNL5160S5-E option.
Table 10. Logic input
Status low output
voltage
Status leakage current
Status pin input
capacitance
Status clamp voltage
(1)
= 1 mA 0.5 V
I
STAT
Normal operation,
V
= 5 V
STAT
Normal operation,
= 5 V
V
STAT
I
STAT
I
STAT
= 1 mA
= -1 mA
5.5
-0.7
10 µA
100 pF
7V
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
V
V
V
I(hyst)
Input low level voltage 0.9 V
IL
Low level input current V
I
IL
Input high level voltage 2.1 V
IH
High level input current V
I
IH
= 0.9 V 1 µA
IN
= 2.1 V 10 µA
IN
Input hysteresis voltage 0.13 V
Input clamp voltage
ICL
IIN = 1 mA
IIN = -1 mA
5.5
7V
-0.7
V
V
1. Valid for VNL5160S5-E option.
Table 11. Openload detection
(1)
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
Open-load off-state voltage
Ol
detection threshold
= 0 V 0.6 1.2 1.7 V
V
IN
Delay between INPUT falling
t
d(oloff)
edge and STATUS falling
I
= 0 A 45 425 1100 µs
OUT
edge in openload condition
1. Valid for VNL5160S5-E option.
Table 12. Supply section
(1)
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
Supply current
S
V
1. Valid for VNL5160S5-E option.
Supply clamp voltage
SCL
Off-state Tj = 25 °C; V
On-state Tj = 25 °C; V
I
= 1mA
SCL
I
= -1mA
SCL
= V
IN
= 5 V; V
IN
DRAIN
= 0 V;
DS
= 0 V
5.5
102525
110µAµA
7V
-0.7
V
Doc ID 16364 Rev 2 11/26
Page 12
Electrical characteristics VNL5160N3-E, VNL5160S5-E
Table 13. Switching characteristics (Vcc=13V
(1)
)
SOT-223
(2)
Symbol Parameter Test conditions
Min. Typ. Max Min. Typ. Max.
t
d(ON)
t
d(OFF)
W
W
Turn-on delay time RL = 13Ω, VCC = 13V
Turn-off delay time RL = 13Ω, V
Rise time RL = 13Ω, V
t
r
t
Fall time RL = 13Ω, V
f
Switching energy
ON
losses at turn-on
Switching energy
OFF
losses at turn-off
R
= 13Ω, V
L
= 13Ω, V
R
L
CC
CC
CC
CC
CC
1. See Figure 7: VNL5160N3-E application schematic and Figure 8: VNL5160S5-E application schematic.
2. 3.5 V < Vs
=Vin<5.5V.
upply
3. See Figure 6: Switching characteristics.
Table 14. Protection and diagnostics
Symbol Parameter Test conditions
I
limH
I
t
DC short circuit current V
Short circuit current
limL
during thermal cycling
Step response current
dlim
limit
(3)
8.9 8.9 µs
= 13V 13.2 13.2 µs
= 13V 14.1 14.1 µs
= 13V 11.5 11.5 µs
= 13V 34.3 34.3 µJ
= 13V 34.3 34.3 µJ
= 13V; VIN=V
DS
V
= 13V; TR < Tj < T
DS
VIN=V
supply
V
= 13V; V
DS
(1)
=5V 3.557.5A
supply
TSD;
=5V
= 5V 20 µs
input
Min. Typ. Max. Unit
SO-8
Unit
2.5 Α
T
T
1. V
T
RS
HYST
Shutdown temperature 150 175 200 °C
TSD
Reset temperature TRS+1 TRS+5 °C
T
R
Thermal reset of
(2)
STATUS
Thermal hysteresis
- TR)
(T
TSD
supply=Vinput
in VNL5160N3-E version.
