Datasheet VN5E016AH-E Datasheet (ST)

16 mΩ high-side driver with analog current sense

Features

Max supply voltage V

Operating voltage range V

Max on-state resistance (per ch.) R

Current limitation (typ) I

Off-state supply current I

1. Typical value with all loads connected.

■ General

– Inrush current active management by

power limitation
– Very low standby current
– 3.0 V CMOS compatible inputs
– Optimized electromagnetic emissions
– Very low electromagnetic susceptibility
– In compliance with the 2002/95/EC

European directive

■ Diagnostic functions

– Proportional load current sense
– High current sense precision for wide

current range
– Current sense disable
– Off-state open-load detection
– Output short to V

indication

CC

– Overload and short to ground (power

limitation) indication
– Thermal shutdown indication

■ Protections

– Undervoltage shutdown
– Overvoltage clamp
– Load current limitation
– Self limiting of fast thermal transients
– Protection against loss of ground and loss

of V

CC

– Overtemperature shutdown with auto

restart (thermal shutdown)

CC

CC

ON

LIMH

S

4.5 to 28V

41V

16 mΩ

73 A

(1)

2 µA

VN5E016AH-E

for automotive applications

– Reverse battery protected
– Electrostatic discharge protection

Applications

■ All types of resistive, inductive and capacitive

loads

■ Suitable as LED driver

Description

The VN5E016AH-E is a single channel high-side
driver manufactured in the ST proprietary
VIPower™ M0-5 technology and housed in the
tiny HPak package. The VN5E016AH-E is
designed to drive 12 V automotive grounded
loads delivering protection, diagnostics and easy
3 V and 5 V CMOS compatible interface with any
microcontroller.

The device integrates advanced protective
functions such as load current limitation, inrush
and overload active management by power
limitation, overtemperature shut-off with auto
restart and overvoltage active clamp.

A dedicated analog current sense pin is
associated with every output channel to provide
enhanced diagnostic functions. These functions
include fast detection of overload and short-circuit
to ground through power limitation indication,
overtemperature indication, short-circuit to V
diagnosis and ON-state and OFF-state open-load
detection.

The current sensing and diagnostic feedback of
the whole device can be disabled by pulling the
CS_DIS pin high to allow sharing of the external
sense resistor with other similar devices

.

CC

August 2010 Doc ID 15994 Rev 4 1/37

www.st.com

1

Contents VN5E016AH-E

Contents

1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.4 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

2.5 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 24

3.1.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 24

3.1.2 Solution 2: a diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . 25

3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

3.3 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

3.4 Current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

3.4.1 Short to VCC and OFF-state open-load detection . . . . . . . . . . . . . . . . . 27

3.5 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . 28

4 Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

4.1 HPak thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

5.1 ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

5.2 Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

6 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

2/37 Doc ID 15994 Rev 4

VN5E016AH-E List of tables

List of tables

Table 1. Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6

Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 5. Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 6. Switching (V

Table 7. Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 8. Protection and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 9. Current sense (8 V < V
Table 10. Open-load detection (8 V < V

Table 11. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Table 12. Electrical transient requirements (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Table 13. Electrical transient requirements (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Table 14. Electrical transient requirements (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Table 15. Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Table 16. Package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Table 17. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Table 18. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

=13V, Tj = 25 °C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

CC

< 18 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

CC

< 18 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

CC

Doc ID 15994 Rev 4 3/37

List of figures VN5E016AH-E

List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 2. Configuration diagram (top view) not in scale. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 4. Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 5. Open-load Off-state delay timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 6. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 7. Delay response time between rising edge of output current and rising edge of current sense

(CS enabled). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 8. Output voltage drop limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 9. I

OUT/ISENSE

Figure 10. Maximum current sense ratio drift vs load current

Figure 11. Normal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Figure 12. Overload or Short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Figure 13. Intermittent overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 14. OFF-state open-load with external circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 15. Short to V
Figure 16. T

evolution in overload or short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

J

Figure 17. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 18. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 19. Input clamp level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 20. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 21. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 22. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 23. On-state resistance vs T
Figure 24. On-state resistance vs V

Figure 25. Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Figure 26. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Figure 27. I

LIMH

vs T

Figure 28. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Figure 29. CS_DIS high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 30. CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 31. CS_DIS low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 32. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Figure 33. Current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Figure 34. Maximum turn off current versus inductance
Figure 35. PC board

Figure 36. Rthj-amb Vs. PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 29

Figure 37. HPak thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Figure 38. Thermal fitting model of a single channel HSD in HPak

Figure 39. Package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Figure 40. HPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Figure 41. HPAK tape and reel (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

vs I

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

CC

case

(1)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

OUT

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

case

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

CC

(1)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

(1)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

(1)

. . . . . . . . . . . . . . . . . . . . . . . . . 30

4/37 Doc ID 15994 Rev 4

VN5E016AH-E Block diagram and pin description

1 Block diagram and pin description

Figure 1. Block diagram

V

CC

Signal Clamp

Undervoltage

IN

CS_
DIS

CS

LOGIC

Table 1. Pin functions

Control & Diagnostic

DRIVER

Over

temp.

