Double channel high-side driver with analog current sense
for automotive applications
Datasheet − production data
Max transient supply voltageV
Operating voltage rangeV
Max on-state resistance (per ch.)R
Current limitation (typ)I
Off-state supply currentI
1. Typical value with all loads connected.
■ General
CC
CC
ON
LIMH
S
4.5 to 28 V
– AEC-Q100 qualified
– Inrush current active management by
power limitation
– Very low standby current
– 3.0 V CMOS compatible inputs
– Optimized electromagnetic emissions
– Very low electromagnetic susceptibility
– Compliant with European directive
2002/95/EC
– Very low current sense leakage
■ Diagnostic functions
– Proportional load current sense
– High current sense precision for wide
currents range
– Current sense disable
– Off-state open- load detection
– Output short to V
– Undervoltage shutdown
– Overvoltage clamp
– Load current limitation
– Self limiting of fast thermal transients
– Protection against loss of ground and loss
■ All types of resistive, inductive and capacitive
loads
■ Suitable as LED driver
Description
The VND5E025AS-E is a double channel highside driver manufactured using ST proprietary
VIPower
SO-16L package. The device is designed to drive
12 V automotive grounded loads, and to provide
protection and diagnostics. It also implements a
3 V and 5 V CMOS-compatible interface for the
use with any microcontroller.
The device integrates advanced protective
functions such as load current limitation, inrush
and overload active management by power
limitation, overtemperature shut-off with autorestart and overvoltage active clamp. A dedicated
analog current sense pin is associated with every
output channel providing enhanced diagnostic
functions including fast detection of overload and
short-circuit to ground through power limitation
indication, overtemperature indication, shortcircuit to V
open-load detection. The current sensing and
diagnostic feedback of the whole device can be
disabled by pulling the CS_DIS pin high to share
the external sense resistor with similar devices.
®
M0-5 technology and housed in
diagnosis and on-state and off-state
CC
June 2012Doc ID 022490 Rev 41/37
This is information on a product in full production.
Applying stress which exceeds the rating listed in Table 3: Absolute maximum ratings may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to the conditions in table below for extended
periods may affect device reliability.
Table 3.Absolute maximum ratings
SymbolParameterValueUnit
V
-V
-I
GND
I
OUT
-I
OUT
I
CSD
-I
CSENSE
V
CSENSE
E
MAX
DC supply voltage41
CC
Reverse DC supply voltage0.3
CC
DC reverse ground pin current200mA
DC output currentInternally limited
Reverse DC output current24
DC input current
IN
-1 to 10
DC current sense disable input current
DC reverse CS pin current200
Current sense maximum voltageVCC- 41 to +V
Maximum switching energy (single pulse)
(L = 0.8 mH; RL=0Ω; V
I
OUT
= I
limL
(Typ.))
Doc ID 022490 Rev 47/37
= 13.5 V; T
bat
jstart
= 150 °C;
V
A
mAI
V
CC
140mJ
Page 8
Electrical specificationsVND5E025AS-E
Table 3.Absolute maximum ratings (continued)
SymbolParameterValueUnit
Electrostatic discharge
(Human Body Model: R = 1.5 kΩ; C = 100 pF)
V
V
ESD
ESD
T
– Input
– Current sense
–CS_DIS
– Output
–V
CC
Charge device model (CDM-AEC-Q100-011)750V
T
Junction operating temperature-40 to 150
j
Storage temperature-55 to 150
stg
4000
2000
4000
5000
5000
V
V
V
V
V
°C
2.2 Thermal data
Table 4.Thermal data
SymbolParameterT yp val ueUnit
R
thj-pcb
R
thj-amb
1. The measure is done in accordance with the JESD 51-8.
Thermal resistance junction-pcb
Thermal resistance junction-ambient See Figure 36°C/W
(1)
18.5°C/W
2.3 Electrical characteristics
Values specified in this section are for 8 V < VCC< 28 V; -40°C < Tj< 150°C, unless
otherwise stated.
