Page 1
Features
Type R
VN610SP 10mΩ
DS(on)
(1)
I
OUT
45A
(1)
VN610SP
Single channel high-side solid state relay
V
CC
36V
10
1. Per each channel.
■ Output current: 45A
■ CMOS compatible inputs
■ Proportional load current sense
■ Under-voltage and over-voltage shutdown
■ Over-voltage clamp
■ Thermal shutdown
■ Current limitation
■ Very low standby power consumption
■ Protection against loss of ground and loss of
V
CC
■
Reverse battery protected
1
PowerSO-10
Description
The VN610SP is a monolithic device made using
STMicroelectronics VIPower M0-3 technology. It
is intended for driving resistive or inductive loads
with one side connected to ground.
Active V
against low energy spikes (see ISO7637 transient
compatibility table). This device integrates an
analog current sense which delivers a current
proportional to the load current (according to a
known ratio).
Active current limitation combined with thermal
shutdown and automatic restart protect the device
against over-load. Device automatically turns off
in case of ground pin disconnection.
pin voltage clamp protects the device
CC
Table 1. Device summary
Order codes
Package
Tube Tape and reel
PowerSO-10 VN610SP VN610SP13TR
July 2010 Doc ID 6236 Rev 4 1/26
www.st.com
1
Page 2
Contents VN610SP
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 16
3.1.1 Solution 1: a resistor in the ground line (RGND only) . . . . . . . . . . . . . . 16
3.1.2 Solution 2: a diode (D
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
) in the ground line . . . . . . . . . . . . . . . . . . . . 17
GND
3.3 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.4 Maximum demagnetization energy (V
= 13.5V) . . . . . . . . . . . . . . . . . . 18
CC
4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.1 PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.2 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.3 PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2/26 Doc ID 6236 Rev 4
Page 3
VN610SP List of tables
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 6. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 7. V
Table 8. Current sense (9V £ VCC £ 16V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 9. Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 10. Switching (V
Table 11. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 12. Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 13. Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 14. PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 15. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
- output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
CC
= 13V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
CC
Doc ID 6236 Rev 4 3/26
Page 4
List of figures VN610SP
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 5. I
OUT/ISENSE
Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 10. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 11. Over-voltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 12. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 13. I
LIM
vs T
Figure 14. On-state resistance vs V
Figure 15. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 16. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 17. On-state resistance vs T
Figure 18. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 19. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 20. Maximum turn-off current versus load inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 21. PowerSO-10 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 22. Rthj-amb Vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 19
Figure 23. Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 24. Thermal fitting model of a single channel in PowerSO-10 . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 25. PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 26. PowerSO-10 suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 27. PowerSO-10 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 28. PowerSO-10 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
versus I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
case
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
case
4/26 Doc ID 6236 Rev 4
Page 5
VN610SP Block diagram and pin description
1 Block diagram and pin description
Figure 1. Block diagram
V
CC
V
CC
CLAMP
DRIVER
GND
LOGIC
INPUT
OVERTEMP.
Figure 2. Configuration diagram (top view)
GROUND
INPUT
C. SENSE
N.C.
N.C.
