Datasheet VND5E025BK-E Datasheet (ST)

Page 1
Features
VND5E025BK-E
Double channel high-side driver with analog current sense
for automotive applications
Max transient supply voltage V
Operating voltage range V
Max on-state resistance (per ch.) R
Current limitation (typ) I
Off-state supply current I
1. Typical value with all loads connected.
■ General
CC
CC
ON
LIMH
S
4.5 to 28 V
25 mΩ
2µA
– Inrush current active management by
■ Diagnostic functions
– High current sense precision for wide
currents range – Current sense ratio drift for single point
calibration – Current sense disable – Overload and short to ground (power
limitation) indication – Thermal shutdown indication
■ Protections
– Undervoltage shutdown – Overvoltage clamp – Load current limitation – Self limiting of fast thermal transients – Protection against loss of ground and loss
of V
CC
– Overtemperature shutdown with auto
restart (thermal shutdown) – Reverse battery protected – Electrostatic discharge protection
Applications
41 V
60 A
(1)
Powe rSS O-24
■ All types of resistive, inductive and capacitive
loads and suitable as LED driver
Description
The VND5E025BK-E is a double channel high­side driver manufactured in the ST proprietary VIPower™ M0-5 technology and housed in the tiny PowerSSO-24 package. The VND5E025BK-E is designed to drive 12V automotive grounded loads delivering protection, diagnostics and easy 3V and 5V CMOS compatible interface with any microcontroller.
The device integrates advanced protective functions such as load current limitation, inrush and overload active management by power limitation, overtemperature shut-off with auto restart and overvoltage active clamp.
A dedicated analog current sense pin is associated with every output channel in order to provide Enhanced diagnostic functions including fast detection of overload and short circuit to ground through power limitation indication and overtemperature indication.
An improved current sense circuitry and the introduction of a new current sense ratio drift, dK/K(tot), allow the "single-point" calibration and ensure a very high accuracy in case of "double­point" calibration.
The current sensing and diagnostic feedback of the whole device can be disabled by pulling the CS_DIS pin high to allow sharing of the external sense resistor with other similar devices.
■ Especially intended for blinkers
October 2010 Doc ID 16273 Rev 7 1/34
www.st.com
1
Page 2
Contents VND5E025BK-E
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.5 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 22
3.1.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 22
3.1.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 23
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.3 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.4 Current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.5 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . 25
4 Package and thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.1 PowerSSO-24 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.1 ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.2 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.3 Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
2/34 Doc ID 16273 Rev 7
Page 3
VND5E025BK-E List of tables
List of tables
Table 1. Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 5. Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 6. Switching (VCC = 13V; Tj = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 7. Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 8. Protections and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 9. Current sense (8V < VCC < 18V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 10. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 11. Electrical transient requirements (part 1/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 12. Electrical transient requirements (part 2/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 13. Electrical transient requirements (part 3/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 14. Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 15. PowerSSO-24 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 16. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 17. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Doc ID 16273 Rev 7 3/34
Page 4
List of figures VND5E025BK-E
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 5. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 6. Output voltage drop limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. Delay response time between rising edge of output current and rising edge of current sense
(CS enabled). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 8. I
Figure 9. Maximum current sense ratio drift vs load current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 10. Normal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 11. Overload or short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 12. Intermittent overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 13. T
Figure 14. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 15. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 16. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 17. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 18. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 19. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 20. On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 21. On-state resistance vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 22. Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 23. ILIMH vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 24. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 25. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 26. CS_DIS high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 27. CS_DIS low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 28. CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 29. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 30. Current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 31. Maximum turn-off current versus inductance (for each channel) . . . . . . . . . . . . . . . . . . . . 25
Figure 32. PowerSSO-24 PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 33. Rthj-amb vs PCB copper area in open box free air condition (one channel on). . . . . . . . . 26
Figure 34. PowerSSO-24 thermal impedance junction to ambient single pulse (one channel on) . . . 27
Figure 35. Thermal fitting model of a double channel HSD in PowerSSO-24 . . . . . . . . . . . . . . . . . . . 27
Figure 36. PowerSSO-24 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 37. PowerSSO-24 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 38. PowerSSO-24 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
OUT/ISENSE
evolution in overload or short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
J
vs I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
OUT
4/34 Doc ID 16273 Rev 7
Page 5
VND5E025BK-E Block diagram and pin description

1 Block diagram and pin description

Figure 1. Block diagram

V
CC
Signal Clamp
IN1
IN2
CS_ DIS
CS1
CS2
Undervoltage
Control & Diagnostic 1
DRIVER
Over
temp.
V
SENSEH
LOGIC

