Single-channel high side driver for automotive applications
Max supply voltageV
Operating voltage rangeV
Max on-state resistance (per ch.)R
Current limitation (typ)I
Off-state supply currentI
1. Typical value with all loads connected
■ Main
CC
CC
ON
LIMH
S
4.5 to 36V
– Inrush current active management by
power limitation
– Very low stand-by current
– 3.0V CMOS compatible input
– Optimized electromagnetic emission
– Very low electromagnetic susceptibility
– In compliance with the 2002/95/EC
european directive
■ Diagnostic Functions
– Open drain status output
– On-state open load detection
– Off-state open load detection
– Thermal shutdown indication
■ Protection
– Undervoltage shutdown
– Overvoltage clamp
– Output stuck to Vcc detection
– Load current limitation
– Self limiting of fast thermal transients
– Protection against loss of ground and loss
■ All types of resistive, inductive and capacitive
loads
Description
The VN5160S-E is a monolithic device made
using STMicroelectronics VIPower M0-5
technology. It is intended for driving resistive or
inductive loads with one side connected to
ground. Active V
device against low energy spikes.The device
detects open load condition both in on and offstate, when STAT_DIS is left open or driven low.
Output shorted to V
When STAT_DIS is driven high, STATUS is in a
high impedance condition. Output current
limitation protects the device in overload
condition. In case of long duration overload, the
device limits the dissipated power to safe level up
to thermal shutdown intervention. Thermal
shutdown with automatic restart allows the device
to recover normal operation as soon as fault
condition disappears.
Ground connection. Must be reverse battery protected by an external
diode/resistor network.
Voltage controlled input pin with hysteresis, CMOS compatible. Controls output
switch state.
DRIVER
OPENLOAD ON
OPENLOAD OFF
OVERTEM P.
Pwr
LIM
PwCLAMP
I
LIM
V
DSLIM
STATUSOpen drain digital diagnostic pin.
STAT_DISActive high CMOS compatible pin, to disable the STATUS pin.
Doc ID 13493 Rev 45/31
Page 6
Block diagram and pins descriptionVN5160S-E
Figure 2.Configuration diagram (top view)
V
CC
OUTPUT
OUTPUT
V
CC
5
6
8
7
4
3
2
1
STAT_DIS
STATUS
INPUT
GND
SO-8
Table 3.Suggested connections for unused and N.C. pins
Connection / PinStatusN.C.OutputInputSTAT_DIS
FloatingXXXXX
To groundN.R.
1. Not recommended.
(1)
XN.R.
Through 10KΩ
resistor
Through 10KΩ
resistor
6/31Doc ID 13493 Rev 4
Page 7
VN5160S-EElectrical specifications
2 Electrical specifications
Figure 3.Current and voltage conventions
I
S
V
CC
V
CC
V
F
I
SD
V
SD
I
IN
INPUT
V
INn
Note:V
F
= V
- VCC during reverse battery condition.
OUT
2.1 Absolute maximum ratings
Stressing the device above the ratings listed in the “Absolute maximum ratings” tables may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to the conditions in this section for extended
periods may affect device reliability. Refer also to the STMicroelectronics SURE Program
and other relevant quality documents.
Table 4.Absolute maximum ratings
SymbolParameterValueUnit
GND
OUTPUTSTAT_DIS
STATUS
I
GND
I
OUT
I
STAT
V
STAT
V
OUT
V
CC
- V
CC
- I
GND
I
OUT
- I
OUT
I
IN
I
STAT
I
STAT_DIS
E
MAX
DC supply voltage 41V
Reverse DC supply voltage0.3V
DC reverse ground pin current200mA
DC output current
Internally
limited
A
Reverse DC output current 6A
DC input current +10 / -1mA
DC status current +10 / -1mA
DC status disable current +10 / -1mA
Maximum switching energy (single pulse)
(L= 12mH; R
= 0Ω; V
L
=13.5V; T
bat
jstart
=150ºC; I
OUT
= I
limL
(Typ.))
