Page 1
Features
Parameters Symbol Value
VND5004B-E
VND5004BSP30-E
Double 4mΩ high side driver with analog current sense
for automotive applications
PQFN
12x12 Power lead-less
Max transient supply voltage V
Operating voltage range V
Max on-state resistance R
Current limitation (typ) I
Off-state supply current I
1. Typical value with all loads connected.
■ General
– Inrush current active management by
power limitation
– Very low standby current
– 3.0 V CMOS compatible input
– Optimized electromagnetic emission
– Very low electromagnetic susceptibility
– In compliance with the 2002/95/EC
European directive
■ Diagnostic functions
– Proportional load current sense
– Current sense disable
– Thermal shutdown indication
■ Protection
– Undervoltage shutdown
– Overvoltage clamp
– Load current limitation
– Thermal shutdown
– Self limiting of fast thermal transients
– Protection against loss of ground and loss
of V
CC
Table 1. Devices summary
Package
PQFN-12x12 power lead-less - VND5004BTR-E VND5004B-E
MultiPowerSO-30 VND5004BSP30-E VND5004BSP30TR-E -
CC
CC
ON
LIMH
S
41 V
4.5 to 28 V
MultiPowerSO-30
4mΩ
100 A
2µA
(1)
– Reverse battery protection with self switch
on of the Power MOSFET
(see Figure 22)
– Electrostatic discharge protection
application
■ All types of resistive, inductive and capacitive
loads
■ Suitable for power management applications
Description
The VND5004BTR-E and VND5004BSP30-E are
devices made using STMicroelectronics VIPower
technology. They are intended for driving resistive
or inductive loads with one side connected to
ground. Active V
dump protection circuit protect the devices
against transients on the Vcc pin (see ISO7637
transient compatibility table). These devices
integrate an analog current sense which delivers
a current proportional to the load current
(according to a known ratio) when CS_DIS is
driven low or left open. When CS_DIS is driven
high, the CURRENT SENSE pin is high
impedance. Output current limitation protects the
devices in overload condition. In case of long
duration overload, the devices limit the dissipated
power to a safe level up to thermal shutdown
intervention. Thermal shutdown with automatic
restart allows the device to recover normal
operation as soon as a fault condition disappears.
Order codes
Tube Tape and reel Tray
pin voltage clamp and load
CC
May 2009 Doc ID 15702 Rev 1 1/33
www.st.com
1
Page 2
Contents VND5004B-E, VND5004BSP30-E
Contents
1 Block diagram and pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.1 Microcontroller I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.3 Maximum demagnetization energy (VCC = 13.5 V) . . . . . . . . . . . . . . . . . 19
4 Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 MultiPowerSO-30 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.2 PQFN - 12x12 power lead-less thermal data . . . . . . . . . . . . . . . . . . . . . . 22
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.2 MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.3 PQFN - 12x12 power lead-less mechanical data . . . . . . . . . . . . . . . . . . . 27
5.4 MultiPowerSO-30 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.5 PQFN - 12x12 power lead-less packing information . . . . . . . . . . . . . . . . 30
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
2/33 Doc ID 15702 Rev 1
Page 3
VND5004B-E, VND5004BSP30-E List of tables
List of tables
Table 1. Devices summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 7. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 8. Electrical transient requirements (part 1/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 9. Electrical transient requirements (part 2/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 10. Electrical transient requirements (part 3/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 11. Thermal parameters for MultiPowerSO-30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 12. Thermal parameters for PQFN - 12x12 power lead-less . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 13. MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 14. PQFN - 12x12 power lead-less mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 15. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Doc ID 15702 Rev 1 3/33
Page 4
List of figures VND5004B-E, VND5004BSP30-E
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (not in scale) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 5. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 7. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 10. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 11. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 12. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 13. On-state resistance vs T
Figure 14. On-state resistance vs V
Figure 15. Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 16. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 17. I
LIMH
vs T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
case
Figure 18. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 19. CS_DIS high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 20. CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 21. CS_DIS low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 22. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 23. Maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 24. MultiPowerSO-30 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 25. Rthj-amb vs PCB copper area in open box free air condition (one channel on). . . . . . . . . 20
Figure 26. MultiPowerSO-30 thermal impedance junction ambient single pulse (one channel on). . . 21
Figure 27. Thermal fitting model of a double channel HSD in MultiPowerSO-30 . . . . . . . . . . . . . . . . 21
Figure 28. 12x12 Power lead-less package PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 29. Rthj-amb vs PCB copper area in open box free air condition (one channel on). . . . . . . . . 23
Figure 30. PQFN - 12x12 power lead-less package thermal impedance junction ambient single pulse
(one channel on) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 31. Thermal fitting model of a double channel HSD in PQFN - 12x12 power lead-less . . . . . 24
Figure 32. MultiPowerSO-30 outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 33. PQFN - 12x12 power lead-less outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 34. MultiPowerSO-30 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 35. MultiPowerSO-30 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 36. PQFN - 12x12 power lead-less tray shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 37. PQFN - 12x12 power lead-less tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . 31
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
case
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
CC
4/33 Doc ID 15702 Rev 1
Page 5
VND5004B-E, VND5004BSP30-E Block diagram and pin configurations
1 Block diagram and pin configurations
Figure 1. Block diagram
V
CC
V
CC
clamp
GND
Reverse
battery
protection
INPUT1
INPUT2
CS_DIS
Table 2. Pin functions
Name Function
V
CC
Battery connection
OUTPUT1,2 Power output
GND Ground connection
Under
voltage
LOGIC
Pwr
Pwr
LIM
LIM
DRIVER
Overtemp.
