Datasheet VND600SP-E Datasheet (ST)

Features

VND600SP-E

Double channel high-side driver

Typ e R

VND600SP-E 30 mΩ 25 A 36 V

■ ECOPACK

■ Automotive Grade: compliance with AEC

DS(on)

®

: lead free and RoHS compliant

I

lim

V

CC

Guidelines

■ Very low standby current

■ CMOS compatible input

■ Proportional load current sense

■ Current sense disable

■ Thermal shutdown protection and diagnosis

■ Undervoltage shutdown

■ Overvoltage clamp

■ Load current limitation

10

1

PowerSO-10™

Description

The VND600SP-E is a monolithic device made
using STMicroelectronics™ VIPower™ M0-3
technology. It is intended for driving resistive or
inductive loads with one side connected to
ground. Active V
device against low energy spikes (see ISO7637
transient compatibility table).

This device has two channels in high-side
configuration; each channel has an analog sense
output on which the sensing current is
proportional (according to a known ratio) to the
corresponding load current.

Built-in thermal shutdown and outputs current
limitation protect the chip from overtemperature
and short circuit. Device turns-off in case of
ground pin disconnections.

pin voltage clamp protects the

CC

Table 1. Device summary

Package

PowerSO-10™ VND600SP-E VND600SPTR-E

February 2011 Doc ID 10876 Rev 3 1/26

Order codes

Tube Tape and reel

www.st.com

1

Contents VND600SP-E

Contents

1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 16

3.1.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 16

3.1.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 17

3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.3 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.4 PowerSO-10 maximum demagnetization energy
(V

= 13.5 V) 18

CC

4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

4.1 PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

5.2 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

5.3 PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

2/26 Doc ID 10876 Rev 3

VND600SP-E List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5

Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 5. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 6. Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 7. V
Table 8. Current sense 9 V ≤ V
Table 9. Switching (V

Table 10. Logic input (channel 1, 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 11. Truth table (per each channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Table 12. Electrical transient requirements on V
Table 13. Electrical transient requirements on V
Table 14. Electrical transient requirements on V

Table 15. Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Table 16. PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Table 17. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

- output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

CC

= 13 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

CC

≤ 16 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

CC

pin (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

CC

pin (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

CC

pin (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

CC

Doc ID 10876 Rev 3 3/26

List of figures VND600SP-E

List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 4. Switching characteristics (resistive load R
Figure 5. I

OUT/ISENSE

versus I

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

OUT

Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 7. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 9. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 10. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 11. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 12. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 13. Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 14. I

LIM

vs T

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

case

Figure 15. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 16. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 17. On-state resistance vs T
Figure 18. On-state resistance vs V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

case

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

CC

Figure 19. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 20. Maximum turn- off current versus load inductance
Figure 21. PowerSO-10 PC board

(1)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 22. Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 23. PowerSO-10 thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . 20

Figure 24. Thermal fitting model of a double channel HSD in PowerSO-10 . . . . . . . . . . . . . . . . . . . . 20

Figure 25. PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Figure 26. PowerSO-10 suggested pad layout and tube shipment (no suffix). . . . . . . . . . . . . . . . . . . 24

Figure 27. Tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

=2.6Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

L

(1)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

4/26 Doc ID 10876 Rev 3

VND600SP-E Block diagram and pin description

1 Block diagram and pin description

Figure 1. Block diagram

VCC

OVERVOLTAGE

VCC CLAMP

UNDERVOLTAGE

DRIVER 1

INPUT 1

LOGIC

INPUT 2

GND

OVERTEMP. 1

OVERTEMP. 2

Ot1

Ot2

DRIVER 2

Figure 2. Configuration diagram (top view)

