Single channel high side driver for automotive applications
Features
Max transient supply voltageV
Operating voltage rangeV
Max On-state resistance (per ch.)R
Current limitation (typ)I
Off state supply currentI
1. Typical value with all loads connected.
■ General
– Inrush current active management by
power limitation
– Very low stand-by current
– 3.0V CMOS compatible inputs
– Optimized electromagnetic emissions
– Very low electromagnetic susceptibility
– In compliance with the 2002/95/EC
european directive
■ Diagnostic functions
– Open Drain status output
– On-state open load detection
– Off-state open load detection
– Output short to V
– Undervoltage shutdown
– Overvoltage clamp
– Load current limitation
– Self limiting of fast thermal transients
– Protection against loss of ground and loss
■ All types of resistive, inductive and capacitive
loads
Description
The VN5E160S-E is a single channel high-side
driver manufactured in the ST proprietary
VIPower M0-5 technology and housed in the tiny
SO-8 package.
The VN5E160S-E is designed to drive automotive
grounded loads delivering protection, diagnostics
and easy 3V and 5V CMOS-compatible interface
with any microcontroller.
The device integrates advanced protective
functions such as load current limitation, inrush
and overload active management by power
limitation, over-temperature shut-off with autorestart and over-voltage active clamp.
A dedicated active low digital status pin is
associated with every output channel in order to
provide Enhanced diagnostic functions including
fast detection of overload and short-circuit to
ground, over-temperature indication, short-circuit
to V
diagnosis and ON & OFF state open-load
CC
detection.
The diagnostic feedback of the whole device can
be disabled by pulling the STAT_DIS pin up, thus
allowing wired-ORing with other similar devices.
Ground connection. Must be reverse battery protected by an external
diode/ resistor network.
Voltage controlled input pin with hysteresis, CMOS compatible. Controls output
switch state.
STATUSOpen Drain digital diagnostic pin.
STAT_DIS
Active high CMOS compatible pin, to disable the STATUS pin.
5/34
Page 6
Block diagram and pin configurationVN5E160S-E
Figure 2.Configuration diagram (top view)
V
CC
OUTPUT
OUTPUT
V
CC
5
6
7
8
4
3
2
1
STAT_DIS
STATUS
INPUT
GND
SO-8
Table 2.Suggested connections for unused and not connected pins
Connection / pinStatusN.C.OutputInputSTAT_DIS
FloatingXXXXX
To ground
Not
allowed
X
Not
allowed
Through 10KΩ
resistor
Through 10KΩ
resistor
6/34
Page 7
VN5E160S-EElectrical specifications
2 Electrical specifications
Figure 3.Current and voltage conventions
I
V
CC
V
S
V
F
CC
I
SD
V
Note:V
= V
F
SD
- VCC during reverse battery condition.
OUT
I
IN
V
IN
INPUT
2.1 Absolute maximum ratings
Stressing the device above the ratings listed in the “Absolute maximum ratings” tables may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to the conditions in the “Absolute maximum
ratings” tables for extended periods may affect device reliability. Refer also to the
STMicroelectronics SURE Program and others relevant quality documents.
Table 3.Absolute maximum ratings
GND
OUTPUTSTAT_DIS
STATUS
I
GND
I
OUT
I
STAT
V
STAT
V
OUT
SymbolParameterValueUnit
V
- V
- I
I
- I
I
STAT
I
STAT_DIS
E
DC supply voltage41V
CC
Reverse DC supply voltage0.3V
CC
DC reverse ground pin current200mA
GND
DC output currentInternally limitedA
OUT
Reverse DC output current 6A
OUT
I
DC input current+10 / -1mA
IN
DC status current+10 / -1mA
DC status disable current+10 / -1mA
Maximum switching energy (single pulse)
MAX
(L=8 mH; R
=0Ω; V
L
=13.5V; T
bat
jstart
=150ºC; I
OUT
= I
limL
(Typ.) )
36mJ
7/34
Page 8
Electrical specificationsVN5E160S-E
Table 3.Absolute maximum ratings (continued)
SymbolParameterValueUnit
Electrostatic discharge (Human body model: R=1.5KΩ;
C=100pF)
Values specified in this section are for 8V<VCC<28V; -40°C< Tj <150°C, unless otherwise
stated.
