Datasheet VN5160S-E Datasheet (ST)

Page 1
Features
VN5160S-E
Single-channel high side driver for automotive applications
Max supply voltage V
Operating voltage range V
Max on-state resistance (per ch.) R
Current limitation (typ) I
Off-state supply current I
1. Typical value with all loads connected
■ Main
CC
CC
ON
LIMH
S
4.5 to 36V
– Inrush current active management by
power limitation – Very low stand-by current – 3.0V CMOS compatible input – Optimized electromagnetic emission – Very low electromagnetic susceptibility – In compliance with the 2002/95/EC
european directive
■ Diagnostic Functions
– Open drain status output – On-state open load detection – Off-state open load detection – Thermal shutdown indication
■ Protection
– Undervoltage shutdown – Overvoltage clamp – Output stuck to Vcc detection – Load current limitation – Self limiting of fast thermal transients – Protection against loss of ground and loss
of V
CC
– Thermal shutdown

Table 1. Device summary

41V
160 mΩ
5.4 A
(1)
2 µA
SO-8
– Reverse battery protection (see Figure 28) – Electrostatic discharge protection
Applications
■ All types of resistive, inductive and capacitive
loads
Description
The VN5160S-E is a monolithic device made using STMicroelectronics VIPower M0-5 technology. It is intended for driving resistive or inductive loads with one side connected to ground. Active V device against low energy spikes.The device detects open load condition both in on and off­state, when STAT_DIS is left open or driven low. Output shorted to V When STAT_DIS is driven high, STATUS is in a high impedance condition. Output current limitation protects the device in overload condition. In case of long duration overload, the device limits the dissipated power to safe level up to thermal shutdown intervention. Thermal shutdown with automatic restart allows the device to recover normal operation as soon as fault condition disappears.
voltage clamp protects the
CC
is detected in the off-state.
CC
Order codes
Package
Tub e Tap e a nd reel
SO-8 VN5160S-E VN5160STR-E
November 2009 Doc ID 13493 Rev 4 1/32
www.st.com
1
Page 2
Contents VN5160S-E
Contents
1 Block diagram and pins description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 20
3.1.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 20
3.1.2 Solution 2: a diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . 21
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.3 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.4 Open load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.5 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . 23
4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.1 SO-8 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.2 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.3 Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2/31 Doc ID 13493 Rev 4
Page 3
VN5160S-E List of tables
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Pins function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Suggested connections for unused and N.C. pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 7. Switching (VCC = 13V; Tj = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 8. Status pin (V
Table 9. Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 10. Openload detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 11. Logic input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 12. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 13. Electrical transient requirements (part 1/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 14. Electrical transient requirements (part 2/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 15. Electrical transient requirements (part 3/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 16. Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 17. SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 18. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
=0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
SD
Doc ID 13493 Rev 4 3/31
Page 4
List of figures VN5160S-E
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 5. Output voltage drop limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 6. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 8. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 10. High-level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 11. Input high-level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 12. Input low-level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 13. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 14. Status low-output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 15. Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 16. Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 17. On-state resistance vs T Figure 18. On-state resistance vs V
Figure 19. Open-load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 20. Open-load off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 21. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 22. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 23. I
LIM
vs T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
case
Figure 24. Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 25. STAT_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 26. High-level STAT_DIS voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 27. Low-level STAT_DIS voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 28. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 29. Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 30. Maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 31. SO-8 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 32. Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 33. SO-8 Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 34. Thermal fitting model of a single-channel HSD in SO-8
Figure 35. SO-8 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 36. SO-8 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 37. SO-8 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
case
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
CC
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . 25
4/31 Doc ID 13493 Rev 4
Page 5
VN5160S-E Block diagram and pins description