2. Valid for VNL5160S5-E option.
135 °C
7°C
12/26 Doc ID 16364 Rev 2
Page 13
VNL5160N3-E, VNL5160S5-E Electrical characteristics
Table 15. Truth table
(1)
Conditions INPUT DRAIN STATUS
Normal operation
Current limitation
Overtemperature
Undervoltage
Output voltage < V
1. Valid for VNL5160S5-E option
OL
L
H
L
H
L
H
L
H
L
H
Figure 6. Switching characteristics
I
D
90%
H
L
H
X
H
H
H
H
L
L
H
H
H
H
H
L
X
X
L
H
t
d(off)
t
f
t
t
t
r
t
V
gen
d(on)
10%
Doc ID 16364 Rev 2 13/26
Page 14
Application information VNL5160N3-E, VNL5160S5-E
4 Application information
Figure 7. VNL5160N3-E application schematic
V
+5V
R
L
cc
INPUT
R
µC
prot
Figure 8. VNL5160S5-E application schematic
DRAIN
SOURCE
14/26 Doc ID 16364 Rev 2
Page 15
VNL5160N3-E, VNL5160S5-E Application information
4.1 MCU I/O protection
ST suggests to insert a resistor (Rprot) in line to prevent the µC I/O pins from latching up
The value of these resistors is a compromise between the leakage current of µC and the
current required by the LSD I/Os (Input levels compatibility) with the latch-up limit of µC I/Os:
(b)
.
0.7/I
latchup
≤ R
prot
≤ (V
OHµC-VIH
) / I
IHmax
Calculation example:
For the following conditions:
I
≥ 20mA
latchup
V
≥ 4.5V
OHµC
35Ω ≤ R
Recommended value is R
prot
≤100kΩ.
prot
=10kΩ
Figure 9. Maximum demagnetization energy
10
1
VNL5160x - Single Pulse
Repetitive pulse Tjstart=100°C
I (A)
Repetitive pulse Tjstart=125°C
0.1
110100
b. In case of negative transient on the drain pin.
L (mH)
Doc ID 16364 Rev 2 15/26
Page 16
Package and PC board thermal data VNL5160N3-E, VNL5160S5-E
5 Package and PC board thermal data
5.1 SOT-223 thermal data
Figure 10. SOT-223 PC board
Note: Layout condition of R
thickness = 2 mm, Cu thickness=35 µm, Copper areas: from minimum pad layout to
2
0.8 cm
).
Figure 11. SOT-223 R
160
150
RTHj_amb(°C/W)
140
130
120
110
100
90
80
70
60
0 0.5 1 1.5 2 2.5
GAPGCFT00530
and Zth measurements (PCB FR4 area = 30 mm x 30 mm,PCB
th
vs PCB copper area in open box free air condition
thj-amb
RTHjamb
footprint
PCB Cu heatsink area (cm^2) - (refer to PCB layout)
16/26 Doc ID 16364 Rev 2
Page 17
VNL5160N3-E, VNL5160S5-E Package and PC board thermal data
Figure 12. SOT-223 thermal impedance junction ambient single pulse
ZTH (°C/W)
1000
Footprint
2
100
2 cm
10
1
0.1
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
Equation 1: pulse calculation formula
Z
THδ
where δ = t
Figure 13. SOT-223 thermal fitting model
1. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
Table 16. SOT-223 thermal parameter
R
δ Z
TH
/T
P
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
THtp
1 δ–()+⋅=
(1)
Area/island (cm2)FP2
R1 (°C/W) 1.4
R2 (°C/W) 1.8
R3 (°C/W) 4.5
R4 (°C/W) 24
Doc ID 16364 Rev 2 17/26
Page 18
Package and PC board thermal data VNL5160N3-E, VNL5160S5-E
Table 16. SOT-223 thermal parameter (continued)
Area/island (cm2)FP2
R5 (°C/W) 0.1
R6 (°C/W) 115 45
C1 (W·s/°C) 0.0003
C2 (W·s/°C) 0.002
C3 (W·s/°C) 0.03
C4 (W·s/°C) 0.16
C5 (W·s/°C) 1000
C6 (W·s/°C) 0.4 2
5.2 SO-8 thermal data
Figure 14. SO-8 PC board
Note: Layout condition of R
and Zth measurements (PCB FR4 area = 58 mm x 58 mm,PCB
th
thickness = 2 mm, Cu thickness=35 µm, Copper areas: from minimum pad layout to 2 cm
18/26 Doc ID 16364 Rev 2
GAPGCFT00534
2
).