Table 5.Power section
SymbolParameterTest conditionsMin. Typ. Max. Unit
V
V
V
USDhyst
R
V
I
L(off1)
1. PowerMOS leakage included.
Operating supply voltage4.51328V
CC
Undervoltage shutdown3.54.5V
USD
Undervoltage shutdown
hysteresis
I
=1A; Tj=25°C
OUT
On state resistance
ON
Clamp voltageIS=20 mA414652V
clamp
I
Supply current
S
Off state output current
Output - VCC diode
V
F
voltage
I
=1A; Tj=150°C
OUT
=1A; VCC=5V; Tj=25°C
I
OUT
Off State; V
=25°C
T
j
CC
On State; VIN=5V; VCC=13V;
=0A
I
OUT
V
IN=VOUT
V
IN=VOUT
-I
OUT
=0V; VCC=13V; Tj=25°C
=0V; VCC=13V; Tj=125°C00
=0.6A; Tj=150°C0.7V
Table 6.Switching (VCC=13V; Tj=25°C)
=13V; VIN=V
OUT
=0V;
0.5V
160
mΩ
320
mΩ
210
mΩ
(1)
2
1.9
(1)
5
3.5µAmA
0.0135µA
µA
SymbolParameterTest conditionsMin.Typ.Max.Unit
=13Ω
R
L
(see Figure 6.)
=13Ω
R
L
(see Figure 6.)
RL=13Ω
(see Figure 6.)
RL=13Ω
(see Figure 6.)
10µs
15µs
See
Figure 26.
See
Figure 28.
70µJ
40µJ
dV
dV
t
d(on)
t
d(off)
OUT
OUT
W
W
/dt
/dt
ON
OFF
Turn-On delay time
Turn-Off delay time
Turn-On voltage slopeRL=13Ω
(on)
Turn-Off voltage slopeRL=13Ω
(off)
Switching energy losses
during t
won
Switching energy losses
during t
woff
V/µs
V/µs
9/34
Page 10
Electrical specificationsVN5E160S-E
Table 7.Status pin (VSD=0)
SymbolParameterTest conditionsMin.Typ.Max.Unit
V
STAT
I
LSTAT
C
STAT
V
Table 8.Protection
Status low output
voltage
Status leakage current
Status pin input
capacitance
Status clamp voltage
SCL
(1)
= 1.6 mA, VSD=0V0.5V
I
STAT
Normal operation or V
= 5V
V
STAT
SD
=5V,
Normal operation or VSD=5V,
V
= 5V
STAT
I
STAT
I
STAT
= 1mA
= - 1mA
5.5
-0.7
10µA
100pF
7V
SymbolParameterTest conditionsMin.Typ.Max.Unit
I
T
limH
I
limL
TSD
T
T
DC short circuit
current
Short circuit current
during thermal cycling
V
=13V; 5V<VCC<28V
CC
=13V; TR<Tj<T
V
CC
TSD
Shutdown
temperature
Reset temperatureTRS + 1 TRS + 5°C
R
Thermal reset of
RS
STATUS
7101414A
2.5A
150175200°C
135°C
V
A
T
HYST
t
SDL
V
DEMAG
V
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles.
Thermal hysteresis
(T
TSD-TR
Status delay in
overload conditions
Turn-off output voltage
clamp
Output voltage drop
ON
limitation
)
T
I
OUT
I
OUT
(see Figure 4)20µs
j>TTSD
=1A; VIN=0; L=20mHVCC-41VCC-46 VCC-52V
=0.03A (see Figure 5.)