6
7
8
9
10
OVERVOLTAGE
UNDERVOLTAGE
PwCLAMP
I
LIM
V
DSLIM
I
OUT
5
4
3
2
1
OUTPUT
K
CURRENT
SENSE
OUTPUT
OUTPUT
OUTPUT
OUTPUT
OUTPUT
11
V
CC
Table 2. Suggested connections for unused and not connected pins
Connection / pin Current sense N.C. Output Input
Floating X X X
To ground
Through 1KΩ
resistor
Doc ID 6236 Rev 4 5/26
X
Through 10KΩ
resistor
Page 6
Electrical specifications VN610SP
2 Electrical specifications
Figure 3. Current and voltage conventions
I
S
V
CC
I
OUT
I
SENSE
V
GND
OUTPUT
I
GND
I
IN
V
IN
INPUT
CURRENT SENSE
SENSE
V
F
V
OUT
V
CC
2.1 Absolute maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality document.
Table 3. Absolute maximum ratings
Symbol Parameter Value Unit
V
-V
- I
I
OUT
V
CSENSE
V
DC supply voltage 41 V
CC
Reverse supply voltage - 0.3 V
CC
DC reverse ground pin current - 200 mA
GND
Output current Internally limited A
I
Reverse output current - 50 A
R
Input current +/- 10 mA
I
IN
Current sense maximum voltage
Electrostatic discharge (human body model: R = 1.5KΩ;
C = 100pF)
- INPUT
ESD
- CURRENT SENSE
- OUTPUT
- V
CC
- 3
+ 15
4000
2000
5000
5000
V
V
V
V
V
V
6/26 Doc ID 6236 Rev 4
Page 7
VN610SP Electrical specifications
Table 3. Absolute maximum ratings (continued)
Symbol Parameter Value Unit
E
P
T
Maximum switching energy
MAX
(L = 0.05mH; R
Power dissipation at Tc ≤ 25°C 139 W
tot
T
Junction operating temperature Internally limited °C
j
Case operating temperature -40 to 150 °C
T
c
Storage temperature -55 to 150 °C
STG
= 0Ω; V
L
= 13.5V; T
bat
2.2 Thermal data
Table 4. Thermal data
Symbol Parameter Max. value Unit
R
thj-case
R
thj-amb
1. When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35 µm thick).
2. When mounted on a standard single-sided FR-4 board with 6 cm2 of Cu (at least 35 µm thick).
Thermal resistance junction-case 0.9 °C/W
Thermal resistance junction-ambient 50.9
2.3 Electrical characteristics
= 150ºC; IL = 75A)
jstart
(1)
193 mJ
(2)
36
°C/W
Values specified in this section are for 8V < V
< 36V; -40°C < Tj < 150°C, unless
CC
otherwise stated.
Table 5. P owe r
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
V
V
R
V
I
I
L(off1)
Operating supply
CC
voltage
Under-voltage shutdown 3 4 5.5 V
USD
Over-voltage shutdown 36 V
OV
I
= 1.5A; Tj = 25°C
OUT
On-state resistance
ON
Clamp voltage I
clamp
(1)
Supply current
S
Off-state output current V
= 1.5A; Tj = 150°C
I
OUT
I
OUT
CC
= 9A; V
= 20mA
= 6V
CC
(1)
41 48 55 V
Off-state; VCC=13V; VIN=V
Off-state; V
Tj=25°C
On-state; V
I
= 0A; R
OUT
= V
IN
=13V; VIN=V
CC
= 5V; V
IN
SENSE
= 0V 0 50 µA
OUT
= 13V;
CC
= 3.9kΩ
OUT
OUT
=0V
=0V;
5.5 13 36 V
10
20
35
101025
20
5
mΩ
mΩ
mΩ
µA
mA
mA
Doc ID 6236 Rev 4 7/26
Page 8
Electrical specifications VN610SP
Table 5. Power (continued)
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
L(off2)
I
L(off3)
I
L(off4)
1. V
Table 6. Protections
Off-state output current V
Off-state output current
Off-state output current
and VOV are correlated. Typical difference is 5V.
clamp
= 0V; V
IN
V
= V
IN
Tj =125°C
V
IN =VOUT
Tj = 25°C
= 3.5V -75 0 µA
OUT
=0V; VCC=13V;
OUT
= 0V; V
CC
= 13V;
5µA
3µA
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
T
T
HYST
V
demag
V
lim
TSD
T
R
ON
V
= 13V
DC short circuit current
CC
5.5V < V
CC
< 36V
Thermal shutdown
temperature
Thermal reset
temperature
Thermal hysteresis 7 15 °C
Turn-off output voltage
clamp
Output voltage drop
limitation
= 2A; V
I
OUT
= 1.5A
I
OUT
= -40°C...+150°C
T
j
IN
= 0V; L = 6mH
45 75 120
120AA
150 175 200 °C
135 °C
-41VCC-48VCC-
V
CC
55
50 mV
V
Note: To ensure long term reliability under heavy over-load or short circuit conditions, protection
and related diagnostic signals must be used together with a proper software strategy. If the
device is subjected to abnormal conditions, this software must limit the duration and number
of activation cycles.
