Double channel high-side driver with analog current sense
for automotive applications
Datasheet − production data
Max transient supply voltageV
Operating voltage rangeVCC4.5 to 28 V
Max on-state resistance (per ch.)R
Current limitation (typ)I
Off-state supply currentI
1. Typical value with all loads connected.
■ General
CC
ON
LIMH
S
41 V
50 mΩ
27 A
(1)
2 µA
– Inrush current active management by
power limitation
– Very low standby current
– 3.0 V CMOS compatible inputs
– Optimized electromagnetic emissions
– Very low electromagnetic susceptibility
– Compliant with European directive
2002/95/EC
– Very low current sense leakage
– AEC-Q100 qualified
■ Diagnostic functions
– Proportional load current sense
– High current sense precision for wide
currents range
– Current sense disable
– Off-state open load detection
– Output short to V
– Undervoltage shutdown
– Overvoltage clamp
– Load current limitation
– Self limiting of fast thermal transients
– Protection against loss of ground and loss
■ All types of resistive, inductive and capacitive
loads
■ Suitable as LED driver
Description
The VND5E050ASO-E is a double channel highside driver manufactured using ST proprietary
VIPower
SO-16L package. The device is designed to drive
12 V automotive grounded loads, and to provide
protection and diagnostics. It also implements a
3 V and 5 V CMOS-compatible interface for the
use with any microcontroller.
The device integrates advanced protective
functions such as load current limitation, inrush
and overload active management by power
limitation, overtemperature shut-off with
auto-restart and overvoltage active clamp. A
dedicated analog current sense pin is associated
with every output channel providing enhanced
diagnostic functions including fast detection of
overload and short-circuit to ground through
power limitation indication, overtemperature
indication, short-circuit to V
state and off-state open-load detection. The
current sensing and diagnostic feedback of the
whole device can be disabled by pulling the
CS_DIS pin high to share the external sense
resistor with similar devices.
®
M0-5 technology and housed in
diagnosis and on-
CC
June 2012Doc ID 022473 Rev 41/37
This is information on a product in full production.
Stressing the device above the rating listed in Table 3: Absolute maximum ratings may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to the conditions in table below for extended
periods may affect device reliability.
Table 3.Absolute maximum ratings
SymbolParameterValueUnit
V
-V
-I
I
-I
I
CC
GND
OUT
OUT
I
IN
CSD
DC supply voltage 41V
Reverse DC supply voltage0.3V
CC
DC reverse ground pin current200mA
DC output currentInternally limitedA
Reverse DC output current 20A
DC input current -1 to 10mA
DC current sense disable input current -1 to 10mA
-I
CSENSE
V
CSENSE
DC reverse CS pin current 200mA
- 41 to
V
Current sense maximum voltage
CC
+V
CC
V
Doc ID 022473 Rev 47/37
Page 8
Electrical specificationsVND5E050ASO-E
Table 3.Absolute maximum ratings (continued)
SymbolParameterValueUnit
Maximum switching energy (single pulse)
E
V
V
MAX
ESD
ESD
(L = 3 mH; R
I
OUT=IlimL
=0Ω; V
L
(Typ.))
=13.5V; T
bat
jstart
=150°C;
Electrostatic discharge
(human body model: R = 1.5 KΩ; C=100pF)
– Input
– Current sense
–CS_DIS
–Output
–V
CC
Charge device model (CDM-AEC-Q100-011)750V
104mJ
4000
2000
4000
5000
5000
V
V
V
V
V
T
T
stg
Junction operating temperature-40 to 150°C
j
Storage temperature-55 to 150 °C
2.2 Thermal data
Table 4.Thermal data
SymbolParameterTypical valueUnit
R
th j-pcb
R
thj-amb
1. The measure is done in accordance with the JESD 51-8.
Thermal resistance junction-pcb (with one channel
(1)
ON)
Thermal resistance junction-ambient See Figure 36°C/W
2.3 Electrical characteristics
Values specified in this section are for 8 V<VCC<28V; -40°C<Tj<150 °C, unless otherwise
stated.