DRIVER
Overtemp.
PwCLAMP
I
I
OUT1
CS_DIS
PwCLAMP
I
I
OUT2
CS_DIS
LIM
LIM
OUTPUT1
K
CURRENT
SENSE1
OUTPUT2
K
CURRENT
SENSE2
INPUT1,2
Voltage controlled input pin with hysteresis, CMOS compatible. Controls
output switch state
CURRENT SENSE1,2 Analog current sense pin, delivers a current proportional to the load current
CS_DIS Active high CMOS compatible pin, to disable the current sense pins
Doc ID 15702 Rev 1 5/33
Page 6
Block diagram and pin configurations VND5004B-E, VND5004BSP30-E
Figure 2. Configuration diagram (not in scale)
1 NC
2 NC
3 NC
4 GND
5 CS_DIS
6 CURRENT SENSE 2
7 CURRENT SENSE 1
8 INPUT 2
9 INPUT 1
10 NC
11 NC
12 NC
13 FOR TEST ONLY
14 V
CC
15 OUTPUT 1
PQFN -12x12 Power
less
lead -
(bottom view)
11
10
9
8
7
6
5
4
3
2
1
12
13
15
14
16
16 OUTPUT 2
V
CC
NC
1
FOR TEST ONLY
NC
NC
GND
CURRENT SENSE 2
CS_DIS
CURRENT SENSE 1
INPUT 2
V
CC
Heat Slug1
INPUT 1
NC
FOR TEST ONLY
NC
V
CC
Table 3. Suggested connections for unused and not connected pins
15 16
30
V
CC
OUTPUT 2
OUTPUT 2
OUTPUT 2
OUTPUT 2
OUTPUT 2
OUTPUT 2
NC
OUTPUT 1
OUTPUT 1
MultiPowerSO-30
(top view)
OUTPUT 1
OUTPUT 1
OUTPUT 1
OUTPUT 1
V
CC
Connection/pin Current sense N.C. Output Input CS_DIS For test only
Floating Not allowed X X X X X
To ground
Through 1 kΩ
resistor
X
Not
allowed
Through
10 kΩ resistor
Through
10 kΩ resistor
Not allowed
6/33 Doc ID 15702 Rev 1
Page 7
VND5004B-E, VND5004BSP30-E Electrical specifications
2 Electrical specifications
Figure 3. Current and voltage conventions
I
S
V
CC
V
CC
I
CSD
I
V
IN1,2
IN1,2
V
CSD
CS_DIS
INPUT1,2
2.1 Absolute maximum ratings
Stress values that exceed those listed in the “Absolute maximum ratings” table can cause
permanent damage to the device. These are stress ratings only, and operation of the device
at these, or any other conditions greater than those, indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics sure
program and other relevant quality documents.
Table 4. Absolute maximum ratings
Symbol Parameter Value Unit
OUTPUT1,2
CURRENT
SENSE1,2
GND
I
GND
I
OUT1,2
I
SENSE1,2
V
SENSE1,2
V
OUT1,2
V
CC
V
CCPK
-V
I
OUT
- I
OUT
I
IN
I
CSD
V
CSENSE
CC
DC supply voltage 28 V
Transient supply voltage (T<400 ms, R
>0.5 Ω) 41 V
load
Reverse DC supply voltage 16 V
DC output current Internally limited A
Reverse DC output current 70 A
DC input current -1 to 10 mA
DC current sense disable input current -1 to 10 mA
Current sense maximum voltage (Vcc>0 V)
Vcc-41
+V
CC
V
V
Maximum switching energy (single pulse)
E
V
MAX
ESD
(L=0.3 mH; R
= I
I
OUT
limL
(typ.))