1 Block diagram and pins description

Figure 1. Block diagram

V
CC
V
CC
CLAMP
UNDERVOLTAGE
GND
INPUT
LOGIC
STATUS
STAT_DIS

Table 2. Pins function

Name Function
V
CC
OUTPUT Power output.
GND
INPUT
Battery connection.
Ground connection. Must be reverse battery protected by an external diode/resistor network.
Voltage controlled input pin with hysteresis, CMOS compatible. Controls output switch state.
DRIVER
OPENLOAD ON
OPENLOAD OFF
OVERTEM P.
Pwr
LIM
PwCLAMP
I
LIM
V
DSLIM
STATUS Open drain digital diagnostic pin.
STAT_DIS Active high CMOS compatible pin, to disable the STATUS pin.
Doc ID 13493 Rev 4 5/31
Page 6
Block diagram and pins description VN5160S-E

Figure 2. Configuration diagram (top view)

V
CC
OUTPUT OUTPUT
V
CC
5 6
8
7
4 3 2
1
STAT_DIS STATUS INPUT GND
SO-8

Table 3. Suggested connections for unused and N.C. pins

Connection / Pin Status N.C. Output Input STAT_DIS
Floating X X X X X
To ground N.R.
1. Not recommended.
(1)
XN.R.
Through 10KΩ
resistor
Through 10KΩ
resistor
6/31 Doc ID 13493 Rev 4
Page 7
VN5160S-E Electrical specifications

2 Electrical specifications

Figure 3. Current and voltage conventions

I
S
V
CC
V
CC
V
F
I
SD
V
SD
I
IN
INPUT
V
INn
Note: V
F
= V
- VCC during reverse battery condition.
OUT

2.1 Absolute maximum ratings

Stressing the device above the ratings listed in the “Absolute maximum ratings” tables may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to the conditions in this section for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents.

Table 4. Absolute maximum ratings

Symbol Parameter Value Unit
GND
OUTPUTSTAT_DIS
STATUS
I
GND
I
OUT
I
STAT
V
STAT
V
OUT
V
CC
- V
CC
- I
GND
I
OUT
- I
OUT
I
IN
I
STAT
I
STAT_DIS
E
MAX
DC supply voltage 41 V
Reverse DC supply voltage 0.3 V
DC reverse ground pin current 200 mA
DC output current
Internally
limited
A
Reverse DC output current 6 A
DC input current +10 / -1 mA
DC status current +10 / -1 mA
DC status disable current +10 / -1 mA
Maximum switching energy (single pulse) (L= 12mH; R
= 0Ω; V
L
=13.5V; T
bat
jstart
=150ºC; I
OUT
= I
limL
(Typ.))
34 mJ
Doc ID 13493 Rev 4 7/31
Page 8
Electrical specifications VN5160S-E
Table 4. Absolute maximum ratings (continued)
Symbol Parameter Value Unit
Electrostatic discharge (Human Body Model: R=1.5KΩ; C=100pF)
V
V
– INPUT
–STATUS
ESD
–STAT_DIS
–OUTPUT
–V
CC
Charge device model (CDM-AEC-Q100-011) 750 V
ESD
Junction operating temperature -40 to 150 °C
T
j
4000 4000 4000 5000 5000
V V V V V
T
Storage temperature -55 to 150 °C
stg

2.2 Thermal data

Table 5. Thermal data

Symbol Parameter Value Unit
R
thj-pins
R
thj-amb
Thermal resistance junction-pins (MAX) 30 °C/W
Thermal resistance junction-ambient (MAX) See Figure 32
°C/W
8/31 Doc ID 13493 Rev 4
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VN5160S-E Electrical specifications

2.3 Electrical characteristics

Values specified in this section are for 8V<VCC<36V; -40°C<Tj<150°C, unless otherwise stated.

