Datasheet VN5E160S-E Datasheet (ST)

Page 1
Single channel high side driver for automotive applications
Features
Max transient supply voltage V
Operating voltage range V
Max On-state resistance (per ch.) R
Current limitation (typ) I
Off state supply current I
1. Typical value with all loads connected.
■ General
– Inrush current active management by
european directive
■ Diagnostic functions
– Open Drain status output – On-state open load detection – Off-state open load detection – Output short to V
detection
CC
– Overload and short to ground (power
limitation) indication – Thermal shutdown indication
■ Protections
– Undervoltage shutdown – Overvoltage clamp – Load current limitation – Self limiting of fast thermal transients – Protection against loss of ground and loss
of V
CC
– Over-temperature shutdown with
autorestart (thermal shutdown)
– Reverse battery protected – Electrostatic discharge protection
(a)
CC
CC
ON
LIMH
S
4.5 to 28V
41V
160 mΩ
10A
(1)
2 µA
VN5E160S-E
SO-8
Application
■ All types of resistive, inductive and capacitive
loads
Description
The VN5E160S-E is a single channel high-side driver manufactured in the ST proprietary VIPower M0-5 technology and housed in the tiny SO-8 package.
The VN5E160S-E is designed to drive automotive grounded loads delivering protection, diagnostics and easy 3V and 5V CMOS-compatible interface with any microcontroller.
The device integrates advanced protective functions such as load current limitation, inrush and overload active management by power limitation, over-temperature shut-off with auto­restart and over-voltage active clamp.
A dedicated active low digital status pin is associated with every output channel in order to provide Enhanced diagnostic functions including fast detection of overload and short-circuit to ground, over-temperature indication, short-circuit to V
diagnosis and ON & OFF state open-load
CC
detection.
The diagnostic feedback of the whole device can be disabled by pulling the STAT_DIS pin up, thus allowing wired-ORing with other similar devices.
a. See Figure 32: Application schematic.
February 2008 Rev 2 1/34
www.st.com
34
Page 2
Contents VN5E160S-E
Contents
1 Block diagram and pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 22
3.1.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 22
3.1.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 23
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.3 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.4 Open load detection in Off state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.5 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . 25
4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.1 SO-8 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.2 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.3 Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
2/34
Page 3
VN5E160S-E List of tables
List of tables
Table 1. Pin function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 5. Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 6. Switching (VCC = 13V; Tj = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 7. Status pin (V
Table 8. Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 9. Open load detection (8V<V
Table 10. Logic input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 11. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 12. Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 13. Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 14. SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 15. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 16. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
=0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
SD
<18V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
CC
3/34
Page 4
List of figures VN5E160S-E
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 5. Output voltage drop limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 6. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. Normal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 8. Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 9. Overload or Short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 10. Intermittent Overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 11. Open Load with external pull-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 12. Open Load without external pull-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 13. Short to V Figure 14. T
evolution in Overload or Short to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
J
Figure 15. Off state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 16. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 17. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 18. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 19. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 20. Low level STAT_DIS current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 21. On state resistance vs T
Figure 22. High level STAT_DIS current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 23. On state resistance vs V
Figure 24. Low level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 25. I
LIM
vs T
Figure 26. Turn-On voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 27. Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 28. Turn-Off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 29. STAT_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 30. High level STAT_DIS voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 31. Low level STAT_DIS voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 32. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 33. Open load detection in Off state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 34. Maximum turn-Off current versus inductance (for each channel) . . . . . . . . . . . . . . . . . . . . 25
Figure 35. SO-8 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 36. Rthj-amb Vs. PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 26
Figure 37. SO-8 thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 38. Thermal fitting model of a single channel HSD in SO-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 39. SO-8 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 40. SO-8 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 41. SO-8 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
case
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
case
4/34
Page 5
VN5E160S-E Block diagram and pin configuration

1 Block diagram and pin configuration

Figure 1. Block diagram

V
CC
Signal Clamp
Undervoltage
IN
ST_ DIS
ST
LOGIC

Table 1. Pin function

C ontrol & Diagnos tic
DRIVER
Over
tem p.
OVERLOAD PROTECTION
(AC TIVE P O WE R LIMITA T ION)
C urre nt
Limi ta tio n
Power Clamp
V
ON
Limi tatio n
OFF S tate Open load
ON State
Open load
OUT
GND
Name Function
V
CC
Battery connection.
OUTPUT Power output.
GND
INPUT
Ground connection. Must be reverse battery protected by an external diode/ resistor network.
Voltage controlled input pin with hysteresis, CMOS compatible. Controls output switch state.
STATUS Open Drain digital diagnostic pin.
STAT_DIS
Active high CMOS compatible pin, to disable the STATUS pin.
5/34
Page 6
Block diagram and pin configuration VN5E160S-E