Table 7. VCC - output diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
F
Forward on voltage - I
8/26 Doc ID 6236 Rev 4
= 8A; Tj = 150°C 0.6 V
OUT
Page 9
VN610SP Electrical specifications
Table 8. Current sense (9V ≤ V
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
K
1
I
OUT/ISENSE
OUT
Tj = -40°C...150°C
≤ 16V)
CC
= 1.5A; V
SENSE
= 0.5V;
3300 4400 6000
dK
1/K1
K
dK
2/K2
K
dK
3/K3
I
SENSE0
V
SENSE
V
SENSEH
R
VSENSEH
Current sense
ratio drift
I
2
OUT/ISENSE
Current sense
ratio drift
I
3
OUT/ISENSE
Current sense
ratio drift
Analog sense
current
Max analog
sense output
voltage
Analog sense
output voltage in
over-temperature
condition
Analog sense
output
impedance in
over-temperature
condition
= 1.5A; V
I
OUT
SENSE
Tj= - 40°C...150°C
I
= 15A; V
OUT
SENSE
Tj = - 40°C
= 25°C...150°C
T
j
= 15A; V
I
OUT
= -40°C...150°C
T
j
I
= 45A; V
OUT
= -40°C
T
j
= 25°C...150°C
T
j
= 45A; V
I
OUT
= -40°C...150°C
T
j
V
= 6...16V; I
CC
V
SENSE
= -40°C...150°C
T
j
SENSE
SENSE
SENSE
OUT
= 0V;
Off-state; VIN = 0V
On-state; V
= 5.5V; I
V
CC
R
SENSE
> 8V, I
V
CC
R
SENSE
= 13V; R
V
CC
= 13V; Tj > T
V
CC
= 5V
IN
OUT
= 10kΩ
OUT
= 10kΩ
SENSE
= 15A;
all channels open
= 0.5V;
-10 +10 %
= 4V;
4200
4900
6000
4400
4900
5750
= 4V;
-6 +6 %
= 4V;
4200
4900
5500
4400
4900
5250
= 4V;
-6 +6 %
= 0A;
0
0
5
10µAµA
= 7.5A;
3.5
5
= 3.9kΩ 5.5 V
;
TSD
400 Ω
V
V
t
DSENSE
1. Current sense signal delay after positive input slope.
Current sense
delay response
To 9 0% I
SENSE
(1)
Doc ID 6236 Rev 4 9/26
500 µs
Page 10
Electrical specifications VN610SP
Table 9. Logic inputs
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
V
V
I(hyst)
V
Table 10. Switching (VCC = 13V)
Input low level voltage 1.25 V
IL
Low level input current V
I
IL
Input high level voltage 3.25 V
IH
I
High level input current V
IH
= 1.25V 1 µA
IN
= 3.25V 10 µA
IN
Input hysteresis voltage 0.5 V
Input clamp voltage
ICL
I
IN
= - 1mA
I
IN
= 1mA
66.8
- 0.7
8V
Symbol Parameter Test conditions Min. Typ. Max. Unit
t
d(on)
t
d(off)
(dV
/dt)onTurn-on voltage slope RL = 0.87Ω (see Figure 4.)
OUT
(dV
/dt)
OUT
Table 11. Truth table
Turn-on delay time RL= 0.87Ω (see Figure 4.)30 µs
Turn-on delay time RL = 0.87Ω (see Figure 4.)30 µs
See
Figure 10.