Table 6. Power section

Symbol Parameter Test conditions Min. Typ. Max. Unit
V
V
V
USDhyst
R
ON
V
clamp
I
L(off1)
I
L(off2)
1. Guaranteed by design/characterization
2. PowerMOS leakage included
Operating supply
CC
voltage
Undervoltage shutdown 3.5 4.5 V
USD
Undervoltage shutdown hysteresis
(1)
On-state resistance
Clamp voltage IS= 20mA 41 46 52 V
I
Supply current
S
Off-state output
(2)
current
Output - VCC diode
V
F
voltage
4.5 13 36 V
0.5 V
I
=1A; Tj=25°C
OUT
=1A; Tj=150°C
I
OUT
=1A; VCC=5V; Tj=25°C
I
OUT
Off-state; V Tj=25°C;
On-state; V I
=0A
OUT
VIN=V
OUT
V
IN=VOUT
VIN= 0V; V
-I
= 0.6A; Tj= 150°C 0.7 V
OUT
=13V; VIN=V
CC
=13V; VIN=5V;
CC
OUT
=0V;
=0V; VCC=13V; Tj=25°C =0V; VCC=13V; Tj=125°C00
= 4V -75 0
OUT
(2)
2
1.9
0.01 3
160 320 210
(1)(2)
5
3.5µAmA
5
mΩ mΩ mΩ
µA
Table 7. Switching (VCC=13V; Tj= 25°C)
Symbol Parameter Test conditions Min. Typ. Max. Unit
Turn-on delay time RL= 13Ω (see Figure 6)10µs
Turn-off delay time RL= 13Ω (see Figure 6)15µs
/dt
Turn-on voltage slope RL= 13Ω See Figure 21 V/µs
(on)
/dt
Turn-off voltage slope RL= 13Ω See Figure 22 V/µs
(off)
Switching energy losses during t
won
Switching energy losses during t
woff
RL= 13Ω (see Figure 6)0.04mJ
RL= 13Ω (see Figure 6)0.04mJ
Doc ID 13493 Rev 4 9/31
dV
dV
t
d(on)
t
d(off)
OUT
OUT
W
W
ON
OFF
Page 10
Electrical specifications VN5160S-E

Table 8. Status pin (VSD=0)

Symbol Parameter Test conditions Min. Typ. Max. Unit
V
STAT
I
LSTAT
C
STAT
V
SCL

Table 9. Protection

Status low output voltage I
Status leakage current
Status pin input capacitance
Status clamp voltage
(1)
= 1.6 mA, VSD= 0V 0.5 V
STAT
Normal operation or V V
= 5V
STAT
SD
= 5V,
Normal operation or VSD=5V, V
= 5V
STAT
I
STAT
I
STAT
= 1mA = - 1mA
5.5
-0.7
10 µA
100 pF
7V
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
I
T
T
T
t
DC short circuit current
limH
Short circuit current during
limL
thermal cycling
Shutdown temperature 150 175 200 °C
TSD
Reset temperature
T
R
Thermal reset of STATUS 135 °C
RS
Thermal hysteresis (T
HYST
Status delay in overload
SDL
conditions
TSD-TR
VCC= 13V 5V<VCC<36V
V
= 13V; TR<Tj<T
CC
)
T
j>TTSD
TSD
3.8 5.4 7.5
2A
TRS + 1
TRS + 5 °C
7°C
7.5
20 µs
V
A A
V
DEMAG
V
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
Turn-off output voltage clamp
Output voltage drop
ON
limitation
diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles.
=150mA; VIN=0 VCC-41 VCC-46 VCC-52 V
I
OUT
I
= 0.03A;
OUT
=-40°C...+150°C
T
j
25 mV
(see Figure 5)
10/31 Doc ID 13493 Rev 4
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VN5160S-E Electrical specifications

Table 10. Openload detection

Symbol Parameter Test conditions Min. Typ. Max. Unit
I
OL
t
DOL(on)
Openload on-state detection threshold
Openload on-state detection delay
VIN = 5V, 8V<VCC<18V 10
= 0A, VCC=13V
I
OUT
(see Figure 4)
See
Figure 19
40 mA
200 µs
Delay between INPUT falling
t
POL
edge and STATUS rising
I
= 0A (see Figure 4) 200 500 1000 µs
OUT
edge in openload condition
V
t
DSTKON