Table 5.Power section
SymbolParameterTest conditionsMin. Typ. Max.Unit
V
V
USDhyst
R
V
clamp
Operating supply
CC
voltage
Undervoltage shutdown3.54.5
USD
Undervoltage shutdown
hysteresis
I
OUT
On-state resistance
ON
(1)
OUT
I
OUT
Clamp voltageIS= 20 mA414652V
Off-state; V
V
I
S
Supply current
IN=VOUT=VSENSE=VCSD
On-state; V
I
OUT
4.51328
0.5
=3A; Tj=25°C25
=3A; Tj=150°C50
=3A; VCC=5V; Tj=25°C35
=0A
=13V; Tj=25°C;
CC
=13V; VIN=5V;
CC
=0V
(2)5(2)
2
36mA
VV
mΩI
µA
8/37Doc ID 022490 Rev 4
Page 9
VND5E025AS-EElectrical specifications
Table 5.Power section (continued)
SymbolParameterTest conditionsMin. Typ. Max.Unit
VIN=V
= 25°C
T
I
L(off1)
1. For each channel.
2. PowerMOS leakage included.
Table 6.Switching (VCC=13V; Tj= 25°C)
Off-state output
current
Output - VCC diode
V
F
voltage
(1)
(1)
j
V
IN=VOUT
= 125°C
T
j
-I
OUT
=0V; VCC=13V;
OUT
=0V; VCC=13V;
00.013
05
=4 A; Tj= 150°C0.7V
SymbolParameterTest conditions Min.Typ.Max. Unit
t
d(on)
t
d(off)
(dV
/dt)onTurn-on voltage slope
OUT
/dt)
(dV
OUT
W
ON
W
OFF
Tu r n - o n d e l a y t i m e
Turn-off delay time—40—
Turn-off voltage slope—See Figure 28—
off
Switching energy losses
during t
Switching energy losses
during t
WON
WOFF
R
=4.3 Ω
L
(see Figure 6)
=4.3 Ω
R
L
RL=4.3 Ω
(see Figure 6)
—20—
—See Figure 27—
—0.6—
—0.35—
µA
µs
V/µs
mJ
Table 7.Logic inputs
SymbolParameterTest conditionsMin.Typ. Max.Unit
V
IL
I
IL
V
IH
I
IH
V
I(hyst)
ICL
V
CSDL
I
CSDL
V
CSDH
I
CSDH
V
CSD(hyst)
V
CSCL
Input low level voltage0.9V
Low level input currentVIN=0.9V1µA
Input high level voltage2.1V
High level input currentVIN=2.1V10µA
Input hysteresis voltage0.25
I
=1mA5.57
Input clamp voltage
IN
I
=-1mA-0.7
IN
CS_DIS low level voltage0.9
Low level CS_DIS currentV
=0.9V1µA
CSD
CS_DIS high level voltage2.1V
High level CS_DIS currentV
=2.1V10µA
CSD
CS_DIS hysteresis voltage0.25
=1mA5.57
I
CS_DIS clamp voltage
CSD
I
=-1mA-0.7
CSD
VV
V
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Page 10
Electrical specificationsVND5E025AS-E
Table 8.Protections and diagnostics
(1)
SymbolParameterTest conditionsMin.Typ.Max.Unit
= 13 V436085A
V
I
LIMH
I
LIML
T
TSD
T
T
RS
T
HYST
V
DEMAG
V
ON
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles.