Figure 2. Configuration diagram (top view)

V
CC
OUTPUT OUTPUT
V
CC
5 6
7
8
4 3 2
1
STAT_DIS STATUS INPUT GND
SO-8

Table 2. Suggested connections for unused and not connected pins

Connection / pin Status N.C. Output Input STAT_DIS
Floating X X X X X
To ground
Not
allowed
X
Not
allowed
Through 10KΩ
resistor
Through 10KΩ
resistor
6/34
Page 7
VN5E160S-E Electrical specifications

2 Electrical specifications

Figure 3. Current and voltage conventions

I
V
CC
V
S
V
F
CC
I
SD
V
Note: V
= V
F
SD
- VCC during reverse battery condition.
OUT
I
IN
V
IN
INPUT

2.1 Absolute maximum ratings

Stressing the device above the ratings listed in the “Absolute maximum ratings” tables may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to the conditions in the “Absolute maximum ratings” tables for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and others relevant quality documents.

Table 3. Absolute maximum ratings

GND
OUTPUTSTAT_DIS
STATUS
I
GND
I
OUT
I
STAT
V
STAT
V
OUT
Symbol Parameter Value Unit
V
- V
- I
I
- I
I
STAT
I
STAT_DIS
E
DC supply voltage 41 V
CC
Reverse DC supply voltage 0.3 V
CC
DC reverse ground pin current 200 mA
GND
DC output current Internally limited A
OUT
Reverse DC output current 6 A
OUT
I
DC input current +10 / -1 mA
IN
DC status current +10 / -1 mA
DC status disable current +10 / -1 mA
Maximum switching energy (single pulse)
MAX
(L=8 mH; R
=0Ω; V
L
=13.5V; T
bat
jstart
=150ºC; I
OUT
= I
limL
(Typ.) )
36 mJ
7/34
Page 8
Electrical specifications VN5E160S-E
Table 3. Absolute maximum ratings (continued)
Symbol Parameter Value Unit
Electrostatic discharge (Human body model: R=1.5KΩ; C=100pF)
–INPUT
ESD
–STATUS
V
–STAT_DIS –OUTPUT –V
CC
V
T
Charge device model (CDM-AEC-Q100-011) 750 V
ESD
Junction operating temperature -40 to 150 °C
T
j
Storage temperature - 55 to 150 °C
stg
4000 4000 4000 5000 5000
V V V V V

Table 4. Thermal data

Symbol Parameter Max. value Unit
R
thj-pins
R
thj-amb
Thermal resistance junction-pins 30 °C/W
Thermal resistance junction-ambient See Figure 36. °C/W
8/34
Page 9
VN5E160S-E Electrical specifications

2.2 Electrical characteristics

Values specified in this section are for 8V<VCC<28V; -40°C< Tj <150°C, unless otherwise stated.

Table 5. Power section

Symbol Parameter Test conditions Min. Typ. Max. Unit
V
V
V
USDhyst
R
V
I
L(off1)
1. PowerMOS leakage included.
Operating supply voltage 4.5 13 28 V
CC
Undervoltage shutdown 3.5 4.5 V
USD
Undervoltage shutdown hysteresis
I
=1A; Tj=25°C
OUT
On state resistance
ON
Clamp voltage IS=20 mA 41 46 52 V
clamp
I
Supply current
S
Off state output current
Output - VCC diode
V
F
voltage
I
=1A; Tj=150°C
OUT
=1A; VCC=5V; Tj=25°C
I
OUT
Off State; V
=25°C
T
j
CC
On State; VIN=5V; VCC=13V;
=0A
I
OUT
V
IN=VOUT
V
IN=VOUT
-I
OUT
=0V; VCC=13V; Tj=25°C =0V; VCC=13V; Tj=125°C00
=0.6A; Tj=150°C 0.7 V
Table 6. Switching (VCC=13V; Tj=25°C)
=13V; VIN=V
OUT
=0V;
0.5 V
160
mΩ
320
mΩ
210
mΩ
(1)
2
1.9
(1)
5
3.5µAmA
0.01 35µA µA
Symbol Parameter Test conditions Min. Typ. Max. Unit
=13Ω
R
L
(see Figure 6.)
=13Ω
R
L
(see Figure 6.)
RL=13Ω
(see Figure 6.)
RL=13Ω
(see Figure 6.)
10 µs
15 µs
See
Figure 26.
See
Figure 28.
70 µJ
40 µJ
dV
dV
t
d(on)
t
d(off)
OUT
OUT
W
W
/dt
/dt
ON
OFF
Turn-On delay time
Turn-Off delay time
Turn-On voltage slope RL=13Ω
(on)
Turn-Off voltage slope RL=13Ω
(off)
Switching energy losses during t
won
Switching energy losses during t
woff
V/µs
V/µs
9/34
Page 10
Electrical specifications VN5E160S-E