Tj= -40°C...+150°C
7°C
25mV
10/34
Page 11
VN5E160S-EElectrical specifications
Table 9.Open load detection (8V<VCC<18V)
SymbolParameterTest conditionsMin.Typ.Max.Unit
t
DOL(on)
t
DSTKON
I
L(off2)
td_vol
I
t
POL
V
Open load ON state
OL
detection threshold
Open load ON state
detection delay
Delay between INPUT
falling edge and
STATUS rising edge in
open load condition
Open load OFF state
voltage detection
OL
threshold
Output short circuit to
Vcc detection delay at
turn-off
Off state output current
Delay response from
output rising edge to
STATUS falling edge in
open load
VIN = 5V 1040mA
I
= 0A, VCC=13V
OUT
(see Figure 4)
= 0A (see Figure 4)2005001200µs
I
OUT
200µs
VIN = 0V24V
See Figure 4180t
= 0V; V
V
IN
(see Section 3.4: Open
OUT
= 4V
-750µA
POL
µs
load detection in Off state)
V
IN
= 0V; V
= 4V20µs
OUT
Table 10.Logic input
SymbolParameterTest conditionsMin.Typ.Max.Unit
V
V
V
I(hyst)
V
V
I
SDL
V
I
SDH
V
SD(hyst)
V
SDCL
Input low level0.9V
IL
I
Low level input currentVIN = 0.9V1µA
IL
Input high level2.1V
IH
High level input currentVIN = 2.1V10µA
I
IH
Input hysteresis voltage0.25V
I
= 1mA
Input clamp voltage
ICL
STAT_DIS low level voltage0.9V
SDL
IN
= -1mA
I
IN
5.5
-0.7
Low level STAT_DIS currentVSD=0.9V1µA
STAT_DIS high level voltage2.1V
SDH
High level STAT_DIS
current
V
=2.1V10µA
SD
STAT_DIS hysteresis voltage0.25V
STAT_DIS clamp voltage
ISD=1mA
=-1mA
I
SD
5.5
-0.7
7V
7V
V
V
11/34
Page 12
Electrical specificationsVN5E160S-E
Figure 4.Status timings
OPEN LOAD STATUS TIMING (without external pull-up)
I
< I
OUT
V
IN
V
STAT
t
DOL(on)
OL
V
< V
OUT
t
POL
OUTPUT STUCK TO Vcc
I
> I
OUT
V
V
IN
STAT
t
DOL(on)
OL
V
t
DSTKON
OUT
> V
OPEN LOAD STATUS TIMING (with external pull-up)
I
< I
OUT
V
OL
IN
V
STAT
t
DOL(on)
OL
V
> V
OUT
OL
OVER TEMP STATUS TIMING
Tj > T
V
V
IN
STAT
t
SDL
OL
TSD
t
SDL
Figure 5.Output voltage drop limitation
Vcc-V
out
Tj=150oC
V
on
V
on/Ron(T)
=25oC
T
j
=-40oC
T
j
I
out
12/34
Page 13
VN5E160S-EElectrical specifications
Figure 6.Switching characteristics
V
OUT
dV
OUT
t
Won
80%
/dt
(on)
t
r
10%
t
Woff
90%
t
f
dV
OUT
/dt
(off)
t
INPUT
t
d(on)
t
d(off)
Table 11.Truth table
ConditionsINPUTOUTPUTSTATUS (VSD=0V)
Normal operation
Overtemperature
Undervoltage
Overload &
Short circuit to GND
Output voltage > V
Output current < I
OL
OL
L
H
L
H
L
H
H
(no power limitation)
H
(power limitation)
L
H
L
H
L
H
L
L
L
L
X
Cycling
H
H
L
H
t
(1)
H
H
H
L
X
X
H
L
(2)
L
H
(3)
H
L
1. If the VSD is high, the STATUS pin is in a high impedance.
2. The STATUS pin is low with a delay equal to t
3. The STATUS pin becomes high with a delay equal to t
after INPUT falling edge.
DSTKON
POL
after INPUT falling edge.
13/34
Page 14
Electrical specificationsVN5E160S-E
Table 12.Electrical transient requirements
ISO 7637-2:
2004(E)
Tes t puls e
Test levels
IIIIV
(1)
Number of
pulses or
test times
Burst cycle / pulse
repetition time
Delays and
impedance
1-75 V-100 V
2a+37 V+50 V
5000
pulses
5000
pulses
0.5 s5 s2 ms, 10 Ω
0.2 s5 s50 µs, 2 Ω
3a-100 V-150 V1h90 ms100 ms0.1 µs, 50 Ω
3b+75 V+100 V1h90 ms100 ms0.1 µs, 50 Ω
4-6 V-7 V1 pulse100 ms, 0.01
(2)
5b
ISO 7637-2:
+65 V+87 V1 pulse400 ms, 2 Ω
Test level results
(1)
2004(E)
Tes t puls e
IIIIV
1CC
2aCC
3aCC
3bCC
4CC
5b
(2)
CC
Ω
1. The above test levels must be considered referred to VCC = 13.5V except for pulse 5b.
2. Valid in case of external load dump clamp: 40V maximum referred to ground.
ClassContents
CAll functions of the device are performed as designed after exposure to disturbance.