=0 Ω; V
L
=13.5 V; T
bat
jstart
=150 ºC;
Electrostatic discharge (Human Body Model: R=1.5 kΩ;
C=100 pF)
342 mJ
2000 V
Doc ID 15702 Rev 1 7/33
Page 8
Electrical specifications VND5004B-E, VND5004BSP30-E
Table 4. Absolute maximum ratings (continued)
Symbol Parameter Value Unit
V
T
ESD
T
STG
Charge device model (CDM-AEC-Q100-011) 750 V
Junction operating temperature -40 to 150 °C
j
Storage temperature -55 to 150 °C
2.2 Thermal data
Table 5. Thermal data
Symbol Parameter
R
thj-case
R
thj-amb
1. PCB FR4 area 58 mmx58 mm, PCB thickness 2 mm, Cu thickness 35 µm, minimum pad layout.
2. PCB FR4 area 78 mmx78 mm, PCB thickness 2 mm, Cu thickness 35 µm, minimum pad layout.
Thermal resistance junction-case (MAX)
(with one channel ON)
Thermal resistance junction-ambient (MAX) 58
Value
MultiPowerSO-30 12x12 PLLP
0.35 0.35 °C/W
(1)
39
(2)
Unit
°C/W
8/33 Doc ID 15702 Rev 1
Page 9
VND5004B-E, VND5004BSP30-E Electrical specifications
2.3 Electrical characteristics
Values specified in this section are for 8 V<VCC<24 V, -40 °C<Tj<150 °C, unless otherwise
stated.
Table 6. Electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
Power section
V
CC
V
USD
V
USDhyst
R
ON
R
ON REV
V
clamp
I
S
I
L(off)
Switching (V
t
d(on)
t
d(off)
(dV
/dt)onTurn-on voltage slope RL= 0.87 Ω
OUT
Operating supply
voltage
Undervoltage
shutdown
Undervoltage
shutdown hysteresis
I
=15 A; Tj=25 °C
On-state
resistance
R
dson
(1)
in reverse
battery condition
OUT
=15 A; Tj=150 °C
I
OUT
I
=15 A; VCC=5 V; Tj=25 °C
OUT
=-13 V; I
V
CC
VCC clamp voltage ICC=20 mA; I
Off-state; V
Supply current
V
IN=VOUT=VSENSE=VCSD
On-state; VCC=13 V; VIN=5 V; I
Off-state output
(1)
current
= 13V; Tj= 25°C)
CC
VIN=V
V
IN=VOUT
OUT
=-15 A; Tj=25 °C 4 mΩ
OUT
=0 A 41 46 52 V
OUT1,2
=13 V; Tj=25 °C;
CC
=0 V
=0 A
OUT
=0 V; VCC=13 V; Tj=25 °C
=0 V; VCC=13 V; Tj=125 °C
4.5 13 28 V
3.5 4.5 V
0.5 V
4
mΩ
8
mΩ
6
mΩ
(2)
2
3.5
0
0.01 3
0
(2)
5
µA
6
mA
µA
5
Turn-on delay time RL= 0.87 Ω (see Figure 5)25µs
Turn-on delay time RL= 0.87 Ω (see Figure 5)35µs
See
Figure 16
V/µs
/dt)
(dV
OUT
off
W
ON
W
OFF
Logic inputs
V
IL1,2
I
IL1,2
V
IH1,2
Turn-off voltage slope RL= 0.87 Ω
Switching energy
losses during t
won
Switching energy
losses during t
woff
RL= 0.87 Ω (see Figure 5)5.4mJ
RL= 0.87 Ω (see Figure 5)2.3mJ
Input low level
voltage
Low level input
current
=0.9 V 1 µA
V
IN
Input high level
voltage
Doc ID 15702 Rev 1 9/33
See
Figure 18
V/µs
0.9 V
2.1 V
Page 10
Electrical specifications VND5004B-E, VND5004BSP30-E
Table 6. Electrical characteristics (continued)
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
IH1,2
V
I(hyst)1,2
V
ICL1,2
V
CSDL
I
CSDL
V
CSDH
I
CSDH
V
CSD(hyst)
V
CSCL
High level input
current
Input hysteresis
voltage
Input clamp voltage
CS_DIS low level
voltage
Low level CS_DIS
current
CS_DIS high level
voltage
High level CS_DIS
current
CS_DIS hysteresis
voltage
CS_DIS clamp
voltage
Protections and diagnostics
I
limH
Short circuit current
Short circuit current
I
limL
during thermal
cycling
T
TSD
T
T
T
HYST
V
DEMAG
R
RS
Shutdown
temperature
Reset temperature TRS+1 TRS+5 °C