34mJ
Doc ID 13493 Rev 47/31
Page 8
Electrical specificationsVN5160S-E
Table 4.Absolute maximum ratings (continued)
SymbolParameterValueUnit
Electrostatic discharge (Human Body Model: R=1.5KΩ; C=100pF)
Values specified in this section are for 8V<VCC<36V; -40°C<Tj<150°C, unless otherwise
stated.
Table 6.Power section
SymbolParameterTest conditionsMin.Typ. Max. Unit
V
V
V
USDhyst
R
ON
V
clamp
I
L(off1)
I
L(off2)
1. Guaranteed by design/characterization
2. PowerMOS leakage included
Operating supply
CC
voltage
Undervoltage shutdown3.54.5V
USD
Undervoltage shutdown
hysteresis
(1)
On-state resistance
Clamp voltageIS= 20mA414652V
I
Supply current
S
Off-state output
(2)
current
Output - VCC diode
V
F
voltage
4.51336V
0.5V
I
=1A; Tj=25°C
OUT
=1A; Tj=150°C
I
OUT
=1A; VCC=5V; Tj=25°C
I
OUT
Off-state; V
Tj=25°C;
On-state; V
I
=0A
OUT
VIN=V
OUT
V
IN=VOUT
VIN= 0V; V
-I
= 0.6A; Tj= 150°C0.7V
OUT
=13V; VIN=V
CC
=13V; VIN=5V;
CC
OUT
=0V;
=0V; VCC=13V; Tj=25°C
=0V; VCC=13V; Tj=125°C00
= 4V-750
OUT
(2)
2
1.9
0.013
160
320
210
(1)(2)
5
3.5µAmA
5
mΩ
mΩ
mΩ
µA
Table 7.Switching (VCC=13V; Tj= 25°C)
SymbolParameterTest conditionsMin.Typ.Max.Unit
Turn-on delay time RL= 13Ω (see Figure 6)10µs
Turn-off delay time RL= 13Ω (see Figure 6)15µs
/dt
Turn-on voltage slopeRL= 13Ω See Figure 21V/µs
(on)
/dt
Turn-off voltage slopeRL= 13Ω See Figure 22V/µs
(off)
Switching energy
losses during t
won
Switching energy
losses during t
woff
RL= 13Ω (see Figure 6)0.04mJ
RL= 13Ω (see Figure 6)0.04mJ
Doc ID 13493 Rev 49/31
dV
dV
t
d(on)
t
d(off)
OUT
OUT
W
W
ON
OFF
Page 10
Electrical specificationsVN5160S-E
Table 8.Status pin (VSD=0)
SymbolParameterTest conditionsMin.Typ. Max. Unit
V
STAT
I
LSTAT
C
STAT
V
SCL
Table 9.Protection
Status low output voltage I
Status leakage current
Status pin input
capacitance
Status clamp voltage
(1)
= 1.6 mA, VSD= 0V0.5V
STAT
Normal operation or V
V
= 5V
STAT
SD
= 5V,
Normal operation or VSD=5V,
V
= 5V
STAT
I
STAT
I
STAT
= 1mA
= - 1mA
5.5
-0.7
10µA
100pF
7V
SymbolParameterTest conditionsMin.Typ.Max.Unit
I
I
T
T
T
t
DC short circuit current
limH
Short circuit current during
limL
thermal cycling
Shutdown temperature150175200°C
TSD
Reset temperature
T
R
Thermal reset of STATUS135°C
RS
Thermal hysteresis (T
HYST
Status delay in overload
SDL
conditions
TSD-TR
VCC= 13V
5V<VCC<36V
V
= 13V; TR<Tj<T
CC
)
T
j>TTSD
TSD
3.85.47.5
2A
TRS + 1
TRS + 5°C
7°C
7.5
20µs
V
A
A
V
DEMAG
V
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
Turn-off output voltage
clamp
Output voltage drop
ON
limitation
diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles.