Table 5.Power section
SymbolParameterTest conditionsMin. Typ. Max. Unit
20°C/W
V
V
V
USDhyst
R
V
clamp
Operating supply voltage4.51328V
CC
Undervoltage shutdown3.54.5V
USD
Undervoltage shutdown
hysteresis
I
=2A; Tj=25°C50
OUT
On-state resistance
ON
(1)
=2A; Tj= 150°C100
OUT
I
=2A; VCC=5V; Tj= 25°C65
OUT
Clamp voltageIS=20mA414652V
8/37Doc ID 022473 Rev 4
0.5V
mΩI
Page 9
VND5E050ASO-EElectrical specifications
Table 5.Power section (continued)
SymbolParameterTest conditionsMin. Typ. Max. Unit
Off-state; V
V
I
S
Supply current
IN=VOUT=VSENSE=VCSD
On-state; V
I
=0A
OUT
VIN=V
=25°C
T
I
L(off1)
1. For each channel.
2. PowerMOS leakage included.
Table 6.Switching (VCC=13V; Tj= 25°C)
Off-state output current
(1)
Output - VCC diode
V
F
voltage
(1)
j
VIN=V
=125°C
T
j
-I
=4A; Tj= 150°C0.7V
OUT
=13V; Tj= 25°C;
CC
=13V; VIN=5V;
CC
=0V; VCC=13V;
OUT
=0V; VCC=13V;
OUT
=0V
(2)5(2)
2
36mA
00.013
05
SymbolParameterTest conditionsMin.Typ.Max. Unit
Turn-on delay time RL=6.5Ω (see Figure 6)—20— µs
Turn-off delay time RL=6.5Ω (see Figure 6)—45— µs
/dt
Turn-on voltage slopeRL=6.5Ω —
(on)
/dt
Turn-off voltage slopeRL=6.5Ω —
(off)
Switching energy
losses during t
won
Switching energy
losses during t
woff
RL=6.5Ω (see Figure 6)— 0.15 — mJ
RL=6.5Ω (see Figure 6)—0.3— mJ
See
Figure 26
See
Figure 28
—V/µs
—V/µs
dV
dV
t
d(on)
t
d(off)
OUT
OUT
W
W
ON
OFF
µA
µA
Table 7.Logic inputs
SymbolParameterTest conditionsMin. Typ. Max. Unit
V
V
V
I(hyst)
V
V
CSDL
I
CSDL
V
CSDH
I
I
IH
ICL
Input low level voltage0.9V
IL
Low level input currentVIN=0.9V1µA
IL
Input high level voltage2.1V
IH
High level input currentVIN=2.1V10µA
Input hysteresis voltage0.25V
I
=1mA5.57
Input clamp voltage
IN
IIN=-1mA-0.7
CS_DIS low level voltage0.9V
Low level CS_DIS currentV
=0.9V1µA
CSD
CS_DIS high level voltage2.1V
Doc ID 022473 Rev 49/37
V
Page 10
Electrical specificationsVND5E050ASO-E
Table 7.Logic inputs (continued)
SymbolParameterTest conditionsMin. Typ. Max. Unit
I
CSDH
V
CSD(hyst)
V
CSCL
Table 8.Protections and diagnostics
High level CS_DIS currentV
=2.1V10µA
CSD
CS_DIS hysteresis voltage0.25V
I
=1mA5.57
CS_DIS clamp voltage
CSD
I
=-1mA-0.7
CSD
(1)
SymbolParameterTest conditionsMin.Typ.Max.Unit
V
= 13 V192738A
I
limH
I
limL
T
TSD
T
T
T
HYST
V
DEMAG
RS
DC short circuit current
Short circuit current
during thermal cycling
Shutdown temperature150175200°C
Reset temperatureTRS+1TRS+5°C
R
Thermal reset of status135°C
Thermal hysteresis
TSD -TR
)
(T
Turn-off output voltage
clamp
CC
5V < V
<28V38A
CC
VCC=13V;
T
R<Tj<TTSD
I
=2A; VIN=0;
OUT
L=6mH
7A
7°C
-41 VCC-46 VCC-52V
V
CC
V
I
=0.1A;
V
ON
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles.
