This device has been designed to meet the increasing
demand for AlInGaP technology.
The package of the VLMF31.. is the PLCC-2.
It consists of a lead frame which is embedded in a
white thermoplast. The reflector inside this package is
filled up with clear epoxy.
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
• Package: SMD PLCC-2
• Product series: standard
• Angle of half intensity: ± 60°
VLMF31..
Vishay Semiconductors
FEATURES
• SMD LED with exceptional brightness
• Luminous intensity categorized
• Compatible with automatic placement
equipment
• EIA and ICE standard package
• Compatible with IR reflow, vapor phase and wave
solder processes acc. to CECC 00802 and
J-STD-020C
• Available in 8 mm tape
• Low profile package
• Non-diffused lens: excellent for coupling to light
pipes and backlighting
• Low power consumption
• Luminous intensity ratio in one packaging unit
I
Vmax/IVmin
≤ 1.6
• Lead (Pb)-free device
• Preconditioning: acc. to JEDEC level 2a
• ESD-withstand voltage:
up to 2 kV according to JESD22-A114-B
APPLICATIONS
• Automotive: backlighting in dashboards and
switches
• Telecommunication: indicator and backlighting in
telephone and fax
• Indicator and backlight for audio and video
equipment
• Indicator and backlight in office equipment
• Flat backlight for LCDs, switches and symbols
• General use
e3
PARTS TABLE
PARTCOLOR, LUMINOUS INTENSITYANGLE OF HALF INTENSITY (± ϕ)TECHNOLOGY
VLMF31Q2T1-GS08
VLMF31Q2T1-GS18
VLMF31R1S2-GS08
VLMF31R1S2-GS18
VLMF31S1T1-GS08
VLMF31S1T1-GS18
Document Number 81330
Rev. 1.1, 06-Sep-07
Soft orange, I
Soft orange, I
Soft orange, I
Soft orange, I
Soft orange, I
Soft orange, I
= (90 to 355) mcd
V
= (90 to 355) mcd
V
= (112 to 280) mcd
V
= (112 to 280) mcd
V
= (180 to 355) mcd
V
= (180 to 355) mcd
V
60°AllnGaP on GaAs
60°AllnGaP on GaAs
60°AllnGaP on GaAs
60°AllnGaP on GaAs
60°AllnGaP on GaAs
60°AllnGaP on GaAs
www.vishay.com
1
Page 2
VLMF31..
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS1) VLMF31..
PARAMETERTEST CONDITIONSYMBOLVAL UEUNIT
Reverse voltage
DC Forward current
Surge forward current
2)
≤ 85 °CI
T
amb
≤ 10 µsI
t
p
Power dissipation
Junction temperature
Operating temperature range
Storage temperature range
Thermal resistance junction/
ambient
Note:
1)
T
= 25 °C unless otherwise specified
amb
2)
Driving the LED in reverse direction is suitable for a short term application
mounted on PC board
(pad size > 16 mm
2
)
OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMF31.., SOFT ORANGE
PARAMETERTEST CONDITIONPARTSYMBOLMINTYP.MAXUNIT
VLMF31Q2T1
Luminous intensity
2)
IF = 20 mA
VLMF31R1S2
VLMF31S1T1
I
Dominant wavelength
Peak wavelength
Angle of half intensity
Forward voltage
Reverse voltage
Junction capacitance
Note:
1)
T
= 25 °C unless otherwise specified
amb
2)
in one packing unit I
Vmax/IVmin
≤ 1.6
= 20 mAλ
F
= 20 mAλ
I
F
= 20 mA
I
F
I
= 20 mAV
F
= 10 µAV
I
R
= 0, f = 1 MHzC
V
R
LUMINOUS INTENSITY CLASSIFICATION
GROUP LIGHT INTENSITY (MCD)
STANDARD OPTIONAL MIN MAX
P
Q
R
S
T
Note:
Luminous intensity is tested at a current pulse duration of 25 ms and
an accuracy of ± 11 %.
The above type numbers represent the order groups which include
only a few brightness groups. Only one group will be shipped on
each reel (there will be no mixing of two groups on each reel).