=150mA; VIN=0VCC-41 VCC-46 VCC-52V
I
OUT
I
= 0.03A;
OUT
=-40°C...+150°C
T
j
25mV
(see Figure 5)
10/31Doc ID 13493 Rev 4
Page 11
VN5160S-EElectrical specifications
Table 10.Openload detection
SymbolParameterTest conditionsMin.Typ.Max.Unit
I
OL
t
DOL(on)
Openload on-state
detection threshold
Openload on-state
detection delay
VIN = 5V, 8V<VCC<18V10
= 0A, VCC=13V
I
OUT
(see Figure 4)
See
Figure 19
40mA
200µs
Delay between INPUT falling
t
POL
edge and STATUS rising
I
= 0A (see Figure 4)2005001000µs
OUT
edge in openload condition
V
t
DSTKON
Table 11.Logic input
Openload off-state voltage
OL
detection threshold
Output short circuit to Vcc
detection delay at turn-off
= 0V, 8V<VCC<16V2
V
IN
(see Figure 4)180t
See
Figure 20
4V
POL
SymbolParameterTest conditionsMin.Typ.Max.Unit
V
V
V
I(hyst)
V
V
I
SDL
V
I
SDH
V
SD(hyst)
V
SDCL
Input low level voltage0.9V
IL
Low level input currentVIN= 0.9V1µA
I
IL
Input high level voltage2.1V
IH
I
High level input currentVIN= 2.1V10µA
IH
Input hysteresis voltage0.25V
I
= 1mA
Input clamp voltage
ICL
STAT_DIS low level voltage0.9V
SDL
Low level STAT_DIS currentV
STAT_DIS high level voltage2.1V
SDH
High level STAT_DIS current V
IN
= -1mA
I
IN
= 0.9V1µA
CSD
= 2.1V10µA
CSD
5.5
-0.7
STAT_DIS hysteresis voltage0.25V
STAT_DIS clamp voltage
I
SD
I
SD
= 1mA
= -1mA
5.5
-0.7
7V
7V
µs
V
V
Doc ID 13493 Rev 411/31
Page 12
Electrical specificationsVN5160S-E
Figure 4.Status timings
OPEN LOAD STATUS TIMING (without external pull-up)
I
< I
OUT
OL
V
< V
OUT
OL
t
POL
V
V
IN
STAT
t
DOL(on)
OUTPUT STUCK TO Vcc
I
> I
OUT
OL
V
t
DSTKON
OUT
> V
OL
V
V
IN
STAT
t
DOL(on)
Figure 5.Output voltage drop limitation
OPEN LOAD STATUS TIMING (with external pull-up)
I
< I
OUT
V
IN
V
STAT
t
DOL(on)
OL
V
OUT
OVER TEMP STATUS TIMING
Tj > T
V
V
IN
STAT
t
SDL
TSD
t
SDL
> V
OL
Vcc-V
out
Tj=150oC
V
on
Von/R
on(T)
T
=25oC
j
=-40oC
T
j
I
out
12/31Doc ID 13493 Rev 4
Page 13
VN5160S-EElectrical specifications
Table 12.Truth table
ConditionsINPUTOUTPUTSTATUS (VSD=0V)
(1)
Normal operation
Current limitation
Overtemperature
Undervoltage
Output voltage > V
Output current < I
1. If the VSD is high, the STATUS pin is in a high impedance.
2. The STATUS pin is low with a delay equal to t
3. The STATUS pin becomes high with a delay equal to t
CAll functions of the device are performed as designed after exposure to disturbance.
E
One or more functions of the device are not performed as designed after exposure to
disturbance and cannot be returned to proper operation without replacing the device.