Table 7. Status pin (VSD=0)

Symbol Parameter Test conditions Min. Typ. Max. Unit
V
STAT
I
LSTAT
C
STAT
V

Table 8. Protection

Status low output voltage
Status leakage current
Status pin input capacitance
Status clamp voltage
SCL
(1)
= 1.6 mA, VSD=0V 0.5 V
I
STAT
Normal operation or V
= 5V
V
STAT
SD
=5V,
Normal operation or VSD=5V, V
= 5V
STAT
I
STAT
I
STAT
= 1mA = - 1mA
5.5
-0.7
10 µA
100 pF
7V
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
T
limH
I
limL
TSD
T
T
DC short circuit current
Short circuit current during thermal cycling
V
=13V; 5V<VCC<28V
CC
=13V; TR<Tj<T
V
CC
TSD
Shutdown temperature
Reset temperature TRS + 1 TRS + 5 °C
R
Thermal reset of
RS
STATUS
7101414A
2.5 A
150 175 200 °C
135 °C
V
A
T
HYST
t
SDL
V
DEMAG
V
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles.
Thermal hysteresis (T
TSD-TR
Status delay in overload conditions
Turn-off output voltage clamp
Output voltage drop
ON
limitation
)
T
I
OUT
I
OUT
(see Figure 4)20µs
j>TTSD
=1A; VIN=0; L=20mH VCC-41 VCC-46 VCC-52 V
=0.03A (see Figure 5.)
Tj= -40°C...+150°C
7°C
25 mV
10/34
Page 11
VN5E160S-E Electrical specifications

Table 9. Open load detection (8V<VCC<18V)

Symbol Parameter Test conditions Min. Typ. Max. Unit
t
DOL(on)
t
DSTKON
I
L(off2)
td_vol
I
t
POL
V
Open load ON state
OL
detection threshold
Open load ON state detection delay
Delay between INPUT falling edge and STATUS rising edge in open load condition
Open load OFF state voltage detection
OL
threshold
Output short circuit to Vcc detection delay at turn-off
Off state output current
Delay response from output rising edge to STATUS falling edge in open load
VIN = 5V 10 40 mA
I
= 0A, VCC=13V
OUT
(see Figure 4)
= 0A (see Figure 4) 200 500 1200 µs
I
OUT
200 µs
VIN = 0V 2 4 V
See Figure 4 180 t
= 0V; V
V
IN
(see Section 3.4: Open
OUT
= 4V
-75 0 µA
POL
µs
load detection in Off state)
V
IN
= 0V; V
= 4V 20 µs
OUT

Table 10. Logic input

Symbol Parameter Test conditions Min. Typ. Max. Unit
V
V
V
I(hyst)
V
V
I
SDL
V
I
SDH
V
SD(hyst)
V
SDCL
Input low level 0.9 V
IL
I
Low level input current VIN = 0.9V 1 µA
IL
Input high level 2.1 V
IH
High level input current VIN = 2.1V 10 µA
I
IH
Input hysteresis voltage 0.25 V
I
= 1mA
Input clamp voltage
ICL
STAT_DIS low level voltage 0.9 V
SDL
IN
= -1mA
I
IN
5.5
-0.7
Low level STAT_DIS current VSD=0.9V 1 µA
STAT_DIS high level voltage 2.1 V
SDH
High level STAT_DIS current
V
=2.1V 10 µA
SD
STAT_DIS hysteresis voltage 0.25 V
STAT_DIS clamp voltage
ISD=1mA
=-1mA
I
SD
5.5
-0.7
7V
7V
V
V
11/34
Page 12
Electrical specifications VN5E160S-E