Thermal reset of
STATUS
Thermal hysteresis
TSD-TR
)
(T
Turn-off output
voltage clamp
(3)
=2.1 V 10 µA
V
IN
0.25 V
IIN=1 mA
IIN=-1 mA
5.5
7V
-0.7
0.9 V
=0.9 V 1 µA
V
CSD
2.1 V
V
=2.1 V 10 µA
CSD
0.25 V
=1 mA
I
CSD
=-1 mA
I
CSD
V
=13 V
CC
5V<V
V
<24 V
CC
=13 V; TR<Tj<T
CC
TSD
5.5
-0.7
70 100 140
40 A
7V
140
150 175 200 °C
135 °C
7°C
=2 A; VIN=0; L=6 mH VCC-28 VCC-32 VCC-35 V
I
OUT
V
V
A
A
Current sense (8 V<V
K
0
K
1
I
OUT/ISENSE
I
OUT/ISENSE
CC
<16 V)
I
=10 A; V
OUT
= -40°C...150°C
T
j
= 25 °C...150 °C
T
j
I
=15 A; V
OUT
= -40°C...150°C
T
j
T
= 25 °C...150 °C
j
SENSE
SENSE
10/33 Doc ID 15702 Rev 1
=4 V; V
=4 V; V
CSD
CSD
=0 V;
=0 V;
7500
11000
10300
12500
16000
16000
16000
16000
23000
20900
19500
19500
Page 11
VND5004B-E, VND5004BSP30-E Electrical specifications
Table 6. Electrical characteristics (continued)
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
K
2
I
SENSE0
V
SENSE
V
SENSEH
I
SENSEH
t
DSENSE1H
t
DSENSE1L
I
OUT/ISENSE
Analog sense current
Max analog sense
output voltage
Analog sense output
voltage in over
temperature
condition
Analog sense output
current in over
temperature
condition
Delay response time
from falling edge of
CS_DIS pin
Delay response time
from rising edge of
CS_DIS pin
=30A; V
OUT
= -40°C...150°C
T
j
= 25°C...150°C
T
j
I
=0 A; V
OUT
=5 V; VIN=0 V; Tj=-40 °C to 150 °C
V
CSD
V
=0 V; VIN=5 V; Tj=-40 °C to 150°C00
CS D
=45 A; V
I
OUT
=13 V; R
V
CC
Vcc=13 V; V
V
I
<4 V, 5 A<Iout<30 A
SENSE
=90% of I
SENSE
(see Figure 4)
V
I
<4V, 5A<Iout<30A
SENSE
=10% of I
SENSE
(see Figure 4)
SENSE
SENSE
=4V; V
=0 V;
CSD
=0V;
12400
14000
16500
16500
19000
19000
5
400µAµA
=0 V; R
CSD
=3.9 kΩ 9V
SENSE
=5 V 8 mA
SENSE
SENSE max
SENSE max
=3.9 kΩ 5V
SENSE
50 100 µs
520µs
t
DSENSE2H
t
DSENSE2L
Delay response time
from rising edge of
INPUT pin
Delay response time
from falling edge of
INPUT pin
V
I
(see Figure 4)
V
I
(see Figure 4)
<4V, 5A<Iout<30A
SENSE
=90% of I
SENSE
<4V, 5A<Iout<30A
SENSE
=10% of I
SENSE
SENSE max
SENSE max
270 600 µs
100 250 µs
1. For each channel.
2. PowerMOS leakage included.
3. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals
must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must
limit the duration and number of activation cycles.
Figure 4. Current sense delay characteristics
INPUT
CS_DIS
LOAD CURRENT
SENSE CURRENT
t
DSENSE2H
t
DSENSE1L
t
DSENSE1H
t
DSENSE2L
Doc ID 15702 Rev 1 11/33
Page 12
Electrical specifications VND5004B-E, VND5004BSP30-E
Figure 5. Switching characteristics
V
OUT
dV
OUT
/dt
(on)
t
Won
80%
t
r
10%
t
Woff
90%
t
f
dV
OUT
/dt
(off)
t
INPUT
Table 7. Truth table
Conditions Input
Normal operation
Over temperature
Undervoltage
Short circuit to GND
≤ 10 mΩ)
(R
SC
Short circuit to V
CC
t
d(on)
t
d(off)
n
L
H
L
H
L
H
L
H
H
L
H
Output
L
H
L
L
L
L
L
L
L
H
H
n
SENSEn (V
(see Figure 4)
Nominal
V
SENSEH
0 if T
V
SENSEH
< Nominal
Negative output voltage clamp L L 0
t
=0 V)
CSD
0
0
0
0
0
< T
j
TSD
if Tj > T
0
TSD
(1)
1. If V
is high, the SENSE output is at a high impedance. Its potential depends on leakage currents and
CSD
the external circuit.