Table 11. Logic input

Openload off-state voltage
OL
detection threshold
Output short circuit to Vcc detection delay at turn-off
= 0V, 8V<VCC<16V 2
V
IN
(see Figure 4) 180 t
See
Figure 20
4V
POL
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
V
V
I(hyst)
V
V
I
SDL
V
I
SDH
V
SD(hyst)
V
SDCL
Input low level voltage 0.9 V
IL
Low level input current VIN= 0.9V 1 µA
I
IL
Input high level voltage 2.1 V
IH
I
High level input current VIN= 2.1V 10 µA
IH
Input hysteresis voltage 0.25 V
I
= 1mA
Input clamp voltage
ICL
STAT_DIS low level voltage 0.9 V
SDL
Low level STAT_DIS current V
STAT_DIS high level voltage 2.1 V
SDH
High level STAT_DIS current V
IN
= -1mA
I
IN
= 0.9V 1 µA
CSD
= 2.1V 10 µA
CSD
5.5
-0.7
STAT_DIS hysteresis voltage 0.25 V
STAT_DIS clamp voltage
I
SD
I
SD
= 1mA = -1mA
5.5
-0.7
7V
7V
µs
V
V
Doc ID 13493 Rev 4 11/31
Page 12
Electrical specifications VN5160S-E

Figure 4. Status timings

OPEN LOAD STATUS TIMING (without external pull-up)
I
< I
OUT
OL
V
< V
OUT
OL
t
POL
V
V
IN
STAT
t
DOL(on)
OUTPUT STUCK TO Vcc
I
> I
OUT
OL
V
t
DSTKON
OUT
> V
OL
V
V
IN
STAT
t
DOL(on)

Figure 5. Output voltage drop limitation

OPEN LOAD STATUS TIMING (with external pull-up)
I
< I
OUT
V
IN
V
STAT
t
DOL(on)
OL
V
OUT
OVER TEMP STATUS TIMING
Tj > T
V
V
IN
STAT
t
SDL
TSD
t
SDL
> V
OL
Vcc-V
out
Tj=150oC
V
on
Von/R
on(T)
T
=25oC
j
=-40oC
T
j
I
out
12/31 Doc ID 13493 Rev 4
Page 13
VN5160S-E Electrical specifications

Table 12. Truth table

Conditions INPUT OUTPUT STATUS (VSD=0V)
(1)
Normal operation
Current limitation
Overtemperature
Undervoltage
Output voltage > V
Output current < I
1. If the VSD is high, the STATUS pin is in a high impedance.
2. The STATUS pin is low with a delay equal to t
3. The STATUS pin becomes high with a delay equal to t
OL
OL
L H
L H
L H
L H
L H
L H
after INPUT falling edge.
DSTKON
POL

Figure 6. Switching characteristics

V
OUT
t
Won
L
H
L
X
L L
L L
H H
L
H
after INPUT falling edge.
t
Woff
H H
H H
H L
X X
(2)
L
H
(3)
H
L
dV
OUT
INPUT
/dt
(on)
t
d(on)
80%
t
90%
dV
/dt
OUT
(off)
r
10%
t
f
t
t
d(off)
t
Doc ID 13493 Rev 4 13/31
Page 14
Electrical specifications VN5160S-E

Table 13. Electrical transient requirements (part 1/3)

ISO 7637-2:
Test levels
2004(E)
Test pul s e
III IV
1 -75V -100V 5000 pulses 0.5 s 5 s 2 ms, 10 Ω
2a +37V +50V 5000 pulses 0.2 s 5 s 50 µs, 2 Ω
3a -100V -150V 1h 90 ms 100 ms 0.1 µs, 50 Ω
3b +75V +100V 1h 90 ms 100 ms 0.1 µs, 50 Ω
Number of
pulses or
test times
Burst cycle/pulse
repetition time
Delays and impedance
4-6V-7V1 pulse
(1)
5b
1. Valid in case of external load dump clamp: 40V maximum referred to ground.

