Page 1
19225
Vishay Semiconductors
Low Current SMD LED PLCC-2
FEATURES
• SMD LED with exceptional brightness
• Compatible with automatic placement
equipment
• EIA and ICE standard package
• Compatible with infrared, vapor phase and
wave solder processes according to CECC 00802
and J-STD-020C
• Available in 8 mm tape
• Low profile package
• Non-diffused lens: excellent for coupling to light
pipes and backlighting
• Very low power consumption
• Luminous intensity ratio in one packaging unit
I
Vmax/IVmin
• Lead (Pb)-free device
• Preconditioning: according to Jedec level 2a
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
≤ 2.0
VLMC310.
e3
DESCRIPTION
These new devices have been designed to meet the
increasing demand for low current SMD LEDs.
The package of the VLMC310. is the PLCC-2
(equivalent to a size B tantalum capacitor).
It consists of a lead frame which is embedded in a
white thermoplast. The reflector inside this package is
filled up with clear epoxy.
APPLICATIONS
• Automotive: backlighting in dashboards and
switches
• Telecommunication: indicator and backlighting in
telephone and fax
• Indicator and backlight for audio and video
equipment
• Indicator and backlight for battery driven equipment
• Small indicator for outdoor applications
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
• Package: SMD PLCC-2
• Indicator and backlight in office equipment
• Flat backlight for LCDs, switches and symbols
• General use
• Product series: low current
• Angle of half intensity: ± 60°
PARTS TABLE
PART COLOR, LUMINOUS INTENSITY TECHNOLOGY
VLMC3100
VLMC3101
Green, I
Green, I
> 0.71 mcd
V
> 1.12 mcd
V
GaP on GaP
GaP on GaP
Document Number 81649
Rev. 1.1, 18-Sep-07
www.vishay.com
1
Page 2
VLMC310.
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS1) VLMC310.
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage
2)
DC Forward current
≤ 10 µs I
Surge forward current
t
p
Power dissipation
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature t ≤ 5 s
Thermal resistance junction/
ambient
Note:
1)
T
= 25 °C unless otherwise specified
amb
2)
Driving the LED in reverse direction is suitable for a short term application
mounted on PC board
(pad size > 16 mm
2
)
OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMC310., GREEN
PARAMETER TEST CONDITION PART SYMBOL MIN TYP. MAX UNIT
Luminous intensity
2)
Dominant wavelength
Peak wavelength
Angle of half intensity
Forward voltage
Reverse voltage
Junction capacitance
Note:
1)
T
= 25 °C unless otherwise specified
amb
2)
in one Packing Unit I
Vmax/IVmin
≤ 2.0
IF = 2 mA
= 2 mA λ
I
F
I
= 2 mA λ
F
= 2 mA
I
F
I
= 2 mA V
F
= 10 µA V
I
R
= 0, f = 1 MHz C
V
R
VLMC3100
VLMC3101
T
R
V
I
FSM
P
T
amb
T
T
thJA
stg
R
F
V
j
sd
I
V
I
V
d
p
0.71 1.6 mcd
1.12 1.6 mcd
6V
7mA
0.5 A
20 mW
100 °C
- 40 to + 100 °C
- 40 to + 100 °C
260 °C
500 K/W
562 575 nm
565 nm
ϕ ± 60 deg
F
R
j
615 V
1.9 2.4 V
50 pF
COLOR CLASSIFICATION
GREEN
GROUP
3 562 565
4 564 567
5 566 569
6 568 571
7 570 573
8 572 575
Note:
Wavelengths are tested at a current pulse duration of 25 ms and an
accuracy of ± 1 nm.
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2
DOM. WAVELENGTH (NM)
MIN. MAX.
LUMINOUS INTENSITY CLASSIFICATION
GROUP LIGHT INTENSITY (MCD)
STANDARD OPTIONAL MIN MAX
E1 1 0.71 0.90
E2 2 0.90 1.12
F1 1 1.12 1.40
Note:
Luminous intensity is tested at a current pulse duration of 25 ms and
an accuracy of ± 11 %.
The above Type Numbers represent the order groups which include
only a few brightness groups. Only one group will be shipped on
each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable.
In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any
one reel.
In order to ensure availability, single wavelength groups will not be
orderable.
Document Number 81649
Rev. 1.1, 18-Sep-07
Page 3
TYPICAL CHARACTERISTICS
T
= 25 °C, unless otherwise specified
amb
VLMC310.
Vishay Semiconductors
10
8
6
4
- Forward Current (mA)
F
2
I
95 10842
0
- Ambient Temperature (°C)
T
amb
100806040200
Figure 1. Forward Current vs. Ambient Temperature
0°
1.0
0.9
0.8
- Relative Luminous Intensity
0.7
V rel
I
95 10319
0.4 0.2 0 0.2 0.4
0.6
10° 20°
30°
40°
50°
60°
70°
80°
0.6
Figure 2. Rel. Luminous Intensity vs. Angular Displacement
1.6
Green
1.2
0.8
0.4
v rel
I - Relative Luminous Intensity
95 10057
IF= 2 mA
0
0
20 40 60 80
T
- Ambient Temperature (°C)
amb
100
Figure 4. Rel. Luminous Intensity vs. Ambient Temperature
2.4
green
2.0
1.6
1.2
8
0.