In order to ensure availability, single brightness groups will not be
orderable.
In a similar manner for colors where wavelength groups are
measured and binned, single wavelength groups will be shipped on
any one reel.
Note:
Wavelengths are tested at a current pulse duration of 25 ms and an
accuracy of ± 1 nm.
DOM. WAVELENGTH (NM)
MIN. MAX.
www.vishay.com
2
Document Number 81330
Rev. 1.1, 06-Sep-07
Page 3
TYPICAL CHARACTERISTICS
T
= 25 °C, unless otherwise specified
amb
VLMF31..
Vishay Semiconductors
40
35
30
25
20
15
10
- Forward Current (mA)
F
I
5
0
0 1020304050607080 90 100
T
16615
- Ambient Temperature (°C)
amb
Figure 1. Forward Current vs. Ambient Temperature
1000.00
100.00
tp/T = 0.01
0.02
0.05
0.1
0.2
0.5
1.2
soft orange
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
rel
I - Relative Intensity
0.2
0.1
0.0
560 570 580 590 600 610 620 630 640 650 660
95 10885
λ - Wavelength (nm)
Figure 4. Relative Intensity vs. Wavelength
100
10
FM
I - Forward Current (mA)
10.00
0.010.101.0010.00100.00
16620
1
tp - Pulse Length (ms)
Figure 2. Forward Current vs. Pulse Length
0°
10°20°
30°
40°
1.0
0.9
0.8
- Relative Luminous Intensity
0.7
V rel
I
95 10319
0.4 0.200.2 0.4
0.6
50°
60°
70°
80°
0.6
Figure 3. Rel. Luminous Intensity vs. Angular Displacement
- Forward Current (mA)
F
I
1
1.01.52.02.53.0
95 10878
VF - Forward Voltage (V)
Figure 5. Forward Current vs. Forward Voltage
10
orange
1
0.1
Vrel
I - Relative Luminous Intensity
0.01
110100
19109
IF - Forward Current (mA)
Figure 6. Relative Luminous Intensity vs. Forward Current
Document Number 81330
Rev. 1.1, 06-Sep-07
www.vishay.com
3
Page 4
VLMF31..
Vishay Semiconductors
1.6
1.4
1.2
1.0
0.8
0.6
0.4
V rel
0.2
I- Relative Luminous Intensity
0.0
0 1020304050607080 90 100
95 10883
T
- Ambient Temperature (°C)
amb
Figure 7. Rel. Luminous Intensity vs. Ambient Temperature
PACKAGE DIMENSIONS in millimeters
3.5 ± 0.2
0.10
1.75 ±
Pin identification
0.9
200
150
100
50
0
- 50
- 100
- 150
- 200
- 250
F
V - Change of Forward Voltage (mV)
- 300
020406080100
16636
T
- Ambient Temperature (°C)
amb
Figure 8. Forward Voltage vs. Ambient Temperature
technical drawings
according to DIN
specifications
Mounting Pad Layout
1.2
area covered with
solder resist
www.vishay.com
4
CA
+ 0.15
2.8
2.2
2.6 (2.8)
1.6 (1.9)
?
2.4
+ 0.15
3
Drawing-No.: 6.541-5025.01-4
Issue: 8; 22.11.05
95 11314-1
4
4
Document Number 81330
Rev. 1.1, 06-Sep-07
Page 5
VLMF31..
Vishay Semiconductors
METHOD OF TAPING/POLARITY AND TAPE
AND REEL
SMD LED (VLM3 - SERIES)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with
DIN IEC 40 (CO) 564) for automatic component
insertion. The blister tape is a plastic strip with
impressed component cavities, covered by a top tape.
Adhesive T ape
Blister T ape
Component Cavity
94 8670
TAPING OF VLM.3..
3.5
3.1
5.75
5.25
3.6
3.4
1.85
1.6
4.1
1.4
3.9
2.05
1.95
4.1
3.9
1.65
Figure 9. Tape Dimensions in mm for PLCC-2
2.2
2.0
4.0
8.3
7.7
3.6
0.25
94 8668
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS18
(= 8000 PCS.) PREFERRED
10.4
13.00
12.75
14.4 max.