Table 14. Electrical transient requirements (part 2/3)

ISO 7637-2:
+65V +87V 1 pulse 400 ms, 2 Ω
Test level results
(1)
100 ms,
0.01Ω
2004(E)
Test pul s e
III IV
1C C
2a C C
3a C C
3b C C
4C C
(2)
5b
1. The above test levels must be considered referred to VCC = 13.5V except for pulse 5b.
2. Valid in case of external load dump clamp: 40V maximum referred to ground.
CC

Table 15. Electrical transient requirements (part 3/3)

Class Contents
C All functions of the device are performed as designed after exposure to disturbance.
E
One or more functions of the device are not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device.
14/31 Doc ID 13493 Rev 4
Page 15
VN5160S-E Electrical specifications

Figure 7. Waveforms

NORMAL OPERATION
INPUT
STAT_DIS
LOAD CURRENT
STATUS
UNDERVOLTAGE
V
V
CC
INPUT STAT_DIS
LOAD CURRENT
STATUS
INPUT
STAT_DIS
LOAD VOLTAGE
STATUS
V
USD
OPEN LOAD with external pull-up
V
OL
USDhyst
undefined
V
OUT>VOL
INPUT
STAT_DIS
LOAD VOLTAGE
LOAD CURRENT
STATUS
INPUT
STAT_DIS
LOAD VOLTAGE
STATUS
T
j
T
INPUT
STAT_DIS
LOAD CURRENT
STATUS
OPEN LOAD without external pull-up
I
OUT<IOL
t
POL
RESISTIVE SHORT TO Vcc, NORMAL LOAD
I
OUT>IOL
t
DSTKON
V
OUT>VOL
V
OL
OVERLOAD OPERATION
T
TSD
R
T
RS
I
LIMH
I
LIML
current
limitation
power limitation
thermal cycling
SHORTED LOAD NORMAL LOAD
Doc ID 13493 Rev 4 15/31
Page 16
Electrical specifications VN5160S-E

2.4 Electrical characteristics curves

Figure 8. Off-state output current Figure 9. Input clamp voltage
Iloff[nA]
600
500
Tc (°C)
Of f-s tate Vcc=13V
Vin=Vout=0V
400
300
200
100
0
-50 -25 0 25 50 75 100 125 150 175
Vicl[V]
7.0
6.8
6.6
Iin = 1 mA
6.4
6.2
6.0
5.8
5.6
5.4
5.2
5.0
-50 - 25 0 25 50 75 100 125 150 175
Tc (°C)

Figure 10. High-level input current Figure 11. Input high-level voltage

Iih[µA]
5.0
4.5
4.0
3.5
3.0
Vin = 2.1V
2.5
2.0
1.5
1.0
0.5
0.0
-50 - 25 0 25 50 75 100 125 150 175
Tc (°C)
Vih[V]
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)

Figure 12. Input low-level voltage Figure 13. Input hysteresis voltage

Vil[V]
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
16/31 Doc ID 13493 Rev 4
Vihyst[V]
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Page 17
VN5160S-E Electrical specifications

Figure 14. Status low-output voltage Figure 15. Status leakage current

Vstat[V]
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-50 -25 0 25 50 75 100 125 150 175
Istat = 1.6mA
Tc (°C)
Ilstat[µA]
0.075
0.065
0.055
0.045
0.035
0.025
0.015
-50 -25 0 25 50 75 100 125 150 175
Vs tat = 5V
Tc (°C)