12/33 Doc ID 15702 Rev 1
Page 13
VND5004B-E, VND5004BSP30-E Electrical specifications
Table 8. Electrical transient requirements (part 1/3)
ISO 7637-2:
2004(E)
test pulse
Test levels
(1)
Number of
pulses or
III IV
test times
1 -75 V -100 V 5000 pulses 0.5 s 5 s 2 ms, 10 Ω
2a +37 V +50 V 5000 pulses 0.2 s 5 s 50 µs, 2 Ω
3a -100 V -150 V 1h 90 ms 100 ms 0.1 µs, 50 Ω
3b +75 V +100 V 1h 90 ms 100 ms 0.1 µs, 50 Ω
4 -6 V -7 V 1 pulse 100 ms, 0.01 Ω
(2)
5b
Table 9. Electrical transient requirements (part 2/3)
ISO 7637-2: 2004(E)
test pulse
+65 V +87 V 1 pulse 400 ms, 2 Ω
Test level results
III IV
1C C
2a C C
3a C C
Burst cycle/pulse repetition
time
(1)
Delays and
impedance
3b C C
4C C
(2) (3)
5b
1. The above test levels must be considered referred to VCC = 13.5 V except for pulse 5b
2. Valid in case of external load dump clamp: 40V maximum referred to ground.
3. Suppressed load dump (pulse 5b) is withstood with a minimum load connected as specified in Table 4.: Absolute maximum
ratings.
Table 10. Electrical transient requirements (part 3/3)
CC
Class Contents
C All functions of the device are performed as designed after exposure to disturbance.
E
One or more functions of the device are not performed as designed after exposure to
disturbance and cannot be returned to proper operation without replacing the device.
Doc ID 15702 Rev 1 13/33
Page 14
Electrical specifications VND5004B-E, VND5004BSP30-E
Figure 6. Waveforms
NORMAL OPERATION
INPUTn
CS_DIS
LOAD CURRENTn
SENSE CURRENTn
UNDERVOLTAGE
V
V
CC
INPUTn
CS_DIS
LOAD CURRENTn
SENSE CURRENTn
V
USD
USDhyst
INPUTn
CS_DIS
LOAD VOLTAGEn
LOAD CURRENTn
SENSE CURRENTn
T
j
T
R
INPUTn
CS_DIS
LOAD CURRENTn
SENSE CURRENTn
T
TSD
T
RS
current
limitation
OUTPUT SHORT TO V
<Nominal
OVERLOAD OPERATION
power
limitation
CC
<Nominal
I
LIMH
I
LIML
V
SENSEH
thermal cycling
SHORTED LOAD NORMAL LOAD
14/33 Doc ID 15702 Rev 1
Page 15
VND5004B-E, VND5004BSP30-E Electrical specifications
2.4 Electrical characteristics curves
Figure 7. Off-state output current Figure 8. High level input current
Iloff (uA)
6
5.4
4.8
4.2
3.6
3
2.4
1.8
1.2
0.6
0
-50 -25 0 25 50 75 100 125 150 175
Off State
Vcc=13V
Vin=Vout=0V
Tc ( °C )
Iih (uA)
5
4.5
3.5
2.5
1.5
0.5
Vin=2.1V
4
3
2
1
0
-50 -25 0 25 50 75 100 125 150 175
Tc (° C)
Figure 9. Input clamp voltage Figure 10. Input low level
Vicl (V)
7
6.75
6.5
6.25
6
5.75
5.5
5.25
5
Iin=1mA
-50 -25 0 25 50 75 100 125 150 175
Tc ( °C )
Vil (V)
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
-50 -25 0 25 50 75 100 125 150 175
Tc (° C)
Figure 11. Input high level Figure 12. Input hysteresis voltage
Vih (V)
4
3.5
3
2.5
2
1.5
1
0.5
0
-50 -25 0 25 50 75 100 125 150 175
Tc (° C)
Doc ID 15702 Rev 1 15/33
Vihyst (V)
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-50 -25 0 25 50 75 100 125 150 175
Tc ( °C )
Page 16
Electrical specifications VND5004B-E, VND5004BSP30-E
Figure 13. On-state resistance vs T
Ron (mOhm)