Turn-off voltage slope RL = 0.87Ω (see Figure 4.)
off
See
Figure 12.
V
V/µs
V/µs
Conditions Input Output Sense
Normal operation
Over-temperature
Under-voltage
Over-voltage
Short circuit to GND
Short circuit to V
CC
L
H
L
H
L
H
L
H
L
H
H
L
H
L
H
Nominal
L
L
V
SENSEH
L
L
L
L
L
L
L
(T
j>TTSD
(T
H
H
< Nominal
Negative output voltage clamp L L 0
0
0
0
0
0
0
0
j<TTSD
) V
0
) 0
SENSEH
10/26 Doc ID 6236 Rev 4
Page 11
VN610SP Electrical specifications
Table 12. Electrical transient requirements
ISO T/R
Test level
7637/1
Test pulse
1- 25V
2 + 25V
3a - 25V
3b + 25V
4- 4V
5+ 26.5V
1. All functions of the device are performed as designed after exposure to disturbance.
2. One or more functions of the device is not performed as designed after exposure and cannot be returned to
proper operation without replacing the device.
I II III IV Delays and impedance
(1)
(1)
(1)
(1)
(1)
(1)
- 50V
+ 50V
- 50V
+ 50V
- 5V
+ 46.5V
(1)
(1)
(1)
(1)
(1)
(2)
- 75V
+ 75V
- 100V
+ 75V
(1)
- 6V
+ 66.5V
(1)
(1)
(1)
(1)
(2)
- 100V
+ 100V
- 150V
+ 100V
(1)
- 7V
+ 86.5V
(1)
(1)
(1)
(1)
(2)
2ms, 10Ω
0.2ms, 10Ω
0.1µs, 50Ω
0.1µs, 50Ω
100ms, 0.01Ω
400ms, 2Ω
Figure 4. Switching characteristics
V
OUT
90%
t
f
dV
OUT
/dt
(off)
t
dV
I
SENSE
OUT
80%
/dt
(on)
t
90%
r
10%
t
t
d(on)
DSENSE
t
d(off)
INPUT
t
t
Doc ID 6236 Rev 4 11/26
Page 12
Electrical specifications VN610SP
Figure 5. I
I
OUT/ISENSE
6500
6000
5500
5000
4500
4000
3500
3000
0246810121416
OUT/ISENSE
versus I
OUT
max.Tj=25...150°C
min.Tj=25...150°C
I
OUT
max.Tj=-40°C
typical value
min.Tj=-40°C
(A)
12/26 Doc ID 6236 Rev 4
Page 13
VN610SP Electrical specifications
Figure 6. Waveforms
NORMAL OPERATION
INPUT
LOAD CURRENT
SENSE CURRENT
UNDERVOLTAGE
V
CC
INPUT
LOAD CURRENT
SENSE CURRENT
V
CC
INPUT
LOAD CURRENT
SENSE
V
USD
V
OV
VCC > V
USD
V
USDhyst
OVERVOLTAGE
V
OVhyst
INPUT
LOAD CURRENT
LOAD VOLTAGE
SENSE CURRENT
INPUT
LOAD VOLTAGE
LOAD CURRENT
SENSE CURRENT
T
j
INPUT
LOAD CURRENT
SENSE CURRENT
SHORT TO GROUND
SHORT TO V
<Nominal
T
TSD
T
R
OVERTEMPERATURE
I
SENSE=VSENSEH
CC
/(R
SENSE+RSENSEH
<Nominal
)
Doc ID 6236 Rev 4 13/26
Page 14
Electrical specifications VN610SP
IL(off1) (uA)
Iih (uA)
Vicl (V)
dVout/dt(on) (V/ms)
Vov (V)
dVout/dt(off) (V/ms)
2.4 Electrical characteristics curves
Figure 7. Off-state output current Figure 8. High level input current
2.5
2.25
2
1.75
1.5
1.25
1
0.75
0.5
0.25
0
-50 -25 0 25 50 75 100 125 150 175
Off state
Vcc=36V
Vin=Vout=0V
5
4.5
3.5
2.5
1.5
0.5
Vin=3.25V
4
3
2
1
0
-50 -25 0 25 50 75 100 125 150 175
Figure 9. Input clamp voltage Figure 10. Turn-on voltage slope
8
7.8
7.6
7.4
7.2
7
6.8
6.6
6.4
6.2
6
Iin=1mA
-50 -25 0 25 50 75 100 125 150 175