Page 19
VNL5160N3-E, VNL5160S5-E Package and PC board thermal data
Figure 15. SO-8 R
115
RTHj_amb(°C/W)
105
vs PCB copper area in open box free air condition
thj-amb
RTHjamb
footprint
95
85
75
65
0 0.5 1 1.5 2 2.5
PCB Cu heatsink area (cm^2) - (refer to PCB layout)
Figure 16. SO-8 thermal impedance junction ambient single pulse
ZTH (°C/W)
1000
100
10
1
0.1
0.0001 0.001 0.01 0.1 1 10 100 1000
Equation 2: pulse calculation formula
Z
THδ
where δ = t
R
TH
P
δ Z
/T
THtp
1 δ–()+⋅=
Time (s)
Footprint
2 cm
2
Doc ID 16364 Rev 2 19/26
Page 20
Package and PC board thermal data VNL5160N3-E, VNL5160S5-E
Figure 17. SO-8 thermal fitting mode
1. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
Table 17. SO-8 thermal parameter
(1)
l
Area/island (cm2)0.072
R1 (°C/W) 1.4
R2 (°C/W) 3.2
R3 (°C/W) 3.5
R4 (°C/W) 21
R5 (°C/W) 16
R6 (°C/W) 58 28
C1 (W·s/°C) 0.0008
C2 (W·s/°C) 0.0032
C3 (W·s/°C) 0.0075
C4 (W·s/°C) 0.045
C5 (W·s/°C) 0.35
C6 (W·s/°C) 1.05 2
20/26 Doc ID 16364 Rev 2
Page 21
VNL5160N3-E, VNL5160S5-E Package and packing information
6 Package and packing information
6.1 ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
6.2 SOT-223 mechanical data
Figure 18. SOT-223 mechanical data & package outline
.
0046067
Doc ID 16364 Rev 2 21/26
Page 22
Package and packing information VNL5160N3-E, VNL5160S5-E
6.3 SO8 mechanical data
Figure 19. SO8 mechanical data & package outline
DIM.
A 1.750 0.0689
A1 0.100 0.250 0.0039 0.0098
A2 1.250 0.0492
b 0.280 0.480 0.0110 0.0189
c 0.170 0.230 0.0067 0.0091
(1)
4.800 4.900 5.000 0.1890 0.1929 0.1969
D
E 5.800 6.000 6.200 0.2283 0.2362 0.2441
(2)
3.800 3.900 4.000 0.1496 0.1535 0.1575
E1
e 1.270 0.0500
h 0.250 0.500 0.0098 0.0197
L 0.400 1.270 0.0157 0.0500
L1 1.040 0.0409
k0˚8˚0˚8˚
ccc 0.100 0.0039
Notes: 1. Dimensions D does not include mold flash,
protrusions or gate burrs.
Mold flash, po trusions or gate burrs shall not
exceed 0.15m m in total (both side) .
2. Dimension “E1” does not include interlead flash
or protrusions. Interlead flash or protrusions shall
not exceed 0.25 mm per side.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
OUTLINE AND
MECHANICAL DATA
SO-8
22/26 Doc ID 16364 Rev 2
0016023 D
Page 23
VNL5160N3-E, VNL5160S5-E Package and packing information
6.4 SOT-223 packing information
The devices can be packed in tube or tape and reel shipments (see the Table 1: Device
summary).
Figure 20. SOT-223 tape and reel shipment (suffix “TR”)
Reel dimensions
Base Q.ty 1000
Bulk Q.ty 1000
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 12.4
N (min) 60
T (max) 18.4
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width W 12
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (+ 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 5.5
Compartment Depth K (max) 4.5
Hole Spacing P1 (± 0.1) 2
All dimensions are in mm.
End
Start
Top
cover
tape
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
No componentsNo components Components
500mm min
Doc ID 16364 Rev 2 23/26
Page 24
Package and packing information VNL5160N3-E, VNL5160S5-E
6.5 SO8 packing information
Figure 21. SO-8 tube shipment (no suffix)
B
C
Base Q.ty 100
Bulk Q.ty 2000
Tube length (± 0.5) 532
A
A 3.2
B 6
C (± 0.1) 0.6
All dimensions are in mm.
Figure 22. SO-8 tape and reel shipment (suffix “TR”)
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width W 12
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (+ 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 5.5
Compartment Depth K (max) 4.5
Hole Spacing P1 (± 0.1) 2
All dimensions are in mm.
End
REEL DIMENSIONS
Base Q.ty 2500
Bulk Q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 12.4
N (min) 60
T (max) 18.4
All dimensions are in mm.
Top
cover
tape
24/26 Doc ID 16364 Rev 2
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
Start
No componentsNo components Components
500mm min
Page 25
VNL5160N3-E, VNL5160S5-E Revision history
7 Revision history
Table 18. Document revision history
Date Revision Changes
17-Nov-2009 1 Initial release.
20-Feb-2012 2
Update the entire document in ST template.
Update Section : Features in cover page.
Doc ID 16364 Rev 2 25/26
Page 26
VNL5160N3-E, VNL5160S5-E
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