V

SENSEH

OVERLOAD PROTECTION

(ACTIVE POWER LIMITATION)

Current

Limitation

Current

Sense

Power
Clamp

V

ON

Limitation

OFF State
Open load

OUT

GND

Name Function

V

CC

OUTPUT Power output

Battery connection

(1)

GND Ground connection

INPUT

CURRENT

SENSE

Voltage controlled input pin with hysteresis, CMOS compatible. Controls output
switch state

Analog current sense pin, delivers a current proportional to the load current

CS_DIS Active high CMOS compatible pin, to disable the current sense pin

1. Pins 1 and 7 must be externally tied together.

Doc ID 15994 Rev 4 5/37

Block diagram and pin description VN5E016AH-E

Figure 2. Configuration diagram (top view) not in scale

1234 567

IN

GND

OUT

Table 2. Suggested connections for unused and not connected pins

Vcc

CS CS_DIS

OUT

Connection / pin Current sense Output Input CS_DIS

Floating Not allowed X X X

To ground

Through 1 kΩ

resistor

Through 22 kΩ

resistor

Through 10 kΩ

resistor

Through 10 kΩ

resistor

6/37 Doc ID 15994 Rev 4

VN5E016AH-E Electrical specifications

2 Electrical specifications

Figure 3. Current and voltage conventions

I

S

V

CC

I

OUT

V

CSD

I

CSD

CS_DIS

OUTPUT

I

IN

V

IN

INPUT

GND

2.1 Absolute maximum ratings

Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality document.

Table 3. Absolute maximum ratings

Symbol Parameter Value Unit

V

-V

I

GND

I

OUT

-I

I

CSD

V

CSENSE

E

DC supply voltage 41 V

CC

Reverse DC supply voltage 0.3 V

CC

DC reverse ground pin current 200 mA

DC output current

Reverse DC output current 20 A

OUT

DC input current -1 to 10 mA

I

IN

DC current sense disable input current -1 to 10 mA

Current sense maximum voltage (VCC>0)

Maximum switching energy (single pulse)

MAX

(L = 1.55 mH; R

= I

limL

(Typ.))

I

OUT

= 0Ω; V

L

= 13.5V; T

bat

CURRENT
S

ENSE

I

GND

= 150ºC;

jstart

I

SENSE

V

SENSE

V

OUT

Internally

limited

V

-41

CC

+V

CC

350 mJ

V

CC

A

V
V

Doc ID 15994 Rev 4 7/37

Electrical specifications VN5E016AH-E

Table 3. Absolute maximum ratings (continued)

Symbol Parameter Value Unit

Electrostatic discharge (human body model: R = 1.5KΩ;
C = 100pF)

V

V

ESD

ESD

T

T

– Input
– Current sense
–CS_DIS
– Output
–V

CC

Charge device model (CDM-AEC-Q100-011) 750 V

Junction operating temperature -40 to 150 °C

j

Storage temperature -55 to 150 °C

stg

4000
2000
4000
5000
5000

V
V
V
V
V

2.2 Thermal data

Table 4. Thermal data

Symbol Parameter Max. value Unit

R

thj-case

R

thj-amb

Thermal resistance junction-case 0.63 °C/W

Thermal resistance junction-ambient 69.3 °C/W

8/37 Doc ID 15994 Rev 4

VN5E016AH-E Electrical specifications

2.3 Electrical characteristics

Values specified in this section are for 8 V < VCC<28V, -40°C< Tj < 150 °C, unless
otherwise specified.

Table 5. Power section

Symbol Parameter Test conditions Min. Typ. Max. Unit

V

V

V

USDhyst

R

V

clamp

I

L(off1)

Table 6. Switching (VCC=13V, Tj = 25 °C)

Operating supply voltage 4.5 13 28 V

CC

Undervoltage shutdown - 3.5 4.5 V

USD

Undervoltage shutdown
hysteresis

I

= 5 A; Tj= 25 °C - - 16

OUT

On-state resistance

ON

Output - VCC diode

V

F

voltage

= 5 A; Tj= 150 °C - - 32

OUT

I

= 5 A; VCC= 5 V; Tj= 25 °C - - 20

OUT

= 5A; Tj = 150°C - - 0.7 V

-I

OUT

Clamp Voltage Icc = 20 mA; I

I

Supply current

S

Off-state output current

Off-state; V
V

On-state; V
I

VIN = V
T

V
T

= V

IN

OUT

= 25°C

j

= V

IN

= 125°C

j

CC

= V

OUT

CC

= 0A

= 0V; VCC = 13V;

OUT

= 0V; VCC = 13V;

OUT

-0.5 - V

= 0A 41 46 52 V

OUT

= 13V; Tj = 25°C;

= 0V

SENSE

= 13V; VIN = 5V;