6
5.4
4.8
4.2
3.6
3
2.4
1.8
Iout=15A
Vcc=13V
-50 -25 0 25 50 75 100 125 150 175
Tc (° C)
case
Figure 14. On-state resistance vs V
Ron (mOhm)
6
5.4
4.8
4.2
3.6
3
2.4
1.8
0 4 8 12 16 20 24 28
Tc=150°C
Tc=125°C
Tc=2 5°C
Tc=-40°C
Vcc
Figure 15. Undervoltage shutdown Figure 16. Turn-on voltage slope
Vusd (V)
16
14
12
10
8
6
4
2
0
-50 -25 0 25 50 75 100 125 150 175
Tc ( °C )
(dVout/dt)on (V/ms)
500
450
400
350
300
250
200
150
100
50
0
Vcc=13V
RI=0.87Ohm
-50-250 255075100125150175
Tc ( °C )
CC
Figure 17. I
LIMH
vs T
case
Ilimh (A)
150
140
130
120
110
100
90
80
70
60
50
Vcc=13V
-50-250 255075100125150175
Tc ( °C )
16/33 Doc ID 15702 Rev 1
Figure 18. Turn-off voltage slope
(dVout/dt)off (V/ms)
500
450
400
350
300
250
200
150
100
50
Vcc=13V
RI=0.87Ohm
0
-50 -25 0 25 50 75 100 125 150 175
Tc ( °C )
Page 17
VND5004B-E, VND5004BSP30-E Electrical specifications
Figure 19. CS_DIS high level voltage Figure 20. CS_DIS clamp voltage
Vcsdh (V)
4
3.5
3
2.5
2
1.5
1
0.5
0
-50 -25 0 25 50 75 100 125 150 175
Tc (° C)
Figure 21. CS_DIS low level voltage
Vcsdl (V)
4
3.5
3
2.5
2
1.5
1
0.5
0
-50 -25 0 25 50 75 100 125 150 175
Tc (° C)
Vcsdcl (V)
8
7.5
7
6.5
6
5.5
5
4.5
4
-50 -25 0 25 50 75 100 125 150 175
Tc (° C)
Doc ID 15702 Rev 1 17/33
Page 18
Application information VND5004B-E, VND5004BSP30-E
3 Application information
Figure 22. Application schematic
+5V
MCU
R
prot
R
prot
R
prot
R
SENSE
C
ext
CS_DIS
INPUT
CURRENT SENSE
45V
3.1 Microcontroller I/Os protection
When negative transients are present on the VCC line, the control pins will be pulled
negative to approximately -1.5 V.
ST suggests the insertion of resistors (R
latching up.
) in the lines to prevent the µC I/Os pins from
prot
GND
V
20V
CC
OUTPUT
D
ld
The values of these resistors provide a compromise between the leakage current of the µC,
the current required by the HSD I/Os (input levels compatibility) and the latch-up limit of the
µC I/Os.
-V
CCpeak/Ilatchup
≤ R
prot
≤ (V
OHµC-VIH
Calculation example:
For V
75 Ω ≤ R
Recommended values: R
CCpeak
prot
= - 1.5 V and I
≤ 240 kΩ.
latchup
=10 kΩ, C
prot
≥ 20 mA; V
3.2 Load dump protection
18/33 Doc ID 15702 Rev 1
Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the
V
max rating. The same applies if the device will be subject to transients on the VCC
CCPK
line that are greater than the ones shown in the ISO 7637-2: 2004(E) table.
) / I
IHmax
EXT
OHµC
=
10 nF
≥ 4.5 V
Page 19
VND5004B-E, VND5004BSP30-E Application information
3.3 Maximum demagnetization energy (VCC = 13.5 V)
Figure 23. Maximum turn-off current versus inductance
100
A
B
C
10
I (A)
1
1 10 100L (mH)
VIN, I
A: T
B: T
C: T
L
= 150°C single pulse
jstart
= 100°C repetitive pulse
jstart
= 125°C repetitive pulse
jstart
Note: Values are generated with R
In case of repetitive pulses, T
must not exceed the temperature specified above for curves A and B.
Demagnetization Demagnetization Demagnetization
= 0 Ω.