14/31Doc ID 13493 Rev 4
Page 15
VN5160S-EElectrical specifications
Figure 7.Waveforms
NORMAL OPERATION
INPUT
STAT_DIS
LOAD CURRENT
STATUS
UNDERVOLTAGE
V
V
CC
INPUT
STAT_DIS
LOAD CURRENT
STATUS
INPUT
STAT_DIS
LOAD VOLTAGE
STATUS
V
USD
OPEN LOAD with external pull-up
V
OL
USDhyst
undefined
V
OUT>VOL
INPUT
STAT_DIS
LOAD VOLTAGE
LOAD CURRENT
STATUS
INPUT
STAT_DIS
LOAD VOLTAGE
STATUS
T
j
T
INPUT
STAT_DIS
LOAD CURRENT
STATUS
OPEN LOAD without external pull-up
I
OUT<IOL
t
POL
RESISTIVE SHORT TO Vcc, NORMAL LOAD
I
OUT>IOL
t
DSTKON
V
OUT>VOL
V
OL
OVERLOAD OPERATION
T
TSD
R
T
RS
I
LIMH
I
LIML
current
limitation
power
limitation
thermal cycling
SHORTED LOADNORMAL LOAD
Doc ID 13493 Rev 415/31
Page 16
Electrical specificationsVN5160S-E
2.4 Electrical characteristics curves
Figure 8.Off-state output currentFigure 9.Input clamp voltage
Iloff[nA]
600
500
Tc (°C)
Of f-s tate
Vcc=13V
Vin=Vout=0V
400
300
200
100
0
-50-250255075100125150175
Vicl[V]
7.0
6.8
6.6
Iin = 1 mA
6.4
6.2
6.0
5.8
5.6
5.4
5.2
5.0
-50 - 250255075100 125 150 175
Tc (°C)
Figure 10. High-level input currentFigure 11.Input high-level voltage
Iih[µA]
5.0
4.5
4.0
3.5
3.0
Vin = 2.1V
2.5
2.0
1.5
1.0
0.5
0.0
-50 - 250255075100 125 150 175
Tc (°C)
Vih[V]
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-50-250255075100 125 150 175
Tc (°C)
Figure 12. Input low-level voltageFigure 13. Input hysteresis voltage
Vil[V]
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-50-250255075100 125 150 175
Tc (°C)
16/31Doc ID 13493 Rev 4
Vihyst[V]
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-50-250255075100 125 150 175
Tc (°C)
Page 17
VN5160S-EElectrical specifications
Figure 14. Status low-output voltageFigure 15. Status leakage current
Vstat[V]
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-50-250255075100 125 150 175
Istat = 1.6mA
Tc (°C)
Ilstat[µA]
0.075
0.065
0.055
0.045
0.035
0.025
0.015
-50-250255075 100 125 150 175
Vs tat = 5V
Tc (°C)
Figure 16. Status clamp voltageFigure 17. On-state resistance vs T
Vscl[V]
9.0
8.5
8.0
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
-50-250255075100 125 150 175
Istat = 1mA
Tc (°C)
Ro nl[ m Oh m ]
300
250
200
150
100
50
0
-50-250255075100 125 150 175
Iout = 1A
Vcc = 13V
Tc (°C)
case
Figure 18. On-state resistance vs V
Ro nl[ m Oh m ]
300
275
250
225
200
175
150
125
100
75
50
0510152025303540
Vcc[V]
CC
Tc = 150°C
Tc = 125°C
Tc = 25°C
Tc = -40°C
Doc ID 13493 Rev 417/31
Figure 19. Open-load on-state detection
threshold
Iol[m A]
100
90
80
70
60
50
40
30
20
10
0
-50-250255075100 125 150 175
Tc (°C)
Page 18
Electrical specificationsVN5160S-E
Figure 20. Open-load off-state voltage
Figure 21. Turn-on voltage slope
detection threshold
Vol[V]
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-50-250255075100 125 150 175
Vin = 0V
Tc (°C)
(dVout/dt)on[V/ms ]
1000
900
800
700
600
500
400
300
200
100
0
-50-250255075100 125 150 175
Figure 22. Turn-off voltage slopeFigure 23. I
(dVout/dt)off[V/ms]
1000
900
800
700
600
500
400
300
200
100
0
-50-250255075100 125 150 175
Vcc = 13V
RL = 13 Oh m
Tc (°C)
Ilimh[A]
16
14
12
10
8
6
4
2
0
-50-250255075100 125150 175
LIM
Vcc = 13V
RL = 13 Oh m
vs T
Vcc = 13V
Tc (°C)
case
Tc (°C)
Figure 24. Undervoltage shutdownFigure 25. STAT_DIS clamp voltage
Vusd[V]
16
14
12
10
8
6
4
2
0
-50-250255075100125 150175
Tc (°C)
18/31Doc ID 13493 Rev 4
Vsdcl[V]
8.0
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
-50-250255075100 125 150175
Ini = 1 mA
Tc (°C)
Page 19
VN5160S-EElectrical specifications