T able 9.Current sense (8 V < VCC<18V)
DC short circuit current
Short circuit current
during thermal cycling
Shutdown temperature150175200°C
Reset temperatureTRS+1 TRS+5°C
R
Thermal reset of STATUS135°C
Thermal hysteresis
TSD-TR
)
(T
Turn-Off output voltage
clamp
Output voltage drop
limitation
CC
5V<VCC<28V85A
VCC=13V;
T
R<Tj<TTSD
15A
7°C
I
=2A; VIN=0;
OUT
L=6 mH
=0.1A;
I
OUT
= -40°C to 150°C
T
j
VCC-41 VCC-46 VCC-52V
25mV
(see Figure 8)
SymbolParameterTest conditionsMin. Typ. Max. Unit
I
dK
dK
K
LED
K
K
1/K1
K
2/K2
K
= 0.05 A; V
I
OUT/ISENSE
0
1
2
3
I
OUT/ISENSE
I
OUT/ISENSE
(1)
Current sense ratio drift
I
OUT/ISENSE
(1)
Current sense ratio drift
I
OUT/ISENSE
OUT
V
=0V; Tj= -40°C to 150°C
CSD
I
= 0.5 A; V
OUT
=0V; Tj= -40 °C to 150 °C
V
CSD
I
=2 A; V
OUT
V
=0V;
CSD
T
= -40°C to 150°C
j
T
= 25°C to 150°C
j
I
=2 A; V
OUT
=0V;
V
CSD
T
= -40°C to 150°C
j
I
=3 A; V
OUT
=0V;
V
CSD
SENSE
SENSE
SENSE
SENSE
Tj= -40°C to 150°C
T
= 25°C to150°C
j
=3 A; V
I
OUT
V
CSD
= -40°C to 150°C
T
j
I
= 10 A; V
OUT
V
CSD
SENSE
=0V;
SENSE
=0V;
Tj= -40°C to 150°C
Tj= 25°C to 150°C
SENSE
=4 V;
=4 V;
=4V;
=4V;
=0.5V;
=0.5V;
=4V;
1240 3350 5100
1860 3150 4600
2100
3100
4400
2250
3100
3850
-1313%
2200
3000
4100
2450
3000
3550
-1212%
2550
2850
3280
2650
2850
3180
10/37Doc ID 022490 Rev 4
Page 11
VND5E025AS-EElectrical specifications
T able 9.Current sense (8 V < VCC< 18 V) (continued)
SymbolParameterTest conditionsMin. Typ. Max. Unit
dK3/K
I
SENSE
I
OL
V
SENSE
V
SENSEH
I
SENSEH
(1)
Current sense ratio drift
3
Analog sense leakage
0
current
Open-load on-state
current detection
threshold
Max analog sense output
voltage
Analog sense output
voltage in fault
condition
(1)
Analog sense output
current in fault
condition
(2)
= 10 A; V
I
OUT
=0V; Tj= -40°C to 150°C
V
CSD
=0A; V
I
OUT
=5V; VIN=0V;
V
CSD
= -40°C to 150°C
T
j
I
=0A; V
OUT
=0V; VIN=5V;
V
CSD
= -40 °C to 150 °C
T
j
I
=2A; V
OUT
=5V; VIN=5V;
V
CSD
= -40°C to 150°C
T
j
= 5V; 8V<VCC<18V;
V
IN
I
SENSE
=3 A; V
I
OUT
VCC=13V; R
VCC=13V; V
= 5 µA
SENSE
=0V;
SENSE
=0V;
SENSE
=0V;
SENSE
=0V 5V
CSD
SENSE
SENSE
=4V;