T able 9.Current sense (8 V < VCC<18V)
Output voltage drop
limitation
OUT
T
= -40°C...+150°C
j
(see Figure 8)
25mV
SymbolParameterTest conditionsMin. Typ. Max. Unit
I
dK
K
0
K
1
1/K1
K
2
I
OUT/ISENSE
I
OUT/ISENSE
Current sense ratio
(1)
drift
I
OUT/ISENSE
= 0.05 A; V
OUT
=0V; Tj= -40°C...150°C
V
CSD
I
=1A; V
OUT
V
CSD
= -40°C...150°C
T
j
SENSE
=0V;
Tj= 25°C...150°C
I
=1A; V
OUT
V
CSD
SENSE
=0V;
TJ= -40 °C to 150 °C
I
=2A; V
OUT
V
CSD
T
= -40°C...150°C
j
= 25°C...150°C
T
j
SENSE
=0V;
SENSE
=4V;
=4V;
=4V;
=0.5V;
1440 2250 3630
1740
2070
2820
1750
2070
2562
-1515%
1900
2000
2395
1899
2000
2282
10/37Doc ID 022473 Rev 4
Page 11
VND5E050ASO-EElectrical specifications
T able 9.Current sense (8 V < VCC< 18 V) (continued)
SymbolParameterTest conditionsMin. Typ. Max. Unit
I
dK
2/K2
K
dK
3/K3
I
SENSE0
I
OL
Current sense ratio
(1)
drift
I
3
OUT/ISENSE
Current sense ratio
(1)
drift
Analog sense leakage
current
Open load on-state
current detection
threshold
=2 A; V
OUT
=0V;
V
CSD
TJ= -40 °C to 150 °C
I
=4A;
OUT
V
T
T
I
V
=4V;V
SENSE
= -40°C...150°C
j
= 25°C...150°C
j
=4 A; V
OUT
=0V;
CSD
TJ= -40 °C to 150 °C
I
=0A; V
OUT
V
=5V; VIN=0V;
CSD
= -40°C...150°C
T
j
I
=0A; V
OUT
=0V; VIN=5V;
V
CSD
T
= -40°C...150°C
j
=2A; V
I
OUT
=5V; VIN=5V;
V
CSD
T
= -40°C...150°C
j
V
=5V; 8V<VCC<18V;
IN
I
=5µA
SENSE
SENSE
CSD
SENSE
SENSE
SENSE
SENSE
=4 V;
=0V;
=4 V;
=0V;
=0V;
=0V;
-99%
1969
1990
2210
1950
1990
2153
-66%
01
02
µA
01
420mA
V
SENSE
V
SENSEH
I
SENSEH
t
DSENSE1H
t
DSENSE1L
t
DSENSE2H
Max analog sense
output voltage
Analog sense output
voltage in fault
condition
(2)
Analog sense output
current in fault
condition
(2)
Delay response time
from falling edge of
CS_DIS pin
Delay response time
from rising edge of
CS_DIS pin
Delay response time
from rising edge of
INPUT pin
=4A; V
I
OUT
VCC=13V; R
VCC=13V; V
SENSE
SENSE
<4V; 0.5A<I
= 90% of I
V
I
(see Figure 4)
SENSE
SENSE
<4V; 0.5A<I
= 10% of I
V
I
(see Figure 4)
V
I
SENSE
SENSE
<4V; 0.5A<I
= 90% of I
(see Figure 4)
=0V5V
CSD
=3.9KΩ8V
SENSE
=5V9mA
SENSE
<4A;
OUT
SENSEMAX
OUT
SENSEMAX
OUT
SENSEMAX
<4A;
<4A;
40100µs
520µs
80250µs
Doc ID 022473 Rev 411/37
Page 12
Electrical specificationsVND5E050ASO-E
T able 9.Current sense (8 V < VCC< 18 V) (continued)