GROUND

INPUT 2
INPUT 1
C.SENSE1
C.SENSE2

6
7

8
9

10

PwCLAMP 1

IOUT1

PwCLAMP 2

Vdslim2

IOUT2

5
4
3

2

1

ILIM1

Vdslim1

K

ILIM2

K

OUTPUT 1

Ot1

CURRENT
SENSE 1

OUTPUT 2

Ot2

CURRENT
SENSE 2

OUTPUT 2
OUTPUT 2
N.C.
OUTPUT 1
OUTPUT 1

11

V

CC

PowerSO-10

Table 2. Suggested connections for unused and not connected pins

Connection / pin Current sense N.C. Output Input

Floating X X X

To ground

Through 1 KΩ

resistor

X

Doc ID 10876 Rev 3 5/26

Through 10 KΩ

resistor

Electrical specifications VND600SP-E

2 Electrical specifications

Figure 3. Current and voltage conventions

I

S

V

CC

I

I

IN1

V

IN1

I

IN2

V

IN2

INPUT1

CURRENT SENSE 1

INPUT2

CURRENT SENSE 2

OUTPUT1

OUTPUT2

GROUND

I

GND

OUT1

I

SENSE1

I

OUT2

I

SENSE2

V

SENSE2

V

V

V

OUT2

(1)

F1

SENSE1

V

OUT1

V

CC

1) V

= V

- V

Fn

CCn

during reverse battery condition

OUTn

2.1 Absolute maximum ratings

Stressing the device above the rating listed in Tab le 3 may cause permanent damage to the
device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the operating sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Refer also to the STMicroelectronics sure program and other relevant quality
document.

Table 3. Absolute maximum ratings

Symbol Parameter Value Unit

V

CC

-V

- I

GND

I

OUT

I

I

IN

V

CSENSE

CC

R

DC supply voltage 41 V

Reverse supply voltage -0.3 V

DC reverse ground pin current -200 mA

Output current Internally limited A

Reverse output current -21 A

Input current +/- 10 mA

Current sense maximum voltage

-3

+15

V
V

6/26 Doc ID 10876 Rev 3

VND600SP-E Electrical specifications

Table 3. Absolute maximum ratings (continued)

Symbol Parameter Value Unit

Electrostatic discharge (Human Body Model:

V

ESD

R=1.5KΩ; C=100pF)
– INPUT
– CURRENT SENSE
–OUTPUT
–V

CC

4000
2000
5000
5000

V
V
V
V

Maximum switching energy

E

T

MAX

P

tot

T

T

STG

(L = 0.13 mH; RL=0Ω; V

= 150 °C; IL=40A)

T

jstart

=13.5V;

bat

Power dissipation at Tc= 25 °C 96.1 W

Junction operating temperature Internally limited °C

j

Case operating temperature -40 to 150 °C

c

Storage temperature -55 to 150 °C

145 mJ

2.2 Thermal data

Table 4. Thermal data

Symbol Parameter Value Unit

R

thj-case

R

thj-amb

1. When mounted on a standard single sided FR-4 board with 0.5 cm2 of Cu (at least 35 μm thick).

2. When mounted on a standard single-sided FR-4 board with 6 cm2 of Cu (at least 35 μm thick).

Thermal resistance junction-case (max) 1.3 °C/W

Thermal resistance junction-ambient (max) 51.3

(1)

37

(2)

°C/W

Doc ID 10876 Rev 3 7/26

Electrical specifications VND600SP-E

2.3 Electrical characteristics

Values specified in this section are for 8 V < V

< 36 V; -40 °C < Tj < 150 °C, unless

CC

otherwise stated. (Per each channel).

Table 5. Power

Symbol Parameter Test conditions Min. Typ. Max. Unit

Operating supply

(1)

V

V

V

OV

V

I

I

I

I

CC

USD

(1)(2)

R

ON

clamp

(1)

I

S

L(off1)

L(off2)

L(off3)

L(off4)

voltage

(1)

Undervoltage shutdown 3 4 5.5 V

Overvoltage shutdown 36 V

I

=5A; Tj=25°C 30 mΩ

OUT

On-state resistance

Clamp voltage ICC=20mA

=5A; Tj= 150 °C 60 mΩ

I

OUT

I

=3A; VCC=6V 100 mΩ

OUT

(2)