-6+6%
01µA
02µA
01µA
530mA
=3.9kΩ8V
=5V9mA
Delay response time
t
DSENSE1H
from falling edge of
CS_DIS pin
Delay response time
t
DSENSE1L
from rising edge of
CS_DIS pin
Delay response time
t
DSENSE2H
from rising edge of
INPUT pin
Delay response time
Δt
DSENSE2H
between rising edge of
output current and rising
edge of current sense
Delay response time
t
DSENSE2L
from falling edge of
INPUT pin
1. Fault condition includes: power limitation, overtemperature and open-load off-state detection.
V
I
SENSE
SENSE
<4V, 0.5<I
= 90% of I
(see Figure 4)
V
I
SENSE
SENSE
<4V, 0.5<I
=10% of I
(see Figure 4)
V
I
SENSE
SENSE
<4V, 0.5<I
= 90% of I
(see Figure 4)
V
I
SENSE
I
OUT
I
OUTMAX
V
I
SENSE
SENSE
=90% of I
=90% of I
SENSE
<4V,
=3A; (see Figure 7)
<4V, 0.5<I
=10% of I
(see Figure 4)
OUT
SENSEMAX
OUT
SENSEMAX
OUT
SENSEMAX
SENSEMAX,
OUTMAX
OUT
SENSEMAX
<10A
<10A
<10A
;
<10A
30100µs
520µs
80300µs
110µs
70250µs
Doc ID 022490 Rev 411/37
Page 12
Electrical specificationsVND5E025AS-E
SENSE CURRENT
INPUT
LOAD CURRENT
CS_DIS
t
DSENSE2H
t
DSENSE2L
t
DSENSE1L
t
DSENSE1H
V
IN
V
CS
t
DSTKON
OUTPUT STUCK TO V
CC
V
OUT
> V
OL
V
SENSEH
Table 10.Open-load detection (8 V < V
SymbolParameterTest conditionMin.Typ.Max. Unit
CC
<18V)
V
t
DSTKON
I
L(off2)r
I
L(off2)f
Open-load off-state
OL
voltage detection threshold
Output short circuit to V
detection delay at turn-off
Off-state output current at
= 4V
V
OUT
Off-state output current at
V
= 2 V
OUT
VIN=0V2
CC
See Figure 51801200µs
V
=0V; V
V
V
V
IN
OUT
IN
OUT
=0V; V
SENSE
rising from 0 V to 4 V
SENSE=VSENSEH
falling from VCC to 2 V
Delay response from
td_vol
output rising edge to
V
SENSE
rising edge in
= 4 V; VIN= 0 V;
V
OUT
V
SENSE
= 90 % of V
openload
Figure 4.Current sense delay characteristics
=0V;
SENSEH
See
Figure 5
4V
-1200µA
;
-5090µA
20µs
12/37Doc ID 022490 Rev 4
Figure 5.Open-load off-state delay timing
Page 13
VND5E025AS-EElectrical specifications
V
OUT
dV
OUT
/dt
(on)
t
r
80%
10%
t
f
dV
OUT
/dt
(off)
t
d(off)
t
d(on)
INPUT
t
t
90%
t
Won
t
Woff
Figure 6.Switching characteristics
Doc ID 022490 Rev 413/37
Page 14
Electrical specificationsVND5E025AS-E
V
IN
I
OUT
I
SENSE
I
OUTMAX
I
SENSEMAX
90% I
SENSEMAX
90% I
OUTMAX
Δ
t
DSENSE2H
t
t
t
V
on
I
OUT
VCC-V
OUT
Tj= 150oC
T
j
=25oC
T
j
=-40oC
V
on/Ron(T)
Figure 7.Delay response time between rising edge of output current and rising
edge of current sense (CS enabled)
Figure 8.Output voltage drop limitation
14/37Doc ID 022490 Rev 4
Page 15
VND5E025AS-EElectrical specifications
1200
1700
2200
2700
3200
3700
4200
4700
2345678910
I
OUT
(A)
I
out
/ I
sense
max Tj = -40 °C to 150 °C
max Tj = 25 °C to 150 °C
min Tj = 25 °C to 150 °C
min Tj = -40 °C to 150 °C
typical value
-20
-15
-10
-5
0
5
10
15
20
2345678 910
I
OUT
(A)
dk/k(%)
Figure 9.I
OUT/ISENSE
vs I
OUT
Figure 10.Maximum current sense ratio drift vs load current
Note:Parameter guaranteed by design; it is not tested.
Doc ID 022490 Rev 415/37
Page 16
Electrical specificationsVND5E025AS-E
Table 11.Truth table
ConditionsInputOutputSense (V
Normal operation
L
H
L
H
CSD
0
Nominal
=0V)
(1)
Overtemperature
Undervoltage
Overload
Short circuit to GND
(Power limitation)
Open-load off-state
(with external pull up)
Short circuit to V
CC
(external pull up
disconnected)
Negative output voltage
clamp
1. If the V
and external circuit.
is high, the SENSE output is at a high impedance, its potential depends on leakage currents
CSD
L
H
L
H
H
L
L
L
L
X
0
V
SENSEH
0
0
Nominal
(no power limitation)
H
Cycling
V
SENSEH
(power limitation)
L
H
LHV
L
H
L
L
H
H
0
V
SENSEH
SENSEH
V
SENSEH
< Nominal
LL0
16/37Doc ID 022490 Rev 4
Page 17
VND5E025AS-EElectrical specifications
T able 12.Electrical transient requirements (part 1)
ISO 7637-2:
2004(E) T est
pulse
Test levels
(1)
Number of
pulses or
IIIIVMin.Max.