-2 5

-1.53mA

00.01 3

0- 5

mΩI

µA

µA

Symbol Parameter Test conditions Min. Typ. Max. Unit

(dV

(dV

t

d(on)

t

d(off)

OUT

OUT

Turn-on delay time RL = 2.6 Ω (see Figure 6)- 15 - µs

Turn-off delay time RL = 2.6 Ω (see Figure 6)- 45 - µs

/dt)onTurn-on voltage slope RL = 2.6 Ω -0.2 -V/µs

/dt)

Turn-off voltage slope RL = 2.6 Ω -0.2 -V/µs

off

Switching energy

W

ON

losses at turn-on

)

(t

won

R

= 2.6 Ω (see Figure 6)- 1.4 - mJ

L

Switching energy

W

OFF

losses at turn-off

)

(t

woff

R

= 2.6 Ω (see Figure 6)- 0.8 - mJ

L

Doc ID 15994 Rev 4 9/37

Electrical specifications VN5E016AH-E

Table 7. Logic Inputs

Symbol Parameter Test conditions Min. Typ. Max. Unit

V

Input low level voltage - - 0.9 V

IL

Low level input current VIN = 0.9V 1 - - µA

I

IL

V

V

I(hyst)

V

V

CSDL

I

CSDL

V

CSDH

I

CSDH

V

CSD(hyst)

V

CSCL

Input high level voltage 2.1 - - V

IH

I

High level input current VIN = 2.1V - - 10 µA

IH

Input hysteresis voltage 0.25 - - V

I

= 1mA 5.5 - 7

Input clamp voltage

ICL

IN

= -1mA - -0.7 -

I

IN

CS_DIS low level voltage - - 0.9 V

Low level CS_DIS current V

= 0.9V 1 - - µA

CSD

CS_DIS high level voltage 2.1 - - V

High level CS_DIS current V

= 2.1V - - 10 µA

CSD

CS_DIS hysteresis voltage 0.25 - - V

I

= 1mA 5.5 - 7

CS_DIS clamp voltage

CSD

= -1mA - -0.7 -

I

CSD

V

V

Table 8. Protection and diagnostics

(1)

Symbol Parameter Test conditions Min. Typ. Max. Unit

I

limH

I

limL

T

TSD

T

R

T

RS

T

HYST

V

DEMAG

V

ON

1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles

Short circuit current

Short circuit current
during thermal cycling

Shutdown temperature 150 175 200 °C

Reset temperature

Thermal reset of status 135 - - °C

Thermal hysteresis
(T

TSD-TR

)

Turn-off output voltage
clamp

Output voltage drop
limitation

VCC = 13V
5V<V

V

I

OUT

<28V

CC

= 13V; TR<Tj<T

CC

= 2A; VIN = 0; L =

6mH

I

= 0.5A;

OUT

= -40°C...150°C

T

j

TSD

54 73 108

108

-18 - A

TRS + 1

TRS + 5

-°C

-7 -°C

V

-41

V

-46

V

CC

CC

CC

-52

-25 -mV

A
A

V

10/37 Doc ID 15994 Rev 4

VN5E016AH-E Electrical specifications

Table 9. Current sense (8 V < VCC<18V)

Symbol Parameter Test conditions Min. Typ. Max. Unit

I

K

K

dK1/K

K

dK2/K

K

dK3/K

I

0

1

2

3

OUT/ISENSE

I

OUT/ISENSE

(1)

Current sense ratio drift

1

I

OUT/ISENSE

(1)

Current sense ratio drift

2

I

OUT/ISENSE

(1)

Current sense ratio drift

3

= 0.25A; V

OUT

Tj = -40°C...150°C

I

= 5A; V

OUT

SENSE

Tj = -40°C...150°C

= 25°C...150°C

T

j

I

= 5A; V

OUT

V

CSD

= -40 °C to 150 °C

T

J

I

= 10A; V

OUT

= -40°C...150°C

T

j

SENSE

= 0V;

SENSE

Tj = 25°C...150°C

I

= 10 A; V

OUT

= 0V;

V

CSD

TJ = -40 °C to 150 °C

I

= 25A; V

OUT

SENSE

Tj = -40°C...150°C

= 25°C...150°C

T

j

I

= 25 A; V

OUT

= 0V;

V

CSD

= -40 °C to 150 °C

T

J

= 0A; V

I

OUT

V

CSD

SENSE

= 5V; VIN = 0V;

Tj = -40°C...150°C

SENSE

SENSE

SENSE

= 0.5V

= 0.5V

= 0.5V;

= 4V

= 4 V;

= 4V

= 4 V;

= 0V;