Off-state; VCC=13V;
VIN=V

Supply current

Off-state; V
V

IN=VOUT

On-state; V
I

OUT

Off-state output current VIN=V

Off-state output current VIN=0V; V

V

Off-state output current

Off-state output current

IN=VOUT

V

CC

V

IN=VOUT

Tj =25°C

=0V

OUT

=13V;

CC

=0V; Tj=25°C

=5V; VCC=13V;

IN

=0A; R

= 0 V 0 50 µA

OUT

OUT

=3.9kΩ

SENSE

=3.5V -75 0 µA

=0V;

=13V; Tj =125°C

=0V; VCC=13V;

5.5 13 36 V

41 48 55 V

12 40 µA

12 25 mA

6mA

5µA

3µA

1. Per device.

2. V

Table 6. Protection

clamp

and V

are correlated. Typical difference is 5 V.

OV

(1)

Symbol Parameter Test conditions Min. Typ. Max. Unit

V

= 13 V 25 40 70 A

CC

5.5 V < V

CC

T

T

HYST

I

DC short circuit current

lim

Thermal shutdown

TSD

temperature

Thermal reset temperature 135 °C

T

R

Thermal hysteresis 7 15 °C

8/26 Doc ID 10876 Rev 3

<36V 70 A

150 175 200 °C

VND600SP-E Electrical specifications

Table 6. Protection

(1)

(continued)

Symbol Parameter Test conditions Min. Typ. Max. Unit

V

demag

V

1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related

Table 7. V

Turn-off output voltage
clamp

Output voltage drop

ON

limitation

diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles

- output diode

CC

I

=2A; VIN=0V;

OUT

L=6mH

I

=0.5A

OUT

Tj= -40 °C...+150 °C

-48VCC-

V

-41

V

CC

CC

55

50 mV

Symbol Parameter Test conditions Min Typ Max Unit

V

Table 8. Current sense 9 V ≤ VCC≤ 16 V

Forward on voltage -I

F

= 2.6 A; Tj= 150 °C - - 0.6 V

OUT

Symbol Parameter Test conditions Min Typ Max Unit

I

or I

K

I

1

OUT/ISENSE

OUT1

V

SENSE

=0.5A;

OUT2

= 0.5 V; other channels

3300 4400 6000

open; Tj= -40 °C...150 °C

I

dK

1/K1

Current sense ratio drift

OUT1

V

SENSE

or I

=0.5A;

OUT2

= 0.5 V; other channels

-10 +10 %

open; Tj= -40 °C...150 °C

V

K

dK

2/K2

K

dK

3/K3

V

SENSE1,2

V

SENSEH

I

2

OUT/ISENSE

Current sense ratio drift

I

3

OUT/ISENSE

Current sense ratio drift

Max analog sense output
voltage

Analog sense output
voltage in overtemperature
condition

I

OUT1

or I

OUT2

=5A; V

SENSE

=4V;

other channels open; Tj=-40°C

= 25 °C...150 °C

T

j

I

OUT1

or I

OUT2

=5A; V

SENSE

=4V;

other channels open;

= - 40 °C...150 °C

T

j

I

or I

OUT1

other channels open; T

= 25 °C...150 °C

T

j

or I

I

OUT1

OUT2

OUT2

=15A; V

=15A; V

SENSE

=- 40 °C

j

SENSE

=4V;

=4V;
other channels open;
T

= -40 °C...150 °C

j

V

CC

R

SENSE

V

CC

R

SENSE

V

CC

= 5.5 V; I

=10kΩ

>8V, I

OUT1,2

=10kΩ

=13V; R

=2.5A;

OUT1,2

=5A;

=3.9kΩ 5.5 V

SENSE

4200
4400

4900
4900

6000
5750

-6 +6 %

4200
4400

4900
4900

5500
5250

-6 +6 %

2V

4V

Doc ID 10876 Rev 3 9/26

Electrical specifications VND600SP-E

Table 8. Current sense 9 V ≤ VCC≤ 16 V (continued)

Symbol Parameter Test conditions Min Typ Max Unit

Analog sense output

R

VSENSEH

impedance in
overtemperature condition

t

DSENSE

1. Current sense signal delay after positive input slope.

Current sense delay
response

Table 9. Switching (VCC=13V)