Figure 26. High-level STAT_DIS voltageFigure 27. Low-level STAT_DIS voltage
VsdH[V]
8
7
6
5
4
3
2
1
0
-50-250255075100125150175
Tc (°C)
VsdL[V]
8
7
6
5
4
3
2
1
0
-50-250255075100 125150175
Tc (°C)
Doc ID 13493 Rev 419/31
Page 20
Application InformationVN5160S-E
3 Application Information
Figure 28. Application schematic
+5V
R
R
µC
R
prot
prot
prot
+5V
STAT_DIS
INPUT
STATUS
V
GND
GND
R
GND
V
CC
OUTPUT
D
GND
3.1 GND protection network against reverse battery
3.1.1 Solution 1: resistor in the ground line (R
GND
only)
D
ld
This can be used with any type of load.
The following is an indication on how to dimension the R
1.R
2. R
where -I
≤ 600mV / (I
GND
≥ (−VCC) / (-I
GND
is the DC reverse ground pin current and can be found in the absolute
GND
S(on)max
GND
)
)
maximum rating section of the device datasheet.
Power dissipation in R
P
= (-VCC)2/ R
D
GND
(when VCC<0: during reverse battery situations) is:
GND
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where I
maximum On-state currents of the different devices.
Please note that if the microprocessor ground is not shared by the device ground then the
R
will produce a shift (I
GND
S(on)max
* R
) in the input thresholds and the status output
GND
values. This shift will vary depending on how many devices are ON in the case of several
high side drivers sharing the same R
GND
.
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize Solution 2 (see below).
20/31Doc ID 13493 Rev 4
resistor.
GND
S(on)max
becomes the sum of the
Page 21
VN5160S-EApplication Information
3.1.2 Solution 2: a diode (D
A resistor (R
=1kΩ) should be inserted in parallel to D
GND
GND
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network will produce a shift (≈600mV) in the input
threshold and in the status output values if the microprocessor ground is not common to the
device ground. This shift will not vary if more than one HSD shares the same diode/resistor
network.
3.2 Load dump protection
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the
V
max DC rating. The same applies if the device is subject to transients on the VCC line
CC
that are greater than the ones shown in the ISO 7637-2: 2004(E) table.
3.3 MCU I/Os protection
If a ground protection network is used and negative transient are present on the VCC line,
the control pins will be pulled negative. ST suggests to insert a resistor (R
prevent the µC I/Os pins to latch-up.
The value of these resistors is a compromise between the leakage current of µC and the
current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC
I/Os.
) in the ground line
if the device drives an
GND
prot
) in line to
-V
CCpeak/Ilatchup
≤ R
prot
≤ (V
OHμC-VIH-VGND
) / I
Calculation example:
For V
5kΩ ≤ R
Recommended R
CCpeak
prot
≤ 180kΩ.
= - 100V and I
values is 10kΩ.
prot
latchup
≥ 20mA; V
OHµC
3.4 Open load detection in off-state
Off-state open load detection requires an external pull-up resistor (RPU) connected between
OUTPUT pin and a positive supply voltage (V
microprocessor.
The external resistor has to be selected according to the following requirements:
1.no false open load indication when load is connected: in this case we have to avoid
V
to be higher than V
OUT
V
= (VPU/(RL+RPU))RL<V
OUT
; this results in the following condition
Olmin
Olmin
.
2. no misdetection when load is disconnected: in this case the V
V
Because I
up resistor R
; this results in the following condition RPU<(VPU–V
OLmax
may significantly increase if V
s(OFF)
should be connected to a supply that is switched OFF when the module is in
PU
standby.