SymbolParameterTest conditionsMin. Typ. Max. Unit
Delay response time
between rising edge of
Δt
DSENSE2H
output current and
rising edge of current
sense
Delay response time
t
DSENSE2L
from falling edge of
INPUT pin
1. Parameter guaranteed by design; it is not tested.
2. Fault condition includes: power limitation, overtemperature and open-load off-state detection.
Table 10.Open load detection (8 V < VCC<18V)
V
I
I
I
V
I
(see Figure 4)
SENSE
SENSE
= 90% of I
OUT
OUTMAX
SENSE
SENSE
= 90% of I
=10% of I
<4V;
SENSEMAX,
OUTMAX
=2A (see Figure 7)
<4V; 0.5A<I
OUT
SENSEMAX
40µs
<4A;
80250µs
SymbolParameterTest conditionsMin.Typ.Max. Unit
Open load off-state
V
OL
voltage detection
=0V2
V
IN
threshold
See
Figure 5
4V
Output short circuit to
t
DSTKON
detection delay at
V
CC
See Figure 51801200 µs
turn-off
I
L(off2)r
I
L(off2)f
Off-state output current
OUT
=4V
at V
Off-state output current
at V
OUT
=2V
V
=0V; V
V
V
V
IN
OUT
IN
OUT
SENSE
rising from 0 V to 4 V
=0V; V
SENSE=VSENSEH
falling from VCC to 2 V
=0V;
-1200µA
;
-5090µA
Delay response from
td_vol
output rising edge to
V
SENSE
rising edge in
=4 V; VIN=0V;
V
OUT
V
SENSE
= 90% of V
SENSEH
20µs
open load
Figure 4.Current sense delay characteristics
INPUT
CS_DIS
LOAD CURRENT
SENSE CURRENT
t
DSENSE2H
12/37Doc ID 022473 Rev 4
t
DSENSE1L
t
DSENSE1H
t
DSENSE2L
Page 13
VND5E050ASO-EElectrical specifications
Figure 5.Open-load off-state delay timing
OUTPUT STUCK TO V
V
IN
V
CS
Figure 6.Switching characteristics
V
OUT
dV
OUT
INPUT
/dt
(on)
t
d(on)
t
Won
80%
t
r
10%
t
d(off)
CC
V
t
DSTKON
t
Woff
90%
t
f
OUT
V
SENSEH
> V
dV
OL
OUT
/dt
(off)
t
t
Doc ID 022473 Rev 413/37
Page 14
Electrical specificationsVND5E050ASO-E
Figure 7.Delay response time between rising edge of output current and rising
edge of current sense (CS enabled)
V
IN
Δ
t
DSENSE2H
t
I
OUT
I
SENSE
90% I
OUTMAX
I
OUTMAX
I
SENSEMAX
t
90% I
Figure 8.Output voltage drop limitation
Vcc-V
out
Tj=150oC
V
on
Von/R
on(T)
SENSEMAX
=25oC
T
j
T
=-40oC
j
t
I
out
14/37Doc ID 022473 Rev 4
Page 15
VND5E050ASO-EElectrical specifications
Figure 9.I
I
/ I
out
sense
3000
2800
2600
2400
max Tj = 25 °C to 15 0 ° C
2200
2000
1800
1600
1400
1200
11,522,533,54
OUT/ISENSE
max Tj = -40 °C to 150 °C
min Tj = 25 °C to 150 °C
min Tj = -40 °C to 150 °C
vs I
OUT
typical value
I
(A)
OUT
Figure 10. Maximum current sense ratio drift vs load current
dk/k(%)
20
15
10
5
0
-5
-10
-15
-20
1234
I
OUT
Note:Parameter guaranteed by design; it is not tested.
(A)
Doc ID 022473 Rev 415/37
Page 16
Electrical specificationsVND5E050ASO-E
Table 11.Truth table
ConditionsInputOutputSense (V
Normal operation
CSD
L
H
L
H
0
Nominal
=0V)
(1)
Overtemperature
Undervoltage
Overload
Short circuit to GND
(power limitation)
Open load off-state
(with external pull-up)
Short circuit to V
CC
(external pull-up
disconnected)
Negative output voltage
clamp
1. If the V
and external circuit.
is high, the SENSE output is at a high impedance, its potential depends on leakage currents
CSD
L
H
L
H
H
L
L
L
L
X
0
V
SENSEH
0
0
Nominal
(no power limitation)
H
Cycling
V
SENSEH
(power limitation)
L
H
LHV
L
H
L
L
H
H
0
V
SENSEH
SENSEH
V
SENSEH
< Nominal
LL0
16/37Doc ID 022473 Rev 4
Page 17
VND5E050ASO-EElectrical specifications
T able 12.Electrical transient requirements (part 1)
ISO 7637-2:
2004(E)
test pulse
Test levels
(1)
Number of
pulses or
IIIIVMin.Max.