E
One or more functions of the device are not performed as designed after exposure to
disturbance and cannot be returned to proper operation without replacing the device.
14/34
Page 15
VN5E160S-EElectrical specifications
2.3 Waveforms
Figure 7.Normal operation
Normal operation
INPUT
Nominal loadNominal load
I
OUT
V
STATUS
V
ST_DIS
Figure 8.Undervoltage shutdown
Undervoltage shut-down
V
V
INPUT
I
V
STATUS
V
ST_DIS
CC
OUT
USD
V
USDhyst
UNDEFINED
15/34
Page 16
Electrical specificationsVN5E160S-E
Figure 9.Overload or Short to GND
Overload or Short to GND
INPUT
I
>
LimH
I
OUT
V
STATUS
V
ST_DIS
Power Limitation
Figure 10. Intermittent Overload
INPUT
I
>
LimH
I
OUT
Thermal cycling
I
>
LimL
Intermittent Overload
Overload
I
>
LimL
Nominal load
V
STATUS
V
ST_DIS
16/34
Page 17
VN5E160S-EElectrical specifications
Figure 11. Open Load with external pull-up
Open Load
with external pull-up
INPUT
VPU> V
OL
V
t
DOL(on)
OL
V
OUT
I
OUT
V
STATUS
V
ST_DIS
Figure 12. Open Load without external pull-up
Open Load
without external pull-up
INPUT
V
OUT
I
OUT
V
STATUS
V
ST_DIS
I
OUT
t
DOL(on)
< I
OL
I
OL
t
POL
17/34
Page 18
Electrical specificationsVN5E160S-E
Figure 13. Short to V
INPUT
V
OUT
I
OUT
V
STATUS
V
ST_DIS
CC
Resistive
Short to V
V
> V
OUT
V
OL
I
> I
OUT
I
OL
t
DSTK(on)
Short to V
CC
Hard
CC
OL
OL
Short to V
V
> V
OUT
I
< I
OUT
t
DOL(on)
CC
OL
OL
Figure 14. TJ evolution in Overload or Short to GND
TJ evolution in
Overload or Short to GND
INPUT
I
OUT
T
J
Self-limitation of fast thermal transients
T
J_START
Power Limitation
I
>
LimH
T
T
TSD
R
< I
T
HYST
LimL
18/34
Page 19
VN5E160S-EElectrical specifications
2.4 Electrical characteristics curves
Figure 15. Off state output currentFigure 16. High level input current
Iloff (nA)
300
Iih (µA)
5
250
200
150
100
50
0
-50 -250255075100 125 150 175
Off State
Vcc=13V
Vin=Vout=0V
Tc (°C)
4,5
3,5
2,5
Vin=2.1V
4
3
2
-50 -250255075100 125 150 175
Tc (°C)
Figure 17. Input clamp voltageFigure 18. Input high level
Vicl (V)
7
6,8
6,6
6,4
6,2
6
5,8
lin=1mA
Vih (V)
3
2,5
2
1,5
1
0,5
5,6
-50 -250255075100 125 150 175
Tc (°C)
0
-50 -250255075100 125 150 175
Tc (°C)
Figure 19. Input low levelFigure 20. Low level STAT_DIS current
Vil (V)
2
1,8
1,6
1,4
1,2
1
0,8
0,6
0,4
-50 -250255075100 125 150 175
Tc (°C)
Isdl (µA)
5
4,5
3,5
2,5
1,5
Vsd= 0.9V
4
3
2
1
-50 -250255075100 125 150 175
Tc (°C)
19/34
Page 20
Electrical specificationsVN5E160S-E
Figure 21. On state resistance vs T
Ron (mOhm)
300
250
200
150
100
50
Iout= 1A
Vcc=13V
-50 -250255075100 125 150 175
Tc (°C)
Figure 23. On state resistance vs V
Ron (mOhm)
300
250
200
150
100
50
05101520253035
Vcc (V)
case
CC
Tc=150°C
Tc=125°C
Tc=25°C
Tc=-40°C
Figure 22. High level STAT_DIS current
Isdh (µA)
5
4,5
3,5
2,5
Vsd= 2.1V
4
3
2
-50 -250255075100 125 150 175
Tc (°C)
Figure 24. Low level input current
Iil (µA)
5
4,5
3,5
2,5
1,5
Vin=0.9V
4
3
2
1
-50 -250255075100 125 150 175
Tc (°C)
Figure 25. I
Ilimh (A)
20
15
10
5
0
-50-250255075100125150
LIM
vs T
Vcc=13V
case
Tc (°C)
20/34
Figure 26. Turn-On voltage slope
(dVout/dt )On (V/ms)
1000
900
800
700
600
500
400
300
-50 -250255075100 125 150 175
Tc (°C)
Vcc=13V
RI=13 Ohm
Page 21
VN5E160S-EElectrical specifications
Figure 27. Undervoltage shutdownFigure 28. Turn-Off voltage slope
Vusd (V)
7
(dVout/dt )Off (V/ms)
1400
6
5
4
3
2
1
0