Table 1. Pin functions

Name Function
V
CC
Battery connection.
Limitation
Current
Limitation
Current
Sense
OVERLOAD PROTECTION
(ACTIVE POWER LIMITATION)
Power Clamp
V
ON
CH 1
GND
CONTROL & DIAGNOSTIC
Channels 2
CH 2
OUT2
OUT1
OUTPUT
1,2
GND
INPUT
1,2
CURRENT SENSE
Power outp ut.
Ground connection. Must be reverse battery protected by an external diode / resistor network.
Voltage controlled input pin with hysteresis, CMOS compatible. Controls output switch state.
Analog current sense pin; delivers a current proportional to the load
1,2
current.
CS_DIS Active high CMOS compatible pin to disable the current sense pin.
Doc ID 16273 Rev 7 5/34
Page 6
Block diagram and pin description VND5E025BK-E

Figure 2. Configuration diagram (top view)

V
CC
GND
N.C.
INPUT2
N.C.
INPUT1
N.C.
CURRENT SENSE1
N.C.
CURRENT SENSE2
CS_DIS.
V
CC
1 2 3 4 5 6 7 8 9 10 11 12
24 23 22 21 20 19 18 17 16 15 14 13
OUTPUT2 OUTPUT2 OUTPUT2 OUTPUT2 OUTPUT2 OUTPUT2 OUTPUT1 OUTPUT1 OUTPUT1 OUTPUT1 OUTPUT1 OUTPUT1
TAB = V
CC

Table 2. Suggested connections for unused and not connected pins

Connection / pin Current sense N.C. Output Input CS_DIS
Floating Not allowed X X X X
To ground
Through 1 kΩ
resistor
Through 22 kΩ
X
resistor
Through 10 kΩ
resistor
Through 10 kΩ
resistor
6/34 Doc ID 16273 Rev 7
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VND5E025BK-E Electrical specification

2 Electrical specification

Figure 3. Current and voltage conventions

I
S
V
Note: V
Fn
I
CSD
V
CSD
V
IN1
V
= V
- VCC during reverse battery condition.
OUTn
IN2
I
I
IN1
IN2
CS_DIS
INPUT1
INPUT2
GND
CC
OUTPUT1
CURRENT SENSE1
OUTPUT2
CURRENT SENSE2
I
GND
I
OUT1
I
SENSE1
I
OUT2
I
SENSE2
V
V
SENSE2
OUT2
V
SENSE1
V
Fn
V
OUT1
V
CC

2.1 Absolute maximum ratings

Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to the conditions in table below for extended
periods may affect device reliability. Refer also to the STMicroelectronics SURE Program
and other relevant quality document.

Table 3. Absolute maximum ratings

Symbol Parameter Value Unit
V
-V
-I
GND
I
OUT
- I
OUT
I
CSD
-I
CSENSE
V
CSENSE
DC supply voltage 41
CC
Reverse DC supply voltage 0.3
CC
DC reverse ground pin current 200 mA
DC output current Internally limited
Reverse DC output current 24
DC input current
IN
DC current sense disable input current
DC reverse CS pin current 200
Current sense maximum voltage VCC- 41 to +V
-1 to 10
CC
V
A
mAI
V
Doc ID 16273 Rev 7 7/34
Page 8
Electrical specification VND5E025BK-E
Table 3. Absolute maximum ratings (continued)
Symbol Parameter Value Unit
Maximum switching energy (single pulse)
E
MAX
(L = 0.8 mH; R
= I
I
OUT
limL
(Typ.))
=0Ω; V
L
= 13.5 V; T
bat
jstart
= 150 °C;
140 mJ
Electrostatic discharge (Human Body Model: R = 1.5 kΩ; C = 100 pF)
4000 2000 4000 5000 5000
V V V V V
°C
V
V
ESD
ESD
T
T
– Input – Current sense –CS_DIS – Output –V
CC
Charge device model (CDM-AEC-Q100-011) 750 V
Junction operating temperature - 40 to 150
j
Storage temperature - 55 to 150
stg

2.2 Thermal data

Table 4. Thermal data

Symbol Parameter Max. value Unit
R
thj-case
R
thj-amb
Thermal resistance junction-case (with one channel on) 1.35
°C/W
Thermal resistance junction-ambient See Figure 33
8/34 Doc ID 16273 Rev 7
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VND5E025BK-E Electrical specification

2.3 Electrical characteristics

Values specified in this section are for 8V<VCC<28V; -40°C<Tj<150°C, unless otherwise
stated.