test times
Burst cycle / pulse
repetition time
Delays and
Impedance
1-75V-100V5000 pulses0.5s5s2 ms, 10Ω
2a+37V+50V5000 pulses0.2s5s50µs, 2Ω
3a-100V-150V1h90ms100ms0.1µs, 50Ω
3b+75V+100V1h90ms100ms0.1µs, 50Ω
4-6V-7V1 pulse100ms, 0.01Ω
(2)
5b
1. The above test levels must be considered referred to VCC= 13.5V except for pulse 5b.
2. Valid in case of external load dump clamp: 40V maximum referred to ground.
T able 13.Electrical transient requirements (part 2)
ISO 7637-2:
+65V+87V1 pulse400ms, 2Ω
Test level results
2004E
T est puls e
IIIVI
1CC
2aCC
3aCC
3bCC
4CC
(1)
5b
1. Valid in case of external load dump clamp: 40V maximum referred to ground
T able 14.Electrical transient requirements (part 3)
CC
ClassContents
CAll functions of the device performed as designed after exposure to disturbance.
E
One or more functions of the device did not perform as designed after exposure to
disturbance and cannot be returned to proper operation without replacing the device.
Doc ID 022490 Rev 417/37
Page 18
Electrical specificationsVND5E025AS-E
I
OUT
V
SENSE
V
CS_DIS
INPUT
Nominal loadNominal load
Normal operation
Power Limitation
I
LimH
>
I
LimL
>
I
OUT
V
SENSE
V
CS_DIS
INPUT
Thermal cycling
Overload or Short to GND
2.4 Waveforms
Figure 11. Normal operation
Figure 12.Overload or short to GND
18/37Doc ID 022490 Rev 4
Page 19
VND5E025AS-EElectrical specifications
I
OUT
V
SENSE
V
CS_DIS
INPUT
I
LimH
>
Nominal load
Intermittent Overload
I
LimL
>
Overload
V
SENSEH
>
INPUT
OFF-State Open Load
with external circuitry
V
OL
I
OUT
V
SENSE
V
CS_DIS
V
OUT
V
OUT
> V
OL
t
DSTK(on)
V
SENSEH
>
Figure 13.Intermittent overload
Figure 14. Off-state open-load with external circuitry
Doc ID 022490 Rev 419/37
Page 20
Electrical specificationsVND5E025AS-E
t
DSTK(on)
V
OUT
> V
OL
Resistive
Short to V
CC
Hard
Short to V
CC
Short to V
CC
I
OUT
V
CS_DIS
V
OUT
V
OL
t
DSTK(on)
T
TSD
T
R
TJ evolution in
Overload or Short to GND
I
LimH
>
< I
LimL
T
J_START
T
HYST
Power Limitation
Self-limitation of fast thermal transients
INPUT
I
OUT
T
J
Figure 15. Short to V
CC
Figure 16. TJ evolution in overload or short to GND
20/37Doc ID 022490 Rev 4
Page 21
VND5E025AS-EElectrical specifications
-50 -250255075 100 125 150 175
Tc (°C)
0
100
200
300
400
500
600
700
800
900
1000
Iloff (nA)
Off State
Vcc=13V
Vin=Vout=0V
-50 -250255075100 125 150 175
Tc (°C)
0
0,5
1
1,5
2
2,5
3
3,5
4
4,5
5
Iih (µA)
Vin = 2.1V
V
CC = 8 V
-50 -250255075100 125 150 175
Tc (°C)
5
5,2
5,4
5,6
5,8
6
6,2
6,4
6,6
6,8
7
Vicl (V)
lin=1mA
-50 -250255075100 125 150 175
Tc (°C)
0
0,5
1
1,5
2
2,5
3
3,5
4
Vih (V)
-50 -250255075100 125 150 175
Tc (°C)
0
0,2
0,4
0,6
0,8
1
1,2
1,4
1,6
1,8
2
Vil (V)
-50 -250255075100 125 150 175
Tc (°C)
0
0,1
0,2
0,3
0,4
0,5
0,6
0,7
0,8
0,9
1
Vihyst (V)
2.5 Electrical characteristics curves
Figure 17. Off-state output currentFigure 18. High level input current
Figure 19. Input clamp voltageFigure 20. Input high level voltage
Figure 21. Input low level voltageFigure 22. Input hysteresis voltage
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Page 22
Electrical specificationsVND5E025AS-E
-50 -250255075100 125 150 175
Tc (°C)
0
10
20
30
40
50
60
70
Ron (mOhm)
Iout= 3A
Vcc=13V
0510152025303540
Vcc (V)
0
10
20
30
40
50
60
Ron (mOhm)
Tc=-40°C
Tc=25°C
Tc=125°C
Tc=150°C
-50 -250255075100 125 150 175
Tc (°C)
0
2
4
6
8
10
12
14
