Page 1
DATA SHEET
GaAs INTEGRATED CIRCUIT
PG174TA
µµµµ
L-BAND PA DRIVER AMPLIFIER
DESCRIPTION
The µPG174TA is L-Band PA driver amplifier developed for digital cellular telephone and PCS applications. This
device feature high output power and low distortion with 2.8 V low voltage and 35 mA low current operation. It is
housed in a very small 6-pin minimold package available on tape-and-reel and easy to install and contributes to
miniaturizing the systems.
FEATURES
DD
Low operation voltage : V
y
Low distortion : P
y
Off-chip input and output matching
Low operation current : IDD = 35 mA TYP. @ VDD = 2.8 V, fRF = 1 429 to 1 453 MHz, P
y
Off-chip input and output matching
6-pin minimold package
y
= 2.8 V
adj1
= –60 dBc TYP. @ VDD = 2.8 V, fRF = 1 429 to 1 453 MHz, P
out
= +10 dBm
out
= +10 dBm
APPLICATION
Digital Cellular: PDC1.5G, DCS1800, PCS, etc.
y
ORDERING INFORMATION
Part Number Package Supplying Form
µ
PG174TA-E3 6-pin minimold
Remark
To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:
PG174TA)
µ
Carrier tape width is 8 mm.
Qty 3kp/reel.
ABSOLUTE MAXIMUM RATINGS (TA = +25°C)
Parameters Symbol Ratings Unit
Supply Voltage V
Input Power P
Total Power Dissipat i on P
Operating Ambient Temperature T
Storage Temperature T
Mounted on a 50 × 50 × 1.6 mm double copper clad epoxy glass PWB, T
Note
DD
in
tot
A
stg
6.0 V
–10 dBm
Note
170
–30 to +90 °C
–35 to +150 °C
mW
A
= +85°C
Caution The IC must be handled with care to prevent static discharge because its circuit composed of
GaAs HJ-FET.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P13230EJ2V0DS00 (2nd edition)
Date Published January 2000 N CP(K)
Printed in Japan
The mark shows major revised points.
©
1998, 2000
Page 2
PIN CONNECTION AND INTERNAL BLOCK DIAGRAM
(Top View)
3
2
1
4
5
G1D
6
(Bottom View)
4
5
6
3
3
2
1
2
1
RECOMMENDED OPERATING CONDITIONS (TA = +25°C)
Parameters Symbol MIN. TYP. MAX. Unit
µµµµ
PG174TA
Pin No. Connection
4
5
6
1GND
2GND
3IN
DD2
DD1
& OUT
4V
5GND
6V
Supply Voltage 1, 2 V
Input Power P
DD1, 2
in
+2.7 +2.8 +3.0 V
– –22 –20 dBm
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, T
A
= +25°C, V
DD1
= V
DD2
= +2.8 V,
/4DQPSK modulated signal input,
ππππ
off-chip input and output matching)
Parameters Symbol Test Conditions MIN. TYP. MAX. Unit
Operating Frequency f 1 429 – 1 453 MHz
DD
adj1
adj2
P
Pin = –22 dBm 32.0 34.0 – dB
Pin = –22 dBm – 35 40 mA
out
P
= +10 dBm, ∆f = ±50 kHz – –60 –55 dBc
out
P
= +10 dBm, ∆f = ±100 kHz – –65 –60 dBc
Power Gain G
Total Current I
Adjacent Channel Power Leakage 1 P
Adjacent Channel Power Leakage 2 P
REFERENCE CHARACTERISTICS
(Unless otherwise specified, T
A
= +25°C, V
DD1
= V
DD2
= +2.8 V, f = 1 429 to 1 453 MHz,
off-chip input and output matching)
Parameters Symbol MIN. TYP. MAX. Unit
Input Return Loss RL
Output Return Loss RL
2
in
out
Data Sheet P13230EJ2V0DS00
–10–dB
–10–dB
Page 3
EVALUATION CIRCUIT
DD1
V
= V
DD2
= +2.8 V, f = 1 429 to 1 453 MHz
R1
µµµµ
PG174TA
V
DD1
V
DD2
C2
IN
Zo = 50 Ω
Using the NEC Evaluation board
Parts List Value
C1, C2 1 000 pF
C3 2.0 pF
R1 10
L1 6.8 nH
L2 3.3 nH
C1
4
L2
OUT
C3
5
6
Zo = 50 Ω
G1D
32
L1
Ω
1
Data Sheet P13230EJ2V0DS00
3
Page 4
µµµµ
PG174TA
EVALUATION BOARD (Epoxy Glass,
V
DD1
38 mm
IN
= 4.6, 0.4 mm thickness)
εεεε
40 mm
OUT
V
DD2
IN
V
DD1
OUT
C3
R1
C2
C1
L1
L2
V
DD2
4
Data Sheet P13230EJ2V0DS00
Page 5
TYPICAL CHARACTERISTICS
µµµµ
PG174TA
OUTPUT POWER AND ADJACENT CHANNEL POWER LEAKAGE vs. INPUT POWER
20
15
10
out (dBm)
5
Output Power P
DD = +2.8 V, f = 1 450 MHz
@V
P
out
Padj1
Padj2
−
20
−
30
−
40
−
50
−
0
−
35
−
30
Input Power P
−
25
in (dBm)
−
20
60
Adjacent Channel Power Leakage Padj1, Padj2 (dBc)
−
70
−
80
−
15
Data Sheet P13230EJ2V0DS00
5
Page 6
µµµµ
PG174TA
40
p (dB)
35
Power Gain G
30
−
35
POWER GAIN AND TOTAL CURRENT vs. INPUT POWER
DD = −2.8 V, f = 1 450 MHz
@V
Gp
IDD
−
25
Input Power P
in (dBm)
40
35
Total Current IDD (mA)
30
−
15
6
Data Sheet P13230EJ2V0DS00
Page 7
PACKAGE DIMENSIONS
6 PIN MINIMOLD PACKAGE (UNIT: mm)
µµµµ
PG174TA
+0.2
–0.3
2.8
+0.2
123
–0.1
1.5
654
+0.1
0.3
–0.0
0.95 0.95
1.9
2.9 ±0.2
1.1
0.8
+0.2
–0.1
0.13 ±0.1
0 to 0.1
Data Sheet P13230EJ2V0DS00
7
Page 8
µµµµ
PG174TA
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method Soldering Conditions Recommended Condition Symbol
Infrared Reflow Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 3, Exposure limi t: None
VPS Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Count: 3, Exposure limi t: None
Wave Soldering Soldering bath temperature: 260°C or below
Time: 10 seconds or less
Count: 1, Exposure limi t: None
Partial Heating Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limit: None
After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Note
Note
Note
Note
Note
IR35-00-3
VP15-00-3
WS60-00-1
–
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
8
Data Sheet P13230EJ2V0DS00
Page 9
[MEMO]
µµµµ
PG174TA
Data Sheet P13230EJ2V0DS00
9
Page 10
[MEMO]
µµµµ
PG174TA
10
Data Sheet P13230EJ2V0DS00
Page 11
[MEMO]
µµµµ
PG174TA
Data Sheet P13230EJ2V0DS00
11
Page 12
µµµµ
PG174TA
Caution
The Great Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the law concerned.
Keep the law concerned and so on, especially in case of removal.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8
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