Table 5. Power section

Symbol Parameter Test conditions Min. Typ. Max. Unit
V
V
USDhyst
R
V
clamp
I
L(off1)
1. For each channel.
2. PowerMOS leakage included.
Operating supply
CC
voltage
Undervoltage shutdown 3.5 4.5
USD
Undervoltage shutdown hysteresis
On-state resistance
ON
Clamp voltage IS= 20 mA 41 46 52 V
Supply current
I
S
Off-state output current
Output - VCC diode
V
F
voltage
(1)
(1)
I
=3A; Tj= 25°C 25
OUT
(1)
=3A; Tj= 150°C 50
OUT
=3A; VCC=5V; Tj= 25°C 35
I
OUT
Off-state; VCC=13V; Tj=25°C; V
IN=VOUT=VSENSE=VCSD
Off-state; VCC=13V; Tj=125°C; V
IN=VOUT=VSENSE=VCSD
On-state; V
=0A
I
OUT
VIN=V
=13V; VIN=5V;
CC
=0V; VCC=13V;
OUT
Tj= 25°C
V
IN=VOUT
=0V; VCC=13V;
Tj= 125°C
-I
=4 A; Tj=150°C 0.7 V
OUT
=0V
=0V
4.5 13 28
VV
0.5
mΩI
(2)
2
(2)
5
µA
9
µA
36mA
00.013
µA
05
Table 6. Switching (VCC=13V; Tj= 25°C)
Symbol Parameter Test conditions Min. Typ. Max. Unit
t
d(on)
t
d(off)
/dt)onTurn-on voltage slope
(dV
OUT
/dt)
(dV
OUT
W
ON
W
OFF
Turn-on delay time
Turn-off delay time - 30 -
Turn-off voltage slope -
off
Switching energy losses during t
Switching energy losses during t
=4.3 Ω
R
L
(see Figure 5)
=4.3 Ω
R
L
ON
W
RL=4.3 Ω (see Figure 5)
OFF
W
-20-
-
See
Figure 24
See
Figure 25
-
-
-0.6-
-0.35-
Doc ID 16273 Rev 7 9/34
µs
V/µs
mJ
Page 10
Electrical specification VND5E025BK-E

Table 7. Logic inputs

Symbol Parameter Test conditions Min. Typ. Max. Unit
V
IL
I
IL
V
IH
I
IH
V
I(hyst)
ICL
V
CSDL
I
CSDL
V
CSDH
I
CSDH
V
CSD(hyst)
V
CSCL

Table 8. Protections and diagnostics

Input low level voltage 0.9 V
Low level input current VIN=0.9V 1 µA
Input high level voltage 2.1 V
High level input current VIN=2.1V 10 µA
Input hysteresis voltage 0.25
I
=1mA 5.5 7
Input clamp voltage
IN
I
= -1mA -0.7
IN
CS_DIS low level voltage 0.9
Low level CS_DIS current V
=0.9V 1 µA
CSD
CS_DIS high level voltage 2.1 V
High level CS_DIS current V
=2.1V 10 µA
CSD
CS_DIS hysteresis voltage 0.25
I
=1mA 5.5 7
(1)
CSD
=-1mA -0.7
I
CSD
CS_DIS clamp voltage
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
= 13V 43 60
I
LIMH
I
LIML
T
TSD
T
T
RS
T
HYST
V
DEMAG
V
ON
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles.
DC short circuit current
Short circuit current during thermal cycling
Shutdown temperature 150 175 200
Reset temperature TRS+1 TRS+5
R
Thermal reset of STATUS 135
Thermal hysteresis (T
TSD-TR
)
Turn-Off output voltage clamp
Output voltage drop limitation
CC
5V < V
CC
< 28V
VCC= 13V; TR<Tj<T
I
OUT
TSD
=2A; VIN=0;
L=6 mH
=0.1A;
I
OUT
= -40°C to +150°C
T
j
(see Figure 6)
15
7
-41 VCC-46 VCC-52 V
V
CC
25 mV
85
VV
V
A
°C
10/34 Doc ID 16273 Rev 7
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VND5E025BK-E Electrical specification

Table 9. Current sense (8V < VCC< 18V)