16
Vusd (V)
-50 -250255075100 125 150 175
Tc (°C)
40
45
50
55
60
65
70
Ilimh (A)
Vcc=13V
-50 -250255075 100 125 150 175
Tc (°C)
0
100
200
300
400
500
600
700
(dVout/dt )On ( V/ms)
Vcc=13V
RI=4.3 Ohm
-50 -250255075 100 125 150 175
Tc (°C)
0
100
200
300
400
500
600
(dVout/dt )Off (V/m s)
Vcc=13V
RI= 4.3 Ohm
Figure 23.On-state resistance vs T
case
Figure 24.On-state resistance vs V
Figure 25. Undervoltage shutdownFigure 26.I
LIMH
vs T
CC
case
Figure 27. Turn-on volt age slopeFigure 28. Turn-off voltage slope
22/37Doc ID 022490 Rev 4
Page 23
VND5E025AS-EElectrical specifications
-50 -250255075100 125 150 175
Tc (°C)
0
0,5
1
1,5
2
2,5
3
3,5
4
Vcsdh (V)
-50 -250255075100 125 150 175
Tc (°C)
0
0,5
1
1,5
2
2,5
3
Vcsdl (V)
-50 -250255075100 125 150 175
Tc (°C)
0
1
2
3
4
5
6
7
8
9
10
Vcsdcl(V)
Icsd = 1 mA
Figure 29.CS_DIS high level voltageFigure 30. CS_DIS low level voltage
Figure 31.CS_DIS clamp voltage
Doc ID 022490 Rev 423/37
Page 24
Application informationVND5E025AS-E
V
CC
GND
OUTPUT
D
GND
R
GND
D
ld
Μ
CU
+5V
V
GND
CS_DIS
INPUT
R
prot
R
prot
CURRENT SENSE
R
SENSE
R
prot
C
EXT
3 Application information
Figure 32. Application schematic
1. Channel 2 has the same internal circuit as channel 1.
3.1 GND protection network against reverse battery
This section provides two solutions for implementing a ground protection network against
reverse battery.
3.1.1 Solution 1: resistor in the ground line (R
This can be used with any type of load.
The following is an indication on how to dimension the R
1.R
2. R
where -I
maximum rating section of the device datasheet.
Power dissipation in R
P
= (-VCC)2/R
D
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where I
maximum on-state currents of the different devices.
Please note that if the microprocessor ground is not shared by the device ground then the
R
GND
values. This shift varies depending on how many devices are On in the case of several high
24/37Doc ID 022490 Rev 4
side drivers sharing the same R
≤ 600mV / (I
GND
≥ (−VCC) / (-I
GND
is the DC reverse ground pin current and can be found in the absolute
GND
GND
produces a shift (I
S(on)max
GND
GND
S(on)max
)
)
(when VCC<0: during reverse battery situations) is:
* R
GND
) in the input thresholds and the status output
GND
.
GND
only)
resistor.
GND
S(on)max
becomes the sum of the
Page 25
VND5E025AS-EApplication information
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize Solution 2 (see below).
3.1.2 Solution 2: diode (D
A resistor (R
=1kΩ) should be inserted in parallel to D
GND
) in the ground line
GND
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network produces a shift (≈600 mV) in the input threshold
and in the status output values if the microprocessor ground is not common to the device
ground. This shift not varies if more than one HSD shares the same diode/resistor network.
3.2 Load dump protection
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the
V
maximum DC rating. The same applies if the device is subject to transients on the VCC
CC
line that are greater than the ones shown in the ISO 7637-2: 2004(E) table.
3.3 MCU I/Os protection
If a ground protection network is used and negative transient are present on the VCC line,
the control pins are pulled negative. ST suggests to insert a resistor (R
the microcontroller I/O pins from latching-up.
