The VN540-E, VN540SP-E, VN540-12-E are
monolithic devices designed in
STMicroelectronics VIPower technology , intended
for driving resistive or inductive loads with one
side connected to ground. Active current limitation
avoids the system power supply dropping in case
of shorted load. Built-in thermal shut-down
protects the chip from overtemperature. The open
drain diagnostic output indicates overtemperature conditions.
Rev 1
November 20051/13
www.st.com
13
Page 2
VN540-E / VN540SP- E / VN540-12-E
Table 1.Absolute Maximum Rating
SymbolParameterValueUnit
V
-V
I
OUT
I
I
I
STAT
V
ESD
P
TOT
T
T
STG
E
CC
CC
R
IN
AS
Power supply voltage45V
Reverse supply voltage-4.0V
Maximum DC load currentInternally limitedA
Reverse output current -10A
Input current ± 10mA
St atus pin current± 10mA
Electrostati c discharge (R = 1.5KW; C = 100pF)2000V
Power dissipation at Tc = 25°C
Junction operating temperatureInternally lim it ed°C
J
Internally limitedw
Storage Temperature-55 to 150 °C
Single pulse avalanche energy500
Electrical Chracteristics (10V < VCC < 36V; -25°C < TJ < 85°C; unles s ot herwise sp ec if ied)
Table 3.Power Section
SymbolParameterT est ConditionsMin.Typ.Max.Unit
V
R
I
I
LGND
V
V
demag
CC
ON
I
LS
Supply voltag e1036V
= 2.8A; TJ = 25°C
I
On state resistance
OUT
I
OUT
= 2.8A;
OFF state
Supply current
S
Output leakage curr ent
Output current at turn-off
OL
Low state output voltage
Output voltage at turn-off
ON state; T
I
= 0A
OUT
Channel OFF
= 45V
V
CC
= VIN = V
V
CC
T
= - 25°C < TJ < 100°C
J
V
= V
IN
I
= 2.8A; L
OUT
= 125°C
J
GND
IL; RLOAD
LOAD
= V
STAT
= 24V
>= 10MΩ
>= 1mHVCC-65 VCC-55 VCC-45
50
90
1
3
mΩ
mΩ
mA
mA
100µΑ
2mA
1.5V
V
Table 4.Switching
SymbolParameterTest ConditionsMin.Typ.Max.Unit
I
t
d(ON)
t
d(OFF)
dI/dt
dI/dt
Turn-on delay on output
current
t
Rise time of output
r
current
Turn-off del ay time of
output current
t
Fall time of Output
f
current
Turn-on current average
(on)
slope
Turn-off current average
(off)
slope
= 2.8A, Resistive Load Input rise
OUT
time < 0.1µs, V
I
= 2.8A, Resistive Load Input rise
OUT
time < 0.1µs, V
I
= 2.8A, Resistive Load Input rise
OUT
time < 0.1µs, V
I
= 2.8A, Resistive Load Input rise
OUT
time < 0.1µs, V
I
= 2.8A,
OUT
I
= I
OUT
LIM
I
= 2.8A,
OUT
I
= I
OUT
LIM
= 24V; TJ = 25°C
CC
= 24V; TJ = 25°C
CC
= 24V; TJ = 25°C
CC
= 24V; TJ = 25°C
CC
; 25°C < TJ < 140°C
; 25°C < TJ < 140°C
40µs
60µs
60µs
25µs
0.5
2
2
4
Α/µs
Α/µs
3/13
Page 4
VN540-E / VN540SP- E / VN540-12-E
Table 5.Logical Input
SymbolParameterTest ConditionsMin.Typ.M ax.Unit
V
V
V
I(HYST)
I
V
Input low level vol tage2.0V
IL
Input high level vol tage 3.5V
IH
Input hyster esis voltage0.5V
= 30V
V
Input current
IN
I/O Input clamp voltage
ICL
Note 1
IN
= 2.0V25
V
IN
= 1mA
I
IN
= -1mA
I
IN
3236
-0.7
300
µΑ
µΑ
V
V
Note: 1 The input voltage is internally clamped at 32V minimum, it is possible to connect the input pins
to an higher voltage via an external resistor calculate to not exeed 10mA
Table 6.Protection and Diagnostic
SymbolPara m eterTest Cond ition sMin.Typ.Max.Unit
V
V
SCL(*)
I
STAT
V
I
I
OVPK
T
STAT
USD
LIM
t
SC
TSD
T
R
Status output voltage
Status clamp voltage
Leakage on diagnostic
pin in high state
Undervoltage shut down5.08.0V
DC Short circuit current
Peak short circuit cur rent
Delay time of current
limiter
Thermal shut down
temperature
Thermal reset
temperature
= 5mA ( Fault condition )
I
STAT
= 1mA
I
STAT
= -1mA
I
STAT
V
= 5V
STAT
V
= 24V; R
CC
= 24V; VIN = 30; R
V
CC
LOAD
< 10mΩ
LOAD
< 10mΩ
1V
3236
-0.7
V
V
10µΑ
2.85.08.0A
4A
100µs
150170°C
135155°C
(*)Status determi nation > 100m s after the switching edge .
Figure 3.Switching Characteristics
4/13
Page 5
VN540-E / VN540SP-E / VN540-12-E
Table 7.Tru th Ta ble
INPUTOUTPUTSTATUS
Normal operation
Overtemperature
Undervoltage
Shorted load
( Current limitati on )
Figure 4.Peak Short Test Circuit
L
H
L
H
L
H
L
H
L
H
L
L
L
L
L
H
H
H
H
L
H
H
H
H
5/13
Page 6
VN540-E / VN540SP- E / VN540-12-E
Figure 5.Switching Waveforms
Figure 6.I
Tes t Co nf ig uration
LGND
IN
6/13
Page 7
VN540-E / VN540SP-E / VN540-12-E
Package Mechanical Data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The catego ry of
second Level Interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com.
nformation furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequence
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y implic ation or otherwise u nder any pat ent or pat ent rights of STMicro el ectronics . Specificati ons menti oned in this publicati on are subje
o change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are n
uthoriz ed for use as critical compo nents in life support devices or systems without express written approval of STMicroel ectronics.
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