Figure 4. Status timings

OPEN LOAD STATUS TIMING (without external pull-up)
I
< I
OUT
V
IN
V
STAT
t
DOL(on)
OL
V
< V
OUT
t
POL
OUTPUT STUCK TO Vcc
I
> I
OUT
V
V
IN
STAT
t
DOL(on)
OL
V
t
DSTKON
OUT
> V
OPEN LOAD STATUS TIMING (with external pull-up)
I
< I
OUT
V
OL
IN
V
STAT
t
DOL(on)
OL
V
> V
OUT
OL
OVER TEMP STATUS TIMING
Tj > T
V
V
IN
STAT
t
SDL
OL
TSD
t
SDL

Figure 5. Output voltage drop limitation

Vcc-V
out
Tj=150oC
V
on
V
on/Ron(T)
=25oC
T
j
=-40oC
T
j
I
out
12/34
Page 13
VN5E160S-E Electrical specifications

Figure 6. Switching characteristics

V
OUT
dV
OUT
t
Won
80%
/dt
(on)
t
r
10%
t
Woff
90%
t
f
dV
OUT
/dt
(off)
t
INPUT
t
d(on)
t
d(off)

Table 11. Truth table

Conditions INPUT OUTPUT STATUS (VSD=0V)
Normal operation
Overtemperature
Undervoltage
Overload &
Short circuit to GND
Output voltage > V
Output current < I
OL
OL
L H
L H
L H
H
(no power limitation)
H
(power limitation)
L H
L H
L H
L L
L L
X
Cycling
H H
L H
t
(1)
H H
H
L
X X
H
L
(2)
L
H
(3)
H
L
1. If the VSD is high, the STATUS pin is in a high impedance.
2. The STATUS pin is low with a delay equal to t
3. The STATUS pin becomes high with a delay equal to t
after INPUT falling edge.
DSTKON
POL
after INPUT falling edge.
13/34
Page 14
Electrical specifications VN5E160S-E

Table 12. Electrical transient requirements

ISO 7637-2:
2004(E)
Tes t puls e
Test levels
III IV
(1)
Number of
pulses or
test times
Burst cycle / pulse
repetition time
Delays and impedance
1 -75 V -100 V
2a +37 V +50 V
5000
pulses
5000
pulses
0.5 s 5 s 2 ms, 10 Ω
0.2 s 5 s 50 µs, 2 Ω
3a -100 V -150 V 1h 90 ms 100 ms 0.1 µs, 50 Ω
3b +75 V +100 V 1h 90 ms 100 ms 0.1 µs, 50 Ω
4 -6 V -7 V 1 pulse 100 ms, 0.01
(2)
5b
ISO 7637-2:
+65 V +87 V 1 pulse 400 ms, 2 Ω
Test level results
(1)
2004(E)
Tes t puls e
III IV
1C C
2a C C
3a C C
3b C C
4C C
5b
(2)
CC
Ω
1. The above test levels must be considered referred to VCC = 13.5V except for pulse 5b.
2. Valid in case of external load dump clamp: 40V maximum referred to ground.
Class Contents
C All functions of the device are performed as designed after exposure to disturbance.
E
One or more functions of the device are not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device.
14/34
Page 15
VN5E160S-E Electrical specifications

2.3 Waveforms

Figure 7. Normal operation

Normal operation
INPUT
Nominal load Nominal load
I
OUT
V
STATUS
V
ST_DIS

Figure 8. Undervoltage shutdown

Undervoltage shut-down
V
V
INPUT
I
V
STATUS
V
ST_DIS
CC
OUT
USD
V
USDhyst
UNDEFINED
15/34
Page 16
Electrical specifications VN5E160S-E

Figure 9. Overload or Short to GND

Overload or Short to GND
INPUT
I
>
LimH
I
OUT
V
STATUS
V
ST_DIS
Power Limitation

Figure 10. Intermittent Overload

INPUT
I
>
LimH
I
OUT
Thermal cycling
I
>
LimL
Intermittent Overload
Overload
I
>
LimL
Nominal load
V
STATUS
V
ST_DIS
16/34
Page 17
VN5E160S-E Electrical specifications