test times
Burst cycle/pulse
repetition time
1-75V-100V5000 pulses0.5s5s2 ms, 10Ω
2a+37V+50V5000 pulses0.2s5s50µs, 2Ω
3a-100V-150V1h90ms100ms0.1µs, 50Ω
3b+75V+100V1h90ms100ms0.1µs, 50Ω
4-6V-7V1 pulse100ms, 0.01Ω
(2)
5b
1. The above test levels must be considered referred to VCC= 13.5V except for pulse 5b.
2. Valid in case of external load dump clamp: 40V maximum referred to ground.
T able 13.Electrical transient requirements (part 2)
ISO 7637-2:
+65V+87V1 pulse400ms, 2Ω
T est leve l results
2004E
test pulse
IIIVI
1CC
2aCC
3aCC
3bCC
Delays and
Impedance
4CC
(1)
5b
1. Valid in case of external load dump clamp: 40V maximum referred to ground.
T able 14.Electrical transient requirements (part 3)
CC
ClassContents
CAll functions of the device performed as designed after exposure to disturbance.
One or more functions of the device did not perform as designed after exposure to
E
disturbance and cannot be returned to proper operation without replacing the
device.
Doc ID 022473 Rev 417/37
Page 18
Electrical specificationsVND5E050ASO-E
2.4 Waveforms
Figure 11. Normal operation
Normal operation
INPUT
Nominal loadNominal load
I
OUT
V
SENSE
V
CS_DIS
Figure 12. Overload or short to GND
Overload or Short to GND
INPUT
I
>
LimH
I
OUT
V
SENSE
V
CS_DIS
Power Limitation
I
LimL
Thermal cycling
>
18/37Doc ID 022473 Rev 4
Page 19
VND5E050ASO-EElectrical specifications
Figure 13. Intermittent overload
Intermittent Overload
INPUT
Overload
I
>
LimH
I
>
LimL
I
OUT
V
>
SENSEH
V
SENSE
V
CS_DIS
Figure 14. Off-state open-load with external circuitry
OFF-State Open Load
with external circuitry
Nominal load
INPUT
V
OUT
I
OUT
V
SENSE
V
CS_DIS
V
> V
OUT
OL
V
OL
t
DSTK(on)
V
SENSEH
>
Doc ID 022473 Rev 419/37
Page 20
Electrical specificationsVND5E050ASO-E
Figure 15. Short to V
V
OUT
I
OUT
V
CS_DIS
CC
Resistive
Short to V
V
OL
t
DSTK(on)
CC
Short to V
CC
Hard
Short to V
V
> V
OUT
t
DSTK(on)
CC
OL
Figure 16. TJ evolution in overload or short to GND
TJ evolution in
Overload or Short to GND
INPUT
I
OUT
T
J
Self-limitation of fast thermal transients
T
J_START
Power Limitation
I
>
LimH
T
T
TSD
R
< I
T
HYST
LimL
20/37Doc ID 022473 Rev 4
Page 21
VND5E050ASO-EElectrical specifications
2.5 Electrical characteristics curves
Figure 17. Off-state output currentFigure 18. High level input current
Figure 21. Input high levelFigure 22. Input hysteresis voltage
Vih (V)
4
3,5
3
2,5
2
1,5
1
0,5
0
-50 -250255075 100 125 150 175
Tc (°C)
Vihyst (V)
1
0,9
0,8
0,7
0,6
0,5
0,4
0,3
0,2
0,1
0
-50 -250255075 100 125 150 175
Tc (°C)
Doc ID 022473 Rev 421/37
Page 22
Electrical specificationsVND5E050ASO-E
Figure 23. On-state resistance vs T
Ron (mOhm)
300
250
200
150
100
50
Iout= 2A
Vcc=13V
0
-50 -250255075 100 125 150 175
Tc (°C)
case
Figure 24. On-state resistance vs V
Ron (mOhm)
100
80
60
40
20
0
0510152025303540
Vcc (V)
Figure 25. Undervoltage shutdownFigure 26. Turn-on voltage slope
Vusd (V)
16
14
12
10
8
6
4
2
0
-50 -250255075 100 125 150 175
Figure 27. I
Ilimh (A)
40
35
30
25
20
15
10
-50 -250255075 100 125 150 175
LIMH
Vcc=13V
vs T
Tc (°C)
case
Tc (°C)
(dVout/dt )On (V/ms)
1000
900
800
700
600
500
400
300
200
100
0