0.4
v rel
I - Specific Luminous Intensity
0
10 20 50 100 200
16486
0.5 0.2 0.05 0.02
1
0.1
500
/mA
I
F
t
/T
p
Figure 5. Rel. Lumin. Intensity vs. Forw. Current/Duty Cycle
100
Green
10
1
F
I- Forward Current (mA)
0.1
95 10056
13
02
Figure 3. Forward Current vs. Forward Voltage
Document Number 81649
Rev. 1.1, 18-Sep-07
- Forward Voltage (V)
V
F
tp/T= 0.001
t
= 10 µs
p
4
100
Green
10
1
0.1
v rel
I - Relative Luminous Intensity
5
0.01
0.1 1 10
95 10059
IF- Forward Current (mA)
100
Figure 6. Relative Luminous Intensity vs. Forward Current
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Page 4
VLMC310.
Vishay Semiconductors
1.2
green
1.0
0.8
0.6
0.4
0.2
Vrel
I - Relative Luminous Intensity
0
520 540 560 580 600
95 10038
Figure 7. Relative Intensity vs. Wavelength
PACKAGE DIMENSIONS in millimeters
λ - Wavelength (nm)
620
20541
2.6 (2.8)
1.6 (1.9)
Mounting Pad Layout
1.2
4
area covered with
solder resist
4
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4
Document Number 81649
Rev. 1.1, 18-Sep-07
Page 5
VLMC310.
Vishay Semiconductors
METHOD OF TAPING/POLARITY AND TAPE
AND REEL
SMD LED (VLM3 - SERIES)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with
DIN IEC 40 (CO) 564) for automatic component insertion. The blister tape is a plastic strip with impressed
component cavities, covered by a top tape.
Adhesive T ape
Blister T ape
Component Cavity
94 8670
TAPING OF VLM.3..
3.5
3.1
3.6
3.4
1.85
1.6
4.1
1.4
3.9
2.05
1.95
4.1
3.9
1.65
Figure 8. Tape Dimensions in mm for PLCC-2
5.75
5.25
2.2
2.0
4.0
8.3
7.7
3.6
0.25
94 8668
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)
10.0
13.00
12.75
14.4 max.
9.0
63.5
60.5
94 8665
Identification
Label:
Vishay
Type
Group
Tape Code
Production
Code
Quantity
120°
4.5
3.5
2.5
1.5
180
178
Figure 9. Reel Dimensions - GS08
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS18
(= 8000 PCS.) PREFERRED
10.4
13.00
12.75
14.4 max.
8.4
62.5
60.0
18857
Identification
Label:
Vishay
Type
Group
Tape Code
Production
Code
Quantity
321
329
120°
4.5
3.5
2.5
1.5
Figure 10. Reel Dimensions - GS18
SOLDERING PROFILE
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
Preconditioning acc. to JEDEC Level 2a
300
255 °C
250
240 °C
217 °C
200
150
Temperature (°C)
100
50
0
0 50 100 150 200 250 300
19885
max. 120 s
max. ramp up 3 °C/s
Time (s)
max. 100 s
max. ramp down 6 °C/s
Figure 11. Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020C)
300
250
200
150
100
Temperature (°C)
50
0
TTW Soldering
235 °C...260 °C
first wave
ca. 200 K/s
100 °C...130 °C
0
(acc. to CECC00802)
5 s
2 K/s
forced cooling
50
100
second
wave
ca. 2 K/s
Time (s)
dotted line: process limits
150
Figure 12. Double Wave Soldering of Opto Devices (all Packages)
max. 260 °C
245 °C
max. 30 s
max. 2 cycles allowed
948626-1
Lead Temperature
full line: typical
ca. 5 K/s
200
250
Document Number 81649
Rev. 1.1, 18-Sep-07
www.vishay.com
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Page 6
VLMC310.
Vishay Semiconductors
BAR CODE PRODUCT LABEL
EXAMPLE:
106
A
BC D E F G
H
VISHAY
37
20127
A) Type of component
B) Manufacturing plant
C) SEL - selection code (bin):
e.g.: J1 = code for luminous intensity group
D) Date code year/week
E) Day code (e.g. 3: Wednesday)
F) Batch no.
G) Total quantity
H) Company code
DRY PACKING
The reel is packed in an anti-humidity bag to protect
the devices from absorbing moisture during transportation and storage.
Aluminum bag
Label
Reel
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 672 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover
to the former condition by drying under the following
condition:
192 h at 40 °C + 5 °C/ - 0 °C and < 5 % RH (dry air/
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers or
24 h at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC standard JESD22-A112 level 2a label
is included on all dry bags.
CAUTION
1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH)
2. After this bag is opened devices that will be subjected to infrared reflow,
vapor-phase reflow, or equivalent processing (peak package body temp.
260°C) must be:
a) Mounted within
b) Stored at <1
3. Devices require baking before mounting if:
a) Humidity Indicator Card is >10% when read at 23°C +
b) 2a or 2b is not met.
4. If baking is required, devices may be baked for:
192 hours
96 hours
24 hours
Bag Seal Date: ______________________________
(If blank, see bar code label)
This bag contains
MOISTURE –SENSITIVE DEVICES
672 hours
0% RH.
at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen)
at 60±5
at 100±5°C Not suitable for
Note: LEVEL defined by EIA JEDEC Standard JESD22-A113
at factory condition of <
o
Cand <5%RH For
all
device containers or
L E V E L
2a
30°C/60%RH or
5°C or
reels or tubes
or
19786
Example of JESD22-A112 level 2a label
15973
FINAL PACKING
The sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes.
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6
ESD PRECAUTION
Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the Antistatic
Shielding Bag. Electro-Static Sensitive Devices warning labels are on the packaging.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
The Vishay Semiconductors standard bar code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Semiconductors
specific data.
Document Number 81649
Rev. 1.1, 18-Sep-07
Page 7
VLMC310.
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as their
impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or
unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs,
damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death
associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 81649
Rev. 1.1, 18-Sep-07
www.vishay.com
7
Page 8
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 www.vishay.com
Revision: 18-Jul-08 1
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