Figure 11. Open Load with external pull-up

Open Load
with external pull-up
INPUT
VPU> V
OL
V
t
DOL(on)
OL
V
OUT
I
OUT
V
STATUS
V
ST_DIS

Figure 12. Open Load without external pull-up

Open Load
without external pull-up
INPUT
V
OUT
I
OUT
V
STATUS
V
ST_DIS
I
OUT
t
DOL(on)
< I
OL
I
OL
t
POL
17/34
Page 18
Electrical specifications VN5E160S-E
Figure 13. Short to V
INPUT
V
OUT
I
OUT
V
STATUS
V
ST_DIS
CC
Resistive
Short to V
V
> V
OUT
V
OL
I
> I
OUT
I
OL
t
DSTK(on)
Short to V
CC
Hard
CC
OL
OL
Short to V
V
> V
OUT
I
< I
OUT
t
DOL(on)
CC
OL
OL

Figure 14. TJ evolution in Overload or Short to GND

TJ evolution in
Overload or Short to GND
INPUT
I
OUT
T
J
Self-limitation of fast thermal transients
T
J_START
Power Limitation
I
>
LimH
T
T
TSD
R
< I
T
HYST
LimL
18/34
Page 19
VN5E160S-E Electrical specifications

2.4 Electrical characteristics curves

Figure 15. Off state output current Figure 16. High level input current

Iloff (nA)
300
Iih (µA)
5
250
200
150
100
50
0
-50 -25 0 25 50 75 100 125 150 175
Off State Vcc=13V
Vin=Vout=0V
Tc (°C)
4,5
3,5
2,5
Vin=2.1V
4
3
2
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)

Figure 17. Input clamp voltage Figure 18. Input high level

Vicl (V)
7
6,8
6,6
6,4
6,2
6
5,8
lin=1mA
Vih (V)
3
2,5
2
1,5
1
0,5
5,6
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)

Figure 19. Input low level Figure 20. Low level STAT_DIS current

Vil (V)
2
1,8
1,6
1,4
1,2
1
0,8
0,6
0,4
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Isdl (µA)
5
4,5
3,5
2,5
1,5
Vsd= 0.9V
4
3
2
1
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
19/34
Page 20
Electrical specifications VN5E160S-E
Figure 21. On state resistance vs T
Ron (mOhm)
300
250
200
150
100
50
Iout= 1A
Vcc=13V
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Figure 23. On state resistance vs V
Ron (mOhm)
300
250
200
150
100
50
0 5 10 15 20 25 30 35
Vcc (V)
case
CC
Tc=150°C
Tc=125°C
Tc=25°C
Tc=-40°C

Figure 22. High level STAT_DIS current

Isdh (µA)
5
4,5
3,5
2,5
Vsd= 2.1V
4
3
2
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)

Figure 24. Low level input current

Iil (µA)
5
4,5
3,5
2,5
1,5
Vin=0.9V
4
3
2
1
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Figure 25. I
Ilimh (A)
20
15
10
5
0
-50 -25 0 25 50 75 100 125 150
LIM
vs T
Vcc=13V
case
Tc (°C)
20/34

Figure 26. Turn-On voltage slope

(dVout/dt )On (V/ms)
1000
900
800
700
600
500
400
300
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Vcc=13V
RI=13 Ohm
Page 21
VN5E160S-E Electrical specifications

Figure 27. Undervoltage shutdown Figure 28. Turn-Off voltage slope

Vusd (V)
7
(dVout/dt )Off (V/ms)
1400
6
5
4
3
2
1
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
1200
1000
800
600
400
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Vcc=13V
RI= 13 Ohm

Figure 29. STAT_DIS clamp voltage Figure 30. High level STAT_DIS voltage

Vsdcl(V)
10
9
8
7
6
5
4
Isd = 1 mA
VsdH(V)
3
2,5
2
1,5
1
0,5
3
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)

Figure 31. Low level STAT_DIS voltage

VsdL(V)
3
2,5
2
1,5
1
0,5
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
21/34
Page 22
Application information VN5E160S-E