2950 6490 9400 -

4540

5130

6230

4540

5130

5720

- 11 - + 11 %

4640

4980

5570

4640

4980

5300

- 8 - + 8 %

4650

4860

5150

4600

4860

5090

- 4 - + 4 %

0-1

-

-

-

I

SENSE0

I

OL

V

SENSE

V

SENSEH

I

SENSEH

t

DSENSE1H

Analog sense leakage
current

Openload ON-state
current detection
threshold

Max analog sense
output voltage

Analog sense output

(2)

voltage in fault condition

Analog sense output

(2)

current in fault condition

Delay response time
from falling edge of
CS_DIS pin

I

= 0A; V

OUT

V

= 0V; VIN = 5V;

CSD

= -40°C...150°C

T

j

I

= 2A; V

OUT

= 5V; VIN = 5V;

V

CSD

= -40°C...150°C

T

j

VIN = 5V;

= 5 µA

I

SENSE

I

= 18A; R

OUT

V

= 13V; R

CC

= 13V; V

V

CC

<4V, 1.5A<Iout<25A

V

SENSE

= 90% of I

I

SENSE

= 0V;

SENSE

0-2

= 0V;

SENSE

--1

5-70mA

= 3.9KΩ 5--V

SENSE

= 3.9KΩ -8-V

SENSE

= 5V - 9 - mA

SENSE

SENSE max

- 50 100 µs

µA

(see Figure 4.)

Doc ID 15994 Rev 4 11/37

Electrical specifications VN5E016AH-E

Table 9. Current sense (8 V < VCC< 18 V) (continued)

Symbol Parameter Test conditions Min. Typ. Max. Unit

<4V, 1.5A<Iout<25A

Delay response time

t

DSENSE1L

from rising edge of
CS_DIS pin

Delay response time

t

DSENSE2H

from rising edge of
INPUT pin

Delay response time

Δ

t

DSENSE2H

between rising edge of
output current and rising
edge of current sense

Delay response time

t

DSENSE2L

from falling edge of
INPUT pin

1. Parameter guaranteed by design, it is not tested.

2. Fault condition includes: power limitation, overtemperature and open-load OFF-state detection.

Table 10. Open-load detection (8 V < VCC<18V)

V

SENSE

= 10% of I

I

SENSE

(see Figure 4)

<4V, 1.5A<Iout<25A

V

SENSE

I

= 90% of I

SENSE

(see Figure 4)

V
I

SENSE

I

OUT

I

OUTMAX

V
I

<4V,

SENSE

= 90% of I

= 90% of I

= 3A (see Figure 7)

<4V, 1.5A<Iout<25A

SENSE

= 10% of I

SENSE

(see Figure 4)

SENSE max

SENSE max

SENSEMAX,

OUTMAX

SENSE max

-520µs

- 270 600 µs

- - 280 µs

- 100 250 µs

Symbol Parameter Test conditions Min. Typ. Max. Unit

Open-load OFF-state

V

voltage detection

OL

= 0V 2

V

IN

threshold

See

Figure 5

4V

Output short circuit to

t

DSTKON

detection delay at

V

CC

See Figure 5 180 - 1200 µs

turn Off

I

L(off2)r

I

L(off2)f

Off-state output current
at V

OUT

= 4V

Off-state output current
at V

OUT

= 2V

= 0V; V

V

IN

rising from 0V to 4V

V

OUT

= 0V; V

V

IN

falling from VCC to 2V

V

OUT

SENSE

SENSE

= 0V

= V

SENSEH

-120 - 0 µA

;

-50 - 90 µA

Delay response from

= 4 V; VIN = 0V

td_vol

output rising edge to

SENSE

rising edge in

V
open-load

V

OUT

V

SENSE

= 90% of V

SENSEH

- - 20 µs

12/37 Doc ID 15994 Rev 4

VN5E016AH-E Electrical specifications

Figure 4. Current sense delay characteristics

INPUT

CS_DIS

LOAD CURRENT

SENSE CURRENT

t

DSENSE2H

t

DSENSE1L

t

DSENSE1H

t

DSENSE2L

Figure 5. Open-load Off-state delay timing

OUTPUT STUCK TO V

V

IN

V

CS

Figure 6. Switching characteristics

V

OUT

dV

OUT

INPUT

t

Won

80%

/dt

(on)

t

r

t

d(on)

10%

t

d(off)

t

Woff

90%

t

f

CC

V

OUT

V

t

DSTKON

dV

> V

SENSEH

/dt

OUT

OL

(off)

t

t

Doc ID 15994 Rev 4 13/37

Electrical specifications VN5E016AH-E

Figure 7. Delay response time between rising edge of output current and rising

edge of current sense (CS enabled)

V

IN

Δt

DSENSE2H

t

I

OUT

I

SENSE

90% I

OUTMAX

I

OUTMAX

I

SENSEMAX

t

90% I

Figure 8. Output voltage drop limitation

Vcc-Vout

Tj=150oC

Von

Von/Ron(T)