-50-250255075100 125 150 175
Tc (°C)
1200
1000
800
600
400
-50 -250255075100 125 150 175
Tc (°C)
Vcc=13V
RI= 13 Ohm
Figure 29. STAT_DIS clamp voltageFigure 30. High level STAT_DIS voltage
Vsdcl(V)
10
9
8
7
6
5
4
Isd = 1 mA
VsdH(V)
3
2,5
2
1,5
1
0,5
3
-50-250255075100 125 150 175
Tc (°C)
Figure 31. Low level STAT_DIS voltage
VsdL(V)
3
2,5
2
1,5
1
0,5
0
-50 -250255075100 125 150 175
Tc (°C)
0
-50 -250255075100 125 150 175
Tc (°C)
21/34
Page 22
Application informationVN5E160S-E
3 Application information
Figure 32. Application schematic
+5V
R
R
MCU
R
prot
prot
prot
+5V
STAT_DIS
INPUT
STATUS
V
GND
GND
R
GND
V
CC
OUTPUT
D
GND
3.1 GND protection network against reverse battery
3.1.1 Solution 1: resistor in the ground line (R
GND
only)
D
ld
This solution can be used with any type of load.
The following is an indication on how to dimension the R
1.R
2. R
where -I
≤ 600mV / (I
GND
≥ (−VCC) / (-I
GND
is the DC reverse ground pin current and can be found in the absolute
GND
S(on)max
GND
).
)
maximum rating section of the device datasheet.
Power dissipation in R
P
= (-VCC)2/R
D
GND
(when VCC<0: during reverse battery situations) is:
GND
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where I
maximum on-state currents of the different devices.
Please note that if the microprocessor ground is not shared by the device ground then the
R
will produce a shift (I
GND
S(on)max
* R
values. This shift will vary depending on how many devices are ON in the case of several
high side drivers sharing the same R
22/34
GND
resistor.
GND
S(on)max
) in the input thresholds and the status output
GND
becomes the sum of the
.
Page 23
VN5E160S-EApplication information
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests Solution 2 is used (see below).
3.1.2 Solution 2: diode (D
A resistor (R
=1kΩ) should be inserted in parallel to D
GND
) in the ground line
GND
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network will produce a shift (~600mV) in the input
threshold and in the status output values, if the microprocessor ground is not common to the
device ground. This shift will not vary if more than one HSD shares the same diode/resistor
network.
3.2 Load dump protection
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds to
V
max DC rating. The same applies if the device is subject to transients on the VCC line
CC
that are greater than the ones shown in the ISO T/R 7637/2 table.
3.3 MCU I/Os protection
If a ground protection network is used and negative transient are present on the VCC line,
the control pins will be pulled negative. ST suggests that a resistor (R
to prevent the µC I/Os pins to latch-up.
The value of these resistors is a compromise between the leakage current of µC and the
current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC
I/Os.
if the device drives an
GND
) be inserted in line
prot
-V
CCpeak/Ilatchup
≤ R
prot
Calculation example:
For V
5kΩ ≤ R
Recommended R
CCpeak
≤ 180kΩ.
prot
= - 100V and I
prot
≤ (V
OHµC-VIH-VGND
≥ 20mA; V
latchup
value is 10kΩ.
) / I
IHmax
OHµC
≥ 4.5V
23/34
Page 24
Application informationVN5E160S-E
3.4 Open load detection in Off state
Off-state open-load detection requires an external pull-up resistor (RPU) connected between
the OUTPUT pin and a positive supply voltage (V
microprocessor.