Symbol Parameter Test conditions Min. Typ. Max. Unit
I
dK
dK
dK
dK
dK
K
1/K1
2/K2
3/K3
4/K4
5/K5
LED
K
1
(1)(2)
K
2
(1)(2)
K
3
(1)(2)
K4 I
(1)(2)
K
5
(1)(2)
I
OUT/ISENSE
I
OUT/ISENSE
Current sense ratio drift
I
OUT/ISENSE
Current sense ratio drift
I
OUT/ISENSE
Current sense ratio drift
OUT/ISENSE
Current sense ratio drift
I
OUT/ISENSE
Current sense ratio drift
= 0.05A; V
OUT
Tj= -40°C to 150°C
I
= 1.5 A; V
OUT
=0V;
V
CSD
= -40°C to 150°C 2460 3363 4050
T
j
= 1.5 A; V
I
OUT
=0V;
V
CSD
Tj= -40°C to 150°C
I
=2 A; V
OUT
V
CSD
= -40°C to 150°C 2550 3405 4108
T
j
=2 A; V
I
OUT
= -40°C to 150°C
T
j
I
= 2.4 A; V
OUT
V
CSD
= -40°C to 150°C 2635 3384 4117
T
j
= 2.4 A; V
I
OUT
= -40°C to 150°C
T
j
I
=3 A; V
OUT
V
CSD
= -40°C to 150°C 2752 3368 3975
T
j
=3 A; V
I
OUT
= -40°C to 150°C
T
j
I
=4 A; V
OUT
V
CSD
= -40°C to 150°C 2860 3341 3805
T
j
=4 A; V
I
OUT
SENSE
=0V;
SENSE
=0V;
SENSE
=0V;
SENSE
SENSE
=0V;
SENSE
Tj= -40°C to 150°C
SENSE
SENSE
SENSE
SENSE
SENSE
=0.5V; V
=4 V;
=4 V;
=4V;
=4V; V
=4V;
=4V; V
=4V;
=4V; V
=4V;
=4V; V
CSD
CSD
CSD
CSD
CSD
=0V;
=0V;
=0V;
=0V;
=0V;
1922 5046 9218
-9 9 %
-7 7 %
-6 +6 %
-5 5 %
-4 4 %
dK
dK/K
K
6/K6
(tot)
6
(1)(2)
I
Current sense ratio drift
Current sense ratio drift for
(1)(3)
single point calibration
OUT/ISENSE
I
=10 A; V
OUT
V
=0V;
CSD
= -40°C to 150°C 2965 3307 3570
T
j
=10 A; V
I
OUT
= -40°C to 150°C
T
j
Measurement point: I
= 25°C; VCC = 13.5V
T
j
=1.5A
I
OUT
=2.0A
I
OUT
I
=2.4A
OUT
=3.0A
I
OUT
=4.0A
I
OUT
SENSE
SENSE
=4V;
=4V; V
= 2.4 A;
OUT
CSD
=0V;
-3 3 %
-9.5
-7
-6
-7
-8
9.5 7 6 7 8
% % % % %
Doc ID 16273 Rev 7 11/34
Page 12
Electrical specification VND5E025BK-E
Table 9. Current sense (8V < VCC< 18V) (continued)
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
I
SENSE
I
OL
V
SENSE
V
SENSEH
I
SENSEH
Analog sense
0
leakage current
Openload on­state current detection threshold
Max analog sense output voltage
Analog sense output voltage in fault condition
Analog sense output current in fault condition
OUT
V
CSD
V
CSD
I
OUT
V
CSD
V
IN
I
SENSE
I
OUT
VCC= 13V; R
(4)
VCC= 13V; V
(2)
=0A; V
=5V; VIN=0V; Tj= -40°C to 150°C =0V; VIN=5V; Tj= -40°C to 150°C
=2A; V
=5V; VIN=5V; Tj= -40°C to 150°C
= 5V, 8V<VCC<18V
= 5 µA
=3 A; V
=0V;
SENSE
=0V;
SENSE
=0V 5
CSD
=3.9kΩ 8
SENSE
=5V 6 9 12 mA
SENSE
0 0
0
1
µA
2
µA
1
µA
570mA
V
t
DSENSE1H
t
DSENSE1L
t
DSENSE2H
Delay response time from falling edge of CS_DIS pin
Delay response time from rising edge of CS_DIS pin
Delay response time from rising edge of INPUT pin
V I
SENSE
SENSE
<4V, 0.5<I
= 90% of I
(see Figure 4)
V I
SENSE
SENSE
<4V, 0.5<I
= 10% of I
(see Figure 4)
V I
SENSE
SENSE
<4V, 0.5<I
= 90% of I
(see Figure 4)
<10A
OUT
SENSEMAX
<10A
OUT
SENSEMAX
<10A
OUT
SENSEMAX
30 100
520
80 300
Delay response
Δt
DSENSE2H
time between rising edge of output current and rising edge
V I
SENSE
I
OUT
SENSE
= 90% of I
<4V,
= 90% of I
(see Figure 7)
SENSEMAX,
OUTMAX
, I
OUTMAX
=3A
of current sense
Delay response
t
DSENSE2L
time from falling edge of INPUT pin
1. Parameter guaranteed by design; it is not tested.
2. Analog sense current drift (dK/K) is deviation of factor K for a given device over (-40 °C to 150 °C, Vbatt: 8 V...16 V) with respect to its value measured at Tj = 25 °C, V
3. Total current drift over -40 °C to 150 °C, Vbatt: 8 V...16 V and output current variation, respect to a calibration point measured at Tj = 25 °C and VCC=13.5V.
4. Fault condition includes: power limitation and overtemperature.
V I
SENSE
SENSE
<4V, 0.5<I
= 10% of I
(see Figure 4)
<10A
OUT
SENSEMAX
CC
520
=13V.
µs
110
12/34 Doc ID 16273 Rev 7
Page 13
VND5E025BK-E Electrical specification