SENSEMAX

t

Tj=25oC

Tj=-40oC

Iout

14/37 Doc ID 15994 Rev 4

VN5E016AH-E Electrical specifications

Figure 9. I

I

/ I

out

sense

6400

6200

6000

5800

5600

5400

max Tj = 25 °C to 150 °C

5200

5000

4800

4600

4400

4200

4000

5 10152025

OUT/ISENSE

max Tj = -40 °C to 150 °C

min Tj = 25 °C to 150 °C

vs I

OUT

typical value

min Tj = -40 °C to 150 °C

I

(A)

OUT

Figure 10. Maximum current sense ratio drift vs load current

dk/k(%)

20

15

10

5

0

-5

-10

-15

-20

5 10152025

1. Parameter guaranteed by design; it is not tested.

I

OUT

(A)

(1)

Doc ID 15994 Rev 4 15/37

Electrical specifications VN5E016AH-E

Table 11. Truth table

Conditions Input Output Sense (V

Normal operation

CSD

L

H

L

H

0

Nominal

=0V)

(1)

Overtemperature

Undervoltage

Overload

Short circuit to GND
(power limitation)

Open-load OFF-state
(with external pull-up)

Short circuit to V

CC

(external pull-up
disconnected)

Negative output voltage
clamp

1. If the V
and external circuit.

is high, the SENSE output is at a high impedance, its potential depends on leakage currents

CSD

L

H

L

H

H

L
L

L
L

X

0

V

SENSEH

0
0

Nominal

(no power limitation)

H

Cycling

V

SENSEH

(power limitation)

L

H

LHV

L

H

L
L

H
H

0

V

SENSEH

SENSEH

V

SENSEH

< Nominal

LL 0

16/37 Doc ID 15994 Rev 4

VN5E016AH-E Electrical specifications

Table 12. Electrical transient requirements (part 1)

ISO 7637-2:

2004(E)

Test pulse

1 -75 V -100 V

2a +37 V +50 V

Test levels

III IV

Number of

pulses or

test times

5000

pulses

5000

pulses

Burst cycle/pulse

repetition time

Delays and
Impedance

0.5 s 5 s 2 ms, 10 Ω

0.2 s 5 s 50 µs, 2 Ω

3a -100 V -150 V 1h 90 ms 100 ms 0.1 µs, 50 Ω

3b +75 V +100 V 1h 90 ms 100 ms 0.1µs, 50 Ω

4 -6 V -7 V 1 pulse -

(2)

5b

Table 13. Electrical transient requirements (part 2)

ISO 7637-2:

+65 V +87 V 1 pulse - 400 ms, 2 Ω

Test level results

(1)

100 ms,

0.01Ω

2004(E)

Test pulse

III IV

1C C

2a C C

3a C C

3b C C

4C C

(2)

5b

1. The above test levels must be considered referred to V

2. Valid in case of external load dump clamp: 40V maximum referred to ground.

Table 14. Electrical transient requirements (part 3)

CC

= 13.5V except for pulse 5b

CC

Class Contents

C All functions of the device are performed as designed after exposure to disturbance.

E

One or more functions of the device are not performed as designed after exposure to
disturbance and cannot be returned to proper operation without replacing the device.

Doc ID 15994 Rev 4 17/37

Electrical specifications VN5E016AH-E

2.4 Waveforms

Figure 11. Normal operation

Normal operation

INPUT

Nominal load Nominal load

I

OUT

V

SENSE

V

CS_DIS

Figure 12. Overload or Short to GND

Overload or Short to GND

INPUT

I

OUT

V

SENSE

V

CS_DIS

I

LimH

>

Power Limitation

I

LimL

Thermal cycling

>

18/37 Doc ID 15994 Rev 4

VN5E016AH-E Electrical specifications

Figure 13. Intermittent overload

Overload or Short to GND

INPUT

I

>

LimH

I

OUT

V

SENSE

V

CS_DIS

Power Limitation

I

LimL

Thermal cycling

>

Figure 14. OFF-state open-load with external circuitry

OFF-State Open Load

with external circutry

INPUT

V

OUT

I

OUT

V

SENSE

V

CS_DIS

V

> V

OUT

OL

V

OL

t

DSTK(on)

V

SENSEH

>

Doc ID 15994 Rev 4 19/37

Electrical specifications VN5E016AH-E

Figure 15. Short to V

V

OUT

I

OUT

V

CS_DIS

CC

Short to V

Resistive

V

OL

t

DSTK(on)

CC

Short to V

CC

Hard

Short to V

V

> V

OUT

t

DSTK(on)

CC

OL

Figure 16. TJ evolution in overload or short to GND

TJ evolution in

Overload or Short to GND

INPUT

T

I

OUT

J

Self-limitation of fast thermal transients

T

J_START

Power Limitation

I

>

LimH

T

TSD

T

R

< I

T

HYST

LimL

20/37 Doc ID 15994 Rev 4

VN5E016AH-E Electrical specifications

2.5 Electrical characteristics curves

Figure 17. Off-state output current Figure 18. High level input current

Iloff [nA]

4000

3500

3000

2500

2000

1500

1000

500

0

-50 - 25 0 25 50 75 100 125 150 175

Tc [°C]