The value of these resistors is a compromise between the leakage current of microcontroller
and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of
microcontroller I/Os:
if the device drives an
GND
) in line to prevent
prot
-V
CCpeak/Ilatchup
≤ R
prot
Calculation example:
For V
5kΩ ≤ R
CCpeak
prot
≤ 180kΩ
= - 100V and I
Recommended values: R
≤ (V
OHμC-VIH-VGND
≥ 20mA; V
latchup
=10kΩ, C
prot
EXT
) / I
IHmax
OHµC
=10nF.
≥ 4.5V
Doc ID 022490 Rev 425/37
Page 26
Application informationVND5E025AS-E
Main MOSn
41V
OUTn
I
Loff2r
R
SENSE
R
PROT
To uC ADC
R
PD
R
PU
V
PU
Pwr_Lim
V
SENSE
PU_CMD
Overtemperature
OL OFF
+
-
V
OL
CURRENT
SENSEn
I
OUT/KX
I
SENSEH
V
BAT
I
Loff2f
V
SENSEH
Load
INPUTn
V
CC
GND
CS_DIS
3.4 Current sense and diagnostic
The current sense pin performs a double function (see Figure 33: Current sense and
diagnostic):
●Current mirror of the load current in normal operation, delivering a current
proportional to the load current according to a known ratio K
The current I
external resistor R
minimum (see parameter V
can be easily converted to a voltage V
SENSE
. Linearity between I
SENSE
SENSE
in Table 9: Current sense (8 V < VCC<18V)). The
OUT
and V
current sense accuracy depends on the output current (refer to current sense electrical
characteristics Table 9: Current sense (8 V < V
●Diagnostic flag in fault conditions, delivering a fixed voltage V
maximum current I
SENSEH
in case of the following fault conditions (refer to
<18V)).
CC
Table 11: Truth table):
–Power limitation activation
–Overtemperature
–Short to V
in off-state
CC
–Open-load in off-state with additional external components.
A logic level high on the CS_DIS pin sets at the same time all the current sense pins of the
device in a high impedance state, thus disabling the current monitoring and diagnostic
detection. This feature allows multiplexing of the microcontroller analog inputs by sharing of
sense resistance and ADC line among different devices.
.
X
by means of an
SENSE
is ensured up to 5V
SENSE
SENSEH
up to a
Figure 33. Current sense and diagnostic
26/37Doc ID 022490 Rev 4
Page 27
VND5E025AS-EApplication information
VVIRV
OLfoffLPD
OFFupPull
OUT
2
min)2(
_
=<⋅=
−
VV
RR
IRRVR
V
OL
PDPU
roffLPDPUPUPD
ONupPull
OUT
4
max
)2(
_
=>
+
=
−
3.4.1 Short to VCC and off-state open-load detection
Short to V
A short circuit between V
V
SENSEH
CC
and output is indicated by the relevant current sense pin set to
CC
during the device off-state. Little or no current is delivered by the current sense
during the on-state depending on the nature of the short circuit.
Off-state open-load with exte rnal circuitry
Detection of an open-load in off mode requires an external pull-up resistor (R
the output to a positive supply voltage V
It is preferable that V
is switched off during the module standby mode to avoid an increase
PU
PU
.
) connecting
PU
in overall standby current consumption in normal conditions, that is, when the load is
connected.
An external pull-down resistor (R
) connected between output and GND is mandatory to
PD
avoid misdetection in case of floating outputs in off-state (see Figure 33: Current sense and
diagnostic).
R
must be selected in order to ensure V
PD
OUT < VOLmin
unless pulled up by the external
circuitry:
R
≤ 22 KΩ is recommended.
PD
For proper open-load detection in off-state, the external pull-up resistor must be selected
according to the following formula:
For the values of V
(8 V < V
CC
<18V).