Figure 4. Current sense delay characteristics

INPUT
CS_DIS
LOAD CURRENT
SENSE CURRENT
t
DSENSE2H
t
DSENSE1L

Figure 5. Switching characteristics

/dt
(on)
t
d(on)
t
Won
80%
t
r
V
OUT
dV
OUT
INPUT
10%
t
d(off)
t
Woff
90%
t
f
t
DSENSE1H
dV
OUT
/dt
(off)
t
DSENSE2L
t
t

Figure 6. Output voltage drop limitation

VCC-V
OUT
Tj=150oC
V
on
V
on/Ron(T)
Doc ID 16273 Rev 7 13/34
Tj=25oC
T
=-40oC
j
I
OUT
Page 14
Electrical specification VND5E025BK-E
Figure 7. Delay response time between rising edge of output current and rising
edge of current sense (CS enabled)
V
IN
Δ
t
DSENSE2H
t
I
OUT
I
SENSE
90% I
OUTMAX
I
OUTMAX
I
SENSEMAX
t
90% I
SENSEMAX
Figure 8. I
OUT/ISENSE
vs I
OUT
K
4200
4000
3800
3600
3400
3200
3000
2800
2600
2400
2200
1.5 2.5 3.5 4.5 5.5 6.5 7.5 8.5 9.5
Iout (A)
t
K(min)
K(max)
14/34 Doc ID 16273 Rev 7
Page 15
VND5E025BK-E Electrical specification

Figure 9. Maximum current sense ratio drift vs load current

dK/K
10%
8%
6%
4%
2%
0%
-2%
-4%
-6%
-8%
-10%
1.5 2.5 3.5 4.5 5.5 6.5 7.5 8.5 9.5
Iout (A)
Note: Parameter guaranteed by design; it is not tested.
dK/K(min)
dK/K(max)

Table 10. Truth table

Conditions Input Output Sense (V
Normal operation
Overtemperature
Undervoltage
Overload
Short circuit to GND (Power limitation)
Negative output voltage clamp
1. If the V and external circuit.
is high, the SENSE output is at a high impedance, its potential depends on leakage currents
CSD
(1)
=0V)
CSD
L
H
L
H
L
H
H
L
H
L L
L L
X
0
Nominal
0
V
SENSEH
0 0
Nominal
(no power limitation)
H
Cycling
V
SENSEH
(power limitation)
L
H
L L
V
SENSEH
0
LL0
Doc ID 16273 Rev 7 15/34
Page 16
Electrical specification VND5E025BK-E

Table 11. Electrical transient requirements (part 1/3)

ISO 7637-2:
2004(E) Test
pulse
Test levels
(1)
Number of
pulses or
III IV Min. Max.
test times
Burst cycle / pulse
repetition time
Delays and Impedance
1 -75V -100V 5000 pulses 0.5s 5s 2 ms, 10Ω
2a +37V +50V 5000 pulses 0.2s 5s 50µs, 2Ω
3a -100V -150V 1h 90ms 100ms 0.1µs, 50Ω
3b +75V +100V 1h 90ms 100ms 0.1µs, 50Ω
4 -6V -7V 1 pulse 100ms, 0.01Ω
(2)
5b
1. The above test levels must be considered referred to VCC= 13.5V except for pulse 5b.
2. Valid in case of external load dump clamp: 40V maximum referred to ground.

Table 12. Electrical transient requirements (part 2/3)

ISO 7637-2:
+65V +87V 1 pulse 400ms, 2Ω
Test level results
2004E
Test pulse
III VI
1C C
2a C C
3a C C
3b C C
4C C
(1)
5b
1. Valid in case of external load dump clamp: 40V maximum referred to ground.