Iih [uA]

5

4.5

4

3.5

3

2.5

2

1.5

1

0.5

0

-50 -25 0 25 50 75 100 125 150 175

Vin= 2.1V

Tc [°C]

Figure 19. Input clamp level Figure 20. Input low level

Vicl [V]

7

6.8

6.6

6.4

6.2

5.8

5.6

5.4

5.2

Iin= 1mA

6

5

-50 -25 0 25 50 75 100 125 150 175

Tc [°C]

Vil [V]

2

1.8

1.6

1.4

1.2

1

0.8

0.6

0.4

0.2

0

-50 -25 0 25 50 75 100 125 150 175

Tc [°C]

Figure 21. Input high level Figure 22. Input hysteresis voltage

Vih [V]

4

3.5

3

2.5

2

1.5

1

0.5

0

-50 -25 0 25 50 75 100 125 150 175

Tc [°C]

Vihyst [V]

1

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0

-50 -25 0 25 50 75 100 125 150 175

Tc [°C]

Doc ID 15994 Rev 4 21/37

Electrical specifications VN5E016AH-E

V

Figure 23. On-state resistance vs T

Ron [mOhm]

100

90

80

70

60

50

40

30

20

10

0

-50 -25 0 25 50 75 100 125 150 175

Iout= 5A
Vcc= 13V

Tc [°C]

case

Figure 24. On-state resistance vs V

Ron [mOhm]

40

30

20

10

0

0 5 10 15 20 25 30 35 40

Vcc [V]

Figure 25. Undervoltage shutdown Figure 26. Turn-on voltage slope

Vusd [V]

16

14

12

10

8

6

4

2

0

-50 -25 0 25 50 75 100 125 150 175

Tc [°C]

(dVout/dt)On [V/ms ]

1000

900

800

700

600

500

400

300

200

100

0

-50 -25 0 25 50 75 100 125 150 175

Vcc= 13V
Rl= 2. 6Ω

Tc [°C]

CC

Tc= 150°C

Tc= 125°C

Tc= 25°C

Tc= -40°C

Figure 27. I

Ilimh [A]

100

90

80

70

60

50

40

-50 -25 0 25 50 75 100 125 150 175

LIMH

cc= 13V

vs T

case

Tc [°C]

Figure 28. Turn-off voltage slope

(dVout/dt)Off [V/ms]

1000

900

800

700

600

500

400

300

200

100

0

-50 -25 0 25 50 75 100 125 150 175

22/37 Doc ID 15994 Rev 4

Vcc= 13V
Rl= 2. 6 Ω

Tc [°C]

VN5E016AH-E Electrical specifications

Figure 29. CS_DIS high level voltage Figure 30. CS_DIS clamp voltage

Vcsdh [V]

4

3.5

3

2.5

2

1.5

1

0.5

0

-50 -25 0 25 50 75 100 125 150 175

Tc [°C]

Vcsdcl [V]

10

9

8

7

6

5

4

3

2

1

0

-50 -25 0 25 50 75 100 125 150 175

Iin= 1mA

Tc [°C]

Figure 31. CS_DIS low level voltage

Vcsdl [V]

4

3.5

3

2.5

2

1.5

1

0.5

0

-50 -25 0 25 50 75 100 125 150 175

Tc [°C]

Doc ID 15994 Rev 4 23/37

Application information VN5E016AH-E

3 Application information

Figure 32. Application schematic

+5V

V

CC

R

prot

CS_DIS

D

ld

μC

R

prot

R

prot

C

ext

IINPUT

CURRENT SENSE

R

SENSE

V

GND

GND

R

GND

D

OUTPUT

GND

3.1 GND protection network against reverse battery

3.1.1 Solution 1: resistor in the ground line (R

This can be used with any type of load.

The following is an indication on how to dimension the R

1. R

2. R

where -I
maximum rating section of the device datasheet.

≤ 600mV / (I

GND

≥ (−VCC) / (-I

GND

is the DC reverse ground pin current and can be found in the absolute

GND

S(on)max

GND

).

)

GND

only)

resistor.

GND

Power dissipation in R

(when VCC<0: during reverse battery situations) is:

GND

Equation 1

= (-VCC)2/R

P

D

GND

This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where I
maximum on-state currents of the different devices.

Please note that if the microprocessor ground is not shared by the device ground then the
R

will produce a shift (I

GND

S(on)max

24/37 Doc ID 15994 Rev 4

* R

) in the input thresholds and the status output

GND

S(on)max

becomes the sum of the

VN5E016AH-E Application information

values. This shift will vary depending on how many devices are ON in the case of several
high side drivers sharing the same R

GND

.

If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize Solution 2 (see below).

3.1.2 Solution 2: a diode (D

A resistor (R

=1kΩ) should be inserted in parallel to D

GND

) in the ground line

GND

inductive load.