-50 -250255075 100 125 150 175
Vcc=13V
RI=6.5 Ohm
Tc (°C)
Figure 28. Turn-off voltage slope
(dVout/dt )Off (V/m s)
600
550
500
450
400
350
300
250
200
150
100
50
0
-50 -250255075 100 125 150 175
Vcc=13V
RI= 6.5 Ohm
Tc (°C)
CC
Tc=150°C
Tc=125°C
Tc=25°C
Tc=-40°C
22/37Doc ID 022473 Rev 4
Page 23
VND5E050ASO-EElectrical specifications
Figure 29. CS_DIS high level voltageFigure 30. CS_DIS clamp voltage
Vcsdh (V)
4
3,5
3
2,5
2
1,5
1
0,5
0
-50 -250255075 100 125 150 175
Tc (°C)
Vcsdcl(V)
10
9
8
7
6
5
4
3
2
1
0
-50 -250255075 100 125 150 175
Icsd = 1 mA
Tc (°C)
Figure 31. CS_DIS low level voltage
Vcsdl (V)
3
2,5
2
1,5
1
0,5
0
-50 -250255075 100 125 150 175
Tc (°C)
Doc ID 022473 Rev 423/37
Page 24
Application informationVND5E050ASO-E
3 Application information
Figure 32. Application schematic
+5V
V
CC
R
prot
Μ
CU
R
prot
R
prot
R
SENSE
C
EXT
CS_DIS
INPUT
CURRENT SENSE
D
ld
OUTPUT
GND
R
GND
GND
D
GND
V
Note:Channel 2 has the same internal circuit as channel 1.
3.1 GND protection network against reverse battery
This section provides two solutions to implement a ground protection network against
reverse battery.
3.1.1 Solution 1: resistor in the ground line (R
This can be used with any type of load.
The following description shows an indication on how to size the R
1.R
2. R
where -I
maximum rating section of the device datasheet.
Power dissipation in R
P
=(-VCC)2/R
D
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where I
maximum on-state currents of the different devices.
≤ 600mV / (I
GND
≥ (−VCC) / (-I
GND
is the DC reverse ground pin current and can be found in the absolute
GND
GND
S(on)max
GND
GND
)
)
(when VCC< 0: during reverse battery situations) is:
GND
only)
S(on)max
GND
becomes the sum of the
resistor.
Please note that if the microprocessor ground is not shared by the device ground then the
R
produces a shift (I
GND
S(on)max
* R
) in the input thresholds and the status output
GND
values. This shift varies depending on how many devices are on in case of several high-side
drivers sharing the same R
24/37Doc ID 022473 Rev 4
GND
.
Page 25
VND5E050ASO-EApplication information
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize Section 3.1.2: Solution 2: diode (DGND) in the
ground line.
3.1.2 Solution 2: diode (D
A resistor (R
=1kΩ) should be inserted in parallel to D
GND
) in the ground line
GND
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network will produce a shift (≈600 mV) in the input
threshold and in the status output values if the microprocessor ground is not common to the
device ground. This shift does not vary if more than one HSD share the same diode/resistor
network.
3.2 Load dump protection
Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the
V
maximum DC rating. The same applies if the device is subject to transients on the VCC
CC
line which are greater than the ones shown in the ISO 7637-2: 2004(E) table.
3.3 MCU I/Os protection
If a ground protection network is used and negative transient are present on the VCC line,
the control pins are pulled negative. ST suggests to insert a resistor (R
the microcontroller I/O pins from latching-up.