Table 13. Electrical transient requirements (part 3/3)

CC
Class Contents
C All functions of the device performed as designed after exposure to disturbance.
E
One or more functions of the device did not perform as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device.
16/34 Doc ID 16273 Rev 7
Page 17
VND5E025BK-E Electrical specification

2.4 Waveforms

Figure 10. Normal operation

Normal operation
INPUT
Nominal load Nominal load
I
OUT
V
SENSE
V
CS_DIS

Figure 11. Overload or short to GND

Overload or Short to GND
INPUT
I
OUT
V
SENSE
V
CS_DIS
I
LimH
>
Power Limitation
I
LimL
Thermal cycling
>
Doc ID 16273 Rev 7 17/34
Page 18
Electrical specification VND5E025BK-E

Figure 12. Intermittent overload

Intermittent Overload
INPUT
Overload
I
>
LimH
I
>
LimL
I
OUT
V
>
SENSEH
V
SENSE
V
CS_DIS

Figure 13. TJ evolution in overload or short to GND

TJ evolution in
Overload or Short to GND
Nominal load
INPUT
Self-limitation of fast thermal transients
T
J_START
T
J
I
>
LimH
I
OUT
Power Limitation
18/34 Doc ID 16273 Rev 7
T
T
TSD
R
< I
T
HYST
LimL
Page 19
VND5E025BK-E Electrical specification

2.5 Electrical characteristics curves

Figure 14. Off-state output current Figure 15. High level input current

Iloff (nA)
1000
900
800
700
600
500
400
300
200
100
0
-50 -25 0 25 50 75 100 125 150 175
Off State Vcc=13V
Vin=Vout=0V
Tc (°C)

Figure 16. Input clamp voltage Figure 17. Input high level

Vicl (V)
7
6,8
6,6
6,4
6,2
6
5,8
5,6
5,4
5,2
5
lin=1mA
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)

Figure 18. Input low level Figure 19. Input hysteresis voltage

Vil (V)
2
1,8
1,6
1,4
1,2
1
0,8
0,6
0,4
0,2
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Iih (µA)
5
4,5
3,5
2,5
1,5
0,5
Vin = 2.1V
V
= 8 V
4
3
2
1
0
-50 -25 0 25 50 75 100 125 150 175
CC
Tc (°C)
Vih (V)
4
3,5
3
2,5
2
1,5
1
0,5
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Vihyst (V)
1
0,9
0,8
0,7
0,6
0,5
0,4
0,3
0,2
0,1
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Doc ID 16273 Rev 7 19/34
Page 20
Electrical specification VND5E025BK-E
Figure 20. On-state resistance vs T
case
Ron (mOhm)
70
60
Iout= 3A
Vcc=13V
50
40
30
20
10
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)

Figure 22. Undervoltage shutdown Figure 23. I

Vusd (V)
16
14
12
10
8
6
4
2
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)

Figure 24. Turn-on voltage slope Figure 25. Turn-off voltage slope

(dVout/dt )On (V/ms)
700
Figure 21. On-state resistance vs V
Ron (mOhm)
60
50
40
30
20
10
0
0 5 10 15 20 25 30 35 40
Vcc (V)
vs T
LIMH
case
Ilimh (A)
70
65
60
55
50
45
40
Vcc=13V
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
(dVout/dt )Off (V/ms)
600
Tc=150°C
Tc=125°C
Tc=25°C
Tc=-40°C
CC
600
500
400
300
200
100
0
-50 -25 0 25 50 75 100 125 150 175
Vcc=13V
RI=4.3 Ohm
Tc (°C)
20/34 Doc ID 16273 Rev 7
500
Vcc=13V
RI= 4.3 Ohm
400
300
200
100
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Page 21
VND5E025BK-E Electrical specification

Figure 26. CS_DIS high level voltage Figure 27. CS_DIS low level voltage

Vcsdh (V)
4
3,5
3
2,5
2
Vcsdl (V)
3
2,5
2
1,5
1,5
1
0,5
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)

Figure 28. CS_DIS clamp voltage

Vcsdcl(V)
10
9
8
Icsd = 1 mA
7
6
5
4
3
2
1
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
1
0,5
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Doc ID 16273 Rev 7 21/34
Page 22
Application information VND5E025BK-E

3 Application information

Figure 29. Application schematic

+5V
V
CC
R
prot
Μ
CU
R
prot
R
prot
R
SENSE
C
EXT
CS_DIS
INPUT
CURRENT SENSE
D
ld
OUTPUT
GND
R
GND
GND
D
GND
V
Note: Channel 2 has the same internal circuit as channel 1.

3.1 GND protection network against reverse battery

This section provides two solutions for implementing a ground protection network against reverse battery.
3.1.1 Solution 1: resistor in the ground line (R
This can be used with any type of load.
The following is an indication on how to dimension the R
1. R
2. R
where -I maximum rating section of the device datasheet.
Power dissipation in R
P
= (-VCC)2/R
D
This resistor can be shared amongst several different HSDs. Please note that the value of this resistor should be calculated with formula (1) where I maximum On-state currents of the different devices.
≤ 600 mV / (I
GND
≥ (−VCC) / (-I
GND
is the DC reverse ground pin current and can be found in the absolute
GND
GND
S(on)max
GND
GND
)
)
(when VCC<0: during reverse battery situations) is:
GND
only)
resistor.
GND
S(on)max
becomes the sum of the
Please note that if the microprocessor ground is not shared by the device ground then the R
will produce a shift (I
GND
S(on)max
22/34 Doc ID 16273 Rev 7
* R
) in the input thresholds and the status output
GND
Page 23
VND5E025BK-E Application information
values. This shift will vary depending on how many devices are On in the case of several high-side drivers sharing the same R
GND
.
If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then ST suggests to utilize Solution 2 (see below).
3.1.2 Solution 2: diode (D
A resistor (R
=1 kΩ) should be inserted in parallel to D
GND
) in the ground line
GND
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network will produce a shift (≈600mV) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network.