This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network will produce a shift (≈600mV) in the input
threshold and in the status output values if the microprocessor ground is not common to the
device ground. This shift will not vary if more than one HSD shares the same diode/resistor
network.

3.2 Load dump protection

Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the
V

max DC rating. The same applies if the device is subject to transients on the VCC line

CC

that are greater than the ones shown in the ISO T/R 7637/1 table.

3.3 MCU I/Os protection

If a ground protection network is used and negative transients are present on the VCC line,
the control pins will be pulled negative. ST suggests to insert a resistor (R
prevent the μC I/Os pins to latch-up.

The value of these resistors is a compromise between the leakage current of
current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of
I/Os.

if the device drives an

GND

prot

) in line to

µC and the

µC

Equation 2

V

Calculation example:

For V

CCpeak

5kΩ ≤ R

= -100V; I

≤ 65kΩ.

prot

latchup

Recommended values: R

CCpeak/Ilatchup

≤ R

≥ 20mA; V

=10kΩ, C

prot

Doc ID 15994 Rev 4 25/37

prot

OHμC

EXT

≤ (V

OHμC-VIH-VGND

≥ 4.5V

= 10nF.

) / I

IHmax

Application information VN5E016AH-E

3.4 Current sense and diagnostic

The current sense pin performs a double function (see Figure 33: Current sense and

diagnostic):

● Current mirror of the load current in normal operation, delivering a current

proportional to the load one according to a know ratio K
The current I
external resistor R
minimum (see parameter V

can be easily converted to a voltage V

SENSE

. Linearity between I

SENSE

SENSE

in Table 9: Current sense (8 V < VCC<18V)). The

OUT

and V

current sense accuracy depends on the output current (refer to current sense electrical
characteristics Table 9: Current sense (8 V < V

● Diagnostic flag in fault conditions, delivering a fixed voltage V

maximum current I

SENSEH

in case of the following fault conditions (refer to Tr ut h t a bl e):

<18V)).

CC

– Power limitation activation

–Overtemperature

–Short to V

in OFF-state

CC

– Open-load in OFF-state with additional external components.

A logic level high on CS_DIS pin sets at the same time all the current sense pins of the
device in a high impedance state, thus disabling the current monitoring and diagnostic
detection. This feature allows multiplexing of the microcontroller analog inputs by sharing of
sense resistance and ADC line among different devices.

.

X

SENSE

by means of an

SENSE

is ensured up to 5V

SENSEH

up to a

Figure 33. Current sense and diagnostic

41V

Overtemperature

Pwr_Lim

SENSEH

CS_DIS

To uC ADC

I

OUT/KX

R

PROT

R

SENSE

I

SENSEH

CURRENT

SENSEn

V

SENSE

V

OL OFF

INPUTn

Main MOSn

+

-

GND

V

PU_CMD

R

I

Loff2r

I

Loff2f

R

PU

PU

Load

PD

V

BAT

V

CC

V

OL

OUTn

26/37 Doc ID 15994 Rev 4

VN5E016AH-E Application information

3.4.1 Short to VCC and OFF-state open-load detection

Short to V

A short circuit between V
V

SENSEH

during the on-state depending on the nature of the short circuit.

OFF-state open-load with external circuitry

CC

and output is indicated by the relevant current sense pin set to

CC

during the device off-state. Small or no current is delivered by the current sense

Detection of an open-load in off mode requires an external pull-up resistor R
the output to a positive supply voltage V

It is preferable V

to be switched off during the module standby mode in order to avoid the

PU

PU

.

connecting

PU

overall standby current consumption to increase in normal conditions, i.e. when load is
connected.

An external pull down resistor R

connected between output and GND is mandatory to

PD

avoid misdetection in case of floating outputs in off-state (see Figure 33: Current sense and

diagnostic).

R

must be selected in order to ensure V

PD

OUT < VOLmin

unless pulled up by the external

circuitry:

Equation 3

OLfoffLPD

min)2(

R

≤ 22 KΩ is recommended.

PD

OUT

−

OFFupPull

_

VVIRV

2

=<⋅=

For proper open-load detection in off-state, the external pull-up resistor must be selected
according to the following formula:

Equation 4

V

OUT

For the values of V

(8 V < V

CC

<18V).

=

ONupPull

_

−

OLmin,VOLmax, IL(off2)r

Doc ID 15994 Rev 4 27/37

and I

IRRVR

⋅⋅−⋅

RR

+

PDPU

see Table 10: Open-load detection

L(off2)f

roffLPDPUPUPD

)2(

OL

max

VV

4

=>

Application information VN5E016AH-E

3.5 Maximum demagnetization energy (VCC=13.5V)

Figure 34. Maximum turn off current versus inductance

100

A

B

C

10

I (A)

1

0,1 1 10 100L (mH)

(1)

A: T

B: T

C: T

VIN, I

= 150°C single pulse

jstart

= 100°C repetitive pulse

jstart

= 125°C repetitive pulse

jstart

L

Demagnetization Demagnetization Demagnetization

1. Values are generated with R
In case of repetitive pulses, T
the temperature specified above for curves A and B.

=0Ω.