3 Application information

Figure 32. Application schematic

+5V
R
R
MCU
R
prot
prot
prot
+5V
STAT_DIS
INPUT
STATUS
V
GND
GND
R
GND
V
CC
OUTPUT
D
GND

3.1 GND protection network against reverse battery

3.1.1 Solution 1: resistor in the ground line (R
GND
only)
D
ld
This solution can be used with any type of load.
The following is an indication on how to dimension the R
1. R
2. R
where -I
≤ 600mV / (I
GND
≥ (−VCC) / (-I
GND
is the DC reverse ground pin current and can be found in the absolute
GND
S(on)max
GND
).
)
maximum rating section of the device datasheet.
Power dissipation in R
P
= (-VCC)2/R
D
GND
(when VCC<0: during reverse battery situations) is:
GND
This resistor can be shared amongst several different HSDs. Please note that the value of this resistor should be calculated with formula (1) where I maximum on-state currents of the different devices.
Please note that if the microprocessor ground is not shared by the device ground then the R
will produce a shift (I
GND
S(on)max
* R values. This shift will vary depending on how many devices are ON in the case of several high side drivers sharing the same R
22/34
GND
resistor.
GND
S(on)max
) in the input thresholds and the status output
GND
becomes the sum of the
.
Page 23
VN5E160S-E Application information
If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then ST suggests Solution 2 is used (see below).
3.1.2 Solution 2: diode (D
A resistor (R
=1kΩ) should be inserted in parallel to D
GND
) in the ground line
GND
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network will produce a shift (~600mV) in the input threshold and in the status output values, if the microprocessor ground is not common to the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network.

3.2 Load dump protection

Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds to V
max DC rating. The same applies if the device is subject to transients on the VCC line
CC
that are greater than the ones shown in the ISO T/R 7637/2 table.

3.3 MCU I/Os protection

If a ground protection network is used and negative transient are present on the VCC line, the control pins will be pulled negative. ST suggests that a resistor (R to prevent the µC I/Os pins to latch-up.
The value of these resistors is a compromise between the leakage current of µC and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC I/Os.
if the device drives an
GND
) be inserted in line
prot
-V
CCpeak/Ilatchup
≤ R
prot
Calculation example:
For V
5kΩ ≤ R
Recommended R
CCpeak
≤ 180kΩ.
prot
= - 100V and I
prot
≤ (V
OHµC-VIH-VGND
≥ 20mA; V
latchup
value is 10kΩ.
) / I
IHmax
OHµC
≥ 4.5V
23/34
Page 24
Application information VN5E160S-E

3.4 Open load detection in Off state

Off-state open-load detection requires an external pull-up resistor (RPU) connected between the OUTPUT pin and a positive supply voltage (V microprocessor.
The external resistor has to be selected according to the following requirements:
1. No false open load indication when load is connected: in this case we have to avoid
V
to be higher than V
OUT
V
= (VPU/(RL+RPU))RL<V
OUT
; this results in the following condition
Olmin
Olmin.
2. No misdetection when load is disconnected: in this case the V
V
Because I up resistor R
; this results in the following condition RPU<(V
OLmax
may significantly increase if V
s(OFF)
should be connected to a supply that is switched OFF when the module is in
PU
standby.
) like the +5V line used to supply the
PU
has to be higher than
OUT
PU–VOLmax
is pulled high (up to several mA), the pull-
out
)/I
L(off2)
.
The values of V
OLmin
, V
OLmax
and I
are available in the Electrical characteristics
L(off2)
section.

Figure 33. Open load detection in Off state

CC
V
IN P U T
STATUS
DRIVER
+
LOGIC
+
-
V
GROUND
V batt. VPU
L(off2)
I
OUT
R
OL
PU
R
L
R
24/34
Page 25
VN5E160S-E Application information

3.5 Maximum demagnetization energy (VCC= 13.5V)

Figure 34. Maximum turn-Off current versus inductance (for each channel)

100
A: T
B: T
C: T
L
A
C
jstart
jstart
jstart
B
= 150°C single pulse
= 100°C repetitive pulse
= 125°C repetitive pulse
10
1
I (A)
0,1
0,1110100L (mH)
VIN, I
Demagnetization Demagnetization Demagnetization
Note: Values are generated with R
In case of repetitive pulses, T must not exceed the temperature specified above for curves A and B.
=0 Ω.
L
(at beginning of each demagnetization) of every pulse
jstart
t
25/34
Page 26
Package and PCB thermal data VN5E160S-E