3.2 Load dump protection

Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the V
max DC rating. The same applies if the device is subject to transients on the VCC line
CC
that are greater than the ones shown in the ISO 7637-2: 2004(E) table.

3.3 MCU I/Os protection

If a ground protection network is used and negative transient are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (R prevent the MCU I/Os pins to latch-up.
The value of these resistors is a compromise between the leakage current of MCU and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of MCU I/Os:
if the device drives an
GND
prot
) in line to
-V
CCpeak/Ilatchup
≤ R
prot
Calculation example:
For V
5kΩ ≤ R
= - 100 V and I
CCpeak
≤ 180 kΩ
prot
Recommended values: R
≤ (V
OHμC-VIH-VGND
≥ 20 mA; V
latchup
=10 kΩ, C
prot
Doc ID 16273 Rev 7 23/34
EXT
) / I
IHmax
OHµC
=10 nF.
≥ 4.5 V
Page 24
Application information VND5E025BK-E

3.4 Current sense and diagnostic

The current sense pin performs a double function (see Figure 30: Current sense and
diagnostic):
● Current mirror of the load current in normal operation, delivering a current
proportional to the load one according to a known ratio K The current I external resistor R minimum (see parameter V
can be easily converted to a voltage V
SENSE
. Linearity between I
SENSE
SENSE
in Table 9: Current sense (8V < VCC < 18V)). The
OUT
and V
current sense accuracy depends on the output current (refer to current sense electrical characteristics Table 9: Current sense (8V < VCC < 18V)).
● Diagnostic flag in fault conditions, delivering a fixed voltage V
maximum current I
SENSEH
in case of the following fault conditions (refer to Tr ut h t a bl e):
– Power limitation activation
–Overtemperature
A logic level high on CS_DIS pin sets at the same time all the current sense pins of the device in a high impedance state, thus disabling the current monitoring and diagnostic detection. This feature allows multiplexing of the microcontroller analog inputs by sharing of sense resistance and ADC line among different devices.
.
X
SENSE
by means of an
SENSE
is ensured up to 5V
SENSEH
up to a

Figure 30. Current sense and diagnostic

Signal Clamp
Undervol t age
IN1
IN2
CS_ DI S
CS1
CS2
LOGIC
Contr ol & Diagnosti c 1
DRI VE R
Ov e r
temp.
V
SENSEH
OVERLOAD PROTECTI ON
( ACTIVE POWER LIMITATION)
Curr ent
Li mitation
Curr ent
Sense
Power Cl a mp
Limitation
V
CC
V
CH 1
ON
Channels 2
CH 2
CONTROL & DIAGNOSTIC
OUT 2
OUT 1
24/34 Doc ID 16273 Rev 7
GND
Page 25
VND5E025BK-E Application information

3.5 Maximum demagnetization energy (VCC=13.5V)

Figure 31. Maximum turn-off current versus inductance (for each channel)

100
A
B
C
10
I (A)
1
0,1 1 10 100L (mH)
A:
T
= 150°C single pulse
jstart
B: T
C:
VIN, I
Note: Values are generated with R In case of repetitive pulses, T specified above for curves A and B.
= 100°C repetitive pulse
jstart
T
= 125°C repetitive pulse
jstart
L
=0 Ω.
L
jstart
Demagnetization Demagnetization Demagnetization
t
(at beginning of each demagnetization) of every pulse must not exceed the temperature
Doc ID 16273 Rev 7 25/34
Page 26
Package and thermal data VND5E025BK-E