The value of these resistors is a compromise between the leakage current of microcontroller
and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of
microcontroller I/Os:
if the device drives an
GND
) in line to prevent
prot
-V
CCpeak/Ilatchup
≤ R
prot
≤ (V
OHμC-VIH-VGND
Calculation example:
For V
CCpeak
5kΩ ≤ R
Recommended values: R
= - 100V and I
≤ 180kΩ
prot
latchup
=10kΩ, C
prot
≥ 20mA; V
EXT
3.4 Current sense and diagnostic
The current sense pin performs a double function (see Figure 33: Current sense and
diagnostic):
●Current mirror of the load current in normal operation, delivering a current
proportional to the load current according to a known ratio K
The current I
external resistor R
minimum (see parameter V
can be easily converted to a voltage V
SENSE
. Linearity between I
SENSE
Doc ID 022473 Rev 425/37
in Table 9: Current sense (8 V < VCC<18V)). The
SENSE
) / I
IHmax
≥ 4.5V
OHµC
= 10nF.
OUT
and V
.
X
by means of an
SENSE
is ensured up to 5V
SENSE
Page 26
Application informationVND5E050ASO-E
current sense accuracy depends on the output current (refer to current sense electrical
characteristics Table 9: Current sense (8 V < V
●Diagnostic flag in fault conditions, delivering a fixed voltage V
maximum current I
SENSEH
in case of the following fault conditions (refer to
<18V)).
CC
SENSEH
up to a
Table 11: Truth table):
–Power limitation activation
–Overtemperature
–Short to V
in off-state
CC
–Open-load in off-state with additional external components.
A logic level high on the CS_DIS pin simultaneously sets all the current sense pins of the
device in a high impedance state, thus disabling the current monitoring and diagnostic
detection. This feature allows multiplexing of the microcontroller analog inputs by sharing
the sense resistance and ADC line among different devices.
Figure 33. Current sense and diagnostic
V
V
BAT
V
CC
PU
Main MOSn
+
-
INPUTn
GND
CS_DIS
To uC ADC
I
OUT/KX
R
PROT
R
SENSE
41V
I
SENSEH
CURRENT
SENSEn
V
SENSE
V
SENSEH
Overtemperature
OL OFF
Pwr_Lim
3.4.1 Short to VCC and off-state open-load detection
Short to V
A short circuit between V
V
SENSEH
during the on-state depending on the nature of the short circuit.
CC
and output is indicated by the relevant current sense pin set to
CC
during the device off-state. Little or no current is delivered by the current sense
PU_CMD
R
PU
V
OL
OUTn
I
Loff2r
I
Loff2f
Load
R
PD
Off-state open load with external circuitry
Detection of an open-load in off mode requires an external pull-up resistor (R
the output to a positive supply voltage (V
26/37Doc ID 022473 Rev 4
PU
).
) connecting
PU
Page 27
VND5E050ASO-EApplication information
It is preferable that VPU is switched off during the module standby mode to avoid an increase
in overall standby current consumption in normal conditions, that is, when the load is
connected.
An external pull-down resistor (R
) connected between output and GND is mandatory to
PD
avoid misdetection in case of floating outputs in off-state (see Figure 33: Current sense and
diagnostic).
R
must be selected in order to ensure V
PD
OUT < VOLmin
unless pulled up by the external
circuitry:
VVIRV
2
=<⋅=
OLfoffLPD
min)2(
R
≤ 22 KΩ is recommended.
PD
OUT
OFFupPull
_
−
For proper open load detection in off-state, the external pull-up resistor must be selected
according to the following formula:
IRRVR
V
OUT
For the values of V
(8 V < V
CC
<18V).
−
OLmin,VOLmax, IL(off2)r
=
ONupPull
_
and I
⋅⋅−⋅
RR
+
PDPU
see Table 10: Open load detection
L(off2)f
roffLPDPUPUPD
)2(
OL
max
VV
4
=>
Doc ID 022473 Rev 427/37
Page 28
Application informationVND5E050ASO-E
3.5 Maximum demagnetization energy (VCC = 13.5V)
Figure 34. Maximum turn-off current versus inductance (for each channel)
100
A
B
C
10
I (A)
1
0,1110100L (mH)
A: T
B: T
C: T
, I
V
IN
= 150°C single pulse
jstart
= 100°C repetitive pulse
jstart
= 125°C repetitive pulse
jstart
L
DemagnetizationDemagnetizationDemagnetization
Note:Values are generated with R
each demagnetization) of every pulse must not exceed the temperature specified above for
curves A and B.