=13V; Tj>T

V

CC

All channels open

to 90% I

Symbol Parameter Test conditions Min Typ Max Unit

t

d(on)

t

d(off)

(dV

OUT

(dV

OUT

Table 10. Logic input (channel 1, 2)

Turn-on delay time RL=2.6Ω (seeFigure 4)- 30-µs

Turn-on delay time RL=2.6Ω (seeFigure 4)- 30-µs

/dt)onTurn-on voltage slope RL=2.6Ω (see Figure 4)-Figure 15 -V/µs

/dt)

Turn-off voltage slope RL=2.6Ω (see Figure 4)-Figure 16 -V/µs

off

Symbol Parameter Test conditions Min Typ Max Unit

V

V

V

I

V

I

I(hyst)

Input low level voltage 1.25 V

IL

Low level input current VIN=1.25V 1 µA

IL

Input high level voltage 3.25 V

IH

High level input current VIN= 3.25 V 10 µA

IH

Input hysteresis voltage 0.5 V

Input clamp voltage

ICL

;

TSD

(1)

SENSE

I

=1mA 6 6.8 8 V

IN

I

=-1mA -0.7 V

IN

400 Ω

500 µs

10/26 Doc ID 10876 Rev 3

VND600SP-E Electrical specifications

Figure 4. Switching characteristics (resistive load RL=2.6Ω)

V

OUT

Figure 5. I

I

OUT/ISENSE

6500

6000

5500

5000

4500

dV

OUT

I

SENSE

INPUT

OUT/ISENSE

80%

/dt

(on)

90%

t

DSENSE

t

d(on)

versus I

t

r

10%

OUT

max.Tj=25...150°C

min.Tj=25...150°C

t

d(off)

90%

t

dV

/dt

OUT

(off)

f

t

t

t

max.Tj=-40°C

typical value

4000

min.Tj=-40°C

3500

3000

0246810121416

I

(A)

OUT

Doc ID 10876 Rev 3 11/26

Electrical specifications VND600SP-E

Table 11. Truth table (per each channel)

Conditions Input Output Sense

Normal operation

Overtemperature

Undervoltage

Overvoltage

Short circuit to GND

Short circuit to V

CC

Negative output voltage
clamp

L

H

L

H

L

H

L

H

L
H
H

L
H

L

H

L
L

L
L

L
L

L
L
L

(T

j<TTSD

(T

j>TTSD

H
H

0

Nominal

0

V

SENSEH

0
0

0
0

0
) 0
) V

SENSEH

0

< Nominal

LL0

12/26 Doc ID 10876 Rev 3

VND600SP-E Electrical specifications

Table 12. Electrical transient requirements on VCC pin (part 1)

ISO T/R 7637/1

Test levels

test pulse

I II III IV

1 -25 V -50 V -75 V -100 V 2 ms, 10 Ω

2 +25 V +50 V +75 V +100 V 0.2 ms, 10 Ω

3a -25 V -50 V -100 V -150 V 0.1 µs, 50 Ω

3b +25 V +50 V +75 V +100 V 0.1 µs, 50 Ω

4 -4 V -5 V -6 V -7 V 100 ms, 0.01

5 +26.5 V +46.5 V +66.5 V +86.5 V 400 ms, 2

Table 13. Electrical transient requirements on VCC pin (part 2)

ISO T/R 7637/1

Test pulse

I II III IV

Test levels results

1CCCC

2CCCC

3aCCCC

3bCCCC

4CCCC

Delays and
impedance

Ω

Ω

5C E E E

Table 14. Electrical transient requirements on VCC pin (part 3)

Class Contents

C

All functions of the device are performed as designed after exposure to
disturbance.

One or more functions of the device is not performed as designed after exposure

E

to disturbance and cannot be returned to proper operation without replacing the
device.