Figure 16. Status clamp voltage Figure 17. On-state resistance vs T

Vscl[V]
9.0
8.5
8.0
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
-50 -25 0 25 50 75 100 125 150 175
Istat = 1mA
Tc (°C)
Ro nl[ m Oh m ]
300
250
200
150
100
50
0
-50 -25 0 25 50 75 100 125 150 175
Iout = 1A Vcc = 13V
Tc (°C)
case
Figure 18. On-state resistance vs V
Ro nl[ m Oh m ]
300
275
250
225
200
175
150
125
100
75
50
0 5 10 15 20 25 30 35 40
Vcc[V]
CC
Tc = 150°C
Tc = 125°C
Tc = 25°C
Tc = -40°C
Doc ID 13493 Rev 4 17/31
Figure 19. Open-load on-state detection
threshold
Iol[m A]
100
90
80
70
60
50
40
30
20
10
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Page 18
Electrical specifications VN5160S-E
Figure 20. Open-load off-state voltage

Figure 21. Turn-on voltage slope

detection threshold
Vol[V]
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-50 -25 0 25 50 75 100 125 150 175
Vin = 0V
Tc (°C)
(dVout/dt)on[V/ms ]
1000
900
800
700
600
500
400
300
200
100
0
-50 -25 0 25 50 75 100 125 150 175

Figure 22. Turn-off voltage slope Figure 23. I

(dVout/dt)off[V/ms]
1000
900
800
700
600
500
400
300
200
100
0
-50 -25 0 25 50 75 100 125 150 175
Vcc = 13V RL = 13 Oh m
Tc (°C)
Ilimh[A]
16
14
12
10
8
6
4
2
0
-50 -25 0 25 50 75 100 125 150 175
LIM
Vcc = 13V RL = 13 Oh m
vs T
Vcc = 13V
Tc (°C)
case
Tc (°C)

Figure 24. Undervoltage shutdown Figure 25. STAT_DIS clamp voltage

Vusd[V]
16
14
12
10
8
6
4
2
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
18/31 Doc ID 13493 Rev 4
Vsdcl[V]
8.0
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
-50 -25 0 25 50 75 100 125 150 175
Ini = 1 mA
Tc (°C)
Page 19
VN5160S-E Electrical specifications

Figure 26. High-level STAT_DIS voltage Figure 27. Low-level STAT_DIS voltage

VsdH[V]
8
7
6
5
4
3
2
1
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
VsdL[V]
8
7
6
5
4
3
2
1
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Doc ID 13493 Rev 4 19/31
Page 20
Application Information VN5160S-E

3 Application Information

Figure 28. Application schematic

+5V
R
R
µC
R
prot
prot
prot
+5V
STAT_DIS
INPUT
STATUS
V
GND
GND
R
GND
V
CC
OUTPUT
D
GND

3.1 GND protection network against reverse battery

3.1.1 Solution 1: resistor in the ground line (R
GND
only)
D
ld
This can be used with any type of load.
The following is an indication on how to dimension the R
1. R
2. R
where -I
≤ 600mV / (I
GND
≥ (−VCC) / (-I
GND
is the DC reverse ground pin current and can be found in the absolute
GND
S(on)max
GND
)
)
maximum rating section of the device datasheet.
Power dissipation in R
P
= (-VCC)2/ R
D
GND
(when VCC<0: during reverse battery situations) is:
GND
This resistor can be shared amongst several different HSDs. Please note that the value of this resistor should be calculated with formula (1) where I maximum On-state currents of the different devices.
Please note that if the microprocessor ground is not shared by the device ground then the R
will produce a shift (I
GND
S(on)max
* R
) in the input thresholds and the status output
GND
values. This shift will vary depending on how many devices are ON in the case of several high side drivers sharing the same R
GND
.
If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then ST suggests to utilize Solution 2 (see below).
20/31 Doc ID 13493 Rev 4
resistor.
GND
S(on)max
becomes the sum of the
Page 21
VN5160S-E Application Information
3.1.2 Solution 2: a diode (D
A resistor (R
=1kΩ) should be inserted in parallel to D
GND
GND
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network will produce a shift (≈600mV) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network.