OLmin,VOLmax, IL(off2)r
and I
⋅⋅−⋅
see Table 10: Open-load detection
L(off2)f
Doc ID 022490 Rev 427/37
Page 28
Application informationVND5E025AS-E
1
10
100
0,1110100L (mH)
I (A)
DemagnetizationDemagnetizationDemagnetization
t
V
IN
, I
L
C:
T
jstart
= 125°C repetitive pulse
A:
T
jstart
= 150°C single pulse
B: T
jstart
= 100°C repetitive pulse
A
B
C
3.5 Maximum demagnetization energy (VCC=13.5V)
Figure 34. Maximum turn-off current versus inductance (for each channel)
1. Values are generated with RL=0 Ω.
In case of repetitive pulses, T
exceed the temperature specified above for curves A and B.
(at the beginning of each demagnetization) of every pulse must not
jstart
28/37Doc ID 022490 Rev 4
Page 29
VND5E025AS-EPackage and thermal data
("1($'5
57+MDPE
57+MDPE
24(J?AMB#7
0#"#UHEATSINKAREACM>
'!0'2)
4 Package and thermal data
4.1 SO-16L thermal data
Figure 35. SO-16L PC board
1. Layout condition of Rth and Zth measurements (PCB: Double Layers, Thermal Vias, FR4 area
77 mm x 86 mm, PCB thickness = 1.6 mm, Cu thickness = 70 µm (front and back side), Copper area from
minimum pad lay- out to 24 cm
2
).
Figure 36. R
thj-amb
on)
vs PCB copper area in open box free air condition (one channel
Doc ID 022490 Rev 429/37
Page 30
Package and thermal dataVND5E025AS-E
7LPHV
=7+ &:
&X FP
&X FP
&X IRRWSULQW
'!0'2)
Z
THδ
R
TH
δZ
THtp
1δ–()+⋅=
'!0'2)
Figure 37.SO-16 L thermal impedance junction to ambient single pulse (one channel
on)
Equation 1: pulse calculation formula
where δ = tP/T
Figure 38. Thermal fitting model of a double channel HSD in SO-16L
1. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
(1)
30/37Doc ID 022490 Rev 4
Page 31
VND5E025AS-EPackage and thermal data
Table 15.Thermal parameters
Area/Island (cm2)Footprint28
R1 (°C/W)0.28
R2 (°C/W)1.2
R3 (°C/W)4
R4 (°C/W)866
R5 (°C/W)141313
R6 (°C/W)282014.5
R7 (°C/W)0.28
R8 (°C/W)1.2
C1 (W.s/°C)0.001
C2 (W.s/°C)0.005
C3 (W.s/°C)0.1
C4 (W.s/°C)0.5
C5 (W.s/°C)11.51.5
C6 (W.s/°C)3912
C7 (W.s/°C)0.001
C8 (W.s/°C)0.005
Doc ID 022490 Rev 431/37
Page 32
Package and packing informationVND5E025AS-E
("1($'5
5 Package and packing information
5.1 ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
5.2 Package mechanical data
Figure 39. SO-16L package dimensions
.
32/37Doc ID 022490 Rev 4
Page 33
VND5E025AS-EPackage and packing information
T able 16.SO-16L mechanical data
Millimeters
Symbol
MinTypMax
A2.352.65
A10.100.30
B0.330.51
C0.230.32
D10.1010.50
E7.407.60
e1.27
H10.0010.65
h0.250.75
L0.401.27
k0°8°
ddd0.10
Doc ID 022490 Rev 433/37
Page 34
Package and packing informationVND5E025AS-E
5.3 Packing information
Figure 40. SO-16L tube shipment (no suffix)
"ASE1TY
K1T Y
"UL
#
"
4UBELE NGTH
!
"
#
!
!LLDIMENSIONSAREINMM
Figure 41. SO-16L tape and reel shipment (suffix “TR”)
("1($'5
34/37Doc ID 022490 Rev 4
Page 35
VND5E025AS-EOrder codes
6 Order codes
T a ble 17.Device summary
Order codes
Package
TubeTape and reel
SO-16LVND5E025AS-EVND5E025ASTR-E
Doc ID 022490 Rev 435/37
Page 36
Revision historyVND5E025AS-E
7 Revision history
Table 18.Document revision history
DateRevisionChanges
11-Nov-20111Initial release.
19-Dec-20112Updated Figure 2.
13-Mar-20123Added Section 4: Package and thermal data.
19-Jun-20124Updated Table 4: Thermal data
36/37Doc ID 022490 Rev 4
Page 37
VND5E025AS-E
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