L
(at beginning of each demagnetization) of every pulse
jstart
t
Doc ID 15702 Rev 1 19/33
Page 20
Package and PC board thermal data VND5004B-E, VND5004BSP30-E
4 Package and PC board thermal data
4.1 MultiPowerSO-30 thermal data
Figure 24. MultiPowerSO-30 PC board
Note: Layout condition of R
area= 58 mm x 58 mm, PCB thickness=2 mm, Cu thickness=70 µm (front and back side),
Copper areas: from minimum pad lay-out to 4 cm
Figure 25.
RTHj_amb(°C/W)
R
thj-amb
60
55
50
45
40
35
012345
and Zth measurements (PCB: Double layer, Thermal Vias, FR4
th
2
).
vs PCB copper area in open box free air condition (one channel on)
PCB Cu heatsink area (cm^2)
20/33 Doc ID 15702 Rev 1
Page 21
VND5004B-E, VND5004BSP30-E Package and PC board thermal data
Figure 26. MultiPowerSO-30 thermal impedance junction ambient single pulse (one
channel on)
ZT H ( °C /W)
1000
100
Footprint
4 cm
10
1
0.1
0.01
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
Figure 27. Thermal fitting model of a double channel HSD in MultiPowerSO-30
2
(a)
a. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
Doc ID 15702 Rev 1 21/33
Page 22
Package and PC board thermal data VND5004B-E, VND5004BSP30-E
Equation 1: pulse calculation formula
Z
THδ
where δ = t
Table 11. Thermal parameters for MultiPowerSO-30
R
TH
P
δ Z
/T
THtp
1 δ–()+⋅=
Area/island (cm2)Footprint4
R1 (°C/W) 0.05
R2 (°C/W) 0.3
R3 (°C/W) 0.5
R4 (°C/W) 1.3
R5 (°C/W) 14
R6 (°C/W) 44.7 23.7
R7 (°C/W) 0.05
R8 (°C/W) 0.3
C1 (W.s/°C) 0.005
C2 (W.s/°C) 0.008
C3 (W.s/°C) 0.01
C4 (W.s/°C) 0.3
C5 (W.s/°C) 0.6
C6 (W.s/°C) 5 11
C7 (W.s/°C) 0.005
C8 (W.s/°C) 0.008
4.2 PQFN - 12x12 power lead-less thermal data
Figure 28. 12x12 Power lead-less package PC board
Note: Layout condition of R
area= 78 mm x 78 mm, PCB thickness=2mm, Cu thickness=70 µm (front and back side),
Copper areas: from minimum pad lay-out to 16 cm
and Zth measurements (PCB: Double layer, Thermal Vias, FR4
th
2
).
22/33 Doc ID 15702 Rev 1
Page 23
VND5004B-E, VND5004BSP30-E Package and PC board thermal data
Figure 29. R
50
45
40
35
30
25
20
0 5 10 15 20
thj-amb
on)
vs PCB copper area in open box free air condition (one channel
PCB Cu heatsink area (cm^ 2)
Figure 30. PQFN - 12x12 power lead-less package thermal impedance junction
ambient single pulse (one channel on)
100
Footprint
2
4 cm
2
8 cm
2
10
°C/W
1
0,1
0,001 0,01 0,1 1 10 100 1000time (s)
16 cm
Doc ID 15702 Rev 1 23/33
Page 24
Package and PC board thermal data VND5004B-E, VND5004BSP30-E
Figure 31.
Equation 2
Z
THδ
where δ = t
Table 12. Thermal parameters for PQFN - 12x12 power lead-less
Thermal fitting model of a double channel HSD in PQFN - 12x12 power lead-
(b)
less
: pulse calculation formula
R
TH
P
δ Z
/T
THtp
1 δ–()+⋅=
Area/island (cm2)Footprint 4 8 16
R1 (°C/W) 0.3
R2 (°C/W) 0.15
R3 (°C/W) 4.2
R4 (°C/W) 9.6 9.4 9.2 9
R5 (°C/W) 15.1 10.5 8.5 5.5
R6 (°C/W) 16.7 12 9 6
R7 (°C/W) 0.3
R8 (°C/W) 0.15
C1 (W.s/°C) 0.021
C2 (W.s/°C) 0.015
C3 (W.s/°C) 0.2
C4 (W.s/°C) 1.9 2.2 2.32 2.45
C5 (W.s/°C) 2.45 7.3 13.7 20
C6 (W.s/°C) 11.85 22 25 30
C7 (W.s/°C) 0.021
C8 (W.s/°C) 0.015
b. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
24/33 Doc ID 15702 Rev 1
Page 25
VND5004B-E, VND5004BSP30-E Package and packing information
5 Package and packing information
5.1 ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com
ECOPACK® is an ST trademark.
5.2 MultiPowerSO-30 mechanical data
Figure 32. MultiPowerSO-30 outline
.