3.2 Load dump protection

Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the V
max DC rating. The same applies if the device is subject to transients on the VCC line
CC
that are greater than the ones shown in the ISO 7637-2: 2004(E) table.

3.3 MCU I/Os protection

If a ground protection network is used and negative transient are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (R prevent the µC I/Os pins to latch-up.
The value of these resistors is a compromise between the leakage current of µC and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC I/Os.
) in the ground line
if the device drives an
GND
prot
) in line to
-V
CCpeak/Ilatchup
≤ R
prot
≤ (V
OHμC-VIH-VGND
) / I
Calculation example:
For V
5kΩ ≤ R
Recommended R
CCpeak
prot
≤ 180kΩ.
= - 100V and I
values is 10kΩ.
prot
latchup
≥ 20mA; V
OHµC

3.4 Open load detection in off-state

Off-state open load detection requires an external pull-up resistor (RPU) connected between OUTPUT pin and a positive supply voltage (V microprocessor.
The external resistor has to be selected according to the following requirements:
1. no false open load indication when load is connected: in this case we have to avoid V
to be higher than V
OUT
V
= (VPU/(RL+RPU))RL<V
OUT
; this results in the following condition
Olmin
Olmin
.
2. no misdetection when load is disconnected: in this case the V V
Because I up resistor R
; this results in the following condition RPU<(VPU–V
OLmax
may significantly increase if V
s(OFF)
should be connected to a supply that is switched OFF when the module is in
PU
standby.
PU
IHmax
≥ 4.5V
) like the +5V line used to supply the
has to be higher than
out
)/I
OLmax
is pulled high (up to several mA), the pull-
out
L(off2)
.
Doc ID 13493 Rev 4 21/31
Page 22
Application Information VN5160S-E
The values of V
OLmin
, V
OLmax
and I
are available in the Electrical characteristics
L(off2)
section.

Figure 29. Open-load detection in off-state

CC
V
INPUT
STATUS
DRIVER
+
LOGIC
+
-
VOL
GROUND
V batt. VPU
L(off2)
I
OUT
R
R
PU
RL
22/31 Doc ID 13493 Rev 4
Page 23
VN5160S-E Application Information

3.5 Maximum demagnetization energy (VCC = 13.5V)

Figure 30. Maximum turn-off current versus inductance

10
A
B
C
1
I (A)
0,1
0,1 1 10 100L (mH)
A: T
B: T
C: T
, I
V
IN
L
= 150°C single pulse
jstart
= 100°C repetitive pulse
jstart
= 125°C repetitive pulse
jstart
Demagnetization Demagnetization Demagnetization
Note: Values are generated with R
demagnetization) of every pulse must not exceed the temperature specified above for curves A and B.
=0 Ω.In case of repetitive pulses, T
L
(at beginning of each
jstart
t
Doc ID 13493 Rev 4 23/31
Page 24
Package and PCB thermal data VN5160S-E

4 Package and PCB thermal data

4.1 SO-8 thermal data

Figure 31. SO-8 PC board

Note: Layout condition of R
thickness=2 mm, Cu thickness= 35 µm, Copper areas: from minimum pad lay-out to 2 cm
Figure 32. R
RTHj_amb(°C/W)
thj-amb
110
100
90
80
70
60
0 0.5 1 1.5 2 2.5
and Zth measurements (PCB: FR4 area= 4.8 mm x 4.8 mm, PCB
th
vs PCB copper area in open box free air condition
2
).
PCB Cu heatsink area (cm^2)
24/31 Doc ID 13493 Rev 4
Page 25
VN5160S-E Package and PCB thermal data