Doc ID 10876 Rev 3 13/26

Electrical specifications VND600SP-E

Figure 6. Waveforms

NORMAL OPERATION

INPUT

n

LOAD CURRENT

SENSE

n

V

CC

INPUT

n

LOAD CURRENT

SENSE

n

V

CC

INPUT

n

LOAD CURRENT
SENSE

n

n

UNDERVOLTAGE

V

V

USD

n

USDhyst

OVERVOLTAGE

V

OV

V

V

< V

CC

OV

n

> V

CC

OV

INPUT

n

LOAD CURRENT
LOAD VOLTAGE

SENSE

n

INPUT

n

LOAD VOLTAGE
LOAD CURRENT

SENSE

n

T

j

INPUT

n

LOAD CURRENT

SENSE

n

SHORT TO GROUND

n

n

SHORT TO V

n

n

<Nominal

T

TSD

T

R

n

OVERTEMPERATURE

CC

<Nominal

I

SENSE

=

V

SENSEH

R

SENSE

14/26 Doc ID 10876 Rev 3

VND600SP-E Electrical specifications

2.4 Electrical characteristics curves

Figure 7. Off-state output current Figure 8. High level input current

IL(off1) (uA)

5

4.5

4

3.5

3

2.5

2

1.5

1

0.5

0

-50 -25 0 25 50 75 100 125 150 175

Off state
Vcc=36V

Vin=Vout=0V

Tc (°C)

Figure 9. Input low level Figure 10. Input high level

Vil (V)

2.6

2.4

2.2

2

1.8

1.6

1.4

1.2

1

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

Iih (uA)

5

4.5

3.5

2.5

1.5

0.5

Vin=3.25V

4

3

2

1

0

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

Vih (V)

3.6

3.4

3.2

3

2.8

2.6

2.4

2.2

2

-50 - 25 0 25 50 75 100 125 150 175

Tc (°C)

Figure 11. Input clamp voltage Figure 12. Input hysteresis voltage

Vicl (V)

8

7.8

7.6

7.4

7.2

6.8

6.6

6.4

6.2

Iin=1mA

7

6

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

Vhyst (V)

1.5

1.4

1.3

1.2

1.1

1

0.9

0.8

0.7

0.6

0.5

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

Doc ID 10876 Rev 3 15/26

Electrical specifications VND600SP-E

Figure 13. Overvoltage shutdown Figure 14. I

Vov (V)

50

48

46

44

42

40

38

36

34

32

30

-50 -25 0 25 50 75 100 125 150 175

Ilim (A)

80

70

60

50

40

30

20

10

0

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

Figure 15. Turn-on voltage slope Figure 16. Turn-off voltage slope

dVout/dt(on) (V/ms)

750

700

650

600

550

500

450

400

350

300

250

Vcc=13V

Rl=2.6Ohm

-50 -25 0 25 50 75 100 125 150 175

dVout/dt(off) (V/ms)

500

450

400

350

300

250

200

150

100

50

0

-50 -25 0 25 50 75 100 125 150 175

Tc (ºC)

vs T

LIM

Vcc=13V

Vcc=13V

Rl=2.6Ohm

case

Tc (°C)

Tc (ºC)

Figure 17. On-state resistance vs T

case

Figure 18. On-state resistance vs V

Ron (mOhm)

100

90

80

70

60

50

40

30

20

10

0

-75 -50 -25 0 25 50 75 100 125 150 175

Iout=5A

Vcc=8V & 36V

Tc (°C)

16/26 Doc ID 10876 Rev 3

CC

Ron (mOhm)

80

70

60

50

40

30

20

10

0

5 10152025303540

Iout=5A

Tc= 150°C

Tc= 25°C

Tc= - 40°C

Vcc (V)

VND600SP-E Application information

3 Application information

Figure 19. Application schematic

+5V

R

prot

R

μ

C

prot

R

prot

INPUT1

CURRENT SENSE1

INPUT2

V

CC

D

ld

OUTPUT1

R

SENSE1

R

prot

CURRENT SENSE2

R

SENSE2

GND

R

GND

GND

V

OUTPUT2

D

GND

3.1 GND protection network against reverse battery

3.1.1 Solution 1: resistor in the ground line (R

This can be used with any type of load.