L

(at beginning of each demagnetization) of every pulse must not exceed

jstart

t

28/37 Doc ID 15994 Rev 4

VN5E016AH-E Package and PC board thermal data

4 Package and PC board thermal data

4.1 HPak thermal data

Figure 35. PC board

1. Layout condition of R
thickness = 1.8 mm, Cu thickness = 70 µm, Copper areas: from minimum pad lay-out to 8 cm2).

Figure 36. R

thj-amb

(1)

and Zth measurements (PCB FR4 area = 58 mm x 58 mm, PCB

th

Vs. PCB copper area in open box free air condition

RTHjamb

75

70

65

60

55

RTHjamb

50

45

40

35

30

0246810

Doc ID 15994 Rev 4 29/37

Package and PC board thermal data VN5E016AH-E

Figure 37. HPak thermal impedance junction ambient single pulse

Equation 5: pulse calculation formula

where δ = t

Z

/T

P

THδ

RTHδ Z

THtp

1 δ–()+⋅=

Figure 38. Thermal fitting model of a single channel HSD in HPak

(1)

1. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.

30/37 Doc ID 15994 Rev 4

VN5E016AH-E Package and PC board thermal data

Table 15. Thermal parameter

Area/island (cm2)Footprint48

R1 (°C/W) 0.1 - -

R2 (°C/W) 0.2 - -

R3 (°C/W) 2 - -

R4 (°C/W) 8 - -

R5 (°C/W) 28 22 12

R6 (°C/W) 31 25 16

C1 (W.s/°C) 0.0001 - -

C2 (W.s/°C) 0.002 - -

C3 (W.s/°C) 0.05 - -

C4 (W.s/°C) 0.4 - -

C5 (W.s/°C) 0.8 1.4 3

C6 (W.s/°C) 3 6 9

Doc ID 15994 Rev 4 31/37

Package and packing information VN5E016AH-E

5 Package and packing information

5.1 ECOPACK

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK

Figure 39. Package dimension

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

®

.

32/37 Doc ID 15994 Rev 4

VN5E016AH-E Package and packing information

Table 16. Package mechanical data

Data book mm

Ref. dim

Nom. Min. Max.

A - 2.20 2.40

A1 - 0.90 1.10

A2 - 0.03 0.23

b - 0.45 0.60

b4 - 5.20 5.40

c - 0.45 0.60

c2 - 0.48 0.60

D - 6.00 6.20

D1 5.10 - -

E - 6.40 6.60

E1 5.20 - -

e0.85- -

e1 - 1.60 1.80

e2 - 3.30 3.50

e3 - 5.00 5.20

H - 9.35 10.10

L-1-

(L1) 2.80 - -

L2 0.80 - -

L4 - 0.60 1.00

R0.20 - -

V2 - 0° 8°

Doc ID 15994 Rev 4 33/37

Package and packing information VN5E016AH-E

5.2 Packing information

The devices can be packed in tube or tape and reel shipments (see Table 17: Device

summary).

Figure 40. HPAK tube shipment (no suffix)

A

Base q.ty 75

C

Bulk q.ty 3000
Tube length (± 0.5) 532
A 6
B 21.3
C (± 0.1) 0.6

B

All dimensions are in mm.

Figure 41. HPAK tape and reel (suffix “TR”)

REEL DIMENSIONS

All dimensions are in mm.

Base q.ty 2500
Bulk q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 16.4
N (min) 60
T (max) 22.4

TAPE DIMENSIONS

According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986

Tape width W 16
Tape hole spacing P0 (± 0.1) 4
Component spacing P 8
Hole diameter D (+ 0.1/-0) 1.5
Hole diameter D1 (min) 1.5
Hole position F (± 0.05) 7.5
Compartment depth K (max) 2.75
Hole spacing P1 (± 0.1) 2

Top

cover

tape

End

All dimensions are in mm.

34/37 Doc ID 15994 Rev 4

500mm min

Empty components pockets
saled with cover tape.

User direction of feed

Start

No componentsNo components Components

500mm min

VN5E016AH-E Order codes

6 Order codes

Table 17. Device summary

Order codes

Package

Tube Tape and reel

7 pins H-pack VN5E016AH-E VN5E016AHTR-E

Doc ID 15994 Rev 4 35/37

Revision history VN5E016AH-E

7 Revision history

Table 18. Document revision history

Date Revision Changes

07-Jul-2009 1 Initial release.

29-Oct-2009 2 Added Section 5.2: Packing information.

01-Jun-2010 3 Updated Table 16: Package mechanical data.

04-Aug-2010 4

Table 9: Current sense (8 V < V

– Updated dK

test conditions

1/K1

CC

<18V):

36/37 Doc ID 15994 Rev 4

VN5E016AH-E

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Doc ID 15994 Rev 4 37/37