800
700
600
500
400
300
200
100
Ri=6.5Ohm
0
-50 -25 0 25 50 75 100 125 150 175
Figure 11. Over-voltage shutdown Figure 12. Turn-off voltage slope
14/26 Doc ID 6236 Rev 4
50
48
46
44
42
40
38
36
34
32
30
-50 -25 0 25 50 75 100 125 150 175
600
550
500
450
400
350
300
250
200
Ri=6.5Ohm
-50 -25 0 25 50 75 100 125 150 175
Page 15
VN610SP Electrical specifications
Ilim (A)
Ron (mOhm)
Vih (V)
Vhyst (V)
Ron (mOhm)
Vil (V)
Figure 13. I
vs T
LIM
20
18
16
14
12
10
8
6
4
2
0
Vcc=13V
-50 -25 0 25 50 75 100 125 150 175
case
Figure 14. On-state resistance vs V
25
22.5
20
17.5
15
12.5
10
7.5
5
2.5
0
5 10152025303540
Iout=15A
Tc= 125ºC
Tc= 25º C
Tc= - 4 0º C
Figure 15. Input high level Figure 16. Input hysteresis voltage
3.6
3.4
3.2
3
2.8
2.6
2.4
2.2
2
-50 -25 0 25 50 75 100 125 150 175
1.5
1.4
1.3
1.2
1.1
1
0.9
0.8
0.7
0.6
0.5
-50 -25 0 25 50 75 100 125 150 175
CC
Figure 17. On-state resistance vs Tcase Figure 18. Input low level
25
22.5
20
17.5
15
12.5
10
7.5
5
2.5
0
-50 -25 0 25 50 75 100 125 150 175
Iout=15A
Vcc=8V; 36V
Doc ID 6236 Rev 4 15/26
2.6
2.4
2.2
2
1.8
1.6
1.4
1.2
1
-50 -25 0 25 50 75 100 125 150 175
Page 16
Application information VN610SP
3 Application information
Figure 19. Application schematic
+5V
GND
GND
V
CC
OUTPUT
D
GND
R
prot
INPUT
R
μ
C
prot
R
SENSE
CURRENT SENSE
V
R
GND
3.1 GND protection network against reverse battery
This section provides two solutions for implementing a ground protection network against
reverse battery.
3.1.1 Solution 1: a resistor in the ground line (R
GND
only)
D
ld
This can be used with any type of load.
The following show how to dimension the R
1. R
2. R
where - I
≤ 600mV / 2 (I
GND
≥ ( - VCC) / ( - I
GND
is the DC reverse ground pin current and can be found in the absolute
GND
S(on)max
GND
)
)
GND
maximum rating section of the device datasheet.
Power dissipation in R
P
= ( - VCC)2/ R
D
GND
GND
(when V
< 0 during reverse battery situations) is:
CC
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where I
maximum on-state currents of the different devices.
Please note that, if the microprocessor ground is not shared by the device ground, then the
R
will produce a shift (I
GND
S(on)max
* R
) in the input thresholds and the status output
GND
values. This shift will vary depending on how many devices are ON in the case of several
high-side drivers sharing the same R
16/26 Doc ID 6236 Rev 4
GND
.
resistor:
S(on)max
becomes the sum of the
Page 17
VN610SP Application information
If the calculated power dissipation requires the use of a large resistor, or several devices
have to share the same resistor, then ST suggests using solution 2 below.