The following is an indication on how to dimension the R

1. R

2. R

where -I
maximum rating section of the device’s datasheet.

Power dissipation in R

P

= (-VCC)2/ R

D

This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where I
maximum on-state currents of the different devices.

≤ 600 mV / I

GND

≥ (-VCC) / (-I

GND

is the DC reverse ground pin current and can be found in the absolute

GND

GND

S(on)max

)

GND

(when V

GND

< 0: during reverse battery situations) is:

CC

GND

only)

resistor.

GND

S(on)max

becomes the sum of the

Please note that if the microprocessor ground is not shared by the device ground then the
R

produces a shift (I

GND

S(on)max

* R

) in the input thresholds and the status output

GND

values. This shift varies depending on how many devices are ON in the case of several
high-side drivers sharing the same R

GND

.

If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize solution 2 (see Section 3.1.2).

Doc ID 10876 Rev 3 17/26

Application information VND600SP-E

3.1.2 Solution 2: diode (D

A resistor (R

= 1 kΩ) should be inserted in parallel to D

GND

) in the ground line

GND

inductive load.

This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network produces a shift (∼600 mV) in the input threshold
and in the status output values if the microprocessor ground is not common to the device
ground. This shift does not vary if more than one HSD shares the same diode/resistor
network.

Series resistor in INPUT and STATUS lines are also required to prevent that, during battery
voltage transient, the current exceeds the absolute maximum rating.

Safest configuration for unused INPUT and STATUS pin is to leave them unconnected, while
unused SENSE pin has to be connected to ground pin.

3.2 Load dump protection

Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the
V

max DC rating. The same applies if the device is subject to transients on the VCC line

CC

that are greater than the ones shown in Ta bl e 1 2.

3.3 MCU I/Os protection

if the device drives an

GND

If a ground protection network is used and negative transient are present on the VCC line,
the control pins are pulled negative. ST suggests to insert a resistor (R

) in line to prevent

prot

the microcontroller I/Os pins to latch-up.

The value of these resistors is a compromise between the leakage current of microcontroller
and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of
microcontroller I/Os.

-V

CCpeak/Ilatchup

≤ R

prot

≤ (V

OHµC-VIH-VGND

) / I

IHmax

Calculation example:

For V

CCpeak

5kΩ ≤ R

= -100 V and I

≤ 65 kΩ.

prot

latchup

≥ 20 mA; V

OHµC

≥ 4.5 V

Recommended values:

R

=10 kΩ.

prot

18/26 Doc ID 10876 Rev 3

VND600SP-E Application information

3.4 PowerSO-10 maximum demagnetization energy
(V

= 13.5 V)

CC

Figure 20. Maximum turn- off current versus load inductance

(1)

A: A single pulse at T

B: Repetitive pulse at T

C: Repetitive pulse at T

jstart

jstart

jstart

= 150 °C

= 100 °C

=125°C

Condition:
V

= 13.5 V

CC

VIN, I

L

1. Values are generated with R

In case of repetitive pulses, T
the temperature specified above for curves B and C.

Demagnetization

=0

Ω

L

(at beginning of each demagnetization) of every pulse must not exceed

jstart

Demagnetization

Demagnetization

t

Doc ID 10876 Rev 3 19/26

Package and PCB thermal data VND600SP-E

4 Package and PCB thermal data

4.1 PowerSO-10 thermal data

Figure 21. PowerSO-10 PC board

1. Layout condition of R

Cu thickness = 35 µm, Copper areas: from minimum pad lay-out to 8 cm2).

