Page 1
PRELIMINARY DATA SHEET
GaAs INTEGRATED CIRCUIT
PG173TA
PPPP
L-BAND PA DRIVER AMPLIFIER
DESCRIPTION
The PPG173TA is L-Band PA driver amplifier developed for digital cellular telephone and PCS applications. This
device feature high output power and low distortion with 2.8 V low voltage and 25 mA low current operation. It is
housed in a very small 6 pin mini-mold package available on tape-and-reel and easy to install and contributes to
miniaturizing the systems.
FEATURES
DD
Low Operation Voltage : V
{
Low distortion : P
{
External output matching
Low operation Current : IDD = 25 mA typ. @ VDD = 2.8 V, fRF = 925 to 960 MHz, P
{
External output matching
6 pin mini-mold package
{
= 2.8 V
adj 1
= –60 dBc typ. @ VDD = 2.8 V, fRF = 925 to 960 MHz, P
out
= +9 dBm
out
= +9 dBm
APPLICATION
Digital Cellular: PDC, GSM, IS-95, IS-136, PCS etc.
{
ORDERING INFORMATION
PART NUMBER PACKAGE PACKING FORM
P
PG173TA-E3 6 pin Mini-Mold Carrier tape width is 8 mm, Quantity is 3 kpcs per reel.
Remark
For sample order, please contact your local NEC sales office. (Part number for sample order:
PG173TA)
P
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
PARAMETERS SYMBOL RATINGS UNIT
Supply Voltage V
Input Power P
Total Power Dissipation P
Operating Temperature T
Storage Temperature T
Mounted on a 50 u 50 u 1.6 mm double copper clad epoxy glass PWB, T
Note
DD
in
tot
A
stg
6.0 V
–8 dBm
Note
170
–30 to +90 °C
–35 to +150 °C
mW
A
= +85°C
Caution The IC must be handled with care to prevent static discharge because its circuit composed of
GaAs HJ-FET.
Document No. P13059EJ1V0DS00 (1st edition)
Date Published November 1997 N
Printed in Japan
The information in this document is subject to change without notice.
1997©
Page 2
PIN CONNECTION AND INTERNAL BLOCK DIAGRAM
Pin No. Connection Pin No. Connection
PPPP
PG173TA
1V
2 GND 5 GND
3V
DD1
DD2
& OUT 6 IN
3
2
1
4 Non Connection
(Top View)
4
5
G1C
6
(Bottom View)
4
5
6
3
2
1
RECOMMENDED OPERATING CONDITIONS (TA = 25°C)
PARAMETERS SYMBOL MIN. TYP. MAX. UNIT
Supply Voltage 1, 2 V
Input Power P
DD1, 2
in
+2.7 +2.8 +3.0 V
–18 dBm
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, T
A
= 25°C, V
DD1
= V
DD2
= +2.8 V,
External output matching)
3
2
1
/4DQPSK modulated signal input,
SSSS
4
5
6
PARAMETERS SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Operating Frequency f 925 960 MHz
DD
adj1
adj2
L
Pin = –18 dBm 27 28.5 dB
Pin = –18 dBm 25 30 mA
out
P
= +9 dBm, 'f = r50 kHz –60 –55 dBc
out
P
= +9 dBm, 'f = r100 kHz –65 –60 dBc
in
out
External matching 10 dB
10 dB
Linear Gain G
Total Current I
Adjacent Channel Power Leakage 1 P
Adjacent Channel Power Leakage 2 P
Input Return Loss RL
Output Return Loss RL
Preliminary Data Sheet2
Page 3
EVALUATION CIRCUIT (Preliminary)
DD1
V
= V
DD2
= +2.8 V, f = 925 to 960 MHz
R1
V
DD1
PPPP
PG173TA
V
DD2
C2
IN
Using the NEC Evaluation board
C1, C2 1000 pF
C3 2.0 pF
R1 10 :
L1 8.2 nH
L2 10 nH
C1
Zo = 50
L1
Ω
L2
1
2
G1C
65
C3
3
4
Non Connection
Zo = 50
OUT
Ω
Preliminary Data Sheet 3
Page 4
PPPP
PG173TA
EVALUATION BOARD (Epoxy Glass,
V
DD1
38 mm
IN
= 4.6, 0.4 mm thickness)
HHHH
40 mm
OUT
V
DD2
6 PIN MINI-MOLD PACKAGE DIMENSIONS (UNIT: mm)
+0.1
0.3
–0.0
123
+0.2
–0.3
+0.2
–0.1
2.8
1.5
654
0.95 0.95
1.9
2.9 ±0.2
0.13 ±0.1
0.8
+0.2
1.1
–0.1
0 to 0.1
Preliminary Data Sheet4
Page 5
PPPP
PG173TA
RECOMMENDED SOLDERING CONDITIONS
This Product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
Soldering process Soldering conditions
Infrared ray reflow Package peak temperature: 235°C
Hour: within 30 s. (more than 210°C)
Time: 3 times, Limited days: no.
VPS Package peak temperature: 215°C
Hour: within 40 s. (more than 200°C)
Time: 3 times, Limited days: no.
Wave Soldering Soldering tub temperature: less than 260°C, Hour: within 10 s.
Time: 1 time, Limited days: no.
Pin part heating Pin area temperature: less than 300°C, Hour: within 3 s.
Limited days: no.
It is the storage days after opening a dry pack, the storage conditions are 25°C, less than 65%, RH.
Note
Note
Note
Note
Note
Recommended condition
symbol
IR35-00-3
VP15-00-3
WS60-00-1
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Preliminary Data Sheet 5
Page 6
[MEMO]
PPPP
PG173TA
Preliminary Data Sheet6
Page 7
[MEMO]
PPPP
PG173TA
Preliminary Data Sheet 7
Page 8
PPPP
PG173TA
Caution
The Great Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the law concerned.
Keep the law concerned and so on, especially in case of removal.
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5
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