4 Package and thermal data

4.1 PowerSSO-24 thermal data

Figure 32. PowerSSO-24 PC board

Note: Layout condition of R thickness = 1.6mm, Cu thickness = 70µm (front and back side), Copper areas: from minimum pad layout to 8cm
and Zth measurements (PCB: Double layer, Thermal Vias, FR4 area = 77mm x 86mm, PCB
th
2
).
Figure 33. R
RTHj_amb(°C/W)
55
50
45
40
35
30
0246810
thj-amb
on)
vs PCB copper area in open box free air condition (one channel
PCB Cu heatsink area (cm^2)
26/34 Doc ID 16273 Rev 7
Page 27
VND5E025BK-E Package and thermal data
Figure 34. PowerSSO-24 thermal impedance junction to ambient single pulse (one
channel on)
ZTH (°C/W)
1000
100
10
1
0.1
0.0001 0.001 0.01 0.1 1 10 100 1000
Equation 1: pulse calculation formula
Z
THδ
R
TH
δ Z
THtp
1 δ–()+⋅=
where δ = tP/T
Time (s)
Footprint
2
2 cm
2
8 cm

Figure 35. Thermal fitting model of a double channel HSD in PowerSSO-24

Note: The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
Doc ID 16273 Rev 7 27/34
Page 28
Package and thermal data VND5E025BK-E

Table 14. Thermal parameters

Area/Island (cm2) Footprint 2 8
R1 (°C/W) 0.28
R2 (°C/W) 0.9
R3 (°C/W) 6
R4 (°C/W) 7.7
R5 (°C/W) 9 9 8
R6 (°C/W) 28 17 10
R7 (°C/W) 0.28
R8 (°C/W) 0.9
C1 (W.s/°C) 0.001
C2 (W.s/°C) 0.003
C3 (W.s/°C) 0.025
C4 (W.s/°C) 0.75
C5 (W.s/°C) 1 4 9
C6 (W.s/°C) 2.2 5 17
C7 (W.s/°C) 0.001
C8 (W.s/°C) 0.003
28/34 Doc ID 16273 Rev 7
Page 29
VND5E025BK-E Package and packing information

5 Package and packing information

5.1 ECOPACK
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com
ECOPACK
®
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.

5.2 Package mechanical data

Figure 36. PowerSSO-24 package dimensions

.
Doc ID 16273 Rev 7 29/34
Page 30
Package and packing information VND5E025BK-E
Table 15. PowerSSO-24
Symbol
A 2.15 2.47
A2 2.15 2.40
a1 0 0.075
b 0.33 0.51
c 0.23 0.32
D 10.10 10.50
E7.4 7.6
e0.8
e3 8.8
G 0.1
G1 0.06
H 10.1 10.5
mechanical data
Millimeters
Min. Typ. Max.
h 0.4
k5°
L 0.55 0.85
N 10°
X4.1 4.7
Y6.5 7.1

5.3 Packing information

Figure 37. PowerSSO-24 tube shipment (no suffix)

C
B
A
Base Qty 49 Bulk Qty 1225 Tube length (±0.5) 532 A 3.5 B 13.8 C (±0.1) 0.6
All dimensions are in mm.
30/34 Doc ID 16273 Rev 7
Page 31
VND5E025BK-E Package and packing information

Figure 38. PowerSSO-24 tape and reel shipment (suffix “TR”)

REEL DIMENSIONS
Base Qty 1000 Bulk Qty 1000 A (max) 330 B (min) 1.5 C (±0.2) 13 F 20.2 G (+2 / -0) 24.4 N (min) 100 T (max) 30.4
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986
Tape width W 24 Tape Hole Spacing P0 (±0.1) 4 Component Spacing P 12 Hole Diameter D (±0.05) 1.55 Hole Diameter D1 (min) 1.5 Hole Position F (±0.1) 11.5 Compartment Depth K (max) 2.85 Hole Spacing P1 (±0.1) 2
All dimensions are in mm.
Top
cover
tape
End
500mm min
No componentsNo components Components
Empty components pockets sealed with cover tape.
User direction of feed
Start
500mm min
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Order codes VND5E025BK-E

6 Order codes

Table 16. Device summary

Order codes
Package
Tube Tape and reel
PowerSSO-24 VND5E025BK-E VND5E025BKTR-E
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VND5E025BK-E Revision history

7 Revision history

Table 17. Document revision history

Date Revision Changes
17-Sep-2009 1 Initial release.
02-Nov-2009 2 Updated Table 5: Power section.
30-Nov-2009 3
21-Jan-2010 4 Updated Table 9: Current sense (8V < VCC < 18V)
03-Feb-2010 5
19-Feb-2010 6 Updated Table 6: Switching (VCC = 13V; Tj = 25°C).
11-Oct-2010 7 Changed document status from target specification to datasheet.
Updated Table 9: Current sense (8V < VCC < 18V). Updated Figure 9: Maximum current sense ratio drift vs load current
Updated following tables: – Table 6: Switching (VCC = 13V; Tj = 25°C) – Table 9: Current sense (8V < VCC < 18V) Updated following figures: – Figure 8: IOUT/ISENSE vs IOUT – Figure 9: Maximum current sense ratio drift vs load current
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VND5E025BK-E
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