=0 Ω.In case of repetitive pulses, T
L
(at the beginning of
jstart
t
28/37Doc ID 022473 Rev 4
Page 29
VND5E050ASO-EPackage and PCB thermal data
4 Package and PCB thermal data
4.1 SO-16L thermal data
Figure 35. SO-16L PC board
("1($'5
Note:Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4
area = 77 mm x 86 mm, PCB thickness = 1.6 mm, Cu thickness = 70 µm (front and back
side), Copper areas: from minimum pad lay-out to 8 cm2).
Figure 36. R
vs PCB copper area in open box free air condition
thj-amb
57+MDPE
57+MDPE
'!0'2)
Doc ID 022473 Rev 429/37
Page 30
Package and PCB thermal dataVND5E050ASO-E
Figure 37. SO-16L thermal impedance junction ambient single pulse
=7+ & :
&X FP
&X FP
&X IRRWSULQW
7LPHV
'!0'2)
Equation 1: pulse calculation formula
Z
THδ
where δ =t
R
P
TH
/T
δZ
THtp
1 δ–()+⋅=
Figure 38. Thermal fitting model of a single channel HSD in SO-16L
(a)
'!0'2)
a. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
30/37Doc ID 022473 Rev 4
Page 31
VND5E050ASO-EPackage and PCB thermal data
Table 15.Thermal parameter
Area/island (cm2)Footprint28
R1 (°C/W)0.7
R2 (°C/W)2.1
R3 (°C/W)4
R4 (°C/W)866
R5 (°C/W)141313
R6 (°C/W)282014.5
R7 (°C/W)0.7
R8 (°C/W)2.1
C1 (W.s/°C)0.001
C2 (W.s/°C)0.005
C3 (W.s/°C)0.1
C4 (W.s/°C)0.5
C5 (W.s/°C)11.51.5
C6 (W.s/°C)3912
C7 (W.s/°C)0.001
C8 (W.s/°C)0.005
Doc ID 022473 Rev 431/37
Page 32
Package informationVND5E050ASO-E
5 Package information
5.1 ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
5.2 Package mechanical data
Figure 39. SO-16L package dimensions
.
32/37Doc ID 022473 Rev 4
("1($'5
Page 33
VND5E050ASO-EPackage information
T able 16.SO-16L mechanical data
Millimeters
Symbol
MinTypMax
A2.352.65
A10.100.30
B0.330.51
C0.230.32
D10.1010.50
E7.407.60
e1.27
H10.0010.65
h0.250.75
L0.401.27
k0°8°
ddd0.10
Doc ID 022473 Rev 433/37
Page 34
Package informationVND5E050ASO-E
5.3 Packing information
Figure 40. SO-16L tube shipment (no suffix)
"ASE1TY
K1T Y
"UL
#
"
4UBELE NGTH
!
"
#
!
!LLDIMENSIONSAREINMM
Figure 41. SO-16L tape and reel shipment (suffix “TR”)
("1($'5
34/37Doc ID 022473 Rev 4
Page 35
VND5E050ASO-EOrder codes
6 Order codes
T a ble 17.Device summary
Order codes
Package
TubeTape and reel
SO-16L VND5E050ASO-EVND5E050ASOTR-E
Doc ID 022473 Rev 435/37
Page 36
Revision historyVND5E050ASO-E
7 Revision history
Table 18.Document revision history
DateRevisionChanges
10-Nov-20111Initial release.
19-Dec-20112Updated Figure 2.
15-Mar-20123
26-June-20124Update Table 4.
Added Section 4: Package and PCB thermal data and update
Ta b l e 5 .
36/37Doc ID 022473 Rev 4
Page 37
VND5E050ASO-E
U
D
W
D
W
S
O
U
T
R
G
A
Y,
D
E
G
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
NLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIE
ARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIE
ARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAW
F ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
NLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NO
ECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAININ
PPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAI LURE OR MALFUNCTION MAY RESULT IN PERSONAL INJUR
EATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIV
RADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.