Figure 33. SO-8 Thermal impedance junction ambient single pulse

ZT H (°C / W)
1000
Footprint
100
2 cm
2
10
1
0.1
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
Equation 1: pulse calculation formula
Z
THδ
where δ = t
Figure 34. Thermal fitting model of a single-channel HSD in SO-8
R
TH
P
δ Z
/T
THtp
1 δ–()+⋅=
(1)
1. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
Doc ID 13493 Rev 4 25/31
Page 26
Package and PCB thermal data VN5160S-E

Table 16. Thermal parameter

Area/island (cm2)Footprint2
R1 (°C/W) 1.2
R2 (°C/W) 6
R3 (°C/W) 3.5
R4 (°C/W) 21
R5 (°C/W) 16
R6 (°C/W) 58 28
C1 (W.s/°C) 0.0008
C2 (W.s/°C) 0.0016
C3 (W.s/°C) 0.0075
C4 (W.s/°C) 0.045
C5 (W.s/°C) 0.35
C6 (W.s/°C) 1.05 2
26/31 Doc ID 13493 Rev 4
Page 27
VN5160S-E Package and packing information

5 Package and packing information

5.1 ECOPACK® packages

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.

5.2 Package mechanical data

Figure 35. SO-8 package dimensions

.
Doc ID 13493 Rev 4 27/31
Page 28
Package and packing information VN5160S-E
SO-8

Table 17. SO-8 mechanical data

Dim.
Min. Typ. Max.
A 1.75
a1 0.1 0.25
a2 1.65
a3 0.65 0.85
b0.35 0.48
b1 0.19 0.25
C 0.25 0.5
c1 45 (typ.)
D4.8 5
E5.8 6.2
e1.27
Millimeter
e3 3.81
F3.8 4
L 0.4 1.27
M 0.6
S 8 (max.)
L1 0.8 1.2
28/31 Doc ID 13493 Rev 4
Page 29
VN5160S-E Package and packing information

5.3 Packing information

Figure 36. SO-8 tube shipment (no suffix)

B
C
Base Q.ty 100 Bulk Q.ty 2000 Tube length (± 0.5) 532
A
A 3.2 B 6 C (± 0.1) 0.6
All dimensions are in mm.

Figure 37. SO-8 tape and reel shipment (suffix “TR”)

Tape dimensions
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986
Tape width W 12 Tape Hole Spacing P0 (± 0.1) 4 Component Spacing P 8 Hole Diameter D (+ 0.1/-0) 1.5 Hole Diameter D1 (min) 1.5 Hole Position F (± 0.05) 5.5 Compartment Depth K (max) 4.5 Hole Spacing P1 (± 0.1) 2
All dimensions are in mm.
End
Reel dimensions
Base Q.ty 2500 Bulk Q.ty 2500 A (max) 330 B (min) 1.5 C (± 0.2) 13 F 20.2 G (+ 2 / -0) 12.4 N (min) 60 T (max) 18.4
All dimensions are in mm.
Start
Top
cover
tape
500mm min
Empty components pockets saled with cover tape.
User direction of feed
No componentsNo components Components
500mm min
Doc ID 13493 Rev 4 29/31
Page 30
Revision history VN5160S-E

6 Revision history

Table 18. Document revision history

Date Revision Changes
Feb-2007 1 Initial release.
May-2007 2
17-Dec-2007 3
23-Nov-2009 4
Document rewritten, restructured and put in corporate technical literature template.
Table 4: Absolute maximum ratings: changed E
MAX value from
14 to 34 mJ.
Table 13: Electrical transient requirements (part 1/3): updated
test level values III and IV for test pulse 5b and notes. Added Section 3.5: Maximum demagnetization energy (VCC =
13.5V). Figure 34: Thermal fitting model of a single-channel HSD in
(1)
: added note.
SO-8
Updated Section 2.3: Electrical characteristics. Updated Section 2.4: Electrical characteristics curves. Updated Table 6: Power section.
30/31 Doc ID 13493 Rev 4
Page 31
VN5160S-E
Please Read Carefully:
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Doc ID 13493 Rev 4 31/31
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