Doc ID 15702 Rev 1 25/33
Page 26
Package and packing information VND5004B-E, VND5004BSP30-E
Table 13. MultiPowerSO-30 mechanical data
Millimeters
Symbol
Min. Typ. Max.
A 2.35
A2 1.85 2.25
A3 0 0.1
B 0.42 0.58
C 0.23 0.32
D 17.1 17.2 17.3
E 18.85 19.15
E1 15.9 16 16.1
“e” 1
F6 14.3
F7 5.45
F8 0.73
L 0.8 1.15
N10 Deg
S 0 Deg 7 Deg
26/33 Doc ID 15702 Rev 1
Page 27
VND5004B-E, VND5004BSP30-E Package and packing information
5.3 PQFN - 12x12 power lead-less mechanical data
Figure 33. PQFN - 12x12 power lead-less outline
Doc ID 15702 Rev 1 27/33
Page 28
Package and packing information VND5004B-E, VND5004BSP30-E
Table 14. PQFN - 12x12 power lead-less mechanical data
Symbol
Min. Typ. Max.
A2 2.2
A1 0 0.05
b 0.35 0.47
C0.50
D 11.90 12.10
Dh1 4.65 4.95
Dh2 10.45 10.65
Dh3 4.80 5
Dh4 4.80 5
E 11.90 12.10
Eh1 2.15 2.45
Millimeters
Eh2 5.15 5.45
Eh3 1.70 2
e1 0.90
e2 3.45
e3 1.10
f0.50
f1 0.60
L 0.75 0.95
L1 1.65 1.90
L2 0.76 0.78
M 11.10 11.30
N 11.10 11.30
v0.1
w0.05
y0.05
y1 0.1
28/33 Doc ID 15702 Rev 1
Page 29
VND5004B-E, VND5004BSP30-E Package and packing information
5.4 MultiPowerSO-30 packing information
The devices can be packed in tube or tape and reel shipments (see the Devices summary
on page 1 for packaging quantities).
Figure 34. MultiPowerSO-30 tube shipment (no suffix)
Tube dimension
Dimension mm
A
C
B
Base Q.ty
Bulk Q.ty
Tube length (± 0.5)
A
B
C (± 0.13)
Figure 35. MultiPowerSO-30 tape and reel shipment (suffix “TR”)
Reel dimension
Dimension mm
Base Q.ty 1000
Bulk Q.ty 1000
A (max) 330
B (min) 1.5
C (± 0.2) 13
D (min) 20.2
G (+ 2 / -0) 32
N (min) 100
T (max) 38.4
29
435
532
3.82
23.6
0.8
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Description Dimension mm
Tape width W 32
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 24
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 2
Hole Position F (± 0.1) 14.2
Compartment Depth K (max) 2.2
End
Start
To p
cover
tape
500 mm min
Empty components pockets
User direction of feed
No componentsNo components Components
500 mm min
Doc ID 15702 Rev 1 29/33
Page 30
Package and packing information VND5004B-E, VND5004BSP30-E
5.5 PQFN - 12x12 power lead-less packing information
The devices can be packed in tray or tape and reel shipments (see the Devices summary on
page 1 for packaging quantities).
Figure 36. PQFN - 12x12 power lead-less tray shipment (no suffix)
30/33 Doc ID 15702 Rev 1
Tray information
Parameter
Base Q.ty 189
Bulk Q.ty 945
Page 31
VND5004B-E, VND5004BSP30-E Package and packing information
Figure 37. PQFN - 12x12 power lead-less tape and reel shipment (suffix “TR”)
Tape dimensions
Dimension mm
A0 ± 0.1 12.30
B0 ± 0.1 12.30
K0 ± 0.1 2.15
F ± 0.1 11.50
E ± 0.1 1.75
W ± 0.3 24
P2 ± 0.1 2
P0 ± 0.1 4
P1 ± 0.1 16
T ± 0.05 0.30
D1.50
D1 (min) 1.50
Reel dimensions
Dimension mm
Base Q.ty 1500
Bulk Q.ty 1500
A (max) 330
B (min) 1.5
C (± 0.2) 13
D (min) 20.2
G (+ 2 / -0) 32
N (min) 100
T (max) 38.4
Doc ID 15702 Rev 1 31/33
Page 32
Revision history VND5004B-E, VND5004BSP30-E
6 Revision history
Table 15. Document revision history
Date Revision Changes
13-May-2009 1 Initial release.
32/33 Doc ID 15702 Rev 1
Page 33
VND5004B-E, VND5004BSP30-E
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