PU
IHmax
≥ 4.5V
) like the +5V line used to supply the
has to be higher than
out
)/I
OLmax
is pulled high (up to several mA), the pull-
out
L(off2)
.
Doc ID 13493 Rev 421/31
Page 22
Application InformationVN5160S-E
The values of V
OLmin
, V
OLmax
and I
are available in the Electrical characteristics
L(off2)
section.
Figure 29. Open-load detection in off-state
CC
V
INPUT
STATUS
DRIVER
+
LOGIC
+
-
VOL
GROUND
V batt.VPU
L(off2)
I
OUT
R
R
PU
RL
22/31Doc ID 13493 Rev 4
Page 23
VN5160S-EApplication Information
3.5 Maximum demagnetization energy (VCC = 13.5V)
Figure 30. Maximum turn-off current versus inductance
10
A
B
C
1
I (A)
0,1
0,1110100L (mH)
A: T
B: T
C: T
, I
V
IN
L
= 150°C single pulse
jstart
= 100°C repetitive pulse
jstart
= 125°C repetitive pulse
jstart
DemagnetizationDemagnetizationDemagnetization
Note:Values are generated with R
demagnetization) of every pulse must not exceed the temperature specified above for
curves A and B.
=0 Ω.In case of repetitive pulses, T
L
(at beginning of each
jstart
t
Doc ID 13493 Rev 423/31
Page 24
Package and PCB thermal dataVN5160S-E
4 Package and PCB thermal data
4.1 SO-8 thermal data
Figure 31. SO-8 PC board
Note:Layout condition of R
thickness=2 mm, Cu thickness= 35 µm, Copper areas: from minimum pad lay-out to 2 cm
Figure 32. R
RTHj_amb(°C/W)
thj-amb
110
100
90
80
70
60
00.511.522.5
and Zth measurements (PCB: FR4 area= 4.8 mm x 4.8 mm, PCB
th
vs PCB copper area in open box free air condition
2
).
PCB Cu heatsink area (cm^2)
24/31Doc ID 13493 Rev 4
Page 25
VN5160S-EPackage and PCB thermal data
Figure 33. SO-8 Thermal impedance junction ambient single pulse
ZT H (°C / W)
1000
Footprint
100
2 cm
2
10
1
0.1
0.00010.0010.010.11101001000
Time (s)
Equation 1: pulse calculation formula
Z
THδ
where δ = t
Figure 34. Thermal fitting model of a single-channel HSD in SO-8
R
TH
P
δZ
/T
THtp
1δ–()+⋅=
(1)
1. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
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Package and PCB thermal dataVN5160S-E
Table 16.Thermal parameter
Area/island (cm2)Footprint2
R1 (°C/W)1.2
R2 (°C/W)6
R3 (°C/W)3.5
R4 (°C/W)21
R5 (°C/W)16
R6 (°C/W)5828
C1 (W.s/°C)0.0008
C2 (W.s/°C)0.0016
C3 (W.s/°C)0.0075
C4 (W.s/°C)0.045
C5 (W.s/°C)0.35
C6 (W.s/°C)1.052
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VN5160S-EPackage and packing information
5 Package and packing information
5.1 ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
5.2 Package mechanical data
Figure 35. SO-8 package dimensions
.
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Package and packing informationVN5160S-E
SO-8
Table 17.SO-8 mechanical data
Dim.
Min.Typ.Max.
A1.75
a10.10.25
a21.65
a30.650.85
b0.350.48
b10.190.25
C0.250.5
c145 (typ.)
D4.85
E5.86.2
e1.27
Millimeter
e33.81
F3.84
L0.41.27
M0.6
S8 (max.)
L10.81.2
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VN5160S-EPackage and packing information
5.3 Packing information
Figure 36. SO-8 tube shipment (no suffix)
B
C
Base Q.ty100
Bulk Q.ty2000
Tube length (± 0.5)532
A
A3.2
B6
C (± 0.1)0.6
All dimensions are in mm.
Figure 37. SO-8 tape and reel shipment (suffix “TR”)
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
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