3.1.2 Solution 2: a diode (D
A resistor (R
= 1kΩ) should be inserted in parallel to D
GND
) in the ground line
GND
an inductive load. This small signal diode can be safely shared amongst several different
HSD. Also in this case, the presence of the ground network will produce a shift (j600mV) in
the input threshold and the status output values if the microprocessor ground is not common
with the device ground. This shift will not vary if more than one HSD shares the same
diode/resistor network. Series resistor in INPUT and STATUS lines are also required to
prevent that, during battery voltage transient, the current exceeds the Absolute Maximum
Rating. Safest configuration for unused INPUT and STATUS pin is to leave them
unconnected.
3.2 Load dump protection
Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the
V
maximum DC rating. The same applies if the device is subject to transients on the VCC
CC
line that are greater than those shown in the ISO T/R 7637/1 table.
3.3 MCU I/O protection
If a ground protection network is used and negative transients are present on the VCC line,
the control pins will be pulled negative. ST suggests to insert a resistor (R
prevent the µC I/O pins from latching up.
if the device will be driving
GND
) in line to
prot
The value of these resistors is a compromise between the leakage current of µC and the
current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC
I/Os:
- V
CCpeak
/ I
latchup
≤ R
prot
≤ (V
OHμC
- V
IH
- V
GND
) / I
IHmax
Example
For the following conditions:
V
CCpeak
I
latchup
V
OHμC
5kΩ ≤ R
Recommended values are:
R
prot
= - 100V
≥ 20mA
≥ 4.5V
prot
= 10kΩ
≤ 65kΩ.
Doc ID 6236 Rev 4 17/26
Page 18
Application information VN610SP
3.4 Maximum demagnetization energy (V
Figure 20. Maximum turn-off current versus load inductance
I
LM AX (A)
1000
100
10
1
0,01 0,1 1 10 100
L( mH)
= 13.5V)
CC
A
B
C
A = single pulse at T
B= repetitive pulse at T
C= repetitive pulse at T
VIN, I
L
Demagnetization
Note: Values are generated with R
In case of repetitive pulses, T
must not exceed the temperature specified above for curves B and C.
= 150ºC
Jstart
= 100ºC
Jstart
= 125ºC
Jstart
Demagnetization
= 0Ω.
L
(at beginning of each demagnetization) of every pulse
jstart
Demagnetization
t
18/26 Doc ID 6236 Rev 4
Page 19
VN610SP Package and PCB thermal data
4 Package and PCB thermal data
4.1 PowerSO-10 thermal data
Figure 21. PowerSO-10 PC board
Note: Layout condition of R
thickness = 2mm, Cu thickness = 35µm, Copper areas: from minimum pad-lay-out to 8cm
Figure 22. R
thj-amb
RTHj_amb (°C/W)
55
50
45
40
35
30
0246810
and Zth measurements (PCB FR4 area = 58mm x 58mm, PCB
th
Vs PCB copper area in open box free air condition
Tj-Tamb=50°C
2
).