Figure 22. R

thj-amb

RTHj_amb (°C/W)

and Zth measurements (PCB FR4 area= 58 mm x 58 mm, PCB thickness=2 mm,

th

vs PCB copper area in open box free air condition

(1)

55

50

Tj-Tamb=50°C

45

40

35

30

0246810

PCB Cu heatsink area (cm^2)

20/26 Doc ID 10876 Rev 3

VND600SP-E Package and PCB thermal data

Figure 23. PowerSO-10 thermal impedance junction ambient single pulse

Equation 1

Z

THδ

where

: pulse calculation formula

RTHδ Z

THtp

1 δ–()+⋅=

δ tpT⁄=

Figure 24. Thermal fitting model of a double channel HSD in PowerSO-10

Tj_1

Pd1

Tj_2

C1

C1 C2

R1

Pd2

C3 C4

R3R1 R6R5R2

R2

R4

T_amb

C5 C6C2

Doc ID 10876 Rev 3 21/26

Package and PCB thermal data VND600SP-E

Table 15. Thermal parameter

Area/island (cm2) Footprint 6

R1 (°C/ W) 0.05

R2 (°C/ W) 0.3

R3 (°C/ W) 0.3

R4 (°C/ W) 0.8

R5 (°C/ W) 12

R6 (°C/ W) 37 22

C1 (W.s/ °C) 0.001

C2 (W.s /°C) 5.00E-03

C3 (W.s/ °C) 0.02

C4 (W.s/ °C) 0.3

C5 (W.s/ °C) 0.75

C6 (W.s/ °C) 3 5

22/26 Doc ID 10876 Rev 3

VND600SP-E Package and packing information

5 Package and packing information

5.1 ECOPACK® packages

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

5.2 PowerSO-10 mechanical data

Figure 25. PowerSO-10 package dimensions

10

HE

h

A

F

A1

1

eB

0.25

D

= =

D1

= =

E2

DETAIL "A"

B

0.10 A

E

SEATING

PLANE

A

C

B

E4

SEATING

PLANE

A1

DETAIL "A"

L

α

Doc ID 10876 Rev 3 23/26

Package and packing information VND600SP-E

Table 16. PowerSO-10 mechanical data

Millimeters

Dim.

Min. Typ. Max.

A 3.35 3.65

(1)

A

A1 0 0.10

B 0.40 0.60

(1)

B

C 0.35 0.55

(1)

C

D 9.40 9.60

D1 7.40 7.60

E 9.30 9.50

3.4 3.6

0.37 0.53

0.23 0.32

E2 7.20 7.60

(1)

E2

E4 5.90 6.10

(1)

E4

e1.27

F 1.25 1.35

(1)

F

H 13.80 14.40

(1)

H

h0.50

L 1.20 1.80

(1)

L

a0° 8°

(1)

α

1. Muar only POA P013P.

7.30 7.50

5.90 6.30

1.20 1.40

13.85 14.35

0.80 1.10

2° 8°

24/26 Doc ID 10876 Rev 3

VND600SP-E Package and packing information

5.3 PowerSO-10 packing information

Figure 26. PowerSO-10 suggested pad layout and tube shipment (no suffix)

14.6 - 14.9

10.8 - 11

6.30

1

2

3

9.5
4

5

0.67 - 0.73

10

0.54 - 0.6

9

8

7

1.27

6

C

A

All dimensions are in mm.

Casablanca 50 1000 532 10.4 16.4 0.8

Figure 27. Tape and reel shipment (suffix “TR”)

B

Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1)

Muar 50 1000 532 4.9 17.2 0.8

REEL DIMENSIONS

Base Q.ty 600
Bulk Q.ty 600
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 24.4
N (min) 60
T (max) 30.4

All dimensions are in mm.

TAPE DIMENSIONS

According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986

Tape width W 24
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 24
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 11.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2

All dimensions are in mm.

Doc ID 10876 Rev 3 25/26

Top

cover

tape

End

500mm min

Empty components pockets
saled with cover tape.

User directio n of feed

Start

No componentsNo components Components

500mm min

Revision history VND600SP-E

6 Revision history

Table 17. Document revision history

Date Revision Changes

01-Oct-2004 1 Initial release.

28-Jun-2010 2

11-Feb-2011 3

Changed Features list.
Reformatted entire document. No content change.

Updated Features list.
Updated following tables:
– Ta b le 5 : Po w er

≤

V

≤

– Table 8: Current sense 9 V

CC

16 V

26/26 Doc ID 10876 Rev 3

VND600SP-E

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26/26 Doc ID 10876 Rev 3