4 Package and PCB thermal data

4.1 SO-8 thermal data

Figure 35. SO-8 PC board

Note: Layout condition of R
thickness=2mm, Cu thickness= 35µm, Copper areas: from minimum pad lay-out to 2cm
Figure 36. R
RTHj_amb(°C/W)
thj-amb
110
100
90
80
70
60
0 0.5 1 1.5 2 2.5
and Zth measurements (PCB: FR4 area= 4.8mm x 4.8mm, PCB
th
Vs. PCB copper area in open box free air condition
2
).
PC B Cu heatsink area (cm^2)
26/34
Page 27
VN5E160S-E Package and PCB thermal data

Figure 37. SO-8 thermal impedance junction ambient single pulse

ZT H (°C/W)
1000
Footprint
100
10
1
0.1
0.0001 0.001 0.01 0.1 1 10 100 1000 Time (s)
Equation 1: pulse calculation formula
Z
THδ
where δ = tP/T
R
TH
δ Z
THtp
1 δ–()+⋅=
2 cm
2

Figure 38. Thermal fitting model of a single channel HSD in SO-8

b. The fitting model is a semplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
(b)
27/34
Page 28
Package and PCB thermal data VN5E160S-E

Table 13. Thermal parameter

Area/island (cm2)Footprint2
R1 (°C/W) 1.2
R2 (°C/W) 6
R3 (°C/W) 3.5
R4 (°C/W) 21
R5 (°C/W) 16
R6 (°C/W) 58 28
C1 (W.s/°C) 0.0008
C2 (W.s/°C) 0.0016
C3 (W.s/°C) 0.0075
C4 (W.s/°C) 0.045
C5 (W.s/°C) 0.35
C6 (W.s/°C) 1.05 2
28/34
Page 29
VN5E160S-E Package and packing information

5 Package and packing information

5.1 ECOPACK® packages

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second-level interconnect. The category of Second-Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

5.2 Package mechanical data

Figure 39. SO-8 package dimensions

29/34
Page 30
Package and packing information VN5E160S-E

Table 14. SO-8 mechanical data

Dim.
Min. Typ. Max.
A 1.75
a1 0.1 0.25
a2 1.65
a3 0.65 0.85
b0.35 0.48
b1 0.19 0.25
C 0.25 0.5
c1 45 (typ.)
D4.8 5
E5.8 6.2
e1.27
Millimeter
e3 3.81
F3.8 4
L 0.4 1.27
M 0.6
S 8 (max.)
L1 0.8 1.2
30/34
Page 31
VN5E160S-E Package and packing information

5.3 Packing information

Figure 40. SO-8 tube shipment (no suffix)

B
C
Base Q.ty 100 Bulk Q.ty 2000 Tube length (± 0.5) 532
A
A 3.2 B 6 C (± 0.1) 0.6
All dimensions are in mm.

Figure 41. SO-8 tape and reel shipment (suffix “TR”)

Tape dimensions
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986
Tape width W 12 Tape Hole Spacing P0 (± 0.1) 4 Component Spacing P 8 Hole Diameter D (+ 0.1/-0) 1.5 Hole Diameter D1 (min) 1.5 Hole Position F (± 0.05) 5.5 Compartment Depth K (max) 4.5 Hole Spacing P1 (± 0.1) 2
All dimensions are in mm.
End
Reel dimensions
Base Q.ty 2500 Bulk Q.ty 2500 A (max) 330 B (min) 1.5 C (± 0.2) 13 F 20.2 G (+ 2 / -0) 12.4 N (min) 60 T (max) 18.4
All dimensions are in mm.
Top
cover
tape
500mm min
Empty components pockets saled with cover tape.
User direction of feed
Start
No componentsNo components Components
500mm min
31/34
Page 32
Order codes VN5E160S-E

6 Order codes

Table 15. Device summary

Package
Tube Tape and reel
SO-8 VN5E160S-E VN5E160STR-E
Order codes
32/34
Page 33
VN5E160S-E Revision history

7 Revision history

Table 16. Document revision history

Date Revision Changes
4-Jun-2007 1 Initial release.
Document restructured. Changed Description on cover page.
<18V): added td_vol parameter.
CC
18-Feb-2008 2
Table 9: Open load detection (8V<V
Changed Section 2.3: Waveforms. Added Section 2.4: Electrical characteristics curves. Added Section 3.5: Maximum demagnetization energy (VCC = 13.5V). Added Section 4.1: SO-8 thermal data.
33/34
Page 34
VN5E160S-E
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