The external resistor has to be selected according to the following requirements:
1.No false open load indication when load is connected: in this case we have to avoid
V
to be higher than V
OUT
V
= (VPU/(RL+RPU))RL<V
OUT
; this results in the following condition
Olmin
Olmin.
2. No misdetection when load is disconnected: in this case the V
V
Because I
up resistor R
; this results in the following condition RPU<(V
OLmax
may significantly increase if V
s(OFF)
should be connected to a supply that is switched OFF when the module is in
PU
standby.
) like the +5V line used to supply the
PU
has to be higher than
OUT
PU–VOLmax
is pulled high (up to several mA), the pull-
out
)/I
L(off2)
.
The values of V
OLmin
, V
OLmax
and I
are available in the Electrical characteristics
L(off2)
section.
Figure 33. Open load detection in Off state
CC
V
IN P U T
STATUS
DRIVER
+
LOGIC
+
-
V
GROUND
V batt.VPU
L(off2)
I
OUT
R
OL
PU
R
L
R
24/34
Page 25
VN5E160S-EApplication information
3.5 Maximum demagnetization energy (VCC= 13.5V)
Figure 34. Maximum turn-Off current versus inductance (for each channel)
100
A: T
B: T
C: T
L
A
C
jstart
jstart
jstart
B
= 150°C single pulse
= 100°C repetitive pulse
= 125°C repetitive pulse
10
1
I (A)
0,1
0,1110100L (mH)
VIN, I
DemagnetizationDemagnetizationDemagnetization
Note:Values are generated with R
In case of repetitive pulses, T
must not exceed the temperature specified above for curves A and B.
=0 Ω.
L
(at beginning of each demagnetization) of every pulse
jstart
t
25/34
Page 26
Package and PCB thermal dataVN5E160S-E
4 Package and PCB thermal data
4.1 SO-8 thermal data
Figure 35. SO-8 PC board
Note:Layout condition of R
thickness=2mm, Cu thickness= 35µm, Copper areas: from minimum pad lay-out to 2cm
Figure 36. R
RTHj_amb(°C/W)
thj-amb
110
100
90
80
70
60
00.511.522.5
and Zth measurements (PCB: FR4 area= 4.8mm x 4.8mm, PCB
th
Vs. PCB copper area in open box free air condition
2
).
PC B Cu heatsink area (cm^2)
26/34
Page 27
VN5E160S-EPackage and PCB thermal data
Figure 37. SO-8 thermal impedance junction ambient single pulse
ZT H (°C/W)
1000
Footprint
100
10
1
0.1
0.00010.0010.010.11101001000
Time (s)
Equation 1: pulse calculation formula
Z
THδ
where δ = tP/T
R
TH
δZ
THtp
1δ–()+⋅=
2 cm
2
Figure 38. Thermal fitting model of a single channel HSD in SO-8
b. The fitting model is a semplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
(b)
27/34
Page 28
Package and PCB thermal dataVN5E160S-E
Table 13.Thermal parameter
Area/island (cm2)Footprint2
R1 (°C/W)1.2
R2 (°C/W)6
R3 (°C/W)3.5
R4 (°C/W)21
R5 (°C/W)16
R6 (°C/W)5828
C1 (W.s/°C)0.0008
C2 (W.s/°C)0.0016
C3 (W.s/°C)0.0075
C4 (W.s/°C)0.045
C5 (W.s/°C)0.35
C6 (W.s/°C)1.052
28/34
Page 29
VN5E160S-EPackage and packing information
5 Package and packing information
5.1 ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second-level interconnect. The category of
Second-Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
5.2 Package mechanical data
Figure 39. SO-8 package dimensions
29/34
Page 30
Package and packing informationVN5E160S-E
Table 14.SO-8 mechanical data
Dim.
Min.Typ.Max.
A1.75
a10.10.25
a21.65
a30.650.85
b0.350.48
b10.190.25
C0.250.5
c145 (typ.)
D4.85
E5.86.2
e1.27
Millimeter
e33.81
F3.84
L0.41.27
M0.6
S8 (max.)
L10.81.2
30/34
Page 31
VN5E160S-EPackage and packing information
5.3 Packing information
Figure 40. SO-8 tube shipment (no suffix)
B
C
Base Q.ty100
Bulk Q.ty2000
Tube length (± 0.5)532
A
A3.2
B6
C (± 0.1)0.6
All dimensions are in mm.
Figure 41. SO-8 tape and reel shipment (suffix “TR”)
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.