PCB Cu heatsink area (cm^2)
Doc ID 6236 Rev 4 19/26
Page 20
Package and PCB thermal data VN610SP
Figure 23. Thermal impedance junction ambient single pulse
ZTH (°C/W)
100
Footprint
2
6 cm
10
1
0.1
0.01
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
Equation 1
Z
THδ
where
: pulse calculation formula
RTHδ Z
THtp
1 δ–()+⋅=
δ tpT⁄=
Figure 24. Thermal fitting model of a single channel in PowerSO-10
Tj
C1
R1 R2
Pd
C2
C3
R3
C4
R4
T_amb
C5
R5
C6
R6
20/26 Doc ID 6236 Rev 4
Page 21
VN610SP Package and PCB thermal data
Table 13. Thermal parameters
Area / island (cm2) Footprint 6
R1 (°C/W) 0.016
R2 (°C/W) 0.06
R3 (°C/W) 0.08
R4 (°C/W) 0.8
R5 (°C/W) 12
R6 (°C/W) 37 22
C1 (W.s/°C) 0.002
C2 (W.s/°C) 1E-02
C3 (W.s/°C) 0.04
C4 (W.s/°C) 0.3
C5 (W.s/°C) 0.75
C6 (W.s/°C) 3 5
Doc ID 6236 Rev 4 21/26
Page 22
Package and packing information VN610SP
5 Package and packing information
5.1 ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
5.2 PowerSO-10 mechanical data
Figure 25. PowerSO-10 package dimensions
10
HE
h
A
F
A1
1
eB
0.25
D
= =
D1
= =
E2
DETAIL "A"
B
0.10 A
E
SEATING
PLANE
A
C
B
E4
SEATING
PLANE
A1
DETAIL "A"
22/26 Doc ID 6236 Rev 4
L
α
Page 23
VN610SP Package and packing information
Table 14. PowerSO-10 mechanical data
mm
Dim.
Min. Typ. Max.
A 3.35 3.65
(1)
A
A1 0 0.10
B 0.40 0.60
(1)
B
C 0.35 0.55
(1)
C
D 9.40 9.60
D1 7.40 7.60
E 9.30 9.50
3.4 3.6
0.37 0.53
0.23 0.32
E2 7.20 7.60
(1)
E2
E4 5.90 6.10
(1)
E4
e1.27
F 1.25 1.35
(1)
F
H 13.80 14.40
(1)
H
h0.50
L 1.20 1.80
(1)
L
α 0° 8°
(1)
α
1. Muar only POA P013P.
7.30 7.50
5.90 6.30
1.20 1.40
13.85 14.35
0.80 1.10
2° 8°
Doc ID 6236 Rev 4 23/26
Page 24
Package and packing information VN610SP
5.3 PowerSO-10 packing information
Figure 26. PowerSO-10 suggested
pad layout
Figure 27. PowerSO-10 tube shipment
(no suffix)
14.6 - 14.9
10.8 - 11
6.30
1
2
3
9.5
4
5
0.67 - 0.73
10
0.54 - 0. 6
9
8
7
1.27
6
C
A
All dimensions are in mm.
Casablanca 50 1000 532 10.4 16.4 0.8
B
Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1)
Muar 50 1000 532 4.9 17.2 0.8
Figure 28. PowerSO-10 tape and reel shipment (suffix “TR”)
Reel dimensions
Base Q.ty 600
Bulk Q.ty 600
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 24.4
N (min) 60
T (max) 30.4
MUARCASABLANCA
A
B
C
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width W 24
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 24
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 11.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2
All dimensions are in mm.
Top
cover
tape
End
24/26 Doc ID 6236 Rev 4
500mm min
Empty components pock ets
saled with cover tape.
User direction of feed
Start
No componentsNo components Components
500mm min
Page 25
VN610SP Revision history
6 Revision history
Table 15. Document revision history
Date Revision Changes
09-Sep-2004 1 Initial release.
Current and voltage convention update (page 2).
Configuration diagram (top view) and suggested connections for
unused and n.c. pins insertion (page 2).
29-Jan-2008 2
15-Dec-2008 3
29-Jul-2010 4
6 cm2 Cu condition insertion in thermal data table (page 3).
Protections note insertion (page 4).
- output diode section update (page 5).
V
CC
Revision history table insertion (page 17).
Disclaimers update (page 18).
Document reformatted and restructured.
Added contents, list of tables and figures.
®
Added ECOPACK
packages information.
Updated Figure 24: Thermal fitting model of a single channel in
PowerSO-10
Doc ID 6236 Rev 4 25/26
Page 26
VN610SP
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26/26 Doc ID 6236 Rev 4
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