8.4
62.5
60.0
18857
Identification
Label:
Vishay
Type
Group
Tape Code
Production
Code
Quantity
321
329
120°
4.5
3.5
2.5
1.5
Figure 11. Reel Dimensions - GS18
SOLDERING PROFILE
IR Reflow Soldering Profile for lead (Pb)-free soldering
Preconditioning acc. to JEDEC Level 2a
300
255 °C
250
240 °C
217 °C
200
150
Temperature (°C)
max. 120 s
100
max. ramp up 3 °C/s
50
0
050100150200250300
19885
Time (s)
max. 100 s
max. ramp down 6 °C/s
Figure 12. Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020C)
max. 260 °C
245 °C
max. 30 s
max. 2 cycles allowed
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)
10.0
13.00
12.75
14.4 max.
9.0
63.5
60.5
94 8665
Identification
Label:
Vishay
Type
Group
Tape Code
Production
Code
Quantity
Figure 10. Reel Dimensions - GS08
Document Number 81330
Rev. 1.1, 06-Sep-07
180
178
120°
4.5
3.5
2.5
1.5
TTW Soldering
300
250
235 °C...260 °C
200
150
first wave
ca. 200 K/s
(acc. to CECC00802)
5 s
Lead Temperature
second
wave
dotted line: process limits
ca. 2 K/s
full line: typical
948626-1
100 °C...130 °C
100
Temperature (°C)
150
ca. 5 K/s
200
250
50
0
0
2 K/s
forced cooling
50
100
Time (s)
Figure 13. Double Wave Soldering of Opto Devices (all Packages)
www.vishay.com
5
Page 6
VLMF31..
Vishay Semiconductors
BAR CODE PRODUCT LABEL
EXAMPLE:
106
A
BC D E FG
H
VISHAY
37
20126
A) Type of component
B) Manufacturing plant
C) SEL - selection code (bin):
e.g.: J1 = code for luminous intensity group
3 = code for color group
D) Date code year/week
E) Day code (e.g. 1: Monday)
F) Batch no.
G) Total quantity
H) Company code
DRY PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation
and storage.
Aluminum bag
Label
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the
aluminium bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 672 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover
to the former condition by drying under the following
condition:
192 h at 40 °C + 5 °C/ - 0 °C and < 5 % RH (dry air/
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device
containers or
24 h at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC standard JESD22-A112 level 2a label is
included on all dry bags.
CAUTION
1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH)
2. After this bag is opened devices that will be subjected to infrared reflow,
vapor-phase reflow, or equivalent processing (peak package body temp.
260°C) must be:
a) Mounted within b)Stored at <1
3. Devices require baking before mounting if:
a) Humidity Indicator Card is >10% when read at 23°C +
b)2a or 2b is not met.
4. If baking is required, devices may be baked for:
192 hours
96 hours
24 hours
Bag Seal Date: ______________________________
(If blank, see bar code label)
This bag contains
MOISTURE –SENSITIVE DEVICES
672 hours
0% RH.
at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen)
at 60±5
at 100±5°C Not suitable for
Note: LEVEL defined by EIA JEDEC Standard JESD22-A113
at factory condition of <
o
Cand <5%RH For
all
device containers or
L E V E L
30°C/60%RH or
5°C or
reels or tubes
2a
or
19786
Example of JESD22-A112 level 2a label
Reel
15973
FINAL PACKING
The sealed reel is packed into a cardboard box. A
secondary cardboard box is used for shipping purposes.
www.vishay.com
6
ESD PRECAUTION
Proper storage and handling procedures should be
followed to prevent ESD damage to the devices
especially when they are removed from the antistatic
shielding bag. Electro-static sensitive devices warning
labels are on the packaging.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
The Vishay Semiconductors standard bar code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Semiconductors
specific data.
Document Number 81330
Rev. 1.1, 06-Sep-07
Page 7
VLMF31..
Vishay Semiconductors
OZONE DEPLETING SUBSTANCES POLICY STATEMENT
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as their
impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or
unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs,
damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death
associated with such unintended or unauthorized use.
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.